JP2018183931A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018183931A5 JP2018183931A5 JP2017087132A JP2017087132A JP2018183931A5 JP 2018183931 A5 JP2018183931 A5 JP 2018183931A5 JP 2017087132 A JP2017087132 A JP 2017087132A JP 2017087132 A JP2017087132 A JP 2017087132A JP 2018183931 A5 JP2018183931 A5 JP 2018183931A5
- Authority
- JP
- Japan
- Prior art keywords
- resin molding
- light
- mold
- guide member
- passage hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 28
- 229920005989 resin Polymers 0.000 claims 28
- 238000000465 moulding Methods 0.000 claims 27
- 238000001514 detection method Methods 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 3
- 230000001678 irradiating Effects 0.000 claims 2
- 230000003287 optical Effects 0.000 claims 1
Claims (10)
前記第1型及び前記第2型のいずれか一方の型の型面に樹脂成形対象物を供給する供給機構と、
前記型面において前記樹脂成形対象物をガイド部材に位置決めする位置決め機構と、
前記成形型を型締めする型締機構と、
照射光を発する発光素子と、
前記供給機構に設けられ前記照射光を受光可能な第1受光素子と、
前記樹脂成形対象物の位置決めに関して判断する判断部とを備え、
前記一方の型は、前記発光素子からの前記照射光を通過させる第1出射用通過孔が設けられ、
前記判断部は、前記第1出射用通過孔を通過した前記照射光に対する前記第1受光素子による検知に基づいて、前記樹脂成形対象物が前記ガイド部材に正常に位置決めされているか否かを判断する樹脂成形装置。 A mold having a first mold and a second mold arranged to face each other;
A supply mechanism for supplying a resin molding target to a mold surface of any one of the first mold and the second mold,
A positioning mechanism for positioning the resin molding target on the guide member on the mold surface;
A mold clamping mechanism for clamping the molding die,
A light-emitting element that emits irradiation light,
A first light receiving element provided in the supply mechanism and capable of receiving the irradiation light;
A determination unit for determining the positioning of the resin molding target,
The one mold is provided with a first emission passage hole that allows the irradiation light from the light emitting element to pass therethrough,
The determination unit determines whether the resin molding target is normally positioned on the guide member based on detection of the irradiation light passing through the first emission passage hole by the first light receiving element. Resin molding equipment.
前記導光部において前記照射光を通過させる光学部材が設けられる請求項1から3のいずれか1項に記載の樹脂成形装置。 A light guide unit for guiding the irradiation light emitted from the light emitting element to the first emission passage hole is provided on the one mold or the platen to which the one mold is attached,
4. The resin molding device according to claim 1, wherein an optical member that allows the irradiation light to pass therethrough is provided in the light guide unit. 5.
前記一方の型は、前記発光素子から発せられた前記照射光を通過させて前記導光部に導く入射用通過孔が設けられる請求項4に記載の樹脂成形装置。 The light emitting element is provided in the supply mechanism,
5. The resin molding apparatus according to claim 4, wherein the one mold is provided with an incident passage hole for passing the irradiation light emitted from the light emitting element and leading the irradiation light to the light guide.
前記供給機構に前記第2出射用通過孔を通過した前記照射光を受光可能な第2受光素子が設けられる請求項1から5のいずれか1項に記載の樹脂成形装置。 In a state in which the resin molding object is in contact with the guide member, irradiation light emitted from the light emitting element or another light emitting element is passed through a region on the opposite side of the guide member where the resin molding object is arranged. A second emission passage hole is provided in the one mold,
The resin molding apparatus according to any one of claims 1 to 5 , wherein the supply mechanism includes a second light receiving element capable of receiving the irradiation light having passed through the second emission passage.
前記型面において前記樹脂成形対象物をガイド部材に位置決めする位置決め工程と、
前記一方の型に設けられた第1出射用通過孔を通過する照射光を発光素子から発する照射工程と、
前記供給機構に設けられた第1受光素子が前記第1出射用通過孔を通過した前記照射光に関して検知する検知工程と、
前記検知工程での検知に基づいて、前記樹脂成形対象物が前記ガイド部材に正常に位置決めされているか否かを判断する判断工程と、
前記判断工程において、前記樹脂成形対象物が正常に位置決めされていると判断した場合は前記成形型を型締めして樹脂成形する樹脂成形工程とを含む樹脂成形品の製造方法。 A supply step of supplying a resin molding target to a mold surface of one of the molds having a first mold and a second mold arranged to face each other by a supply mechanism;
A positioning step of positioning the resin molding target on the guide member on the mold surface;
An irradiation step of emitting, from a light emitting element, irradiation light passing through a first emission passage hole provided in the one mold;
A detection step in which a first light receiving element provided in the supply mechanism detects the irradiation light passing through the first emission passage hole;
Based on the detection in the detection step, a determination step of determining whether the resin molding target is normally positioned on the guide member,
A resin molding step of, when it is determined in the determining step, that the resin molding object is properly positioned, performing a resin molding by clamping the molding die.
前記検知工程では、前記導光部を経由して前記第1出射用通過孔を通過した前記照射光に関して検知する請求項7に記載の樹脂成形品の製造方法。 In the irradiating step, the irradiating light is emitted toward a light guide portion provided on the platen to which the one mold or the one mold is attached,
The method of manufacturing a resin molded product according to claim 7, wherein in the detecting step, the irradiation light that has passed through the first emission passage hole via the light guide unit is detected.
前記照射光は、前記発光素子から前記一方の型に設けられた入射用通過孔、前記導光部、前記第1出射用通過孔を順次経由して前記第1受光素子によって検知される請求項8に記載の樹脂成形品の製造方法。 The light emitting element is provided in the supply mechanism,
The illuminating light is detected by the first light receiving element from the light emitting element via the incident passage hole, the light guide, and the first emission passage hole provided in the one mold in order. 9. The method for producing a resin molded product according to item 8 .
前記判断工程では、前記検知工程における前記第2受光素子による検知に基づいて、前記ガイド部材の異常及び前記樹脂成形対象物の変形の少なくとも一方に関して判断する請求項7から9のいずれか1項に記載の樹脂成形品の製造方法。 In the detecting step, in a state where the resin molding object is in contact with the guide member, further, a second emission passage hole provided in a region where the resin molding object is arranged on the opposite side of the guide member is further inserted. A second light receiving element for detecting irradiation light emitted from the light emitting element or another light emitting element that has passed,
The method according to any one of claims 7 to 9 , wherein in the determining step, based on the detection by the second light receiving element in the detecting step, a determination is made regarding at least one of the abnormality of the guide member and the deformation of the resin molding target. The method for producing a resin molded product according to the above.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017087132A JP6894285B2 (en) | 2017-04-26 | 2017-04-26 | Resin molding equipment and manufacturing method of resin molded products |
CN201810048558.5A CN108789988B (en) | 2017-04-26 | 2018-01-18 | Resin molding apparatus and method for manufacturing resin molded product |
TW107105777A TWI704043B (en) | 2017-04-26 | 2018-02-21 | Resin molding device and manufacturing method of resin molded product |
KR1020180026809A KR102153058B1 (en) | 2017-04-26 | 2018-03-07 | Molding apparatus and manufacturing method of resin molded article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017087132A JP6894285B2 (en) | 2017-04-26 | 2017-04-26 | Resin molding equipment and manufacturing method of resin molded products |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018183931A JP2018183931A (en) | 2018-11-22 |
JP2018183931A5 true JP2018183931A5 (en) | 2020-03-26 |
JP6894285B2 JP6894285B2 (en) | 2021-06-30 |
Family
ID=64094603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017087132A Active JP6894285B2 (en) | 2017-04-26 | 2017-04-26 | Resin molding equipment and manufacturing method of resin molded products |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6894285B2 (en) |
KR (1) | KR102153058B1 (en) |
CN (1) | CN108789988B (en) |
TW (1) | TWI704043B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7203778B2 (en) * | 2020-01-21 | 2023-01-13 | Towa株式会社 | RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD |
JP2022037315A (en) | 2020-08-25 | 2022-03-09 | Towa株式会社 | Resin molding equipment and method for manufacturing resin molded product |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH084267Y2 (en) * | 1989-05-31 | 1996-02-07 | 三菱マテリアル株式会社 | Mold for element package molding |
JPH05109797A (en) * | 1991-10-14 | 1993-04-30 | Mitsubishi Electric Corp | Semiconductor resin sealing device |
JPH1086188A (en) * | 1996-09-18 | 1998-04-07 | Sony Corp | Mold assembly for ic package |
JP3398032B2 (en) * | 1997-12-10 | 2003-04-21 | 河西工業株式会社 | Sheet material positioning method and positioning device |
JP4362296B2 (en) * | 2003-02-25 | 2009-11-11 | アピックヤマダ株式会社 | Work carry-in device and resin sealing device |
JP2005154201A (en) * | 2003-11-26 | 2005-06-16 | Sumitomo Heavy Ind Ltd | Mold assembly, press apparatus, handling apparatus and method, and positioning method |
JP4290177B2 (en) * | 2005-06-08 | 2009-07-01 | キヤノン株式会社 | Mold, alignment method, pattern forming apparatus, pattern transfer apparatus, and chip manufacturing method |
CN100503265C (en) * | 2005-06-08 | 2009-06-24 | 佳能株式会社 | Mold, pattern forming method, and pattern forming apparatus |
CN101037013A (en) * | 2006-03-15 | 2007-09-19 | 鸿富锦精密工业(深圳)有限公司 | Mould device |
JP4965933B2 (en) * | 2006-08-11 | 2012-07-04 | アピックヤマダ株式会社 | Mold equipment |
JP4848255B2 (en) * | 2006-11-29 | 2011-12-28 | アピックヤマダ株式会社 | Resin molding method and resin molding apparatus |
TW201040009A (en) * | 2009-05-08 | 2010-11-16 | Hon Hai Prec Ind Co Ltd | Method for making optical element and imprinting mold |
JP6294680B2 (en) * | 2014-01-24 | 2018-03-14 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
JP2015154201A (en) * | 2014-02-13 | 2015-08-24 | キヤノン株式会社 | Image processing system, control method for the same, and program |
JP6566706B2 (en) * | 2015-04-29 | 2019-08-28 | Towa株式会社 | Article manufacturing apparatus and method |
-
2017
- 2017-04-26 JP JP2017087132A patent/JP6894285B2/en active Active
-
2018
- 2018-01-18 CN CN201810048558.5A patent/CN108789988B/en active Active
- 2018-02-21 TW TW107105777A patent/TWI704043B/en active
- 2018-03-07 KR KR1020180026809A patent/KR102153058B1/en active IP Right Grant
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2018183931A5 (en) | ||
JP2018512187A5 (en) | ||
JP2015205775A5 (en) | ||
ATE549574T1 (en) | LIGHT SIGNAL DEVICE | |
BRPI0622243B8 (en) | method and system for inspecting a moving object by radiation imaging | |
JP2014517539A5 (en) | ||
RU2014123644A (en) | INK ROD IDENTIFICATION SYSTEM | |
JP2019505077A5 (en) | ||
JP2014225637A5 (en) | ||
DE502008002394D1 (en) | Operating light with distance-dependent brightness control | |
US20200256664A1 (en) | Systems and methods for optical measurement of container wall thickness | |
JP2017518615A5 (en) | ||
AR058832A1 (en) | RELEASE COATING CONTAINING THERMOPLASTIC POLYMERS | |
JP2017136411A5 (en) | ||
JP2016042501A5 (en) | ||
US9415548B2 (en) | Feeding apparatus for forming 3D object | |
JPWO2017109892A1 (en) | Component supply equipment, surface mounting machine | |
JP2017090695A5 (en) | ||
AR065330A1 (en) | PRODUCT IN HOLLOW GLASS WITH INDELEBLE DATA MATRIX MARKING | |
TWI670162B (en) | Injection molding machine | |
JP2017202892A5 (en) | ||
TWI660836B (en) | Extrusion device of three-dimensional printer and optical detection mechanism thereof | |
MX2019012179A (en) | Device and method for automatically orienting containers entering a labeling machine. | |
JP2018202862A5 (en) | ||
MY184538A (en) | Resin sealing apparatus and method of detecting abnormality of resin sealing apparatus |