JP2019016724A - Electronic equipment module - Google Patents

Electronic equipment module Download PDF

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JP2019016724A
JP2019016724A JP2017134298A JP2017134298A JP2019016724A JP 2019016724 A JP2019016724 A JP 2019016724A JP 2017134298 A JP2017134298 A JP 2017134298A JP 2017134298 A JP2017134298 A JP 2017134298A JP 2019016724 A JP2019016724 A JP 2019016724A
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heat dissipation
heat
dissipation base
base
electronic device
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JP6920585B2 (en
Inventor
正幸 長松
Masayuki Nagamatsu
正幸 長松
潤一 木村
Junichi Kimura
潤一 木村
則充 穂積
Norimitsu Hozumi
則充 穂積
幸太郎 出口
Kotaro Deguchi
幸太郎 出口
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Abstract

To provide an electronic equipment module capable of maintaining high reliability by stabilizing the adhesion state of sealing resin.SOLUTION: An electronic equipment module 8 comprises: a heat radiation base 9 having first plane 9A a second plane 9B at the opposite side of the first plane 9A; a metal coated part 10 having infinite number of projections 13 on the surface thereof, which covers at least a part of the first plane 9A; a heating component 11 mounted on the metal coated part 10; and a sealing resin 12 sealing a part of the heat radiation base 9, the metal coated part 10 and the heating component 11. The number of the projections 13 disposed in a unit area gets larger from the outer edge of the heat radiation base 9 toward the inner side.SELECTED DRAWING: Figure 1

Description

本発明は、各種電子機器に使用される電子機器モジュールに関する。   The present invention relates to an electronic device module used in various electronic devices.

以下、従来の電子機器モジュールについて図面を用いて説明する。図４は従来の電子機器モジュールの構成を示した断面模式図であり、電子機器モジュール１は基台部２と、基台部２へ半田３によって実装された半導体素子４と、基台部２および半導体素子４を覆う外装体５とによって構成されていた。また、基台部２における半導体素子４を実装する実装面２Ａには凸部６と凹部７とが設けられていた。   Hereinafter, a conventional electronic device module will be described with reference to the drawings. FIG. 4 is a schematic cross-sectional view showing the configuration of a conventional electronic device module. The electronic device module 1 includes a base portion 2, a semiconductor element 4 mounted on the base portion 2 with solder 3, and a base portion 2. And the exterior body 5 covering the semiconductor element 4. Also, the mounting surface 2 </ b> A on which the semiconductor element 4 is mounted in the base portion 2 is provided with a convex portion 6 and a concave portion 7.

凸部６は、半田３と基台部２との固着強度を向上させるとともに、外装体５と基台部２との固着強度を向上させていた。   The convex portion 6 improved the fixing strength between the solder 3 and the base portion 2 and also improved the fixing strength between the exterior body 5 and the base portion 2.

なお、この出願の発明に関連する先行技術文献情報としては、例えば特許文献１が知られている。   For example, Patent Document 1 is known as prior art document information related to the invention of this application.

特開平１０−１６３４０１号公報JP-A-10-163401

しかしながら、従来の電子機器モジュール１では半導体素子４が動作したときに大量の熱を放出することによって、特に半導体素子４へ近接する領域においては外装体５と基台部２との間には線膨張係数の差に起因する歪が大きくなり、外装体５と基台部２との固着強度が劣化するおそれを有していた。   However, in the conventional electronic device module 1, a large amount of heat is released when the semiconductor element 4 operates, so that a line is not formed between the exterior body 5 and the base portion 2, particularly in a region close to the semiconductor element 4. The strain due to the difference in the expansion coefficient is increased, and there is a possibility that the fixing strength between the exterior body 5 and the base portion 2 is deteriorated.

