JP2020191315A - Retainer - Google Patents

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JP2020191315A
JP2020191315A JP2019094218A JP2019094218A JP2020191315A JP 2020191315 A JP2020191315 A JP 2020191315A JP 2019094218 A JP2019094218 A JP 2019094218A JP 2019094218 A JP2019094218 A JP 2019094218A JP 2020191315 A JP2020191315 A JP 2020191315A
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common
driver electrode
common driver
electrode
heater
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JP7252825B2 (en
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和孝 田中
Kazutaka Tanaka
和孝 田中
駒津　貴久
Takahisa Komatsu
貴久 駒津
雅夫 辻他
Masao Tsujita
雅夫 辻他
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Abstract

To suppress generation of a singular point at high temperature on a center side of a first surface in a common driver electrode in comparison with a configuration where the common driver electrode does not have a thick part.SOLUTION: In a retainer, a shape of a common driver electrode is one which has a pair of first sides. The common driver electrode has a terminal connection part electrically connected to a common supply-terminal; and N heater connection parts electrically connected to N heater electrodes. The terminal connection part is positioned closer to a center side of a first surface than the heater connection part. The common driver electrode has a thick part. The thick part has a pair of second sides whose shapes in a first direction view go along the pair of first sides respectively, a peripheral part on the outer peripheral side of the first surface is in the shape separate from the peripheral part of the common driver electrode, and thickness in the first direction is larger than thickness in the first direction of the other part in the common driver electrode.SELECTED DRAWING: Figure 2

Description

本明細書に開示される技術は、保持装置に関する。 The techniques disclosed herein relate to holding devices.

対象物（例えば、半導体ウェハ）を保持しつつ所定の処理温度（例えば、４００〜８００℃程度）に加熱する加熱装置（「サセプタ」とも呼ばれる）が知られている。加熱装置は、例えば、成膜装置（ＣＶＤ成膜装置やスパッタリング成膜装置等）やエッチング装置（プラズマエッチング装置等）といった半導体製造装置の一部として使用される。 A heating device (also referred to as a "susceptor") that heats an object (for example, a semiconductor wafer) to a predetermined processing temperature (for example, about 400 to 800 ° C.) while holding the object (for example, a semiconductor wafer) is known. The heating device is used as a part of a semiconductor manufacturing device such as a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

加熱装置の中には、所定の方向（以下、「第１の方向」という）に略垂直な保持面および裏面を有する板状の保持体を備え、保持体の内部に、複数のヒータ電極と複数の個別ドライバ電極と１つの共通ドライバ電極とが配置され、保持体の裏面側に、複数の個別給電端子と１つの共通給電端子とが配置されたものがある。複数の個別ドライバ電極は、複数のヒータ電極のそれぞれに対して個別に電気的に接続されており、共通ドライバ電極は、複数のヒータ電極のすべてに対して共通に電気的に接続されている。また、複数の個別ドライバ電極と共通ドライバ電極とは、第１の方向に略垂直な一の仮想平面上に配置されている。複数の個別給電端子は、複数の個別ドライバ電極のそれぞれに対して個別に電気的に接続されており、共通給電端子は、共通ドライバ電極に電気的に接続されている。そして、複数の個別給電端子と共通給電端子とは、いずれも、第１の方向視で保持体の保持面の中心側に配置されている（下記特許文献１参照）。 The heating device includes a plate-shaped holding body having a holding surface and a back surface substantially perpendicular to a predetermined direction (hereinafter, referred to as "first direction"), and a plurality of heater electrodes are provided inside the holding body. In some cases, a plurality of individual driver electrodes and one common driver electrode are arranged, and a plurality of individual power supply terminals and one common power supply terminal are arranged on the back surface side of the holder. The plurality of individual driver electrodes are individually electrically connected to each of the plurality of heater electrodes, and the common driver electrode is commonly electrically connected to all of the plurality of heater electrodes. Further, the plurality of individual driver electrodes and the common driver electrode are arranged on one virtual plane substantially perpendicular to the first direction. The plurality of individual power supply terminals are individually electrically connected to each of the plurality of individual driver electrodes, and the common power supply terminal is electrically connected to the common driver electrode. The plurality of individual power supply terminals and the common power supply terminal are all arranged on the center side of the holding surface of the holder in the first directional view (see Patent Document 1 below).

特開２０１５−１９１８３７号公報Japanese Unexamined Patent Publication No. 2015-191837

上述したように、従来の加熱装置では、複数のヒータ電極および複数の個別ドライバ電極のそれぞれに流れる電流のすべてが共通ドライバ電極に流れる。このため、共通ドライバ電極は、個別ドライバ電極に比べて、電流が流れることによる発熱量が大きい。また、共通ドライバ電極は、複数の個別ドライバ電極と共に、上記一の仮想平面上に配置されている。このため、共通ドライバ電極の発熱を抑制するために、共通ドライバ電極の第１の方向視での面積を広く確保するにも制約がある。さらに、複数の個別給電端子と共通給電端子とは、いずれも、第１の方向視で保持体の保持面の中心側に配置されている。このため、共通ドライバ電極における保持面の中心側に高温の特異点が生じやすい、という問題があった。 As described above, in the conventional heating device, all the currents flowing through each of the plurality of heater electrodes and the plurality of individual driver electrodes flow to the common driver electrode. Therefore, the common driver electrode generates a larger amount of heat due to the current flowing than the individual driver electrode. Further, the common driver electrode is arranged on the above-mentioned one virtual plane together with a plurality of individual driver electrodes. Therefore, in order to suppress heat generation of the common driver electrode, there is a restriction in securing a wide area of the common driver electrode in the first directional view. Further, the plurality of individual power supply terminals and the common power supply terminal are all arranged on the center side of the holding surface of the holder in the first directional view. Therefore, there is a problem that a high temperature singular point is likely to occur on the center side of the holding surface of the common driver electrode.

なお、このような課題は、加熱装置に限らず、上述した保持体と同様の構成要素を有する板状部材を備え、板状部材の表面上に対象物を保持する保持装置一般に共通の課題である。 It should be noted that such a problem is not limited to the heating device, but is a problem common to all holding devices that are provided with a plate-shaped member having the same components as the above-mentioned holding body and hold an object on the surface of the plate-shaped member. is there.

本明細書では、上述した課題を解決することが可能な技術を開示する。 This specification discloses a technique capable of solving the above-mentioned problems.

本明細書に開示される技術は、以下の形態として実現することが可能である。 The technique disclosed in the present specification can be realized in the following forms.

（１）本明細書に開示される保持装置は、第１の方向に略垂直な略平面状の第１の表面と、前記第１の表面とは反対側の第２の表面と、を有する板状部材と、前記板状部材の内部に配置され、抵抗発熱体により構成された複数のヒータ電極と、前記板状部材の内部において前記第１の方向に略垂直な一の仮想平面上に配置され、前記複数のヒータ電極の内のＮ（Ｎは２以上の整数）個の前記ヒータ電極のそれぞれに対して電気的に接続されたＮ個の個別ドライバ電極と、前記板状部材の前記第２の表面側に配置され、前記Ｎ個の個別ドライバ電極のそれぞれに対して電気的に接続されたＮ個の個別給電端子と、前記板状部材の内部において前記一の仮想平面上に配置され、前記Ｎ個のヒータ電極のすべてに対して電気的に接続された共通ドライバ電極と、前記板状部材の前記第２の表面側に配置され、前記共通ドライバ電極に対して電気的に接続された共通給電端子と、を備え、前記板状部材の前記第１の表面上に対象物を保持する保持装置において、前記Ｎ個の個別給電端子と前記共通給電端子とは、いずれも、前記第１の方向視で前記第１の表面の中心側に配置され、前記共通ドライバ電極の前記第１の方向視での形状は、前記第１の表面の外周側から前記中心側に向かうに連れて互いの距離が短くなる一対の第１の辺を有する形状であり、前記共通ドライバ電極は、前記共通給電端子に電気的に接続された端子接続部分と、前記Ｎ個のヒータ電極に電気的に接続されたＮ個のヒータ接続部分と、を有し、前記第１の方向視で、前記端子接続部分は、前記ヒータ接続部分より前記第１の表面の前記中心側に位置しており、前記共通ドライバ電極は、前記第１の方向視での形状が、前記一対の第１の辺のそれぞれに沿った一対の第２の辺を有するとともに、前記第１の表面の前記外周側における周縁部が、前記共通ドライバ電極の周縁部から離間した形状であり、かつ、前記第１の方向の厚さが、前記共通ドライバ電極における他の部分の前記第１の方向の厚さより厚い、肉厚部分を有している。 (1) The holding device disclosed in the present specification has a substantially planar first surface substantially perpendicular to the first direction and a second surface opposite to the first surface. On a plate-shaped member, a plurality of heater electrodes arranged inside the plate-shaped member and formed of a resistance heating element, and on one virtual plane substantially perpendicular to the first direction inside the plate-shaped member. N individual driver electrodes arranged and electrically connected to each of the N (N is an integer of 2 or more) heater electrodes among the plurality of heater electrodes, and the plate-shaped member. N individual power supply terminals arranged on the second surface side and electrically connected to each of the N individual driver electrodes, and arranged on the one virtual plane inside the plate-shaped member. A common driver electrode that is electrically connected to all of the N heater electrodes, and a common driver electrode that is arranged on the second surface side of the plate-shaped member and electrically connected to the common driver electrode. In the holding device provided with the common power supply terminal and holding the object on the first surface of the plate-shaped member, the N individual power supply terminals and the common power supply terminal are both said. It is arranged on the center side of the first surface in the first directional view, and the shape of the common driver electrode in the first directional view increases from the outer peripheral side of the first surface toward the center side. The common driver electrode has a pair of first sides that shorten the distance from each other, and the common driver electrode is electrically connected to the terminal connection portion electrically connected to the common feeding terminal and the N heater electrodes. It has N heater connecting portions connected to the above, and in the first directional view, the terminal connecting portion is located on the center side of the first surface from the heater connecting portion. The common driver electrode has a pair of second sides whose shape in the first directional view is along each of the pair of first sides, and the peripheral edge of the first surface on the outer peripheral side. The portion has a shape separated from the peripheral edge portion of the common driver electrode, and the thickness in the first direction is thicker than the thickness of the other portion in the common driver electrode in the first direction. Has a part.

本保持装置では、共通ドライバ電極は、肉厚部分を有している。肉厚部分の第１の方向視での形状は、共通ドライバ電極の一対の第１の辺のそれぞれに沿った一対の第２の辺を有するとともに、前記第１の表面の前記外周側における自身の周縁部が前記共通ドライバ電極の周縁部から離間した形状である。また、肉厚部分の第１の方向の厚さは、共通ドライバ電極における他の部分（肉厚部分を除いた部分）の第１の方向の厚さより厚い。このため、本保持装置によれば、共通ドライバ電極が肉厚部分を有しない構成に比べて、共通ドライバ電極における第１の表面の中心側に高温の特異点が生じることを抑制することができる。 In this holding device, the common driver electrode has a thick portion. The shape of the thick portion in the first directional view has a pair of second sides along each of the pair of first sides of the common driver electrode, and also has itself on the outer peripheral side of the first surface. The peripheral portion of the common driver electrode is separated from the peripheral portion of the common driver electrode. Further, the thickness of the thick portion in the first direction is thicker than the thickness of the other portion (the portion excluding the thick portion) in the common driver electrode in the first direction. Therefore, according to this holding device, it is possible to suppress the occurrence of a high-temperature singularity on the center side of the first surface of the common driver electrode as compared with the configuration in which the common driver electrode does not have a thick portion. ..

（２）上記保持装置において、前記共通ドライバ電極は、第１の共通ドライバ電極と、前記第１の方向において前記第１の共通ドライバ電極と前記共通給電端子との間に配置され、第１のビア部を介して前記第１の共通ドライバ電極に電気的に接続されると共に、第２のビア部を介して前記共通給電端子に電気的に接続された第２の共通ドライバ電極と、を含んでおり、前記第１のビア部と前記第２のビア部とは、前記第１の方向視で前記ヒータ接続部分より前記第１の表面の前記中心側に位置し、かつ、前記第１の方向視で前記ヒータ接続部分側の端の位置は互いに略一致している構成としてもよい。 (2) In the holding device, the common driver electrode is arranged between the first common driver electrode and the first common driver electrode and the common feeding terminal in the first direction, and is the first. A second common driver electrode electrically connected to the first common driver electrode via a via portion and electrically connected to the common feeding terminal via a second via portion is included. The first via portion and the second via portion are located on the center side of the first surface from the heater connection portion in the first direction view, and the first via portion is formed. The positions of the ends on the heater connection portion side may be substantially coincident with each other in the direction view.

本保持装置では、共通ドライバ電極は、第１の共通ドライバ電極と第２の共通ドライバ電極とを含んでいる。第１の共通ドライバ電極と第２の共通ドライバ電極とは、第１のビア部を介して電気的に接続され、第２の共通ドライバ電極と共通給電端子とは、第２のビア部を介して電気的に接続されている。第１のビア部と第２のビア部とは、第１の方向視でヒータ接続部分より第１の表面の中心側に位置し、かつ、第１の方向視でヒータ接続部分側の端の位置は互いに略一致している。このため、本保持装置では、第１の方向視で、第１のビア部と第２のビア部とのヒータ接続部分側の端の位置が互いに異なる構成に比べて、第２の共通ドライバ電極を介して第１のビア部と第２のビア部との間に流れる電流に起因して第２の共通ドライバ電極に高温の特異点が生じることを抑制することができる。 In this holding device, the common driver electrode includes a first common driver electrode and a second common driver electrode. The first common driver electrode and the second common driver electrode are electrically connected to each other via the first via portion, and the second common driver electrode and the common feeding terminal are connected to each other via the second via portion. Is electrically connected. The first via portion and the second via portion are located on the center side of the first surface from the heater connecting portion in the first directional view, and are located at the end of the heater connecting portion side in the first directional view. The positions are almost the same as each other. Therefore, in the present holding device, the second common driver electrode is compared with the configuration in which the positions of the ends of the first via portion and the second via portion on the heater connection portion side are different from each other in the first directional view. It is possible to suppress the occurrence of a high temperature singularity in the second common driver electrode due to the current flowing between the first via portion and the second via portion via the above.

（３）上記保持装置において、前記共通ドライバ電極は、第１の共通ドライバ電極と、前記第１の方向において前記第１の共通ドライバ電極と前記共通給電端子との間に配置され、第１のビア部を介して前記第１の共通ドライバ電極に電気的に接続されると共に、第２のビア部を介して前記共通給電端子に電気的に接続された第２の共通ドライバ電極と、を含んでおり、前記第１のビア部と前記第２のビア部との内の一方のビア部を構成するビアの数は、他方のビア部を構成するビアの数より多く、かつ、前記第１の方向視で、前記他方のビア部を囲む領域の全体が前記一方のビア部を囲む領域に重なっており、前記第２の共通ドライバ電極の内、少なくとも前記一方のビア部を囲む領域の全体は、前記肉厚部分になっている構成としてもよい。 (3) In the holding device, the common driver electrode is arranged between the first common driver electrode and the first common driver electrode and the common feeding terminal in the first direction, and is the first. A second common driver electrode electrically connected to the first common driver electrode via a via portion and electrically connected to the common feeding terminal via a second via portion is included. The number of vias constituting one via portion of the first via portion and the second via portion is larger than the number of vias constituting the other via portion, and the first via portion is described. The entire region surrounding the other via portion overlaps with the region surrounding the one via portion, and the entire region surrounding at least one via portion of the second common driver electrode is formed. May be configured to be the thick portion.

本保持装置では、共通ドライバ電極は、第１の共通ドライバ電極と第２の共通ドライバ電極とを含んでいる。第１の共通ドライバ電極と第２の共通ドライバ電極とは、第１のビア部を介して電気的に接続され、第２の共通ドライバ電極と共通給電端子とは、第２のビア部を介して電気的に接続されている。第１のビア部と第２のビア部との内の一方のビア部を構成するビアの数は、他方のビア部を構成するビアの数より多く、かつ、第１の方向視で、他方のビア部を囲む領域の全体が一方のビア部を囲む領域に重なっている。そして、第２の共通ドライバ電極の内、少なくとも一方のビア部を囲む領域の全体が肉厚部分になっている。このため、例えば、第１の方向視で、他方のビア部を囲む領域の少なくとも一部が一方のビア部を囲む領域に重なっていない構成に比べて、第２の共通ドライバ電極を介して第１のビア部と第２のビア部との間に流れる電流に起因して第２の共通ドライバ電極に高温の特異点が生じることを抑制することができる。 In this holding device, the common driver electrode includes a first common driver electrode and a second common driver electrode. The first common driver electrode and the second common driver electrode are electrically connected to each other via the first via portion, and the second common driver electrode and the common feeding terminal are connected to each other via the second via portion. Is electrically connected. The number of vias constituting one via portion of the first via portion and the second via portion is larger than the number of vias constituting the other via portion, and in the first direction, the other. The entire area surrounding the via portion of is overlapped with the area surrounding one via portion. The entire region surrounding at least one via portion of the second common driver electrode is a thick portion. Therefore, for example, in the first directional view, as compared with the configuration in which at least a part of the region surrounding the other via portion does not overlap the region surrounding the one via portion, the second via the second common driver electrode is used. It is possible to suppress the occurrence of a high temperature singularity in the second common driver electrode due to the current flowing between the first via portion and the second via portion.

（４）上記保持装置において、前記共通ドライバ電極は、第１の共通ドライバ電極と、前記第１の共通ドライバ電極と前記共通給電端子との間に配置され、複数の第１のビア部を介して前記第１の共通ドライバ電極に電気的に接続されると共に、第２のビア部を介して前記共通給電端子に電気的に接続された第２の共通ドライバ電極と、を含んでおり、前記複数の第１のビア部は、前記共通ドライバ電極の前記第１の辺に沿って並んでおり、前記共通ドライバ電極の内、少なくとも互いに隣り合う２つの以上の前記第１のビア部を囲む領域は、前記肉厚部分になっている構成としてもよい。本保持装置では、第１の共通ドライバ電極と第２の共通ドライバ電極とを電気的に接続する複数の第１のビアは、共通ドライバ電極の第１の辺に沿って並んでいる。共通ドライバ電極の内、少なくとも互いに隣り合う２つの以上の第１のビアを囲む領域は、肉厚部分になっている。このため、例えば、互いに隣り合う２つの以上の第１のビアを囲む領域が肉厚部分になっていない構成に比べて、共通ドライバ電極の第１の辺付近に高温の特異点が生じることを抑制することができる。 (4) In the holding device, the common driver electrode is arranged between the first common driver electrode, the first common driver electrode, and the common feeding terminal, and is interposed via a plurality of first via portions. The second common driver electrode, which is electrically connected to the first common driver electrode and electrically connected to the common power supply terminal via the second via portion, is included. The plurality of first via portions are arranged along the first side of the common driver electrode, and the region surrounding at least two or more of the common driver electrodes adjacent to each other. May be configured to be the thick portion. In this holding device, a plurality of first vias that electrically connect the first common driver electrode and the second common driver electrode are arranged along the first side of the common driver electrode. Of the common driver electrodes, at least a region surrounding two or more first vias adjacent to each other is a thick portion. Therefore, for example, as compared with the configuration in which the region surrounding the two or more first vias adjacent to each other is not a thick portion, a high temperature singular point is generated near the first side of the common driver electrode. It can be suppressed.

（５）上記保持装置において、前記第１の方向視で、前記共通ドライバ電極の面積は、前記Ｎ個の個別ドライバ電極のいずれの面積よりも大きい構成としてもよい。本保持装置では、第１の方向視で、共通ドライバ電極の面積は、Ｎ個の個別ドライバ電極のいずれの面積よりも大きい。このため、例えば、共通ドライバ電極の面積が各個別ドライバ電極の面積以下である構成に比べて、共通ドライバ電極が高温になることを効果的に抑制することができる。 (5) In the holding device, the area of the common driver electrode may be larger than the area of any of the N individual driver electrodes in the first directional view. In this holding device, the area of the common driver electrode is larger than the area of any of the N individual driver electrodes in the first directional view. Therefore, for example, it is possible to effectively suppress the temperature of the common driver electrode from becoming high as compared with the configuration in which the area of the common driver electrode is smaller than the area of each individual driver electrode.

なお、本明細書に開示される技術は、種々の形態で実現することが可能であり、例えば、保持装置、静電チャック、ＣＶＤヒータ等の加熱装置、真空チャック、それらの製造方法等の形態で実現することが可能である。 The technique disclosed in the present specification can be realized in various forms, for example, a holding device, an electrostatic chuck, a heating device such as a CVD heater, a vacuum chuck, and a method for manufacturing the same. It is possible to realize with.

本実施形態における加熱装置１００の外観構成を概略的に示す斜視図である。It is a perspective view which shows schematic appearance structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００のＸＺ断面構成を概略的に示す説明図である。It is explanatory drawing which shows typically the XZ cross-sectional structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００のＸＹ断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the XY cross-sectional structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００のＸＹ断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the XY cross-sectional structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００の一部を分解した斜視図である。It is a perspective view which disassembled a part of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００の一部の断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the cross-sectional structure of a part of the heating apparatus 100 in this embodiment.

Ａ．本実施形態：
Ａ−１．加熱装置１００の構成：
図１は、本実施形態における加熱装置１００の外観構成を概略的に示す斜視図であり、図２は、本実施形態における加熱装置１００のＸＺ断面構成を概略的に示す説明図である。なお、図２には、後述の図３および図４のＩＩ−ＩＩの位置における加熱装置１００のＸＺ断面構成が示されている。各図には、方向を特定するための互いに直交するＸＹＺ軸が示されている。本明細書では、便宜的に、Ｚ軸正方向を上方向といい、Ｚ軸負方向を下方向というものとするが、加熱装置１００は実際にはそのような向きとは異なる向きで設置されてもよい。 A. This embodiment:
A-1. Configuration of heating device 100:
FIG. 1 is a perspective view schematically showing an external configuration of the heating device 100 in the present embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the heating device 100 in the present embodiment. Note that FIG. 2 shows the XZ cross-sectional configuration of the heating device 100 at the positions II-II of FIGS. 3 and 4 described later. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the heating device 100 is actually installed in a direction different from such a direction. You may.

加熱装置１００は、対象物（例えば、半導体ウェハＷ）を保持しつつ所定の処理温度（例えば、４００〜６５０℃程度）に加熱する装置であり、サセプタとも呼ばれる。加熱装置１００は、例えば、成膜装置（ＣＶＤ成膜装置やスパッタリング成膜装置等）やエッチング装置（プラズマエッチング装置等）といった半導体製造装置の一部として使用される。加熱装置１００は、特許請求の範囲における保持装置に相当する。 The heating device 100 is a device that heats an object (for example, a semiconductor wafer W) to a predetermined processing temperature (for example, about 400 to 650 ° C.) while holding it, and is also called a susceptor. The heating device 100 is used as a part of a semiconductor manufacturing device such as a film forming apparatus (CVD deposition apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.). The heating device 100 corresponds to a holding device within the scope of the claims.

図１および図２に示すように、加熱装置１００は、保持体１０と柱状支持体２０とを備える。 As shown in FIGS. 1 and 2, the heating device 100 includes a holding body 10 and a columnar support 20.

（保持体１０）
保持体１０は、所定の方向（本実施形態では上下方向）に略垂直な保持面Ｓ１および裏面Ｓ２を有する略円板状の部材である。保持体１０は、例えば、ＡｌＮ（窒化アルミニウム）を主成分とするセラミックスにより形成されている。なお、ここでいう主成分とは、含有割合（重量割合）の最も多い成分を意味する。保持体１０の直径は、例えば１００ｍｍ以上、５００ｍｍ以下程度であり、保持体１０の厚さ（上下方向における長さ）は、例えば３ｍｍ以上、２０ｍｍ以下程度である。保持体１０は、特許請求の範囲における板状部材に相当し、上下方向（Ｚ軸方向）は、特許請求の範囲における第１の方向に相当する。また、保持面Ｓ１は、特許請求の範囲における第１の表面に相当し、裏面Ｓ２は、特許請求の範囲における第２の表面に相当する。 (Holder 10)
The holding body 10 is a substantially disk-shaped member having a holding surface S1 and a back surface S2 that are substantially perpendicular to a predetermined direction (vertical direction in the present embodiment). The retainer 10 is formed of, for example, ceramics containing AlN (aluminum nitride) as a main component. The main component referred to here means the component having the highest content ratio (weight ratio). The diameter of the holding body 10 is, for example, about 100 mm or more and 500 mm or less, and the thickness (length in the vertical direction) of the holding body 10 is, for example, about 3 mm or more and about 20 mm or less. The holding body 10 corresponds to a plate-shaped member in the claims, and the vertical direction (Z-axis direction) corresponds to the first direction in the claims. Further, the holding surface S1 corresponds to the first front surface in the claims, and the back surface S2 corresponds to the second surface in the claims.

