JP2019102509A - Transport tool, transport method, and transport tool unit - Google Patents
Transport tool, transport method, and transport tool unit Download PDFInfo
- Publication number
- JP2019102509A JP2019102509A JP2017228627A JP2017228627A JP2019102509A JP 2019102509 A JP2019102509 A JP 2019102509A JP 2017228627 A JP2017228627 A JP 2017228627A JP 2017228627 A JP2017228627 A JP 2017228627A JP 2019102509 A JP2019102509 A JP 2019102509A
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- transfer tool
- conveyance
- transport
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 229920001971 elastomer Polymers 0.000 description 12
- 229920001973 fluoroelastomer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- -1 perfluoro Chemical group 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920006169 Perfluoroelastomer Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010068 moulding (rubber) Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Packaging Frangible Articles (AREA)
- Belt Conveyors (AREA)
Abstract
Description
本発明は、搬送具と搬送方法と搬送ユニットに関する。特に、製造ライン等で一時的に対象物を搬送するための搬送具と搬送方法と搬送ユニットに関する。 The present invention relates to a transport tool, a transport method, and a transport unit. In particular, the present invention relates to a transfer tool, a transfer method, and a transfer unit for temporarily transferring an object on a manufacturing line or the like.
製造ラインでは、基板やガラスなどが搬送する搬送具が、従来から使用されている（特許文献１）。この搬送具では、金属板上にゴムが設けられている。ゴムに、対象物が一時的に粘着され搬送され、目的地で対象物が搬送具から外される。 In the manufacturing line, a transfer tool for transferring a substrate, glass or the like is conventionally used (Patent Document 1). In this transport tool, rubber is provided on the metal plate. The object is temporarily adhered to the rubber and conveyed, and the object is removed from the carrier at the destination.
しかし、この搬送具では、吸着力が弱く適切に対象物を保持できない。よって、本願課題は、粘着力の強い搬送具と搬送方法を提供することである。 However, with this transport tool, the suction force is weak and the object can not be properly held. Therefore, an object of the present invention is to provide a highly adhesive carrier and a carrier method.
前記従来の課題を解決するために、台座と、前記台座の表面に配置された複数の柱状の突起と、を含み、前記複数の柱状の突起は、それぞれ頂部に１つの凹部を有する搬送具を用いる。
また、上記搬送具を、複数個、プレート上に重ねずに、前記突起を表面として配置した大型搬送具を用いる。
さらに、上記搬送具を、複数個、プレート上に重ねずに、前記突起を表面として配置した大型搬送具を用いて、製造の対象物を搬送する搬送方法を用いる。
上記搬送具の複数個を、上記台座を１つとして、１つの搬送具とした搬送具ユニットを用いる。
In order to solve the above-described conventional problems, a carrier includes a pedestal and a plurality of columnar protrusions disposed on the surface of the pedestal, and the plurality of columnar protrusions each have a recess at the top. Use.
Moreover, the large sized conveyance tool which has arrange | positioned the said protrusion as the surface is used, without superimposing a plurality of said conveyance tools on a plate.
Furthermore, the conveyance method which conveys the target object of manufacture is used using the large sized conveyance tool which arrange | positions the said protrusion as the surface, without superimposing a plurality of said conveyance tools on a plate.
A transport tool unit is used, in which a plurality of the transport tools are one pedestal and one pedestal.
本発明の搬送具では、対象物を十分に保持し、目的の場所まで確実に搬送できる。 In the transfer tool of the present invention, the object can be sufficiently held and can be reliably transferred to the target location.
以下本発明の実施の形態について、図面を参照しながら説明する。なお、この実施の形態によって本発明が限定されるものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited by the embodiment.
（実施の形態１）
図１（ａ）〜図１（ｄ）を用いて、実施の形態１の搬送具１０を説明する。図１（ａ）は、搬送具１０の平面図である。図１（ｂ）は、対象物１６を保持した搬送具１０の側面図である。図１（ｃ）は、搬送具１０の拡大平面図である。図１（ｄ）は、搬送具１０に対象物１６を保持させた状態での搬送具１０の拡大平面図である。対象物１６を除いて表示されている。
Embodiment 1
The conveyance tool 10 of Embodiment 1 is demonstrated using Fig.1 (a)-FIG.1 (d). FIG. 1A is a plan view of the carrier 10. FIG. 1 (b) is a side view of the carrier 10 holding the object 16. FIG. 1 (c) is an enlarged plan view of the carrier 10. FIG. 1D is an enlarged plan view of the transport tool 10 in a state in which the transport tool 10 holds an object 16. It is displayed except for the object 16.