この結果、上記の熱ストレスが繰り返し生じることによって外装体５と基台部２との固着強度の劣化が、外装体５と基台部２との対向面の広い領域に拡張し、電子機器モジュール１の信頼性が劣化してしまうおそれがある、という課題を有するものであった。   As a result, the deterioration of the fixing strength between the exterior body 5 and the base portion 2 is expanded to a wide area of the facing surface between the exterior body 5 and the base portion 2 due to repeated occurrence of the above-described thermal stress, and the electronic device module 1 has a problem that the reliability of 1 may be deteriorated.

そこで本発明は電子機器モジュールの信頼性を維持、向上させることを目的とするものである。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to maintain and improve the reliability of an electronic device module.

そして、この目的を達成するために本発明は、第１面と前記第１面と反対面の第２面とを有する放熱基台と、前記第１面の少なくとも一部を覆い表面に無数の突起部を有する金属被覆部と、前記金属被覆部に実装された発熱部品と、前記放熱基台の一部と前記金属被覆部と前記発熱部品とを封止する封止樹脂と、を備え、前記突起部の単位面積あたりの配置数は、前記放熱基台の外縁から内側へと向かうに従って多くなる、ことを特徴としたものである。   In order to achieve this object, the present invention provides a heat dissipation base having a first surface and a second surface opposite to the first surface, and covers a myriad of surfaces covering at least a part of the first surface. A metal covering portion having a protrusion, a heat generating component mounted on the metal covering portion, a part of the heat dissipation base, a sealing resin that seals the metal covering portion and the heat generating component, The number of the protrusions disposed per unit area is increased from the outer edge of the heat dissipation base toward the inner side.

本発明によれば、特に熱に起因する歪が生じ易くなる放熱基台と封止樹脂とが対面する発熱部品に近接した位置では、放熱基台の外周縁に比較して突起部の配置密度を大きくする。これにより、発熱部品に近接した領域においては放熱基台と外装樹脂との固着力は大きくなる。よって、熱ストレスが繰り返し生じることによっても、発熱部品に近接した領
域において放熱基台と封止樹脂との固着強度の劣化は生じにくく、当然ながら、放熱基台と封止樹脂との固着強度の劣化が、放熱基台と封止樹脂との対向面の広い領域に拡張することも生じにくくなる。 According to the present invention, in the position close to the heat-generating component where the heat radiation base and the sealing resin face each other, where the distortion due to heat is likely to occur, the arrangement density of the protrusions compared to the outer peripheral edge of the heat radiation base Increase Thereby, in the area | region close | similar to a heat-emitting component, the adhesive force of a thermal radiation base and exterior resin becomes large. Therefore, even if heat stress is repeatedly generated, the fixing strength between the heat dissipation base and the sealing resin is hardly deteriorated in the region close to the heat generating component. It is difficult for the deterioration to extend to a wide area of the facing surface between the heat radiation base and the sealing resin.

この結果として、固着力の劣化に伴う電子機器モジュールの内部への異物の侵入などが抑制され、長期間に渡って電子機器モジュールの信頼性は高く維持、向上される。   As a result, entry of foreign matter into the electronic device module due to deterioration of the adhesion force is suppressed, and the reliability of the electronic device module is maintained and improved over a long period of time.

本発明の実施の形態における電子機器モジュールの構成を示す第１の断面模式図First cross-sectional schematic diagram showing a configuration of an electronic device module in an embodiment of the present invention 本発明の実施の形態における電子機器モジュールの構成を示す第２の断面模式図2nd cross-sectional schematic diagram which shows the structure of the electronic device module in embodiment of this invention 本発明の実施の形態における電子機器モジュールの構成を示す上面視模式図The top view schematic diagram which shows the structure of the electronic device module in embodiment of this invention 従来の電子機器モジュールの断面模式図Cross-sectional schematic diagram of a conventional electronic device module

以下、本発明の実施の形態について図面を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（実施の形態）
図１は本発明の実施の形態における電子機器モジュールの構成を示す第１の断面模式図である。電子機器モジュール８は、放熱基台９と金属被覆部１０と発熱部品１１と封止樹脂１２とを含む。 (Embodiment)
FIG. 1 is a first schematic cross-sectional view showing the configuration of an electronic device module according to an embodiment of the present invention. The electronic device module 8 includes a heat dissipation base 9, a metal cover 10, a heat generating component 11, and a sealing resin 12.

