JP2020519484A - レーザーリソグラフィによる3d構造の製造方法、及び対応するコンピュータプログラム製品 - Google Patents
レーザーリソグラフィによる3d構造の製造方法、及び対応するコンピュータプログラム製品 Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70416—2.5D lithography
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70025—Production of exposure light, i.e. light sources by lasers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
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- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (15)
- リソグラフィ材料におけるレーザーリソグラフィによる3次元の全体構造(10)を製造する方法において、
前記全体構造(10)が、少なくとも1つの部分構造(14)が前記全体構造(10)に近似するように前記少なくとも部分構造(14)が画定されるように画定され、
前記部分構造(14)を書き込むために、多光子吸収を利用しながらレーザー書き込みビーム(28)の焦点領域(26)において前記リソグラフィ材料に露光量が照射され、
製造される前記全体構造(10)の外部表面(12)に直接隣接するエッジ部分(20)における前記少なくとも1つの部分構造(14)における残りの部分構造(14)と比較して前記露光量が変更される、ことを特徴とする方法。 - 前記全体構造(10)が、複数の部分構造(14)を順次画定することにより画定され、前記部分構造(14)が、前記全体構造(10)に一体に近似する、請求項1に記載の方法。
- 前記エッジ部分(20)における前記露光量が、前記残りの部分構造(14)と比較して増加する、請求項1又は請求項2に記載の方法。
- 前記エッジ部分(20)における前記露光量が、前記残りの部分構造(14)と比較して減少する、請求項1又は請求項2に記載の方法。
- 前記露光量を変化させるために、前記レーザー書き込みビーム(28)の照射出力が変更される、請求項1から請求項4のいずれか一項に記載の方法。
- 前記部分構造(14)を書き込むために、前記レーザー書き込みビーム(28)の前記焦点領域(26)が、前記リソグラフィ材料を介してシフトされ、前記焦点領域(26)のシフト速度が、前記露光量を変化させるために変更される、請求項1から請求項5のいずれか一項に記載の方法。
- 前記部分構造(14)を書き込むために、前記レーザー書き込みビーム(28)の前記焦点領域(26)が、複数の直接隣接する曲線部分を有する前記リソグラフィ材料を通る走査曲線(22)を通過し、2つの連続して横切る曲線部分を通過する間の待機時間だけ待機され、待機時間の間、露光量が照射されない、請求項1から請求項6のいずれか一項に記載の方法。
- 前記部分構造(14)を書き込むために、前記レーザー書き込みビーム(28)の前記焦点領域(26)が、複数の直接隣接する曲線部分を有する前記リソグラフィ材料を通る走査曲線(22)を通過し、各部分構造(14)の前記エッジ部分(20)における前記露光量が、前記エッジ部分(20)における直接隣接する曲線部分が互いに有する平均距離が直接隣接する曲線部分が各部分構造(14)の他の部分において互いに有する平均距離とは異なるように変更される、請求項1から請求項7のいずれか一項に記載の方法。
- 前記部分構造(14)を書き込むために、前記レーザー書き込みビーム(28)の前記焦点領域(26)が、前記リソグラフィ材料を通る走査曲線(22)を通過し、それにより、前記エッジ部分(20)における前記露光量が、前記エッジ部分(20)内で前記走査曲線(22)を複数回通過することにより変更される、請求項1から請求項8のいずれか一項に記載の方法。
- 前記部分構造(14)が、一組の体積要素(24)から構成され、前記レーザー書き込みビーム(28)が、所定のパルスレートで照射される一連のレーザーパルスとして形成され、各レーザーパルスが体積要素(24)を書き込むために使用され、前記パルスレート及び/又はパルス長を変化させることにより前記露光量が変更される、請求項1から請求項9のいずれか一項に記載の方法。
- 前記全体構造(10)を表すデータセットが提供され、これから、前記少なくとも1つの部分構造(14)を表す少なくとも1つのさらなるデータセットが生成され、さらに、前記全体構造(10)から前記少なくとも1つの部分構造(14)の偏差(18)を表す第2のさらなるデータセットが決定され、前記露光量の変化が、前記エッジ部分(20)における局所偏差(18)に依存して生成される、請求項1から請求項10のいずれか一項に記載の方法。
- 前記依存が、前記局所偏差(18)によって前記露光量が単調増加する関数によって与えられる、請求項11に記載の方法。
- 前記依存が、前記局所偏差(18)によって前記露光量が単調減少する関数によって与えられる、請求項11に記載の方法。
- 前記全体構造(10)の前記外部表面(12)を表すデータセットが提供され、前記外部表面の局所的な傾斜及び/又は曲率が決定され、前記露光量の変化が、前記部分構造(14)の前記エッジ部分(20)に隣接する前記外部表面(12)の領域(36)の局所的な傾斜及び/又は曲率に依存する、請求項1から請求項10のいずれか一項に記載の方法。
- コンピュータによって実行されると、請求項1から請求項14のいずれか一項に記載の方法をコンピュータに実行させる命令を含むコンピュータプログラム製品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102017110241.8 | 2017-05-11 | ||
DE102017110241.8A DE102017110241A1 (de) | 2017-05-11 | 2017-05-11 | Verfahren zum Erzeugen einer 3D-Struktur mittels Laserlithographie sowie Computerprogrammprodukt |
PCT/EP2018/053016 WO2018206161A1 (de) | 2017-05-11 | 2018-02-07 | Verfahren zum erzeugen einer 3d-struktur mittels laserlithographie mit geänderter belichtdosis an randabschnitten, sowie entsprechendes computerprogrammprodukt |
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JP2020519484A true JP2020519484A (ja) | 2020-07-02 |
JP6956304B2 JP6956304B2 (ja) | 2021-11-02 |
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US (1) | US11179883B2 (ja) |
EP (2) | EP3621766B1 (ja) |
JP (1) | JP6956304B2 (ja) |
KR (1) | KR102326904B1 (ja) |
CN (1) | CN110573291B (ja) |
DE (1) | DE102017110241A1 (ja) |
WO (1) | WO2018206161A1 (ja) |
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DE102021110860B3 (de) | 2021-04-28 | 2022-03-17 | Nanoscribe Holding Gmbh | Verfahren zum Erzeugen einer dreidimensionalen Struktur in einem Lithographiematerial mittels einer Laserlithographie-Vorrichtung und Laserlithographie-Vorrichtung |
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2018
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JP2005084617A (ja) * | 2003-09-11 | 2005-03-31 | Fuji Photo Film Co Ltd | 多光子吸収露光方法および装置 |
JP2014111385A (ja) * | 2007-12-12 | 2014-06-19 | 3M Innovative Properties Co | エッジ明瞭性が向上した構造の製造方法 |
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EP3621766A1 (de) | 2020-03-18 |
CN110573291A (zh) | 2019-12-13 |
WO2018206161A1 (de) | 2018-11-15 |
EP3970900B1 (de) | 2023-07-26 |
US11179883B2 (en) | 2021-11-23 |
US20200047408A1 (en) | 2020-02-13 |
EP3621766B1 (de) | 2022-01-05 |
JP6956304B2 (ja) | 2021-11-02 |
KR20190142337A (ko) | 2019-12-26 |
KR102326904B1 (ko) | 2021-11-17 |
DE102017110241A1 (de) | 2018-11-15 |
EP3970900C0 (de) | 2023-07-26 |
EP3970900A1 (de) | 2022-03-23 |
CN110573291B (zh) | 2022-01-04 |
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