JP2020113586A - Component mounting system and manufacturing method of mounting board - Google Patents

Component mounting system and manufacturing method of mounting board Download PDF

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JP2020113586A
JP2020113586A JP2019001537A JP2019001537A JP2020113586A JP 2020113586 A JP2020113586 A JP 2020113586A JP 2019001537 A JP2019001537 A JP 2019001537A JP 2019001537 A JP2019001537 A JP 2019001537A JP 2020113586 A JP2020113586 A JP 2020113586A
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mounting
component
inspection
board
substrate
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JP7194881B2 (en
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谷口　昌弘
Masahiro Taniguchi
昌弘 谷口
利彦 永冶
Toshihiko Nagaya
利彦 永冶
貴之 北
Takayuki Kita
貴之 北
正宏 木原
Masahiro Kihara
正宏 木原
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Abstract

To provide a component mounting system capable of correcting deviation of the component mounting position due to impact of device fluctuation, and to provide a manufacturing method of a mounting board.SOLUTION: A component mounting system has a component mounting device M1, an inspection device M2, and a correction amount calculation device for calculating the correction amount of the mounting position on the basis of the measurement results by the inspection device M2. The component mounting device M1 includes a board transfer mechanism 5 for transferring a board 6 to the inspection device M2 (arrow head a), when some components D are mounted on the board 6. The inspection device M2 includes a board transfer mechanism 31 for reverse transporting (arrow head b) the board 6 to the component mounting device M1, when the mounting positions of the some components D, mounted on the board 6, are measured by an inspection camera 32. The component mounting device M1 includes mounting position correction means for correcting the mounting position of an unmounted component on the basis of the correction amount calculated by the correction amount calculation device, and the mounting head mounts the unmounted component at the corrected mounting position.SELECTED DRAWING: Figure 5

Description

本発明は、基板に部品を装着する部品実装システムおよび実装基板の製造方法に関する。 The present invention relates to a component mounting system for mounting components on a substrate and a method for manufacturing a mounted substrate.

部品実装装置は、装着ヘッド移動機構によって水平方向に高速で移動する装着ヘッドが、部品供給装置より部品を取り出して基板に装着する装着動作を繰り返し実行して、基板に複数の部品を装着した実装基板を製造する。部品実装装置では、装着動作を反復実行する過程で発生する装着ヘッド移動機構の熱変形などの装置変動に起因して、基板に装着した部品の装着位置の位置ずれが発生する（例えば、特許文献１参照）。特許文献１に記載の部品実装システムでは、全ての部品の装着が完了した基板を部品実装装置の下流に配置した検査装置に搬送し、検査装置が部品の装着位置を計測し、計測結果に基づいて補正量が算出される。そして、次の基板に部品を装着する際に、この補正量に基づいて補正された実装位置に部品実装装置が部品を装着することで、部品の装着精度を確保している。 In the component mounting apparatus, the mounting head that moves at a high speed in the horizontal direction by the mounting head moving mechanism repeatedly performs the mounting operation of picking up the component from the component supply device and mounting it on the board, and mounting the plurality of components on the board. Produce a substrate. In the component mounting apparatus, displacement of the mounting position of the component mounted on the substrate occurs due to device fluctuation such as thermal deformation of the mounting head moving mechanism that occurs in the process of repeatedly performing the mounting operation (for example, Patent Document 1). 1). In the component mounting system described in Patent Document 1, a substrate on which all components have been mounted is conveyed to an inspection device arranged downstream of the component mounting device, the inspection device measures the component mounting position, and based on the measurement result. Then, the correction amount is calculated. Then, when the component is mounted on the next board, the component mounting apparatus mounts the component at the mounting position corrected based on the correction amount, thereby ensuring the mounting accuracy of the component.

特開２０１６−５８６０４号公報JP, 2016-58604, A

ところで、部品装着後に個々に切り離される複数の個別基板から構成される基板などでは、合計で１万個を超える大量の部品が装着される場合がある。そのような基板では装着作業に要する時間が長くなり、装着作業中に装置の状態が変動して装着位置の位置ずれ量が変動することがある。しかしながら、特許文献１に記載を含む従来技術では、全部品を装着した後に計測した全部品の装着位置に基づいて補正量を算出しているため、算出された補正量が現在の部品実装装置の状態を反映していない可能性があり、部品の装着精度が確保できないという問題点があった。 By the way, in the case of a board or the like composed of a plurality of individual boards which are individually separated after the parts are mounted, a large number of parts in total exceeding 10,000 may be mounted. With such a board, the time required for the mounting work becomes long, and the state of the apparatus may change during the mounting work, and the amount of displacement of the mounting position may change. However, in the conventional technique including the one described in Patent Document 1, since the correction amount is calculated based on the mounting positions of all the components measured after mounting all the components, the calculated correction amount corresponds to the current component mounting apparatus. There is a possibility that the state may not be reflected, and the component mounting accuracy cannot be ensured.

そこで本発明は、装置変動の影響による部品の装着位置のずれを精度良く補正することができる部品実装システムおよび実装基板の製造方法を提供することを目的とする。 Therefore, it is an object of the present invention to provide a component mounting system and a method of manufacturing a mounting substrate, which can accurately correct a displacement of a mounting position of a component due to the influence of a device variation.

本発明の部品実装システムは、装着ヘッドによって基板に複数の部品を装着する部品実装装置と、前記装着ヘッドによって装着された部品の装着位置を検査手段によって計測する検査装置と、前記検査装置による計測結果に基づいて装着位置の補正量を算出する補正量算出装置と、を有する部品実装システムであって、前記部品実装装置は、前記装着ヘッドによって前記複数の部品のうちの一部の部品が前記基板に装着されたら、前記基板を前記検査装置に搬送する搬送手段を備え、前記検査装置は、前記検査手段によって前記搬送された前記基板に装着された前記一部の部品の装着位置が計測されたら、前記基板を前記部品実装装置に逆搬送する逆搬送手段を備え、前記部品実装装置は、前記補正量算出装置によって算出された補正量に基づいて、前記複数の部品のうちの未装着の未装着部品の装着位置を補正する装着位置補正手段を備え、前記装着ヘッドは、前記補正された装着位置に前記未装着部品を装着する。 The component mounting system of the present invention includes a component mounting device that mounts a plurality of components on a substrate by a mounting head, an inspection device that measures the mounting position of the component mounted by the mounting head by an inspection unit, and a measurement by the inspection device. A component mounting system including a correction amount calculation device that calculates a correction amount of a mounting position based on a result, wherein the component mounting device is configured such that a part of the plurality of components by the mounting head is When mounted on the board, the board is provided with a carrying means for carrying the board to the inspecting apparatus, and the inspecting apparatus measures a mounting position of the part of the parts mounted on the board transported by the inspecting means. Then, the component mounting apparatus includes a reverse transport unit that transports the substrate to the component mounting apparatus in a reverse direction, and the component mounting apparatus, based on the correction amount calculated by the correction amount calculation device, determines whether the component is not mounted yet. The mounting head corrects the mounting position of the unmounted component, and the mounting head mounts the unmounted component at the corrected mounting position.

本発明の実装基板の製造方法は、装着ヘッドによって基板に複数の部品を装着する部品実装装置と、前記装着ヘッドによって装着された部品の装着位置を検査手段によって計測する検査装置と、を有する部品実装システムによって、前記基板に前記部品を装着する実装基板の製造方法であって、前記装着ヘッドによって、前記複数の部品のうちの一部の部品を前記基板に装着する第１の装着工程と、前記基板を前記部品実装装置から前記検査装置に搬送する搬送工程と、前記検査手段によって、前記基板に装着された前記一部の部品の装着位置を計測する検査工程と、前記基板を前記検査装置から前記部品実装装置に逆搬送する逆搬送工程と、前記検査工程における計測結果に基づいて、装着位置の補正量を算出する補正量算出工程と、前記算出された補正量に基づいて、前記複数の部品のうちの未装着の未装着部品の装着位置を補正する装着位置補正工程と、前記装着ヘッドによって、前記補正された装着位置に前記未装着部品を装着する第２の装着工程と、を含む。 A mounting board manufacturing method of the present invention includes a component mounting apparatus that mounts a plurality of components on a board by a mounting head, and an inspection apparatus that measures the mounting position of the component mounted by the mounting head by an inspection unit. A mounting board manufacturing method for mounting the component on the board by a mounting system, comprising: a first mounting step of mounting a part of the plurality of components on the board by the mounting head; A carrying step of carrying the board from the component mounting apparatus to the inspecting apparatus, an inspecting step of measuring a mounting position of the part of the parts mounted on the board by the inspecting unit, and the board inspecting apparatus. From the component mounting device to the component mounting device, a correction amount calculation process of calculating a correction amount of the mounting position based on the measurement result in the inspection process, and a plurality of the plurality of correction units based on the calculated correction amount. A mounting position correction step of correcting a mounting position of an unmounted component that has not been mounted, and a second mounting step of mounting the unmounted component at the corrected mounting position by the mounting head. Including.

本発明によれば、装置変動の影響による部品の装着位置ずれを精度良く補正することができる。 According to the present invention, it is possible to accurately correct a mounting position deviation of a component due to the influence of device fluctuation.

本発明の一実施の形態の部品実装システムの構成説明図Structure explanatory drawing of the component mounting system of one embodiment of this invention 本発明の一実施の形態の部品実装装置の構成を示す平面図The top view which shows the structure of the component mounting apparatus of one embodiment of this invention. 本発明の一実施の形態の部品実装装置において部品が装着される多面取り基板の一例の（ａ）部品装着前の状態を示す図（ｂ）部品装着後の状態を示す図(A) A diagram showing a state before component mounting of an example of a multi-chambered substrate on which a component is mounted in a component mounting apparatus according to an embodiment of the present invention (b) A diagram showing a state after component mounting 本発明の一実施の形態の部品実装システムの制御系の構成を示すブロック図Block diagram showing the configuration of the control system of the component mounting system of one embodiment of the present invention （ａ）（ｂ）（ｃ）本発明の一実施の形態の部品実装システムにおける装着検査方法の工程説明図(A) (b) (c) Process explanatory drawing of the mounting inspection method in the component mounting system of one embodiment of this invention. 本発明の一実施の形態の実装基板の製造方法のフロー図Flowchart of a method of manufacturing a mounting board according to an embodiment of the present invention

以下に図面を用いて、本発明の一実施の形態を詳細に説明する。以下で述べる構成、形状等は説明のための例示であって、部品実装システム、部品実装装置、検査装置の仕様に応じ、適宜変更が可能である。以下では、全ての図面において対応する要素には同一符号を付し、重複する説明を省略する。図２、及び後述する一部では、水平面内で互いに直交する２軸方向として、基板搬送方向のＸ方向（図２における左右方向）、基板搬送方向に直交するＹ方向（図２における上下方向）が示される。 An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, and the like described below are examples for description, and can be changed as appropriate according to the specifications of the component mounting system, the component mounting apparatus, and the inspection apparatus. In the following, corresponding elements are designated by the same reference numerals in all the drawings, and redundant description will be omitted. In FIG. 2 and a part to be described later, as the biaxial directions orthogonal to each other in the horizontal plane, the X direction of the substrate transfer direction (left and right direction in FIG. 2) and the Y direction orthogonal to the substrate transfer direction (up and down direction in FIG. 2). Is shown.

まず図１を参照して、部品実装システム１の構成を説明する。部品実装システム１は、基板に部品を実装して実装基板を製造する機能を有するものであり、部品実装装置Ｍ１および検査装置Ｍ２を備えている。これらの装置は通信ネットワーク２を介して管理コンピュータ３に接続されている。なお、部品実装システム１が備える部品実装装置Ｍ１は１台に限定されることはなく、２台以上でも良い。 First, the configuration of the component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of mounting a component on a substrate to manufacture a mounted substrate, and includes a component mounting device M1 and an inspection device M2. These devices are connected to the management computer 3 via the communication network 2. The component mounting apparatus M1 included in the component mounting system 1 is not limited to one, and may be two or more.

部品実装装置Ｍ１は、装着ヘッドによって上流側から搬入された基板の装着位置に部品供給部から取り出した部品を装着する部品装着作業を行う。検査装置Ｍ２は、検査カメラによって部品実装装置Ｍ１から搬送された基板に装着された部品Ｄの装着状態を検査し、装着位置を計測する。管理コンピュータ３は、ライン管理機能と併せて、検査装置Ｍ２によって取得された計測結果に基づいて、装着位置精度を改善するために部品実装装置Ｍ１にフィードバックすべき補正量を算出する機能を有している。 The component mounting apparatus M1 performs a component mounting operation of mounting the component taken out from the component supply unit at the mounting position of the board carried in from the upstream side by the mounting head. The inspection device M2 inspects the mounting state of the component D mounted on the board conveyed from the component mounting device M1 by the inspection camera, and measures the mounting position. The management computer 3 has a function of calculating a correction amount to be fed back to the component mounting apparatus M1 in order to improve the mounting position accuracy, based on the measurement result acquired by the inspection apparatus M2, in addition to the line management function. ing.

次に図２を参照して、部品実装装置Ｍ１の構成を説明する。図２において、基台４の中央には、基板搬送機構５がＸ方向に設置されている。基板搬送機構５は、上流側から搬入された基板６をＸ方向へ搬送し、以下に説明する装着ヘッドによる装着作業位置に位置決めして保持する。また、基板搬送機構５は、部品装着作業が終了した基板６を下流側の検査装置Ｍ２に搬送する（図５（ａ）の矢印ａ）。また、基板搬送機構５は、検査装置Ｍ２から逆搬送された基板６を装着作業位置に搬送する（図５（ｃ）の矢印ｂ）。 Next, the configuration of the component mounting apparatus M1 will be described with reference to FIG. In FIG. 2, the substrate transfer mechanism 5 is installed in the X direction at the center of the base 4. The substrate transport mechanism 5 transports the substrate 6 loaded from the upstream side in the X direction, and positions and holds the substrate 6 at the mounting work position by the mounting head described below. Further, the board transfer mechanism 5 transfers the board 6 for which the component mounting work has been completed to the inspection device M2 on the downstream side (arrow a in FIG. 5A). Further, the board transfer mechanism 5 transfers the board 6 reversely transferred from the inspection device M2 to the mounting work position (arrow b in FIG. 5C).

基板搬送機構５の両側方には、部品供給部７がそれぞれ設置されている。部品供給部７には、複数のテープフィーダ８がＸ方向に並列に装着されている。テープフィーダ８は、部品を格納するポケットが形成されたキャリアテープを部品供給部７の外側から基板搬送機構５に向かう方向（テープ送り方向）にピッチ送りすることにより、装着ヘッドが部品をピックアップする部品取出し位置に部品を供給する。 The component supply units 7 are installed on both sides of the board transfer mechanism 5, respectively. A plurality of tape feeders 8 are mounted on the component supply unit 7 in parallel in the X direction. In the tape feeder 8, the mounting head picks up a component by pitch-feeding a carrier tape having a pocket for storing a component in a direction from the outside of the component supply unit 7 toward the substrate transport mechanism 5 (tape feeding direction). Supply parts to the parts picking position.

図２において、基台４の上面におけるＸ方向の両端部には、リニア駆動機構を備えたＹ軸テーブル９が配置されている。２基のＹ軸テーブル９の間には、同様にリニア機構を備えた２基のビーム１０がＹ方向に移動自在に結合されている。２基のビーム１０には、それぞれ装着ヘッド１１がＸ方向に移動自在に装着されている。装着ヘッド１１は、下端に装着された吸着ノズルによって部品を保持して昇降可能な複数の吸着ユニット（図示省略）を備えている。 In FIG. 2, Y-axis tables 9 having a linear drive mechanism are arranged at both ends in the X direction on the upper surface of the base 4. Between the two Y-axis tables 9, two beams 10 similarly having a linear mechanism are coupled so as to be movable in the Y direction. A mounting head 11 is mounted on each of the two beams 10 so as to be movable in the X direction. The mounting head 11 includes a plurality of suction units (not shown) capable of holding and lifting components by suction nozzles mounted on the lower end.

Ｙ軸テーブル９およびビーム１０は、装着ヘッド１１を水平方向（Ｘ方向、Ｙ方向）に移動させる装着ヘッド移動機構１２を構成する。装着ヘッド移動機構１２および装着ヘッド１１は、部品供給部７に装着されているテープフィーダ８の部品取出し位置から部品をピックアップし、基板搬送機構５に保持された基板６の装着位置に装着する部品装着作業を実行する。部品装着作業において装着ヘッド１１は、部品供給部７の上方に移動し、各吸着ノズルで所定の部品をそれぞれピックアップし、基板６の上方に移動し、各吸着ノズルが保持する部品をそれぞれの実装位置に実装する一連のターンを繰り返す。 The Y-axis table 9 and the beam 10 form a mounting head moving mechanism 12 that moves the mounting head 11 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism 12 and the mounting head 11 pick up a component from the component take-out position of the tape feeder 8 mounted on the component supply unit 7, and mount the component on the mounting position of the substrate 6 held by the substrate transport mechanism 5. Perform mounting work. In the component mounting operation, the mounting head 11 moves above the component supply unit 7, picks up a predetermined component by each suction nozzle, moves above the substrate 6, and mounts each component held by each suction nozzle. Repeat a series of turns to mount in position.

図２において、ビーム１０には、ビーム１０の下面側に位置して装着ヘッド１１とともに一体的に移動するヘッドカメラ１３が装着されている。装着ヘッド１１が移動することにより、ヘッドカメラ１３は基板搬送機構５の装着作業位置に位置決めされた基板６の上方に移動して、基板６に設けられた基板マーク（図示せず）を撮像して基板６の位置を認識する。 In FIG. 2, a head camera 13 that is located on the lower surface side of the beam 10 and moves integrally with the mounting head 11 is mounted on the beam 10. As the mounting head 11 moves, the head camera 13 moves above the substrate 6 positioned at the mounting work position of the substrate transport mechanism 5 and images a substrate mark (not shown) provided on the substrate 6. The position of the substrate 6 is recognized.

部品供給部７と基板搬送機構５との間には、部品認識カメラ１４が設置されている。部品認識カメラ１４は、部品供給部７から部品を取り出した装着ヘッド１１が部品認識カメラ１４の上方に位置した際に、吸着ノズルに保持された部品を下方から撮像する。装着ヘッド１１による部品の基板６への部品装着作業では、ヘッドカメラ１３による基板６の認識結果と部品認識カメラ１４による部品の認識結果と後述する補正量とを加味して装着位置の補正が行われる。このように、部品実装装置Ｍ１は、装着ヘッド１１によって基板６に複数の部品を装着する。 A component recognition camera 14 is installed between the component supply unit 7 and the board transport mechanism 5. The component recognition camera 14 images the component held by the suction nozzle from below when the mounting head 11 that has taken out the component from the component supply unit 7 is positioned above the component recognition camera 14. In the work of mounting the component on the substrate 6 by the mounting head 11, the mounting position is corrected in consideration of the recognition result of the substrate 6 by the head camera 13, the recognition result of the component by the component recognition camera 14, and the correction amount described later. Be seen. In this way, the component mounting apparatus M1 mounts a plurality of components on the board 6 by the mounting head 11.

次に図４、図５を参照して、検査装置Ｍ２の構成を説明する。図５（ａ）において、検査装置Ｍ２の基台３０ａの中央には、基板搬送機構３１がＸ方向に設置されている。基板搬送機構３１は、上流側の部品実装装置Ｍ１から搬送された基板６をＸ方向へ搬送し（矢印ａ）、検査カメラ３２による検査作業位置に位置決めして保持する（図５（ｂ））。また、基板搬送機構３１は、装着検査作業が完了した基板６を下流側に搬出する。図５（ｃ）において、基板搬送機構３１は、装着検査作業が完了した基板６を上流側の部品実装装置Ｍ１に搬送（逆搬送）する（矢印ｂ）。 Next, the configuration of the inspection device M2 will be described with reference to FIGS. In FIG. 5A, a substrate transfer mechanism 31 is installed in the X direction at the center of the base 30a of the inspection device M2. The board transfer mechanism 31 transfers the board 6 transferred from the upstream component mounting apparatus M1 in the X direction (arrow a), and positions and holds the board 6 at the inspection work position by the inspection camera 32 (FIG. 5B). .. Further, the board transport mechanism 31 carries out the board 6 on which the mounting inspection work has been completed to the downstream side. In FIG. 5C, the board transfer mechanism 31 transfers (reverse transfer) the board 6 on which the mounting inspection work is completed to the upstream component mounting apparatus M1 (arrow b).

図４において、検査装置Ｍ２は、検査カメラ３２を水平方向（Ｘ方向、Ｙ方向）に移動させる検査カメラ移動機構３３を備えている。検査カメラ３２は、基板搬送機構３１に保持された基板６に装着された部品Ｄを撮像して装着状態を検査する（図５（ｂ）参照）。このように、検査装置Ｍ２は、装着ヘッド１１によって装着された部品の装着位置を検査カメラ３２（検査手段）によって計測する。 In FIG. 4, the inspection device M2 includes an inspection camera moving mechanism 33 that moves the inspection camera 32 in the horizontal direction (X direction, Y direction). The inspection camera 32 images the component D mounted on the substrate 6 held by the substrate transport mechanism 31 and inspects the mounting state (see FIG. 5B). In this way, the inspection device M2 measures the mounting position of the component mounted by the mounting head 11 by the inspection camera 32 (inspection means).

次に図３（ａ）、図３（ｂ）を参照し、部品実装装置Ｍ１によって部品が装着される基板６の例について説明する。図３（ａ）は部品Ｄが装着される前の基板６を、図３（ｂ）は部品Ｄが装着された後の基板６を示している。図３（ａ）において、基板６には、部品Ｄの端子と接合される電極６ｂを含む回路パターン（図示省略）が形成された複数の個別基板６ａ（ここでは１２個）が形成されている。図３（ｂ）に示すように、回路パターンには、電極６ｂと部品Ｄの端子が接合されるように部品Ｄが実装される。全ての部品Ｄが実装された基板６は部品実装装置Ｍ１から搬出されて、個別基板６ａに切り離される。このように、基板６は複数の個別基板６ａを含んで構成された多面取り基板である。 Next, with reference to FIG. 3A and FIG. 3B, an example of the board 6 on which the component is mounted by the component mounting apparatus M1 will be described. 3A shows the substrate 6 before the component D is mounted, and FIG. 3B shows the substrate 6 after the component D is mounted. In FIG. 3A, a plurality of individual substrates 6a (here, 12) on which a circuit pattern (not shown) including electrodes 6b joined to the terminals of the component D are formed are formed on the substrate 6. .. As shown in FIG. 3B, the component D is mounted on the circuit pattern such that the electrode 6b and the terminal of the component D are bonded to each other. The board 6 on which all the components D are mounted is carried out from the component mounting apparatus M1 and separated into the individual boards 6a. As described above, the substrate 6 is a multi-chambered substrate including a plurality of individual substrates 6a.