放熱基台９は第１面９Ａと、第１面９Ａと反対面の第２面９Ｂとを有する。金属被覆部１０は第１面９Ａの少なくとも一部を覆っている。金属被覆部１０は表面に無数の突起部１３を有する。そして発熱部品１１は金属被覆部１０に実装されている。さらに、封止樹脂１２は放熱基台９の一部と、金属被覆部１０と、発熱部品１１とを覆い、封止している。ここで、突起部１３の単位面積あたりの配置数は、放熱基台９の外縁９Ｅから内側へと向かうに従って多くなる。   The heat dissipation base 9 has a first surface 9A and a second surface 9B opposite to the first surface 9A. The metal covering portion 10 covers at least a part of the first surface 9A. The metal coating part 10 has innumerable protrusions 13 on the surface. The heat generating component 11 is mounted on the metal cover 10. Further, the sealing resin 12 covers and seals a part of the heat dissipation base 9, the metal covering portion 10, and the heat generating component 11. Here, the number of the protrusions 13 arranged per unit area increases from the outer edge 9E of the heat dissipation base 9 toward the inside.

以上の構成により、特に熱に起因する歪が生じ易くなる放熱基台９と封止樹脂１２とが対面する発熱部品１１に近接した位置では、放熱基台９の外縁９Ｅに比較して突起部１３の配置密度を大きくする。このため、発熱部品１１に近接した領域においては放熱基台９と封止樹脂１２との固着力は放熱基台９の外縁９Ｅに比較して大きくなる。よって、熱ストレスが繰り返し生じることによっても、発熱部品１１に近接した領域において放熱基台９と封止樹脂１２との固着強度の劣化は生じにくくなる。当然ながら、放熱基台９と封止樹脂１２との固着強度の劣化が、放熱基台９と封止樹脂１２との対向面における広い領域に拡張することも生じにくくなる。   With the above configuration, in the position close to the heat-generating component 11 where the heat-dissipating base 9 and the sealing resin 12 face each other, in particular, distortion due to heat is likely to occur, as compared with the outer edge 9E of the heat-dissipating base 9. The arrangement density of 13 is increased. For this reason, in the area close to the heat generating component 11, the fixing force between the heat dissipation base 9 and the sealing resin 12 is larger than the outer edge 9 </ b> E of the heat dissipation base 9. Therefore, even when thermal stress is repeatedly generated, deterioration of the fixing strength between the heat dissipation base 9 and the sealing resin 12 is unlikely to occur in a region close to the heat generating component 11. Of course, the deterioration of the fixing strength between the heat dissipation base 9 and the sealing resin 12 is less likely to extend to a wide area on the opposing surface of the heat dissipation base 9 and the sealing resin 12.

この結果として、固着力の劣化に伴う電子機器モジュール８の内部への異物の侵入などが抑制され、長期間に渡って電子機器モジュール８の信頼性は高く維持、向上される。   As a result, the entry of foreign matter into the electronic device module 8 due to the deterioration of the fixing force is suppressed, and the reliability of the electronic device module 8 is maintained and improved over a long period of time.

以下で、電子機器モジュール８について図を用いて詳しく説明する。図２は本発明の実施の形態における電子機器モジュールの構成を示す第２の断面模式図であり、図３は本発明の実施の形態における電子機器モジュールの構成を示す上面視模式図である。   Hereinafter, the electronic device module 8 will be described in detail with reference to the drawings. FIG. 2 is a second schematic cross-sectional view showing the configuration of the electronic device module in the embodiment of the present invention, and FIG. 3 is a schematic top view showing the configuration of the electronic device module in the embodiment of the present invention.

放熱基台９は第１面９Ａと、第１面９Ａと反対面の第２面９Ｂとを有する。ここで放熱基台９は、板状の放熱板であっても、あるいは、第１面９Ａが実装平面とされて第２面９Ｂは放熱のためにフィン（図示せず）などが形成されていてもよい。またあるいは、放熱基台９には塊状の金属が用いられ、放熱基台９は放熱基台９の内部に冷却用の液体を流す
流路（図示せず）が設けられた液冷器であってもよい。また、放熱基台９の材質としては放熱特性の良好なアルミニウムやアルミニウム合金が望ましい。 The heat dissipation base 9 has a first surface 9A and a second surface 9B opposite to the first surface 9A. Here, the heat radiation base 9 may be a plate-shaped heat radiation plate, or the first surface 9A may be a mounting plane and the second surface 9B may be provided with fins (not shown) for heat radiation. May be. Alternatively, a massive metal is used for the heat radiating base 9, and the heat radiating base 9 is a liquid cooler provided with a flow path (not shown) for flowing a cooling liquid inside the heat radiating base 9. May be. The material of the heat radiation base 9 is preferably aluminum or aluminum alloy having good heat radiation characteristics.

特に図２では発熱部品１１が配置される放熱基台９の第１面９Ａを金属被覆部１０は覆っているが、図１に示すように、金属被覆部１０が放熱基台９の第１面９Ａを不完全に覆った状態であってもよい。いいかえると、放熱基台９の第１面９Ａの一部が露出した状態であってもよい。特に、放熱基台９の第１面９Ａの一部が露出した領域では、突起部１３そのものが不連続に形成され配置された金属被覆部１０に相当してもよい。そして、放熱基台９の第１面９Ａが露出せずに金属被覆部１０で覆われた領域では、金属被覆部１０の上に突起部１３が配置されている。   In particular, in FIG. 2, the metal covering portion 10 covers the first surface 9 </ b> A of the heat dissipating base 9 on which the heat generating component 11 is arranged, but the metal covering portion 10 is the first surface of the heat dissipating base 9 as shown in FIG. 1. The surface 9A may be incompletely covered. In other words, a part of the first surface 9A of the heat dissipation base 9 may be exposed. In particular, in a region where a part of the first surface 9A of the heat radiating base 9 is exposed, the protrusion 13 itself may correspond to the metal covering portion 10 that is discontinuously formed and arranged. And in the area | region where the 1st surface 9A of the thermal radiation base 9 was covered with the metal coating | coated part 10 without exposing, the projection part 13 is arrange | positioned on the metal coating | coated part 10. FIG.

あるいは、図２に示すように、金属被覆部１０が放熱基台９の第１面９Ａを完全に覆った状態であってもよい。ここで、突起部１３および金属被覆部１０は銅や銅合金などの半田濡れ性が良好な金属であることが望ましい。   Alternatively, as shown in FIG. 2, the metal covering portion 10 may completely cover the first surface 9 </ b> A of the heat dissipation base 9. Here, it is desirable that the protruding portion 13 and the metal covering portion 10 be a metal with good solder wettability such as copper or copper alloy.

ここでは、金属被覆部１０、特に突起部１３は発熱部品１１に近接した領域において封止樹脂１２を金属被覆部１０に、あるいは放熱基台９に機械的に固着すことが重要な機能である。したがって、放熱基台９の外縁９Ｅでは放熱基台９の第１面９Ａが露出し、かつ、突起部１３の単位面積あたりの配置数が、放熱基台９の外縁９Ｅに向かうにつれて少なくなってよい。この場合、当然ながら、第１面９Ａにおける金属被覆部１０あるいは突起部１３が存在しない露出部１４の、第１面９Ａの単位面積あたりに占める比率、あるいは、第１面９Ａの単位面積あたりの露出部１４の面積は、放熱基台９の外縁９Ｅから内側へと向かうに従って小さくなる。   Here, the metal covering portion 10, particularly the protrusion 13, is an important function in that the sealing resin 12 is mechanically fixed to the metal covering portion 10 or the heat dissipation base 9 in a region close to the heat generating component 11. . Therefore, the first surface 9A of the heat radiating base 9 is exposed at the outer edge 9E of the heat radiating base 9, and the number of protrusions 13 arranged per unit area decreases toward the outer edge 9E of the heat radiating base 9. Good. In this case, as a matter of course, the ratio of the exposed portion 14 on the first surface 9A where the metal covering portion 10 or the protruding portion 13 does not exist to the unit area of the first surface 9A or the unit area of the first surface 9A. The area of the exposed portion 14 becomes smaller from the outer edge 9E of the heat dissipation base 9 toward the inside.

これにより、発熱部品１１に近接した領域において封止樹脂１２は強固に金属被覆部１０へ、あるいは放熱基台９へ固着され、電子機器モジュール８の信頼性は高く維持、向上される。ここで、露出部１４は連続した広い面として存在する必要は無く、分散して存在して構わない。   As a result, the sealing resin 12 is firmly fixed to the metal cover 10 or the heat dissipation base 9 in a region close to the heat generating component 11, and the reliability of the electronic device module 8 is maintained and improved. Here, the exposed portion 14 does not need to exist as a continuous wide surface, and may be dispersed.

また、図２に示すように金属被覆部１０の被覆厚は、放熱基台９の外縁９Ｅから内側へと向かうに従って厚くしてもよい。より厳密には、放熱基台９の外縁９Ｅから内側へと向かう方向の単位長さあたりにおける金属被覆部１０の平均被覆厚は、放熱基台９の外縁９Ｅから内側へと向かうに従って厚くしてもよい。   Further, as shown in FIG. 2, the coating thickness of the metal coating portion 10 may be increased from the outer edge 9 </ b> E of the heat dissipation base 9 toward the inside. More precisely, the average coating thickness of the metal coating portion 10 per unit length in the direction from the outer edge 9E to the inside of the heat dissipation base 9 is increased as it goes from the outer edge 9E to the inside of the heat dissipation base 9. Also good.

金属被覆部１０は先にも述べたとおり、特に突起部１３は封止樹脂１２を金属被覆部１０に、あるいは放熱基台９に機械的に固着すことが重要な機能である。これと同時に、金属被覆部１０は発熱部品１１が半田などの溶接材１５による実装が容易となることを目的として設けられている。したがって、金属被覆部１０が溶接される領域では、放熱基台９の第１面９Ａが露出しないように、金属被覆部１０は放熱基台９の外縁９Ｅに比較して十分な厚さを有しているとよい。   As described above, the metal covering portion 10 has an important function in that, particularly, the protruding portion 13 mechanically fixes the sealing resin 12 to the metal covering portion 10 or to the heat dissipation base 9. At the same time, the metal cover 10 is provided for the purpose of facilitating mounting of the heat generating component 11 with the welding material 15 such as solder. Therefore, in the region where the metal cover 10 is welded, the metal cover 10 has a sufficient thickness compared to the outer edge 9E of the heat dissipation base 9 so that the first surface 9A of the heat dissipation base 9 is not exposed. It is good to have.

図１および図２では突起部１３は、放熱基台９の第１面９Ａから図中の上方へ向かうにしたがって尖る尖塔状の形状で一例として示されている。しかしながら、突起部１３は必ず尖塔状とする必要はなく、図示はしていないが、球状で第１面９Ａに設けられた突起部１３や、第１面９Ａ側に括れが形成された瘤状の突起部１３や、茸形状の突起部１３であってもよい。また、突起部１３の形状は一様でなく、上記のような様々な形状の突起部１３が混在して配置されていてもよい。特に、突起部１３が球状などに形成され、封止樹脂１２が突起部１３に対して鉤状に係合することで、放熱基台９と封止樹脂１２との固着強度は一層向上する。   In FIG. 1 and FIG. 2, the protrusion 13 is shown as an example in the shape of a spire as it is pointed upward from the first surface 9 </ b> A of the heat dissipation base 9 in the drawing. However, the protrusion 13 does not necessarily have a spire shape, and although not shown, the protrusion 13 provided in a spherical shape on the first surface 9A or a conical shape formed with a constriction on the first surface 9A side. The protrusion 13 may be a hook-shaped protrusion 13. Moreover, the shape of the protrusion 13 is not uniform, and the protrusions 13 having various shapes as described above may be mixedly arranged. In particular, the protrusion 13 is formed in a spherical shape or the like, and the sealing resin 12 engages the protrusion 13 in a hook shape, whereby the fixing strength between the heat dissipation base 9 and the sealing resin 12 is further improved.

