JP2020194922A - 電子機器及び電子機器製造方法 - Google Patents
電子機器及び電子機器製造方法 Download PDFInfo
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- JP2020194922A JP2020194922A JP2019100543A JP2019100543A JP2020194922A JP 2020194922 A JP2020194922 A JP 2020194922A JP 2019100543 A JP2019100543 A JP 2019100543A JP 2019100543 A JP2019100543 A JP 2019100543A JP 2020194922 A JP2020194922 A JP 2020194922A
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
2 タッチスクリーンディスプレイ
2A ディスプレイ
2B タッチスクリーン
3 ボタン
4 照度センサ
5 近接センサ
7 レシーバ
8 マイク
11 スピーカ
12、13 カメラ
14 コネクタ
20 ハウジング
21 第1ケース(リアケース)
22 第2ケース(フロントケース)
24 シール部材
26 締結部材
28 基板
30 溝
31 穴
32 リブ
34 ねじ穴
40 底面
42 第1側壁
44 第2側壁
46 外壁
70 ノズル
72 液状シール材料
Claims (7)
- 外周に沿って溝が設けられた第1ケースと、
前記第1ケースに重ねられ、前記溝の底面に向かって延びるリブが設けられた第2ケースと、
前記底面と前記リブとで挟持されるシール部材と、を備え、
前記溝は、前記底面の一方の端部に設けられた第1側壁と、前記底面の他方の端部に設けられ第2側壁と、を備え、
前記第1側壁は、前記底面に対する高さが前記第2側壁よりも低く、前記第2ケースと接触しない電子機器。 - 前記シール部材は、前記溝に密着する請求項1に記載の電子機器。
- 前記第2側壁は、前記第2ケースと接触する請求項1または請求項2に記載の電子機器。
- 前記リブは、先端に曲面形状を有し、
前記溝は、前記底面が曲面形状を有する請求項1から請求項3のいずれか一項に記載の電子機器。 - 前記第1側壁は、前記底面の内周側の端部に設けられ、
前記第2側壁は、前記底面の外周側の端部に設けられる請求項1から請求項4のいずれか一項に記載の電子機器。 - 前記シール部材は、前記底面に対する高さが前記第2側壁よりも低い請求項1から請求項5のいずれか一項に記載の電子機器。
- 外周に沿って溝が設けられた第1ケースの、前記溝に液状のシール材料を充填するステップと、
前記シール材料を硬化させるステップと、
前記溝と対面する位置にリブが設けられた第2ケースを、前記リブが前記溝の底面に向かって延びる向きで、嵌め合せて、前記第1ケースに重ね、前記リブと前記シール材料とを接触させるステップと、を含み、
前記溝は、前記底面の一方の端部に設けられた第1側壁と、前記底面の他方の端部に設けられ第2側壁と、を備え、
前記第1側壁は、前記底面に対する高さが前記第2側壁よりも低く、前記第2ケースと接触しない電子機器製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019100543A JP2020194922A (ja) | 2019-05-29 | 2019-05-29 | 電子機器及び電子機器製造方法 |
US16/879,174 US11659675B2 (en) | 2019-05-29 | 2020-05-20 | Electronic device and electronic device manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019100543A JP2020194922A (ja) | 2019-05-29 | 2019-05-29 | 電子機器及び電子機器製造方法 |
Publications (1)
Publication Number | Publication Date |
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JP2020194922A true JP2020194922A (ja) | 2020-12-03 |
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JP2019100543A Pending JP2020194922A (ja) | 2019-05-29 | 2019-05-29 | 電子機器及び電子機器製造方法 |
Country Status (2)
Country | Link |
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US (1) | US11659675B2 (ja) |
JP (1) | JP2020194922A (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001337743A (ja) * | 2000-05-24 | 2001-12-07 | Hitachi Ltd | 情報処理装置 |
JP2004166413A (ja) * | 2002-11-14 | 2004-06-10 | Mitsubishi Electric Corp | 車載電子機器の筐体構造 |
WO2016031511A1 (ja) * | 2014-08-29 | 2016-03-03 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP2017168695A (ja) * | 2016-03-17 | 2017-09-21 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6407925B1 (en) * | 1999-09-17 | 2002-06-18 | Denso Corporation | Casing for electronic control devices |
EP1267598B1 (en) * | 2001-06-13 | 2008-02-06 | Fujikura, Ltd. | Cooling device for electronic unit |
TWI333805B (en) * | 2003-10-03 | 2010-11-21 | Osram Sylvania Inc | Housing for electronic ballast |
JP4521487B2 (ja) | 2005-03-15 | 2010-08-11 | 株式会社カシオ日立モバイルコミュニケーションズ | 機器ケースの防水構造 |
JP4357504B2 (ja) * | 2006-06-29 | 2009-11-04 | 株式会社日立製作所 | エンジン制御装置 |
TWM315472U (en) * | 2006-11-28 | 2007-07-11 | Microelectronics Tech Inc | Electromagnetic interference shielding apparatus for transmitter |
JP4470980B2 (ja) * | 2007-09-10 | 2010-06-02 | 株式会社デンソー | 電子装置 |
JP5543948B2 (ja) * | 2011-09-21 | 2014-07-09 | 日立オートモティブシステムズ株式会社 | 電子制御装置のシール構造 |
JP2013105766A (ja) * | 2011-11-10 | 2013-05-30 | Mitsubishi Electric Corp | 電子制御装置 |
JP6058350B2 (ja) * | 2012-10-25 | 2017-01-11 | 京セラ株式会社 | 電子部品を内蔵する筐体の防水構造 |
KR101469826B1 (ko) * | 2013-05-10 | 2014-12-05 | 현대오트론 주식회사 | 차량의 전자 제어 장치 |
JP3191032U (ja) * | 2014-03-25 | 2014-06-05 | 日立オートモティブシステムズ株式会社 | 自動車用内燃機関制御装置 |
CN107836139A (zh) * | 2015-09-04 | 2018-03-23 | 日立汽车***株式会社 | 车载控制装置 |
-
2019
- 2019-05-29 JP JP2019100543A patent/JP2020194922A/ja active Pending
-
2020
- 2020-05-20 US US16/879,174 patent/US11659675B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001337743A (ja) * | 2000-05-24 | 2001-12-07 | Hitachi Ltd | 情報処理装置 |
JP2004166413A (ja) * | 2002-11-14 | 2004-06-10 | Mitsubishi Electric Corp | 車載電子機器の筐体構造 |
WO2016031511A1 (ja) * | 2014-08-29 | 2016-03-03 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP2017168695A (ja) * | 2016-03-17 | 2017-09-21 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
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US20200383225A1 (en) | 2020-12-03 |
US11659675B2 (en) | 2023-05-23 |
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