JP2019076932A - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
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- JP2019076932A JP2019076932A JP2017206117A JP2017206117A JP2019076932A JP 2019076932 A JP2019076932 A JP 2019076932A JP 2017206117 A JP2017206117 A JP 2017206117A JP 2017206117 A JP2017206117 A JP 2017206117A JP 2019076932 A JP2019076932 A JP 2019076932A
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- 239000007788 liquid Substances 0.000 claims abstract description 215
- 230000001678 irradiating effect Effects 0.000 claims abstract description 10
- 238000007599 discharging Methods 0.000 claims abstract description 6
- 238000002679 ablation Methods 0.000 description 14
- 238000001914 filtration Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000012530 fluid Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Laser Surgery Devices (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
レーザー光線の波長 :226nm、355nm、532nm、1064nm
平均出力 :10〜100W
繰り返し周波数 :0〜300MHz
パルス幅 :50fs〜1ns
加工送り速度 :10〜1000mm/s
6:レーザー光線照射手段
21:基台
22:枠体
23:案内レール
24:保持テーブル移動手段
241:雄ねじロッド
242:パルスモータ
30:保持手段
31:保持基台
31a:被案内溝
31b:貫通雌ねじ孔
32:ベーステーブル
33:中央テーブル
34:保持テーブル
34a:吸着チャック
40:液体供給機構
41:液体チャンバー
41a:フレーム
41b:空間
41c:液体供給口
41d:液体排出口
42:透明板
43:液体供給ノズル
44:液体排出ノズル
45:液体供給ポンプ
46:濾過フィルター
47:液体貯留タンク
52:ローラ
54:モータ
82:発振器
86:集光器
88:アライメント手段
LB:レーザー光線
Claims (2)
- 板状の被加工物を保持する保持テーブルを備えた保持手段と、該保持テーブルに保持された被加工物にレーザー光線を照射して加工を施すレーザー光線照射手段と、を少なくとも含み構成されるレーザー加工装置であって、
該保持手段の上部には、該保持テーブルに保持された被加工物の上面との間に隙間を形成して位置付けられる透明板を備えた液体チャンバーと、該液体チャンバー内において該保持テーブルに保持された該被加工物の上面に非接触の状態で近接した位置に配設されると共に、該被加工物上の液体に流れを生成する透明部材からなるローラと、該ローラを回転させるローラ回転手段と、該液体チャンバーの一方から該隙間に液体を供給する液体供給ノズルと、該液体チャンバーの他方から液体を排出する液体排出ノズルと、を備えた液体供給機構が配設され、
該レーザー光線照射手段は、レーザー光線を発振する発振器と、該発振器が発振したレーザー光線を集光し、該透明板、該ローラ、及び該隙間に供給された液体を透過して該保持テーブルに保持された被加工物に照射する集光器と、から少なくとも構成されるレーザー加工装置。 - 該レーザー光線照射手段には、該発振器から発振されたレーザー光線を分散させる分散手段が配設される、請求項1に記載のレーザー加工装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017206117A JP6968659B2 (ja) | 2017-10-25 | 2017-10-25 | レーザー加工装置 |
KR1020180120962A KR102513057B1 (ko) | 2017-10-25 | 2018-10-11 | 레이저 가공 장치 |
CN201811213262.0A CN109702334B (zh) | 2017-10-25 | 2018-10-18 | 激光加工装置 |
TW107137189A TWI778154B (zh) | 2017-10-25 | 2018-10-22 | 雷射加工裝置 |
US16/168,300 US11224941B2 (en) | 2017-10-25 | 2018-10-23 | Laser processing apparatus |
DE102018218221.3A DE102018218221A1 (de) | 2017-10-25 | 2018-10-24 | Laserbearbeitungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017206117A JP6968659B2 (ja) | 2017-10-25 | 2017-10-25 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019076932A true JP2019076932A (ja) | 2019-05-23 |
JP6968659B2 JP6968659B2 (ja) | 2021-11-17 |
Family
ID=65996639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017206117A Active JP6968659B2 (ja) | 2017-10-25 | 2017-10-25 | レーザー加工装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11224941B2 (ja) |
JP (1) | JP6968659B2 (ja) |
KR (1) | KR102513057B1 (ja) |
CN (1) | CN109702334B (ja) |
DE (1) | DE102018218221A1 (ja) |
TW (1) | TWI778154B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021052144A (ja) * | 2019-09-26 | 2021-04-01 | 株式会社ディスコ | ウエーハの加工方法、及びウエーハの加工装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6998177B2 (ja) * | 2017-11-02 | 2022-01-18 | 株式会社ディスコ | レーザー加工装置 |
KR20200016175A (ko) * | 2018-08-06 | 2020-02-14 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 보유 지지 장치, 기판 흡착 판정 방법, 기판 연마 장치, 기판 연마 방법, 연마되는 웨이퍼의 상면으로부터 액체를 제거하는 방법, 및 웨이퍼를 연마 패드에 압박하기 위한 탄성막, 기판 릴리스 방법 및 정량 기체 공급 장치 |
Citations (4)
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JPH09141484A (ja) * | 1995-11-22 | 1997-06-03 | Nikon Corp | レーザ加工装置 |
JP2003245791A (ja) * | 2002-02-25 | 2003-09-02 | Sony Corp | レーザ加工装置およびレーザ加工方法 |
JP2007136482A (ja) * | 2005-11-16 | 2007-06-07 | Denso Corp | 半導体基板の分断装置 |
US20140154871A1 (en) * | 2012-11-30 | 2014-06-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for manufacturing semiconductor device |
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-
2017
- 2017-10-25 JP JP2017206117A patent/JP6968659B2/ja active Active
-
2018
- 2018-10-11 KR KR1020180120962A patent/KR102513057B1/ko active IP Right Grant
- 2018-10-18 CN CN201811213262.0A patent/CN109702334B/zh active Active
- 2018-10-22 TW TW107137189A patent/TWI778154B/zh active
- 2018-10-23 US US16/168,300 patent/US11224941B2/en active Active
- 2018-10-24 DE DE102018218221.3A patent/DE102018218221A1/de active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09141484A (ja) * | 1995-11-22 | 1997-06-03 | Nikon Corp | レーザ加工装置 |
JP2003245791A (ja) * | 2002-02-25 | 2003-09-02 | Sony Corp | レーザ加工装置およびレーザ加工方法 |
JP2007136482A (ja) * | 2005-11-16 | 2007-06-07 | Denso Corp | 半導体基板の分断装置 |
US20140154871A1 (en) * | 2012-11-30 | 2014-06-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for manufacturing semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021052144A (ja) * | 2019-09-26 | 2021-04-01 | 株式会社ディスコ | ウエーハの加工方法、及びウエーハの加工装置 |
JP7286503B2 (ja) | 2019-09-26 | 2023-06-05 | 株式会社ディスコ | ウエーハの加工方法、及びウエーハの加工装置 |
Also Published As
Publication number | Publication date |
---|---|
CN109702334B (zh) | 2021-12-28 |
US11224941B2 (en) | 2022-01-18 |
KR102513057B1 (ko) | 2023-03-22 |
KR20190046634A (ko) | 2019-05-07 |
TW201916962A (zh) | 2019-05-01 |
DE102018218221A1 (de) | 2019-04-25 |
JP6968659B2 (ja) | 2021-11-17 |
CN109702334A (zh) | 2019-05-03 |
US20190118292A1 (en) | 2019-04-25 |
TWI778154B (zh) | 2022-09-21 |
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