ここで、先にも述べたように突起部１３および金属被覆部１０は銅や銅合金などの同一の材質で構成されている。そして、金属被覆部１０は小さな領域においても完全に均一な被覆厚で設けられているのではなく、小さな凹凸を有している。言い換えると、金属被覆部１０は突起部１３が隙間無く密集して配置されたうえで形成されていてもよい。このとき、金属被覆部１０の表面の凹凸は、隙間無く密集して配置された突起部１３の頭頂部によって形成されていることになる。ここで、上記の凹凸は突起部１３の突出高さよりも大幅に小さい。そしてさらに図中における最も上方に位置して側面および頭頂部が露出した状態の突起部１３が、金属被覆部１０の上に設けられていてもよい。   Here, as described above, the protruding portion 13 and the metal covering portion 10 are made of the same material such as copper or copper alloy. The metal coating 10 is not provided with a completely uniform coating thickness even in a small region, but has small irregularities. In other words, the metal covering portion 10 may be formed after the protruding portions 13 are densely arranged without a gap. At this time, the irregularities on the surface of the metal cover 10 are formed by the tops of the protrusions 13 that are densely arranged without a gap. Here, the above unevenness is significantly smaller than the protrusion height of the protrusion 13. Further, the protrusion 13 may be provided on the metal covering portion 10 in the state where the side surface and the top of the head are exposed at the uppermost position in the drawing.

さらに、突起部１３の高さもまた、放熱基台９の外縁９Ｅから内側へと向かうに従って高くなるように突起部１３が設けられてもよい。当然ながら、突起部１３の高さが高いほど、溶接材１５と突起部１３との固着状態および封止樹脂１２と突起部１３との固着状態は安定するので、結果として電子機器モジュール８の信頼性は高く維持、向上される。   Furthermore, the protrusion 13 may be provided so that the height of the protrusion 13 also increases from the outer edge 9E of the heat dissipation base 9 toward the inside. As a matter of course, the higher the height of the protruding portion 13, the more stable the fixing state between the welding material 15 and the protruding portion 13 and the fixed state between the sealing resin 12 and the protruding portion 13. Highly maintained and improved.

ここで、突起部１３の高さを示す指標としては、金属被覆部１０の表面や、あるいは露出部１４と突起部１３とによって構成される面における、単位長さあたりの算術平均粗さや、単位面積あたりの算術平均粗さが用いられてもよい。   Here, as an index indicating the height of the protruding portion 13, the arithmetic average roughness per unit length on the surface of the metal covering portion 10 or the surface constituted by the exposed portion 14 and the protruding portion 13, or the unit Arithmetic average roughness per area may be used.

当然ながら、発熱部品１１が放熱基台９の中央や中央付近に配置される場合には、発熱部品１１の直下あるいは近傍における金属被覆部１０上の突起部１３の配置密度や突起部１３の高さを極大とすることが容易となる。突起部１３の配置密度や突起部１３の高さが極大となる領域では、溶接材１５と突起部１３との固着状態および封止樹脂１２と突起部１３との固着状態もまた最も安定する領域となる。この結果として、電子機器モジュール８の信頼性は高く維持、向上される。   Of course, when the heat generating component 11 is arranged at or near the center of the heat dissipation base 9, the arrangement density of the protrusions 13 on the metal covering portion 10 immediately below or near the heat generating component 11 and the height of the protrusions 13 are high. It becomes easy to maximize the thickness. In the region where the arrangement density of the protrusions 13 and the height of the protrusions 13 are maximized, the region in which the fixing state between the welding material 15 and the protrusions 13 and the fixing state between the sealing resin 12 and the protrusions 13 are also the most stable. It becomes. As a result, the reliability of the electronic device module 8 is maintained and improved.

また、図３に示すように発熱部品１１は単独で金属被覆部１０の上に配置するだけでなく、金属被覆部１０の上に複数の発熱部品１１が列状に配置されてもよい。このときもまた、放熱基台９の外縁９Ｅから内側へと向かうに従って、突起部１３の単位面積あたりの配置数が多くなればよい。図３の模式図では個々の突起部１３を同じ大きさの点として示しているが、実際の突起部１３における個々の上面視での大きさはランダムであってよい。図３は上面視模式図であるため、実際には封止樹脂１２が存在するが、ここでは説明の便宜上、封止樹脂１２を図示せずに説明している。   Further, as shown in FIG. 3, the heat generating component 11 is not only disposed on the metal covering portion 10 alone, but a plurality of heat generating components 11 may be disposed on the metal covering portion 10 in a row. Also at this time, it is only necessary that the number of the protrusions 13 arranged per unit area increases from the outer edge 9E of the heat dissipation base 9 toward the inside. In the schematic diagram of FIG. 3, the individual protrusions 13 are shown as points having the same size, but the size of the actual protrusions 13 in the top view may be random. Since FIG. 3 is a schematic top view, the sealing resin 12 actually exists. However, for convenience of explanation, the sealing resin 12 is illustrated without being illustrated.

ここで図示のうえでは、突起部１３は列状に配置されているものの、実際の突起部１３は列状に配置される必要はない。望ましい突起部１３の配置形態としては、突起部１３の単位面積あたりの配置数つまり、突起部１３の配置密度が放熱基台９の外縁９Ｅから内側へと向かうに従って連続的に上昇する状態である。突起部１３の配置密度が連続的に変化することによって、封止樹脂１２と突起部１３との固着状態もまた連続的に変化する。   Here, although the protrusions 13 are arranged in a row on the drawing, the actual protrusions 13 do not need to be arranged in a row. A desirable arrangement of the protrusions 13 is a state in which the number of protrusions 13 arranged per unit area, that is, the arrangement density of the protrusions 13 continuously increases from the outer edge 9E of the heat dissipation base 9 toward the inside. . As the arrangement density of the protrusions 13 changes continuously, the fixing state between the sealing resin 12 and the protrusions 13 also changes continuously.

いいかえると、封止樹脂１２と突起部１３との固着状態の不連続点や不連続線は生じない。これにより、封止樹脂１２や突起部１３に生じる応力が上記の不連続点や不連続線に集中することが回避される。この結果として、電子機器モジュール８の信頼性は高く維持、向上される。   In other words, there are no discontinuities or discontinuities in the fixed state between the sealing resin 12 and the protrusion 13. Thereby, it is avoided that the stress which arises in the sealing resin 12 and the projection part 13 concentrates on said discontinuous point and discontinuous line. As a result, the reliability of the electronic device module 8 is maintained and improved.

また、発熱部品１１と発熱部品１１との間に位置する領域は最も発熱部品１１による熱ストレスを受けることになる。よって、発熱部品１１と発熱部品１１との間に位置する領域では、金属被覆部１０上における突起部１３の位面積あたりの配置数を最も多くするとよい。言い換えると、発熱部品１１と発熱部品１１との間に位置する領域では、突起部１３の配置密度を最も大きくするとよい。   Further, the region located between the heat generating component 11 and the heat generating component 11 is subjected to the most heat stress by the heat generating component 11. Therefore, in the region located between the heat generating component 11 and the heat generating component 11, the number of arrangements per unit area of the protrusions 13 on the metal covering portion 10 should be maximized. In other words, in the region located between the heat generating component 11 and the heat generating component 11, the arrangement density of the protrusions 13 is preferably maximized.

