JP2019188552A - Cutting device - Google Patents
Cutting device Download PDFInfo
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- JP2019188552A JP2019188552A JP2018085242A JP2018085242A JP2019188552A JP 2019188552 A JP2019188552 A JP 2019188552A JP 2018085242 A JP2018085242 A JP 2018085242A JP 2018085242 A JP2018085242 A JP 2018085242A JP 2019188552 A JP2019188552 A JP 2019188552A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 186
- 239000007788 liquid Substances 0.000 claims abstract description 153
- 239000002699 waste material Substances 0.000 claims abstract description 72
- 238000000926 separation method Methods 0.000 claims abstract description 29
- 238000011084 recovery Methods 0.000 claims abstract description 26
- 239000002173 cutting fluid Substances 0.000 claims description 92
- 239000012530 fluid Substances 0.000 claims description 3
- 239000003570 air Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000012080 ambient air Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Auxiliary Devices For Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Abstract
Description
本発明は、被加工物を保持する保持テーブルと、該保持テーブルで保持された被加工物を切削する切削ブレードと、を備えた切削装置に関する。 The present invention relates to a cutting apparatus that includes a holding table that holds a workpiece and a cutting blade that cuts the workpiece held by the holding table.
デバイスチップの製造工程では、半導体ウェーハやパッケージ基板、セラミックス基板、ガラス基板等の基板の表面に複数の交差する切削予定ライン（ストリート）が設定され、切削予定ラインで区画された各領域にデバイスが設けられる。デバイスが設けられた基板を切削予定ラインに沿って切削して分割すると、個々のデバイスチップが形成される。 In the manufacturing process of device chips, a plurality of intersecting cutting lines (streets) are set on the surface of a substrate such as a semiconductor wafer, a package substrate, a ceramic substrate, or a glass substrate, and a device is placed in each area defined by the cutting lines. Provided. When the substrate on which the device is provided is cut along a planned cutting line and divided, individual device chips are formed.
該基板の切削には、例えば、切削ブレードを備える切削装置が使用される。切削装置は、基板等の被加工物を保持する保持テーブルと、保持テーブルに保持された被加工物を切削する切削ユニットと、を備える。切削ユニットには、砥粒が埋め込まれた砥石部を含む円環状の切削ブレードが装着されている。切削ブレードを回転させ、切削ブレードを所定の高さ位置に位置づけ、切削ブレードに向けて保持テーブルを水平方向に移動させると、被加工物が切削される。 For example, a cutting device including a cutting blade is used for cutting the substrate. The cutting apparatus includes a holding table that holds a workpiece such as a substrate, and a cutting unit that cuts the workpiece held on the holding table. The cutting unit is equipped with an annular cutting blade including a grindstone portion in which abrasive grains are embedded. When the cutting blade is rotated, the cutting blade is positioned at a predetermined height, and the holding table is moved in the horizontal direction toward the cutting blade, the workpiece is cut.
被加工物を切削すると、被加工物から切削屑が生じて飛散する。また、切削ブレード及び被加工物の摩擦により熱が生じる。そこで、被加工物を切削ブレードで切削する際には、切削屑や熱を排除するために、切削ブレード及び被加工物に切削液が供給される。しかし、切削屑を含む切削廃液が迅速に排出されず被加工物の上面に切削屑が付着する場合がある。 When the workpiece is cut, cutting waste is generated and scattered from the workpiece. Also, heat is generated by friction between the cutting blade and the workpiece. Therefore, when cutting the workpiece with a cutting blade, a cutting fluid is supplied to the cutting blade and the workpiece in order to eliminate cutting waste and heat. However, cutting waste liquid containing cutting waste may not be discharged quickly, and cutting waste may adhere to the upper surface of the workpiece.
特に、被加工物がＣＣＤ（チャージ・カップルド・デバイス）やＣ−ＭＯＳ（コンプリメンタリ・メタル・オキサイド・セミコンダクタ）等の撮像素子である場合、被加工物の切削屑に対する接着力が強い。そのため、被加工物の切削が完了した後に該被加工物を洗浄しても、切削屑を十分に除去できない。その上、該撮像素子の場合、切削屑の残留がデバイス不良に直結するため、特に問題が深刻となる。 In particular, when the workpiece is an image sensor such as a CCD (Charge Coupled Device) or C-MOS (Complementary Metal Oxide Semiconductor), the adhesion of the workpiece to the cutting waste is strong. Therefore, even if the workpiece is washed after the workpiece has been cut, the cutting waste cannot be removed sufficiently. In addition, in the case of the image pickup device, since the residue of cutting waste is directly connected to a device failure, the problem becomes particularly serious.
そこで、切削ユニットに廃液回収ユニットが配設され、該廃液回収ユニットにより切削廃液が直ちに回収される切削装置が開発されている（特許文献１参照）。該廃液回収ユニットは、一端が切削ブレード近傍に設けられた廃液回収口に接続された排液路を備える。該廃液回収口は、切削ブレードの回転により切削廃液が飛散する方向に設けられており、該切削廃液は該廃液回収口に飛散して回収される。 Accordingly, a cutting apparatus has been developed in which a waste liquid recovery unit is disposed in the cutting unit, and the cutting liquid is immediately recovered by the waste liquid recovery unit (see Patent Document 1). The waste liquid recovery unit includes a drain path connected at one end to a waste liquid recovery port provided near the cutting blade. The waste liquid recovery port is provided in a direction in which the cutting waste liquid is scattered by the rotation of the cutting blade, and the cutting waste liquid is scattered and recovered to the waste liquid recovery port.
さらに、該排液路の他端側に吸引源を備える廃液回収ユニットを含む切削装置が開発されている（特許文献２参照）。その上、切削ユニットから周囲への切削廃液の飛散を抑制するために、切削ブレードを覆うブレードカバーを備える切削ユニットを含む切削装置が開発されている（特許文献３参照）。 Furthermore, a cutting apparatus including a waste liquid recovery unit having a suction source on the other end side of the drainage path has been developed (see Patent Document 2). In addition, in order to suppress scattering of cutting waste liquid from the cutting unit to the surroundings, a cutting apparatus including a cutting unit including a blade cover that covers the cutting blade has been developed (see Patent Document 3).
吸引源を備える廃液回収ユニットでは、吸引源による吸引時に周囲の空気を取り込んでしまい、吸引源の吸引能力が該空気の吸引に割かれて切削液に作用する吸引力が低下することがある。吸引力が低下すると、十分に切削液を吸引できないばかりでなく、一度は吸引路に進入した切削液が逆流する場合もある。切削液が逆流すると被加工物の表面に切削屑を含む切削液が飛散し、被加工物に切削屑が付着するおそれがある。 In a waste liquid recovery unit including a suction source, ambient air is taken in during suction by the suction source, and the suction capability of the suction source may be divided by the suction of the air, and the suction force acting on the cutting fluid may be reduced. When the suction force decreases, not only the cutting fluid can be sufficiently sucked, but also the cutting fluid that has entered the suction path may flow backward. When the cutting fluid flows backward, the cutting fluid containing cutting waste scatters on the surface of the workpiece, and the cutting waste may adhere to the workpiece.
