CN108281283A - The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor - Google Patents
The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor Download PDFInfo
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- CN108281283A CN108281283A CN201711462950.6A CN201711462950A CN108281283A CN 108281283 A CN108281283 A CN 108281283A CN 201711462950 A CN201711462950 A CN 201711462950A CN 108281283 A CN108281283 A CN 108281283A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 66
- 239000003990 capacitor Substances 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 28
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 20
- 238000003475 lamination Methods 0.000 claims abstract description 17
- 238000005245 sintering Methods 0.000 claims abstract description 15
- 239000002002 slurry Substances 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 8
- 210000001161 mammalian embryo Anatomy 0.000 claims abstract description 7
- 238000007639 printing Methods 0.000 claims abstract description 7
- 238000005266 casting Methods 0.000 claims abstract description 4
- 235000011837 pasties Nutrition 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 238000007650 screen-printing Methods 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims description 15
- 229910002113 barium titanate Inorganic materials 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 229910003781 PbTiO3 Inorganic materials 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 238000007605 air drying Methods 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000009766 low-temperature sintering Methods 0.000 claims description 3
- 229910052706 scandium Inorganic materials 0.000 claims description 3
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000011179 visual inspection Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 11
- 230000008859 change Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000004377 microelectronic Methods 0.000 abstract description 2
- 238000007766 curtain coating Methods 0.000 abstract 1
- 230000005611 electricity Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/306—Stacked capacitors made by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The present invention discloses a kind of manufacturing process and its capacitor packages of vertical type ceramic patch capacitor, belongs to microelectronics technology, technique includes：Dispensing：Raw material are mixed by certain proportioning；Curtain coating：Slurry is formed into one layer of uniform pasty film by casting machine；Printing：Electrode size is printed on porcelain diaphragm by screen printing forme according to technological requirement；Lamination：Porcelain film after printing is built up into different layers of green compact；Lamination：Raw embryo is packed into lamination bag；Cutting：Big block green body after lamination is cut into smaller briquet；Dumping：Briquet after cutting is subjected to dumping；Sintering：Green sintering will be made at porcelain body；Chamfering：The capacitor for sintering porcelain into is gone to the corner angle of product；Sealing end forms end seal ceramic body；It burns end and forms ceramic electrical volume；Achieve the purpose that the shape and electrode direction that change capacitance by changing electrode print technique, cutting method, plating process, installing and using for capacitance in flat package element can be adapted to.
Description
Technical field
The present invention relates to a kind of manufacturing process and its capacitor packages of vertical type ceramic patch capacitor, belong to microelectric technique neck
Domain.
Background technology
Patch capacitor is a kind of microelectronics passive device of maturation, the energy storage or filtering more being applied on circuit, and existing
Its shape and the form of termination electrode are not suitable for encapsulating the vertical peace of interior element when MLCC capacitance applications are in flat package element
Dress mode causes to perplex to the application of capacitance in potted element, and MLCC capacitances perplex caused by installation：Device in potted element
Automation installation is with progress, and routine MLCC capacitance shapes are in long and narrow flat pattern, as shown in fig. 7, upper table faciostenosis
Elongated and because of two end electrodes protuberances make surface irregularity, to cause the snatch rate of automatic welding process extremely low, to lead
Cause the yields of automated production not high, if the artificial load of use load efficiency and accuracy cause anxiety；The end electricity of MLCC capacitances
Pole 7 is located at the both ends of horizontal direction, and as being mounted in potted element, receiving MLCC capacitances need to be outputed on frame to constitute circuit
Notch or increase frame number the piece number, so sacrifice the integrality of frame, reduce the thermal diffusivity and frame and outer layer of product
The binding force of capsulation material.
The manufacturing process of capacitance in currently available technology only for MLCC conventional capacitances manufacturing method, it is vertical
Capacitance is not applicable, and ceramic material is at low cost to be adapted to act as dielectric material, therefore, a kind of manufacturing process of vertical type ceramic patch capacitor
And its capacitor packages become current active demand.
Invention content
The purpose of the present invention is to provide a kind of manufacturing process and its capacitor packages of vertical type ceramic patch capacitor, by changing
Variable electrode printing technology, cutting method, plating process and achieve the purpose that change capacitance shape and electrode direction, can fit
Answer installing and using for capacitance in flat package element.
The manufacturing process of vertical type ceramic patch capacitor of the present invention, includes the following steps：
(1) dispensing：By raw material barium titanate basis powder and corresponding adhesive, solvent, additive by certain proportioning into
Row mixing, stirs evenly to form ceramic slurry；
(2) it is cast：Slurry is formed into one layer of uniform pasty film by casting machine, forms ceramic membrane after heated-air drying
Piece；
(3) it prints：Electrode size is printed on porcelain diaphragm by screen printing forme according to technological requirement；
(4) lamination：Porcelain film after printing is required to build up different layers of green compact according to the dislocation of interior electrode；
(5) it is laminated：Raw embryo is packed into lamination bag, is compressed raw embryo with the mode of isostatic pressed, it is not stratified, form one；
(6) it cuts：The big block green body after lamination, smaller briquet is cut by dicer；
(7) dumping：Briquet after cutting is placed on special load bearing board, be put into baking oven with certain temperature curve into
Row dumping；
(8) it is sintered：Being put into high temperature sintering furnace will make green sintering at porcelain body in a certain temperature conditions；
(9) chamfering：The corner angle that the capacitor for sintering porcelain into is gone to product make its interior electrode fully expose to ensure product
Next step termination procedure and termination electrode connection；
(10) it blocks：It fully connect, makes with the interior electrode of exposure in the capacitor porcelain body both ends coating silver paste after chamfering
Two end forms one layer of termination electrode, and low-temperature sintering is used in combination to form end seal ceramic body；
(11) end is burnt：End seal ceramic body after sealing end, which is put into, to burn in the stove of end keeps it careful with electrode version termination electrode sintering
Contact；Form ceramic electrical volume；
(12) it is electroplated：Last layer guard metal layer is electroplated in ceramic electrical volume electrode tip；
(13) visual inspection：Appearance sorts, and rejects the product of bad order under the microscope；
(14) it tests：Proof voltage, capacitance, DF value loss, leakage current Ir and the insulation resistance Ri of ceramic capacitor are tested,
Reject electrically undesirable product；
(15) packaging and storage：The size and quantity of installation capacitor are according to customer requirement packaging and storage.
Formula for raw stock includes in the step (1)：
The bases barium titanate BaTiO3 (80%-X) powder；Scandium acid bismuth BiScO3 (10%) and lead titanates PbTiO3 (10%) change
Property powder；
Oxide Pb (Ni1/3, Nb2/3) O3(X) it adulterates, wherein 0.05≤X≤0.2.
The thickness of ceramic diaphragm is 10um-30um in the step (2).
The thickness to print electrode in the step (3) determines by electrode size and capacitance, interior thickness of electrode with
Capacitance is proportional.
The number of plies of lamination is determined by capacitance in the step (4)：Capacitance model is identical, electrode material and
In the case of pressure resistance is identical, laminated thickness is proportional with capacitance.
Tmax=390 DEG C of temperature curve -400 DEG C carries out dumping in the step (7).
The material of coating is determined that capacitance applications wire bonding is then by the bonding scheme of capacitance applications in the step (12)
Aluminize (Al) on surface, and then surface gold-plating/silver (Au/Ag) is bonded using wire jumper.
Semiconductor rectifier device is complied with to lightening, miniaturization, surface-pasted development trend, vertical type ceramic patch capacitor
Manufacture craft reaches the shape and electrode direction for changing capacitance by changing electrode print technique, cutting method, plating process
Purpose, installing and using for capacitance in flat package element can be adapted to.
Vertical type ceramic patch capacitor of the present invention, including capacitance ontology, capacitance ontology include upper surface and lower face,
Interior electrode is equipped on the inside of upper surface and lower face, interior electrode includes top electrode and lower electrode, and top electrode and lower electrode are in vertical
Formula interlaced arrangement, and top electrode one end connects upper surface, the other end does not contact lower face, and lower electrode connects lower face, the other end
Do not contact upper surface, metal layer be equipped with outside upper surface and lower face and forms external terminal electrode, termination electrode be parallel to mounting surface and
It is connect with interior electrode.
