JP2020027932A - Electronic component - Google Patents

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Publication number
JP2020027932A
JP2020027932A JP2018215932A JP2018215932A JP2020027932A JP 2020027932 A JP2020027932 A JP 2020027932A JP 2018215932 A JP2018215932 A JP 2018215932A JP 2018215932 A JP2018215932 A JP 2018215932A JP 2020027932 A JP2020027932 A JP 2020027932A
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horizontal
electronic component
head
vertical
capacitor array
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JP6721152B2 (en
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ジュン チョ、ボム
Beom Joon Cho
ジュン チョ、ボム
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/04—Mountings specially adapted for mounting on a chassis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
    • H01G4/1245—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates containing also titanates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

To provide a stacked type electronic component capable of implementing high capacitance and having excellent durability and reliability against vibrations and deformation.SOLUTION: An electronic component includes: a capacitor array including a plurality of multilayer capacitors consecutively disposed in a horizontal direction; and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes 131, 132 of the plurality of multilayer capacitors, respectively. The first and second metal frames respectively include first and second horizontal bonding portions 141, 151 bonded to upper portions of first and second band portions of the plurality of first and second external electrodes, first horizontal mounting portion 143 and second horizontal mounting portion disposed to face the first and second horizontal bonding portions in a vertical direction, and first vertical portion 142 and second vertical portion connecting the first and second horizontal bonding portions and the first and second horizontal mounting portions and having at least one first and second cutout portions in a horizontal direction, respectively.SELECTED DRAWING: Figure 4

Description

本発明は、電子部品に関する。   The present invention relates to an electronic component.

積層型キャパシタは、小型でありながら高容量の実現が可能であるため、様々な電子機器に用いられている。   2. Description of the Related Art Multilayer capacitors are used for various electronic devices because they can achieve high capacitance while being small.

最近では、環境にやさしい自動車及び電気自動車の急浮上により、自動車内の電力駆動システムが増加しており、これにより、自動車に必要な積層型キャパシタの需要も増加している。   Recently, with the rapid rise of eco-friendly vehicles and electric vehicles, the number of power drive systems in vehicles has been increasing, and as a result, the demand for multilayer capacitors required for vehicles has also increased.

自動車用部品として用いられるためには、高レベルの熱信頼性、電気的信頼性、及び機械的信頼性が求められるため、積層型キャパシタに求められる性能も次第に高度化している。   Since high levels of thermal reliability, electrical reliability, and mechanical reliability are required in order to be used as automotive parts, the performance required for multilayer capacitors is becoming increasingly sophisticated.

特に、限られた空間で複数の積層型キャパシタをスタック（Ｓｔａｃｋ）することで高容量を実現できるようにした形態の電子部品、又は振動及び変形に対する耐久性が強い電子部品の構造が求められている。   In particular, there is a demand for a structure of an electronic component in which high capacitance can be realized by stacking a plurality of multilayer capacitors in a limited space, or an electronic component having high durability against vibration and deformation. I have.

特開平７−２４９５４１号公報JP-A-7-249541 韓国公開特許第２０１６−００９２２５１号公報Korean Published Patent Application No. 2016-092251

本発明の目的は、高容量を実現しながら、振動及び変形に対する耐久性と信頼性に優れたスタック型の電子部品を提供することにある。   An object of the present invention is to provide a stack-type electronic component that is excellent in durability and reliability against vibration and deformation while realizing high capacity.

本発明の一側面は、水平方向に連続して配列される複数の積層型キャパシタを含むキャパシタアレイと、上記キャパシタアレイの一側面に配置され、上記複数の積層型キャパシタのそれぞれの第１外部電極と接続される第１金属フレームと、上記キャパシタアレイの他側面に配置され、上記複数の積層型キャパシタのそれぞれの第２外部電極と接続される第２金属フレームと、を含み、上記第１金属フレームは、複数の第１外部電極の第１バンド部の上側部分と接合される第１水平接合部と、上記第１水平接合部と垂直方向に向かい合うように配置される第１水平実装部と、上記第１水平接合部と上記第１水平実装部とを連結し、水平方向に少なくとも一つ以上の第１切開部を有する第１垂直部と、を含み、上記第２金属フレームは、複数の第２外部電極の第２バンド部の上側部分と接合される第２水平接合部と、上記第２水平接合部と垂直方向に向かい合うように配置される第２水平実装部と、上記第２水平接合部と上記第２水平実装部とを連結し、水平方向に少なくとも一つ以上の第２切開部を有する第２垂直部と、を含み、上記第１及び第２水平実装部が積層型キャパシタから離隔するように配置される電子部品を提供する。   One aspect of the present invention is a capacitor array including a plurality of multilayer capacitors arranged continuously in a horizontal direction, and a first external electrode of each of the plurality of multilayer capacitors disposed on one side of the capacitor array. A first metal frame connected to the first metal frame, and a second metal frame disposed on the other side surface of the capacitor array and connected to second external electrodes of the plurality of multilayer capacitors, respectively. The frame includes a first horizontal joint portion joined to an upper portion of the first band portion of the plurality of first external electrodes, and a first horizontal mounting portion arranged to face the first horizontal joint portion in a vertical direction. A first vertical portion connecting the first horizontal joint portion and the first horizontal mounting portion and having at least one or more first cutouts in the horizontal direction. of (2) a second horizontal joining portion joined to an upper portion of the second band portion of the external electrode; a second horizontal mounting portion disposed to face the second horizontal joining portion in a vertical direction; and the second horizontal joining portion And a second vertical portion having at least one or more second cutouts in the horizontal direction, the first and second horizontal mounting portions being connected to the second horizontal mounting portion. Provided are electronic components that are arranged to be separated from each other.

本発明の一実施形態におけるキャパシタアレイにおいて、第１又は第２外部電極の第１又は第２頭部の総面積をＡｔ、第１又は第２垂直部の面積をＡｍと定義する場合、０．２≦Ａｍ／Ａｔ≦０．９を満たすことができる。   In the capacitor array according to an embodiment of the present invention, if the total area of the first or second head of the first or second external electrode is defined as At, and the area of the first or second vertical portion is defined as Am, 0. 2 ≦ Am / At ≦ 0.9 can be satisfied.

本発明の一実施形態において、上記第１及び第２金属フレームは、上記第１及び第２水平実装部に水平方向に少なくとも一つ以上の第３及び第４切開部がそれぞれに形成されることができる。   In one embodiment of the present invention, the first and second metal frames have at least one or more third and fourth cutouts formed in the first and second horizontal mounting portions in the horizontal direction, respectively. Can be.

本発明の一実施形態において、上記第１外部電極と上記第１水平接合部及び上記第１垂直部の間に導電性接着部が設けられ、上記第２外部電極と上記第２水平接合部及び上記第２垂直部の間に導電性接着部が設けられることができる。   In one embodiment of the present invention, a conductive adhesive portion is provided between the first external electrode and the first horizontal junction and the first vertical portion, and the second external electrode and the second horizontal junction are provided. A conductive bonding part may be provided between the second vertical parts.

本発明の一実施形態において、上記キャパシタアレイをカプセル化するカプセル部をさらに含み、上記第１及び第２水平実装部が上記カプセル部の外に露出することができる。   In one embodiment of the present invention, the apparatus further includes a capsule unit for encapsulating the capacitor array, and the first and second horizontal mounting units can be exposed outside the capsule unit.

本発明の一実施形態において、上記積層型キャパシタは、本体と、上記本体の両端部にそれぞれ形成される第１及び第２外部電極と、を含み、上記本体は、誘電体層と、上記誘電体層を挟んで幅方向に交互に配置される第１及び第２内部電極と、を含むことができる。   In one embodiment of the present invention, the multilayer capacitor includes a main body, and first and second external electrodes formed on both ends of the main body, respectively, wherein the main body includes a dielectric layer, the dielectric And first and second internal electrodes alternately arranged in the width direction with the body layer interposed therebetween.

本発明の一実施形態において、上記第１及び第２外部電極は、上記本体の両端面にそれぞれ形成される第１及び第２頭部と、上記第１及び第２頭部から上記本体の上下面の一部までそれぞれ延長される第１及び第２バンド部と、をそれぞれ含むことができる。   In one embodiment of the present invention, the first and second external electrodes are respectively formed on first and second heads respectively formed on both end surfaces of the main body, and on the main body from the first and second heads. And first and second band portions each extending to a part of the lower surface.