空気の取り込みにより割かれる吸引能力を補うために、より大きな吸引能力を有する吸引源を排液路に接続することも考えられるが、吸引能力の高い吸引源は高価である上、装置構成が大型となる。 In order to compensate for the suction ability that is broken by the intake of air, it is conceivable to connect a suction source having a larger suction ability to the drainage channel, but a suction source with a high suction ability is expensive and has a large apparatus configuration. It becomes.
本発明はかかる問題に鑑みてなされたものであり、その目的とするところは、装置を大型化することなく効率よく切削廃液を被加工物上から排出できる切削装置を提供することである。 This invention is made | formed in view of this problem, The place made into the objective is providing the cutting device which can discharge | emit cutting waste liquid from a workpiece efficiently, without enlarging an apparatus.
本発明の一態様によれば、被加工物を保持する保持テーブルと、該保持テーブルで保持された被加工物を切削する切削ブレードと、を備えた切削装置であって、天井部と、該天井部から下垂した側壁部と、を有し、該切削ブレードの一部を覆うように配設されたブレードカバーと、該切削ブレードに切削液を供給する切削液供給手段と、該切削ブレードに供給された切削液が該切削ブレードの回転に伴って飛散する領域に配設され該切削液を該切削ブレードの周囲の一部の気体とともに回収する廃液回収手段と、を備え、該廃液回収手段は、該廃液回収手段に到達する該切削液と、該気体と、を分離させる気液分離部と、該気液分離部で分離された該切削液の排出経路となる液体排出路と、該気液分離部で分離された該気体の排出経路となる気体排出路と、を備え、該切削液の排出先となる該液体排出路の一端には液体排出用吸引源が接続されていることを特徴とする切削装置が提供される。 According to one aspect of the present invention, there is provided a cutting device comprising a holding table that holds a workpiece, and a cutting blade that cuts the workpiece held by the holding table, the ceiling portion; A blade cover provided to cover a part of the cutting blade, a cutting fluid supply means for supplying a cutting fluid to the cutting blade, and a cutting blade A waste liquid collecting means disposed in a region where the supplied cutting liquid is scattered as the cutting blade rotates, and collecting the cutting liquid together with a part of the gas around the cutting blade, the waste liquid collecting means Is a gas-liquid separation part that separates the cutting liquid that reaches the waste liquid recovery means and the gas, a liquid discharge path that is a discharge path for the cutting liquid separated by the gas-liquid separation part, and It becomes the discharge route of the gas separated by the gas-liquid separation part Comprising a body discharge passage, the cutting device at one end of the liquid discharge passage becomes a discharge destination of the cutting fluid, characterized in that for discharging liquid suction source is connected is provided.
好ましくは、該気液分離部は、該廃液回収手段に到達した切削液が該気体排出路に流入することを防止する流入規制板を備える。また、好ましくは、該気体排出路は、該気体の排出先となる一端に気体排出用吸引源が接続されている。 Preferably, the gas-liquid separation unit includes an inflow restricting plate that prevents the cutting fluid that has reached the waste liquid collecting means from flowing into the gas discharge path. Preferably, in the gas discharge path, a gas discharge suction source is connected to one end of the gas discharge path.
さらに、好ましくは、該ブレードカバーは、該側壁部から連続して形成され該天井部に対面する底部を有し、該底部は、ブレードカバーの内外に通じる貫通孔を有し、該切削ブレードは、該貫通孔を通じて先端が該ブレードカバーの外部に突出する。 Further preferably, the blade cover has a bottom portion formed continuously from the side wall portion and facing the ceiling portion, and the bottom portion has a through hole communicating with the inside and outside of the blade cover, and the cutting blade is The tip projects out of the blade cover through the through hole.
本発明の一態様に係る切削装置は、切削ブレードに供給された切削液を回収する廃液回収手段を備え、切削ブレードに供給された切削液は切削ブレードの回転に伴って該廃液回収手段に飛散する。このとき、切削液は、周囲の空気を取り込んで該廃液回収手段に到達する。ここで、廃液回収手段は気液分離部を備えるため、該廃液回収手段に到達する切削液と、気体と、は該気液分離部により分離される。 A cutting apparatus according to an aspect of the present invention includes a waste liquid collecting unit that collects cutting fluid supplied to a cutting blade, and the cutting fluid supplied to the cutting blade is scattered to the waste liquid collecting unit as the cutting blade rotates. To do. At this time, the cutting fluid takes in ambient air and reaches the waste liquid collecting means. Here, since the waste liquid recovery means includes a gas-liquid separation unit, the cutting fluid and the gas that reach the waste liquid recovery means are separated by the gas-liquid separation part.
廃液回収手段は、切削液の排出経路となる液体排出路と、気体の排出経路となる気体排出路と、をさらに備え、液体排出路からは切削液が排出され、気体排出路からは該気体が排出される。切削液の排出経路となる液体排出路の一端には吸引源が接続されているが、該吸引源には気体は到達しにくく主に切削液が到達するため、気体の吸引に起因する吸引源の吸引能力の損失は小さくなる。 The waste liquid recovery means further includes a liquid discharge path serving as a cutting fluid discharge path and a gas discharge path serving as a gas discharge path. The cutting liquid is discharged from the liquid discharge path, and the gas is discharged from the gas discharge path. Is discharged. A suction source is connected to one end of the liquid discharge path that serves as a discharge path for the cutting fluid. However, since the gas hardly reaches the suction source and mainly the cutting fluid reaches, the suction source is caused by the suction of the gas. The loss of suction capacity is reduced.
すなわち、廃液回収手段は、気液分離部と、気体排出路と、を備えるため、液体排出路に接続された吸引源による切削液の排出効率が高まる。よって、該吸引源の吸引能力を増強することなく、適切に被加工物上から切削液を排出できる。 That is, since the waste liquid recovery means includes the gas-liquid separation unit and the gas discharge path, the efficiency of discharging the cutting fluid by the suction source connected to the liquid discharge path is increased. Therefore, the cutting fluid can be appropriately discharged from the workpiece without increasing the suction capability of the suction source.
したがって、本発明により装置を大型化することなく効率よく切削廃液を被加工物上から排出できる切削装置が提供される。 Therefore, the present invention provides a cutting apparatus that can efficiently discharge cutting waste liquid from the workpiece without increasing the size of the apparatus.
添付図面を参照して、本発明の一態様に係る実施形態について説明する。まず、本実施形態に係る切削装置について図１を用いて説明する。図１は、切削装置を模式的に示す斜視図である。 Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. First, the cutting apparatus according to the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view schematically showing a cutting device.
切断装置２は、各構成を支持する装置基台４を備え、装置基台４の上面に被加工物を吸引保持する保持テーブル１４と、被加工物を切削加工する切削ユニット３８と、を備える。装置基台４の上面の前部の一端には、複数の被加工物が収容可能なカセット８が載せられるカセット支持台６が配設されている。切削装置２は、図示しない搬入出機構を備え、切削加工の対象となる被加工物をカセット８から引き出し保持テーブル１４上に搬入し、また、切削加工が終了した後に該被加工物をカセット８に収納する。 The cutting device 2 includes a device base 4 that supports each component, and includes a holding table 14 that sucks and holds a workpiece on the upper surface of the device base 4, and a cutting unit 38 that cuts the workpiece. . A cassette support base 6 on which a cassette 8 capable of accommodating a plurality of workpieces is placed is disposed at one end of the front portion of the upper surface of the apparatus base 4. The cutting device 2 includes a carry-in / out mechanism (not shown), pulls out a workpiece to be cut from the cassette 8 and carries it onto the holding table 14. After the cutting is completed, the workpiece is loaded into the cassette 8. Store in.
