JP2020021769A - 載置台機構、処理装置及び載置台機構の動作方法 - Google Patents
載置台機構、処理装置及び載置台機構の動作方法 Download PDFInfo
- Publication number
- JP2020021769A JP2020021769A JP2018142579A JP2018142579A JP2020021769A JP 2020021769 A JP2020021769 A JP 2020021769A JP 2018142579 A JP2018142579 A JP 2018142579A JP 2018142579 A JP2018142579 A JP 2018142579A JP 2020021769 A JP2020021769 A JP 2020021769A
- Authority
- JP
- Japan
- Prior art keywords
- mounting table
- electrostatic chuck
- table mechanism
- back surface
- ground potential
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本開示の一実施形態に係る処理装置について、基板の一例である半導体ウエハ(以下「ウエハ」という。)の表面に対して傾斜して配置されたターゲット材からウエハにスパッタ粒子を放射させることによりウエハに膜を形成するスパッタ装置を例に挙げて説明する。図1は、処理装置の構成例を示す断面図である。
図1の処理装置10における載置台機構100の一例について説明する。図2は、載置台機構100の一例を示す断面図である。図2では、複数の昇降ピンのうちの1つが設けられている部分を拡大して示す。なお、他の昇降ピンが設けられている部分についても同様である。図3は、静電チャック114の一例を示す平面図である。図4は、静電チャック114の一部を拡大して示す斜視図であり、図3における領域Aを拡大して示す。図5は、静電チャック114の一部を拡大して示す平面図であり、図3における領域Bを拡大して示す。図6は、静電チャック114の表面に形成された導電膜とチャック電極114aとの位置関係の説明図である。
上記の処理装置10の載置台機構100の動作方法について、静電チャック114の吸着面に吸着されたウエハWを昇降ピン136で持ち上げて吸着面から離間させるときの動作を例に挙げて説明する。
12 処理容器
12c 突起部
12d 弾性体
100 載置台機構
110 載置台
114 静電チャック
114a チャック電極
114f シールバンド
114g 除電部
114h 接触部
120 導電部材
130 昇降ピン機構
134 シャフト
136 昇降ピン
138 接続部材
140 押圧部材
W ウエハ
Claims (12)
- 基板の裏面と電気的に接触可能な導電膜が表面に形成された静電チャックと、
前記導電膜と電気的に接続され、前記静電チャックの裏面まで這いまわされた導電部材と、
前記導電部材に接続部材を介して電気的に接続され、接地電位に接続される位置と接続されない位置との間で移動可能な移動部材と、
を有する、
載置台機構。 - 当該載置台機構は、処理容器内に設けられており、
前記接地電位に接続される位置は、前記処理容器と電気的に接続される位置であり、
前記接地電位に接続されない位置は、前記処理容器と電気的に絶縁される位置である、
請求項1に記載の載置台機構。 - 前記導電膜は、前記静電チャックの吸着面に、前記静電チャックの中心部から径方向に沿って外縁部までライン状に延びて形成されている、
請求項1又は2に記載の載置台機構。 - 前記静電チャックは、一対のチャック電極を有する双曲型であり、
前記導電膜は、平面視で、一方のチャック電極と重なり、他方のチャック電極と重ならない位置に形成されている、
請求項1乃至3のいずれか一項に記載の載置台機構。 - 前記導電部材を前記導電膜に押圧する押圧部材を有する、
請求項1乃至4のいずれか一項に記載の載置台機構。 - 前記移動部材には、前記基板の裏面と接触可能な昇降ピンが取り付けられており、
前記移動部材は、前記接地電位に接続される位置において前記昇降ピンと前記基板の裏面とが接触し、前記接地電位に接続されない位置において前記昇降ピンと前記基板の裏面とが離間する、
請求項1乃至5のいずれか一項に記載の載置台機構。 - 前記接続部材は、弾性体である、
請求項1乃至6のいずれか一項に記載の載置台機構。 - 前記弾性体は、コイルバネである、
請求項7に記載の載置台機構。 - 処理容器と、
前記処理容器内に設けられ、基板を載置する載置台機構と、
を備え、
前記載置台機構は、
基板の裏面と電気的に接触可能な導電膜が表面に形成された静電チャックと、
前記導電膜と電気的に接続され、前記静電チャックの裏面まで這いまわされた導電部材と、
前記導電部材に接続部材を介して電気的に接続され、接地電位に接続される位置と接続されない位置との間で移動可能な移動部材と、
を有する、
処理装置。 - 前記処理容器の底部に設けられ、上下に移動可能な導電性の突起部を備え、
前記接地電位に接続される位置は、前記移動部材と前記突起部とが接触する位置であり、
前記接地電位に接続されない位置は、前記移動部材と前記突起部とが離間する位置である、
請求項9に記載の処理装置。 - 前記接続部材は、第1の弾性体により形成されており、
前記突起部は、第2の弾性体の弾性変形により上下に移動可能であり、
前記第2の弾性体の反力は、前記第1の弾性体の反力よりも大きい、
請求項10に記載の処理装置。 - 基板の裏面と電気的に接触可能な導電膜が表面に形成された静電チャックと、
前記導電膜と電気的に接続され、前記静電チャックの裏面まで這いまわされた導電部材と、
前記導電部材に接続部材を介して電気的に接続され、接地電位に接続される位置と接続されない位置との間で移動可能な移動部材と、
前記移動部材に取り付けられ、前記基板の裏面と接触可能な昇降ピンと、
を有する載置台機構の動作方法であって、
前記移動部材を前記接地電位に接続される位置に移動させた後、前記昇降ピンを前記基板の裏面に接触させる、
載置台機構の動作方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018142579A JP7170449B2 (ja) | 2018-07-30 | 2018-07-30 | 載置台機構、処理装置及び載置台機構の動作方法 |
TW108125068A TW202021031A (zh) | 2018-07-30 | 2019-07-16 | 載台機構、處理裝置及載台機構的動作方法 |
KR1020190086867A KR102281719B1 (ko) | 2018-07-30 | 2019-07-18 | 적재대 기구, 처리 장치 및 적재대 기구의 동작 방법 |
US16/521,042 US11282733B2 (en) | 2018-07-30 | 2019-07-24 | Stage mechanism, processing apparatus, and method of operating the stage mechanism |
CN201910675192.9A CN110783242B (zh) | 2018-07-30 | 2019-07-25 | 载置台装置、处理装置和载置台装置的操作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018142579A JP7170449B2 (ja) | 2018-07-30 | 2018-07-30 | 載置台機構、処理装置及び載置台機構の動作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020021769A true JP2020021769A (ja) | 2020-02-06 |
JP7170449B2 JP7170449B2 (ja) | 2022-11-14 |
Family
ID=69178594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018142579A Active JP7170449B2 (ja) | 2018-07-30 | 2018-07-30 | 載置台機構、処理装置及び載置台機構の動作方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11282733B2 (ja) |
JP (1) | JP7170449B2 (ja) |
KR (1) | KR102281719B1 (ja) |
CN (1) | CN110783242B (ja) |
TW (1) | TW202021031A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113084731B (zh) * | 2021-04-21 | 2023-12-05 | 广州得尔塔影像技术有限公司 | 旋转式吸取装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004014868A (ja) * | 2002-06-07 | 2004-01-15 | Tokyo Electron Ltd | 静電チャック及び処理装置 |
JP2004022889A (ja) * | 2002-06-18 | 2004-01-22 | Anelva Corp | 静電吸着装置 |
WO2006049085A1 (ja) * | 2004-11-04 | 2006-05-11 | Ulvac, Inc. | 静電チャック装置 |
JP2009164620A (ja) * | 2009-02-13 | 2009-07-23 | Canon Anelva Corp | スパッタリング装置 |
JP2010177686A (ja) * | 2010-03-24 | 2010-08-12 | Ebara Corp | ウェハのチャッキング装置およびチャッキング方法 |
JP2013098276A (ja) * | 2011-10-31 | 2013-05-20 | Canon Anelva Corp | 基板ホルダー及び真空処理装置 |
JP2013098277A (ja) * | 2011-10-31 | 2013-05-20 | Canon Anelva Corp | 基板ホルダー及び真空処理装置 |
JP2014075372A (ja) * | 2010-12-27 | 2014-04-24 | Canon Anelva Corp | 静電吸着装置 |
JP2017134882A (ja) * | 2014-04-24 | 2017-08-03 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置及びその帯電除去方法 |
JP2018074164A (ja) * | 2016-11-04 | 2018-05-10 | アドバンスト イオン ビーム テクノロジー インクAdvanced Ion Beam Technology Inc. | ウェーハとチャックとの相対的関係を監視する装置および方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251374A (en) | 1975-10-24 | 1977-04-25 | Rikagaku Kenkyusho | Preparation of pyrimidine nucleosides |
JP3082624B2 (ja) * | 1994-12-28 | 2000-08-28 | 住友金属工業株式会社 | 静電チャックの使用方法 |
KR100511854B1 (ko) * | 2002-06-18 | 2005-09-02 | 아네르바 가부시키가이샤 | 정전 흡착 장치 |
US7292428B2 (en) * | 2005-04-26 | 2007-11-06 | Applied Materials, Inc. | Electrostatic chuck with smart lift-pin mechanism for a plasma reactor |
JP4634992B2 (ja) * | 2005-11-04 | 2011-02-16 | 株式会社ニューフレアテクノロジー | 位置計測装置及び位置ずれ量計測方法 |
JP4808676B2 (ja) * | 2007-05-30 | 2011-11-02 | 株式会社日立ハイテクノロジーズ | 露光装置、露光方法、及び表示用パネル基板の製造方法 |
CN103222043B (zh) | 2010-09-08 | 2016-10-12 | 恩特格林斯公司 | 一种高传导静电夹盘 |
US8804299B2 (en) * | 2011-02-14 | 2014-08-12 | Applied Materials Israel, Ltd. | Electrostatic chuck and a method for supporting a wafer |
JP6018606B2 (ja) * | 2014-06-27 | 2016-11-02 | 東京エレクトロン株式会社 | 温度制御可能なステージを含むシステム、半導体製造装置及びステージの温度制御方法 |
US9595464B2 (en) | 2014-07-19 | 2017-03-14 | Applied Materials, Inc. | Apparatus and method for reducing substrate sliding in process chambers |
CN107431040B (zh) * | 2015-04-15 | 2020-10-16 | 株式会社爱发科 | 吸附装置、真空处理装置 |
JP6877133B2 (ja) * | 2016-03-28 | 2021-05-26 | 株式会社日立ハイテク | プラズマ処理装置およびプラズマ処理方法 |
-
2018
- 2018-07-30 JP JP2018142579A patent/JP7170449B2/ja active Active
-
2019
- 2019-07-16 TW TW108125068A patent/TW202021031A/zh unknown