本発明の一実施形態において、上記第１垂直部が水平方向にそれぞれの第１頭部の中央部分に位置し、上記第２垂直部が水平方向にそれぞれの第２頭部の中央部分に位置することができる。   In one embodiment of the present invention, the first vertical portion is horizontally located at a central portion of each first head, and the second vertical portion is horizontally located at a central portion of each second head. can do.

本発明の一実施形態において、上記キャパシタアレイは、垂直方向に少なくとも２層以上積層されることができる。   In one embodiment of the present invention, the capacitor array may be stacked in at least two layers in a vertical direction.

本発明の一実施形態において、第１垂直部が、上側に位置したキャパシタアレイの第１頭部まで延長され、上記第２垂直部が、上側に位置したキャパシタアレイの第２頭部まで延長されることができる。   In one embodiment of the present invention, the first vertical portion extends to a first head portion of the upper capacitor array, and the second vertical portion extends to a second head portion of the upper capacitor array. Can be

本発明の一実施形態における上側に配置されたキャパシタアレイにおいて、第１頭部と第１垂直部との間に導電性接着部が設けられ、第２頭部と第２垂直部との間に導電性接着部が設けられることができる。   In the capacitor array arranged on the upper side in one embodiment of the present invention, a conductive adhesive portion is provided between the first head and the first vertical portion, and between the second head and the second vertical portion. A conductive adhesive may be provided.

本発明の一実施形態において、上記複数のキャパシタアレイをカプセル化するカプセル部をさらに含み、上記第１及び第２水平実装部が上記カプセル部の外に露出することができる。   In one embodiment of the present invention, the apparatus further includes a capsule unit for encapsulating the plurality of capacitor arrays, and the first and second horizontal mounting units can be exposed outside the capsule unit.

本発明の一実施形態において、上記キャパシタアレイが多層多列構造からなることができる。   In one embodiment of the present invention, the capacitor array may have a multilayered multi-row structure.

本発明の一実施形態によると、電子部品の高容量を実現すると共に、振動及び変形に対する耐久性と信頼性を向上させることができるという効果がある。   According to one embodiment of the present invention, there is an effect that a high capacity of an electronic component can be realized, and durability and reliability against vibration and deformation can be improved.

本発明の一実施形態に適用される積層型キャパシタを概略的に示す斜視図である。1 is a perspective view schematically illustrating a multilayer capacitor applied to an embodiment of the present invention. （ａ）及び（ｂ）は図１の積層型キャパシタに適用される第１及び第２内部電極をそれぞれ示す平面図である。FIGS. 2A and 2B are plan views showing first and second internal electrodes applied to the multilayer capacitor of FIG. 1, respectively. 図１のＩ−Ｉ'線に沿った断面図である。FIG. 2 is a sectional view taken along the line II ′ of FIG. 1. 本発明の一実施形態に適用される電子部品の概略的な構造を示す斜視図である。1 is a perspective view showing a schematic structure of an electronic component applied to an embodiment of the present invention. 図４の分離斜視図である。FIG. 5 is an exploded perspective view of FIG. 4. 図４の電子部品にカプセル部が形成されている様子を示す斜視図である。FIG. 5 is a perspective view illustrating a state in which a capsule portion is formed on the electronic component in FIG. 4. 本発明の他の実施形態に適用される電子部品の概略的な構造を示す斜視図である。It is a perspective view showing the schematic structure of the electronic parts applied to other embodiments of the present invention. 図７の分離斜視図である。FIG. 8 is an exploded perspective view of FIG. 7. 図７の電子部品にカプセル部が形成されている様子を示す斜視図である。FIG. 8 is a perspective view illustrating a state in which a capsule portion is formed on the electronic component in FIG. 7. 本発明のさらに他の実施形態に適用される電子部品の概略的な構造を示す斜視図である。It is a perspective view showing a schematic structure of an electronic component applied to yet another embodiment of the present invention. 図１０の分離斜視図である。FIG. 11 is an exploded perspective view of FIG. 10. 図１０の電子部品にカプセル部が形成されている様子を示す斜視図である。FIG. 11 is a perspective view illustrating a state in which a capsule portion is formed on the electronic component in FIG. 10. 金属フレームの構造に応じた曲げ変形テストの結果をそれぞれ示すグラフである。It is a graph which shows the result of the bending deformation test according to the structure of the metal frame, respectively. 金属フレームの構造に応じた曲げ変形テストの結果をそれぞれ示すグラフである。It is a graph which shows the result of the bending deformation test according to the structure of the metal frame, respectively. 金属フレームの構造に応じた曲げ変形テストの結果をそれぞれ示すグラフである。It is a graph which shows the result of the bending deformation test according to the structure of the metal frame, respectively. 金属フレームの構造に応じた曲げ変形テストの結果をそれぞれ示すグラフである。It is a graph which shows the result of the bending deformation test according to the structure of the metal frame, respectively. 金属フレームの構造に応じた曲げ変形テストの結果をそれぞれ示すグラフである。It is a graph which shows the result of the bending deformation test according to the structure of the metal frame, respectively. 金属フレームの構造に応じた曲げ変形テストの結果をそれぞれ示すグラフである。It is a graph which shows the result of the bending deformation test according to the structure of the metal frame, respectively.

以下では、添付の図面を参照して本発明の好ましい実施形態について説明する。しかし、本発明の実施形態は様々な他の形態に変形されることができ、本発明の範囲は以下で説明する実施形態に限定されない。また、本発明の実施形態は、当該技術分野で平均的な知識を有する者に本発明をより完全に説明するために提供されるものである。したがって、図面における要素の形状及び大きさなどはより明確な説明のために拡大縮小表示（又は強調表示や簡略化表示）がされることがあり、図面上の同一の符号で示される要素は同一の要素である。また、類似の機能及び作用を果たす部分には図面全体にわたって同一の符号を付す。   Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of the elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and the elements denoted by the same reference numerals in the drawings are the same. Is the element. Further, parts performing similar functions and actions are denoted by the same reference numerals throughout the drawings.

さらに、明細書全体において、ある部分がある構成要素を「含む」とするとき、特に反対の記載がない限り、他の構成要素を除外する意味ではなく、他の構成要素をさらに含むことができることを意味する。   Furthermore, in the entire specification, when a part is referred to as “including” a certain element, unless otherwise specified, it does not mean that the other element is excluded, and may further include another element. Means

本発明の実施形態を明確に説明するために方向を定義すると、図面に表示されているＸ、Ｙ、Ｚはそれぞれ、積層型キャパシタとキャパシタアレイの長さ方向、幅方向、及び厚さ方向を示す。   When the directions are defined to clearly explain the embodiments of the present invention, X, Y, and Z shown in the drawings correspond to the length direction, the width direction, and the thickness direction of the multilayer capacitor and the capacitor array, respectively. Show.

ここで、幅方向は、誘電体層が積層される積層方向と同一の概念として用いられることができる。   Here, the width direction can be used as the same concept as the lamination direction in which the dielectric layers are laminated.

図１は本発明の一実施形態に適用される積層型キャパシタを概略的に示す斜視図であり、図２（ａ）及び図２（ｂ）は、図１の積層型キャパシタに適用される第１及び第２内部電極をそれぞれ示す平面図であり、図３は図１のＩ−Ｉ'線に沿った断面図である。   FIG. 1 is a perspective view schematically showing a multilayer capacitor applied to an embodiment of the present invention, and FIGS. 2A and 2B show a second embodiment applied to the multilayer capacitor of FIG. FIG. 3 is a plan view showing first and second internal electrodes, respectively, and FIG. 3 is a cross-sectional view taken along line II ′ of FIG.

まず図１〜図３を参照して、本実施形態の電子部品に適用される積層型キャパシタの構造について説明する。   First, the structure of a multilayer capacitor applied to the electronic component of the present embodiment will be described with reference to FIGS.

図１〜図３を参照すると、本実施形態の積層型キャパシタ１００は、本体１１０と、本体１１０のＸ方向の両端部にそれぞれ形成される第１及び第２外部電極１３１、１３２と、を含む。   Referring to FIGS. 1 to 3, the multilayer capacitor 100 of the present embodiment includes a main body 110 and first and second external electrodes 131 and 132 formed at both ends of the main body 110 in the X direction. .

本体１１０は、複数の誘電体層１１１をＺ方向に積層した後に焼成したものであり、キャパシタ本体１１０の互いに隣接する誘電体層１１１の間の境界は、走査電子顕微鏡（ＳＥＭ：Ｓｃａｎｎｉｎｇ Ｅｌｅｃｔｒｏｎ Ｍｉｃｒｏｓｃｏｐｅ）を利用せずは確認し難いほど一体化することができる。   The main body 110 is formed by stacking a plurality of dielectric layers 111 in the Z direction and then sintering. The boundary between the adjacent dielectric layers 111 of the capacitor main body 110 is defined by a scanning electron microscope (SEM). It is possible to integrate such that it is difficult to confirm without using.

また、本体１１０は、複数の誘電体層１１１と、誘電体層１１１を挟んでＹ方向に交互に配置される、互いに異なる極性を有する第１及び第２内部電極１２１、１２２と、を含む。   Further, the main body 110 includes a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122 having different polarities and alternately arranged in the Y direction with the dielectric layers 111 interposed therebetween.

また、本体１１０は、キャパシタの容量形成に寄与する部分としての活性領域と、上下マージン部として、Ｚ方向に上記活性領域の上下部にそれぞれ設けられるカバーと、を含むことができる。   In addition, the main body 110 can include an active region as a portion contributing to the formation of the capacitance of the capacitor, and covers provided as upper and lower margin portions provided above and below the active region in the Z direction.

かかる本体１１０は、その形状に特に制限はないが、六面体形状であることができ、Ｚ方向に互いに対向する第１及び第２面１、２と、第１及び第２面１、２と互いに連結され、Ｘ方向に互いに対向する第３及び第４面３、４と、第１及び第２面１、２と連結され、且つ第３及び第４面３、４と連結され、互いに対向する第５及び第６面５、６と、を含むことができる。   The shape of the main body 110 is not particularly limited, but may be a hexahedral shape, and the first and second surfaces 1 and 2 facing each other in the Z direction and the first and second surfaces 1 and 2 The third and fourth surfaces 3 and 4 are connected to each other in the X direction, are connected to the first and second surfaces 1 and 2, and are connected to the third and fourth surfaces 3 and 4, and are opposed to each other. Fifth and sixth surfaces 5,6.

誘電体層１１１は、セラミック粉末、例えば、ＢａＴｉＯ３系セラミック粉末などを含むことができる。 The dielectric layer 111 may include a ceramic powder, for example, a BaTiO 3 ceramic powder.

上記ＢａＴｉＯ３系セラミック粉末は、ＢａＴｉＯ３にＣａ又はＺｒなどが一部固溶された（Ｂａ１−ｘＣａｘ）ＴｉＯ３、Ｂａ（Ｔｉ１−ｙＣａｙ）Ｏ３、（Ｂａ１−ｘＣａｘ）（Ｔｉ１−ｙＺｒｙ）Ｏ３又はＢａ（Ｔｉ１−ｙＺｒｙ）Ｏ３などがあり得るが、これに限定されるものではない。 The BaTiO 3 based ceramic powder, such as Ca or Zr is dissolved partially in BaTiO 3 (Ba 1-x Ca x) TiO 3, Ba (Ti 1-y Ca y) O 3, (Ba 1-x Ca x) (Ti 1-y Zr y) O 3 or Ba (Ti 1-y Zr y ) O 3 may include, but not limited thereto.

また、誘電体層１１１には、上記セラミック粉末と共に、セラミック添加剤、有機溶剤、可塑剤、結合剤、及び分散剤などがさらに添加されることができる。   Further, a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like can be further added to the dielectric layer 111 together with the ceramic powder.

上記セラミック添加剤としては、例えば、遷移金属酸化物又は遷移金属炭化物、希土類元素、マグネシウム（Ｍｇ）又はアルミニウム（Ａｌ）などが用いられることができる。   As the ceramic additive, for example, a transition metal oxide or a transition metal carbide, a rare earth element, magnesium (Mg), or aluminum (Al) can be used.

第１及び第２内部電極１２１、１２２は、互いに異なる極性が印加される電極であって、誘電体層１１１上に形成されてＹ方向に積層されることができる。また、一つの誘電体層１１１を挟んで本体１１０の内部にＹ方向に沿って互いに対向するように交互に配置されることができる。   The first and second internal electrodes 121 and 122 are electrodes to which different polarities are applied, and may be formed on the dielectric layer 111 and stacked in the Y direction. Also, they may be alternately arranged inside the main body 110 so as to face each other along the Y direction with one dielectric layer 111 interposed therebetween.

また、第１及び第２内部電極１２１、１２２は、一端が本体１１０の第３及び第４面３、４を介してそれぞれ露出することができる。   In addition, one end of the first and second internal electrodes 121 and 122 may be exposed through the third and fourth surfaces 3 and 4 of the main body 110, respectively.

このとき、第１及び第２内部電極１２１、１２２は、中間に配置された誘電体層１１１によって互いに電気的に絶縁されることができる。   At this time, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

このように本体１１０の第３及び第４面３、４を介して交互に露出する第１及び第２内部電極１２１、１２２の端部は、後述する本体１１０のＸ方向の両端部に配置される第１及び第２外部電極１３１、１３２とそれぞれ接続されて電気的に連結されることができる。   The ends of the first and second internal electrodes 121 and 122 which are alternately exposed through the third and fourth surfaces 3 and 4 of the main body 110 are arranged at both ends in the X direction of the main body 110 described later. The first and second external electrodes 131 and 132 may be electrically connected to each other.

上記のような構成により、第１及び第２外部電極１３１、１３２に所定の電圧が印加されると、第１及び第２内部電極１２１、１２２の間に電荷が蓄積される。   With the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132, charges are accumulated between the first and second internal electrodes 121 and 122.

このとき、積層型キャパシタ１００の静電容量は、活性領域においてＹ方向に沿って互いに重なる第１及び第２内部電極１２１、１２２の重なり面積と比例する。   At this time, the capacitance of the multilayer capacitor 100 is proportional to the overlapping area of the first and second internal electrodes 121 and 122 overlapping each other along the Y direction in the active region.

また、第１及び第２内部電極１２１、１２２を形成する材料は、特に制限されず、例えば、白金（Ｐｔ）、パラジウム（Ｐｄ）、パラジウム−銀（Ｐｄ−Ａｇ）合金などの貴金属材料、及びニッケル（Ｎｉ）及び銅（Ｃｕ）のうち１つ以上の物質からなる導電性ペーストを用いて形成することができる。   The material for forming the first and second internal electrodes 121 and 122 is not particularly limited, and is, for example, a noble metal material such as platinum (Pt), palladium (Pd), palladium-silver (Pd-Ag) alloy, and the like. The conductive paste may be formed using a conductive paste made of at least one of nickel (Ni) and copper (Cu).

このとき、上記導電性ペーストの印刷方法は、スクリーン印刷法又はグラビア印刷法などを用いることができるが、本発明がこれに限定されるものではない。   At this time, a screen printing method, a gravure printing method, or the like can be used as a printing method of the conductive paste, but the present invention is not limited thereto.

第１及び第２外部電極１３１、１３２には、互いに異なる極性の電圧が提供される。第１及び第２外部電極１３１、１３２は、本体１１０のＸ方向の両端部に配置され、第１及び第２内部電極１２１、１２２の露出する部分とそれぞれ接続されて電気的に連結されることができる。   Voltages having different polarities are provided to the first and second external electrodes 131 and 132. The first and second external electrodes 131 and 132 are disposed at both ends in the X direction of the main body 110 and are connected to and electrically connected to exposed portions of the first and second internal electrodes 121 and 122, respectively. Can be.

第１外部電極１３１は、第１頭部１３１ａと、第１バンド部１３１ｂと、を含むことができる。   The first external electrode 131 may include a first head 131a and a first band 131b.

第１頭部１３１ａは、本体１１０の第３面３に配置され、第１内部電極１２１において本体１１０の第３面３を介して外部に露出する部分と接触することで、第１内部電極１２１と第１外部電極１３１とを互いに接続させる役割を果たす。   The first head 131a is disposed on the third surface 3 of the main body 110, and comes into contact with a portion of the first internal electrode 121 that is exposed to the outside via the third surface 3 of the main body 110. And the first external electrode 131 are connected to each other.

第１バンド部１３１ｂは、第１頭部１３１ａから本体１１０の第１及び第２面１、２の一部まで延長され、第１金属フレーム１４０と接続される部分である。   The first band portion 131b is a portion extending from the first head portion 131a to a part of the first and second surfaces 1 and 2 of the main body 110 and connected to the first metal frame 140.

このとき、第１バンド部１３１ｂは、固着強度の向上などのために、必要に応じて第１頭部１３１ａから本体１１０の第５及び第６面５、６の一部までさらに延長されるように形成されることができる。   At this time, the first band portion 131b is further extended from the first head portion 131a to a part of the fifth and sixth surfaces 5, 6 of the main body 110 as necessary to improve the fixing strength. Can be formed.

第２外部電極１３２は、本体１１０のＸ方向の他端部に形成される。   The second external electrode 132 is formed on the other end of the main body 110 in the X direction.

このとき、第２外部電極１３２は、第２頭部１３２ａと、第２バンド部１３２ｂと、を含むことができる。   At this time, the second external electrode 132 may include a second head 132a and a second band 132b.

第２頭部１３２ａは、本体１１０の第４面４に配置され、第２内部電極１２２において本体１１０の第４面４を介して外部に露出する部分と接触することで、第２内部電極１２２と第２外部電極１３２とを互いに接続させる役割を果たす。   The second head 132a is disposed on the fourth surface 4 of the main body 110, and comes into contact with a portion of the second internal electrode 122 that is exposed to the outside via the fourth surface 4 of the main body 110, so that the second internal electrode 122 And the second external electrode 132.

第２バンド部１３２ｂは、第２頭部１３２ａから本体１１０の第１及び第２面１、２の一部まで延長され、第２金属フレーム１５０と接続される部分である。   The second band portion 132 b is a portion extending from the second head 132 a to a part of the first and second surfaces 1 and 2 of the main body 110 and connected to the second metal frame 150.

このとき、第２バンド部１３２ｂは、固着強度の向上などのために、必要に応じて第２頭部１３２ａから本体１１０の第５及び第６面５、６の一部までさらに延長されるように形成されることができる。   At this time, the second band portion 132b is further extended from the second head portion 132a to a part of the fifth and sixth surfaces 5, 6 of the main body 110 as necessary to improve the fixing strength. Can be formed.

一方、第１及び第２外部電極１３１、１３２は、めっき層をさらに含むことができる。   Meanwhile, the first and second external electrodes 131 and 132 may further include a plating layer.

上記めっき層は、第１及び第２ニッケル（Ｎｉ）めっき層と、上記第１及び第２ニッケルめっき層をそれぞれカバーする第１及び第２錫（Ｓｎ）めっき層と、を含むことができる。   The plating layer may include first and second nickel (Ni) plating layers, and first and second tin (Sn) plating layers respectively covering the first and second nickel plating layers.

図４は本発明の一実施形態に適用される電子部品の概略的な構造を示す斜視図であり、図５は図４の分離斜視図である。   FIG. 4 is a perspective view showing a schematic structure of an electronic component applied to one embodiment of the present invention, and FIG. 5 is an exploded perspective view of FIG.

図４及び図５を参照すると、本実施形態の電子部品は、水平方向であるＸ方向に連続して配列される複数の積層型キャパシタ１００を含むキャパシタアレイと、上記キャパシタアレイのＹ方向の一側面に配置され、複数の積層型キャパシタ１００のそれぞれの第１外部電極１３１と接続される第１金属フレーム１４０と、上記キャパシタアレイのＹ方向の他側面に配置され、複数の積層型キャパシタ１００の第２外部電極１３２と接続される第２金属フレーム１５０と、を含む。   Referring to FIGS. 4 and 5, an electronic component according to the present embodiment includes a capacitor array including a plurality of multilayer capacitors 100 that are continuously arranged in a horizontal X direction, and one of the capacitor arrays in the Y direction. A first metal frame 140 arranged on the side surface and connected to each of the first external electrodes 131 of the plurality of multilayer capacitors 100; and a first metal frame 140 arranged on the other side surface of the capacitor array in the Y direction. A second metal frame 150 connected to the second external electrode 132.

第１金属フレーム１４０は、複数の積層型キャパシタ１００のそれぞれの第１外部電極１３１に接合されて、隣接する第１外部電極１３１を互いに連結する共通電極の役割を果たすことができる。   The first metal frame 140 is joined to the first external electrodes 131 of each of the plurality of multilayer capacitors 100 and may serve as a common electrode connecting the adjacent first external electrodes 131 to each other.

かかる第１金属フレーム１４０は、第１水平接合部１４１と、第１水平実装部１４３と、第１垂直部１４２と、を含む。   The first metal frame 140 includes a first horizontal joint 141, a first horizontal mounting part 143, and a first vertical part 142.

第１水平接合部１４１は、Ｘ方向に長く形成され、複数の第１外部電極１３１のそれぞれの第１バンド部１３１ｂの上側部分に接合されて、複数の第１外部電極１３１の第１バンド部１３１ｂの上側部分を電気的及び物理的に互いに連結する。   The first horizontal joint 141 is formed to be long in the X direction, and is joined to an upper portion of each of the first band portions 131b of the plurality of first external electrodes 131, and the first band portions of the plurality of first external electrodes 131 are formed. The upper portions of 131b are electrically and physically connected to each other.

このとき、それぞれの第１外部電極１３１の第１バンド部１３１ｂの上側部分において第１水平接合部１４１と対応する位置に導電性接着部１７０が設けられることができる。   At this time, the conductive bonding part 170 may be provided at a position corresponding to the first horizontal bonding part 141 in an upper part of the first band part 131b of each first external electrode 131.

導電性接着部１７０は、高温半田又は導電性接合材などからなることができるが、本発明がこれに限定されるものではない。   The conductive bonding portion 170 may be made of a high-temperature solder or a conductive bonding material, but the present invention is not limited thereto.

第１水平実装部１４３は、第１水平接合部１４１とＺ方向に向かい合うように配置され、基板への実装時に接続端子の役割を果たす。   The first horizontal mounting portion 143 is disposed so as to face the first horizontal joint portion 141 in the Z direction, and plays a role of a connection terminal when mounted on a board.

また、第１水平実装部１４３は、積層型キャパシタ１００の下面からＺ方向に所定距離だけ離隔するように配置される。   Further, the first horizontal mounting portion 143 is disposed so as to be separated from the lower surface of the multilayer capacitor 100 by a predetermined distance in the Z direction.

また、第１水平実装部１４３には、Ｘ方向に沿って少なくとも一つ以上の第３切開部１４５が形成されることができる。   Further, at least one or more third cutouts 145 may be formed in the first horizontal mounting portion 143 along the X direction.

第１垂直部１４２は、第１水平接合部１４１の先端から下側に延長され、下端が第１水平実装部１４３の先端と連結される。   The first vertical part 142 extends downward from the tip of the first horizontal joint part 141, and has a lower end connected to the tip of the first horizontal mounting part 143.

また、第１垂直部１４２は、複数の第１外部電極１３１のそれぞれの第１頭部１３１ａと接合されて、複数の第１外部電極１３１の第１頭部１３１ａを電気的及び物理的にＸ方向に連結する。   Further, the first vertical portion 142 is joined to the first head 131a of each of the plurality of first external electrodes 131, and electrically and physically connects the first head 131a of the plurality of first external electrodes 131 to X. Connect in the direction.

また、第１垂直部１４２には、Ｘ方向に沿って少なくとも一つ以上の第１切開部１４４が形成され、第１外部電極１３１の第１頭部１３１ａ全体の面積より小さい面積で形成されることができる。   In addition, at least one or more first cutouts 144 are formed in the first vertical portion 142 along the X direction, and are formed with an area smaller than the entire area of the first head 131a of the first external electrode 131. be able to.

これにより、第１垂直部１４２が、Ｘ方向においてそれぞれの第１外部電極１３１の第１頭部１３１ａの中央部分に位置するようになる。   As a result, the first vertical portion 142 is located at the center of the first head 131a of each first external electrode 131 in the X direction.

このとき、それぞれの第１外部電極１３１の第１頭部１３１ａにおいて第１垂直部１４２と対応する位置に導電性接着部１８０が設けられることができる。   At this time, the conductive bonding part 180 may be provided at a position corresponding to the first vertical part 142 in the first head 131a of each first external electrode 131.