装置基台４の上面のカセット支持台６に隣接した位置には開口４ａが設けられており、開口４ａの内部にはＸ軸移動デーブル１０と、一端がＸ軸移動テーブル１０に取り付けられた防塵防滴カバー１２と、が配設されている。Ｘ軸移動テーブル１０は、図示しないＸ軸移動機構に接続されており、該Ｘ軸移動機構によりＸ軸方向に移動できる。Ｘ軸移動テーブル１０上には保持テーブル１４が配設されており、Ｘ軸移動テーブル１０を移動させることで保持テーブル１４をＸ軸方向に移動できる。 An opening 4 a is provided at a position adjacent to the cassette support base 6 on the upper surface of the apparatus base 4, and an X-axis moving table 10 and one end attached to the X-axis moving table 10 are installed inside the opening 4 a. A drip-proof cover 12 is provided. The X-axis movement table 10 is connected to an X-axis movement mechanism (not shown), and can be moved in the X-axis direction by the X-axis movement mechanism. A holding table 14 is disposed on the X-axis moving table 10, and the holding table 14 can be moved in the X-axis direction by moving the X-axis moving table 10.
保持テーブル１４は、上方に露出する多孔質部材を上部に有し、該多孔質部材の上面が保持テーブル１４の吸着面となる。保持テーブル１４は、一端が吸引源（不図示）に接続された吸引路を内部に有し、該吸引路の他端が多孔質部材に接続されている。被加工物を該吸着面上に載せ、該吸引源を作動させて多孔質部材を通じて被加工物を吸引すると、被加工物が保持テーブル１４に吸引保持される。保持テーブル１４は、吸着面に垂直な方向に沿った軸の周りに回転可能である。 The holding table 14 has a porous member that is exposed upward, and an upper surface of the porous member serves as an adsorption surface of the holding table 14. The holding table 14 has a suction path with one end connected to a suction source (not shown) inside, and the other end of the suction path is connected to a porous member. When the workpiece is placed on the suction surface and the suction source is operated to suck the workpiece through the porous member, the workpiece is sucked and held on the holding table 14. The holding table 14 is rotatable around an axis along a direction perpendicular to the suction surface.
装置基台４の上面の開口４ａに隣接する位置には、切削加工が実施された後に被加工物を洗浄する洗浄ユニット４２が配設されている。洗浄ユニット４２は、被加工物を保持する洗浄テーブルと、洗浄テーブルに保持された被加工物に洗浄液を供給するノズル（不図示）と、を備える At a position adjacent to the opening 4 a on the upper surface of the apparatus base 4, a cleaning unit 42 that cleans the workpiece after cutting is disposed is disposed. The cleaning unit 42 includes a cleaning table that holds a workpiece, and a nozzle (not shown) that supplies a cleaning liquid to the workpiece held on the cleaning table.
装置基台４の上面の後部には、開口４ａを跨ぐ門型の支持部１６が立設されている。支持部１６の上部の前面には、切削ユニット３８をＹ軸方向に移動させるＹ軸移動機構１８が配設されている。 At the rear part of the upper surface of the apparatus base 4, a gate-shaped support part 16 is provided so as to straddle the opening 4 a. A Y-axis moving mechanism 18 that moves the cutting unit 38 in the Y-axis direction is disposed on the front surface of the upper portion of the support portion 16.
Ｙ軸移動機構１８は、Ｙ軸方向に平行な一対のＹ軸ガイドレール２０と、Ｙ軸ガイドレール２０にスライド可能に取り付けられたＹ軸移動プレート２２と、を備える。さらに、Ｙ軸移動プレート２２の後面側に設けられたナット部（不図示）に螺合するＹ軸ボールねじ２４と、Ｙ軸ボールねじ２４を回転させるＹ軸パルスモータ２６と、を備える。 The Y-axis moving mechanism 18 includes a pair of Y-axis guide rails 20 that are parallel to the Y-axis direction, and a Y-axis moving plate 22 that is slidably attached to the Y-axis guide rails 20. Furthermore, a Y-axis ball screw 24 that is screwed into a nut portion (not shown) provided on the rear surface side of the Y-axis moving plate 22 and a Y-axis pulse motor 26 that rotates the Y-axis ball screw 24 are provided.
Ｙ軸移動プレート２２の前面には、切削ユニット２８をＺ軸方向に移動させるＺ軸移動機構２８が配設されている。Ｚ軸移動機構２８は、Ｚ軸方向に伸長する一対のＺ軸ガイドレール３０と、Ｚ軸ガイドレール３０にスライド可能に取り付けられたＺ軸移動プレート３２と、を備える。さらに、Ｚ軸移動プレート３２の裏面側（後面側）に設けられたナット部（不図示）に螺合するＸ軸ボールねじ３４と、Ｚ軸ボールねじ３４を回転させるＺ軸パルスモータ３６と、を備える。 A Z-axis moving mechanism 28 that moves the cutting unit 28 in the Z-axis direction is disposed on the front surface of the Y-axis moving plate 22. The Z-axis movement mechanism 28 includes a pair of Z-axis guide rails 30 that extend in the Z-axis direction, and a Z-axis movement plate 32 that is slidably attached to the Z-axis guide rails 30. Furthermore, an X-axis ball screw 34 that is screwed into a nut portion (not shown) provided on the back side (rear side) of the Z-axis moving plate 32, a Z-axis pulse motor 36 that rotates the Z-axis ball screw 34, Is provided.
Ｙ軸パルスモータ２６でＹ軸ボールねじ２４を回転させると、Ｙ軸移動プレート２２はＹ軸ガイドレール２０に沿ってＹ軸方向に移動する。Ｚ軸パルスモータ３６でＺ軸ボールねじ３４を回転させると、Ｚ軸移動プレート３２はＺ軸ガイドレール３０に沿ってＺ軸方向に移動する。 When the Y-axis ball motor 24 is rotated by the Y-axis pulse motor 26, the Y-axis moving plate 22 moves along the Y-axis guide rail 20 in the Y-axis direction. When the Z-axis ball screw 34 is rotated by the Z-axis pulse motor 36, the Z-axis moving plate 32 moves in the Z-axis direction along the Z-axis guide rail 30.
Ｚ軸移動プレート３２の前面下部には、被加工物を切削する切削ユニット３８と、被加工物の表面を撮影するカメラユニット４０と、が配設されている。カメラユニット４０は、撮影により得られた画像を切削装置２の制御部（不図示）に送る。該制御部は、加工予定ラインに沿って被加工物が切削されるように、該画像に基づいて切削装置２の各構成を制御する。 A cutting unit 38 for cutting the workpiece and a camera unit 40 for photographing the surface of the workpiece are disposed at the lower part of the front surface of the Z-axis moving plate 32. The camera unit 40 sends an image obtained by photographing to a control unit (not shown) of the cutting device 2. The control unit controls each component of the cutting device 2 based on the image so that the workpiece is cut along the planned machining line.
