JP2020113746A - 処理装置 - Google Patents
処理装置 Download PDFInfo
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- JP2020113746A JP2020113746A JP2019191462A JP2019191462A JP2020113746A JP 2020113746 A JP2020113746 A JP 2020113746A JP 2019191462 A JP2019191462 A JP 2019191462A JP 2019191462 A JP2019191462 A JP 2019191462A JP 2020113746 A JP2020113746 A JP 2020113746A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/0084—Charging; Manipulation of SC or SC wafers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D5/00—Supports, screens, or the like for the charge within the furnace
- F27D5/0037—Supports specially adapted for semi-conductors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D2003/0085—Movement of the container or support of the charge in the furnace or in the charging facilities
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
- F27D2009/007—Cooling of charges therein
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
第1の実施形態の処理装置について説明する。図1から図3は、第1の実施形態の処理装置の構成例を示す斜視図であり、それぞれ異なる方向から処理装置を見たときの図である。図4は、図1から図3の処理装置の側面である。以下では、処理装置の左右方向をX方向、前後方向をY方向、高さ方向をZ方向として説明する。
第2の実施形態の処理装置について説明する。図6は、第2の実施形態の処理装置の構成例を示す斜視図である。
20 ローダモジュール
40 プロセスモジュール
41 熱処理ユニット
412a ガス導入ポート
412b 排気ポート
43 ガス供給ユニット
44 排気ダクト
F 床
W ウエハ
Claims (8)
- 連接配置された複数のプロセスモジュールと、
前記複数のプロセスモジュールで処理する基板を収納したキャリアを収容するローダモジュールと、
を備え、
前記複数のプロセスモジュールの各々は、
複数枚の基板を収容して熱処理する処理容器を含む熱処理ユニットと、
前記熱処理ユニットの一側面に配置され、前記処理容器内にガスを供給するガス供給ユニットと、
を有する、
処理装置。 - 前記ガス供給ユニットは、床から離間して配置されている、
請求項1に記載の処理装置。 - 前記熱処理ユニットは、前記ガス供給ユニットの側に配置され、前記処理容器内にガスを導入するガス導入ポートを有する、
請求項1又は2に記載の処理装置。 - 前記複数のプロセスモジュールの各々は、前記熱処理ユニットを挟んで前記ガス供給ユニットと対向して配置され、前記処理容器内のガスを排気する排気配管を含む排気ダクトを有する、
請求項1乃至3のいずれか一項に記載の処理装置。 - 前記熱処理ユニットは、前記排気ダクトの側に配置され、前記処理容器内のガスを排気する排気ポートを有する、
請求項4に記載の処理装置。 - 前記複数のプロセスモジュールの各々は、前記熱処理ユニットの下方に配置され、前記熱処理ユニットとの間で複数枚の基板を受け渡すための基板保持具を収容するロードユニットを有する、
請求項1乃至5のいずれか一項に記載の処理装置。 - 前記ローダモジュールと、前記複数のプロセスモジュールの各々に設けられた前記ロードユニットとの間で基板を受け渡す基板搬送機構を含む基板搬送モジュールを備える、
請求項6に記載の処理装置。 - 前記ガス供給ユニットは、平面視で、前記基板搬送モジュールと重なるように配置されている、
請求項7に記載の処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108148558A TWI799673B (zh) | 2019-01-10 | 2019-12-31 | 處理裝置(二) |
KR1020200001251A KR102552110B1 (ko) | 2019-01-10 | 2020-01-06 | 처리 장치 |
US16/737,512 US11302542B2 (en) | 2019-01-10 | 2020-01-08 | Processing apparatus |
CN202010026896.6A CN111430268B (zh) | 2019-01-10 | 2020-01-10 | 处理装置 |
Applications Claiming Priority (2)
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JP2019002945 | 2019-01-10 | ||
JP2019002945 | 2019-01-10 |
Publications (2)
Publication Number | Publication Date |
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JP2020113746A true JP2020113746A (ja) | 2020-07-27 |
JP7105751B2 JP7105751B2 (ja) | 2022-07-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019191462A Active JP7105751B2 (ja) | 2019-01-10 | 2019-10-18 | 処理装置 |
Country Status (4)
Country | Link |
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US (1) | US11302542B2 (ja) |
JP (1) | JP7105751B2 (ja) |
KR (1) | KR102552110B1 (ja) |
TW (1) | TWI799673B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230120575A (ko) | 2022-02-09 | 2023-08-17 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
KR20230120574A (ko) | 2022-02-09 | 2023-08-17 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
KR20230146447A (ko) | 2022-04-12 | 2023-10-19 | 도쿄엘렉트론가부시키가이샤 | 반응관 반송 지그 및 반응관의 반송 방법 |
KR20240050276A (ko) | 2022-10-11 | 2024-04-18 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11204449A (ja) * | 1998-01-14 | 1999-07-30 | Tokyo Electron Ltd | 縦型熱処理装置 |
JP2001156009A (ja) * | 1999-11-30 | 2001-06-08 | Tokyo Electron Ltd | 熱処理装置 |
JP2005243858A (ja) * | 2004-02-26 | 2005-09-08 | Tokyo Electron Ltd | 処理装置 |
JP2006229085A (ja) * | 2005-02-18 | 2006-08-31 | Tokyo Electron Ltd | プラズマ処理装置、熱処理装置、処理システム、前処理装置及び記憶媒体 |
JP2015517210A (ja) * | 2012-03-28 | 2015-06-18 | クックジェ エレクトリック コリア カンパニー リミテッド | 選択的エピタキシャル成長のための装置およびクラスター設備 |
WO2018150536A1 (ja) * | 2017-02-17 | 2018-08-23 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
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JP2500759B2 (ja) * | 1993-06-24 | 1996-05-29 | 日本電気株式会社 | 半導体製造装置 |
JP3610900B2 (ja) | 2000-11-30 | 2005-01-19 | 東京エレクトロン株式会社 | 熱処理装置 |
JP4884607B2 (ja) | 2001-07-12 | 2012-02-29 | 東京エレクトロン株式会社 | 熱処理装置 |
JP2015122481A (ja) * | 2013-11-22 | 2015-07-02 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
KR20220078725A (ko) * | 2016-06-30 | 2022-06-10 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체 |
JP2018174186A (ja) * | 2017-03-31 | 2018-11-08 | 東京エレクトロン株式会社 | 基板処理装置 |
-
2019
- 2019-10-18 JP JP2019191462A patent/JP7105751B2/ja active Active
- 2019-12-31 TW TW108148558A patent/TWI799673B/zh active
-
2020
- 2020-01-06 KR KR1020200001251A patent/KR102552110B1/ko active IP Right Grant
- 2020-01-08 US US16/737,512 patent/US11302542B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11204449A (ja) * | 1998-01-14 | 1999-07-30 | Tokyo Electron Ltd | 縦型熱処理装置 |
JP2001156009A (ja) * | 1999-11-30 | 2001-06-08 | Tokyo Electron Ltd | 熱処理装置 |
JP2005243858A (ja) * | 2004-02-26 | 2005-09-08 | Tokyo Electron Ltd | 処理装置 |
JP2006229085A (ja) * | 2005-02-18 | 2006-08-31 | Tokyo Electron Ltd | プラズマ処理装置、熱処理装置、処理システム、前処理装置及び記憶媒体 |
JP2015517210A (ja) * | 2012-03-28 | 2015-06-18 | クックジェ エレクトリック コリア カンパニー リミテッド | 選択的エピタキシャル成長のための装置およびクラスター設備 |
WO2018150536A1 (ja) * | 2017-02-17 | 2018-08-23 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230120575A (ko) | 2022-02-09 | 2023-08-17 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
KR20230120574A (ko) | 2022-02-09 | 2023-08-17 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
KR20230146447A (ko) | 2022-04-12 | 2023-10-19 | 도쿄엘렉트론가부시키가이샤 | 반응관 반송 지그 및 반응관의 반송 방법 |
KR20240050276A (ko) | 2022-10-11 | 2024-04-18 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
Also Published As
Publication number | Publication date |
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KR102552110B1 (ko) | 2023-07-06 |
TW202101542A (zh) | 2021-01-01 |
US20200227293A1 (en) | 2020-07-16 |
JP7105751B2 (ja) | 2022-07-25 |
TWI799673B (zh) | 2023-04-21 |
KR20200087083A (ko) | 2020-07-20 |
US11302542B2 (en) | 2022-04-12 |
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