また、第１垂直部１４２のＸ方向の長さは、すべての積層型キャパシタ１００の第１外部電極１３１と接続できるように、キャパシタアレイの長さとほぼ同様に設定されることができる。   Further, the length of the first vertical portion 142 in the X direction can be set to be substantially the same as the length of the capacitor array so that the first vertical portion 142 can be connected to the first external electrodes 131 of all the multilayer capacitors 100.

第２金属フレーム１５０は、複数の積層型キャパシタ１００のそれぞれの第１外部電極１３２に接合されて、隣接する第２外部電極１３２を互いに連結する共通電極の役割を果たすことができる。   The second metal frame 150 may be joined to the first external electrodes 132 of each of the plurality of multilayer capacitors 100 and may serve as a common electrode connecting the adjacent second external electrodes 132 to each other.

かかる第２金属フレーム１５０は、第２水平接合部１５１と、第２水平実装部１５３と、第２垂直部１５２と、を含む。   The second metal frame 150 includes a second horizontal joining part 151, a second horizontal mounting part 153, and a second vertical part 152.

第２水平接合部１５１は、Ｘ方向に長く形成され、複数の第２外部電極１３２のそれぞれの第２バンド部１３２ｂの上側部分に接合されて、複数の第２外部電極１３２の第２バンド部１３２ｂの上側部分を電気的及び物理的に互いに連結する。   The second horizontal bonding portion 151 is formed to be long in the X direction, and is bonded to an upper portion of each of the second band portions 132b of the plurality of second external electrodes 132, and the second band portion of the plurality of second external electrodes 132 is formed. The upper portions of 132b are electrically and physically connected to each other.

このとき、それぞれの第２外部電極１３２の第２バンド部１３２ｂの上側部分において第２水平接合部１５１と対応する位置に導電性接着部１７０が設けられることができる。   At this time, the conductive bonding part 170 may be provided at a position corresponding to the second horizontal bonding part 151 in an upper part of the second band part 132b of each second external electrode 132.

第２水平実装部１５３は、第２水平接合部１５１とＺ方向に向かい合うように配置され、基板実装時に接続端子の役割を果たす。   The second horizontal mounting portion 153 is disposed so as to face the second horizontal joining portion 151 in the Z direction, and plays a role of a connection terminal during mounting on the board.

また、第２水平実装部１５３は、積層型キャパシタ１００の下面からＺ方向に所定距離だけ離隔するように配置される。   Further, the second horizontal mounting portion 153 is disposed so as to be separated from the lower surface of the multilayer capacitor 100 by a predetermined distance in the Z direction.

また、第２水平実装部１５３には、Ｘ方向に沿って少なくとも一つ以上の第４切開部１５５が形成されることができる。     Also, at least one or more fourth cutouts 155 may be formed in the second horizontal mounting part 153 along the X direction.

第２垂直部１５２は、第２水平接合部１５１の先端から下側に延長され、下端が第２水平実装部１５３の先端と連結される。   The second vertical part 152 extends downward from the tip of the second horizontal joint part 151, and has a lower end connected to the tip of the second horizontal mounting part 153.

また、第２垂直部１５２は、複数の第２外部電極１３２のそれぞれの第２頭部１３２ａと接合されて、複数の第２外部電極１３２の第２頭部１３２ａを電気的及び物理的にＸ方向に連結する。   In addition, the second vertical portion 152 is joined to each of the second heads 132a of the plurality of second external electrodes 132, and electrically and physically connects the second heads 132a of the plurality of second external electrodes 132 to X. Connect in the direction.

また、第２垂直部１５２には、Ｘ方向に沿って少なくとも一つ以上の第２切開部１５４が形成され、第２外部電極１３２の第２頭部１３２ａ全体の面積より小さい面積で形成されることができる。   Further, at least one or more second cutouts 154 are formed in the second vertical portion 152 along the X direction, and are formed with an area smaller than the entire area of the second head 132a of the second external electrode 132. be able to.

これにより、第２垂直部１５２は、Ｘ方向においてそれぞれの第２外部電極１３２の第２頭部１３２ａの中央部分に位置するようになる。   Thus, the second vertical portion 152 is located at the center of the second head 132a of each of the second external electrodes 132 in the X direction.

このとき、それぞれの第２外部電極１３２の第２頭部１３２ａにおいて第２垂直部１５２と対応する位置に導電性接着部１８０が設けられることができる。   At this time, the conductive bonding portion 180 may be provided at a position corresponding to the second vertical portion 152 in the second head 132a of each of the second external electrodes 132.

また、第２垂直部１５２のＸ方向の長さは、すべての積層型キャパシタ１００の第１外部電極１３２と接続できるように、キャパシタアレイの長さとほぼ同様に設定されることができる。   In addition, the length of the second vertical portion 152 in the X direction can be set substantially the same as the length of the capacitor array so that the second vertical portion 152 can be connected to the first external electrodes 132 of all the multilayer capacitors 100.

一方、本実施形態の電子部品は、キャパシタアレイにおいて、第１又は第２外部電極１３１、１３２の第１又は第２頭部１３１ａ、１３２ａの総面積をＡｔ、第１又は第２垂直部１４２、１５２の面積をＡｍと定義する場合、０．２≦Ａｍ／Ａｔ≦０．９を満たすことができる。   On the other hand, in the electronic component of the present embodiment, in the capacitor array, the total area of the first or second heads 131a, 132a of the first or second external electrodes 131, 132 is At, the first or second vertical portion 142, If the area of 152 is defined as Am, it can satisfy 0.2 ≦ Am / At ≦ 0.9.

本実施形態によれば、複数の積層型キャパシタを含むキャパシタアレイを含むことにより、高容量の実現が可能であり、金属フレームを用いてキャパシタアレイと実装基板との間の間隔を確保することにより、基板に実装する際に基板からのストレスが積層型キャパシタに直接伝達されないようにすることで、電子部品の熱信頼性及び機械的信頼性を向上させることができる。   According to the present embodiment, by including a capacitor array including a plurality of multilayer capacitors, a high capacity can be realized, and by securing a space between the capacitor array and the mounting substrate using a metal frame, In addition, by preventing stress from the substrate from being directly transmitted to the multilayer capacitor when mounted on the substrate, the thermal reliability and the mechanical reliability of the electronic component can be improved.

一方、キャパシタアレイの両側面に金属フレームを接合する場合、常温での接合状態は良好であるが、電装部品のように使用温度の変動が大きい環境下では、互いに接合された金属フレームと積層型キャパシタの外部電極との熱膨張係数の差によって接合界面に応力が発生し、接合力の劣化及びクラック不良が発生する可能性がある。   On the other hand, when metal frames are bonded to both sides of the capacitor array, the bonding state at normal temperature is good, but in an environment where the operating temperature fluctuates greatly, such as electrical components, the metal frames bonded to each other and Due to the difference in the coefficient of thermal expansion between the capacitor and the external electrode, stress is generated at the bonding interface, and there is a possibility that the bonding force is degraded and cracks are generated.

本実施形態によると、第１及び第２垂直部１４２、１５２は、Ｘ方向に第１及び第２切開部１４４、１５４が形成されることで、第１及び第２垂直部１４２、１５２の一部に金属フレームのない不連続面が設けられる。   According to the present embodiment, the first and second vertical portions 142 and 152 are formed by forming the first and second cutouts 144 and 154 in the X direction, thereby forming one of the first and second vertical portions 142 and 152. The part is provided with a discontinuous surface without a metal frame.

これにより、第１及び第２金属フレーム１４０、１５０の電気的及び物理的接合性を一定レベルに確保しながらも、第１及び第２垂直部１４２、１５２と第１及び第２外部電極１３１、１３２とが接合される面積を部分的に減少させ、熱衝撃による応力の発生を抑制することができる。   Accordingly, the first and second vertical portions 142 and 152 and the first and second external electrodes 131 and the first and second external electrodes 131 and 150 may be secured while maintaining the electrical and physical bonding between the first and second metal frames 140 and 150 at a certain level. 132 can be partially reduced, and generation of stress due to thermal shock can be suppressed.

このとき、第１及び第２切開部１４４、１５４によって減少した第１及び第２垂直部１４２、１５２における接合力は、第１及び第２金属フレーム１４０、１５０の第１及び第２水平接合部１４１、１５１と、第１及び第２外部電極１３１、１３２の第１及び第２バンド部１３１ｂ、１３２ｂとがそれぞれ接合されることによって発生する接合力により補償されることができる。   At this time, the joining force at the first and second vertical portions 142 and 152 reduced by the first and second cutouts 144 and 154 is equal to the first and second horizontal joining portions of the first and second metal frames 140 and 150. This can be compensated for by a bonding force generated by bonding the first and second band portions 131b and 132b of the first and second external electrodes 131 and 132 to the first and second external electrodes 131 and 132, respectively.

したがって、第１及び第２金属フレーム１４０、１５０の接合力劣化及びクラック不良を同時に防止することができ、電子部品の信頼性を大幅に向上させることができる。     Therefore, it is possible to simultaneously prevent the deterioration of the bonding strength of the first and second metal frames 140 and 150 and the crack failure, and to significantly improve the reliability of the electronic component.

図６は図４の電子部品にカプセル部が形成されている様子を示す斜視図である。   FIG. 6 is a perspective view showing a state in which a capsule portion is formed on the electronic component of FIG.

図６を参照すると、キャパシタアレイをカプセル化するカプセル部１６０をさらに含むことができる。   Referring to FIG. 6, a capsule unit 160 for encapsulating the capacitor array may be further included.

カプセル部１６０は、エポキシのような絶縁性樹脂からなることができ、第１及び第２金属フレーム１４０、１５０において第１及び第２水平実装部１４３、１５３を除いた電子部品の残りの部分がすべてカプセル化するように形成されることができる。   The capsule part 160 may be made of an insulating resin such as epoxy, and the remaining parts of the electronic component except for the first and second horizontal mounting parts 143 and 153 in the first and second metal frames 140 and 150 may be used. All can be formed to encapsulate.

カプセル部１６０は、キャパシタアレイと第１及び第２金属フレーム１４０、１５０との接合状態を向上させ、且つ外部環境からの信頼性を向上させる役割を果たすことができる。   The capsule part 160 may serve to improve a bonding state between the capacitor array and the first and second metal frames 140 and 150 and to improve reliability from an external environment.

図７は本発明の他の実施形態に適用される電子部品の概略的な構造を示す斜視図であり、図８は図７の分離斜視図である。   FIG. 7 is a perspective view showing a schematic structure of an electronic component applied to another embodiment of the present invention, and FIG. 8 is an exploded perspective view of FIG.

図７及び図８を参照すると、本実施形態の電子部品は、キャパシタアレイがＺ方向に少なくとも２層以上積層されることができる。   Referring to FIGS. 7 and 8, in the electronic component of the present embodiment, at least two or more capacitor arrays can be stacked in the Z direction.

上側に位置したキャパシタアレイは、第１バンド部１３１ｂの下側部分が第１金属フレーム１４０の第１水平接合部１４１の上面に接合されることができ、第２バンド部１３２ｂの下側部分が第２金属フレーム１５０の第２水平接合部１５１の上面に接合されることができる。   In the capacitor array located on the upper side, the lower part of the first band part 131b may be joined to the upper surface of the first horizontal joint part 141 of the first metal frame 140, and the lower part of the second band part 132b may be joined. The second metal frame 150 may be joined to the upper surface of the second horizontal joint 151.

一方、図面には、キャパシタアレイが２層に積層されている構造が示されているが、本発明はこれに限定されるものではなく、キャパシタアレイは、必要に応じて３層以上積層されることができる。   On the other hand, although the drawings show a structure in which the capacitor array is stacked in two layers, the present invention is not limited to this, and the capacitor array may be stacked in three or more layers as necessary. be able to.

図９は図７の電子部品にカプセル部が形成されている様子を示す斜視図である。   FIG. 9 is a perspective view showing a state in which a capsule portion is formed on the electronic component of FIG.

図９を参照すると、複数のキャパシタアレイをカプセル化するカプセル部１６０'をさらに含むことができる。   Referring to FIG. 9, an encapsulation unit 160 'for encapsulating a plurality of capacitor arrays may be further included.

カプセル部１６０'は、エポキシのような絶縁性樹脂からなることができ、第１及び第２金属フレーム１４０、１５０において第１及び第２水平実装部１４３、１５３を除いた電子部品の残りの部分がすべてカプセル化するように形成されることができる。   The encapsulation part 160 ′ may be made of an insulating resin such as epoxy, and the remaining parts of the electronic component excluding the first and second horizontal mounting parts 143 and 153 in the first and second metal frames 140 and 150. Can all be formed to encapsulate.

図１０は本発明の他の実施形態に適用される電子部品の概略的な構造を示す斜視図であり、図１１は図１０の分離斜視図である。   FIG. 10 is a perspective view showing a schematic structure of an electronic component applied to another embodiment of the present invention, and FIG. 11 is an exploded perspective view of FIG.

図１０及び図１１を参照すると、本実施形態の電子部品は、キャパシタアレイがＺ方向に少なくとも２層以上積層されることができる。   Referring to FIGS. 10 and 11, in the electronic component of the present embodiment, at least two or more capacitor arrays can be stacked in the Z direction.

上側に位置したキャパシタアレイは、第１バンド部１３１ｂの下側部分が第１金属フレーム１４０'の第１水平接合部１４１の上面に接合されることができ、第２バンド部１３２ｂの下側部分が第２金属フレーム１５０'の第２水平接合部１５１の上面に接合されることができる。   In the capacitor array located on the upper side, the lower part of the first band part 131b may be joined to the upper surface of the first horizontal joint part 141 of the first metal frame 140 ', and the lower part of the second band part 132b may be joined. May be joined to the upper surface of the second horizontal joint 151 of the second metal frame 150 ′.

ここで、上述の図７に示された実施形態と異なる点は、第１金属フレーム１４０'の第１垂直部１４２が、上側に配置されたキャパシタアレイを構成する積層型キャパシタ１００における第１外部電極１３１の第１頭部１３１ａに接合されるようにＺ方向に延長される第１延長部１４２ａを有することができ、第２金属フレーム１５０'の第２垂直部１５２が、上側に配置されたキャパシタアレイを構成する積層型キャパシタ１００における第２外部電極１３２の第２頭部１３２ａに接合されるようにＺ方向に延長される第２延長部１５２ａを有することができるという点である。   Here, the point different from the embodiment shown in FIG. 7 described above is that the first vertical portion 142 of the first metal frame 140 ′ is the first external part of the multilayer capacitor 100 constituting the capacitor array arranged on the upper side. It may have a first extension 142a extending in the Z direction so as to be joined to the first head 131a of the electrode 131, and the second vertical portion 152 of the second metal frame 150 'is disposed on the upper side. The point is that it can have a second extension 152a extending in the Z direction so as to be joined to the second head 132a of the second external electrode 132 in the multilayer capacitor 100 forming the capacitor array.

このとき、複数の第１延長部１４２ａの間に第１スペース部が形成されることができ、複数の第２延長部１５２ａの間に第２スペース部が形成されることができる。   At this time, a first space may be formed between the plurality of first extensions 142a, and a second space may be formed between the plurality of second extensions 152a.

これにより、上側に位置したキャパシタアレイにおいて第１及び第２延長部１４２ａ、１５２ａと第１及び第２外部電極１３１、１３２との接合面積が減少し、熱衝撃による応力の発生をさらに抑制することができる。   Accordingly, in the capacitor array located on the upper side, the bonding area between the first and second extension portions 142a and 152a and the first and second external electrodes 131 and 132 is reduced, and the generation of stress due to thermal shock is further suppressed. Can be.

また、上側に位置したキャパシタアレイには、それぞれの第１外部電極１３１の第１頭部１３１ａにおいて第１垂直部１４２の延長部１４２ａと対応する位置に導電性接着部１８０'がさらに設けられることができる。   In the capacitor array located on the upper side, a conductive adhesive part 180 ′ is further provided at a position corresponding to the extension 142 a of the first vertical part 142 on the first head 131 a of each first external electrode 131. Can be.

上側に位置したキャパシタアレイには、それぞれの第２外部電極１３２の第２頭部１３２ａにおいて第２垂直部１５２の延長部１５２ａと対応する位置に導電性接着部１８０'がさらに設けられることができる。   In the upper capacitor array, a conductive adhesive part 180 ′ may be further provided at a position corresponding to the extension 152 a of the second vertical part 152 on the second head 132 a of each second external electrode 132. .

一方、図面には、キャパシタアレイが２層に積層されている構造が示されているが、本発明はこれに限定されるものではなく、キャパシタアレイは、必要に応じて３層以上積層されることができる。   On the other hand, although the drawings show a structure in which the capacitor array is stacked in two layers, the present invention is not limited to this, and the capacitor array may be stacked in three or more layers as necessary. be able to.

また、本発明の電子部品は、必要に応じて上記キャパシタアレイが多層多列構造からなることもできる。   In the electronic component of the present invention, the capacitor array may have a multi-layered multi-row structure, if necessary.

図１２は図１０の電子部品にカプセル部が形成されている様子を示す斜視図である。   FIG. 12 is a perspective view showing a state in which a capsule portion is formed on the electronic component of FIG.

図１２を参照すると、複数のキャパシタアレイをカプセル化するカプセル部１６０''をさらに含むことができる。   Referring to FIG. 12, an encapsulation unit 160 ″ for encapsulating a plurality of capacitor arrays may be further included.

カプセル部１６０''は、エポキシのような絶縁性樹脂からなることができ、第１及び第２金属フレーム１４０'、１５０'において第１及び第２水平実装部１４３、１５３を除いた電子部品の残りの部分がすべてカプセル化するように形成されることができる。   The capsule part 160 ″ may be made of an insulating resin such as epoxy, and is formed of an electronic component excluding the first and second horizontal mounting parts 143 and 153 in the first and second metal frames 140 ′ and 150 ′. The rest can all be formed to encapsulate.

実験例
図１３〜図１８は金属フレームの構造に応じた曲げ変形テストの結果をそれぞれ示すグラフである。 Experimental Example FIGS. 13 to 18 are graphs respectively showing the results of a bending deformation test according to the structure of the metal frame.

それぞれのサンプルに用いられた積層型キャパシタは、長さと幅が３．２ｍｍと２．５ｍｍであり、１０ｕＦの電気的特性を有するように製造したものである。また、テストに用いられたキャパシタアレイは、かかる積層型キャパシタ１０個を２層×５列の構造で配列し、−５５℃〜１２５℃の温度サイクルを１００回行って構成したものである。   The multilayer capacitor used for each sample had lengths and widths of 3.2 mm and 2.5 mm, and was manufactured to have electrical characteristics of 10 uF. The capacitor array used in the test is configured by arranging ten such stacked capacitors in a two-layer × five-row structure and performing a temperature cycle of −55 ° C. to 125 ° C. 100 times.

そして、金属フレームは、水平実装部と積層型キャパシタの底面との間の間隔が０．２５ｍｍとなるようにした。   The distance between the horizontal mounting portion and the bottom surface of the multilayer capacitor was set to 0.25 mm in the metal frame.

以下、キャパシタアレイにおいて一方の外部電極の頭部の面積をＡｔ、上記頭部と接合される金属フレームの垂直部の面積をＡｍと定義し、各サンプルの金属フレームの形態を説明する。   Hereinafter, the area of the head of one external electrode in the capacitor array is defined as At, and the area of the vertical portion of the metal frame joined to the head is defined as Am, and the form of the metal frame of each sample will be described.

図１３は比較例であって、金属フレームの垂直部に切開部が形成されておらず、Ａｍ／Ａｔが１．０であるものであり、図１４は垂直部のＸ方向の長さがキャパシタアレイのＸ方向の長さより短くて垂直部のＸ方向の両端部に切開部が形成され、Ａｍ／Ａｔが０．９であるものである。   FIG. 13 shows a comparative example in which a cutout portion is not formed in a vertical portion of a metal frame and Am / At is 1.0. FIG. Incisions are formed at both ends in the X direction of the vertical portion shorter than the length of the array in the X direction, and Am / At is 0.9.

図１５は垂直部にＸ方向に４つの切開部が形成され、Ａｍ／Ａｔは０．９５であるものであり、図１６は垂直部にＸ方向に４つの切開部が形成され、且つ切開部の幅を図１５の切開部の幅より大きくしてＡｍ／Ａｔが０．９であるものである。   FIG. 15 shows that four incisions are formed in the vertical direction in the X direction, and Am / At is 0.95. FIG. 16 shows four incisions formed in the vertical direction in the X direction. Is larger than the width of the incision in FIG. 15, and Am / At is 0.9.

図１７は垂直部のＸ方向の両端部に切開部が形成され、内側に４つの切開部が形成され、且つ切開部の幅を図１６の切開部の幅より大きくしてＡｍ／Ａｔが０．２０であるものであり、図１８は垂直部のＸ方向の両端部に切開部が形成され、内側に４つの切開部が形成され、且つ切開部の幅を図１７の切開部の幅より大きくしてＡｍ／Ａｔが０．１０であるものである。   In FIG. 17, incisions are formed at both ends in the X direction of the vertical portion, four incisions are formed inside, and the width of the incision is larger than the width of the incision in FIG. FIG. 18 shows an incision formed at both ends in the X direction of the vertical portion, four incisions formed inside, and the width of the incision is smaller than the width of the incision in FIG. Am / At is set to 0.10.

かかるサンプルを用いて外部電極の頭部の面積と金属フレームの垂直部の面積の変化による熱変形応力の影響を比較するために、曲げクラックテストを行う。   Using such a sample, a bending crack test is performed in order to compare the effect of thermal deformation stress due to a change in the area of the head of the external electrode and the area of the vertical portion of the metal frame.

曲げクラックテストは、基板に電子部品を実装した後、電子部品が実装された基板面を下に向けて配置し、電子部品の両側から所定距離だけ離隔した位置にそれぞれ支持台を位置させて行われる。その後、電子部品が実装された基板面の反対面を、基板が１０ｍｍほど変形するまで押し続けながら電子部品又は実装部にクラックが発生するか、又は電流値が急激に増加するかを確認して測定する。   In the bending crack test, after mounting the electronic components on the board, the board on which the electronic components are mounted is placed face down, and the support base is positioned at a predetermined distance from both sides of the electronic components. Will be Thereafter, while pressing the opposite side of the board surface on which the electronic component is mounted, until the board is deformed by about 10 mm, cracks are generated in the electronic component or the mounting portion, or it is checked whether the current value increases rapidly. Measure.

図１３〜図１８を参照すると、比較例の場合、４回の曲げ変形不良が現れ、切開部があっても垂直部の両端部にのみ形成されている図１４の場合、曲げ変形不良が現れた。   Referring to FIGS. 13 to 18, in the case of the comparative example, four bending deformation defects appear, and in the case of FIG. Was.

また、垂直部の内側に切開部がある場合、曲げ変形不良がほぼ現れなかったが、Ａｍ／Ａｔが０．９５である図１５のサンプルと、Ａｍ／Ａｔが０．１０である図１８のサンプルでは、曲げ変形不良が現れた。   In addition, when there was an incision inside the vertical part, bending deformation failure hardly appeared, but the sample of FIG. 15 where Am / At was 0.95 and the sample of FIG. 18 where Am / At was 0.10. In the sample, poor bending deformation appeared.

したがって、曲げ変形不良が現れていないＡｍ／Ａｔの好ましい数値範囲は、０．９以下、０．２以上であることが分かる。   Therefore, it can be seen that the preferred numerical range of Am / At where no bending deformation failure appears is 0.9 or less and 0.2 or more.

以上、本発明の実施形態について詳細に説明したが、本発明の技術的範囲はこれに限定されず、特許請求の範囲に記載された本発明の技術的思想から外れない範囲内で多様な修正及び変形が可能であるということは、当技術分野の通常の知識を有する者には明らかである。   Although the embodiments of the present invention have been described in detail, the technical scope of the present invention is not limited thereto, and various modifications may be made without departing from the technical concept of the present invention described in the appended claims. It will be apparent to those having ordinary skill in the art that modifications and variations are possible.

１００ 積層型キャパシタ
１１０ キャパシタ本体
１１１ 誘電体層
１２１、１２２ 第１及び第２内部電極
１３１、１３２ 第１及び第２外部電極
１４０、１５０ 第１及び第２金属フレーム
１４１、１５１ 第１及び第２水平接合部
１４２、１５２ 第１及び第２垂直部
１４３、１５３ 第１及び第２水平実装部
１４４、１５４ 第１及び第２切開部
１４５、１５５ 第３及び第４切開部
１６０、１６０'、１６０'' カプセル部 Reference Signs List 100 multilayer capacitor 110 capacitor body 111 dielectric layer 121, 122 first and second internal electrodes 131, 132 first and second external electrodes 140, 150 first and second metal frames 141, 151 first and second horizontal Joints 142, 152 First and second vertical parts 143, 153 First and second horizontal mounting parts 144, 154 First and second cutouts 145, 155 Third and fourth cutouts 160, 160 ', 160''' Capsule part

Claims (13)

水平方向に連続して配列される複数の積層型キャパシタを含むキャパシタアレイと、
前記キャパシタアレイの一側面に配置され、前記複数の積層型キャパシタのそれぞれの第１外部電極と接続される第１金属フレームと、
前記キャパシタアレイの他側面に配置され、前記複数の積層型キャパシタのそれぞれの第２外部電極と接続される第２金属フレームと、を含み、
前記第１金属フレームは、複数の第１外部電極の第１バンド部の上側部分と接合される第１水平接合部と、前記第１水平接合部と垂直方向に向かい合うように配置される第１水平実装部と、前記第１水平接合部と前記第１水平実装部とを連結し、水平方向に少なくとも一つ以上の第１切開部を有する第１垂直部と、を含み、
前記第２金属フレームは、複数の第２外部電極の第２バンド部の上側部分と接合される第２水平接合部と、前記第２水平接合部と垂直方向に向かい合うように配置される第２水平実装部と、前記第２水平接合部と前記第２水平実装部とを連結し、水平方向に少なくとも一つ以上の第２切開部を有する第２垂直部と、を含み、
前記第１水平実装部及び前記第２水平実装部が積層型キャパシタから離隔するように配置される、電子部品。 A capacitor array including a plurality of multilayer capacitors arranged continuously in the horizontal direction;
A first metal frame disposed on one side of the capacitor array and connected to first external electrodes of each of the plurality of multilayer capacitors;
A second metal frame disposed on the other side surface of the capacitor array and connected to each of the second external electrodes of the plurality of multilayer capacitors,
The first metal frame includes a first horizontal bonding portion bonded to an upper portion of the first band portion of the plurality of first external electrodes, and a first metal frame arranged to face the first horizontal bonding portion in a vertical direction. A horizontal mounting portion, including a first vertical portion connecting the first horizontal joint portion and the first horizontal mounting portion, and having at least one or more first cutout portions in a horizontal direction;
The second metal frame includes a second horizontal bonding portion that is bonded to an upper portion of the second band portion of the plurality of second external electrodes, and a second metal frame that is disposed to face the second horizontal bonding portion in a vertical direction. A horizontal mounting portion, a second vertical portion connecting the second horizontal joining portion and the second horizontal mounting portion, and having at least one or more second cutouts in a horizontal direction,
An electronic component, wherein the first horizontal mounting portion and the second horizontal mounting portion are arranged so as to be separated from a multilayer capacitor. キャパシタアレイにおいて、第１外部電極又は第２外部電極の第１頭部又は第２頭部の総面積をＡｔ、第１垂直部又は第２垂直部の面積をＡｍと定義する場合、０．２≦Ａｍ／Ａｔ≦０．９を満たす、請求項１に記載の電子部品。   In the capacitor array, if the total area of the first head or the second head of the first external electrode or the second external electrode is defined as At, and the area of the first vertical portion or the second vertical portion is defined as Am, 0.2 The electronic component according to claim 1, which satisfies ≦ Am / At ≦ 0.9. 前記第１金属フレーム及び前記第２金属フレームは、前記第１水平実装部及び前記第２水平実装部に水平方向に少なくとも一つ以上の第３切開部及び第４切開部がそれぞれ形成される、請求項１又は２に記載の電子部品。   In the first metal frame and the second metal frame, at least one or more third cutouts and fourth cutouts are formed in the first horizontal mounting portion and the second horizontal mounting portion, respectively, in a horizontal direction. The electronic component according to claim 1. 前記第１外部電極と前記第１水平接合部及び前記第１垂直部の間に導電性接着部が設けられ、
前記第２外部電極と前記第２水平接合部及び前記第２垂直部の間に導電性接着部が設けられる、請求項１から３のいずれか一項に記載の電子部品。 A conductive adhesive part is provided between the first external electrode and the first horizontal joint part and the first vertical part;
4. The electronic component according to claim 1, wherein a conductive adhesive portion is provided between the second external electrode and the second horizontal junction and the second vertical portion. 5. 前記キャパシタアレイをカプセル化するカプセル部をさらに含み、
前記第１水平実装部及び前記第２水平実装部が前記カプセル部の外に露出する、請求項１から４のいずれか一項に記載の電子部品。 Further comprising a capsule unit for encapsulating the capacitor array,
The electronic component according to claim 1, wherein the first horizontal mounting portion and the second horizontal mounting portion are exposed outside the capsule portion. 前記積層型キャパシタは、本体と、前記本体の両端部にそれぞれ形成される第１外部電極及び第２外部電極と、を含み、
前記本体は、誘電体層と、前記誘電体層を挟んで幅方向に交互に配置される第１内部電極及び第２内部電極と、を含む、請求項１から５のいずれか一項に記載の電子部品。 The multilayer capacitor includes a main body, and first and second external electrodes formed at both ends of the main body, respectively.
6. The body according to claim 1, wherein the main body includes a dielectric layer, and first and second internal electrodes alternately arranged in the width direction with the dielectric layer interposed therebetween. 7. Electronic components. 前記第１外部電極及び前記第２外部電極は、前記本体の両端面にそれぞれ形成される第１頭部及び第２頭部と、前記第１頭部及び前記第２頭部から前記本体の上下面の一部までそれぞれ延長される第１バンド部及び第２バンド部と、をそれぞれ含む、請求項６に記載の電子部品。   The first external electrode and the second external electrode are formed on a first head and a second head formed on both end surfaces of the main body, respectively, and the first external electrode and the second external electrode are formed on the main body from the first head and the second head. The electronic component according to claim 6, further comprising a first band portion and a second band portion each extending to a part of the lower surface. 前記第１垂直部が水平方向にそれぞれの第１頭部の中央部分に位置し、
前記第２垂直部が水平方向にそれぞれの第２頭部の中央部分に位置する、請求項７に記載の電子部品。 The first vertical portion is located at a central portion of each first head in the horizontal direction,
The electronic component according to claim 7, wherein the second vertical portion is located at a central portion of each of the second heads in a horizontal direction. 前記キャパシタアレイが垂直方向に少なくとも２層以上積層される、請求項１から８のいずれか一項に記載の電子部品。   The electronic component according to claim 1, wherein the capacitor array is stacked in at least two layers in a vertical direction. 前記第１垂直部が、上側に位置したキャパシタアレイの第１頭部まで延長され、
前記第２垂直部が、上側に位置したキャパシタアレイの第２頭部まで延長される、請求項９に記載の電子部品。 The first vertical portion extends to a first head of the capacitor array located on the upper side;
The electronic component according to claim 9, wherein the second vertical portion extends to a second head of the capacitor array located on the upper side. 上側に配置されたキャパシタアレイにおいて、第１頭部と第１垂直部との間に導電性接着部が設けられ、第２頭部と第２垂直部との間に導電性接着部が設けられる、請求項１０に記載の電子部品。   In the capacitor array arranged on the upper side, a conductive adhesive portion is provided between the first head and the first vertical portion, and a conductive adhesive portion is provided between the second head and the second vertical portion. The electronic component according to claim 10. 複数の前記キャパシタアレイをカプセル化するカプセル部をさらに含み、
前記第１水平実装部及び前記第２水平実装部が前記カプセル部の外に露出する、請求項９から１１のいずれか一項に記載の電子部品。 Further comprising a capsule unit for encapsulating the plurality of capacitor arrays,
The electronic component according to claim 9, wherein the first horizontal mounting portion and the second horizontal mounting portion are exposed outside the capsule portion. 前記キャパシタアレイが多層多列構造からなる、請求項１から１２のいずれか一項に記載の電子部品。   The electronic component according to claim 1, wherein the capacitor array has a multilayered multi-row structure.
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