切削ユニット３８は、被加工物を切削する切削ブレード６６（図４等参照）と、切削ブレード６６の一部を覆うように配設されたブレードカバー４４と、を備える。切削ブレード６６は、例えば、中央に貫通孔を有するアルミニウム等でなる基台６６ａ（図４等参照）と、基台６６ａの外周に配された砥石部６６ｂ（図４等参照）と、を備える。 The cutting unit 38 includes a cutting blade 66 (see FIG. 4 and the like) for cutting a workpiece, and a blade cover 44 disposed so as to cover a part of the cutting blade 66. The cutting blade 66 includes, for example, a base 66a (see FIG. 4 and the like) made of aluminum having a through hole in the center and a grindstone portion 66b (see FIG. 4 and the like) disposed on the outer periphery of the base 66a. .
砥石部６６ｂは、ダイヤモンド砥粒等の砥粒と、該砥粒を分散して固定する結合材と、を備える。切削ブレード６６を該貫通孔の周りに回転させ、砥石部６６ｂを被加工物に接触させると、被加工物が切削される。被加工物を切削すると、被加工物から切削屑が発生して周囲に飛散する。また、切削ブレード６６及び被加工物の摩擦により熱が生じる。そこで、被加工物を切削ブレード６６で切削する際には、切削屑や熱を排除するために、切削ブレード６６及び被加工物に切削液が供給される。 The grindstone portion 66b includes abrasive grains such as diamond abrasive grains and a binding material that disperses and fixes the abrasive grains. When the cutting blade 66 is rotated around the through hole and the grindstone 66b is brought into contact with the workpiece, the workpiece is cut. When the workpiece is cut, cutting waste is generated from the workpiece and scattered around. Further, heat is generated by friction between the cutting blade 66 and the workpiece. Therefore, when cutting the workpiece with the cutting blade 66, a cutting fluid is supplied to the cutting blade 66 and the workpiece in order to eliminate cutting waste and heat.
切削装置２で切削される被加工物は、例えば、シリコン、ＳｉＣ（シリコンカーバイド）、若しくは、その他の半導体等の材料、または、サファイア、ガラス、石英、セラミックス等の材料からなる基板である。または、該板状の被加工物は、デバイスが樹脂で覆われたパッケージ基板である。 The workpiece to be cut by the cutting device 2 is, for example, a substrate made of a material such as silicon, SiC (silicon carbide), or other semiconductor, or a material such as sapphire, glass, quartz, or ceramic. Alternatively, the plate-like workpiece is a package substrate in which a device is covered with a resin.
被加工物には、ＩＣ（Integrated Circuit）、ＬＳＩ（Large Scale Integration）等のデバイスが設けられている。または、該デバイスは、ＣＣＤ（チャージ・カップルド・デバイス）やＣ−ＭＯＳ（コンプリメンタリ・メタル・オキサイド・セミコンダクタ）等の撮像素子である。被加工物を切削装置２で切削しデバイス毎に分割すると、デバイスチップを形成できる。 The workpiece is provided with a device such as an IC (Integrated Circuit) or an LSI (Large Scale Integration). Alternatively, the device is an image sensor such as a CCD (Charge Coupled Device) or a C-MOS (Complementary Metal Oxide Semiconductor). When the workpiece is cut by the cutting device 2 and divided for each device, a device chip can be formed.
切削装置２は、切削加工中に切削ブレード６６及び被加工物に純水等の切削液を供給する切削液供給手段を備える。切削液供給手段は、例えば、切削液供給源５４（図２等参照）と、切削液供給路５６（図３（Ｃ）等参照）と、切削液供給口５８（図３（Ｃ）等参照）と、等を含む。被加工物の切削中に、該切削液が切削ブレード６６や被加工物に供給され、発生する切削屑が切削液に取り込まれて除去されるが、切削屑を含む切削液が迅速に排出されず被加工物の上面に切削屑が付着する場合がある。 The cutting device 2 includes a cutting fluid supply means for supplying a cutting fluid such as pure water to the cutting blade 66 and the workpiece during cutting. The cutting fluid supply means includes, for example, a cutting fluid supply source 54 (see FIG. 2 and the like), a cutting fluid supply path 56 (see FIG. 3C and the like), and a cutting fluid supply port 58 (see FIG. 3C and the like). ), Etc. During cutting of the workpiece, the cutting fluid is supplied to the cutting blade 66 and the workpiece, and the generated cutting waste is taken in and removed by the cutting fluid, but the cutting fluid containing the cutting waste is quickly discharged. In some cases, cutting waste may adhere to the upper surface of the workpiece.
特に、被加工物がＣＣＤやＣ−ＭＯＳ等の撮像素子を備える基板等である場合、被加工物の切削屑に対する接着力が強くなる。そのため、被加工物の切削が完了した後に該被加工物を洗浄しても、切削屑を十分に除去できない。その上、該撮像素子の場合、切削屑の残留がデバイス不良に直結するため、特に問題が深刻となる。 In particular, when the workpiece is a substrate or the like provided with an image sensor such as a CCD or C-MOS, the adhesion force of the workpiece to the cutting waste is increased. Therefore, even if the workpiece is washed after the workpiece has been cut, the cutting waste cannot be removed sufficiently. In addition, in the case of the image pickup device, since the residue of cutting waste is directly connected to a device failure, the problem becomes particularly serious.
そこで、本実施形態に係る切削装置２は、切削液の飛散を防止するために、該切削ブレード６６の一部を覆うブレードカバー４４と、被加工物に供給された切削液を回収する廃液回収手段と、が配設される。図２及び図３を用いてブレードカバー４４について詳述する。 Therefore, the cutting device 2 according to the present embodiment includes a blade cover 44 that covers a part of the cutting blade 66 and a waste liquid recovery that recovers the cutting liquid supplied to the workpiece in order to prevent the scattering of the cutting liquid. Means. The blade cover 44 will be described in detail with reference to FIGS.
図２は、ブレードカバー４４と、気体排出路４６と、液体排出路４８と、を模式的に示す斜視図である。該気体排出路４６と、該液体排出路４８と、は廃液回収手段８０を構成する。ブレードカバー４４は、例えば、カバー４４ａと、カバー４４ａと対になり切削ブレード６６を覆うカバー４４ｂと、を含み、切削ブレード６６を覆うようにカバー４４ａと、カバー４４ｂと、が一体化されることで切削ユニット３８に組み込まれる。 FIG. 2 is a perspective view schematically showing the blade cover 44, the gas discharge path 46, and the liquid discharge path 48. The gas discharge path 46 and the liquid discharge path 48 constitute a waste liquid collecting means 80. The blade cover 44 includes, for example, a cover 44a and a cover 44b that is paired with the cover 44a and covers the cutting blade 66. The cover 44a and the cover 44b are integrated so as to cover the cutting blade 66. Is incorporated into the cutting unit 38.
