JP2020059048A - レーザー加工装置及びレーザー加工方法 - Google Patents
レーザー加工装置及びレーザー加工方法 Download PDFInfo
- Publication number
- JP2020059048A JP2020059048A JP2018192092A JP2018192092A JP2020059048A JP 2020059048 A JP2020059048 A JP 2020059048A JP 2018192092 A JP2018192092 A JP 2018192092A JP 2018192092 A JP2018192092 A JP 2018192092A JP 2020059048 A JP2020059048 A JP 2020059048A
- Authority
- JP
- Japan
- Prior art keywords
- polarized light
- laser
- light
- polarized
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 title claims abstract description 40
- 238000003672 processing method Methods 0.000 title claims abstract description 19
- 230000010287 polarization Effects 0.000 claims abstract description 70
- 230000004907 flux Effects 0.000 claims abstract description 62
- 230000003287 optical effect Effects 0.000 claims description 58
- 238000012937 correction Methods 0.000 claims description 40
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000002194 synthesizing effect Effects 0.000 claims description 3
- 230000004075 alteration Effects 0.000 description 26
- 238000010586 diagram Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
- B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with infrared radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136277—Active matrix addressed cells formed on a semiconductor substrate, e.g. of silicon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/02—Function characteristic reflective
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/12—Function characteristic spatial light modulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
Description
本実施形態では、図2及び図3に示すように、空間光変調器28の手前に光束分離合成手段42が配置されている。光束分離合成手段42は、レーザー光源22から出力されたレーザー光Lを互いの偏光方向が直交する2つの偏光光束に偏光分離して空間光変調器28に向けて出射するとともに、空間光変調器28で変調された2つの偏光光束を合成して同一方向に向けて出射するものである。また、光束分離合成手段42は、空間光変調器28に照射される2つの偏光光束の光路を平行且つそれらの偏光方向を揃えた状態で、2つの偏光光束を空間光変調器28に導くものである。
Claims (6)
- 被加工物の内部に集光点を合わせてレーザー光を照射することにより、前記被加工物の切断予定ラインに沿って前記被加工物の内部に改質領域を形成するレーザー加工装置であって、
前記レーザー光を出力するレーザー光源と、
前記レーザー光を変調する空間光変調器と、
前記レーザー光を前記被加工物の内部に集光する集光レンズと、
前記被加工物に対して前記レーザー光を前記切断予定ラインに沿って相対移動させる相対移動手段と、
前記レーザー光源から出力された前記レーザー光を互いの偏光方向が直交する2つの偏光光束に偏光分離し、前記2つの偏光光束の偏光方向を揃えて前記空間光変調器の異なる領域に向けて出射し、且つ前記空間光変調器で変調された前記2つの偏光光束を合成して前記集光レンズに向けて出射する光束分離合成手段と、
前記被加工物の内部において前記被加工物の厚さ方向に互いに異なり、且つ前記レーザー光の相対移動方向に互いに等しい少なくとも2つの位置に前記レーザー光が前記集光レンズにより集光されて前記改質領域が形成されるように、前記空間光変調器に呈示させるホログラムパターンを前記2つの偏光光束が前記空間光変調器に照射される領域毎に制御する制御部と、
を備えるレーザー加工装置。 - 前記光束分離合成手段は、
前記レーザー光源から出力された前記レーザー光を互いの偏光方向が直交する2つの偏光光束に偏光分離する偏光ビームスプリッターと、
前記偏光ビームスプリッターで偏光分離された前記2つの偏光光束のうちいずれか一方の偏光光束の光路が他方の偏光光束の光路と平行となるように、前記一方の偏光光束を反射する全反射プリズム又はミラーと、
前記全反射プリズム又はミラーと前記空間光変調器との間に配置され、前記全反射プリズム又はミラーで反射した前記一方の偏光光束の偏光方向を前記他方の偏光光束の偏光光束の偏光方向に変換して出射するλ/2波長板と、
を備える、請求項1に記載のレーザー加工装置。 - 前記光束分離合成手段は、前記2つの偏光光束の間に発生する幾何光学的な光路長差を少なくする光路長補正光学系を備える、
請求項1又は2に記載のレーザー加工装置。 - 被加工物の内部に集光点を合わせてレーザー光を照射することにより、前記被加工物の切断予定ラインに沿って前記被加工物の内部に改質領域を形成するレーザー加工方法であって、
レーザー光源から出力された前記レーザー光を変調する変調工程と、
空間光変調器で変調された前記レーザー光を集光レンズにより前記被加工物の内部に集光する集光工程と、
前記被加工物に対して前記レーザー光を前記切断予定ラインに沿って相対移動させる相対移動工程と、
前記被加工物の内部において前記被加工物の厚さ方向に互いに異なり、且つ前記レーザー光の相対移動方向に互いに等しい少なくとも2つの位置に前記レーザー光が前記集光レンズにより集光されて前記改質領域が形成されるように制御する制御工程と、
前記レーザー光源から出力された前記レーザー光を互いの偏光方向が直交する2つの偏光光束に偏光分離し、前記2つの偏光光束の偏光方向を揃えて空間光変調器の異なる領域に向けて出射し、且つ前記空間光変調器で変調された前記2つの偏光光束を合成して前記集光レンズに向けて出射する光束分離合成工程と、
を備え、
前記制御工程は、前記空間光変調器に呈示させるホログラムパターンを前記2つの偏光光束が前記空間光変調器に照射される領域毎に制御する、
レーザー加工方法。 - 前記光束分離合成工程は、
前記レーザー光源から出力された前記レーザー光を互いの偏光方向が直交する2つの偏光光束に偏光分離する偏光分離工程と、
前記偏光分離工程で偏光分離された前記2つの偏光光束のうちいずれか一方の偏光光束の光路が他方の偏光光束の光路と平行となるように、前記一方の偏光光束を反射する反射工程と、
前記反射工程で反射した前記一方の偏光光束の偏光方向を前記他方の偏光光束の偏光光束の偏光方向に変換する変換工程と、
前記変換工程で偏光方向が変換された前記一方の偏光光束と、前記他方の偏光光束とを前記空間光変調器に向けて出射する出射工程と、
を備える、請求項4に記載のレーザー加工方法。 - 前記光束分離合成工程は、前記2つの偏光光束の間に発生する幾何光学的な光路長差を少なくする光路長補正工程を備える、
請求項4又は5に記載のレーザー加工方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018192092A JP6587115B1 (ja) | 2018-10-10 | 2018-10-10 | レーザー加工装置及びレーザー加工方法 |
US16/596,384 US11065722B2 (en) | 2018-10-10 | 2019-10-08 | Laser processing apparatus and laser processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018192092A JP6587115B1 (ja) | 2018-10-10 | 2018-10-10 | レーザー加工装置及びレーザー加工方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019167034A Division JP6710891B2 (ja) | 2019-09-13 | 2019-09-13 | 光変調装置及び光変調方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6587115B1 JP6587115B1 (ja) | 2019-10-09 |
JP2020059048A true JP2020059048A (ja) | 2020-04-16 |
Family
ID=68159636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018192092A Active JP6587115B1 (ja) | 2018-10-10 | 2018-10-10 | レーザー加工装置及びレーザー加工方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US11065722B2 (ja) |
JP (1) | JP6587115B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112824003B (zh) * | 2019-11-21 | 2023-11-03 | 深圳市大族半导体装备科技有限公司 | 激光切割方法、装置、计算机设备及存储介质 |
US20210283719A1 (en) * | 2020-03-12 | 2021-09-16 | Rohr, Inc. | Substrate perforation system & method using beamlets |
KR102603032B1 (ko) * | 2020-06-05 | 2023-11-16 | 한국전자통신연구원 | 축 분할 기반의 홀로그램 생성 방법 및 장치 |
KR20220039966A (ko) * | 2020-09-22 | 2022-03-30 | 삼성디스플레이 주식회사 | 빔 교정부를 포함하는 레이저 장치 및 이를 이용한 레이저 조사 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012016722A (ja) * | 2010-07-08 | 2012-01-26 | Disco Corp | レーザー加工装置およびレーザー加工方法 |
WO2014156690A1 (ja) * | 2013-03-27 | 2014-10-02 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5330892B2 (ja) | 2009-04-30 | 2013-10-30 | 浜松ホトニクス株式会社 | レーザ加工装置 |
JP5775265B2 (ja) | 2009-08-03 | 2015-09-09 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体装置の製造方法 |
JP2013221953A (ja) | 2012-04-12 | 2013-10-28 | Olympus Corp | 照明装置、及び、それを備えた顕微鏡装置 |
US9914183B2 (en) * | 2013-03-27 | 2018-03-13 | Hamamatsu Photonics K.K. | Laser machining device and laser machining method |
JP6466106B2 (ja) * | 2014-09-02 | 2019-02-06 | 浜松ホトニクス株式会社 | 光変調装置および光学システム |
-
2018
- 2018-10-10 JP JP2018192092A patent/JP6587115B1/ja active Active
-
2019
- 2019-10-08 US US16/596,384 patent/US11065722B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012016722A (ja) * | 2010-07-08 | 2012-01-26 | Disco Corp | レーザー加工装置およびレーザー加工方法 |
WO2014156690A1 (ja) * | 2013-03-27 | 2014-10-02 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6587115B1 (ja) | 2019-10-09 |
US20200114473A1 (en) | 2020-04-16 |
US11065722B2 (en) | 2021-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6531345B2 (ja) | レーザー加工装置及びレーザー加工方法 | |
US11612956B2 (en) | Laser light radiation device and laser light radiation method | |
JP6587115B1 (ja) | レーザー加工装置及びレーザー加工方法 | |
JP7105639B2 (ja) | レーザ加工装置 | |
JP6786374B2 (ja) | レーザ加工装置及びレーザ加工方法 | |
JP6719074B2 (ja) | レーザー加工領域の確認装置及び確認方法 | |
JP4640029B2 (ja) | 波長変換光学系、レーザ光源、露光装置、被検物検査装置、及び高分子結晶の加工装置 | |
US11471976B2 (en) | Laser light radiation device and laser light radiation method | |
JP7034621B2 (ja) | レーザ加工装置 | |
JP6620976B2 (ja) | レーザー加工装置及びレーザー加工方法 | |
JP6689646B2 (ja) | レーザ加工装置 | |
JP6867762B2 (ja) | 発散角調整装置及び発散角調整方法 | |
JP6632203B2 (ja) | レーザー加工装置及びレーザー加工方法 | |
JP6628081B2 (ja) | レーザー加工装置及びレーザー加工方法 | |
JP6783509B2 (ja) | レーザー加工装置及びレーザー加工方法 | |
JP2019096908A (ja) | レーザー加工装置 | |
JP2019176079A (ja) | ウェーハ加工方法及びウェーハ加工装置 | |
KR101497763B1 (ko) | 레이저 가공 장치 | |
JP2007029959A (ja) | レーザ加工機 | |
JP7222906B2 (ja) | レーザ加工方法、及び、レーザ加工装置 | |
JP6710891B2 (ja) | 光変調装置及び光変調方法 | |
KR102343564B1 (ko) | 레이저 가공 장치 및 동작 확인 방법 | |
WO2022254844A1 (ja) | レーザ加工装置 | |
JP2020126244A (ja) | 光変調装置及び光変調方法 | |
JP6988057B2 (ja) | レーザー加工装置及びレーザー加工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190807 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20190807 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20190808 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190815 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190828 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6587115 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |