JP2001221486A - Control equipment with temperature sensor - Google Patents
Control equipment with temperature sensorInfo
- Publication number
- JP2001221486A JP2001221486A JP2000034616A JP2000034616A JP2001221486A JP 2001221486 A JP2001221486 A JP 2001221486A JP 2000034616 A JP2000034616 A JP 2000034616A JP 2000034616 A JP2000034616 A JP 2000034616A JP 2001221486 A JP2001221486 A JP 2001221486A
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- circuit board
- printed circuit
- heat
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Air Conditioning Control Device (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、室内の温度等を検
出して空気調和機等の運転を制御する機器（リモコン）
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device (remote control) for detecting an indoor temperature or the like and controlling the operation of an air conditioner or the like.
About.
【０００２】[0002]
【従来の技術】例えば、特開平６−８２３１５号公報で
は、小型、高精度で応答性に優れた温度を検出するセン
サを提供する方法が開示されている。2. Description of the Related Art For example, Japanese Patent Laying-Open No. 6-82315 discloses a method for providing a small-sized, highly accurate, and highly responsive sensor for detecting temperature.
【０００３】この発明によると、絶縁性セラミックス製
の実装シートと、絶縁性セラミックス製のカバーシート
と、リード部材とを有している複数のサーミスタ素子を
密閉・内蔵したサーミスタ式温度センサの応答性を高め
る方法が示されている。According to the present invention, the response of a thermistor-type temperature sensor in which a plurality of thermistor elements each having a mounting sheet made of insulating ceramics, a cover sheet made of insulating ceramics, and a lead member are hermetically sealed and built-in. Are shown.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな温度センサ本体を改良して温度検知の応答性を高め
る方法は設計及び製造方法の変更を必要とする為、開発
コスト・製造コストの増加は免れなかった。However, such a method of improving the temperature sensor main body and improving the responsiveness of temperature detection requires a change in design and manufacturing method, so that development costs and manufacturing costs are increased. I was not spared.
【０００５】本発明は、温度センサを取付けるプリント
基板にわずかな変更を加えるだけで上述した温度センサ
の応答性を高める方法を提供するものである。The present invention provides a method for improving the responsiveness of the above-described temperature sensor by making a slight change to the printed circuit board on which the temperature sensor is mounted.
【０００６】[0006]
【発明が解決しようとする手段】上記課題を解決するた
めに、請求項１に記載の発明は、室内温度を検出する感
熱部と該感熱部から延びるリード線とを有する温度セン
サと、前記温度センサのリード線を制御回路が構成され
るプリント基板上に接着し室内温度を検出して空気調和
機等の運転を制御する機器において、前記プリント基板
には前記リード線の取付け部の周囲にスリットを設ける
ことである。According to one aspect of the present invention, there is provided a temperature sensor having a heat-sensitive portion for detecting a room temperature and a lead wire extending from the heat-sensitive portion; In a device for controlling the operation of an air conditioner or the like by bonding a sensor lead wire to a printed circuit board on which a control circuit is formed and detecting an indoor temperature, a slit is formed around a mounting portion of the lead wire on the printed circuit board. Is provided.
【０００７】請求項１に記載の発明には、次の作用があ
る。上述の温度センサを取付けたプリント基板は、該プ
リント基板上に制御回路が構成されており、通電によっ
て制御回路自身が発熱することによりプリント基板を加
熱する、この熱は熱伝導によりプリント基板上の温度セ
ンサ取付け部へと至り温度センサに影響を与えるため、
このプリント基板の温度センサ取付け部周囲にスリット
を設けることにより、制御回路部からプリント基板の熱
伝導により伝わる熱を遮断し、室内温度を温度センサで
正確に検出する。The first aspect of the invention has the following operation. The printed circuit board on which the above-mentioned temperature sensor is mounted has a control circuit formed on the printed circuit board, and the control circuit itself generates heat when energized, thereby heating the printed circuit board. This heat is transferred to the printed circuit board by heat conduction. To reach the temperature sensor mounting part and affect the temperature sensor,
By providing a slit around the temperature sensor mounting portion of the printed circuit board, heat transmitted from the control circuit unit due to heat conduction of the printed circuit board is blocked, and the room temperature is accurately detected by the temperature sensor.
【０００８】請求項２に記載の発明は、室内温度を検出
する感熱部と該感熱部から延びるリード線とを有する温
度センサと、前記感熱素子を制御回路が構成されるプリ
ント基板上に接着し室内温度を検出して空気調和機等の
運転を制御する機器において、前記プリント基板の感熱
素子を接着する周囲に、室温検知精度を向上させるため
のパターン配線を設けることことである。According to a second aspect of the present invention, there is provided a temperature sensor having a heat-sensitive portion for detecting a room temperature and a lead wire extending from the heat-sensitive portion, and the heat-sensitive element is bonded to a printed circuit board on which a control circuit is formed. In a device for detecting the room temperature and controlling the operation of an air conditioner or the like, a pattern wiring for improving room temperature detection accuracy is provided around the printed circuit board around which the heat-sensitive element is bonded.
【０００９】請求項２に記載の発明には、次の作用があ
る。上述の温度センサを取付けたプリント基板は、該プ
リント基板上の温度センサ取付け部のパターン配線を例
えば拡大することにより室温検知精度を向上することが
できる。The invention according to claim 2 has the following operation. The printed circuit board to which the above-mentioned temperature sensor is attached can improve the room temperature detection accuracy by enlarging the pattern wiring of the temperature sensor attachment portion on the printed board, for example.
【００１０】請求項３に記載の発明は、請求項１ないし
２に記載の項目の少なくともいずれか１項目に該当する
温度センサを備えることである。According to a third aspect of the present invention, there is provided a temperature sensor corresponding to at least one of the items described in the first and second aspects.
【００１１】請求項３に記載の発明には、次の作用があ
る。上述の温度センサを取付けたプリント基板は、プリ
ント基板上に取付けた温度センサの周囲にスリットを設
ける及び／又はこのプリント基板の温度センサ取付け部
のパターン配線を拡大することを組み合わせることによ
り、温度センサの室温検知精度を向上することができ
る。The third aspect of the invention has the following operation. The printed circuit board on which the above-described temperature sensor is mounted may be provided with a slit around the temperature sensor mounted on the printed circuit board and / or by enlarging the pattern wiring of the temperature sensor mounting portion of the printed circuit board. Room temperature detection accuracy can be improved.
【００１２】[0012]
【発明の実施の形態】次に、本発明の一実施形態を、図
面に基づき説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【００１３】図１は、本発明に係わる温度センサを備え
た制御機器（空気調和機の運転を制御するリモコン）の
一実施の形態における説明図である。FIG. 1 is an explanatory view in one embodiment of a control device (remote control for controlling the operation of an air conditioner) provided with a temperature sensor according to the present invention.
【００１４】図１において１はプリント基板で、感熱部
２とリード線３からなる温度センサ１０、該温度センサ
１０の取付け部パターン４及び制御回路５から構成され
ており、このプリント基板１は、温度センサ１０の周囲
にスリット６が設けられている。In FIG. 1, reference numeral 1 denotes a printed circuit board, which comprises a temperature sensor 10 comprising a heat sensitive portion 2 and a lead wire 3, a mounting portion pattern 4 of the temperature sensor 10, and a control circuit 5. A slit 6 is provided around the temperature sensor 10.
【００１５】このスリット６を設けた事によりプリント
基板１において、制御回路５側から温度センサ１０側へ
の熱伝導を小さく抑えた区画部７が形成されている。従
って、プリント基板１上の制御回路５が通電中に発生す
る熱は区画部７によって温度センサ１０側へ伝わりにく
くなり、温度センサ１０の温度検知精度に与える影響度
を最小限に食い止める作用を行っている。The provision of the slit 6 forms a partition 7 on the printed circuit board 1 in which heat conduction from the control circuit 5 side to the temperature sensor 10 side is kept small. Therefore, the heat generated when the control circuit 5 on the printed circuit board 1 is energized becomes less likely to be transmitted to the temperature sensor 10 by the partition portion 7, and acts to minimize the influence on the temperature detection accuracy of the temperature sensor 10. ing.
【００１６】図２において、２０は、感熱部２とリード
線３からなる温度センサ１０、該温度センサ１０の取付
け部パターン２１及び制御回路５からなるプリント基板
で、このプリント基板２０は、温度センサ１０の取付け
部パターン２１を拡大し、例えばこのパターンを温度特
性の良い銅箔等で配線することにより、このプリント基
板２０を、温度センサ１０の周囲の雰囲気が、空気の流
れの少ない空気調和機のリモコン機器等で使用される場
合でも、この取付け部パターン２１が雰囲気に応じて温
度変化し温度センサ１０の温度検知精度を向上させるこ
とができる。In FIG. 2, reference numeral 20 denotes a printed circuit board comprising a temperature sensor 10 comprising a heat-sensitive portion 2 and a lead wire 3, a mounting portion pattern 21 of the temperature sensor 10, and a control circuit 5. The printed circuit board 20 comprises a temperature sensor. By enlarging the mounting portion pattern 21 of FIG. 10 and, for example, wiring this pattern with a copper foil or the like having a good temperature characteristic, the printed circuit board 20 can be mounted in an air conditioner in which the atmosphere around the temperature sensor 10 has a small air flow. In this case, the temperature of the attachment portion pattern 21 changes in accordance with the atmosphere, so that the temperature detection accuracy of the temperature sensor 10 can be improved.
【００１７】図３は、本発明の一実施例である空気調和
機のリモコンの外観図である。１１は、運転／停止スイ
ッチ１２、冷暖運転切換スイッチ１３、温度設定スイッ
チ１４、風速切換スイッチ１５等の操作部と、温度を検
出する温度センサ１０とが設けられているリモコンの筐
体である。このリモコン１１の内部には、本発明の温度
センサを備えたプリント基板が内蔵されスリット３０に
て室内空気が通風可能なスペース３１が形成され、この
スペース３１に図１並びに図２で示すような温度センサ
１０が位置している。FIG. 3 is an external view of a remote controller of an air conditioner according to one embodiment of the present invention. Reference numeral 11 denotes a remote control housing provided with operation units such as an operation / stop switch 12, a cooling / heating operation changeover switch 13, a temperature setting switch 14, a wind speed changeover switch 15, and a temperature sensor 10 for detecting a temperature. Inside the remote controller 11, a printed circuit board provided with the temperature sensor of the present invention is incorporated, and a space 31 through which room air can flow is formed by the slit 30, and the space 31 is formed as shown in FIGS. A temperature sensor 10 is located.
【００１８】図４は、図３に示したリモコンの斜視図で
ある。FIG. 4 is a perspective view of the remote controller shown in FIG.
【００１９】図５は、図３に示したリモコンの筐体１１
の内部に備えられるプリント基板１の表面における温度
センサ１０の取付け状態を示したものであり、感熱部２
とリード線３を有する温度センサ１０が、取付け部パタ
ーン４の面積を大きくしているとともに、その周囲にス
リット６を設けている様子を示している。３２は、室内
空気が通風可能なスペース３１を区画するための立上部
で、スリット６は、この立上部３２に沿って位置するよ
うになっている。FIG. 5 shows a case 11 of the remote controller shown in FIG.
FIG. 4 shows a state of attachment of the temperature sensor 10 on the surface of the printed circuit board 1 provided in the inside of the heat sensitive unit 2.
And a temperature sensor 10 having lead wires 3 in which the area of the attachment pattern 4 is increased and slits 6 are provided around the area. Reference numeral 32 denotes a rising portion for defining a space 31 through which room air can pass, and the slit 6 is located along the rising portion 32.
【００２０】図６は、図３に示したリモコンの筐体１１
の内部に備えられるプリント基板１の裏面における温度
センサ１０の取付け状態を示したものであり、感熱部２
とリード線部３を有する温度センサ１０が、取付け部パ
ターン４の面積を大きくしているとともに、その周囲に
スリット６を設けている様子を示している。FIG. 6 shows a case 11 of the remote controller shown in FIG.
FIG. 3 shows a state of attachment of the temperature sensor 10 on the back surface of the printed circuit board 1 provided in the inside of the heat sensitive unit 2.
And the temperature sensor 10 having the lead wire portion 3 has an enlarged area of the mounting portion pattern 4 and a slit 6 provided around the same.
【００２１】以上、本発明を上記実施の形態に基づいて
説明したが、本発明はこれに限定されるものではない。Although the present invention has been described based on the above embodiment, the present invention is not limited to this.
【００２２】[0022]
【発明の効果】以上のように、請求項１に記載の発明に
よれば、このプリント基板の温度センサ取付け部周囲に
スリットを設けることにより、制御回路部からプリント
基板の熱伝導により伝わる熱を遮断することができ、プ
リント基板にスリットを設けることによる設計／製造す
るコストは、ほとんど無視できるため安価に温度センサ
の温度検知精度の向上を図れる。As described above, according to the first aspect of the present invention, by providing a slit around the temperature sensor mounting portion of the printed circuit board, the heat transmitted from the control circuit portion by the heat conduction of the printed circuit board is provided. It can be cut off, and the cost of designing / manufacturing by providing slits on the printed circuit board can be almost ignored, so that the temperature detection accuracy of the temperature sensor can be improved at low cost.
【００２３】請求項２に記載の発明によれば、温度セン
サを取付けたプリント基板は、該プリント基板上の温度
センサ取付け部のパターン配線を例えば拡大することに
より室温検知精度を向上することができ、パターン配線
を拡大することによる設計／製造するコストは、ほとん
ど無視できるため安価に温度センサの温度検知精度の向
上を図れる。According to the second aspect of the present invention, the printed circuit board on which the temperature sensor is mounted can improve the room temperature detection accuracy by enlarging the pattern wiring of the temperature sensor mounting portion on the printed circuit board, for example. The cost of designing / manufacturing by enlarging the pattern wiring is almost negligible, so that the temperature detection accuracy of the temperature sensor can be improved at low cost.
【００２４】請求項３に記載の発明によれば、温度セン
サを取付けたプリント基板は、プリント基板上に取付け
た温度センサの周囲にスリットを設ける及び／又はこの
プリント基板の温度センサ取付け部のパターン配線を拡
大することを組み合わせることにより、温度センサの室
温検知精度を向上することができる。According to the third aspect of the present invention, the printed circuit board on which the temperature sensor is mounted is provided with a slit around the temperature sensor mounted on the printed circuit board and / or a pattern of the temperature sensor mounting portion of the printed circuit board. By combining the enlargement of the wiring, the room temperature detection accuracy of the temperature sensor can be improved.
【図１】本発明に請求項１に係る温度センサを備えたプ
リント基板の一実施の形態における説明図である。FIG. 1 is an explanatory view in one embodiment of a printed circuit board provided with a temperature sensor according to claim 1 of the present invention.
【図２】本発明に請求項２に係る温度センサを備えたプ
リント基板の一実施の形態における説明図である。FIG. 2 is an explanatory view in one embodiment of a printed circuit board provided with a temperature sensor according to claim 2 of the present invention.
【図３】本発明に係る空気調和装置におけるリモコンを
示す正面図である。FIG. 3 is a front view showing a remote controller in the air-conditioning apparatus according to the present invention.
【図４】図３に示したリモコンの温度センサ部分を示す
斜視図である。FIG. 4 is a perspective view showing a temperature sensor portion of the remote controller shown in FIG.
【図５】図３に示したリモコン内部に設置したプリント
基板の表面図である。FIG. 5 is a front view of a printed circuit board installed inside the remote controller shown in FIG. 3;
【図６】図３に示したリモコン内部に設置したプリント
基板の裏面図である。FIG. 6 is a rear view of the printed circuit board installed inside the remote controller shown in FIG. 3;
１ プリント基板 ２ 感熱部 ３ リード線 ４ パターン配線 ５ 制御回路 ６ スリット ７ 区画部 １０ 温度センサ DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Heat sensitive part 3 Lead wire 4 Pattern wiring 5 Control circuit 6 Slit 7 Division part 10 Temperature sensor
フロントページの続き (72)発明者 西田 圭二 大阪府守口市京阪本通２丁目５番５号 三 洋電機株式会社内 Ｆターム(参考） 3L061 BA01 5E338 AA01 AA11 BB06 BB17 BB75 CC10 CD23 EE01 EE03 Continued on the front page (72) Inventor Keiji Nishida 2-5-5 Keihanhondori, Moriguchi-shi, Osaka F-term in Sanyo Electric Co., Ltd. 3L061 BA01 5E338 AA01 AA11 BB06 BB17 BB75 CC10 CD23 EE01 EE03
Claims (3)
延びるリード線とを有する温度センサと、前記温度セン
サのリード線を制御回路が構成されるプリント基板上に
接着し室内温度を検出して空気調和機等の運転を制御す
る機器において、前記プリント基板には前記リード線の
取付け部の周囲にスリットを設けることを特徴とする温
度センサを備える制御機器。1. A temperature sensor having a heat sensitive part for detecting a room temperature and a lead wire extending from the heat sensitive part, and a lead wire of the temperature sensor is adhered to a printed circuit board on which a control circuit is formed to detect a room temperature. A device for controlling the operation of an air conditioner or the like, wherein the printed circuit board is provided with a slit around a mounting portion of the lead wire, the control device including a temperature sensor.
延びるリード線とを有する温度センサと、前記感熱素子
を制御回路が構成されるプリント基板上に接着し室内温
度を検出して空気調和機等の運転を制御する機器におい
て、前記プリント基板の感熱素子を接着する周囲に、室
温検知精度を向上させるためのパターン配線を設けるこ
とを特徴とする温度センサを備える制御機器。2. A temperature sensor having a heat-sensitive part for detecting a room temperature and a lead wire extending from the heat-sensitive part, and the heat-sensitive element is adhered to a printed circuit board on which a control circuit is formed, and the room temperature is detected and air is detected. A control device including a temperature sensor, wherein a pattern wiring for improving room temperature detection accuracy is provided around a portion of the printed circuit board to which the heat-sensitive element is bonded, such as a harmonic machine.
もいずれか１項目に該当する温度センサを備える制御機
器。3. A control device comprising a temperature sensor corresponding to at least one of the items described in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000034616A JP3995382B2 (en) | 2000-02-14 | 2000-02-14 | Control device with temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000034616A JP3995382B2 (en) | 2000-02-14 | 2000-02-14 | Control device with temperature sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001221486A true JP2001221486A (en) | 2001-08-17 |
| JP3995382B2 JP3995382B2 (en) | 2007-10-24 |
Family
ID=18558925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000034616A Expired - Fee Related JP3995382B2 (en) | 2000-02-14 | 2000-02-14 | Control device with temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3995382B2 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007263636A (en) * | 2006-03-28 | 2007-10-11 | Meidensha Corp | Temperature measuring instrument and temperature monitoring method for electronic equipment unit |
| US20100290183A1 (en) * | 2008-01-31 | 2010-11-18 | Rijken Christopher N | Insulating Aperture In Printed Circuit Boards |
| WO2013093959A1 (en) * | 2011-12-20 | 2013-06-27 | 三菱電機株式会社 | Remote control device for air conditioning |
| CN103313581A (en) * | 2012-03-12 | 2013-09-18 | 西门子公司 | Assembly for a modular automation device |
| JP2015087196A (en) * | 2013-10-30 | 2015-05-07 | 日立オートモティブシステムズ株式会社 | Temperature control device for heater for temperature/humidity sensor |
| CN105705941A (en) * | 2013-11-15 | 2016-06-22 | 本田技研工业株式会社 | Gas sensor |
| JP2017057828A (en) * | 2015-09-18 | 2017-03-23 | アイシン精機株式会社 | Electric pump |
| DE102014104976B4 (en) * | 2013-04-29 | 2017-07-06 | Toyota Jidosha Kabushiki Kaisha | Printed circuit boards with temperature management features and temperature management devices having the same |
| US10028413B2 (en) | 2014-07-25 | 2018-07-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Heat transfer management apparatuses having a composite lamina |
| CN111492215A (en) * | 2017-10-23 | 2020-08-04 | 盛思锐股份公司 | Sensor module, in particular for measuring the ambient temperature, the relative air humidity and the gas concentration in the environment in which the sensor module is located |
-
2000
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007263636A (en) * | 2006-03-28 | 2007-10-11 | Meidensha Corp | Temperature measuring instrument and temperature monitoring method for electronic equipment unit |
| US20100290183A1 (en) * | 2008-01-31 | 2010-11-18 | Rijken Christopher N | Insulating Aperture In Printed Circuit Boards |
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| US8335077B2 (en) | 2008-01-31 | 2012-12-18 | Hewlett-Packard Development Company, L.P. | Insulating aperture in printed circuit boards |
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| WO2013093959A1 (en) * | 2011-12-20 | 2013-06-27 | 三菱電機株式会社 | Remote control device for air conditioning |
| EP2640175A1 (en) * | 2012-03-12 | 2013-09-18 | Siemens Aktiengesellschaft | Assembly for a modular automation device |
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| JPWO2015072430A1 (en) * | 2013-11-15 | 2017-03-16 | 本田技研工業株式会社 | Gas sensor |
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| JP3995382B2 (en) | 2007-10-24 |
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