Groove is etched on the inside of the upper surface of the capacitance ontology and lower face, filling metal forms interior electrode in groove,
It is equipped with dielectric layer in the gap of the interior vertical interlaced arrangement of electrode, capacity effect is formed between dielectric layer and interior electrode.
The dielectric layer is ceramic material, and the outside of capacitance ontology is wrapped up using dielectric ceramic.
Compared with prior art, the present invention having the advantages that：By change electrode print technique, cutting method,
Plating process and achieve the purpose that change capacitance shape and electrode direction, the peace of capacitance in flat package element can be adapted to
Dress uses, and the vertical arrangement of electrode in the lamination of dielectric ceramics package, the termination electrode after surface treatment is located at upper and lower end face, shape
Flakiness shape, the vertical installation of capacitance in ensure that the integrality of frame, provide production without making sacrifices on frame
The binding force of the thermal diffusivity and frame and outer layer capsulation material of product, and the automatic peace of capacitance mounting means and bonding scheme and chip
It fills process compatibility and has saved equipment and the input of manpower without separately setting process, reduce the production effect that working hour improves product
Rate.
Description of the drawings
Fig. 1 is the flow chart of the manufacturing process of vertical type ceramic patch capacitor of the present invention；
Fig. 2 is the sectional view of vertical type ceramic patch capacitor embodiment of the present invention；
Fig. 3 is the stereogram of vertical type ceramic patch capacitor embodiment of the present invention；
Fig. 4 is the external structure of vertical type ceramic patch capacitor embodiment of the present invention；
Fig. 5 is the installation diagram of vertical type ceramic patch capacitor embodiment of the present invention；
Fig. 6 is that vertical ceramic paster capacitance is pacified in synchronous rectification structure in vertical type ceramic patch capacitor embodiment of the present invention
The schematic diagram of dress；
Fig. 7 is the structural schematic diagram of MLCC capacitances in the prior art of the invention；
In figure：1, groove；2, upper surface；3, capacitance ontology；4, dielectric layer；5, lower face；6, interior electrode；7, termination electrode；
8, lead；9, wire jumper；10, the second frame；11, IC chip is controlled；12, MOSFET chips；13, the first frame.
Specific implementation mode
The present invention is further illustrated with reference to the accompanying drawings and examples：
Embodiment 1：
As shown in Figure 1, vertical type ceramic patch capacitor aufbauprinciple is isolated with quiet with dielectric ceramics between electrode 6 in upper and lower
The form storage of electricity and release electric energy, capacity formula are as follows：
C:Capacitance；ε：The dielectric constant of inter-electrode dielectric；K:Dielectric constant (different according to ceramic species)
A:Conductive area；D:4 thickness of dielectric layer (strip thickness)；n：The number of plies (stacking number)；
The manufacturing process of vertical type ceramic patch capacitor of the present invention, includes the following steps：
1) dispensing：By the basic powder of main raw material(s) barium titanate (BaTiO3) and corresponding adhesive, solvent, additive by matching
Side's mixing, stirs evenly to form ceramic slurry；Items proportioning can change because of the capacity and purposes of capacitance, such as BT-BS-PT-
PNN dielectric ceramics, formula for raw stock include：The bases barium titanate BaTiO3 (80%-X) powder；Scandium acid bismuth BiScO3 (10%) and
Lead titanates PbTiO3 (10%) is modified powder；Oxide Pb (Ni1/3Nb2/3) O3(X) it adulterates, wherein 0.05≤X≤0.2, the type
Dielectric ceramic is to improve capacitance low-temperature end temperature stability.
2) it is cast：Slurry is formed into one layer of uniform pasty film by casting machine, forms 10um- after heated-air drying
The ceramic diaphragm of 30um；
3) it prints：6 slurry of interior electrode is printed on porcelain diaphragm by screen printing forme according to technological requirement, is printed electrode
Thickness is determined by 6 slurry of interior electrode and capacitance, identical in capacitance model, under lamination same case (30 layers),
Pressure-resistant (50V) printing its thickness of electrode of nickel electrode is thickened from 0.8um to 1.5um, and capacity then increases to 115nf, interior electricity by 65nf
6 thickness of pole and capacity are proportional；
4) lamination：Porcelain film after printing is required to build up different layers of green compact, the specific number of plies according to the dislocation of interior electrode
It is to be determined such as by capacitance：Identical in capacitance model, electrode material (nickel electrode) and pressure-resistant (50V) are identical
In the case of build up number and increase to 250 layers by 5 layers, capacity then gradually increases to 3.3nf by 0.5pf, and laminated thickness is with capacity at just
The relationship of ratio；
5) it is laminated：Raw embryo is packed into lamination bag, is compressed raw embryo with the mode of isostatic pressed, it is not stratified, form one；
6) it cuts：The big block green body after lamination, smaller briquet is cut by dicer；
7) dumping：Briquet after cutting is placed on special load bearing board, is put into baking oven with certain temperature curve
(Tmax=390 DEG C -400 DEG C) progress dumpings, the organic matters such as removal adhesive green body caused by prevent organic matter from volatilizing are layered
And cracking；
8) it is sintered：Being put into high temperature sintering furnace will make green sintering at porcelain body under the conditions of 1300 DEG C, make it have higher
Mechanical strength and good electric property；
9) chamfering：The corner angle that the capacitor for sintering porcelain into is gone to product make the fully exposure of its interior electrode 6 to ensure product
Next step termination procedure and termination electrode 7 connection；
10) it blocks：It fully connect, makes with the interior electrode 6 of exposure in the capacitor porcelain body both ends coating silver paste after chamfering
Two end forms one layer of termination electrode 7, and low-temperature sintering is used in combination to form end seal ceramic body；
11) end is burnt：End seal ceramic body after sealing end is put into burn in the stove of end, silver or the sintering of copper termination 7 are made into itself and electrode
The careful contact of version；Form ceramic electrical volume；
12) it is electroplated：It is to ensure the solderability of product, ceramic electrical volume electrode tip (copper end or silver-colored end) plating last layer is thin
Thin guard metal layer (aluminium/gold/tin), then aluminize capacitance applications wire bonding (Al) on surface, the surface if using wire jumper bonding
Gold-plated/silver-colored (Au/Ag)；
13) visual inspection：Appearance sorts, and rejects the product of bad order under the microscope；
14) it tests：Test proof voltage, capacitance, DF value loss, leakage current Ir and the insulation resistance Ri of ceramic capacitor
(technique distinguishes the withstand voltage value of capacitance, the accuracy etc. of capacitance) rejects electrically undesirable product；
15) packaging and storage：The size and quantity of installation capacitor are according to customer requirement packaging and storage.
Embodiment 2：
As in Figure 2-4, vertical type ceramic patch capacitor of the present invention, including capacitance ontology 3, capacitance ontology 3 include
The inside of upper surface 2 and lower face 5, upper surface 2 and lower face 5 is equipped with interior electrode 6, and interior electrode 6 includes top electrode and lower electricity
Pole, top electrode and lower electrode are in vertical interlaced arrangement, and top electrode one end connects upper surface 2, and the other end does not contact lower face 5,
Lower electrode connects lower face 5, and the other end does not contact upper surface 2, and upper surface 2 and 5 outside of lower face form outside equipped with metal layer
Termination electrode 7, termination electrode 7 are parallel to mounting surface and are connect with interior electrode 6.
In order to further illustrate above-described embodiment, the upper surface 2 and 5 inside of lower face of capacitance ontology 3 etch groove 1, ditch
Filling metal forms interior electrode 6 in slot 1, and dielectric layer 4, dielectric layer 4 and interior electricity are equipped in the gap of 6 vertical interlaced arrangement of interior electrode
Capacity effect is formed between pole 6.
In order to further illustrate above-described embodiment, dielectric layer 4 is ceramic material, and the outside of capacitance ontology 3 is made pottery using dielectric
Porcelain wraps up.
The operation principle of embodiment 2 is：As shown in figure 4, device mounting design is to adapt to small thin outline package, interior device
Installation is in movement in vertical direction in a manner of automatic positioning, also this requires the termination electrode of capacitance answers parallel mounting surface, and MLCC
The termination electrode of capacitance be by vertically with mounting surface in the form of install, if by its vertically-arranged height again will exceed package thickness, so
Capacitance of the present invention uses vertical installation form, in order to the installation of vertical direction.
As shown in figure 5, device bonding pattern designs：Wherein bonding refers to by vertical type ceramic patch capacitor and external cabling
The mode of connection, form leaded (wires) bonding of bonding and wire jumper (clip) is held to be bonded two kinds, wherein wire bonding mode
It is by the 7 external connection lead 8 of termination electrode of vertical type ceramic patch capacitor, wire jumper (clip) bonding pattern is by vertical type ceramic patch
The 7 external connection wire jumper 9 of termination electrode of capacitance, installation form is the movement of vertical direction, is answered this requires termination electrode 7 is parallel
Be bonded that direction is vertical, therefore be located at the form of vertical type ceramic patch capacitor upper and lower ends face using two end electrodes 7 so as to vertical
The installation and bonding of ceramic paster capacitance.
As shown in fig. 6, vertical type ceramic patch capacitor is installed in synchronous rectification structure, synchronous rectification structure is by MOSFET
Chip 12, control IC chip 11, the first frame 13, the second frame 10, capacitance ontology 3 and bonding line welding fabrication post package are in modeling
Envelope is internal, to constitute an entirety, when installation, 12 back side of MOSFET chips is combined with the first frame 13, control IC chip
Termination electrode 7 on 11 back sides and the lower face of capacitance ontology 35 is bonded with the second frame 10, passes through automatic welding process tack welding
It connecing, the termination electrode 7 on the upper surface 2 of capacitance ontology 3 constitutes circuit by the form connection control IC chip 11 of wire bonding, after
The device for being bonded completion is molded by molding process plastic packaging；Since the vertical installation of capacitance ontology, nothing are not necessarily in
It makes sacrifices on frame, ensure that the integrality of frame, improve the thermal diffusivity and frame and outer layer capsulation material of product
Binding force, and capacitance mounting bonding form is compatible with the automatic installation procedure of chip, without separately setting process, has saved equipment and people
The input of power reduces the production efficiency that working hour improves product.
Using the vertical type ceramic patch capacitor of the embodiment of the present invention described above in association with attached drawing manufacturing process and its
Capacitor packages reach the shape and electrode direction for changing capacitance by changing electrode print technique, cutting method, plating process
Purpose, installing and using for capacitance in flat package element can be adapted to.But the present invention is not limited to described embodiment party
Formula, without departing from the principles and spirit of the present invention these variation, modification, replacement and deformations that embodiment is carried out
It still falls in protection scope of the present invention.
Claims (10)
1. a kind of manufacturing process of vertical type ceramic patch capacitor, it is characterised in that：The technique includes the following steps：
(1) dispensing：Raw material barium titanate basis powder is mixed with corresponding adhesive, solvent, additive by certain proportioning
It closes, stirs evenly to form ceramic slurry；
(2) it is cast：Slurry is formed into one layer of uniform pasty film by casting machine, forms ceramic diaphragm after heated-air drying；
(3) it prints：Interior electrode (6) slurry is printed on porcelain diaphragm by screen printing forme according to technological requirement；
(4) lamination：Porcelain film after printing is required to build up different layers of green compact according to the dislocation of interior electrode；
(5) it is laminated：Raw embryo is packed into lamination bag, is compressed raw embryo with the mode of isostatic pressed, it is not stratified, form one；
(6) it cuts：The big block green body after lamination, smaller briquet is cut by dicer；
(7) dumping：Briquet after cutting is placed on special load bearing board, is put into baking oven and is arranged with certain temperature curve
Glue；
(8) it is sintered：Being put into high temperature sintering furnace will make green sintering at porcelain body in a certain temperature conditions；
(9) chamfering：The corner angle that the capacitor for sintering porcelain into is gone to product make the fully exposure of its interior electrode (6) to ensure product
Next step termination procedure and termination electrode (7) connection；
(10) it blocks：It is fully connect with the interior electrode (6) of exposure in the capacitor porcelain body both ends coating silver paste after chamfering, makes it
Two ends form one layer of termination electrode (7), and low-temperature sintering is used in combination to form end seal ceramic body；
(11) end is burnt：End seal ceramic body after sealing end, which is put into, to burn in the stove of end keeps it careful with electrode version termination electrode (7) sintering
Contact；Form ceramic electrical volume；
(12) it is electroplated：Last layer guard metal layer is electroplated in ceramic electrical volume electrode tip；
(13) visual inspection：Appearance sorts, and rejects the product of bad order under the microscope；
(14) it tests：Proof voltage, capacitance, DF value loss, leakage current Ir and the insulation resistance Ri for testing ceramic capacitor, are rejected
Electrical undesirable product；
(15) packaging and storage：The size and quantity of installation capacitor are according to customer requirement packaging and storage.
2. the manufacturing process of vertical type ceramic patch capacitor according to claim 1, it is characterised in that：The step (1)
Middle formula for raw stock includes：The bases barium titanate BaTiO3 (80%-X) powder；Scandium acid bismuth BiScO3 (10%) and lead titanates
PbTiO3 (10%) is modified powder；Oxide Pb (Ni1/3, Nb2/3) O3(X) it adulterates, wherein 0.05≤X≤0.2.
3. the manufacturing process of vertical type ceramic patch capacitor according to claim 1, it is characterised in that：The step (2)
The thickness of middle ceramic diaphragm is 10um-30um.
4. the manufacturing process of vertical type ceramic patch capacitor according to claim 1, it is characterised in that：The step (3)
In the thickness that prints electrode determined by interior electrode (6) slurry and capacitance, interior electrode (6) thickness pass directly proportional to capacitance
System.
5. the manufacturing process of vertical type ceramic patch capacitor according to claim 1, it is characterised in that：The step (4)
The number of plies of middle lamination is determined by capacitance：In the situation that capacitance model is identical, interior electrode (6) material and pressure resistance are identical
Under, laminated thickness is proportional with capacitance.
6. the manufacturing process of vertical type ceramic patch capacitor according to claim 1, it is characterised in that：The step (7)
Tmax=390 DEG C of middle temperature curve -400 DEG C carries out dumping.
7. the manufacturing process of vertical type ceramic patch capacitor according to claim 1, it is characterised in that：The step (12)
The material of middle coating is determined that then aluminize capacitance applications wire bonding (Al) on surface, using wire jumper by the bonding scheme of capacitance applications
It is bonded then surface gold-plating/silver (Au/Ag).
8. a kind of vertical type ceramic patch capacitor is applied to the manufacture of any vertical type ceramic patch capacitors of claim 1-7
Technique, it is characterised in that：Including capacitance ontology (3), capacitance ontology (3) includes upper surface (2) and lower face (5), upper surface (2)
With interior electrode (6) is equipped on the inside of lower face (5), interior electrode (6) includes top electrode and lower electrode, and top electrode and lower electrode are in
Vertical interlaced arrangement, and top electrode one end connection upper surface (2), the other end do not contact lower face (5), and lower electrode connects lower face
(5), the other end does not contact upper surface (2), and metal layer is equipped with outside upper surface (2) and lower face (5) and forms external terminal electrode
(7), termination electrode (7) is parallel to mounting surface and is connect with interior electrode (6).
9. vertical type ceramic patch capacitor according to claim 8, it is characterised in that：The upper end of the capacitance ontology (3)
Etching groove (1) on the inside of face (2) and lower face (5), the interior filling metal of groove (1) form interior electrode (6), and interior electrode (6) is vertical
It is equipped with dielectric layer (4) in the gap of interlaced arrangement, capacity effect is formed between dielectric layer (4) and interior electrode (6).
10. vertical type ceramic patch capacitor according to claim 8, it is characterised in that：The dielectric layer (4) is ceramic material
It is wrapped up using dielectric ceramic the outside of material, capacitance ontology (3).
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| CN113161149A (en) * | 2021-04-26 | 2021-07-23 | 深圳市三炎科电子科技有限公司 | Production method of MLCC (multilayer ceramic capacitor) patch capacitor with crack-resistant design |
| CN114050053A (en) * | 2021-11-16 | 2022-02-15 | 莫纶(珠海)新材料科技有限公司 | Preparation method of flexible ceramic film capacitor |
| CN114152847A (en) * | 2021-11-30 | 2022-03-08 | 伊默维科技有限公司 | Electricity taking structure of high-voltage ceramic capacitor and manufacturing method thereof |
| CN115572171A (en) * | 2022-10-08 | 2023-01-06 | 广东微容电子科技有限公司 | Cutting and glue discharging process of chip type high-capacity multilayer ceramic capacitor |
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Application publication date: 20180713 |