これにより、熱ストレスが繰り返し生じることによっても、発熱部品１１に近接した領域において放熱基台９と封止樹脂１２との固着強度の劣化は生じにくくなる。   As a result, even when thermal stress repeatedly occurs, deterioration in the fixing strength between the heat radiation base 9 and the sealing resin 12 is unlikely to occur in a region close to the heat generating component 11.

本発明の電子機器モジュールは、高い信頼性を維持することができるという効果を有し、各種電子機器において有用である。   The electronic device module of the present invention has an effect that high reliability can be maintained, and is useful in various electronic devices.

８ 電子機器モジュール
９ 放熱基台
９Ａ 第１面
９Ｂ 第２面
９Ｅ 外縁
１０ 金属被覆部
１１ 発熱部品
１２ 封止樹脂
１３ 突起部
１４ 露出部
１５ 溶接材 DESCRIPTION OF SYMBOLS 8 Electronic device module 9 Heat radiation base 9A 1st surface 9B 2nd surface 9E Outer edge 10 Metal coating | cover part 11 Heating component 12 Sealing resin 13 Protrusion part 14 Exposed part 15 Welding material

Claims (4)

第１面と前記第１面と反対面の第２面とを有する放熱基台と、
前記第１面の少なくとも一部を覆い表面に無数の突起部を有する金属被覆部と、
前記金属被覆部に実装された発熱部品と、
前記放熱基台の一部と前記金属被覆部と前記発熱部品とを封止する封止樹脂と、
を備え、
前記突起部の単位面積あたりの配置数は、前記放熱基台の外縁から内側へと向かうに従って多くなる、
電子機器モジュール。 A heat dissipating base having a first surface and a second surface opposite to the first surface;
A metal covering portion covering at least a part of the first surface and having innumerable protrusions on the surface;
A heat generating component mounted on the metal coating,
A sealing resin that seals a part of the heat dissipation base, the metal cover, and the heat-generating component;
With
The number of arrangement per unit area of the protrusions increases from the outer edge of the heat dissipation base toward the inside.
Electronic equipment module. 前記放熱基台の外縁において前記第１面は、前記第１面の一部が前記金属被覆部から露出する露出部を有し、
前記第１面の単位面積あたりの前記露出部の面積は、前記放熱基台の外縁から内側へと向かうに従って小さくなる、
請求項１に記載の電子機器モジュール。 In the outer edge of the heat dissipation base, the first surface has an exposed portion where a part of the first surface is exposed from the metal covering portion,
The area of the exposed portion per unit area of the first surface decreases as it goes inward from the outer edge of the heat dissipation base,
The electronic device module according to claim 1. 前記金属被覆部の被覆厚は、前記放熱基台の外縁から内側へと向かうに従って厚くなる、請求項１に記載の電子機器モジュール。 2. The electronic device module according to claim 1, wherein a coating thickness of the metal coating portion is increased from an outer edge of the heat dissipation base toward an inner side. 前記金属被覆部は銅合金によって構成され、前記放熱基台はアルミニウム合金によって構成される、
請求項１に記載の電子機器モジュール。 The metal coating portion is made of a copper alloy, and the heat dissipation base is made of an aluminum alloy.
The electronic device module according to claim 1.
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JP7418178B2 (en) 2019-10-17 2024-01-19 三菱電機株式会社 Semiconductor device and its manufacturing method

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JPH10163401A (en) * 1996-12-04 1998-06-19 Sony Corp Lead frame, semiconductor package, and manufacture of semiconductor package
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JP2016072433A (en) * 2014-09-30 2016-05-09 大日本印刷株式会社 Through electrode substrate and method of manufacturing the same

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH10163401A (en) * 1996-12-04 1998-06-19 Sony Corp Lead frame, semiconductor package, and manufacture of semiconductor package
JP2004349497A (en) * 2003-05-22 2004-12-09 Shinko Electric Ind Co Ltd Packaging component and semiconductor package
JP2016072433A (en) * 2014-09-30 2016-05-09 大日本印刷株式会社 Through electrode substrate and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7418178B2 (en) 2019-10-17 2024-01-19 三菱電機株式会社 Semiconductor device and its manufacturing method

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