＜構造＞
搬送具１０は、台座１５と突起１１と凹部１３と隙間１４とを含む。
台座１５は、平板状で、一方の面に突起１１を有する。台座１５は、約３０ｍｍ角の正方形形状である。１ｃｍ〜１００ｃｍまで作製できる。
突起１１は、円柱状の突起である。円の直径は、約０．５ｍｍ〜２ｍｍである。高さも、約０．５ｍｍ〜２ｍｍである。円の直径に対する高さの比（アスペクト比）は、０．５から１．５が好ましい。円柱に限られず柱状ならよい。
<Structure>
The carrier 10 includes a pedestal 15, a protrusion 11, a recess 13 and a gap 14.
The pedestal 15 is flat and has a protrusion 11 on one side. The pedestal 15 has a square shape of about 30 mm square. It can be made up to 1 cm to 100 cm.
The protrusion 11 is a cylindrical protrusion. The diameter of the circle is about 0.5 mm to 2 mm. The height is also about 0.5 mm to 2 mm. The ratio of height to diameter of the circle (aspect ratio) is preferably 0.5 to 1.5. It is not limited to a cylinder, but may be a column.
突起１１の頂部の面積の割合（占有面積、突起１１が存在する領域での単位面積あたりの面積密度）は５０％以上がよい。６０％以上が好ましい。対象物１６を保持するため、多いほどよい。ただし、突起１１は変形する必要があるので、それぞれ独立した複数の突起１１としている。頂部の面積の割合を増やすため、突起１１は、千鳥配列としている。また、突起１１は、変形した時に均等に広がるように円柱形状が好ましい。そのため、頂部の面積の割合は、９５％以下がよい。９０％以下が好ましい。
凹部１３は、突起１１と台座１５とで囲まれた空間である。
The percentage of the area of the top of the protrusion 11 (occupied area, area density per unit area in the region where the protrusion 11 is present) is preferably 50% or more. 60% or more is preferable. In order to hold the object 16, the more the better. However, since the projections 11 need to be deformed, they are provided as a plurality of independent projections 11 respectively. In order to increase the proportion of the top area, the protrusions 11 are arranged in a staggered arrangement. The projections 11 preferably have a cylindrical shape so as to spread evenly when deformed. Therefore, the percentage of the area of the top is preferably 95% or less. 90% or less is preferable.
The recess 13 is a space surrounded by the protrusion 11 and the pedestal 15.
隙間１４は、突起１１間の隙間である。突起１１が、対象物１６を保持した時、変形できるように、隙間１４が必要である。隙間１４は、０．１ｍｍ以下である。
搬送具１０は、材質が、化学的に安定なフッ素ゴムが好ましく、プレス成型もしくは注型成型で作製される。
The gap 14 is a gap between the protrusions 11. A gap 14 is necessary so that the projection 11 can deform when holding the object 16. The clearance 14 is 0.1 mm or less.
The carrier tool 10 is preferably made of a chemically stable fluororubber, and is manufactured by press molding or cast molding.
フッ素ゴムとしては、フッ化ビニリデン由来の構成単位、ヘキサフルオロプロピレンの構成単位、および、テトラフルオロエチレン由来の構成単位を主とした構成をもつフッ素ゴム組成物も利用できる。なお、フッ素ゴム全般に適応できる。テトラフルオロエチレン由来の構成単位、パーフルオロ（アルキルビニルエーテル）又は、パーフルオロ（アルコキシアルキルビニルエーテル）由来の構成単位を主とした構成を含有するパーフルオロエラストマーも利用できる。
また、ゴムとして、上記以外のフッ素ゴムも使用できる。シリコンゴム、エラストマーも使用できる。室温で、加圧で変形できるものなら使用できる。
As the fluororubber, a fluororubber composition having a constitution mainly composed of a constitutional unit derived from vinylidene fluoride, a constitutional unit of hexafluoropropylene, and a constitutional unit derived from tetrafluoroethylene can also be used. In addition, it can apply to fluororubber in general. It is also possible to use a perfluoroelastomer containing a constitution mainly composed of a constituent unit derived from tetrafluoroethylene, a constituent unit derived from perfluoro (alkyl vinyl ether) or perfluoro (alkoxy alkyl vinyl ether).
Moreover, fluororubber other than the above can also be used as rubber. Silicone rubber and elastomers can also be used. Any material that can deform under pressure at room temperature can be used.
＜製造方法＞
搬送具１０の形状に対応する凹部を施した金型を作成し、プレス機に金型を設置する。金型を１８０℃まで熱しておき、ゴム成型後にゴムが剥がれやすくするよう離型剤（フッ素系、シリコン系など）を塗布する。
ゴムシートを適切なサイズにカットし下型に置きプレスを行う。プレスは１８０℃、２４０秒で設定する。ゴムの材質により温度・時間は設定を変える。適切なサイズより少ないようであれば未加硫状態となりゴムが成型できない。
<Manufacturing method>
A mold provided with a recess corresponding to the shape of the transfer tool 10 is created, and the mold is installed in a press. The mold is heated to 180 ° C., and a release agent (fluorine-based, silicon-based, etc.) is applied to facilitate peeling of the rubber after rubber molding.
Cut the rubber sheet to an appropriate size, place it in the lower mold and press it. The press is set at 180 ° C. for 240 seconds. The temperature and time changes depending on the rubber material. If the size is smaller than the appropriate size, it becomes unvulcanized and the rubber can not be molded.
プレス後、ゴムがちぎれないよう丁寧に金型からゴムを剥がす。剥がし終わった後、外観確認をして問題なければそのゴム製品をオーブンにいれ２３２℃、１０時間熱を加える。温度・時間が少ないとゴムの物性が出ない恐れがある。ゴムの材質により温度・時間は設定を変える。オーブンでの作業後、外観確認をして問題なければ製品の完成である。 After pressing, carefully remove the rubber from the mold so that it does not break. After peeling off, the appearance of the product is checked, and if no problem is encountered, the rubber product is put in an oven and heated at 232 ° C. for 10 hours. If the temperature and time are short, the physical properties of the rubber may not be obtained. The temperature and time changes depending on the rubber material. After working in the oven, if there is no problem with the appearance check, the product is finished.
なお、ゴムシートの成形でなくともよい。通常の成形加工でもよい。台座１５と突起１１は一体で作製した方が好ましい。なぜなら、突起１１は、対象物１６により圧を受け、変形するので、破損しやすい。そのため、台座１５と突起１１とは、１つの材料で形成される方が、強度的によい。 In addition, it is not necessary to form the rubber sheet. It may be a normal molding process. It is preferable that the pedestal 15 and the projection 11 be integrally manufactured. The reason is that the projection 11 is susceptible to breakage because it is deformed by pressure from the object 16. Therefore, the pedestal 15 and the projection 11 are preferably made of one material in terms of strength.
＜保持状態＞
図１（ｂ）は、搬送具１０で対象物１６を保持している状態を示す。搬送具１０では、突起１１の頂部で対象物１６と接し、対象物１６を保持する。突起１１の頂部には粘着性があり、対象物１６を粘着保持する。
<Retention state>
FIG. 1B shows a state in which the object 16 is held by the transfer tool 10. In the transport tool 10, the top of the projection 11 contacts the object 16 and holds the object 16. The top of the projection 11 is sticky and holds the object 16 sticky.
図１（ｃ）は、対象物１６を保持していない時の搬送具１０の拡大平面であり、図１（ｄ）は、対象物１６を保持している時の搬送具１０の拡大平面である。
突起１１の頂部は、対象物１６の重さで変形し、広がり、対象物１６を保持する。このため、突起１１間には隙間１４が設けられている。より突起１１の頂部の面積を増やすことで対象物１６をより保持しやすい。そのため、突起１１を平面内で密に配置している。
なお、突起１１は、対象物１６により、圧縮変形し広がるので、複数の非接触の突起１１が好ましい。
FIG. 1 (c) is an enlarged plane of the carrier 10 when the object 16 is not held, and FIG. 1 (d) is an enlarged plane of the carrier 10 when the object 16 is held. is there.
The top of the projection 11 deforms and spreads with the weight of the object 16 and holds the object 16. For this reason, a gap 14 is provided between the protrusions 11. It is easier to hold the object 16 by increasing the area of the top of the projection 11. Therefore, the protrusions 11 are densely arranged in a plane.
In addition, since the projections 11 are compressed and deformed by the object 16, the plurality of non-contact projections 11 are preferable.
搬送具１０の硬さは、２０〜９０がよい。好ましくは、６０〜８０が好ましい。ここで、硬さは、デユロメータータイプＡでの値である。搬送具１０の硬さは、突起１１の変形のしやすさ、保持性から上記範囲となる。 The hardness of the transfer tool 10 is preferably 20-90. Preferably, 60 to 80 is preferred. Here, the hardness is the value of the dullometer type A. The hardness of the transfer tool 10 is in the above range from the ease of deformation of the protrusion 11 and the holding property.
（実施の形態２）
図２（ａ）〜図２（ｃ）を用いて、実施の形態２の搬送具２０を説明する。図２（ａ）は、搬送具２０の平面図である。図２（ｂ）は、搬送具２０の側面図である。図２（ｃ）は、搬送具２０に対象物１６を保持させた側面図である。記載しない事項は実施の形態１と同様である。
Second Embodiment
The conveyance tool 20 of Embodiment 2 is demonstrated using Fig.2 (a)-FIG.2 (c). FIG. 2A is a plan view of the carrier 20. FIG. FIG. 2 (b) is a side view of the carrier 20. FIG. 2C is a side view in which the transport tool 20 holds the object 16. Items not described are the same as in the first embodiment.
＜構造＞
搬送具２０は、台座１５と第１突起１１ａと第２突起１１ｂと凹部１３と隙間１４とを含む。
台座１５は、平板状で、一方の面に第１突起１１ａと第２突起１１ｂとを有する。
第１突起１１ａは、円柱状の突起である。実施の形態１の突起１１と同様である。
第２突起１１ｂは、円柱状の突起である。第１突起１１ａより、断面積が小さく、第１突起１１ａと同じ高さである。第１突起１１ａがメインの突起である。
<Structure>
The transfer tool 20 includes a pedestal 15, a first protrusion 11 a, a second protrusion 11 b, a recess 13, and a gap 14.
The pedestal 15 is flat and has a first protrusion 11 a and a second protrusion 11 b on one surface.
The first protrusion 11 a is a cylindrical protrusion. This is the same as the protrusion 11 of the first embodiment.
The second protrusion 11 b is a cylindrical protrusion. The cross-sectional area is smaller than that of the first projection 11a, and is the same height as the first projection 11a. The first protrusion 11 a is a main protrusion.
凹部１３は、第１突起１１ａと第２突起１１ｂと台座１５とで囲まれた空間である。
隙間１４は、第１突起１１ａと第２突起１１ｂとの間の隙間である。
第１突起１１ａの直径は、第２突起１１ｂより大きい。突起の占有面積を増やすため、密に並べると、第１突起１１ａの直径は、第２突起１１ｂの２．３倍までである。
なお、第１突起１１ａのアスペクト比は、実施の形態１の突起１１と同様で１前後である。そのため、第２突起１１ｂは、細長い突起となる。第１突起１１ａが対象物１６を受け止め、第２突起１１ｂは補助的に受け止める。第２突起１１ｂは、粘着性のアップ、真空吸着性のために存在する。
The recess 13 is a space surrounded by the first protrusion 11 a, the second protrusion 11 b, and the pedestal 15.
The gap 14 is a gap between the first protrusion 11 a and the second protrusion 11 b.
The diameter of the first protrusion 11a is larger than that of the second protrusion 11b. In order to increase the occupied area of the projections, the diameter of the first projections 11a is up to 2.3 times that of the second projections 11b when closely arranged.
The aspect ratio of the first protrusion 11 a is approximately 1 as in the case of the protrusion 11 of the first embodiment. Therefore, the second protrusion 11 b is an elongated protrusion. The first protrusion 11 a receives the object 16, and the second protrusion 11 b additionally receives it. The second protrusions 11 b are present for increasing the tackiness and vacuum adsorption.
＜保持状態＞
図３（ａ）は、対象物１６を保持する前の搬送具２０の拡大平面図である。
図３（ｂ）は、対象物１６を保持中の搬送具２０の拡大平面図である。対象物１６を省略してあらわされている。
<Retention state>
FIG. 3A is an enlarged plan view of the transfer tool 20 before holding the object 16.
FIG. 3 (b) is an enlarged plan view of the carrier 20 while holding the object 16. The object 16 is omitted.
対象物１６が、第１突起１１ａと第２突起１１ｂ上に乗せられた時、第１突起１１ａと第２突起１１ｂとは、圧縮され、隙間１４は無くなり、第１突起１１ａと第２突起１１ｂとが接触する。この状態で、凹部１３は、第１突起１１ａと第２突起１１ｂと台座１５と対象物１６とで密閉された空間となる。この時、この空間は、少し真空状態となり、対象物１６を搬送具１０により吸着、保持する。
つまり、第１突起１１ａと第２突起１１ｂの頂部の粘性と凹部１３の真空とで、対象物１６を保持できる。
When the object 16 is placed on the first protrusion 11a and the second protrusion 11b, the first protrusion 11a and the second protrusion 11b are compressed, the gap 14 disappears, and the first protrusion 11a and the second protrusion 11b And contact. In this state, the recess 13 is a space sealed by the first protrusion 11 a, the second protrusion 11 b, the pedestal 15, and the object 16. At this time, this space is slightly evacuated, and the object 16 is adsorbed and held by the carrier 10.
That is, the object 16 can be held by the viscosity of the top of the first protrusion 11 a and the second protrusion 11 b and the vacuum of the recess 13.
対象物１６を取り外す時に、少し端部を持ち上げると、すき間１４ができ、真空状態が解除され、取り出しやすい。つまり、複数の凹部１３が、端部から徐々に、その真空が解除され、対象物１６を取り出しやすい。 When the object 16 is removed, raising the end a little will create a gap 14 which will release the vacuum and facilitate removal. That is, the vacuum is gradually released from the end of the plurality of recesses 13, and the object 16 can be easily removed.
（実施の形態３）
図４（ａ）〜図４（ｃ）を用いて、実施の形態３を説明する。説明しない事項は、実施の形態１，２と同様である。
図４（ａ）は、実施の形態３の突起１１ｃの拡大側面図である。図４（ｃ）は、突起１１ｃの拡大平面図である。図４（ｂ）は、突起１１ｃ上に対象物１６が保持された場合の拡大側面図である。突起１１ｃは、実施の形態１または２の搬送具の突起である。
Third Embodiment
The third embodiment will be described with reference to FIGS. 4 (a) to 4 (c). Matters not described are the same as in the first and second embodiments.
FIG. 4A is an enlarged side view of the protrusion 11c of the third embodiment. FIG. 4C is an enlarged plan view of the protrusion 11c. FIG. 4B is an enlarged side view of the case where the object 16 is held on the protrusion 11c. The protrusion 11 c is a protrusion of the carrier according to the first or second embodiment.
突起１１ｃは、円柱形状で頂部に１つの凹部４１を有する。凹部４１の周囲は、突起凸部１１ｄで囲まれる。円柱形状でなくとも柱状であればよい。凹部４１の深さは、数ミクロン、１〜５μである。突起１１ｄの直径は、約０．５ｍｍ〜１．５ｍｍである。凹部４１の深さが、深いと、空気が、凹部４１と対象物１６間に残り、吸着性がよくない。
突起１１ｃ上に対象物１６が保持されると、突起１１ｃは、頂部の突起凸部１１ｄが変形し、突起１１ｃの側面が膨らみ、突起側部１１ｅができる。この時、突起１１ｃの頂部は、より広い面として、対象物１６を保持できる。円柱でなく角柱でもよい。
突起１１ｃは、実施の形態１，２の突起として使用できる。さらに、実施の形態１，２とは無関係に単独で使用してもよい。
The protrusion 11c has a cylindrical shape and has one recess 41 at the top. The periphery of the recess 41 is surrounded by the protrusion 11 d. Even if it is not cylindrical, it may be columnar. The depth of the recess 41 is several microns, 1 to 5 μ. The diameter of the protrusion 11 d is about 0.5 mm to 1.5 mm. When the depth of the recess 41 is deep, air remains between the recess 41 and the object 16 and the adsorptivity is not good.
When the object 16 is held on the protrusion 11c, the protrusion 11d on the top of the protrusion 11c is deformed, and the side surface of the protrusion 11c is expanded to form a protrusion side 11e. At this time, the top of the projection 11 c can hold the object 16 as a wider surface. It may be a prism instead of a cylinder.
The protrusion 11c can be used as the protrusion of the first and second embodiments. Furthermore, they may be used independently of the first and second embodiments.
（実施の形態４）
実施の形態４を図５（ａ）と図５（ｂ）で説明する。記載しない事項は、上記の実施の形態と同様である。
図５（ａ）は、大型搬送具５０の対象物１６を保持しているところの側面図である。
図５（ｂ）は、大型搬送具５０の平面図である。
対象物１６が大きくなると、上記実施の形態の搬送具１０，２０を大きくしてもよいが、作製上の問題、コスト面から好ましくない。
Embodiment 4
The fourth embodiment will be described with reference to FIGS. 5 (a) and 5 (b). Matters that are not described are the same as in the above embodiment.
FIG. 5A is a side view of the large-sized transfer tool 50 where the object 16 is held.
FIG. 5 (b) is a plan view of the large-sized transfer tool 50.
When the object 16 becomes large, the transport tools 10 and 20 of the above-described embodiment may be enlarged, but this is not preferable in terms of problems in production and cost.
そこで、この実施の形態では、複数の搬送具３０を用いる。搬送具３０は、上記実施の形態の搬送具のいずれかである。複数種類の搬送具を用いてもよい。搬送具３０の大きさは、１０ｍｍ角〜５０ｍｍ角の面積で正方形、長方形、ひし形、台形でもよい。
大型搬送具５０は、搬送台１７と搬送具３０とを含む。
搬送台１７は、金属板などで運搬用の台座である。
搬送具３０は、上記実施の形態の搬送具のいずれか１つまたは複数である。
大型搬送具５０は、その表面に、複数の搬送具３０を配置されている。複数の搬送具３０上に対象物１６が乗り、対象物１６が保持されている。
Therefore, in this embodiment, a plurality of transport tools 30 are used. The transfer tool 30 is any of the transfer tools of the above embodiments. A plurality of types of transport tools may be used. The size of the transfer tool 30 may be a square, a rectangle, a rhombus, or a trapezoid in an area of 10 mm square to 50 mm square.
The large-sized transfer tool 50 includes the transfer stand 17 and the transfer tool 30.
The transport stand 17 is a pedestal for transport with a metal plate or the like.
The transfer tool 30 is any one or more of the transfer tools of the above embodiments.
The large-sized transfer tool 50 has a plurality of transfer tools 30 arranged on its surface. The object 16 rides on a plurality of transport tools 30 and the object 16 is held.
搬送具３０は、対象物１６に対して、均等に配置されるのが好ましい。ただし、搬送具３０を、周辺部のみ、端部部のみに配置してもよい。全体として対象物１６とを保持する。搬送具３０は、搬送台１７に接着固定されている。 It is preferable that the transfer tool 30 be evenly disposed with respect to the object 16. However, the transfer tool 30 may be disposed only at the peripheral portion and only at the end portion. It holds the object 16 as a whole. The carrier 30 is adhesively fixed to the carrier 17.
結果、搬送具３０を大きくしなくとも、大型搬送具５０が実現できる。
また、図５（ｃ）の平面図、図５（ｄ）の側面図で示す搬送具ユニット５１を用いることができる。搬送具ユニット５１は、搬送具３０を複数有する。これは、搬送具３０を作製する時に、台座１５を共通にして複数の搬送具３０を作製したものである。搬送具ユニット５１で供給し、マーク５２に沿ってカットして、複数の搬送具３０として利用するものである。マーク５２は、搬送具ユニット５１の製造時に金型により設けることができる。マーク５２は無くともよい。搬送具ユニット５１において、搬送具３０間は、突起のない台座１５のみの平面である。
As a result, the large-sized transfer tool 50 can be realized without increasing the size of the transfer tool 30.
Moreover, the transfer tool unit 51 shown by the top view of FIG.5 (c) and the side view of FIG.5 (d) can be used. The carrier unit 51 has a plurality of carriers 30. In this case, when the carrier 30 is manufactured, the plurality of carriers 30 are manufactured with the pedestal 15 in common. The material is supplied by the carrier unit 51 and cut along the marks 52 to be used as the plurality of carriers 30. The mark 52 can be provided by a mold when the carrier unit 51 is manufactured. The mark 52 may not be present. In the transfer tool unit 51, the space between the transfer tools 30 is a flat surface of only the pedestal 15 without a protrusion.
搬送具３０は、直接、搬送台１７に接着材などで固定することができる。しかし、搬送具３０を一端、中間体に接着材で貼り付け、その中間体をネジなど物理的に搬送台１７に固定するのが好ましい。搬送具３０は定期的に、消耗し交換されるが、搬送台１７は、長期間使用されるので、長期間使用できるように、搬送台１７に接着材などを直接使用しないのが好ましい。 The transfer tool 30 can be directly fixed to the transfer stand 17 with an adhesive or the like. However, it is preferable that one end of the carrier tool 30 be attached to the intermediate body with an adhesive and that the intermediate body be physically fixed to the carrier table 17 such as a screw. Although the transfer tool 30 is consumed and replaced regularly, since the transfer table 17 is used for a long time, it is preferable not to use an adhesive or the like directly on the transfer table 17 so that it can be used for a long time.
（全体として）
上記実施の形態１〜４は組み合わせできる。
対象物１６は、ガラスパネル、半導体チップ、レンズ、ウエハーなどであり、限定されない。
(as a whole)
The first to fourth embodiments can be combined.
The object 16 is a glass panel, a semiconductor chip, a lens, a wafer, etc., and is not limited.
本発明の搬送具と大型搬送具は、半導体、デイスプレイなどをデバイスの製造において、対象物を搬送する時に利用できる。その他の製品の製造でも利用できる。 The transfer tool and the large-size transfer tool of the present invention can be used to transfer semiconductors, displays and the like in the manufacture of devices. It can also be used to manufacture other products.
１０，２０，３０ 搬送具
１１，１１ｃ 突起
１１ａ 第１突起
１１ｂ 第２突起
１１ｄ 突起凸部
１１ｅ 突起側部
１３，４１ 凹部
１４ 隙間
１５ 台座
１６ 対象物
１７ 搬送台
３０ 搬送具
５０ 大型搬送具
５１ 搬送具ユニット
５２ マーク
DESCRIPTION OF SYMBOLS 10, 20, 30 Conveying tools 11 and 11c Protrusion 11a 1st projection 11b 2nd projection 11d Protrusion convex part 11e Protrusion side part 13 and 41 Recess 14 Clearance 15 Base 16 Object 17 Conveyance table 30 Conveyance tool 30 Large conveyance tool 51 Conveyance Unit 52 mark
Claims (12)
前記台座の表面に配置された複数の柱状の突起と、を含み、
前記複数の柱状の突起は、それぞれ頂部に１つの凹部を有する搬送具。 The pedestal,
And a plurality of columnar protrusions disposed on the surface of the pedestal,
Each of the plurality of columnar projections has a recess at its top.
A carrier unit comprising a plurality of the carrier according to any one of claims 1 to 7 as one carrier with one pedestal.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017228627A JP6353969B1 (en) | 2017-11-29 | 2017-11-29 | Transport tool, transport method and transport tool unit |
| TW107127964A TWI666722B (en) | 2017-11-29 | 2018-08-10 | Conveyor and large conveyer, conveying method and conveyer unit |
| KR1020180097831A KR102170518B1 (en) | 2017-11-29 | 2018-08-22 | Transport tool, transport method and transport unit |
| CN201811098681.4A CN109835714B (en) | 2017-11-29 | 2018-09-19 | Conveyance tool, conveyance method, and conveyance tool unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017228627A JP6353969B1 (en) | 2017-11-29 | 2017-11-29 | Transport tool, transport method and transport tool unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6353969B1 JP6353969B1 (en) | 2018-07-04 |
| JP2019102509A true JP2019102509A (en) | 2019-06-24 |
Family
ID=62779963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017228627A Active JP6353969B1 (en) | 2017-11-29 | 2017-11-29 | Transport tool, transport method and transport tool unit |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6353969B1 (en) |
| KR (1) | KR102170518B1 (en) |
| CN (1) | CN109835714B (en) |
| TW (1) | TWI666722B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022137889A1 (en) * | 2020-12-24 | 2022-06-30 | 信越化学工業株式会社 | Stamp component for transferring microstructure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281254A (en) * | 2006-04-07 | 2007-10-25 | Tokyo Electron Ltd | Substrate support and substrate transfer mechanism |
| WO2011096208A1 (en) * | 2010-02-05 | 2011-08-11 | 東京エレクトロン株式会社 | Substrate holder, substrate transfer apparatus, and substrate processing apparatus |
| JP2014101192A (en) * | 2012-11-20 | 2014-06-05 | Alpha- Design Kk | Suction holding device, and suction holding method and program for transported body by suction holding device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4272216B2 (en) | 2003-02-07 | 2009-06-03 | パナソニック株式会社 | Board holder |
| WO2007105611A1 (en) * | 2006-03-15 | 2007-09-20 | Shin-Etsu Polymer Co., Ltd. | Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure, semiconductor wafer grinding method using such semiconductor wafer protecting structure, and semiconductor chip manufacturing method |
| JP2008103493A (en) * | 2006-10-18 | 2008-05-01 | Lintec Corp | Method and apparatus for picking up chip |
| CN102870204B (en) * | 2010-06-07 | 2016-02-03 | 日本电气硝子株式会社 | The transfer device of tabular component and absorption layer |
| JP5343954B2 (en) * | 2010-11-01 | 2013-11-13 | 株式会社安川電機 | Substrate transfer hand, substrate transfer apparatus and substrate transfer method including the same |
| KR20120124700A (en) * | 2011-05-04 | 2012-11-14 | 엠.씨.케이 (주) | Pad for adsorbing the substrate and manufacturing method thereof |
-
2017
- 2017-11-29 JP JP2017228627A patent/JP6353969B1/en active Active
-
2018
- 2018-08-10 TW TW107127964A patent/TWI666722B/en active
- 2018-08-22 KR KR1020180097831A patent/KR102170518B1/en active IP Right Grant
- 2018-09-19 CN CN201811098681.4A patent/CN109835714B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281254A (en) * | 2006-04-07 | 2007-10-25 | Tokyo Electron Ltd | Substrate support and substrate transfer mechanism |
| WO2011096208A1 (en) * | 2010-02-05 | 2011-08-11 | 東京エレクトロン株式会社 | Substrate holder, substrate transfer apparatus, and substrate processing apparatus |
| JP2014101192A (en) * | 2012-11-20 | 2014-06-05 | Alpha- Design Kk | Suction holding device, and suction holding method and program for transported body by suction holding device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022137889A1 (en) * | 2020-12-24 | 2022-06-30 | 信越化学工業株式会社 | Stamp component for transferring microstructure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201926521A (en) | 2019-07-01 |
| JP6353969B1 (en) | 2018-07-04 |
| TWI666722B (en) | 2019-07-21 |
| KR102170518B1 (en) | 2020-10-27 |
| KR20190063370A (en) | 2019-06-07 |
| CN109835714A (en) | 2019-06-04 |
| CN109835714B (en) | 2021-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6128459B2 (en) | Method for peeling a semiconductor chip from a metal foil | |
| JP4268091B2 (en) | Parts holder | |
| JP6340693B2 (en) | Substrate holding device, contact exposure device, and proximity exposure device | |
| TW201736144A (en) | Soft adsorption attaching platform being used for realizing overall adsorption or partial adsorption of the surfaces of plates of various sizes without being easily limited | |
| US11784083B2 (en) | Pad structure for transferring flat panel | |
| JP2018182278A5 (en) | ||
| EP3605597B1 (en) | Silicon chip holding device, silicon chip conveying device, silicon chip delivery system and conveying method | |
| JP5337620B2 (en) | Workpiece adhesive holding device and vacuum bonding machine | |
| JP2019102509A (en) | Transport tool, transport method, and transport tool unit | |
| JP2005135931A (en) | Device and method for sticking tape | |
| TWI632982B (en) | Plate retaining device | |
| JP4863350B2 (en) | Adhesive sheet and holding jig | |
| JP5757649B2 (en) | Holding jig | |
| JP5254832B2 (en) | Wafer holding mechanism | |
| CN205944048U (en) | Wafer bonded equipment | |
| JP5577817B2 (en) | Substrate mounting pad mechanism | |
| TWM355236U (en) | Carrier platform structure for vacuum suction apparatus | |
| CN211614566U (en) | Vacuum adsorption disc | |
| JP2014184502A (en) | Suction pad and workpiece processing device | |
| CN102130019B (en) | Semiconductor packaging process and die utilized in same | |
| JP5795272B2 (en) | Method for manufacturing ceramic element | |
| US11164771B1 (en) | Wafer transferring device | |
| CN221160033U (en) | Vacuum chuck | |
| JP6312248B2 (en) | Thin plate holder and method of using the same | |
| JP2009266866A (en) | Adhesion device of material to be processed |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171206 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20171206 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20171222 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171226 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180222 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180327 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180419 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180605 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180611 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6353969 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |