JP2020502779A - Qfn表面実装型rgb−ledパッケージモジュール及びその製造方法 - Google Patents
Qfn表面実装型rgb−ledパッケージモジュール及びその製造方法 Download PDFInfo
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Abstract
Description
QFN表面実装型RGB−LEDパッケージモジュールであって、パッケージホルダと前記パッケージホルダに設けられた発光ユニットとを含み、前記発光ユニットの個数は、少なくとも2個であり、前記パッケージホルダは金属製基体と絶縁フレームとを含み、前記金属製基体の各発光ユニットがある領域にダイボンディング及びワイヤボンディングするために用いられる支持電極が設けられ、前記発光ユニットは前記金属製基体に固定されたRGBLEDチップと前記RGBLEDチップと支持電極を接続するボンディングワイヤとを含み、前記発光ユニット上に保護層が設けられ、前記支持電極は金属製基体の裏面に設けられたパッドを介して外部回路と接続される。
金属製基体で導電ラインを形成する工程1と、
金属製基体を封止材で覆い、ダイボンディング及びワイヤボンディング用の支持電極を露出させて、パッケージホルダを形成する工程2と、
支持電極に金属をめっきする工程3と、
RGBLEDチップを支持電極にダイボンディングすると共にワイヤボンディングして物理的・電気的な接続を形成する工程4と、
前記発光ユニットに保護層を射出圧縮成形する工程5と、
パッケージモジュール単体を切取る工程6と、
を含む。
金属製基体100にエッチング或いはプレス方式で導電ラインを形成する工程1と、
圧縮成形機により金属製基体100を封止材で覆い、ダイボンディング及びワイヤボンディング用の支持電極101を露出させて、パッケージホルダを形成する工程2と、
支持電極101に金属をめっきする工程3と、
RGBLEDチップ301を支持電極101にダイボンディングすると共にワイヤボンディングして物理的・電気的な接続を形成する工程4と、
前記発光ユニットに保護層400を射出圧縮成形する工程5と、
切断機でパッケージモジュール単体を切取る工程6と、
を含む。
101…支持電極
102…パッド
103…ステップ
104…支持領域
200…絶縁フレーム
201…カップ部
301…RGBLEDチップ
302…ボンディングワイヤ
400…保護層
701…熱可塑性材料
702…金属
801…樹脂
802…平坦樹脂
Claims (10)
- パッケージホルダと前記パッケージホルダに設けられた発光ユニットとを含むQFN表面実装型RGB−LEDパッケージモジュールであって、前記発光ユニットの個数は、少なくとも2個であり、前記パッケージホルダは金属製基体と絶縁フレームとを含み、前記金属製基体の各発光ユニットがある領域にダイボンディング及びワイヤボンディングするために用いられる支持電極が設けられ、前記発光ユニットは前記金属製基体に固定されたRGBLEDチップと前記RGBLEDチップと支持電極を接続するボンディングワイヤとを含み、前記発光ユニット上に保護層が設けられ、前記支持電極は金属製基体の裏面に設けられたパッドを介して外部回路と接続されることを特徴とする、QFN表面実装型RGB−LEDパッケージモジュール。
- 前記絶縁フレームは、前記発光ユニットの周囲でカップ部を形成することを特徴とする、請求項1に記載のQFN表面実装型RGB−LEDパッケージモジュール。
- 前記金属製基体の表面及び/又は裏面にステップが設けられることを特徴とする、請求項1に記載のQFN表面実装型RGB−LEDパッケージモジュール。
- 前記金属製基体に前記パッドの高さと面一となる支持領域が更に設けられることを特徴とする、請求項1に記載のQFN表面実装型RGB−LEDパッケージモジュール。
- 前記保護層の表面は、ざらざらして光を反射しないことを特徴とする、請求項1に記載のQFN表面実装型RGB−LEDパッケージモジュール。
- 請求項1〜5のいずれか一項に記載のQFN表面実装型RGB−LEDパッケージモジュールの製造方法であって、
金属製基体で導電ラインを形成する工程1と、
前記金属製基体を封止材で覆い、ダイボンディング及びワイヤボンディング用の支持電極を露出させて、パッケージホルダを形成する工程2と、
前記支持電極に金属をめっきする工程3と、
RGBLEDチップを前記支持電極にダイボンディングすると共にワイヤボンディングして物理的・電気的な接続を形成する工程4と、
前記発光ユニットに保護層を射出圧縮成形する工程5と、
パッケージモジュール単体を切取る工程6と、
を含むことを特徴とする、QFN表面実装型RGB−LEDパッケージモジュールの製造方法。 - 前記工程1は、前記金属製基体の表面及び/又は裏面にステップを製作することを更に含むことを特徴とする、請求項6に記載のQFN表面実装型RGB−LEDパッケージモジュールの製造方法。
- 前記工程1は、前記金属製基体の裏面にパッドの高さと面一となる支持領域を製作することを更に含むことを特徴とする、請求項6に記載のQFN表面実装型RGB−LEDパッケージモジュールの製造方法。
- 前記工程2は、圧縮成形時に前記金属製基体上で複数のカップ部を形成することを特徴とする、請求項6に記載のQFN表面実装型RGB−LEDパッケージモジュールの製造方法。
- 前記工程5の保護層の射出圧縮成形方法は、分注又は注入の方式で前記カップ部のキャビティ内に封止材を注入してから加熱方式で硬化させ、又はMGP型によって封止材をカップ部のキャビティ内に圧入することを含み、前記封止材は液状封止材或いはエポキシモールディングコンパウンドとすることを特徴とする、請求項9に記載のQFN表面実装型RGB−LEDパッケージモジュールの製造方法。
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CN201710194274.2 | 2017-03-28 | ||
CN201710194274.2A CN106847800A (zh) | 2017-03-28 | 2017-03-28 | Qfn表面贴装式rgb‑led封装模组及其制造方法 |
PCT/CN2017/089335 WO2018176656A1 (zh) | 2017-03-28 | 2017-06-21 | Qfn表面贴装式rgb-led封装模组及其制造方法 |
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CN106847800A (zh) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | Qfn表面贴装式rgb‑led封装模组及其制造方法 |
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EP3591697A1 (en) | 2020-01-08 |
EP3591697A4 (en) | 2020-03-25 |
US20190259735A1 (en) | 2019-08-22 |
CN106847800A (zh) | 2017-06-13 |
WO2018176656A1 (zh) | 2018-10-04 |
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