切削ユニット３８に組み込またブレードカバー４４は、例えば、天井部４４ｃと、天井部４４ｃの側端から下垂した側壁部４４ｄと、天井部４４ｃと対面し側壁部４４ｄの下端から延在する底部４４ｅと、を備える。 The blade cover 44 incorporated in the cutting unit 38 includes, for example, a ceiling part 44c, a side wall part 44d hanging from the side end of the ceiling part 44c, a bottom part 44e facing the ceiling part 44c and extending from the lower end of the side wall part 44d. .
例えば、カバー４４ｂには、切削液供給手段を構成する切削液供給源５４への接続端子となる切削液導入部５２が配設されている。該切削液供給源５４から該切削液導入部５２を経てブレードカバー４４の内部に切削液が供給される。ブレードカバー４４のより詳細な構造について図３を用いて説明する。 For example, the cover 44b is provided with a cutting fluid introduction portion 52 that serves as a connection terminal to a cutting fluid supply source 54 that constitutes a cutting fluid supply means. The cutting fluid is supplied from the cutting fluid supply source 54 into the blade cover 44 through the cutting fluid introduction portion 52. A more detailed structure of the blade cover 44 will be described with reference to FIG.
図３（Ｂ）は、ブレードカバー４４の底面を模式的に示す平面図であり、図３（Ｃ）は、ブレードカバー４４を模式的に示す断面図である。図３（Ｃ）に示す断面図は、図３（Ｂ）に示す平面図にＣＣ´で示す線に沿ってブレードカバー４４を切断した場合の断面図である。 FIG. 3B is a plan view schematically showing the bottom surface of the blade cover 44, and FIG. 3C is a cross-sectional view schematically showing the blade cover 44. The cross-sectional view shown in FIG. 3C is a cross-sectional view when the blade cover 44 is cut along the line CC ′ in the plan view shown in FIG.
図３（Ｃ）に示す通り、カバー４４ｂの内部には一端が切削液導入部５２に接続された切削液供給路５６が形成されている。切削液供給路５６の他端は、切削液供給口５８に接続されており、切削液は切削液供給口５８から被加工物に噴出される。切削液供給路５６は、カバー４４ａ側の切削液供給口５８にも通じている。 As shown in FIG. 3C, a cutting fluid supply path 56 having one end connected to the cutting fluid introducing portion 52 is formed inside the cover 44b. The other end of the cutting fluid supply path 56 is connected to a cutting fluid supply port 58, and the cutting fluid is ejected from the cutting fluid supply port 58 to the workpiece. The cutting fluid supply path 56 also communicates with a cutting fluid supply port 58 on the cover 44a side.
図３（Ｂ）に示す通り、カバー４４ａと、カバー４４ｂと、を一体化させると、ブレードカバー４４の底部４４ｅに貫通孔６２が形成され、切削ブレード６６の砥石部６８ｂ（図３（Ｄ）参照）は、貫通孔６２を通じて下方に突出する。複数の切削液供給口５８は、貫通孔６２を挟み込むようにカバー４４ａと、カバー４４ｂと、のそれぞれの底部に列状に配されている。 As shown in FIG. 3B, when the cover 44a and the cover 44b are integrated, a through hole 62 is formed in the bottom 44e of the blade cover 44, and a grindstone portion 68b of the cutting blade 66 (FIG. 3D). (See) protrudes downward through the through hole 62. The plurality of cutting fluid supply ports 58 are arranged in a row at the bottoms of the cover 44a and the cover 44b so as to sandwich the through hole 62 therebetween.
図３（Ａ）は、ブレードカバー４４を模式的に示す断面図である。図３（Ａ）に示す断面図は、図３（Ｂ）に示す平面図にＡＡ´で示す線に沿ってブレードカバー４４を切断した場合の断面図である。図３（Ａ）に示す通り、ブレードカバー４４の内部には、スピンドル６４（図３（Ｄ）参照）が突き通されるスピンドル挿入孔６０が形成されている。また、ブレードカバー４４の内部には、スピンドル６４の先端に装着される切削ブレード６６を収容する空間が形成されている。 FIG. 3A is a cross-sectional view schematically showing the blade cover 44. The cross-sectional view shown in FIG. 3A is a cross-sectional view when the blade cover 44 is cut along the line AA ′ in the plan view shown in FIG. As shown in FIG. 3A, a spindle insertion hole 60 through which the spindle 64 (see FIG. 3D) penetrates is formed inside the blade cover 44. In addition, a space for accommodating a cutting blade 66 attached to the tip of the spindle 64 is formed in the blade cover 44.
図３（Ｄ）は、ブレードカバー４４を模式的に示す断面図である。図３（Ｄ）に示す断面図は、図３（Ｂ）に示す平面図にＢＢ´で示す線に沿ってブレードカバー４４を切断した場合の断面図である。図３（Ｄ）に示す断面図には、スピンドル６４と、ブレードカバー４４に収容される切削ブレード６６と、が示されている。スピンドル６４の先端部にはマウントフランジ６４ａが配設されている。 FIG. 3D is a cross-sectional view schematically showing the blade cover 44. The cross-sectional view shown in FIG. 3D is a cross-sectional view when the blade cover 44 is cut along the line BB ′ in the plan view shown in FIG. In the cross-sectional view shown in FIG. 3D, the spindle 64 and the cutting blade 66 accommodated in the blade cover 44 are shown. A mount flange 64 a is disposed at the tip of the spindle 64.
切削ブレード６６は、スピンドル６４が突き通される貫通孔（不図示）を中央に備える環状の基台６６ａと、基台６６ａの外周部に配設された砥石部６８ｂと、を備える。スピンドル６４の先端にはねじ溝が形成されている。環状の基台６６ａの該貫通孔にスピンドル６４を突き通して該環状の基台６６ａをマウントフランジ６４ａに接触させ、スピンドル６４の先端にナット６４ｂを締め込むことで、切削ブレード６６をスピンドル６４の先端に固定できる。 The cutting blade 66 includes an annular base 66a having a through hole (not shown) through which the spindle 64 penetrates in the center, and a grindstone portion 68b disposed on the outer periphery of the base 66a. A screw groove is formed at the tip of the spindle 64. The spindle 64 is inserted into the through hole of the annular base 66a, the annular base 66a is brought into contact with the mount flange 64a, and the nut 64b is tightened at the tip of the spindle 64, so that the cutting blade 66 is attached to the spindle 64. Can be fixed to the tip.
スピンドル６４の基端側には、スピンドル６４を回転させるスピンドルモータ（不図示）が接続されており、該スピンドルモータを作動させてスピンドル６４を回転させると、切削ブレード６６が回転する。 A spindle motor (not shown) for rotating the spindle 64 is connected to the base end side of the spindle 64. When the spindle motor is rotated by operating the spindle motor, the cutting blade 66 is rotated.
ブレードカバー４４の底面には吸引開口６８が形成されており、ブレードカバー４４の内部には、排出路７０が形成されている。排出路７０の一端は吸引開口６８に通じており、排出路７０の他端にはホース等が接続される排出口７２が形成されている。排出口７２には、例えば、気液分離部７６と、液体排出路４８と、気体排出路４６と、を含む廃液回収手段が接続される。図４は、廃液回収手段の一例を模式的に示す断面図であり、切削加工時における切削液及び気体の排出の様子が示されている。 A suction opening 68 is formed on the bottom surface of the blade cover 44, and a discharge path 70 is formed inside the blade cover 44. One end of the discharge path 70 communicates with the suction opening 68, and a discharge port 72 to which a hose or the like is connected is formed at the other end of the discharge path 70. To the discharge port 72, for example, a waste liquid collecting unit including a gas-liquid separation unit 76, a liquid discharge path 48, and a gas discharge path 46 is connected. FIG. 4 is a cross-sectional view schematically showing an example of the waste liquid recovery means, and shows the state of discharge of the cutting liquid and gas during the cutting process.
図４に示す通り、該排出口７２には気体排出路４６が接続される。気体排出路４６の内壁には、気液分離部７６として該内壁の底部から突出する流入規制板７６ａが配設される。また、気体排出路４６の上部には、気体排出路４６の径よりも小さい径のホース状の液体排出路４８が貫通する貫通孔が設けられており、該貫通孔に突き通された液体排出路４８の一端は、該流入規制板７６ａの吸引方向上流側の領域に達する。 As shown in FIG. 4, a gas discharge path 46 is connected to the discharge port 72. An inflow restricting plate 76 a that protrudes from the bottom of the inner wall is disposed on the inner wall of the gas discharge path 46 as a gas-liquid separator 76. In addition, a through hole through which a hose-like liquid discharge path 48 having a diameter smaller than the diameter of the gas discharge path 46 passes is provided in the upper part of the gas discharge path 46, and the liquid discharged through the through hole is discharged. One end of the path 48 reaches a region upstream of the inflow regulating plate 76a in the suction direction.
気体排出路４６の他端側には気体排出用の吸引源７８ａが接続されており、液体排出路４８の他端側には液体排出用の吸引源７８ｂが接続されている。被加工物の切削時には吸引源７８ａ，７８ｂにより、気体排出路４６及び液体排出路４８の内部が吸引される。 A gas discharge suction source 78 a is connected to the other end side of the gas discharge path 46, and a liquid discharge suction source 78 b is connected to the other end side of the liquid discharge path 48. When cutting the workpiece, the insides of the gas discharge path 46 and the liquid discharge path 48 are sucked by the suction sources 78a and 78b.
被加工物１の切削時の切削液の移動経路について説明する。被加工物１の切削時には、ブレードカバー４４の貫通孔６２から突出する切削ブレード６６の砥石部６６ｂが被加工物に接触する。このとき、切削液供給口５８からは切削液７４が吐出され、該切削液７４が加工点に到達する。 The moving path of the cutting fluid when cutting the workpiece 1 will be described. When cutting the workpiece 1, the grindstone 66 b of the cutting blade 66 protruding from the through hole 62 of the blade cover 44 comes into contact with the workpiece. At this time, the cutting fluid 74 is discharged from the cutting fluid supply port 58, and the cutting fluid 74 reaches the machining point.
切削ブレード６６により被加工物１が切削されると被加工物１から切削屑が生じて、該切削液７４に該切削屑が取り込まれる。切削屑が取り込まれた切削液７４は、切削ブレード６６の回転に伴って飛散し、また、吸引開口６８から吸引される。 When the workpiece 1 is cut by the cutting blade 66, cutting waste is generated from the workpiece 1 and the cutting waste is taken into the cutting fluid 74. The cutting fluid 74 in which the cutting waste is taken in is scattered as the cutting blade 66 rotates, and is sucked from the suction opening 68.
ブレードカバー４４の底部の排出口７２とは反対側には、気体取り込み路５０が形成されており、被加工物１の切削時には該気体取り込み路５０からは空気（気体）が取り込まれる。該廃液回収手段８０は、切削ブレード６６の回転に伴って切削液７４が飛散する方向に配設されている。被加工物１の切削時には、廃液回収手段８０に切削液７４が飛散するとともに切削ブレード６６の回転に伴って該空気が到達する。 A gas intake path 50 is formed on the bottom side of the blade cover 44 opposite to the discharge port 72, and air (gas) is taken in from the gas intake path 50 when the workpiece 1 is cut. The waste liquid collecting means 80 is disposed in a direction in which the cutting liquid 74 is scattered as the cutting blade 66 rotates. At the time of cutting the workpiece 1, the cutting fluid 74 scatters to the waste liquid collecting means 80 and the air reaches as the cutting blade 66 rotates.
そして、切削液７４が気液分離部７６に達すると、気液分離部７６により気体排出路４６内の切削液７４の移動が規制され、液体排出路４８の該一端が切削液７４中に浸り、液体排出路４８の該一端から切削液７４が吸引される。その一方で、該空気（気体）は気液分離部７６で移動が規制されず、そのまま気体排出路４６を進行する。 When the cutting liquid 74 reaches the gas-liquid separation unit 76, the movement of the cutting liquid 74 in the gas discharge path 46 is restricted by the gas-liquid separation unit 76, and the one end of the liquid discharge path 48 is immersed in the cutting liquid 74. The cutting fluid 74 is sucked from the one end of the liquid discharge path 48. On the other hand, the movement of the air (gas) is not restricted by the gas-liquid separator 76 and proceeds through the gas discharge path 46 as it is.
すなわち、気液分離部７６は、廃液回収手段８０に到達した切削液７４と、空気（気体）と、を分離し、気体排出路４６の他端に接続された吸引源７８ａへの切削液７４の進行を抑制する。また、液体排出路４８の他端に接続された吸引源７８ｂへの気体の進行を抑制する。したがって、液体排出路４８に接続された吸引源７８ｂは主に切削液７４を吸引するため、吸引能力を気体の吸引に割かれない。また、気体排出路４６に接続された吸引源７８ａは、主に気体を吸引するため、吸引能力を切削液７４の吸引に割かれない。 That is, the gas-liquid separation unit 76 separates the cutting fluid 74 that has reached the waste liquid collection means 80 and air (gas), and supplies the cutting fluid 74 to the suction source 78 a connected to the other end of the gas discharge path 46. Suppresses the progression of Further, the progression of the gas to the suction source 78b connected to the other end of the liquid discharge path 48 is suppressed. Therefore, since the suction source 78b connected to the liquid discharge path 48 mainly sucks the cutting fluid 74, the suction capability cannot be divided into the suction of gas. Further, since the suction source 78a connected to the gas discharge path 46 mainly sucks the gas, the suction capability is not divided into the suction of the cutting fluid 74.
気体や液体等の流体を吸引する吸引機構には、気体の吸引に適した機構や液体の吸引に適した機構等が存在する。気体と、液体と、の両方を一つの吸引源で吸引しようとする場合、大型で高価な吸引源を準備しなければならない。これに対して、本実施形態に係る切削装置２は気液分離部７６を備えるため、それぞれの吸引対象に適した吸引源を採用できる。そのため、切削装置２の価格の上昇や大型化を抑制できる。 As a suction mechanism for sucking a fluid such as gas or liquid, there are a mechanism suitable for sucking a gas, a mechanism suitable for sucking a liquid, and the like. When both a gas and a liquid are to be sucked with a single suction source, a large and expensive suction source must be prepared. On the other hand, since the cutting device 2 according to the present embodiment includes the gas-liquid separation unit 76, a suction source suitable for each suction target can be employed. Therefore, an increase in the price and an increase in size of the cutting device 2 can be suppressed.