図２に示すように、保持体１０の内部には、保持体１０を加熱する複数のヒータ電極５０と、ヒータ電極５０への給電のための構成とが配置されている。これらの構成については後述する。なお、このような構成の保持体１０は、例えば、セラミックスグリーンシートを複数枚作製し、所定のセラミックスグリーンシートにビア孔の形成やメタライズペーストの充填および印刷等の加工を行い、これらのセラミックスグリーンシートを熱圧着し、切断等の加工を行った上で焼成することにより作製することができる。 As shown in FIG. 2, a plurality of heater electrodes 50 for heating the holding body 10 and a configuration for supplying power to the heater electrodes 50 are arranged inside the holding body 10. These configurations will be described later. For the holding body 10 having such a configuration, for example, a plurality of ceramic green sheets are produced, and a predetermined ceramic green sheet is processed by forming via holes, filling metallized paste, printing, or the like, and these ceramic green sheets. It can be produced by thermocompression bonding a sheet, performing processing such as cutting, and then firing.

（柱状支持体２０）
柱状支持体２０は、上記上下方向（Ｚ軸方向）に延びる略円柱状部材である。柱状支持体２０は、保持体１０と同様に、例えばＡｌＮを主成分とするセラミックスにより形成されている。柱状支持体２０の外径は、例えば３０ｍｍ以上、９０ｍｍ以下程度であり、柱状支持体２０の高さ（上下方向における長さ）は、例えば１００ｍｍ以上、３００ｍｍ以下程度である。 (Columnar support 20)
The columnar support 20 is a substantially columnar member extending in the vertical direction (Z-axis direction). Like the holding body 10, the columnar support 20 is formed of, for example, ceramics containing AlN as a main component. The outer diameter of the columnar support 20 is, for example, about 30 mm or more and 90 mm or less, and the height (length in the vertical direction) of the columnar support 20 is, for example, about 100 mm or more and 300 mm or less.

保持体１０と柱状支持体２０とは、保持体１０の裏面Ｓ２と柱状支持体２０の上面Ｓ３とが上下方向に対向するように配置されている。柱状支持体２０は、保持体１０の裏面Ｓ２の中心部付近に、後述の接合材料により形成された接合層３０を介して接合されている。 The holding body 10 and the columnar support 20 are arranged so that the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 face each other in the vertical direction. The columnar support 20 is joined to the vicinity of the center of the back surface S2 of the holding body 10 via a joining layer 30 formed of a joining material described later.

図２に示すように、柱状支持体２０には、保持体１０の裏面Ｓ２側に開口する貫通孔２２が形成されている。貫通孔２２は、上下方向と略同一方向に延び、延伸方向にわたって略一定の内径を有する断面略円形の孔である。貫通孔２２には、後述する複数の給電端子９０，９１（２つの個別給電端子９０Ａ，９０Ｂ（図２では１つのみ図示）、共通給電端子９１）が収容されている。保持体１０の裏面Ｓ２の中心付近には、３つの凹部１２（図２では２つのみ図示）が形成されており、３つの凹部１２の内、２つの凹部１２には、個別受電電極５４（図２では１つのみ図示）が配置されており、１つの凹部１２には共通受電電極５７が配置されている。各個別給電端子９０Ａ，９０Ｂの上端部は、金属ろう材（例えば金ろう材）を含む接合部５６を介して個別受電電極５４に接合されている。共通給電端子９１の上端部は、金属ろう材（例えば金ろう材）を含む接合部５６を介して共通受電電極５７に接合されている。 As shown in FIG. 2, the columnar support 20 is formed with a through hole 22 that opens on the back surface S2 side of the holding body 10. The through hole 22 is a hole having a substantially circular cross section, which extends in substantially the same direction as the vertical direction and has a substantially constant inner diameter in the extending direction. The through hole 22 accommodates a plurality of power supply terminals 90, 91 (two individual power supply terminals 90A, 90B (only one is shown in FIG. 2) and a common power supply terminal 91), which will be described later. Three recesses 12 (only two are shown in FIG. 2) are formed near the center of the back surface S2 of the holding body 10, and the individual power receiving electrodes 54 (individual power receiving electrodes 54) are formed in the two recesses 12 of the three recesses 12. Only one (shown in FIG. 2) is arranged in FIG. 2, and a common power receiving electrode 57 is arranged in one recess 12. The upper ends of the individual power feeding terminals 90A and 90B are joined to the individual power receiving electrode 54 via a joining portion 56 including a metal brazing material (for example, gold brazing material). The upper end of the common power feeding terminal 91 is joined to the common power receiving electrode 57 via a joining portion 56 including a metal brazing material (for example, a gold brazing material).

Ａ−２．ヒータ電極５０の構成：
図３は、本実施形態における加熱装置１００のＸＹ断面構成を概略的に示す説明図である。図３には、図２のＩＩＩ−ＩＩＩの位置における加熱装置１００のＸＹ断面構成が示されている。 A-2. Configuration of heater electrode 50:
FIG. 3 is an explanatory view schematically showing an XY cross-sectional configuration of the heating device 100 in the present embodiment. FIG. 3 shows the XY cross-sectional configuration of the heating device 100 at the positions III-III of FIG.

上述したように、加熱装置１００は、複数のヒータ電極５０（より具体的には、２つのヒータ電極５０Ａ，５０Ｂ）を備える（図２および図３参照）。２つのヒータ電極５０は、保持体１０の内部において、上下方向（Ｚ軸方向）に互いに略同一の位置に配置されている。換言すれば、２つのヒータ電極５０は、上下方向に略垂直な一（共通）の仮想平面（ＸＹ平面）上に配置されている。 As described above, the heating device 100 includes a plurality of heater electrodes 50 (more specifically, two heater electrodes 50A and 50B) (see FIGS. 2 and 3). The two heater electrodes 50 are arranged at substantially the same positions in the holding body 10 in the vertical direction (Z-axis direction). In other words, the two heater electrodes 50 are arranged on one (common) virtual plane (XY plane) that is substantially perpendicular to the vertical direction.

２つのヒータ電極５０の内、第１のヒータ電極５０Ａは、上下方向（Ｚ軸方向）視で、保持体１０の保持面Ｓ１における中心Ｏ付近の第１の領域Ｚａに配置されており、第２のヒータ電極５０Ｂは、第１の領域Ｚａより保持体１０の外周側に位置する第２の領域Ｚｂに配置されている。なお、第１の領域Ｚａの上下方向視での形状は、略円形であり、第２の領域Ｚｂの上下方向視での形状は、略環状である。各ヒータ電極５０は、上下方向（Ｚ軸方向）視で線状の抵抗発熱体であり、導電性材料（例えば、タングステン、モリブデン、白金等）により形成されている。本実施形態では、各ヒータ電極５０の上下方向視での形状は、略円形または略螺旋状とされている。 Of the two heater electrodes 50, the first heater electrode 50A is arranged in the first region Za near the center O on the holding surface S1 of the holding body 10 in the vertical direction (Z-axis direction). The heater electrode 50B of 2 is arranged in the second region Zb located on the outer peripheral side of the holding body 10 from the first region Za. The shape of the first region Za in the vertical direction is substantially circular, and the shape of the second region Zb in the vertical direction is substantially annular. Each heater electrode 50 is a linear resistance heating element when viewed in the vertical direction (Z-axis direction), and is made of a conductive material (for example, tungsten, molybdenum, platinum, etc.). In the present embodiment, the shape of each heater electrode 50 in the vertical direction is substantially circular or substantially spiral.

Ａ−３．ヒータ電極５０への給電のための構成：
図４は、本実施形態における加熱装置１００のＸＹ断面構成を概略的に示す説明図である。図４には、図２のＩＶ−ＩＶの位置における加熱装置１００のＸＹ断面構成が示されている。図５は、本実施形態における加熱装置１００の一部を分解した斜視図である。図５には、ヒータ電極５０とドライバ電極６０，８０と柱状支持体２０と給電端子９０，９１とが示されている。 A-3. Configuration for feeding power to the heater electrode 50:
FIG. 4 is an explanatory view schematically showing an XY cross-sectional configuration of the heating device 100 in the present embodiment. FIG. 4 shows the XY cross-sectional configuration of the heating device 100 at the position IV-IV of FIG. FIG. 5 is an exploded perspective view of a part of the heating device 100 in the present embodiment. FIG. 5 shows a heater electrode 50, a driver electrode 60, 80, a columnar support 20, and a feeding terminal 90, 91.

上述したように、加熱装置１００は、各ヒータ電極５０への給電のための構成を備えている。具体的には、加熱装置１００は、複数のドライバ電極６０，８０（より具体的には、４つの個別ドライバ電極６０と、２つの共通ドライバ電極８０）を備える（図２から図５参照）。各ドライバ電極６０，８０は、上下方向（Ｚ軸方向）に垂直な面方向に平行な所定の形状の導体パターンであり、導電性材料（例えば、タングステン、モリブデン、白金等）により形成されている。なお、ドライバ電極６０，８０は、下記の（１）および（２）の少なくとも一方を満たすという点で、ヒータ電極５０と相違する。
（１）ドライバ電極６０，８０の電流が流れる方向に対して垂直方向の断面積は、ヒータ電極５０の同様な断面積の５倍以上である。
（２）ヒータ電極５０における、ドライバ電極６０，８０につながる一方のビアから他方のビアまでの間の抵抗は、ドライバ電極６０，８０における、ヒータ電極５０につながるビアから給電端子９０，９１につながるビアまでの間の抵抗の５倍以上である。例えば、第１のヒータ電極５０Ａにおける、第１の個別ドライバ電極６１Ａにつながる第１のヒータ用個別ビア部５５Ａから第１の共通ドライバ電極８１につながるヒータ用共通ビア５５Ｃ等）までの間の抵抗は、第１の個別ドライバ電極６１Ａにおける、第１のヒータ電極５０Ａにつながる第１のヒータ用個別ビア部５５Ａから第２の個別ドライバ電極６２Ａにつながる第１の個別中間ビア部５６Ａまでの間の抵抗の５倍以上である。 As described above, the heating device 100 includes a configuration for supplying power to each heater electrode 50. Specifically, the heating device 100 includes a plurality of driver electrodes 60 and 80 (more specifically, four individual driver electrodes 60 and two common driver electrodes 80) (see FIGS. 2 to 5). Each of the driver electrodes 60 and 80 is a conductor pattern having a predetermined shape parallel to the plane direction perpendicular to the vertical direction (Z-axis direction), and is formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.). .. The driver electrodes 60 and 80 are different from the heater electrodes 50 in that they satisfy at least one of the following (1) and (2).
(1) The cross-sectional area of the driver electrodes 60 and 80 in the direction perpendicular to the current flow direction is five times or more the similar cross-sectional area of the heater electrodes 50.
(2) The resistance between one via connected to the driver electrodes 60 and 80 in the heater electrode 50 to the other via is connected to the feeding terminals 90 and 91 from the via connected to the heater electrode 50 in the driver electrodes 60 and 80. It is more than 5 times the resistance to the via. For example, the resistance of the first heater electrode 50A from the individual via portion 55A for the first heater connected to the first individual driver electrode 61A to the common via 55C for the heater connected to the first common driver electrode 81). Is between the first individual via portion 55A for the heater connected to the first heater electrode 50A and the first individual intermediate via portion 56A connected to the second individual driver electrode 62A in the first individual driver electrode 61A. It is more than 5 times the resistance.

図２に示すように、複数のドライバ電極６０，８０は、保持体１０の内部において、ヒータ電極５０と裏面Ｓ２との間に配置されている。本実施形態では、複数のドライバ層が上下方向（Ｚ軸方向）に互いに異なる位置に配置されており、各ドライバ層では、複数個の個別ドライバ電極６０と１個の共通ドライバ電極８０とが、上下方向に略垂直な一の仮想平面（ＸＹ平面）上に配置されている。具体的には、２個の第１の個別ドライバ電極６１Ａ，６１Ｂと１つの第１の共通ドライバ電極８１とが、上下方向に略垂直な第１の仮想平面Ｍ１（図２参照）上に配置されている。２個の第２の個別ドライバ電極６２Ａ，６２Ｂと１つの第２の共通ドライバ電極８２とが、上記第１の仮想平面Ｍ１より下側に位置する第２の仮想平面Ｍ２（図２参照）上に配置されている。 As shown in FIG. 2, the plurality of driver electrodes 60 and 80 are arranged between the heater electrode 50 and the back surface S2 inside the holding body 10. In the present embodiment, a plurality of driver layers are arranged at different positions in the vertical direction (Z-axis direction), and in each driver layer, a plurality of individual driver electrodes 60 and one common driver electrode 80 are provided. It is arranged on one virtual plane (XY plane) that is substantially perpendicular to the vertical direction. Specifically, the two first individual driver electrodes 61A and 61B and the one first common driver electrode 81 are arranged on a first virtual plane M1 (see FIG. 2) that is substantially perpendicular to the vertical direction. Has been done. The two second individual driver electrodes 62A and 62B and the one second common driver electrode 82 are located on the second virtual plane M2 (see FIG. 2) located below the first virtual plane M1. It is located in.

Ａ−３−１．個別ドライバ電極６０の構成：
図３から図５に示すように、各個別ドライバ電極６０の上下方向視での形状は、保持体１０の保持面Ｓ１の外周側から中心Ｏ側に向かうに連れて互いの距離が短くなる一対の辺を有する形状である。具体的には、各個別ドライバ電極６０の上下方向視での形状は、保持面Ｓ１の中心Ｏ側から外周側（径方向）に向かって直線状に延びる一対の辺６４と、該中心Ｏを略中心とし、かつ、一対の辺６４における保持面Ｓ１の外周側の端同士を繋ぐ円弧６６とから構成された略扇状である（図４参照）。一対の辺６４のなす角度の内、円弧６６側の角度は、１８０度より小さい角度（鋭角）である。２つの第１の個別ドライバ電極６１Ａ，６１Ｂは、上下方向視で、第１の共通ドライバ電極８１とは異なる領域を、該第１の個別ドライバ電極６１Ａ，６１Ｂの個数分（２つ）に均等分割して形成される２つの領域のそれぞれに配置されている。また、２つの第２の個別ドライバ電極６２Ａ，６２Ｂは、上下方向視で、第２の共通ドライバ電極８２とは異なる領域を、該第２の個別ドライバ電極６２Ａ，６２Ｂの個数分（２つ）に均等分割して形成される２つの領域のそれぞれに配置されている。 A-3-1. Configuration of individual driver electrodes 60:
As shown in FIGS. 3 to 5, the shapes of the individual driver electrodes 60 in the vertical direction are such that the distance between the individual driver electrodes 60 becomes shorter from the outer peripheral side of the holding surface S1 of the holding body 10 toward the center O side. It is a shape having a side of. Specifically, the shape of each individual driver electrode 60 in the vertical direction includes a pair of sides 64 extending linearly from the center O side of the holding surface S1 toward the outer peripheral side (diameter direction) and the center O. It has a substantially fan shape and is formed of an arc 66 that connects the outer peripheral ends of the holding surfaces S1 on the pair of sides 64 (see FIG. 4). Of the angles formed by the pair of sides 64, the angle on the arc 66 side is an angle smaller than 180 degrees (acute angle). The two first individual driver electrodes 61A and 61B equalize (two) regions different from the first common driver electrode 81 in the vertical direction by the number of the first individual driver electrodes 61A and 61B. It is arranged in each of the two regions formed by dividing. Further, the two second individual driver electrodes 62A and 62B have a region different from that of the second common driver electrode 82 in the vertical direction, as many as the number of the second individual driver electrodes 62A and 62B (two). It is arranged in each of the two regions formed by being evenly divided into two regions.

第１の個別ドライバ電極６１Ａ，６１Ｂと第２の個別ドライバ電極６２Ａ，６２Ｂとは、上下方向に並ぶように配置され、かつ、第１の個別中間ビア部５６Ａを介して電気的に接続されている。第２の個別ドライバ電極６２Ａと６２Ｂとは、上下方向に並ぶように配置され、かつ、第２の個別中間ビア５６Ｂを介して電気的に接続されている。第１の共通ドライバ電極８１と第２の共通ドライバ電極８２とは、上下方向に並ぶように配置され、かつ、複数（４つ）の共通中間ビア部５６Ｃを介して電気的に接続されている。複数の共通中間ビア部５６Ｃは、上下方向視で、共通ドライバ電極８０の辺８４に沿って並んでいる。なお、共通中間ビア部５６Ｃは、特許請求の範囲における第１のビア部に相当する。 The first individual driver electrodes 61A and 61B and the second individual driver electrodes 62A and 62B are arranged so as to be arranged in the vertical direction, and are electrically connected via the first individual intermediate via portion 56A. There is. The second individual driver electrodes 62A and 62B are arranged so as to be arranged in the vertical direction, and are electrically connected via the second individual intermediate via 56B. The first common driver electrode 81 and the second common driver electrode 82 are arranged so as to be arranged in the vertical direction, and are electrically connected via a plurality (four) common intermediate via portions 56C. .. The plurality of common intermediate via portions 56C are arranged along the side 84 of the common driver electrode 80 in a vertical view. The common intermediate via portion 56C corresponds to the first via portion within the scope of the claims.

Ａ−３−２．共通ドライバ電極８０の構成：
図３から図５に示すように、各共通ドライバ電極８０の上下方向視での形状は、保持体１０の保持面Ｓ１の外周側から中心Ｏ側に向かうに連れて互いの距離が短くなる一対の辺を有する形状である。具体的には、各共通ドライバ電極８０の上下方向視での形状は、保持面Ｓ１の中心Ｏ側から外周側（径方向）に向かって直線状に延びる一対の辺８４と、該中心Ｏを略中心とし、かつ、一対の辺８４における保持面Ｓ１の外周側の端同士を繋ぐ円弧８６とから構成された略扇状である（図４参照）。一対の辺８４のなす角度の内、円弧８６側の角度は、１８０度より大きい角度（鈍角）である。なお、共通ドライバ電極８０の辺８４は、特許請求の範囲における第１の辺に相当する。 A-3-2. Configuration of common driver electrode 80:
As shown in FIGS. 3 to 5, the shapes of the common driver electrodes 80 in the vertical direction are such that the distance between the common driver electrodes 80 becomes shorter from the outer peripheral side of the holding surface S1 of the holding body 10 toward the center O side. It is a shape having a side of. Specifically, the shape of each common driver electrode 80 in the vertical direction is a pair of sides 84 extending linearly from the center O side of the holding surface S1 toward the outer peripheral side (diameter direction), and the center O. It has a substantially fan shape and is formed of an arc 86 that connects the outer peripheral ends of the holding surfaces S1 on the pair of sides 84 (see FIG. 4). Of the angles formed by the pair of sides 84, the angle on the arc 86 side is an angle larger than 180 degrees (obtuse angle). The side 84 of the common driver electrode 80 corresponds to the first side in the claims.

各共通ドライバ電極８０は、上下方向視で、該共通ドライバ電極８０と同一の仮想平面上に配置された複数個の個別ドライバ電極６０とは異なる位置に配置されている。また、各共通ドライバ電極８０の上下方向視での面積は、該共通ドライバ電極８０と同一の仮想平面上に配置された複数個の個別ドライバ電極６０のいずれの上下方向視での面積より大きい。特に、本実施形態では、各共通ドライバ電極８０の上下方向視での面積は、該共通ドライバ電極８０と同一の仮想平面上に配置された複数個の個別ドライバ電極６０の上下方向視での面積を合算した合計面積より大きい。なお、同一の仮想平面上において、短絡防止のため、複数の個別ドライバ電極６０および１つの共通ドライバ電極８０とは、面方向において互いに離間するように配置されている。 Each common driver electrode 80 is arranged at a position different from a plurality of individual driver electrodes 60 arranged on the same virtual plane as the common driver electrode 80 in the vertical direction. Further, the area of each common driver electrode 80 in the vertical direction is larger than the area of any of the plurality of individual driver electrodes 60 arranged on the same virtual plane as the common driver electrode 80 in the vertical direction. In particular, in the present embodiment, the area of each common driver electrode 80 in the vertical direction is the area of the plurality of individual driver electrodes 60 arranged on the same virtual plane as the common driver electrode 80 in the vertical direction. Is larger than the total area of the sum. In addition, on the same virtual plane, in order to prevent a short circuit, the plurality of individual driver electrodes 60 and one common driver electrode 80 are arranged so as to be separated from each other in the plane direction.

なお、第１の共通ドライバ電極８１と第２の共通ドライバ電極８２とは、互いの周縁が重ならないように配置されている。本実施形態では、上下方向視で、第１の共通ドライバ電極８１の外形線は、全周にわたって、第２の共通ドライバ電極８２の外形線より内側に位置している。これにより、第１の共通ドライバ電極８１と第２の共通ドライバ電極８２との周縁が重なって段差が大きくなっている構成に比べて、上下方向に並ぶ導電部の周縁の段差に起因して保持体１０内に空隙が生じることを抑制することができる。第１の個別ドライバ電極６１Ａ，６１Ｂと第２の個別ドライバ電極６２Ａ，６２Ｂとについても同様であり、第２の個別ドライバ電極６２Ａと６２Ｂとについても同様である。 The first common driver electrode 81 and the second common driver electrode 82 are arranged so that their peripheral edges do not overlap with each other. In the present embodiment, the outer line of the first common driver electrode 81 is located inside the outer line of the second common driver electrode 82 over the entire circumference in the vertical view. As a result, compared to the configuration in which the peripheral edges of the first common driver electrode 81 and the second common driver electrode 82 overlap and the step is large, the holding is caused by the step on the peripheral edge of the conductive portion arranged in the vertical direction. It is possible to suppress the formation of voids in the body 10. The same applies to the first individual driver electrodes 61A and 61B and the second individual driver electrodes 62A and 62B, and the same applies to the second individual driver electrodes 62A and 62B.

Ａ−３−３．ヒータ電極５０とドライバ電極６０，８０と給電端子９０，９１との電気的接続：
第１のヒータ電極５０Ａの一方の端部は、第１のヒータ用個別ビア部５５Ａを介して、第１の個別ドライバ電極６１Ａに電気的に接続されており、第１のヒータ電極５０Ａの他方の端部は、第１のヒータ用共通ビア部５５Ｃを介して、第１の共通ドライバ電極８１に電気的に接続されている。第２のヒータ電極５０Ｂの一方の端部は、第２のヒータ用個別ビア部５５Ｂを介して、第２の個別ドライバ電極６１Ｂに電気的に接続されており、第２のヒータ電極５０Ｂの他方の端部は、第２のヒータ用共通ビア部５５Ｄを介して、第１の共通ドライバ電極８１に電気的に接続されている。 A-3-3. Electrical connection between heater electrode 50, driver electrodes 60, 80, and power supply terminals 90, 91:
One end of the first heater electrode 50A is electrically connected to the first individual driver electrode 61A via the first heater individual via portion 55A, and the other end of the first heater electrode 50A. Is electrically connected to the first common driver electrode 81 via the first heater common via portion 55C. One end of the second heater electrode 50B is electrically connected to the second individual driver electrode 61B via the second heater individual via portion 55B, and the other end of the second heater electrode 50B. The end of the is electrically connected to the first common driver electrode 81 via the second heater common via portion 55D.

