JP2018523913A - ウエハ処理システム向けの、ボルト留めされたウエハチャックの熱管理のシステム及び方法 - Google Patents
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Abstract
Description
Claims (15)
- 処理のために被加工物を位置付ける被加工物ホルダであって、
実質的に円筒形のパックと、
前記パックの径方向内側部分と熱連通するように配置された、第1加熱デバイスと、
前記パックの径方向外側部分と熱連通するように配置された、第2加熱デバイスであって、前記第1加熱デバイスと前記第2加熱デバイスが、互いに対して個別に制御可能である、第2加熱デバイスと、
前記パックと熱連通するように配置された熱シンクとを備え、
前記第1加熱デバイスと前記第2加熱デバイスは、前記パックとのそれぞれの熱連通の度合いが、前記熱シンクと前記パックとの熱連通の度合いよりも高い、被加工物ホルダ。 - 前記第1加熱デバイスと前記第2加熱デバイスの少なくとも一方が、前記パックの底面内に画定された溝の中に配置された、ケーブルヒータを備え、
前記ケーブルヒータを所定の位置に保持するために前記溝の中に配置されるヒータキャップであって、前記ケーブルヒータの弧長の少なくとも一部に沿って前記パックに固定される、ヒータキャップを更に備える、請求項1に記載の被加工物ホルダ。 - 前記パックが、複数の取り付けポイントにおいて、機械的かつ熱的に前記熱シンクと連結し、前記取り付けポイントのうちの少なくとも1つについて、
前記パックが、前記熱シンクに対面する突起を形成し、
前記熱シンクが開孔を形成し、
ファスナが、前記開孔を通過し、かつ、前記突起の内部に連結し、
前記複数の取り付けポイントが、前記熱シンクと前記パックとの前記熱連通の実質的に全てを提供する、請求項1に記載の被加工物ホルダ。 - 前記パックの直径が少なくとも12インチであり、前記複数の取り付けポイントが少なくとも30の取り付けポイントを含む、請求項3に記載の被加工物ホルダ。
- 前記取り付けポイントのうちの前記少なくとも1つにおいて、
前記突起が第1の横方向の広さを画定し、
前記突起と前記熱シンクの全厚部分との間に横方向間隙が存在するように、前記熱シンクが、前記開孔の周囲に、厚さが低減している薄化部分であって、前記第1の横方向の広さよりも広い第2の横方向の広さを有する薄化部分を画定する、請求項3に記載の被加工物ホルダ。 - 前記パックから前記熱シンクへの熱伝達を限定するために、前記熱シンクが、前記薄化部分内に、前記開孔に隣接した一又は複数のボイドを画定する、請求項5に記載の被加工物ホルダ。
- 前記熱シンクと前記突起との間の、前記ファスナの周囲に配置された波ワッシャーであって、その圧縮厚さの少なくとも2倍の正味非圧縮厚さを有する波ワッシャーを更に備える、請求項3に記載の被加工物ホルダ。
- 前記熱シンクが、一又は複数の流体チャネルを画定する金属プレートを備え、前記熱シンクの基準温度を定めるために、熱交換流体が、前記一又は複数の流体チャネルを通って流れる、請求項1に記載の被加工物ホルダ。
- 前記パックが、円筒軸、前記円筒軸の周囲のパック半径、及びパック厚さによって特徴付けられ、
前記実質的に円筒形のパックの少なくとも上面が、実質的に平らであり、
前記実質的に円筒形のパックが、前記パックの前記径方向内側部分と前記径方向外側部分との間に一又は複数の径方向熱遮断部を画定し、
各熱遮断部が、前記実質的に円筒形のパックの前記上面と底面の少なくとも一方と交わる径方向凹部として特徴付けられており、前記径方向凹部が、
前記パックの前記上面又は前記底面から前記パック厚さの少なくとも半分まで延在する、熱遮断部深さと、
前記円筒軸について対称に配置され、かつ、前記パック半径の少なくとも二分の一である、熱遮断部半径とによって特徴付けられる、請求項1に記載の被加工物ホルダ。 - 被加工物の空間的な温度分布を制御する方法であって、
実質的に円筒形のパックと熱連通する熱シンク内のチャネルを通して制御された温度の熱交換流体を流すことによって、前記パックに対する基準温度を提供することと、
前記パックの径方向内側部分と熱連通するように配置された第1加熱デバイスを作動させることによって、前記基準温度よりも高い第1温度まで、前記パックの前記径方向内側部分の温度を上昇させることと、
前記パックの径方向外側部分と熱連通するように配置された第2加熱デバイスを作動させることによって、前記基準温度よりも高い第2温度まで、前記パックの前記径方向外側部分の温度を上昇させることと、