気液分離部７６は、例えば、図４に示す通り気体排出路４６の該内壁の底部から突出する流入規制板７６ａであるが、本実施形態に係る切削装置はこれに限定されない。気液分離部７６は、該内壁の天井部から突出する流入規制板でもよく、液体排出路４８の内壁から突出する流入規制板でもよい。また、板状の部材でなくてもよい。図５に、気液分離部７６の他の例について示す。 For example, as shown in FIG. 4, the gas-liquid separator 76 is an inflow restricting plate 76 a that protrudes from the bottom of the inner wall of the gas discharge path 46, but the cutting device according to the present embodiment is not limited to this. The gas-liquid separator 76 may be an inflow restricting plate protruding from the ceiling portion of the inner wall or an inflow restricting plate protruding from the inner wall of the liquid discharge path 48. Moreover, it may not be a plate-shaped member. FIG. 5 shows another example of the gas-liquid separator 76.
図５は、廃液回収手段８０の他の一例を模式的に示す断面図である。図５に示す切削ユニット３８は、切削ブレード６６の一部を覆うブレードカバー４４と、該ブレードカバー４４に収容された切削ブレード６６と、を備える。なお、図５に示す切削ユニット３８では、該切削ブレード６６は該ブレードカバー４４に密閉されていない。 FIG. 5 is a cross-sectional view schematically showing another example of the waste liquid recovery means 80. The cutting unit 38 shown in FIG. 5 includes a blade cover 44 that covers a part of the cutting blade 66, and a cutting blade 66 accommodated in the blade cover 44. In the cutting unit 38 shown in FIG. 5, the cutting blade 66 is not sealed by the blade cover 44.
該ブレードカバー４４は、切削液供給源（不図示）に接続された切削液導入部５２と、一端が切削液導入部５２に通じる切削液供給路５６と、切削液供給路５６の他端側に配された切削液供給口５８と、を備える。ブレードカバー４４は、さらに、切削ブレード６６に側方から切削液を噴出する切削液供給ノズル５８ａを備える。 The blade cover 44 includes a cutting fluid introduction section 52 connected to a cutting fluid supply source (not shown), a cutting fluid supply path 56 with one end communicating with the cutting fluid introduction section 52, and the other end side of the cutting fluid supply path 56. And a cutting fluid supply port 58 disposed in the. The blade cover 44 further includes a cutting fluid supply nozzle 58 a that ejects the cutting fluid from the side to the cutting blade 66.
被加工物の切削時には、切削液供給口５８と、切削液供給ノズル５８ａと、から切削ブレード６６及び被加工物に切削液７４が供給される。切削ブレード６６を回転させて被加工物を切削すると被加工物から切削屑が発生するが、切削屑は該切削液に取り込まれる。該切削液７４は、切削ブレード６６の回転に伴って飛散する。切削液７４が飛散する方向には廃液回収手段８０が配設されている。 When cutting the workpiece, the cutting fluid 74 is supplied to the cutting blade 66 and the workpiece from the cutting fluid supply port 58 and the cutting fluid supply nozzle 58a. When the workpiece is cut by rotating the cutting blade 66, cutting waste is generated from the workpiece, but the cutting waste is taken into the cutting fluid. The cutting fluid 74 scatters as the cutting blade 66 rotates. Waste liquid collecting means 80 is disposed in the direction in which the cutting fluid 74 is scattered.
廃液回収手段８０は、気体排出路４６と、液体排出路４８と、気液分離部７６と、液体排出路４８に接続された吸引源７８ｂと、を備える。気液分離部７６は、気液分離室７６ｂと、気液分離室７６ｂの天井から突出する流入規制板７６ａと、を備える。液体排出路４８は、気液分離室７６の底部の側壁に接続されており、気体排出路４６は、気液分離室７６の天井に接続されている。廃液回収手段８０は、気体を吸引する吸引源を備えず、気体排出路４６の一端には排気口８２が設けられている。 The waste liquid recovery means 80 includes a gas discharge path 46, a liquid discharge path 48, a gas / liquid separator 76, and a suction source 78 b connected to the liquid discharge path 48. The gas-liquid separation unit 76 includes a gas-liquid separation chamber 76b and an inflow restricting plate 76a protruding from the ceiling of the gas-liquid separation chamber 76b. The liquid discharge path 48 is connected to the side wall at the bottom of the gas-liquid separation chamber 76, and the gas discharge path 46 is connected to the ceiling of the gas-liquid separation chamber 76. The waste liquid recovery means 80 does not include a suction source for sucking gas, and an exhaust port 82 is provided at one end of the gas discharge path 46.
被加工物の切削により廃液回収手段８０に切削液７４が飛散すると、気液分離室７６ｂの内部で切削液７４が流入規制板７６ａに衝突し、切削液７４が気液分離室７６ｂの底部に溜まる。気液分離室７６ｂの底部に溜まった切削液７４は、液体排出路４８を通じて吸引源７８ｂにより吸引される。切削ブレード６６の回転に伴って、廃液回収手段８０には気体も取り込まれる。該気体は、気体排出路４６を経て排気口８２から外部に排出される。 When the cutting fluid 74 scatters to the waste fluid collecting means 80 by cutting the workpiece, the cutting fluid 74 collides with the inflow restricting plate 76a inside the gas-liquid separation chamber 76b, and the cutting fluid 74 reaches the bottom of the gas-liquid separation chamber 76b. Accumulate. The cutting fluid 74 accumulated at the bottom of the gas-liquid separation chamber 76 b is sucked by the suction source 78 b through the liquid discharge path 48. As the cutting blade 66 rotates, gas is also taken into the waste liquid collecting means 80. The gas is discharged to the outside from the exhaust port 82 through the gas discharge path 46.
このように気液分離部７６の流入規制板７６ａにより切削液７４の気体排出路４６への進入が抑制される。また、該気体は、気体排出路４６を経て適切に排出されるため、液体排出路４８への該気体の混入が抑制され、液体排出路４８に接続された吸引源７８ｂは切削液７４を効率良く吸引できる。 In this way, the inflow restricting plate 76a of the gas-liquid separator 76 prevents the cutting fluid 74 from entering the gas discharge path 46. Further, since the gas is appropriately discharged through the gas discharge path 46, mixing of the gas into the liquid discharge path 48 is suppressed, and the suction source 78b connected to the liquid discharge path 48 makes the cutting fluid 74 efficient. Can suck well.
なお、上記実施形態では、気体排出路４６と、液体排出路４８と、にそれぞれ異なる吸引源が配設される場合や、気体排出路４６と、液体排出路４８と、の一方に吸引源が配設される場合について説明したが、本発明の一態様に係る切削装置はこれに限定されない。例えば、気体排出路４６と、液体排出路４８と、には共通する一つの吸引源が接続されてもよい。 In the above embodiment, when a different suction source is provided for each of the gas discharge path 46 and the liquid discharge path 48, or when one of the gas discharge path 46 and the liquid discharge path 48 has a suction source. Although the case where it arrange | positions was demonstrated, the cutting device which concerns on 1 aspect of this invention is not limited to this. For example, a common suction source may be connected to the gas discharge path 46 and the liquid discharge path 48.
この場合、気体排出路４６及び該吸引源の間、又は、液体排出路４８及び該吸引源の間に吸引力を調節する調整弁を設け、廃液回収手段８０に到達した切削液が気体よりも高圧で吸引されることが好ましい。 In this case, an adjustment valve that adjusts the suction force is provided between the gas discharge path 46 and the suction source, or between the liquid discharge path 48 and the suction source, so that the cutting fluid that reaches the waste liquid collecting means 80 is less than the gas. It is preferable to be sucked at a high pressure.
また、廃液回収手段８０の気液分離部７６は、切削液７４と、空気と、を完全に分離する必要はなく、例えば、気体排出路４６または液体排出路４８を経て霧状の切削液７４を含む空気が排出されてもよい。この場合においても、気液分離部７６により液体排出路４８に進入する空気を減少できるため、液体排出路４８に接続された吸引源７８ｂにおける空気の吸引に伴う吸引能力の低下が抑制される。 Further, the gas-liquid separation unit 76 of the waste liquid collecting means 80 does not need to completely separate the cutting fluid 74 from the air. For example, the atomized cutting fluid 74 passes through the gas discharge path 46 or the liquid discharge path 48. The air containing may be discharged. Even in this case, the air entering the liquid discharge path 48 can be reduced by the gas-liquid separation unit 76, so that a reduction in the suction capacity accompanying the suction of air in the suction source 78b connected to the liquid discharge path 48 is suppressed.
その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.
１ 被加工物
２ 切削装置
４ 装置基台
４ａ 開口
６ カセット支持台
８ カセット
１０ Ｘ軸移動テーブル
１２ 防塵防滴カバー
１４ 保持テーブル
１６ 支持部
１８ Ｙ軸移動機構
２０，３０ ガイドレール
２２，３２ 移動プレート
２４，３４ ボールネジ
２６，３６ パルスモータ
２８ Ｚ軸移動機構
３８ 切削ユニット
４０ カメラユニット
４２ 洗浄ユニット
４４，４４ａ，４４ｂ カバー
４６ 気体排出路
４８ 液体排出路
５０ 気体取り込み路
５２ 切削液導入部
５４ 切削液供給源
５６ 切削液供給路
５８ 切削液供給口
５８ａ 切削液供給ノズル
６０ スピンドル挿入孔
６２ 貫通孔
６４ スピンドル
６４ａ マウントフランジ
６４ｂ ナット
６６ 切削ブレード
６６ａ 基台
６６ｂ 砥石部
６６ｃ 切削ブレード回転方向
６８ 吸引開口
７０ 排出路
７２ 排出口
７４ 切削液
７６ 気液分離部
７６ａ 流入規制板
７６ｂ 気液分離室
７８ａ，７８ｂ 吸引源
８０ 廃液回収手段
８２ 排気口
DESCRIPTION OF SYMBOLS 1 Workpiece 2 Cutting apparatus 4 Apparatus base 4a Opening 6 Cassette support stand 8 Cassette 10 X-axis movement table 12 Dust-proof drip-proof cover 14 Holding table 16 Support part 18 Y-axis movement mechanism 20, 30 Guide rail 22, 32 Movement plate 24, 34 Ball screw 26, 36 Pulse motor 28 Z-axis moving mechanism 38 Cutting unit 40 Camera unit 42 Cleaning unit 44, 44a, 44b Cover 46 Gas discharge path 48 Liquid discharge path 50 Gas intake path 52 Cutting fluid introduction part 54 Cutting fluid supply 54 Source 56 Cutting fluid supply path 58 Cutting fluid supply port 58a Cutting fluid supply nozzle 60 Spindle insertion hole 62 Through hole 64 Spindle 64a Mount flange 64b Nut 66 Cutting blade 66a Base 66b Grinding wheel portion 66c Cutting blade rotation direction 68 Suction opening 70 Drain Road 72 outlet 74 the cutting fluid 76 gas-liquid separator 76a flows into the regulating plate 76b gas-liquid separating chamber 78a, 78b suction source 80 waste liquid collecting means 82 outlet
Claims (4)
天井部と、該天井部から下垂した側壁部と、を有し、該切削ブレードの一部を覆うように配設されたブレードカバーと、
該切削ブレードに切削液を供給する切削液供給手段と、
該切削ブレードに供給された切削液が該切削ブレードの回転に伴って飛散する領域に配設され該切削液を該切削ブレードの周囲の一部の気体とともに回収する廃液回収手段と、を備え、
該廃液回収手段は、
該廃液回収手段に到達する該切削液と、該気体と、を分離させる気液分離部と、
該気液分離部で分離された該切削液の排出経路となる液体排出路と、
該気液分離部で分離された該気体の排出経路となる気体排出路と、を備え、
該切削液の排出先となる該液体排出路の一端には液体排出用吸引源が接続されていることを特徴とする切削装置。 A cutting device comprising: a holding table that holds a workpiece; and a cutting blade that cuts the workpiece held by the holding table;
A blade cover having a ceiling part and a side wall part hanging from the ceiling part, and arranged to cover a part of the cutting blade;
Cutting fluid supply means for supplying cutting fluid to the cutting blade;
A waste fluid recovery means disposed in a region where the cutting fluid supplied to the cutting blade is scattered as the cutting blade rotates and recovering the cutting fluid together with a part of the gas around the cutting blade;
The waste liquid recovery means includes
A gas-liquid separation unit that separates the cutting fluid reaching the waste liquid recovery means and the gas;
A liquid discharge path serving as a discharge path for the cutting fluid separated by the gas-liquid separation unit;
A gas discharge path serving as a discharge path for the gas separated by the gas-liquid separation unit,
A cutting apparatus, characterized in that a liquid discharge suction source is connected to one end of the liquid discharge path which is a discharge destination of the cutting liquid.
該切削ブレードは、該貫通孔を通じて先端が該ブレードカバーの外部に突出することを特徴とする請求項１乃至請求項３のいずれかに記載の切削装置。 The blade cover has a bottom portion that is formed continuously from the side wall portion and faces the ceiling portion, and the bottom portion has a through hole that communicates with the inside and outside of the blade cover,
The cutting device according to any one of claims 1 to 3, wherein a tip of the cutting blade protrudes outside the blade cover through the through hole.
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| CN111496303B (en) * | 2020-04-23 | 2021-03-26 | 临沂临工德鑫机械有限责任公司 | Milling machine with cutting fluid clean system |
| CN113977322A (en) * | 2021-11-29 | 2022-01-28 | 常德市境宏金属结构有限责任公司 | Metal structure spare processingequipment with collect waste material function |
| CN113977322B (en) * | 2021-11-29 | 2024-02-27 | 江苏嘉嘉汽车零部件科技有限公司 | Metal structure part processing device with waste material collecting function |
| CN114603721A (en) * | 2022-02-11 | 2022-06-10 | 厦门理工学院 | Cutting dust device for rock processing |
| CN114603721B (en) * | 2022-02-11 | 2023-05-02 | 厦门理工学院 | Cutting dust device for rock processing |
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