次に図４を参照して、部品実装システム１の制御系の構成について説明する。管理コンピュータ３、部品実装装置Ｍ１および検査装置Ｍ２は、通信ネットワーク２を介して接続されている。部品実装装置Ｍ１は、実装制御装置２０、基板搬送機構５、部品供給部７、装着ヘッド１１、装着ヘッド移動機構１２、ヘッドカメラ１３、部品認識カメラ１４を備えている。実装制御装置２０は、実装記憶部２１、実装搬送制御部２２、装着制御部２３、実装通信部２４を備えている。実装通信部２４は、通信ネットワーク２を介して検査装置Ｍ２、管理コンピュータ３との間でデータの送受信を行う。 Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. The management computer 3, the component mounting apparatus M1 and the inspection apparatus M2 are connected via the communication network 2. The component mounting apparatus M1 includes a mounting control device 20, a board transfer mechanism 5, a component supply unit 7, a mounting head 11, a mounting head moving mechanism 12, a head camera 13, and a component recognition camera 14. The mounting control device 20 includes a mounting storage unit 21, a mounting transfer control unit 22, a mounting control unit 23, and a mounting communication unit 24. The mounting communication unit 24 transmits/receives data to/from the inspection device M2 and the management computer 3 via the communication network 2.

実装記憶部２１は記憶装置であり、生産データ２１ａ、装着不良データ２１ｂ、補正量データ２１ｃなどが記憶されている。生産データ２１ａには、実装基板の生産機種名、基板６に装着される部品Ｄの部品名（種類）、部品Ｄのサイズ、装着位置（ＸＹ座標）、装着順序などの他、装着検査のタイミング情報などが含まれている。装着検査のタイミング情報には、基板１枚あたりの補正回数（装着検査の回数）、装着検査間の連続装着数などが含まれている。 The mounting storage unit 21 is a storage device, and stores production data 21a, defective mounting data 21b, correction amount data 21c, and the like. The production data 21a includes the production model name of the mounting board, the part name (type) of the part D mounted on the board 6, the size of the part D, the mounting position (XY coordinates), the mounting order, and the mounting inspection timing. Information etc. are included. The mounting inspection timing information includes the number of corrections per board (the number of mounting inspections), the number of continuous mountings between mounting inspections, and the like.

図４において、検査装置Ｍ２は、検査制御装置３０、基板搬送機構３１、検査カメラ３２、検査カメラ移動機構３３を備えている。検査制御装置３０は、検査記憶部３４、検査搬送制御部３５、検査制御部３６、検査通信部３７を備えている。検査通信部３７は、通信ネットワーク２を介して部品実装装置Ｍ１、管理コンピュータ３との間でデータの送受信を行う。 In FIG. 4, the inspection device M2 includes an inspection control device 30, a substrate transfer mechanism 31, an inspection camera 32, and an inspection camera moving mechanism 33. The inspection control device 30 includes an inspection storage unit 34, an inspection conveyance control unit 35, an inspection control unit 36, and an inspection communication unit 37. The inspection communication unit 37 transmits/receives data to/from the component mounting apparatus M1 and the management computer 3 via the communication network 2.

検査記憶部３４は記憶装置であり、検査データ３４ａ、検査基準データ３４ｂなどが記憶されている。検査データ３４ａは、実装基板の生産機種名、基板６に装着される部品Ｄの装着位置（ＸＹ座標）、部品Ｄのサイズなどの他、装着検査間に基板６に装着される部品Ｄを特定する情報などが含まれている。検査基準データ３４ｂには、基板６に装着された部品Ｄの装着状態の良否を判定するための基準であり、許容位置ずれ量、許容姿勢などの情報が含まれている。 The inspection storage unit 34 is a storage device, and stores inspection data 34a, inspection reference data 34b, and the like. The inspection data 34a identifies the production model name of the mounting board, the mounting position (XY coordinates) of the component D mounted on the substrate 6, the size of the component D, and the component D mounted on the substrate 6 during the mounting inspection. Information to be included is included. The inspection reference data 34b is a reference for determining whether the mounting state of the component D mounted on the board 6 is good or bad, and includes information such as an allowable positional deviation amount and an allowable posture.

図４において、管理コンピュータ３は、管理処理装置４０を備えている。管理処理装置４０は、管理記憶部４１、補正量算出部４２、入力部４３、表示部４４、管理通信部４５を備えている。管理記憶部４１は記憶装置であり、計測データ４１ａなどが記憶されている。入力部４３は、キーボード、タッチパネル、マウスなどの入力装置であり、操作コマンドやデータ入力時などに用いられる。表示部４４は液晶パネルなどの表示装置であり、管理記憶部４１が記憶する各種データを表示する他、入力部４３による操作のための操作画面、データ入力画面などを表示画面に表示する。管理通信部４５は、通信ネットワーク２を介して部品実装装置Ｍ１、検査装置Ｍ２との間でデータの送受信を行う。 In FIG. 4, the management computer 3 includes a management processing device 40. The management processing device 40 includes a management storage unit 41, a correction amount calculation unit 42, an input unit 43, a display unit 44, and a management communication unit 45. The management storage unit 41 is a storage device, and stores measurement data 41a and the like. The input unit 43 is an input device such as a keyboard, a touch panel, and a mouse, and is used when inputting operation commands and data. The display unit 44 is a display device such as a liquid crystal panel, and displays various data stored in the management storage unit 41, and also displays an operation screen for operation by the input unit 43, a data input screen, and the like on the display screen. The management communication unit 45 transmits/receives data to/from the component mounting apparatus M1 and the inspection apparatus M2 via the communication network 2.

図４において、実装搬送制御部２２は、基板搬送機構５を制御して、上流側から搬入された基板６を装着作業位置に位置決めして保持させる。また、実装搬送制御部２２は、生産データ２１ａに含まれる装着検査のタイミング情報に基づいて基板搬送機構５を制御して、所定数（次の装着検査までの連続装着数）の部品Ｄが装着された基板６を検査装置Ｍ２に搬送させる。このように、基板搬送機構５と実装搬送制御部２２は、装着ヘッド１１によって複数の部品Ｄのうちの一部（所定数）の部品Ｄが基板６に装着されたら、基板６を検査装置Ｍ２に搬送する搬送手段である。また、実装搬送制御部２２は、基板搬送機構５を制御して、検査装置Ｍ２から逆搬送された基板６を装着作業位置に位置決めして保持させる。 In FIG. 4, the mounting transfer control unit 22 controls the board transfer mechanism 5 to position and hold the board 6 carried in from the upstream side at the mounting work position. Further, the mounting/transportation control unit 22 controls the substrate transporting mechanism 5 based on the timing information of the mounting inspection included in the production data 21a, and mounts a predetermined number (number of consecutive mountings until the next mounting inspection) of the components D. The substrate 6 thus prepared is conveyed to the inspection device M2. As described above, when the mounting head 11 mounts a part (a predetermined number) of the components D on the substrate 6 by the mounting head 11, the substrate transport mechanism 5 and the mounting transport control unit 22 mount the substrate 6 on the inspection device M2. It is a conveying means for conveying to. Further, the mounting/transportation control unit 22 controls the substrate transport mechanism 5 to position and hold the substrate 6 reversely transported from the inspection device M2 at the mounting work position.

検査搬送制御部３５は、基板搬送機構３１を制御して、部品実装装置Ｍ１から搬送された基板６を検査作業位置に位置決めして保持させる。また、検査搬送制御部３５は、基板搬送機構３１を制御して、全ての部品Ｄが装着されて装着検査作業が完了した基板６を下流側に搬出させる。また、検査搬送制御部３５は、基板搬送機構３１を制御して、一部の部品Ｄが装着されて装着検査作業が完了した基板６（全ての部品Ｄが装着されていない基板６）を部品実装装置Ｍ１に逆搬送させる。このように、基板搬送機構３１と検査搬送制御部３５は、検査カメラ３２（検査手段）によって部品実装装置Ｍ１から搬送された基板６に装着された一部の部品Ｄの装着位置が計測されたら、基板６を部品実装装置Ｍ１に逆搬送する逆搬送手段である。 The inspection transfer control unit 35 controls the board transfer mechanism 31 to position and hold the board 6 transferred from the component mounting apparatus M1 at the inspection work position. Further, the inspection transfer control unit 35 controls the board transfer mechanism 31 to transfer the board 6 on which all the components D are mounted and the mounting inspection work is completed, to the downstream side. Further, the inspection transfer control unit 35 controls the board transfer mechanism 31 so that the board 6 on which a part of the parts D is mounted and the mounting inspection work is completed (the board 6 on which all the parts D are not mounted) is mounted. The mounting device M1 is reversely conveyed. In this way, the board transfer mechanism 31 and the inspection transfer control unit 35 measure the mounting positions of some components D mounted on the board 6 transferred from the component mounting apparatus M1 by the inspection camera 32 (inspection means). , A reverse carrying means for carrying the board 6 back to the component mounting apparatus M1.

図４において検査制御部３６は、検査データ３４ａに含まれる前の装着検査後に基板６に装着された部品Ｄの実装位置、検査基準データ３４ｂに基づいて検査カメラ３２、検査カメラ移動機構３３を制御して、基板６に装着された部品Ｄの装着位置（以下「検査装着位置」と称する。）を計測し、装着状態を検査する装着検査を実行する。すなわち、検査カメラ３２、検査カメラ移動機構３３、および検査制御部３６は、装着ヘッド１１によって基板６に装着された部品Ｄの装着位置を計測する検査手段である。 4, the inspection control unit 36 controls the inspection camera 32 and the inspection camera moving mechanism 33 based on the mounting position of the component D mounted on the substrate 6 after the mounting inspection before being included in the inspection data 34a and the inspection reference data 34b. Then, the mounting position of the component D mounted on the substrate 6 (hereinafter referred to as "inspection mounting position") is measured, and the mounting inspection for inspecting the mounting state is executed. That is, the inspection camera 32, the inspection camera moving mechanism 33, and the inspection control unit 36 are inspection means for measuring the mounting position of the component D mounted on the substrate 6 by the mounting head 11.

検査制御部３６は、予定の装着位置に対する検査装着位置（以下「装着位置ずれ量」と称する。）を算出して、管理コンピュータ３に送信する。管理コンピュータ３は、送信された装着位置ずれ量を計測データ４１ａとして管理記憶部４１に記憶させる。また、検査制御部３６は、装着状態が不良の部品Ｄを検出すると、その部品Ｄが装着された個別基板６ａを特定する情報、装着位置などを関連付けて、部品実装装置Ｍ１に送信する。部品実装装置Ｍ１は、送信された装着不良の部品Ｄの情報を装着不良データ２１ｂとして実装記憶部２１に記憶させる。 The inspection control unit 36 calculates the inspection mounting position with respect to the planned mounting position (hereinafter, referred to as “mounting position shift amount”) and transmits it to the management computer 3. The management computer 3 stores the transmitted mounting position displacement amount in the management storage unit 41 as the measurement data 41a. Further, when the inspection control unit 36 detects a component D having a poor mounting state, the inspection control unit 36 associates information for identifying the individual board 6a on which the component D is mounted, a mounting position, and the like, and transmits it to the component mounting apparatus M1. The component mounting apparatus M1 stores the transmitted information about the component D having the poor mounting in the mounting storage unit 21 as poor mounting data 21b.

図４において、補正量算出部４２は、計測データ４１ａに含まれる前の装着検査後に装着された部品Ｄの装着位置ずれ量を統計処理して、基板６に部品Ｄを装着する際の装着位置の補正量を算出する。統計処理としては、例えば、装着状態が不良であったり装着位置ずれ量が所定値よりも大きかったりする異常なデータを除いた装着位置ずれ量の平均などが使用される。 In FIG. 4, the correction amount calculation unit 42 statistically processes the mounting position deviation amount of the component D mounted after the previous mounting inspection, which is included in the measurement data 41a, and mounts the component D on the substrate 6 at the mounting position. The correction amount of is calculated. As the statistical processing, for example, an average of the mounting position displacement amount excluding abnormal data such as a poor mounting state or a mounting position displacement amount larger than a predetermined value is used.

すなわち、補正量算出部４２は、検査装置Ｍ２による計測結果（計測データ４１ａ）に基づいて装着位置の補正量を算出する補正量算出装置である。補正量算出部４２は、算出された補正量を部品実装装置Ｍ１に送信する。部品実装装置Ｍ１は、送信された補正量を補正量データ２１ｃとして実装記憶部２１に記憶させる。また、補正量データ２１ｃに古いデータが記憶されている場合は、新たに算出した補正量に更新される。 That is, the correction amount calculation unit 42 is a correction amount calculation device that calculates the correction amount of the mounting position based on the measurement result (measurement data 41a) by the inspection device M2. The correction amount calculation unit 42 transmits the calculated correction amount to the component mounting apparatus M1. The component mounting apparatus M1 stores the transmitted correction amount in the mounting storage unit 21 as the correction amount data 21c. If old data is stored in the correction amount data 21c, the correction amount is updated to the newly calculated correction amount.

図４において、装着制御部２３は、内部処理部として装着位置補正部２３ａを備えている。装着制御部２３は、生産データ２１ａに含まれる装着位置、装着順序に基づいて、部品供給部７、装着ヘッド１１、装着ヘッド移動機構１２を制御して、基板６に部品Ｄを装着する部品装着作業を実行させる。装着位置補正部２３ａは、部品装着作業の際に、ヘッドカメラ１３による基板６の位置の認識結果、部品認識カメラ１４による吸着ノズルに保持された部品Ｄの認識結果、補正量データ２１ｃに含まれる補正量に基づいて、基板６に部品Ｄを装着する際の装着位置を補正する。 In FIG. 4, the mounting control unit 23 includes a mounting position correction unit 23a as an internal processing unit. The mounting control unit 23 controls the component supply unit 7, the mounting head 11, and the mounting head moving mechanism 12 based on the mounting position and the mounting order included in the production data 21a to mount the component D on the substrate 6. Get the work done. The mounting position correction unit 23a includes the recognition result of the position of the substrate 6 by the head camera 13, the recognition result of the component D held by the suction nozzle by the component recognition camera 14, and the correction amount data 21c during the component mounting work. The mounting position when the component D is mounted on the board 6 is corrected based on the correction amount.

すなわち、装着位置補正部２３ａは、補正量算出装置（補正量算出部４２）によって算出された補正量（補正量データ２１ｃ）に基づいて、複数の部品Ｄのうちの未装着の未装着部品の装着位置を補正する装着位置補正手段である。そして、装着ヘッド１１は、補正された装着位置に未装着部品を装着する。また、装着制御部２３は、装着不良データ２１ｂに含まれる装着不良の個別基板６ａの情報に基づいて、装着不良が検出された個別基板６ａには部品Ｄを装着しない。すなわち、検査装置Ｍ２（検査手段）による計測結果（装着不良データ２１ｂ）に装着不良の部品Ｄがある場合、装着ヘッド１１は、装着不良の部品Ｄがある個別基板６ａには未装着部品を装着しない。 That is, the mounting position correction unit 23a determines, based on the correction amount (correction amount data 21c) calculated by the correction amount calculation device (correction amount calculation unit 42), the unmounted and unmounted components among the plurality of components D. It is a mounting position correcting means for correcting the mounting position. Then, the mounting head 11 mounts the unmounted component at the corrected mounting position. Further, the mounting control unit 23 does not mount the component D on the individual board 6a in which the mounting failure is detected based on the information of the mounting failure individual board 6a included in the mounting failure data 21b. That is, when the measurement result (mounting failure data 21b) by the inspection device M2 (mounting failure data 21b) includes the mounting failure component D, the mounting head 11 mounts the unmounted component on the individual substrate 6a including the mounting failure component D. do not do.

なお、図４に示す部品実装システム１では、補正量算出装置（補正算出部４２）は管理コンピュータ３が備えていたが、この形態に限定されることはない。例えば、補正量算出装置は部品実装装置Ｍ１に含まれていてもよい。その場合、検査装置Ｍ２で算出された装着位置ずれ量（計測データ４１ａ）は部品実装装置Ｍ１に送信されて部品実装装置Ｍ１に記憶される。また、補正量算出装置は検査装置Ｍ２に含まれていてもよい。その場合、装着位置ずれ量（計測データ４１ａ）は検査装置Ｍ２に記憶される。 In the component mounting system 1 shown in FIG. 4, the management computer 3 includes the correction amount calculation device (correction calculation unit 42), but the invention is not limited to this. For example, the correction amount calculation device may be included in the component mounting device M1. In that case, the mounting position displacement amount (measurement data 41a) calculated by the inspection device M2 is transmitted to the component mounting device M1 and stored in the component mounting device M1. The correction amount calculation device may be included in the inspection device M2. In that case, the mounting position displacement amount (measurement data 41a) is stored in the inspection device M2.

次に図６のフローに沿って図５を参照しながら、部品実装システム１によって基板６に部品Ｄを装着する実装基板の製造方法について説明する。ここでは、装着検査のタイミングとして補正回数（３回）、装着検査間の連続装着数（３８７６個、３８５２個、３８４０個）が生産データ２１ａに記憶されているとする。また、補正量の初期値が補正量データ２１ｃに記憶されているとする。 Next, a method of manufacturing a mounting board in which the component D is mounted on the board 6 by the component mounting system 1 will be described with reference to FIG. 5 along the flow of FIG. Here, it is assumed that the number of corrections (3 times) as the timing of the mounting inspection and the number of consecutive mountings between the mounting inspections (3876, 3852, 3840) are stored in the production data 21a. Further, it is assumed that the initial value of the correction amount is stored in the correction amount data 21c.

図６において、まず、部品実装装置Ｍ１において、実装搬送制御部２２は基板搬送機構５を制御して、上流側から搬入された基板６を装着作業位置に搬送させて保持させる（ＳＴ１：基板搬入工程）。次いで装着位置補正部２３ａは、ヘッドカメラ１３による基板６の位置の認識結果、部品認識カメラ１４による吸着ノズルに保持された部品Ｄの認識結果、補正量データ２１ｃに含まれる補正量に基づいて装着位置を補正する（ＳＴ２：装着位置補正工程）。次いで装着制御部２３は、装着ヘッド１１、装着ヘッド移動機構１２を制御して、基板６の補正された装着位置に部品Ｄを装着させる（ＳＴ３：部品装着工程）。 In FIG. 6, first, in the component mounting apparatus M1, the mounting/transportation control unit 22 controls the substrate transporting mechanism 5 to transport and hold the substrate 6 loaded from the upstream side to the mounting work position (ST1: substrate loading). Process). Next, the mounting position correction unit 23a mounts the substrate 6 based on the recognition result of the position of the substrate 6 by the head camera 13, the recognition result of the component D held by the suction nozzle by the component recognition camera 14, and the correction amount included in the correction amount data 21c. The position is corrected (ST2: mounting position correction step). Next, the mounting control unit 23 controls the mounting head 11 and the mounting head moving mechanism 12 to mount the component D at the corrected mounting position on the substrate 6 (ST3: component mounting step).

次いで装着制御部２３は、設定された連続装着数の部品Ｄ（所定数の部品Ｄ）を装着したか否かを判断する（ＳＴ４）。所定数の部品Ｄを装着していない場合は（ＳＴ４においてＮｏ）、装着位置補正工程（ＳＴ２）に戻って次の部品Ｄが装着される（ＳＴ３）。すなわち、所定数の部品Ｄが装着されるまで、装着ターン（ＳＴ２、ＳＴ３）が繰り返し実行される。所定数の部品Ｄ（ここでは、３８７６個）を装着した場合は（ＳＴ４においてＹｅｓ）、実装搬送制御部２２は基板搬送機構５を制御して基板６を部品実装装置Ｍ１から検査装置Ｍ２に搬送させ、検査搬送制御部３５は基板搬送機構３１を制御して基板６を検査作業位置に保持させる（ＳＴ５：搬送工程）（図５（ａ）の矢印ａ）。 Next, the mounting control unit 23 determines whether or not the set continuous mounting number of components D (a predetermined number of components D) has been mounted (ST4). If the predetermined number of components D have not been mounted (No in ST4), the process returns to the mounting position correction step (ST2) and the next component D is mounted (ST3). That is, the mounting turns (ST2, ST3) are repeatedly executed until the predetermined number of components D are mounted. When a predetermined number of parts D (here, 3876) are mounted (Yes in ST4), the mounting transfer control unit 22 controls the board transfer mechanism 5 to transfer the board 6 from the component mounting apparatus M1 to the inspection apparatus M2. Then, the inspection transfer control unit 35 controls the substrate transfer mechanism 31 to hold the substrate 6 at the inspection work position (ST5: transfer step) (arrow a in FIG. 5A).

図６において、次いで検査装置Ｍ２において、検査制御部３６は検査カメラ３２と検査カメラ移動機構３３（検査手段）を制御して、基板６に装着される複数の部品Ｄ（１１５６８個）のうちの一部の部品Ｄ（３８７６個）の装着位置を計測し、装着位置ずれ量を算出する（ＳＴ６：検査工程）（図５（ｂ））。すなわち、検査工程（ＳＴ６）では、検査手段によって、基板６に装着された一部の部品Ｄの装着位置を計測し、装着位置ずれ量が算出される。算出された装着位置ずれ量は管理コンピュータ３に送信され、計測データ４１ａとして管理記憶部４１に記憶される。 In FIG. 6, next, in the inspection device M2, the inspection control unit 36 controls the inspection camera 32 and the inspection camera moving mechanism 33 (inspection means) to select one of the plurality of parts D (11568 pieces) mounted on the board 6. The mounting positions of some of the components D (3876 pieces) are measured, and the mounting position displacement amount is calculated (ST6: inspection step) (FIG. 5B). That is, in the inspection step (ST6), the inspection unit measures the mounting positions of some of the components D mounted on the substrate 6 and calculates the mounting position displacement amount. The calculated mounting position deviation amount is transmitted to the management computer 3 and stored in the management storage unit 41 as measurement data 41a.

また、検査工程（ＳＴ６）において部品Ｄの装着状態も検査される。そして、装着不良が検出された場合は、装着不良の部品Ｄ、装着不良の個別基板６ａの情報が部品実装装置Ｍ１に送信されて、装着不良データ２１ｂとして実装記憶部２１に記憶される。このように、１回目の検査工程（ＳＴ６）までに実行された部品装着工程（ＳＴ３）は、装着ヘッド１１によって、複数の部品Ｄのうちの一部の部品Ｄ（３８７６個）を基板６に装着する第１の装着工程である。 Further, the mounting state of the component D is also inspected in the inspection step (ST6). When a mounting failure is detected, information on the mounting failure component D and the mounting failure individual substrate 6a is transmitted to the component mounting apparatus M1 and stored in the mounting storage unit 21 as mounting failure data 21b. In this way, in the component mounting step (ST3) executed up to the first inspection step (ST6), the mounting head 11 causes a part of the plurality of components D (3,876) to be placed on the substrate 6. This is the first mounting step of mounting.

図６において、次いで管理コンピュータ３において、補正量算出部４２は、検査工程（ＳＴ６）における計測結果（計測データ４１ａ）に基づいて、装着位置の補正量を算出する（ＳＴ７：補正量算出工程）。算出された補正量は部品実装装置Ｍ１に送信されて、補正量データ２１ｃとして実装記憶部２１に記憶される（または、算出された補正量に更新される）。次いで装着制御部２３は、全ての部品Ｄを基板６に装着したか否かを判断する（ＳＴ８）。 In FIG. 6, then, in the management computer 3, the correction amount calculation unit 42 calculates the correction amount of the mounting position based on the measurement result (measurement data 41a) in the inspection process (ST6) (ST7: correction amount calculation process). .. The calculated correction amount is transmitted to the component mounting apparatus M1 and stored in the mounting storage unit 21 as the correction amount data 21c (or updated to the calculated correction amount). Next, the mounting control unit 23 determines whether all the components D have been mounted on the board 6 (ST8).

未装着の部品Ｄがある場合（ＳＴ８においてＮｏ）、検査搬送制御部３５は基板搬送機構３１を制御して基板６を検査装置Ｍ２から部品実装装置Ｍ１に逆搬送させ、実装搬送制御部２２は基板搬送機構５を制御して基板６を装着作業位置に保持させる（ＳＴ９：逆搬送工程）（図５（ｃ）の矢印ｂ）。なお、逆搬送工程（ＳＴ９）は補正量算出工程（ＳＴ７）の前、または補正量算出工程（ＳＴ７）と同時に実行するようにしてもよい。これによって、実装基板の製造時間を短縮することができる。 When there is an unmounted component D (No in ST8), the inspection transfer control unit 35 controls the substrate transfer mechanism 31 to transfer the substrate 6 from the inspection device M2 to the component mounting device M1 in reverse, and the mounting transfer control unit 22 The board transfer mechanism 5 is controlled to hold the board 6 at the mounting work position (ST9: reverse transfer step) (arrow b in FIG. 5C). The reverse transport step (ST9) may be executed before the correction amount calculation step (ST7) or simultaneously with the correction amount calculation step (ST7). Thereby, the manufacturing time of the mounting board can be shortened.

図６において、基板６が装着作業位置に保持されると、次いで装着位置補正工程（ＳＴ２）に戻って未装着部品が装着される（ＳＴ３）。すなわち、装着位置補正工程（ＳＴ２）において、算出された補正量（補正量データ２１ｃ）に基づいて、複数の部品（１１５６８個）のうちの未装着の未装着部品（ここでは、３８５２個）の装着位置が補正され、部品装着工程（ＳＴ３）において基板６に装着される。これによって、装置変動の影響による部品Ｄの装着位置ずれを精度良く補正することができる。１回目の検査工程（ＳＴ６）の後、設定された未装着部品（３８５２個）が装着されると、基板６が検査装置Ｍ２に搬送されて（基板搬送工程（ＳＴ５））、２回目の検査工程（ＳＴ６）が実行される。 In FIG. 6, when the board 6 is held at the mounting work position, the process then returns to the mounting position correction step (ST2) to mount the unmounted component (ST3). That is, in the mounting position correction step (ST2), based on the calculated correction amount (correction amount data 21c), the number of unmounted unmounted components (here, 3852) among the plurality of components (11568) is determined. The mounting position is corrected and mounted on the substrate 6 in the component mounting step (ST3). As a result, it is possible to accurately correct the mounting position deviation of the component D due to the influence of the device fluctuation. When the set unmounted components (3852 pieces) are mounted after the first inspection process (ST6), the substrate 6 is transferred to the inspection device M2 (substrate transfer process (ST5)), and the second inspection is performed. The step (ST6) is executed.

すなわち、１回目の検査工程（ＳＴ６）後、２回目の検査工程（ＳＴ６）までに実行された部品装着工程（ＳＴ３）は、装着ヘッド１１によって、補正された装着位置に未装着部品（３８５２個）を装着する第２の装着工程である。なお、第２の装着工程では、１回目の検査工程（ＳＴ６）おける計測結果（装着不良データ２１ｂ）に装着不良の部品Ｄがある場合、装着ヘッド１１は装着不良の部品Ｄがある個別基板６ａには未装着部品を装着しない。これによって、装着不良の個別基板６ａに装着して無駄に廃棄される部品Ｄを削減することができ、また、装着時間を短縮することができる。 That is, after the first inspection process (ST6), the component mounting process (ST3) executed up to the second inspection process (ST6) is performed by the mounting head 11 at the corrected mounting position with the unmounted components (3852 pieces). ) Is the second mounting step. In the second mounting step, when the measurement result (mounting failure data 21b) in the first inspection step (ST6) includes the mounting failure component D, the mounting head 11 includes the individual mounting board 6a including the mounting failure component D. Do not install unmounted parts. As a result, it is possible to reduce the number of parts D that are mounted on the improperly mounted individual substrate 6a and are wastefully discarded, and it is possible to shorten the mounting time.

図６において、２回目の検査工程（ＳＴ６）が終了すると、２回目の補正値算出工程（ＳＴ７）が実行され、補正量（補正量データ２１ｃ）が更新される。さらに未装着の部品Ｄがある場合（ＳＴ８においてＮｏ）、基板６は部品実装装置Ｍ１に逆搬送される（逆搬送工程（ＳＴ９））。次いで装着位置補正工程（ＳＴ２）に戻って残りの全ての未装着部品（ここでは、３８４０個）が装着される（３回目の部品装着工程（ＳＴ３））。次いで３回目の検査工程（ＳＴ６）、３回目の補正値算出工程（ＳＴ７）が実行される。この例では、設定された補正回数（検査工程の回数）は３回であり、基板６に全ての部品Ｄが装着されたので（ＳＴ８においてＹｅｓ）、検査搬送制御部３５は基板搬送機構３１を制御して基板６を検査装置Ｍ２の下流側に搬出させる（ＳＴ１０：基板搬出工程）。 In FIG. 6, when the second inspection process (ST6) is completed, the second correction value calculation process (ST7) is executed, and the correction amount (correction amount data 21c) is updated. Further, if there is an unmounted component D (No in ST8), the substrate 6 is conveyed backward to the component mounting apparatus M1 (reverse conveying step (ST9)). Then, the process returns to the mounting position correction step (ST2), and all the remaining unmounted components (here, 3840 pieces) are mounted (third component mounting step (ST3)). Next, the third inspection process (ST6) and the third correction value calculation process (ST7) are performed. In this example, the set number of corrections (the number of inspection steps) is three, and since all the components D have been mounted on the board 6 (Yes in ST8), the inspection transfer control unit 35 causes the board transfer mechanism 31 to operate. It controls and carries out the board|substrate 6 to the downstream of the inspection apparatus M2 (ST10: board|substrate carrying-out process).

次いで予定の実装基板の生産が終了していない場合は（ＳＴ１１においてＮｏ）、基板搬入工程（ＳＴ１）に戻って次の基板６に対する部品装着作業が実行される。次の基板６における１回目の装着位置補正工程（ＳＴ２）では、前の基板６における３回目の補正値算出工程（ＳＴ７）で算出された補正量（補正量データ２１ｃ）が使用される。予定数の実装基板が生産されると（ＳＴ１１においてＹｅｓ）、実装基板の製造が終了する。 Next, when the production of the planned mounting board is not completed (No in ST11), the process returns to the board loading step (ST1), and the component mounting operation for the next board 6 is executed. In the first mounting position correction step (ST2) on the next board 6, the correction amount (correction amount data 21c) calculated in the third correction value calculation step (ST7) on the previous board 6 is used. When the planned number of mounting boards are produced (Yes in ST11), the manufacturing of the mounting boards is completed.

上記説明したように、本実施の形態の部品実装システム１は、部品実装装置Ｍ１と、検査装置Ｍ２と、検査装置Ｍ２による計測結果（計測データ４１ａ）に基づいて装着位置の補正量を算出する補正量算出装置（補正量算出部４２）と、を有する。部品実装装置Ｍ１は、装着ヘッド１１によって複数の部品Ｄのうちの一部の部品Ｄが基板６に装着されたら、基板６を検査装置Ｍ２に搬送する搬送手段（基板搬送機構５、実装搬送制御部２２）を備えている。 As described above, the component mounting system 1 of the present embodiment calculates the correction amount of the mounting position based on the measurement result (measurement data 41a) by the component mounting apparatus M1, the inspection apparatus M2, and the inspection apparatus M2. And a correction amount calculation device (correction amount calculation unit 42). When the mounting head 11 mounts a part of the plurality of components D on the substrate 6, the component mounting apparatus M1 transports the substrate 6 to the inspection device M2 (substrate transport mechanism 5, mounting transport control). Part 22).

検査装置Ｍ２は、検査手段（検査カメラ３２、検査カメラ移動機構３３、検査制御部３６）によって搬送された基板６に装着された一部の部品Ｄの装着位置が計測されたら、基板６を部品実装装置Ｍ１に逆搬送する逆搬送手段（基板搬送機構３１、検査搬送制御部３５）を備えている。そして、部品実装装置Ｍ１は、補正量算出装置によって算出された補正量（補正量データ２１ｃ）に基づいて、複数の部品Ｄのうちの未装着の未装着部品の装着位置を補正する装着位置補正手段（装着位置補正部２３ａ）を備えており、装着ヘッド１１は、補正された装着位置に未装着部品を装着する。これによって、装置変動の影響による部品Ｄの装着位置ずれを精度良く補正することができる。 When the mounting position of a part of the component D mounted on the board 6 conveyed by the inspection means (the inspection camera 32, the inspection camera moving mechanism 33, the inspection control unit 36) is measured, the inspection device M2 separates the board 6 into parts. The mounting device M1 is provided with a reverse transport unit (a substrate transport mechanism 31, an inspection transport control unit 35) that transports the carrier backward. Then, the component mounting apparatus M1 corrects the mounting position of the unmounted unmounted component of the plurality of components D based on the correction amount (correction amount data 21c) calculated by the correction amount calculation device. The mounting head 11 includes means (mounting position correction unit 23a), and mounts the unmounted component at the corrected mounting position. As a result, it is possible to accurately correct the mounting position deviation of the component D due to the influence of the device fluctuation.

本発明の部品実装システムおよび実装基板の製造方法は、装置変動の影響による部品の装着位置ずれを精度良く補正することができるという効果を有し、部品を基板に実装する分野において有用である。 INDUSTRIAL APPLICABILITY The component mounting system and the mounting board manufacturing method of the present invention have the effect of being able to accurately correct the mounting position deviation of a component due to the influence of device variations, and are useful in the field of mounting a component on a board.

１ 部品実装システム
５ 基板搬送機構（搬送手段）
６ 基板
６ａ 個別基板
１１ 装着ヘッド
３１ 基板搬送機構（逆搬送手段）
３２ 検査カメラ（検査手段）
Ｄ 部品
Ｍ１ 部品実装装置
Ｍ２ 検査装置 1 Component mounting system 5 Board transfer mechanism (transfer means)
6 board 6a individual board 11 mounting head 31 board transfer mechanism (reverse transfer means)
32 Inspection camera (inspection means)
D component M1 component mounting device M2 inspection device

Claims (6)

装着ヘッドによって基板に複数の部品を装着する部品実装装置と、前記装着ヘッドによって装着された部品の装着位置を検査手段によって計測する検査装置と、前記検査装置による計測結果に基づいて装着位置の補正量を算出する補正量算出装置と、を有する部品実装システムであって、
前記部品実装装置は、
前記装着ヘッドによって前記複数の部品のうちの一部の部品が前記基板に装着されたら、前記基板を前記検査装置に搬送する搬送手段を備え、
前記検査装置は、
前記検査手段によって前記搬送された前記基板に装着された前記一部の部品の装着位置が計測されたら、前記基板を前記部品実装装置に逆搬送する逆搬送手段を備え、
前記部品実装装置は、
前記補正量算出装置によって算出された補正量に基づいて、前記複数の部品のうちの未装着の未装着部品の装着位置を補正する装着位置補正手段を備え、
前記装着ヘッドは、前記補正された装着位置に前記未装着部品を装着する、部品実装システム。 A component mounting device that mounts a plurality of components on a substrate by a mounting head, an inspection device that measures the mounting position of the component mounted by the mounting head by an inspection means, and a correction of the mounting position based on the measurement result by the inspection device. A component mounting system having a correction amount calculation device for calculating the amount,
The component mounting device,
When a part of the plurality of parts is mounted on the board by the mounting head, a transfer means is provided for transferring the board to the inspection device,
The inspection device,
When the mounting position of the part of the component mounted on the substrate that has been transported by the inspection unit is measured, a reverse transport unit that transports the substrate to the component mounting apparatus in reverse is provided,
The component mounting device,
Based on the correction amount calculated by the correction amount calculation device, a mounting position correction means for correcting the mounting position of the unmounted component of the plurality of components,
The mounting head mounts the unmounted component at the corrected mounting position. 前記補正量算出装置は前記部品実装装置に含まれる、請求項１に記載の部品実装システム。 The component mounting system according to claim 1, wherein the correction amount calculation device is included in the component mounting device. 前記補正量算出装置は前記検査装置に含まれる、請求項１に記載の部品実装システム。 The component mounting system according to claim 1, wherein the correction amount calculation device is included in the inspection device. 前記基板は複数の個別基板を含んで構成され、
前記検査手段による計測結果に装着不良の部品がある場合、前記装着ヘッドは、前記装着不良の部品がある前記個別基板には前記未装着部品を装着しない、請求項１に記載の部品実装システム。 The substrate is configured to include a plurality of individual substrates,
The component mounting system according to claim 1, wherein when the measurement result of the inspection unit includes a component having a poor mounting, the mounting head does not mount the unmounted component on the individual board having the defective component. 装着ヘッドによって基板に複数の部品を装着する部品実装装置と、前記装着ヘッドによって装着された部品の装着位置を検査手段によって計測する検査装置と、を有する部品実装システムによって、前記基板に前記部品を装着する実装基板の製造方法であって、
前記装着ヘッドによって、前記複数の部品のうちの一部の部品を前記基板に装着する第１の装着工程と、
前記基板を前記部品実装装置から前記検査装置に搬送する搬送工程と、
前記検査手段によって、前記基板に装着された前記一部の部品の装着位置を計測する検査工程と、
前記基板を前記検査装置から前記部品実装装置に逆搬送する逆搬送工程と、
前記検査工程における計測結果に基づいて、装着位置の補正量を算出する補正量算出工程と、
前記算出された補正量に基づいて、前記複数の部品のうちの未装着の未装着部品の装着位置を補正する装着位置補正工程と、
前記装着ヘッドによって、前記補正された装着位置に前記未装着部品を装着する第２の装着工程と、を含む、実装基板の製造方法。 A component mounting system that mounts a plurality of components on the substrate by the mounting head, and an inspection device that measures the mounting position of the component mounted by the mounting head by the inspection means, and the components are mounted on the substrate by the component mounting system. A method of manufacturing a mounting board to be mounted, comprising:
A first mounting step of mounting a part of the plurality of components on the substrate by the mounting head;
A carrying step of carrying the board from the component mounting apparatus to the inspection apparatus,
An inspection step of measuring the mounting position of the part of the components mounted on the board by the inspection means;
A reverse transport step of transporting the substrate from the inspection device to the component mounting device in a reverse direction,
A correction amount calculation step of calculating a correction amount of the mounting position based on the measurement result in the inspection step,
A mounting position correction step of correcting the mounting position of an unmounted component not yet mounted among the plurality of components based on the calculated correction amount;
A second mounting step of mounting the unmounted component at the corrected mounting position by the mounting head. 前記基板は複数の個別基板を含んで構成され、
前記検査工程おける計測結果に装着不良の部品がある場合、前記第２の装着工程において、前記装着ヘッドは前記装着不良の部品がある前記個別基板には前記未装着部品を装着しない、請求項５に記載の実装基板の製造方法。 The substrate is configured to include a plurality of individual substrates,
6. When the measurement result in the inspection step includes a defective mounting component, the mounting head does not mount the unmounted component on the individual substrate including the defective mounting component in the second mounting step. A method for manufacturing a mounting board as described in.
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JP2000286599A (en) * 1999-03-30 2000-10-13 Matsushita Electric Ind Co Ltd Method and device for mounting component
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* Cited by examiner, † Cited by third party
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