前記パック上に前記被加工物を置くこととを含む、方法。 - 前記実質的に円筒形のパックに対する前記基準温度を提供することが、複数の取り付けポイントにおいて前記実質的に円筒形のパックに前記熱シンクを連結させることを更に含み、
前記実質的に円筒形のパックに対する前記基準温度を提供することが、前記熱シンクと前記パックとの間の熱抵抗を増大させるために、
前記取り付けポイントの各々に隣接して、前記熱シンク内にボイドを提供することと、
前記熱シンクと前記実質的に円筒形のパックとの間に波ワッシャーを配置することの、少なくとも一方を含む、請求項10に記載の方法。 - 前記パックの前記径方向内側部分の温度を上昇させること、又は、前記パックの前記径方向外側部分の温度を上昇させることが、ケーブルヒータを通して電流を流すことを含む、請求項10に記載の方法。
- 前記パック内の前記径方向内側部分と前記径方向外側部分との間に一又は複数の熱遮断部を提供することによって、前記パックの前記径方向内側部分と前記パックの前記径方向外側部分との間に熱抵抗を提供することを更に含み、
前記熱遮断部の各々が、前記パックの上面と底面の少なくとも一方と交わる径方向凹部として画定され、
前記径方向凹部が、前記パックの厚さの半分を超過する深さによって特徴付けられる、請求項10に記載の方法。 - 前記パック内の前記径方向内側部分と前記径方向外側部分との間に前記一又は複数の熱遮断部を提供することが、前記パックの前記上面と交わる径方向凹部を提供することを含み、
前記パック上に前記被加工物を置くことが、前記パックの前記上面と交わる前記径方向凹部内に前記被加工物を支持する一又は複数のリフトピンを後退させることを含む、請求項13に記載の方法。 - 処理のために被加工物を位置付ける被加工物ホルダであって、
円筒軸及び実質的に平らな上面によって特徴付けられる、実質的に円筒形のパックであって、2つの径方向熱遮断部を画定する、パックを備え、
前記熱遮断部のうちの第1のものが、第1半径のところで前記パックの底面と交わり、かつ、前記底面から前記パックの厚さの少なくとも二分の一まで延在する、径方向凹部として特徴付けられ、
前記熱遮断部のうちの第2のものが、前記第1半径よりも大きい第2半径のところで前記パックの前記上面と交わり、かつ、前記上面から前記パックの前記厚さの少なくとも二分の一まで延在する、径方向凹部として特徴付けられ、
前記第1熱遮断部及び前記第2熱遮断部が、前記パックの径方向内側部分と前記パックの径方向外側部分との間の境界を画定し、
前記パックは、
前記パックの前記径方向内側部分内に埋めこまれた、第1加熱デバイスと、
前記パックの前記径方向外側部分内に埋めこまれた、第2加熱デバイスとを備えており、
前記被加工物ホルダは、前記パックの前記底面の実質的に下方に延在する熱シンクであって、前記パックの基準温度を維持するために、内部に画定されたチャネルを通して熱交換流体を流す金属プレートを備える、熱シンクを更に備え、
前記熱シンクは、複数の取り付けポイントにおいて前記パックと機械的かつ熱的に連結し、前記取り付けポイントは、前記第1加熱デバイス及び前記第2加熱デバイスの各々と前記パックとの間の熱連通の度合いを下回る度合いの、前記熱シンクと前記パックとの間の熱連通を提供する、被加工物ホルダ。
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KR102460313B1 (ko) * | 2018-12-13 | 2022-10-28 | 주식회사 원익아이피에스 | 기판 처리 장치의 서셉터 및 기판 처리 장치 |
JP7254542B2 (ja) | 2019-02-01 | 2023-04-10 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
JP2022047847A (ja) * | 2020-09-14 | 2022-03-25 | 株式会社Kelk | ウェーハの温度調節装置 |
CN115371366B (zh) * | 2022-08-22 | 2024-05-28 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 刚性转架装置及其安装工艺和载片刚性转架 |
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TWI703671B (zh) | 2020-09-01 |
KR20240015747A (ko) | 2024-02-05 |
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