JP2019016454A - 回路装置 - Google Patents
回路装置 Download PDFInfo
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- JP2019016454A JP2019016454A JP2017131186A JP2017131186A JP2019016454A JP 2019016454 A JP2019016454 A JP 2019016454A JP 2017131186 A JP2017131186 A JP 2017131186A JP 2017131186 A JP2017131186 A JP 2017131186A JP 2019016454 A JP2019016454 A JP 2019016454A
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- JP
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- Prior art keywords
- circuit board
- connector
- resin
- buffer
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920005989 resin Polymers 0.000 claims abstract description 61
- 239000011347 resin Substances 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims description 23
- 239000013013 elastic material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
【解決手段】ECU1は、回路基板10と、回路基板10に固定されたコネクタ20と、回路基板10とコネクタ20とを覆う樹脂部50とを備え、回路基板10とコネクタ20との間、回路基板10と樹脂部50との間、および、コネクタ20と樹脂部50との間に緩衝部60が介在している。このような構成によれば、線膨張係数が異なることに起因して、回路基板10とコネクタ20との境界部分、回路基板10と樹脂部50との境界部分、および、コネクタ20と樹脂部50との境界部分で生じる応力を、弾性を有する緩衝部60によって吸収することができる。これにより、コネクタ20が回路基板10から剥がれてしまうことを抑制できる。
【選択図】図2
Description
変形例のECU70は、緩衝部71が回路基板10とコネクタ20との間、および、コネクタ20と樹脂部50との間に介在しており、回路基板10のうちコネクタ20の周辺部を除く部分と樹脂部50との間には介在していない点で、上記実施形態と異なる。
本明細書によって開示される技術は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような種々の態様も含まれる。
(1)回路基板とコネクタとの間、回路基板と樹脂部との間、およびコネクタと樹脂部との間のうち、少なくとも1か所に緩衝部が介在していれば、コネクタが回路基板から剥がれてしまうことを抑制する効果が得られる。また、緩衝部が、コネクタの一部と回路基板の間、回路基板の一部と樹脂部との間、あるいはコネクタの一部と樹脂部との間に介在していても、コネクタが回路基板から剥がれてしまうことを抑制する一定の効果が得られる。
10…回路基板
20…コネクタ
50…樹脂部
60、71…緩衝部
31…固定金具(金属部材)
41…端子金具(金属部材)
Claims (4)
- 回路基板と、前記回路基板に固定されたコネクタと、前記回路基板と前記コネクタとを覆う樹脂部とを備えた回路装置であって、
前記回路基板と前記コネクタとの間、前記回路基板と前記樹脂部との間、または、前記コネクタと前記樹脂部との間に、弾性を有する材料により構成された緩衝部が介在している、回路装置。 - 前記コネクタが、コネクタハウジングと、前記コネクタハウジングに組み付けられて前記回路基板に固着されている金属部材とを備えており、
前記緩衝部が前記金属部材と前記樹脂部との間に介在している、請求項1に記載の回路装置。 - 前記金属部材が、前記コネクタハウジングを前記回路基板に固定するための固定金具である、請求項2に記載の回路装置。
- 前記金属部材が端子金具である、請求項2に記載の回路装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017131186A JP6883260B2 (ja) | 2017-07-04 | 2017-07-04 | 回路装置 |
PCT/JP2018/024278 WO2019009148A1 (ja) | 2017-07-04 | 2018-06-27 | 回路装置 |
CN201880040600.7A CN110770979B (zh) | 2017-07-04 | 2018-06-27 | 电路装置 |
US16/626,595 US20200161784A1 (en) | 2017-07-04 | 2018-06-27 | Circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017131186A JP6883260B2 (ja) | 2017-07-04 | 2017-07-04 | 回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019016454A true JP2019016454A (ja) | 2019-01-31 |
JP6883260B2 JP6883260B2 (ja) | 2021-06-09 |
Family
ID=64949962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017131186A Active JP6883260B2 (ja) | 2017-07-04 | 2017-07-04 | 回路装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20200161784A1 (ja) |
JP (1) | JP6883260B2 (ja) |
CN (1) | CN110770979B (ja) |
WO (1) | WO2019009148A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021012925A (ja) * | 2019-07-04 | 2021-02-04 | ホシデン株式会社 | 防水型電子部品及びその組立方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3761768B1 (en) * | 2019-07-04 | 2023-04-12 | Hosiden Corporation | Waterproof electronic component and method for assembling the same |
JP7220632B2 (ja) * | 2019-07-04 | 2023-02-10 | ホシデン株式会社 | 防水型発光装置及びその組立方法 |
DE102021103474A1 (de) | 2021-02-15 | 2022-08-18 | HELLA GmbH & Co. KGaA | Verbindungsmittel mit ersten Kontaktelementen und zweiten Kontaktelementen, die zur Herstellung einer elektrischen Verbindung miteinander verbunden sind, und mit einem Gießharz, das die Kontaktelemente zumindest zum Teil einhüllt |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5844777U (ja) * | 1981-09-21 | 1983-03-25 | 三菱電機株式会社 | 絶縁封止電子回路装置 |
JP2007255275A (ja) * | 2006-03-23 | 2007-10-04 | Ngk Spark Plug Co Ltd | ディーゼルエンジン予熱用ヒータの通電制御装置 |
JP2012138178A (ja) * | 2010-12-24 | 2012-07-19 | Sumitomo Wiring Syst Ltd | 基板用コネクタの接続構造および基板用コネクタ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006036493A1 (de) * | 2006-08-04 | 2008-02-21 | Oerlikon Leybold Vacuum Gmbh | Vakuumpumpe |
JP4881894B2 (ja) * | 2008-02-19 | 2012-02-22 | 株式会社ケーヒン | 電子基板の保持構造及び電子基板の封止方法 |
JP4937976B2 (ja) * | 2008-08-27 | 2012-05-23 | 日本航空電子工業株式会社 | コネクタ装置の製造方法 |
WO2014132973A1 (ja) * | 2013-02-27 | 2014-09-04 | ユニチカ株式会社 | 電子部品装置の製造方法および電子部品装置 |
-
2017
- 2017-07-04 JP JP2017131186A patent/JP6883260B2/ja active Active
-
2018
- 2018-06-27 CN CN201880040600.7A patent/CN110770979B/zh active Active
- 2018-06-27 WO PCT/JP2018/024278 patent/WO2019009148A1/ja active Application Filing
- 2018-06-27 US US16/626,595 patent/US20200161784A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5844777U (ja) * | 1981-09-21 | 1983-03-25 | 三菱電機株式会社 | 絶縁封止電子回路装置 |
JP2007255275A (ja) * | 2006-03-23 | 2007-10-04 | Ngk Spark Plug Co Ltd | ディーゼルエンジン予熱用ヒータの通電制御装置 |
JP2012138178A (ja) * | 2010-12-24 | 2012-07-19 | Sumitomo Wiring Syst Ltd | 基板用コネクタの接続構造および基板用コネクタ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021012925A (ja) * | 2019-07-04 | 2021-02-04 | ホシデン株式会社 | 防水型電子部品及びその組立方法 |
JP7233325B2 (ja) | 2019-07-04 | 2023-03-06 | ホシデン株式会社 | 防水型電子部品及びその組立方法 |
Also Published As
Publication number | Publication date |
---|---|
US20200161784A1 (en) | 2020-05-21 |
JP6883260B2 (ja) | 2021-06-09 |
CN110770979B (zh) | 2021-10-29 |
WO2019009148A1 (ja) | 2019-01-10 |
CN110770979A (zh) | 2020-02-07 |
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