第２の個別ドライバ電極６２Ａは、第１の端子用個別ビア部５８Ａを介して、第１の個別給電端子９０Ａに電気的に接続されており、第２の個別ドライバ電極６２Ｂは、第２の端子用個別ビア部５８Ｂを介して、第２の個別給電端子９０Ｂに電気的に接続されている。また、第２の共通ドライバ電極８２は、端子用共通ビア部５８Ｃを介して、共通給電端子９１に電気的に接続されている。なお、各ビア部（ヒータ用個別ビア部５５Ａ，５５Ｂ、各ヒータ用共通ビア部５５Ｃ，５５Ｄ、各個別中間ビア部５６Ａ，５６Ｂ、共通中間ビア部５６Ｃ、各端子用個別ビア部５８Ａ，５８Ｂ、端子用共通ビア部５８Ｃ）は、いずれも、複数のビア（線状の導電体）のグループにより構成されている（後述の図６参照）。また、端子用共通ビア部５８Ｃは、特許請求の範囲における第２のビア部に相当する。 The second individual driver electrode 62A is electrically connected to the first individual power supply terminal 90A via the individual via portion 58A for the first terminal, and the second individual driver electrode 62B is the second individual driver electrode 62B. It is electrically connected to the second individual power supply terminal 90B via the terminal individual via portion 58B. Further, the second common driver electrode 82 is electrically connected to the common power supply terminal 91 via the common via portion 58C for terminals. In addition, each via portion (individual via portion 55A, 55B for heater, common via portion 55C, 55D for each heater, each individual intermediate via portion 56A, 56B, common intermediate via portion 56C, individual via portion 58A, 58B for each terminal, The terminal common via portion 58C) is composed of a group of a plurality of vias (linear conductors) (see FIG. 6 described later). Further, the common via portion 58C for terminals corresponds to the second via portion within the scope of claims.

以上の構成により、図示しない電源から各給電端子９０，９１、各受電電極５４，５７等を介して複数のヒータ電極５０のそれぞれに電圧が印加されると、各ヒータ電極５０が発熱し、保持体１０の保持面Ｓ１上に保持された対象物（例えば、半導体ウェハＷ）が所定の温度（例えば、４００〜６５０℃程度）に加熱される。 With the above configuration, when a voltage is applied to each of the plurality of heater electrodes 50 from a power supply (not shown) via the power supply terminals 90, 91, the power receiving electrodes 54, 57, etc., the heater electrodes 50 generate heat and hold. The object (for example, the semiconductor wafer W) held on the holding surface S1 of the body 10 is heated to a predetermined temperature (for example, about 400 to 650 ° C.).

Ａ−４．共通ドライバ電極８０における高温の特異点の発生を抑制するための構成：
図６は、本実施形態における加熱装置１００の一部の断面構成を概略的に示す説明図である。図６には、図４のＶＩ−ＶＩの位置における加熱装置１００における共通ドライバ電極８０の周辺部分のＺ軸方向に平行な断面構成が示されている。 A-4. Configuration for suppressing the generation of high-temperature singular points in the common driver electrode 80:
FIG. 6 is an explanatory view schematically showing a cross-sectional configuration of a part of the heating device 100 in the present embodiment. FIG. 6 shows a cross-sectional configuration parallel to the Z-axis direction of the peripheral portion of the common driver electrode 80 in the heating device 100 at the position of VI-VI in FIG.

加熱装置１００は、共通ドライバ電極８０における高温の特異点の発生を抑制するための構成を備える。まず、図２および図５に示すように、２つの個別給電端子９０と共通給電端子９１とは、いずれも、上下方向視で保持体１０の保持面Ｓ１の中心Ｏ側（保持面Ｓ１の周縁より中心Ｏに近い位置）に配置されている。また、図５および図６に示すように、共通ドライバ電極８０は、共通給電端子９１に電気的に接続された端子接続部分８５（第２の共通ドライバ電極８２における共通給電端子９１（端子用共通ビア部５８Ｃ）の直上に位置する部分）と、２つのヒータ電極５０のそれぞれに電気的に接続された２つのヒータ接続部分８７（各ヒータ電極５０の他方の端部（各ヒータ用共通ビア部５５Ｃ，５５Ｄ）の直下に位置する部分）とを有する。端子接続部分８５は、２つのヒータ接続部分８７のいずれよりも、保持面Ｓ１の中心Ｏ側に位置している（図５参照）。 The heating device 100 includes a configuration for suppressing the generation of high-temperature singular points in the common driver electrode 80. First, as shown in FIGS. 2 and 5, the two individual power supply terminals 90 and the common power supply terminal 91 are both on the central O side of the holding surface S1 of the holding body 10 in the vertical direction (periphery of the holding surface S1). It is located closer to the center O). Further, as shown in FIGS. 5 and 6, the common driver electrode 80 is a terminal connection portion 85 electrically connected to the common power supply terminal 91 (common power supply terminal 91 in the second common driver electrode 82 (common for terminals). A portion located directly above the via portion 58C) and two heater connecting portions 87 electrically connected to each of the two heater electrodes 50 (the other end portion of each heater electrode 50 (common via portion for each heater). It has a portion) located directly below 55C, 55D). The terminal connection portion 85 is located closer to the center O of the holding surface S1 than any of the two heater connection portions 87 (see FIG. 5).

図２、図４から図６に示すように、第１の共通ドライバ電極８１は、第１の肉厚部分８８を有する。第１の肉厚部分８８の上下方向視での形状は、第１の共通ドライバ電極８１の一対の辺８４のそれぞれに沿った一対の辺８８Ａを有するとともに、保持体１０の保持面Ｓ１の外周側における周縁部８８Ｂが、第１の共通ドライバ電極８１の周縁部から離間した形状である（図４および図５参照）。具体的には、第１の肉厚部分８８の上下方向視での形状は、保持面Ｓ１の中心Ｏ側から、第１の共通ドライバ電極８１の一対の辺８４のそれぞれに沿って外周側（径方向）に向かって直線状に延び、かつ、該辺８４より短い一対の辺８８Ａと、該中心Ｏを略中心とし、かつ、一対の辺８４における保持面Ｓ１の外周側の端同士を繋ぐ円弧（周縁部８８Ｂ）とから構成された略扇状である（図４参照）。また、第１の肉厚部分８８の上下方向の厚さは、第１の共通ドライバ電極８１における他の部分（第１の肉厚部分８８より外周側の部分）の上下方向の厚さより厚い。なお、上下方向視で、第１の肉厚部分８８における各辺８８Ａの位置は、第１の共通ドライバ電極８１における各辺８４に対して、第１の共通ドライバ電極８１の内側にずれている。これにより、第１の肉厚部分８８における辺８８Ａと第１の共通ドライバ電極８１における辺８４が重なる構成に比べて、共通ドライバ電極８０の厚みに起因して保持体１０内に空隙が生じることを抑制することができる。なお、第１の共通ドライバ電極８１における辺８４と第１の肉厚部分８８における辺８８Ａとのずれ幅は、１ｍｍ以上であることが好ましく、また、３ｍｍ以下であることが好ましい。また、本実施形態では、第２の共通ドライバ電極８２も、第１の肉厚部分８８と同様の第２の肉厚部分８９を有する（図２、図５および図６参照）。 As shown in FIGS. 2, 4 to 6, the first common driver electrode 81 has a first thick portion 88. The shape of the first thick portion 88 in the vertical direction has a pair of sides 88A along each of the pair of sides 84 of the first common driver electrode 81, and the outer circumference of the holding surface S1 of the holding body 10. The peripheral edge portion 88B on the side has a shape separated from the peripheral edge portion of the first common driver electrode 81 (see FIGS. 4 and 5). Specifically, the shape of the first thick portion 88 in the vertical direction is from the center O side of the holding surface S1 to the outer peripheral side along each of the pair of sides 84 of the first common driver electrode 81. Connects a pair of sides 88A that extend linearly in the radial direction and shorter than the side 84 and the outer peripheral ends of the holding surface S1 on the pair of sides 84 with the center O as the substantially center. It has a substantially fan shape composed of an arc (peripheral portion 88B) (see FIG. 4). Further, the vertical thickness of the first thick portion 88 is thicker than the vertical thickness of the other portion (the portion on the outer peripheral side of the first thick portion 88) of the first common driver electrode 81. In the vertical view, the position of each side 88A in the first thick portion 88 is shifted to the inside of the first common driver electrode 81 with respect to each side 84 in the first common driver electrode 81. .. As a result, a gap is generated in the holding body 10 due to the thickness of the common driver electrode 80, as compared with the configuration in which the side 88A in the first thick portion 88 and the side 84 in the first common driver electrode 81 overlap. Can be suppressed. The deviation width between the side 84 of the first common driver electrode 81 and the side 88A of the first thick portion 88 is preferably 1 mm or more, and preferably 3 mm or less. Further, in the present embodiment, the second common driver electrode 82 also has a second wall thickness portion 89 similar to the first wall thickness portion 88 (see FIGS. 2, 5 and 6).

図６に示すように、端子用共通ビア部５８Ｃと共通中間ビア部５６Ｃとは、上下方向視で、ヒータ接続部分８７より保持面Ｓ１の中心Ｏ側に位置している。また、端子用共通ビア部５８Ｃにおけるヒータ接続部分８７側の端の位置と、該端子用共通ビア部５８Ｃの直上に位置する共通中間ビア部５６Ｃにおけるヒータ接続部分８７側の端の位置とは、略一致している。換言すれば、上下方向視で、端子用共通ビア部５８Ｃとヒータ接続部分８７との最短距離と、該端子用共通ビア部５８Ｃの直上に位置する共通中間ビア部５６Ｃとヒータ接続部分８７との最短距離とは、略同じである。より具体的には、端子用共通ビア部５８Ｃを構成する４本のビアの内、ヒータ接続部分８７に最も近いビアにおけるヒータ接続部分８７側の端の位置と、該端子用共通ビア部５８Ｃの直上に位置する共通中間ビア部５６Ｃを構成する３本のビアの内、ヒータ接続部分８７に最も近いビアにおけるヒータ接続部分８７側の端の位置とは、略一致している（図６の一点鎖線Ｌ参照）。 As shown in FIG. 6, the terminal common via portion 58C and the common intermediate via portion 56C are located on the center O side of the holding surface S1 from the heater connecting portion 87 in the vertical view. Further, the position of the end of the common via portion 58C for terminals on the heater connection portion 87 side and the position of the end of the common intermediate via portion 56C located directly above the common via portion 58C for terminals on the heater connection portion 87 side are It is almost the same. In other words, in the vertical view, the shortest distance between the terminal common via portion 58C and the heater connection portion 87, and the common intermediate via portion 56C and the heater connection portion 87 located directly above the terminal common via portion 58C. The shortest distance is almost the same. More specifically, among the four vias constituting the common via portion 58C for terminals, the position of the end on the heater connection portion 87 side of the via closest to the heater connection portion 87 and the common via portion 58C for terminals. Of the three vias constituting the common intermediate via portion 56C located directly above, the position of the end on the heater connection portion 87 side of the via closest to the heater connection portion 87 is substantially the same (one point in FIG. 6). See chain line L).

また、図４から図６に示すように、複数（４つ）の共通中間ビア部５６Ｃが、第１の共通ドライバ電極８１の辺８４に沿って並んでいる。第１の共通ドライバ電極８１の内、少なくとも互いに隣り合う２つの以上の共通中間ビア部５６Ｃを囲む領域は、肉厚部分（第１の肉厚部分８８）になっている。具体的には、上下方向視で、第１の肉厚部分８８の外形線は、第１の共通ドライバ電極８１の一対の辺８４のそれぞれに沿って並んでいる２つずつの共通中間ビア部５６Ｃを包含している。さらに、上下方向視で、第１の肉厚部分８８の外形線は、複数のヒータ用共通ビア５５Ｃの内、少なくとも、保持体１０の保持面Ｓ１の中心Ｏに最も近いヒータ用共通ビア５５Ｃを包含している。このため、図６に示すように、第１の共通ドライバ電極８１は、ヒータ接続部分８７から各共通中間ビア部５６Ｃとの接続部分にわたって肉厚部分（第１の肉厚部分８８）になっている。 Further, as shown in FIGS. 4 to 6, a plurality of (four) common intermediate via portions 56C are arranged along the side 84 of the first common driver electrode 81. Of the first common driver electrode 81, a region surrounding at least two or more common intermediate via portions 56C adjacent to each other is a wall-thick portion (first wall-thick portion 88). Specifically, in the vertical view, the outline of the first thick portion 88 is two common intermediate via portions arranged along each of the pair of sides 84 of the first common driver electrode 81. It includes 56C. Further, when viewed in the vertical direction, the outline of the first thick portion 88 is at least the common via 55C for heaters closest to the center O of the holding surface S1 of the holding body 10 among the plurality of common vias 55C for heaters. Including. Therefore, as shown in FIG. 6, the first common driver electrode 81 becomes a thick portion (first thick portion 88) from the heater connecting portion 87 to the connecting portion with each common intermediate via portion 56C. There is.

また、図５および図６に示すように、複数（４つ）の共通中間ビア部５６Ｃが、第２の共通ドライバ電極８２において径方向に延びる各辺に沿って並んでいる。第２の共通ドライバ電極８２の内、少なくとも互いに隣り合う２つの以上の共通中間ビア部５６Ｃを囲む領域は、肉厚部分（第２の肉厚部分８９）になっている。具体的には、上下方向視で、第２の肉厚部分８９の外形線は、第２の共通ドライバ電極８２の一対の辺のそれぞれに沿って並んでいる２つずつの共通中間ビア部５６Ｃを包含している。ここで、端子用共通ビア部５８Ｃのビアの数は、該端子用共通ビア部５８Ｃの直上に位置する共通中間ビア部５６Ｃの数より多い。また、上下方向視で、共通中間ビア部５６Ｃ（共通中間ビア部５６Ｃを構成する全てのビア）を囲む領域の全体が端子用共通ビア部５８Ｃ（端子用共通ビア部５８Ｃを構成する全てのビア）を囲む領域に重なっている。第２の肉厚部分８９の内、少なくとも端子用共通ビア部５８Ｃを囲む領域の全体は、肉厚部分（第２の肉厚部分８９）になっている。 Further, as shown in FIGS. 5 and 6, a plurality of (four) common intermediate via portions 56C are arranged along each side extending in the radial direction in the second common driver electrode 82. Of the second common driver electrode 82, a region surrounding at least two or more common intermediate via portions 56C adjacent to each other is a thick portion (second thick portion 89). Specifically, in the vertical view, the outline of the second thick portion 89 is the two common intermediate via portions 56C arranged along each of the pair of sides of the second common driver electrode 82. Includes. Here, the number of vias of the terminal common via portion 58C is larger than the number of the common intermediate via portion 56C located directly above the terminal common via portion 58C. Further, when viewed in the vertical direction, the entire area surrounding the common intermediate via portion 56C (all vias constituting the common intermediate via portion 56C) is the terminal common via portion 58C (all vias constituting the terminal common via portion 58C). ) Overlaps the surrounding area. Of the second thick portion 89, at least the entire region surrounding the terminal common via portion 58C is a thick portion (second thick portion 89).

なお、共通ドライバ電極８０における肉厚部分８８，８９の特定方法は次の通りである。まず、超音波探傷検査により取得された画像から、共通ドライバ電極８０における肉厚部分８８，８９の形状を確認する。同画像において、肉厚部分と他の部分とは画像の色の濃度が異なることから両者を区別することができる（例えば、肉厚部分の色は、他の部分の色に比べて白っぽい）。したがって、この白っぽい部分の形状が、一対の第１の辺のそれぞれに沿った一対の第２の辺を有するとともに、保持体１０の保持面Ｓ１の外周側における周縁部が、共通ドライバ電極８０の周縁部から離間した形状であれば、肉厚部分の形状に関する条件を満たすことになる。また、共通ドライバ電極８０における端子接続部分８５とヒータ接続部分８７との両方を含む部分について、上下方向に平行な断面画像を取得し、その断面画像において、上記超音波探傷検査により特定された肉厚部分が他の部分より厚ければ（肉厚部分の最小厚み＞他の部分の最小厚みがより好ましい）、肉厚部分の厚さに関する条件を満たすことになる。 The method for specifying the thick portions 88 and 89 in the common driver electrode 80 is as follows. First, the shapes of the thick portions 88 and 89 of the common driver electrode 80 are confirmed from the images acquired by the ultrasonic flaw detection inspection. In the same image, the thick portion and the other portion can be distinguished from each other because the color density of the image is different (for example, the color of the thick portion is whitish compared to the color of the other portion). Therefore, the shape of this whitish portion has a pair of second sides along each of the pair of first sides, and the peripheral edge portion on the outer peripheral side of the holding surface S1 of the holding body 10 is the common driver electrode 80. If the shape is separated from the peripheral edge portion, the condition regarding the shape of the thick portion is satisfied. Further, for the portion of the common driver electrode 80 including both the terminal connection portion 85 and the heater connection portion 87, a cross-sectional image parallel to the vertical direction is acquired, and in the cross-sectional image, the meat identified by the ultrasonic flaw detection inspection is performed. If the thick portion is thicker than the other portion (the minimum thickness of the thick portion> the minimum thickness of the other portion is more preferable), the condition regarding the thickness of the thick portion is satisfied.

Ａ−５．本実施形態の効果：
以上説明したように、本実施形態の加熱装置１００では、２つのヒータ電極５０のそれぞれに流れる電流のすべてが共通ドライバ電極８０に流れる。このため、共通ドライバ電極８０は、個別ドライバ電極６０に比べて、電流が流れることによる発熱量が大きい。また、共通ドライバ電極８０は、複数の個別ドライバ電極６０と共に、一の仮想平面Ｍ１，Ｍ２上に配置されている。このため、共通ドライバ電極８０の発熱を抑制するために、共通ドライバ電極８０の上下方向視での面積を広く確保するにも制約がある。さらに、２つの個別給電端子９０と共通給電端子９１とは、いずれも、上下方向視で保持体１０の保持面Ｓ１の中心Ｏ側に配置されている。このため、仮に、共通ドライバ電極８０が上述の肉厚部分８８，８９を有しない構成では、共通ドライバ電極８０における保持面Ｓ１の中心Ｏ側に高温の特異点が生じやすい。 A-5. Effect of this embodiment:
As described above, in the heating device 100 of the present embodiment, all the currents flowing through each of the two heater electrodes 50 flow through the common driver electrode 80. Therefore, the common driver electrode 80 generates a larger amount of heat due to the flow of current than the individual driver electrode 60. Further, the common driver electrode 80 is arranged on one virtual plane M1 and M2 together with a plurality of individual driver electrodes 60. Therefore, in order to suppress the heat generation of the common driver electrode 80, there is a restriction in securing a large area of the common driver electrode 80 in the vertical direction. Further, the two individual power supply terminals 90 and the common power supply terminal 91 are both arranged on the center O side of the holding surface S1 of the holding body 10 in the vertical direction. Therefore, if the common driver electrode 80 does not have the thick portions 88 and 89 described above, a high temperature singular point is likely to occur on the center O side of the holding surface S1 of the common driver electrode 80.

これに対して、本実施形態では、共通ドライバ電極８０は、肉厚部分８８，８９を有している。各肉厚部分８８，８９の上下方向視での形状は、共通ドライバ電極８０の一対の辺８４のそれぞれに沿った一対の辺８８Ａを有するとともに、保持面Ｓ１の外周側における自身の周縁部８８Ｂが共通ドライバ電極８０の周縁部８６から離間した形状である（図４および図５参照）。また、肉厚部分８８，８９の上下方向の厚さは、共通ドライバ電極８０における他の部分（肉厚部分８８，８９を除いた部分）の上下方向の厚さより厚い（図５および図６参照）。このため、本実施形態によれば、共通ドライバ電極８０が肉厚部分を有しない構成に比べて、共通ドライバ電極８０における保持面Ｓ１の中心Ｏ側に高温の特異点が生じることを抑制することができる。なお、共通ドライバ電極８０における肉厚部分８８，８９と他の部分との上下方向の厚さの差は、５μｍ以上であることが好ましく、１０μｍ以上、５０μｍ以下であることがより好ましい。 On the other hand, in the present embodiment, the common driver electrode 80 has thick portions 88 and 89. The shape of each of the thick portions 88 and 89 in the vertical direction has a pair of sides 88A along each of the pair of sides 84 of the common driver electrode 80, and its own peripheral edge portion 88B on the outer peripheral side of the holding surface S1. Is a shape separated from the peripheral edge 86 of the common driver electrode 80 (see FIGS. 4 and 5). Further, the vertical thickness of the thick portions 88 and 89 is thicker than the vertical thickness of the other portions (the portions excluding the thick portions 88 and 89) of the common driver electrode 80 (see FIGS. 5 and 6). ). Therefore, according to the present embodiment, it is possible to suppress the occurrence of a high temperature singularity on the center O side of the holding surface S1 of the common driver electrode 80, as compared with the configuration in which the common driver electrode 80 does not have a thick portion. Can be done. The difference in thickness between the wall-thick portions 88 and 89 and the other portions in the common driver electrode 80 in the vertical direction is preferably 5 μm or more, and more preferably 10 μm or more and 50 μm or less.

また、本実施形態では、共通ドライバ電極８０は、上下方向に互いに異なる位置に配置された第１の共通ドライバ電極８１と第２の共通ドライバ電極８２を有する。第１の共通ドライバ電極８１と第２の共通ドライバ電極８２とは、いずれも、肉厚部分８８，８９を有する。このため、共通ドライバ電極８０における保持面Ｓ１の中心Ｏ側に高温の特異点が生じることを、より効果的に抑制することができる。 Further, in the present embodiment, the common driver electrode 80 has a first common driver electrode 81 and a second common driver electrode 82 arranged at different positions in the vertical direction. Both the first common driver electrode 81 and the second common driver electrode 82 have thick portions 88 and 89. Therefore, it is possible to more effectively suppress the occurrence of a high-temperature singular point on the center O side of the holding surface S1 of the common driver electrode 80.

また、本実施形態では、端子用共通ビア部５８Ｃにおけるヒータ接続部分８７側の端の位置と、該端子用共通ビア部５８Ｃの直上に位置する共通中間ビア部５６Ｃにおけるヒータ接続部分８７側の端の位置とは、略一致している（図６参照）。このため、上下方向視で、端子用共通ビア部５８Ｃと共通中間ビア部５６Ｃとのヒータ接続部分側の端の位置が互いに異なる構成に比べて、第２の共通ドライバ電極８２を介して端子用共通ビア部５８Ｃと共通中間ビア部５６Ｃとの間に流れる電流に起因して第２の共通ドライバ電極８２に高温の特異点が生じることを抑制することができる。 Further, in the present embodiment, the position of the end on the heater connection portion 87 side of the common via portion 58C for terminals and the end on the heater connection portion 87 side of the common intermediate via portion 56C located directly above the common via portion 58C for terminals. It is almost the same as the position of (see FIG. 6). Therefore, in the vertical direction, the terminals are connected via the second common driver electrode 82 as compared with the configuration in which the positions of the ends of the common via portion 58C for terminals and the common via portion 56C on the heater connection portion side are different from each other. It is possible to suppress the occurrence of a high temperature singularity in the second common driver electrode 82 due to the current flowing between the common via portion 58C and the common intermediate portion 56C.

また、本実施形態では、端子用共通ビア部５８Ｃのビアの数は、該端子用共通ビア部５８Ｃの直上に位置する共通中間ビア部５６Ｃの数より多い。また、上下方向視で、共通中間ビア部５６Ｃを囲む領域の全体が端子用共通ビア部５８Ｃを囲む領域に重なっている。第２の肉厚部分８９の内、少なくとも端子用共通ビア部５８Ｃを囲む領域の全体は、肉厚部分（第２の肉厚部分８９）になっている（図６参照）。このため、例えば、上下方向視で、共通中間ビア部５６Ｃを囲む領域の少なくとも一部が端子用共通ビア部５８Ｃを囲む領域に重なっていない構成に比べて、第２の共通ドライバ電極８２を介して端子用共通ビア部５８Ｃと共通中間ビア部５６Ｃとの間に流れる電流に起因して第２の共通ドライバ電極８２に高温の特異点が生じることを抑制することができる。 Further, in the present embodiment, the number of vias of the terminal common via portion 58C is larger than the number of the common intermediate via portion 56C located directly above the terminal common via portion 58C. Further, when viewed in the vertical direction, the entire region surrounding the common intermediate via portion 56C overlaps the region surrounding the common via portion 58C for terminals. Of the second thick portion 89, at least the entire region surrounding the terminal common via portion 58C is a thick portion (second thick portion 89) (see FIG. 6). Therefore, for example, as compared with the configuration in which at least a part of the region surrounding the common intermediate via portion 56C does not overlap the region surrounding the common via portion 58C for terminals in the vertical view, the second common driver electrode 82 is used. It is possible to suppress the occurrence of a high temperature singularity in the second common driver electrode 82 due to the current flowing between the common via portion 58C for terminals and the common intermediate via portion 56C.

また、本実施形態では、複数（４つ）の共通中間ビア部５６Ｃが、第１の共通ドライバ電極８１の辺８４に沿って並んでいる。第１の共通ドライバ電極８１の内、少なくとも互いに隣り合う２つの以上の共通中間ビア部５６Ｃを囲む領域は、肉厚部分（第１の肉厚部分８８）になっている。このため、例えば、互いに隣り合う２つの以上の共通中間ビア部５６Ｃを囲む領域が肉厚部分になっていない構成に比べて、共通ドライバ電極８０の辺８４付近に高温の特異点が生じることを抑制することができる。 Further, in the present embodiment, a plurality of (four) common intermediate via portions 56C are arranged along the side 84 of the first common driver electrode 81. Of the first common driver electrode 81, a region surrounding at least two or more common intermediate via portions 56C adjacent to each other is a wall-thick portion (first wall-thick portion 88). Therefore, for example, as compared with the configuration in which the region surrounding the two or more common intermediate via portions 56C adjacent to each other is not a thick portion, a high temperature singular point is generated near the side 84 of the common driver electrode 80. It can be suppressed.

また、本実施形態では、上下方向視で、共通ドライバ電極８０の面積は、各個別ドライバ電極６０のいずれの面積よりも大きい。このため、例えば、共通ドライバ電極８０の面積が個別ドライバ電極６０の面積以下である構成に比べて、共通ドライバ電極８０が高温になることを効果的に抑制することができる。 Further, in the present embodiment, the area of the common driver electrode 80 is larger than the area of any of the individual driver electrodes 60 in the vertical view. Therefore, for example, it is possible to effectively suppress the temperature of the common driver electrode 80 from becoming high as compared with the configuration in which the area of the common driver electrode 80 is smaller than the area of the individual driver electrode 60.

Ｂ．変形例：
本明細書で開示される技術は、上述の実施形態に限られるものではなく、その要旨を逸脱しない範囲において種々の形態に変形することができ、例えば次のような変形も可能である。 B. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof. For example, the following modifications are also possible.

上記実施形態における加熱装置１００の構成は、あくまで一例であり、種々変形可能である。例えば、上記実施形態では、保持体１０の保持面Ｓ１（第１の表面）は、平面であるとしたが、例えば、緩やかな凹面状であるとしてもよい。要するに、保持面Ｓ１は、略平面状であればよい。また、上記実施形態では、個別給電端子９０や共通給電端子９１の形状は、上下方向に延びる略棒状であるとしたが（図２参照）、例えば平板状（例えば個別受電電極５４や共通受電電極５７）であるとしてもよい。また、上記実施形態では、個別給電端子９０等は、保持体１０の裏面Ｓ２に形成された凹部１２の底面に配置されるとしたが、個別給電端子９０等は、例えば、裏面Ｓ２の平面上や裏面Ｓ２に形成された凸部に配置されるとしてもよい。 The configuration of the heating device 100 in the above embodiment is merely an example and can be variously deformed. For example, in the above embodiment, the holding surface S1 (first surface) of the holding body 10 is a flat surface, but may be, for example, a gentle concave surface. In short, the holding surface S1 may be substantially flat. Further, in the above embodiment, the shape of the individual power supply terminal 90 and the common power supply terminal 91 is assumed to be a substantially rod shape extending in the vertical direction (see FIG. 2), but for example, a flat plate shape (for example, the individual power receiving electrode 54 or the common power receiving electrode 54). 57) may be used. Further, in the above embodiment, the individual power supply terminal 90 or the like is arranged on the bottom surface of the recess 12 formed in the back surface S2 of the holding body 10, but the individual power supply terminal 90 or the like is, for example, on the flat surface of the back surface S2. Or it may be arranged on a convex portion formed on the back surface S2.

また、上記実施形態において、複数のヒータ電極５０の少なくとも一部は、保持体１０の内部において、上下方向（Ｚ軸方向）に互いに異なる位置に配置されているとしてもよい。また、上記実施形態において、加熱装置１００は、上記ドライバ層を１つ（１層）だけ、或いは、３つ（３層）以上備えるとしてもよい。また、上記実施形態では、保持体１０に備えられた全てのヒータ電極５０に電気的に接続された全てのドライバ電極６０，８０に対して本発明を適したが、保持体１０に備えられた一部のヒータ電極５０に電気的に接続された一部のドライバ電極６０，８０に対してのみ本発明を適用してもよい。 Further, in the above embodiment, at least a part of the plurality of heater electrodes 50 may be arranged at different positions in the vertical direction (Z-axis direction) inside the holding body 10. Further, in the above embodiment, the heating device 100 may include only one (one layer) or three (three layers) or more of the driver layers. Further, in the above embodiment, the present invention is suitable for all the driver electrodes 60 and 80 electrically connected to all the heater electrodes 50 provided in the holding body 10, but the holding body 10 is provided. The present invention may be applied only to some driver electrodes 60, 80 electrically connected to some heater electrodes 50.

また、上記実施形態において、ドライバ電極６０，８０は、保持体１０の内部において、保持面Ｓ１とヒータ電極５０との間に配置されているとしてもよい。また、上記実施形態において、個別ドライバ電極６０の上下方向視での形状は、一対の辺６４のなす角度の内、円弧６６側の角度が１８０度、または、１８０度より大きい角度である略扇状であってもよい。また、個別ドライバ電極６０の上下方向視での形状は、扇状以外の形状（例えば三角形）であってもよい。 Further, in the above embodiment, the driver electrodes 60 and 80 may be arranged between the holding surface S1 and the heater electrode 50 inside the holding body 10. Further, in the above embodiment, the shape of the individual driver electrode 60 in the vertical direction is substantially a fan shape in which the angle on the arc 66 side is 180 degrees or larger than 180 degrees among the angles formed by the pair of sides 64. It may be. Further, the shape of the individual driver electrode 60 in the vertical direction may be a shape other than the fan shape (for example, a triangle).

また、上記実施形態において、共通ドライバ電極８０の上下方向視での形状は、一対の辺８４のなす角度の内、円弧８６側の角度が１８０度、または、１８０度より小さい（鋭角）である略扇状であってもよい。共通ドライバ電極８０の上下方向視での形状は、扇状以外の形状であってもよい。また、上記実施形態において、第１の共通ドライバ電極８１と第２の共通ドライバ電極８２とを電気的に接続する共通中間ビア部５６Ｃの数が１つであってもよい。また、上記実施形態において、共通ドライバ電極８０の各辺８４は、直線に限らず、例えば曲線状であってもよい。なお、共通ドライバ電極８０が有する一対の第１の辺のなす角が鋭角である場合、共通ドライバ電極における第１の表面の中心側の先端先細り状部分に高温の特異点が特に生じやすいため、本発明を適用することは特に好ましい。 Further, in the above embodiment, the shape of the common driver electrode 80 in the vertical direction is that the angle formed by the pair of sides 84 on the arc 86 side is 180 degrees or smaller than 180 degrees (acute angle). It may be substantially fan-shaped. The shape of the common driver electrode 80 in the vertical direction may be a shape other than the fan shape. Further, in the above embodiment, the number of common intermediate via portions 56C for electrically connecting the first common driver electrode 81 and the second common driver electrode 82 may be one. Further, in the above embodiment, each side 84 of the common driver electrode 80 is not limited to a straight line, but may be curved, for example. When the angle formed by the pair of first sides of the common driver electrode 80 is an acute angle, a high-temperature singular point is particularly likely to occur in the tapered portion on the center side of the first surface of the common driver electrode. It is particularly preferable to apply the present invention.

上記実施形態において、各肉厚部分８８，８９の上下方向視での形状は、扇状以外の形状であってもよい。要するに、肉厚部分の上下方向視での形状は、共通ドライバ電極８０の辺８４に沿った辺を有するとともに、周縁部が共通ドライバ電極８０の円弧８６（周縁部）から離間した形状であればよい。また、上下方向視で、第１の肉厚部分８８における各辺８８Ａの位置は、第１の共通ドライバ電極８１における各辺８４に重なっていてもよい。また、上記実施形態において、２つの共通ドライバ電極８０の一方は、肉厚部分を有しない構成であってもよい。また、上記実施形態において、共通ドライバ電極８０に加えて、個別ドライバ電極６０が肉厚部分を有する構成であってもよい。この肉厚部分の上下方向視での形状は、個別ドライバ電極６０の一対の辺６４のそれぞれに沿った一対の辺を有するとともに、保持体１０の保持面Ｓ１の外周側における周縁部６６が、個別ドライバ電極６０の周縁部から離間した形状である。このような構成であれば、個別ドライバ電極６０における保持面Ｓ１の中心Ｏ側に高温の特異点が生じることを抑制することができる。 In the above embodiment, the shapes of the thick portions 88 and 89 in the vertical direction may be shapes other than the fan shape. In short, the shape of the thick portion in the vertical direction is as long as it has a side along the side 84 of the common driver electrode 80 and the peripheral edge portion is separated from the arc 86 (peripheral portion) of the common driver electrode 80. Good. Further, in the vertical view, the position of each side 88A in the first thick portion 88 may overlap with each side 84 in the first common driver electrode 81. Further, in the above embodiment, one of the two common driver electrodes 80 may have a configuration that does not have a thick portion. Further, in the above embodiment, in addition to the common driver electrode 80, the individual driver electrode 60 may have a thick portion. The shape of this thick portion in the vertical direction has a pair of sides along each of the pair of sides 64 of the individual driver electrodes 60, and the peripheral edge portion 66 on the outer peripheral side of the holding surface S1 of the holding body 10 has a peripheral portion 66. The shape is separated from the peripheral edge of the individual driver electrode 60. With such a configuration, it is possible to suppress the occurrence of a high-temperature singular point on the center O side of the holding surface S1 of the individual driver electrode 60.

上記実施形態において、上下方向視で、端子用共通ビア部５８Ｃと共通中間ビア部５６Ｃとのヒータ接続部分側の端の位置が互いに異なる構成であってもよい。また、上記実施形態において、上下方向視で、共通中間ビア部５６Ｃを囲む領域の少なくとも一部が端子用共通ビア部５８Ｃを囲む領域に重なっていない構成であってもよい。また、上記実施形態において、互いに隣り合う２つの以上の共通中間ビア部５６Ｃを囲む領域が肉厚部分になっていない構成であってもよい。また、共通ドライバ電極８０の面積が各個別ドライバ電極６０の面積以下である構成であってもよい。 In the above embodiment, the positions of the ends of the common via portion 58C for terminals and the common via portion 56C on the heater connection portion side may be different from each other in the vertical direction. Further, in the above embodiment, at least a part of the region surrounding the common intermediate via portion 56C may not overlap the region surrounding the common via portion 58C for terminals in the vertical view. Further, in the above embodiment, the region surrounding the two or more common intermediate via portions 56C adjacent to each other may not be a thick portion. Further, the area of the common driver electrode 80 may be smaller than the area of each individual driver electrode 60.

また、上記実施形態において、各ビア部（ヒータ用個別ビア部５５Ａ，５５Ｂ等）は、単数のビアにより構成されてもよい。また、上記実施形態において、各ビア部は、ビア部分のみからなる単層構成であってもよいし、複数層構成（例えば、ビア部分とパッド部分とビア部分とが積層された構成）であってもよい。 Further, in the above embodiment, each via portion (individual via portion for heater 55A, 55B, etc.) may be composed of a single via. Further, in the above embodiment, each via portion may have a single layer configuration consisting of only the via portion, or may have a multi-layer configuration (for example, a configuration in which a via portion, a pad portion, and a via portion are laminated). You may.

また、上記実施形態の加熱装置１００における各部材を形成する材料は、あくまで例示であり、各部材が他の材料により形成されてもよい。例えば、上記実施形態では、板状部材として、ＡｌＮにより形成された保持体１０を例示したが、板状部材は、Ａｌ２Ｏ３（アルミナ）などの他のセラミックス材料やセラミックス以外の材料（例えば樹脂等の絶縁材料）により形成された部材であるとしてもよい。 Further, the material forming each member in the heating device 100 of the above embodiment is merely an example, and each member may be formed of another material. For example, in the above embodiment, the holding body 10 formed of AlN is exemplified as the plate-shaped member, but the plate-shaped member is made of another ceramic material such as Al 2 O 3 (alumina) or a material other than ceramics (for example,). It may be a member formed of an insulating material such as resin).

また、本発明は、保持体１０と柱状支持体２０とを備え、半導体ウェハＷを保持して加熱する加熱装置１００に限らず、板状部材を備え、板状部材の表面上に対象物を保持する他の保持装置（例えば、静電チャックや真空チャック等）にも適用可能である。 Further, the present invention is not limited to the heating device 100 which includes the holding body 10 and the columnar support 20 to hold and heat the semiconductor wafer W, but also includes a plate-shaped member, and an object is placed on the surface of the plate-shaped member. It can also be applied to other holding devices for holding (for example, electrostatic chucks, vacuum chucks, etc.).

１０：保持体 １２：凹部 ２０：柱状支持体 ２２：貫通孔 ３０：接合層 ５０（５０Ａ，５０Ｂ）：ヒータ電極 ５４：個別受電電極 ５５Ａ：第１のヒータ用個別ビア部 ５５Ｂ：第２のヒータ用個別ビア部 ５５Ｃ：第１のヒータ用共通ビア部 ５５Ｄ：第２のヒータ用共通ビア部 ５６：接合部 ５６Ａ：第１の個別中間ビア部 ５６Ｂ：第２の個別中間ビア ５６Ｃ：共通中間ビア部 ５７：共通受電電極 ５８Ａ：第１の端子用個別ビア部 ５８Ｂ：第２の端子用個別ビア部 ５８Ｃ：端子用共通ビア部 ６０：個別ドライバ電極 ６１Ａ，６１Ｂ：第１の個別ドライバ電極 ６２Ａ，６２Ｂ：第２の個別ドライバ電極 ６６：円弧 ８０：共通ドライバ電極 ８１：第１の共通ドライバ電極 ８２：第２の共通ドライバ電極 ８４：辺 ８５：端子接続部分 ８６：円弧 ８７：ヒータ接続部分 ８８：第１の肉厚部分 ８８Ａ：辺 ８８Ｂ：周縁部 ８９：第２の肉厚部分 ９０（９０Ａ，９０Ｂ）：個別給電端子 ９１：共通給電端子 １００：加熱装置 Ｌ：一点鎖線 Ｍ１：第１の仮想平面 Ｍ２：第２の仮想平面 Ｏ：中心 Ｓ１：保持面 Ｓ２：裏面 Ｓ３：上面 Ｗ：半導体ウェハ Ｚａ：第１の領域 Ｚｂ：第２の領域 10: Holder 12: Recession 20: Columnar support 22: Through hole 30: Bonding layer 50 (50A, 50B): Heater electrode 54: Individual power receiving electrode 55A: Individual via portion for first heater 55B: Second heater Individual via portion 55C: Common via portion for the first heater 55D: Common via portion for the second heater 56: Joint portion 56A: First individual intermediate via portion 56B: Second individual intermediate via 56C: Common intermediate via Part 57: Common power receiving electrode 58A: Individual via part for first terminal 58B: Individual via part for second terminal 58C: Common via part for terminal 60: Individual driver electrodes 61A, 61B: First individual driver electrode 62A, 62B: Second individual driver electrode 66: Arc 80: Common driver electrode 81: First common driver electrode 82: Second common driver electrode 84: Side 85: Terminal connection part 86: Arc 87: Heater connection part 88: First thick portion 88A: Side 88B: Peripheral portion 89: Second thick portion 90 (90A, 90B): Individual power supply terminal 91: Common power supply terminal 100: Heating device L: Single point chain wire M1: First virtual Plane M2: Second virtual plane O: Center S1: Holding surface S2: Back surface S3: Top surface W: Semiconductor wafer Za: First region Zb: Second region

Claims (5)

第１の方向に略垂直な略平面状の第１の表面と、前記第１の表面とは反対側の第２の表面と、を有する板状部材と、
前記板状部材の内部に配置され、抵抗発熱体により構成された複数のヒータ電極と、
前記板状部材の内部において前記第１の方向に略垂直な一の仮想平面上に配置され、前記複数のヒータ電極の内のＮ（Ｎは２以上の整数）個の前記ヒータ電極のそれぞれに対して電気的に接続されたＮ個の個別ドライバ電極と、
前記板状部材の前記第２の表面側に配置され、前記Ｎ個の個別ドライバ電極のそれぞれに対して電気的に接続されたＮ個の個別給電端子と、
前記板状部材の内部において前記一の仮想平面上に配置され、前記Ｎ個のヒータ電極のすべてに対して電気的に接続された共通ドライバ電極と、
前記板状部材の前記第２の表面側に配置され、前記共通ドライバ電極に対して電気的に接続された共通給電端子と、
を備え、
前記板状部材の前記第１の表面上に対象物を保持する保持装置において、
前記Ｎ個の個別給電端子と前記共通給電端子とは、いずれも、前記第１の方向視で前記第１の表面の中心側に配置され、
前記共通ドライバ電極の前記第１の方向視での形状は、前記第１の表面の外周側から前記中心側に向かうに連れて互いの距離が短くなる一対の第１の辺を有する形状であり、
前記共通ドライバ電極は、前記共通給電端子に電気的に接続された端子接続部分と、前記Ｎ個のヒータ電極に電気的に接続されたＮ個のヒータ接続部分と、を有し、前記第１の方向視で、前記端子接続部分は、前記ヒータ接続部分より前記第１の表面の前記中心側に位置しており、
前記共通ドライバ電極は、
前記第１の方向視での形状が、前記一対の第１の辺のそれぞれに沿った一対の第２の辺を有するとともに、前記第１の表面の前記外周側における周縁部が、前記共通ドライバ電極の周縁部から離間した形状であり、かつ、前記第１の方向の厚さが、前記共通ドライバ電極における他の部分の前記第１の方向の厚さより厚い、肉厚部分を有している、
ことを特徴とする保持装置。 A plate-like member having a substantially planar first surface substantially perpendicular to the first direction and a second surface opposite to the first surface.
A plurality of heater electrodes arranged inside the plate-shaped member and composed of a resistance heating element, and
Inside the plate-shaped member, the heater electrodes are arranged on one virtual plane substantially perpendicular to the first direction, and N (N is an integer of 2 or more) among the plurality of heater electrodes. N individual driver electrodes electrically connected to each other,
N individual power supply terminals arranged on the second surface side of the plate-shaped member and electrically connected to each of the N individual driver electrodes.
A common driver electrode arranged on the one virtual plane inside the plate-shaped member and electrically connected to all of the N heater electrodes,
A common power supply terminal arranged on the second surface side of the plate-shaped member and electrically connected to the common driver electrode,
With
In a holding device for holding an object on the first surface of the plate-shaped member,
Both the N individual power supply terminals and the common power supply terminal are arranged on the center side of the first surface in the first directional view.
The shape of the common driver electrode in the first directional view is a shape having a pair of first sides in which the distance between the common driver electrodes becomes shorter from the outer peripheral side to the central side of the first surface. ,
The common driver electrode has a terminal connection portion electrically connected to the common power supply terminal and N heater connection portions electrically connected to the N heater electrodes, and the first one. The terminal connection portion is located on the center side of the first surface of the heater connection portion in the direction of the above.
The common driver electrode is
The shape in the first directional view has a pair of second sides along each of the pair of first sides, and the peripheral edge portion on the outer peripheral side of the first surface is the common driver. It has a thick portion that is separated from the peripheral edge of the electrode and whose thickness in the first direction is thicker than the thickness of other portions in the common driver electrode in the first direction. ,
A holding device characterized by that. 請求項１に記載の保持装置において、
前記共通ドライバ電極は、第１の共通ドライバ電極と、前記第１の方向において前記第１の共通ドライバ電極と前記共通給電端子との間に配置され、第１のビア部を介して前記第１の共通ドライバ電極に電気的に接続されると共に、第２のビア部を介して前記共通給電端子に電気的に接続された第２の共通ドライバ電極と、を含んでおり、
前記第１のビア部と前記第２のビア部とは、前記第１の方向視で前記ヒータ接続部分より前記第１の表面の前記中心側に位置し、かつ、前記第１の方向視で前記ヒータ接続部分側の端の位置は互いに略一致している、
ことを特徴とする保持装置。 In the holding device according to claim 1,
The common driver electrode is arranged between the first common driver electrode and the first common driver electrode and the common feeding terminal in the first direction, and the first via the first via portion. A second common driver electrode, which is electrically connected to the common driver electrode of the above and is electrically connected to the common power supply terminal via the second via portion, is included.
The first via portion and the second via portion are located on the center side of the first surface from the heater connection portion in the first directional view, and in the first directional view. The positions of the ends on the heater connection portion side are substantially the same as each other.
A holding device characterized by that. 請求項１または請求項２に記載の保持装置において、
前記共通ドライバ電極は、第１の共通ドライバ電極と、前記第１の方向において前記第１の共通ドライバ電極と前記共通給電端子との間に配置され、第１のビア部を介して前記第１の共通ドライバ電極に電気的に接続されると共に、第２のビア部を介して前記共通給電端子に電気的に接続された第２の共通ドライバ電極と、を含んでおり、
前記第１のビア部と前記第２のビア部との内の一方のビア部を構成するビアの数は、他方のビア部を構成するビアの数より多く、かつ、前記第１の方向視で、前記他方のビア部を囲む領域の全体が前記一方のビア部を囲む領域に重なっており、
前記第２の共通ドライバ電極の内、少なくとも前記一方のビア部を囲む領域の全体は、前記肉厚部分になっている、
ことを特徴とする保持装置。 In the holding device according to claim 1 or 2.
The common driver electrode is arranged between the first common driver electrode and the first common driver electrode and the common feeding terminal in the first direction, and the first via the first via portion. A second common driver electrode, which is electrically connected to the common driver electrode of the above and is electrically connected to the common power supply terminal via the second via portion, is included.
The number of vias constituting one via portion of the first via portion and the second via portion is larger than the number of vias constituting the other via portion, and the first directional view Then, the entire region surrounding the other via portion overlaps with the region surrounding the one via portion.
Of the second common driver electrode, at least the entire region surrounding the via portion is the thick portion.
A holding device characterized by that. 請求項１から請求項３までのいずれか一項に記載の保持装置において、
前記共通ドライバ電極は、第１の共通ドライバ電極と、前記第１の共通ドライバ電極と前記共通給電端子との間に配置され、複数の第１のビア部を介して前記第１の共通ドライバ電極に電気的に接続されると共に、第２のビア部を介して前記共通給電端子に電気的に接続された第２の共通ドライバ電極と、を含んでおり、
前記複数の第１のビア部は、前記共通ドライバ電極の前記第１の辺に沿って並んでおり、
前記共通ドライバ電極の内、少なくとも互いに隣り合う２つの以上の前記第１のビア部を囲む領域は、前記肉厚部分になっている、
ことを特徴とする保持装置。 In the holding device according to any one of claims 1 to 3.
The common driver electrode is arranged between the first common driver electrode, the first common driver electrode, and the common feeding terminal, and the first common driver electrode is provided via a plurality of first via portions. A second common driver electrode, which is electrically connected to the common feeding terminal and electrically connected to the common power supply terminal via the second via portion, is included.
The plurality of first via portions are arranged along the first side of the common driver electrode.
Among the common driver electrodes, at least two or more regions surrounding the first via portion adjacent to each other are the thick portions.
A holding device characterized by that. 請求項１から請求項４までのいずれか一項に記載の保持装置において、
前記第１の方向視で、前記共通ドライバ電極の面積は、前記Ｎ個の個別ドライバ電極のいずれの面積よりも大きい、
ことを特徴とする保持装置。 In the holding device according to any one of claims 1 to 4.
In the first directional view, the area of the common driver electrode is larger than the area of any of the N individual driver electrodes.
A holding device characterized by that.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034054A1 (en) * 2022-08-10 2024-02-15 日本碍子株式会社 Wafer placement table

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JP2015191837A (en) * 2014-03-28 2015-11-02 日本特殊陶業株式会社 Layered heating element
JP2017201669A (en) * 2016-05-06 2017-11-09 日本特殊陶業株式会社 Heating member and electrostatic chuck
JP2018170508A (en) * 2017-03-29 2018-11-01 Toto株式会社 Electrostatic chuck

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Publication number Priority date Publication date Assignee Title
JP2015191837A (en) * 2014-03-28 2015-11-02 日本特殊陶業株式会社 Layered heating element
JP2017201669A (en) * 2016-05-06 2017-11-09 日本特殊陶業株式会社 Heating member and electrostatic chuck
JP2018170508A (en) * 2017-03-29 2018-11-01 Toto株式会社 Electrostatic chuck

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034054A1 (en) * 2022-08-10 2024-02-15 日本碍子株式会社 Wafer placement table
JP7478905B1 (en) 2022-08-10 2024-05-07 日本碍子株式会社 Wafer placement table

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