- 2019-07-18 KR KR1020190086867A patent/KR102281719B1/ko active IP Right Grant
- 2019-07-24 US US16/521,042 patent/US11282733B2/en active Active
- 2019-07-25 CN CN201910675192.9A patent/CN110783242B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004014868A (ja) * | 2002-06-07 | 2004-01-15 | Tokyo Electron Ltd | 静電チャック及び処理装置 |
JP2004022889A (ja) * | 2002-06-18 | 2004-01-22 | Anelva Corp | 静電吸着装置 |
WO2006049085A1 (ja) * | 2004-11-04 | 2006-05-11 | Ulvac, Inc. | 静電チャック装置 |
JP2009164620A (ja) * | 2009-02-13 | 2009-07-23 | Canon Anelva Corp | スパッタリング装置 |
JP2010177686A (ja) * | 2010-03-24 | 2010-08-12 | Ebara Corp | ウェハのチャッキング装置およびチャッキング方法 |
JP2014075372A (ja) * | 2010-12-27 | 2014-04-24 | Canon Anelva Corp | 静電吸着装置 |
JP2013098276A (ja) * | 2011-10-31 | 2013-05-20 | Canon Anelva Corp | 基板ホルダー及び真空処理装置 |
JP2013098277A (ja) * | 2011-10-31 | 2013-05-20 | Canon Anelva Corp | 基板ホルダー及び真空処理装置 |
JP2017134882A (ja) * | 2014-04-24 | 2017-08-03 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置及びその帯電除去方法 |
JP2018074164A (ja) * | 2016-11-04 | 2018-05-10 | アドバンスト イオン ビーム テクノロジー インクAdvanced Ion Beam Technology Inc. | ウェーハとチャックとの相対的関係を監視する装置および方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110783242A (zh) | 2020-02-11 |
JP7170449B2 (ja) | 2022-11-14 |
TW202021031A (zh) | 2020-06-01 |
US20200035537A1 (en) | 2020-01-30 |
US11282733B2 (en) | 2022-03-22 |
KR20200013590A (ko) | 2020-02-07 |
KR102281719B1 (ko) | 2021-07-23 |
CN110783242B (zh) | 2023-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10340174B2 (en) | Mounting table and plasma processing apparatus | |
JP5323317B2 (ja) | 静電チャック方法 | |
JP5948026B2 (ja) | 半導体製造装置及び処理方法 | |
TWI748009B (zh) | 電漿處理裝置 | |
US20150010381A1 (en) | Wafer processing chamber and method for transferring wafer in the same | |
JP4354983B2 (ja) | 基板処理設備 | |
TWI725067B (zh) | 可旋轉靜電夾盤 | |
JP5071437B2 (ja) | プラズマ処理装置及びプラズマ処理装置におけるトレイの載置方法 | |
TWI493650B (zh) | 銷升降系統 | |
JP6978840B2 (ja) | 基板処理装置および基板保持装置 | |
US20190304824A1 (en) | Plasma processing apparatus and method of transferring workpiece | |
TW201705264A (zh) | 減壓處理裝置 | |
CN112563186A (zh) | 基片支承器和等离子体处理装置 | |
JP2024075697A (ja) | 基板支持器及びプラズマ処理装置 | |
JP2020021769A (ja) | 載置台機構、処理装置及び載置台機構の動作方法 | |
JP2008041969A (ja) | 基板の脱離方法 | |
JP4961179B2 (ja) | 基板処理装置及び半導体装置の製造方法 | |
KR102496166B1 (ko) | 정전척을 구비한 기판처리장치 | |
JP2004040047A (ja) | 処理装置及び静電チャックからの被吸着体の脱離方法 | |
JP2007073568A (ja) | プラズマ処理装置 | |
US20230386798A1 (en) | Substrate processing apparatus and method for aligning ring member | |
KR20080061109A (ko) | 정전척 어셈블리 및 이를 갖는 막 형성 장치 | |
KR102277816B1 (ko) | 기판 처리 장치 | |
JP4860078B2 (ja) | プラズマ処理装置及びプラズマ処理方法 | |
JP5090281B2 (ja) | 基板電位測定装置及び基板電位測定方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210510 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220421 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220510 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220624 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221004 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221101 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7170449 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |