JP2018180271A - Wavelength conversion member, wavelength conversion element, and light-emitting device using the same - Google Patents
Wavelength conversion member, wavelength conversion element, and light-emitting device using the same Download PDFInfo
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- JP2018180271A JP2018180271A JP2017079488A JP2017079488A JP2018180271A JP 2018180271 A JP2018180271 A JP 2018180271A JP 2017079488 A JP2017079488 A JP 2017079488A JP 2017079488 A JP2017079488 A JP 2017079488A JP 2018180271 A JP2018180271 A JP 2018180271A
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- wavelength conversion
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- magnesium oxide
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- inorganic phosphor
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 105
- 239000002245 particle Substances 0.000 claims abstract description 110
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 49
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 49
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000000919 ceramic Substances 0.000 claims description 31
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 230000005284 excitation Effects 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002223 garnet Substances 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 3
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 7
- 230000002123 temporal effect Effects 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000011224 oxide ceramic Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- -1 polypropylene carbonate Polymers 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Optical Filters (AREA)
- Semiconductor Lasers (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
本発明は、発光ダイオード（ＬＥＤ：Light Emitting Diode）やレーザーダイオード（ＬＤ：Laser Diode）等の発する光の波長を別の波長に変換する波長変換部材及び波長変換素子、並びにそれらを用いた発光装置に関する。 The present invention relates to a wavelength conversion member and a wavelength conversion element for converting the wavelength of light emitted from a light emitting diode (LED: Light Emitting Diode) or a laser diode (LD: Laser Diode) to another wavelength, and a light emitting device using them About.
近年、蛍光ランプや白熱灯に変わる次世代の発光装置として、低消費電力、小型軽量、容易な光量調節という観点から、ＬＥＤやＬＤを用いた発光装置に対する注目が高まってきている。そのような次世代発光装置の一例として、例えば特許文献１には、青色光を出射するＬＥＤ上に、ＬＥＤからの光の一部を吸収して黄色光に変換する波長変換部材が配置された発光装置が開示されている。この発光装置は、ＬＥＤから出射された青色光と、波長変換部材から出射された黄色光との合成光である白色光を発する。 In recent years, as a next-generation light emitting device replacing fluorescent lamps and incandescent lamps, attention has been focused on light emitting devices using LEDs or LDs from the viewpoint of low power consumption, small size, light weight, and easy light amount adjustment. As an example of such a next-generation light emitting device, for example, in Patent Document 1, a wavelength conversion member that absorbs a part of light from the LED and converts it into yellow light is disposed on the LED that emits blue light. A light emitting device is disclosed. The light emitting device emits white light which is a composite light of blue light emitted from the LED and yellow light emitted from the wavelength conversion member.
波長変換部材としては、従来、樹脂マトリクス中に無機蛍光体粒子を分散させたものが用いられている。しかしながら、当該波長変換部材を用いた場合、ＬＥＤからの光により樹脂マトリクスが変色したり、変形するという問題がある。そこで、樹脂に代えてガラスマトリクス中に蛍光体を分散固定した完全無機固体からなる波長変換部材が提案されている（例えば、特許文献２及び３参照）。当該波長変換部材は、母材となるガラスマトリクスがＬＥＤからの熱や照射光により劣化しにくく、変色や変形といった問題が生じにくいという特徴を有している。 As the wavelength conversion member, conventionally, one in which inorganic phosphor particles are dispersed in a resin matrix is used. However, when the wavelength conversion member is used, there is a problem that the resin matrix is discolored or deformed by the light from the LED. Then, the wavelength conversion member which consists of a perfect inorganic solid which disperse | distributed and fixed fluorescent substance in glass matrix instead of resin is proposed (for example, refer patent documents 2 and 3). The said wavelength conversion member has the characteristics that the glass matrix used as a base material does not deteriorate easily with the heat and irradiation light from LED, and problems, such as discoloration and a deformation | transformation, do not arise easily.
近年、発光装置のハイパワー化を目的として、光源として用いるＬＥＤやＬＤの出力が上昇している。それに伴い、光源の熱や、励起光を照射された蛍光体から発せられる熱により波長変換部材の温度が上昇し、その結果、発光強度が経時的に低下する（温度消光）という問題がある。また、場合によっては、波長変換部材の温度上昇が顕著となり、構成材料（ガラスマトリクス等）が溶解するおそれがある。 In recent years, the output of LEDs and LDs used as light sources has been rising for the purpose of increasing the power of light emitting devices. Along with that, the temperature of the wavelength conversion member rises due to the heat of the light source and the heat emitted from the phosphor irradiated with the excitation light, and as a result, there is a problem that the light emission intensity decreases with time (temperature quenching). Further, depending on the case, the temperature rise of the wavelength conversion member becomes remarkable, and there is a possibility that the constituent material (glass matrix or the like) may be dissolved.
以上に鑑み、本発明は、ハイパワーのＬＥＤやＬＤの光を照射した場合に、経時的な発光強度の低下や構成材料の溶解を抑制することが可能な波長変換部材及び波長変換素子、並びにそれらを用いた発光装置を提供することを目的とする。 In view of the above, according to the present invention, a wavelength conversion member, a wavelength conversion element, and a wavelength conversion element capable of suppressing the temporal decrease in emission intensity and the dissolution of constituent materials when irradiated with high power LED and LD light An object of the present invention is to provide a light emitting device using them.
本発明の波長変換部材は、無機蛍光体粒子、及び、酸化マグネシウム粒子を含有する波長変換部材であって、無機蛍光体粒子間に酸化マグネシウム粒子が介在しており、かつ、無機蛍光体粒子が酸化マグネシウム粒子により結着されていることを特徴とする。 The wavelength conversion member of the present invention is a wavelength conversion member containing inorganic phosphor particles and magnesium oxide particles, wherein magnesium oxide particles are interposed between the inorganic phosphor particles, and the inorganic phosphor particles are It is characterized in that it is bound by magnesium oxide particles.
本発明の波長変換部材においては、無機蛍光体粒子間に酸化マグネシウム粒子が介在している。ここで、酸化マグネシウム粒子はガラス等と比較して熱伝導性に優れているため、無機蛍光体粒子で発生した熱を効率良く外部に放出することができる。その結果、波長変換部材の温度上昇が抑制され、温度消光が生じにくくなる。また、酸化マグネシウム粒子は耐熱性にも優れるため、ハイパワーのＬＥＤやＬＤの光を照射した場合であっても溶解しにくい、あるいは、急激な温度上昇によるサーマルクラックといった不具合の発生を抑制することができるという利点もある。さらに、酸化マグネシウム粒子は、酸化アルミニウムや酸化ジルコニウム等のセラミック粒子と比較して低温で焼結可能であるという利点もある。そのため、波長変換部材作製時の焼成温度も低くすることができ、焼成時における無機蛍光体粉末の劣化を抑制することができる。 In the wavelength conversion member of the present invention, magnesium oxide particles are present between the inorganic phosphor particles. Here, since magnesium oxide particles are superior in thermal conductivity to glass and the like, heat generated by the inorganic phosphor particles can be efficiently released to the outside. As a result, the temperature rise of the wavelength conversion member is suppressed, and temperature quenching hardly occurs. In addition, since magnesium oxide particles are also excellent in heat resistance, they are difficult to be dissolved even when irradiated with light of high power LED or LD, or to suppress the occurrence of defects such as thermal cracks due to rapid temperature rise. There is also the advantage of being able to Furthermore, magnesium oxide particles have an advantage that they can be sintered at low temperature as compared with ceramic particles such as aluminum oxide and zirconium oxide. Therefore, the calcination temperature at the time of wavelength conversion member preparation can also be made low, and degradation of inorganic fluorescent substance powder at the time of calcination can be controlled.
本発明の波長変換部材は、質量％で、無機蛍光体粒子 ３〜８０％、及び、酸化マグネシウム粒子 ２０〜９７％を含有することが好ましい。 The wavelength conversion member of the present invention preferably contains 3 to 80% of inorganic phosphor particles and 20 to 97% of magnesium oxide particles in mass%.
本発明の波長変換部材において、酸化マグネシウム粒子の平均粒子径が０．０１〜１０μｍであることが好ましい。このようにすれば、波長変換部材の緻密性が向上して、熱伝導パスが形成されやすくなるため、無機蛍光体粒子で発生した熱をより一層効率良く外部に放出することができる。 In the wavelength conversion member of the present invention, the magnesium oxide particles preferably have an average particle size of 0.01 to 10 μm. In this way, the compactness of the wavelength conversion member is improved, and the heat conduction path is easily formed. Therefore, the heat generated by the inorganic phosphor particles can be released to the outside more efficiently.
本発明の波長変換部材において、酸化マグネシウム粒子の純度が９９％以上であることが好ましい。このようにすれば、酸化マグネシウム粒子を比較的低温で焼結することが可能となる。 In the wavelength conversion member of the present invention, the purity of the magnesium oxide particles is preferably 99% or more. In this way, it is possible to sinter the magnesium oxide particles at a relatively low temperature.
本発明の波長変換部材において、無機蛍光体粒子の平均粒子径が１〜５０μｍであることが好ましい。 In the wavelength conversion member of the present invention, the average particle diameter of the inorganic phosphor particles is preferably 1 to 50 μm.
本発明の波長変換部材において、無機蛍光体粒子がガーネット構造を有する酸化物蛍光体からなることが好ましい。ガーネット構造を有する酸化物蛍光体は耐熱性に優れるため、ハイパワーのＬＥＤやＬＤの光を照射した場合に、無機蛍光体粒子自体の劣化を抑制することができる。 In the wavelength conversion member of the present invention, the inorganic phosphor particles are preferably made of an oxide phosphor having a garnet structure. Since the oxide fluorescent substance which has a garnet structure is excellent in heat resistance, when irradiating the light of high power LED or LD, degradation of inorganic fluorescent substance particle itself can be suppressed.
本発明の波長変換部材において、（酸化マグネシウム粒子の平均粒子径）／（無機蛍光体粒子の平均粒子径）が０．５以下であることが好ましい。このようにすれば、波長変換部材の緻密性が向上して、熱伝導パスが形成されやすくなるため、無機蛍光体粒子で発生した熱をより一層効率良く外部に放出することができる。 In the wavelength conversion member of the present invention, (average particle diameter of magnesium oxide particles) / (average particle diameter of inorganic phosphor particles) is preferably 0.5 or less. In this way, the compactness of the wavelength conversion member is improved, and the heat conduction path is easily formed. Therefore, the heat generated by the inorganic phosphor particles can be released to the outside more efficiently.
本発明の波長変換素子は、上記の波長変換部材と、波長変換部材より高い熱伝導率を有する放熱層とが積層されてなる積層体からなることを特徴とする。このようにすれば、波長変換部材で発生した熱を放熱層に伝達することができるため、波長変換部材の温度上昇を抑制しやすくなる。 The wavelength conversion element of the present invention is characterized in that it is a laminated body formed by laminating the above-mentioned wavelength conversion member and a heat dissipation layer having a thermal conductivity higher than that of the wavelength conversion member. According to this configuration, the heat generated by the wavelength conversion member can be transmitted to the heat dissipation layer, so that the temperature rise of the wavelength conversion member can be easily suppressed.
本発明の波長変換素子において、放熱層として透光性セラミックスからなるものを使用することができる。 In the wavelength conversion element of the present invention, a material made of translucent ceramics can be used as a heat dissipation layer.
本発明の波長変換素子において、透光性セラミックスとして、酸化アルミニウム系セラミックス、窒化アルミニウム系セラミックス、炭化ケイ素系セラミックス、窒化ホウ素系セラミックス、酸化マグネシウム系セラミックス、酸化チタン系セラミックス、酸化ニオビウム系セラミックス、酸化亜鉛系セラミックス及び酸化イットリウム系セラミックスから選択される少なくとも１種を使用することができる。 In the wavelength conversion element of the present invention, aluminum oxide ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron nitride ceramics, magnesium oxide ceramics, titanium oxide ceramics, niobium oxide ceramics, oxide oxides are used as translucent ceramics. At least one selected from zinc-based ceramics and yttrium oxide-based ceramics can be used.
本発明の発光装置は、上記の波長変換部材と、波長変換部材に励起光を照射する光源とを備えてなることを特徴とする。 A light emitting device according to the present invention is characterized by including the above-described wavelength conversion member and a light source for irradiating the wavelength conversion member with excitation light.
本発明の発光装置は、上記の波長変換素子と、波長変換素子に励起光を照射する光源とを備えてなることを特徴とする。 A light emitting device of the present invention is characterized by including the above-described wavelength conversion element, and a light source for irradiating the wavelength conversion element with excitation light.
本発明の発光装置において、光源がレーザーダイオードであることが好ましい。本発明の波長変換部材及び波長変換素子は耐熱性及び放熱性に優れるため、光源として比較的ハイパワーであるレーザーダイオードを使用した場合に発明の効果を享受しやすい。 In the light emitting device of the present invention, the light source is preferably a laser diode. Since the wavelength conversion member and the wavelength conversion element of the present invention are excellent in heat resistance and heat dissipation, it is easy to receive the effects of the invention when a laser diode with relatively high power is used as a light source.
本発明によれば、ハイパワーのＬＥＤやＬＤの光を照射した場合に、経時的な発光強度の低下や構成材料の溶解を抑制することが可能な波長変換部材及び波長変換素子、並びにそれらを用いた発光装置を提供することができる。 According to the present invention, there is provided a wavelength conversion member and a wavelength conversion element capable of suppressing the decrease in emission intensity and the dissolution of constituent materials with time when light of high power LED or LD is irradiated. The light emitting device used can be provided.
以下、本発明の実施形態を図面を用いて説明する。但し、以下の実施形態は単なる例示であり、本発明は以下の実施形態に限定されるものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the following embodiments are merely illustrative, and the present invention is not limited to the following embodiments.
（波長変換部材）
図１は、本発明の波長変換部材の一実施形態を示す模式的断面図である。波長変換部材１０は無機蛍光体粒子１と酸化マグネシウム粒子２を含有している。ここで、無機蛍光体粒子１間に酸化マグネシウム粒子２が介在しており、無機蛍光体粒子１が酸化マグネシウム粒子２により結着されている。
(Wavelength conversion member)
FIG. 1 is a schematic cross-sectional view showing an embodiment of the wavelength conversion member of the present invention. The wavelength conversion member 10 contains inorganic phosphor particles 1 and magnesium oxide particles 2. Here, magnesium oxide particles 2 intervene between the inorganic phosphor particles 1, and the inorganic phosphor particles 1 are bound by the magnesium oxide particles 2.
無機蛍光体粒子１は、励起光の入射により蛍光を出射するものであれば、特に限定されるものではない。無機蛍光体粒子１の具体例としては、例えば、酸化物蛍光体、窒化物蛍光体、酸窒化物蛍光体、塩化物蛍光体、酸塩化物蛍光体、硫化物蛍光体、酸硫化物蛍光体、ハロゲン化物蛍光体、カルコゲン化物蛍光体、アルミン酸塩蛍光体、ハロリン酸塩化物蛍光体等が挙げられる。これらは単独または２種以上を混合して使用することができる。なお後述するように、波長変換部材１０は無機蛍光体粒子１と酸化マグネシウム粒子２の混合粒子を焼結することにより作製されるため、無機蛍光体粒子１としては焼結時に熱劣化しないように耐熱性に優れるものが好ましい。そのような観点からは、無機蛍光体粒子１は酸化物蛍光体、特にガーネット構造を有する酸化物蛍光体（Ｙ３Ａｌ５Ｏ１２：Ｃｅ３＋、Ｌｕ３Ａｌ５Ｏ１２：Ｃｅ３＋等）であることが好ましい。 The inorganic phosphor particles 1 are not particularly limited as long as they emit fluorescence upon incidence of excitation light. Specific examples of the inorganic phosphor particles 1 include, for example, oxide phosphors, nitride phosphors, oxynitride phosphors, chloride phosphors, acid chloride phosphors, sulfide phosphors, and acid sulfide phosphors. And halide phosphors, chalcogenide phosphors, aluminate phosphors, halophosphate chloride phosphors and the like. These may be used alone or in combination of two or more. As described later, since the wavelength conversion member 10 is produced by sintering mixed particles of the inorganic phosphor particles 1 and the magnesium oxide particles 2, the inorganic phosphor particles 1 should not be thermally deteriorated at the time of sintering. Those having excellent heat resistance are preferred. From such a point of view, the inorganic phosphor particle 1 is an oxide phosphor, particularly an oxide phosphor having a garnet structure (Y 3 Al 5 O 12 : Ce 3 + , Lu 3 Al 5 O 12 : Ce 3 +, etc.) Is preferred.
無機蛍光体粒子１の平均粒子径（Ｄ５０）は１〜５０μｍ、特に５〜２５μｍであることが好ましい。無機蛍光体粒子１の平均粒子径が小さすぎると、発光強度が低下しやすくなる。一方、無機蛍光体粒子１の平均粒子径が大きすぎると、発光色が不均一になる傾向がある。 The average particle size (D 50 ) of the inorganic phosphor particles 1 is preferably 1 to 50 μm, particularly 5 to 25 μm. When the average particle size of the inorganic phosphor particles 1 is too small, the emission intensity tends to be reduced. On the other hand, when the average particle size of the inorganic phosphor particles 1 is too large, the luminescent color tends to be nonuniform.
酸化マグネシウム粒子２の平均粒子径（Ｄ５０）は０．０１〜１０μｍ、特に０．０５〜５μｍ、特に０．０８〜１μｍであることが好ましい。平均粒子径を上記範囲とすることにより、酸化マグネシウム粒子２を比較的低温で焼結することが可能となる。 The average particle size (D 50 ) of the magnesium oxide particles 2 is preferably 0.01 to 10 μm, more preferably 0.05 to 5 μm, and particularly preferably 0.08 to 1 μm. By setting the average particle size in the above range, it is possible to sinter the magnesium oxide particles 2 at a relatively low temperature.
酸化マグネシウム粒子２の純度は９９％以上、９９．９％以上、特に９９．９８％以上であることが好ましい。酸化マグネシウム粒子２の純度を上記範囲とすることにより、酸化マグネシウム粒子２を比較的低温で焼結することが可能となる。 The purity of the magnesium oxide particles 2 is preferably 99% or more, 99.9% or more, particularly 99.98% or more. By setting the purity of the magnesium oxide particles 2 in the above range, it is possible to sinter the magnesium oxide particles 2 at a relatively low temperature.
上記の通り、酸化マグネシウム粒子２の平均粒子径や純度を適宜調整することにより、焼結温度を低くすることが可能となる。具体的には、１０００〜１４００℃、１０２０〜１２５０℃、さらには１０５０〜１１００℃未満の比較的低温で焼成しても緻密に焼結することができる。 As described above, by appropriately adjusting the average particle size and purity of the magnesium oxide particles 2, it is possible to lower the sintering temperature. Specifically, it can be densely sintered even if it is fired at a relatively low temperature of 1000 to 1400 ° C., 1020-1250 ° C., and further 1050 to 1100 ° C.
酸化マグネシウム粒子２の作製方法としては、気相酸化反応による合成法や、水中火花放電法等が挙げられる。なかでも、気相酸化反応による合成法は、高純度の酸化マグネシウム粒子が得られやすいため好ましい。なお、酸化マグネシウム粒子の市販品としては、宇部マテリアルズ製の５０Ａや２０００Ａ等を用いることができる。 Examples of the method for producing the magnesium oxide particles 2 include a synthesis method by gas phase oxidation reaction, an underwater spark discharge method, and the like. Among them, a synthesis method by gas phase oxidation reaction is preferable because magnesium oxide particles with high purity can be easily obtained. In addition, 50A, 2000A etc. made from Ube Materials can be used as a commercial item of magnesium oxide particle | grains.
なお、（酸化マグネシウム粒子２の平均粒子径）／（無機蛍光体粒子１の平均粒子径）は０．５以下、０．２以下、０．１以下、特に０．０５以下であることが好ましい。このようにすれば、波長変換部材１０の緻密性が向上して、熱伝導パスが形成されやすくなるため、無機蛍光体粒子１で発生した熱をより一層効率良く外部に放出することができる。 The (average particle diameter of magnesium oxide particles 2) / (average particle diameter of inorganic phosphor particles 1) is preferably 0.5 or less, 0.2 or less, 0.1 or less, and particularly preferably 0.05 or less. . In this way, the compactness of the wavelength conversion member 10 is improved, and the heat conduction path is easily formed. Therefore, the heat generated by the inorganic phosphor particles 1 can be released to the outside more efficiently.
波長変換部材１０における無機蛍光体粒子１及び酸化マグネシウム粒子２の割合は、質量％で、無機蛍光体粒子１ ３〜８０％、酸化マグネシウム粒子２ ２０〜９７％であることが好ましく、無機蛍光体粒子１ １５〜７５％、酸化マグネシウム粒子２ ２５〜９５％であることがより好ましく、無機蛍光体粒子１ ８〜７０％、酸化マグネシウム粒子２ ３０〜９２％であることがさらに好ましい。無機蛍光体粒子１の含有量が少なすぎる（酸化マグネシウム粒子２の含有量が多すぎる）と、波長変換部材１０の発光強度が低下しやすくなる。一方、無機蛍光体粒子１の含有量が多すぎる（酸化マグネシウム粒子２の含有量が少なすぎる）と、波長変換部材１０において酸化マグネシウム粒子２からなる熱伝導パスが形成されにくくなるため、無機蛍光体粒子１で発生した熱が外部に放出されにくくなる。また、無機蛍光体粒子１の結着性が低下して、波長変換部材１０の機械的強度が低下しやすくなる。 The ratio of the inorganic phosphor particles 1 and the magnesium oxide particles 2 in the wavelength conversion member 10 is preferably 3 to 80% of the inorganic phosphor particles 13 and 20 to 97% of the magnesium oxide particles in mass%, and the inorganic phosphors The particle number is preferably 15 to 75%, and the magnesium oxide particles 2 is preferably 25 to 95%, and more preferably, the inorganic phosphor particles 18 to 70%, and the magnesium oxide particles 2 to 30 to 92%. If the content of the inorganic phosphor particles 1 is too small (the content of the magnesium oxide particles 2 is too large), the emission intensity of the wavelength conversion member 10 tends to be reduced. On the other hand, if the content of the inorganic phosphor particles 1 is too large (the content of the magnesium oxide particles 2 is too small), it becomes difficult to form a heat conduction path consisting of the magnesium oxide particles 2 in the wavelength conversion member 10. The heat generated by the body particle 1 is less likely to be released to the outside. In addition, the binding property of the inorganic phosphor particles 1 is reduced, and the mechanical strength of the wavelength conversion member 10 is easily reduced.
波長変換部材１０の形状は特に限定されないが、通常は板状（矩形板状、円盤状等）である。波長変換部材１０の厚みは、目的とする色合いの光が得られるよう適宜選択することが好ましい。具体的には、波長変換部材１０の厚みは２ｍｍ以下、１ｍｍ以下、特に０．８ｍｍ以下であることが好ましい。但し、波長変換部材１０の厚みが小さすぎると機械的強度が低下しやすくなるため、０．０３ｍｍ以上であることが好ましい。 The shape of the wavelength conversion member 10 is not particularly limited, but is usually plate-like (rectangular plate-like, disk-like, etc.). It is preferable that the thickness of the wavelength conversion member 10 be appropriately selected so as to obtain light of a target color. Specifically, the thickness of the wavelength conversion member 10 is preferably 2 mm or less, 1 mm or less, and particularly 0.8 mm or less. However, if the thickness of the wavelength conversion member 10 is too small, the mechanical strength is likely to be reduced, so the thickness is preferably 0.03 mm or more.
波長変換部材１０は、無機蛍光体粒子１と酸化マグネシウム粒子２を所定の割合で混合した原料粉末を予備成型した後、焼成することにより製造することができる。ここで、原料粉末に結合剤や溶剤等の有機成分を添加してペースト状にした後、焼成してもよい。このようにすれば、グリーンシート成形等の方法を利用して、所望の形状の予備成型体が形成しやすくなる。この際、まず脱脂工程（６００℃程度）で有機成分を除去した後、酸化マグネシウム粒子２の焼結温度で焼成することにより、緻密な焼結体が得られやすくなる。また、１次焼成後に焼成温度±１５０℃でＨＩＰ（熱間静水圧プレス）処理を施しても良い。そうすることによって、波長変換部材１０内の空孔を収縮させて消滅させることができ、過剰な光の散乱を抑制することができる。 The wavelength conversion member 10 can be manufactured by pre-forming a raw material powder in which the inorganic phosphor particles 1 and the magnesium oxide particles 2 are mixed in a predetermined ratio, and then firing the raw material powder. Here, an organic component such as a binder or a solvent may be added to the raw material powder to form a paste, which may then be fired. In this way, a preformed body having a desired shape can be easily formed using a method such as green sheet molding. Under the present circumstances, after removing an organic component at a degreasing process (about 600 degreeC) first, by baking at the sintering temperature of the magnesium oxide particle 2, a precise | minute sintered compact becomes is easy to be obtained. Moreover, you may perform a HIP (hot isostatic press) process with the calcination temperature +/- 150 degreeC after primary baking. By doing so, the holes in the wavelength conversion member 10 can be shrunk and eliminated, and excessive light scattering can be suppressed.
結合剤としては、ポリプロピレンカーボネート、ポリブチルメタクリレート、ポリビニルブチラール、ポリメチルメタクリレート、ポリエチルメタクリレート、エチルセルロース、ニトロセルロース、ポリエステルカーボネート等が使用可能であり、これらを単独あるいは混合して使用することができる。 As the binder, polypropylene carbonate, polybutyl methacrylate, polyvinyl butyral, polymethyl methacrylate, polyethyl methacrylate, ethyl cellulose, nitrocellulose, polyester carbonate and the like can be used, and these can be used alone or in combination.
溶剤としては、テルピネオール、酢酸イソアミル、トルエン、メチルエチルケトン、ジエチレングリコールモノブチルエーテルアセテート、２，２，４−トリメチル−１，３−ペンタジオールモノイソブチレート等を単独または混合して使用することができる。 As a solvent, terpineol, isoamyl acetate, toluene, methyl ethyl ketone, diethylene glycol monobutyl ether acetate, 2,2,4-trimethyl-1,3-pentadiol monoisobutyrate etc. can be used alone or in combination.
ペースト中には、焼結助剤が含有されていてもよい。焼結助剤としては、例えば、リン酸マグネシウム、リン酸ジルコニウム、酸化マンガン、酸化バリウム、酸化イットリウム、酸化ケイ素等の晶質粉末や、ケイ酸系やリン酸系等の酸化物非晶質粉末を用いることができる。 The paste may contain a sintering aid. As a sintering aid, for example, crystalline powder such as magnesium phosphate, zirconium phosphate, manganese oxide, barium oxide, yttrium oxide, silicon oxide, etc., oxide amorphous powder such as silicic acid type or phosphoric acid type Can be used.
（波長変換素子）
図２は、本発明の波長変換素子の一実施形態を示す模式的断面図である。波長変換素子２０は波長変換部材１０と、波長変換部材１０より高い熱伝導率を有する放熱層３とを積層させた積層体から構成されている。本実施形態では、波長変換部材１０に励起光が照射されることにより発生した熱は、放熱層３を通じて外部に効率良く放出される。よって、波長変換部材１０の温度が過度に上昇することを抑制することができる。
(Wavelength conversion element)
FIG. 2 is a schematic cross-sectional view showing an embodiment of the wavelength conversion element of the present invention. The wavelength conversion element 20 is formed of a laminated body in which the wavelength conversion member 10 and the heat dissipation layer 3 having a thermal conductivity higher than that of the wavelength conversion member 10 are laminated. In the present embodiment, the heat generated by irradiating the wavelength conversion member 10 with the excitation light is efficiently released to the outside through the heat dissipation layer 3. Therefore, it can suppress that the temperature of the wavelength conversion member 10 rises too much.
放熱層３は、波長変換部材１０より高い熱伝導率を有している。具体的には、放熱層３の熱伝導率は５Ｗ／ｍ・Ｋ以上、１０Ｗ／ｍ・Ｋ以上、特に２０Ｗ／ｍ・Ｋ以上であることが好ましい。 The heat dissipation layer 3 has a thermal conductivity higher than that of the wavelength conversion member 10. Specifically, the thermal conductivity of the heat dissipation layer 3 is preferably 5 W / m · K or more, 10 W / m · K or more, particularly 20 W / m · K or more.
放熱層３の厚みは０．０５〜１ｍｍ、０．０７〜０．８ｍｍ、特に０．１〜０．５ｍｍであることが好ましい。放熱層３の厚みが小さすぎると、機械的強度が低下する傾向がある。一方、放熱層３の厚みが大きすぎると、波長変換素子が大型化する傾向がある。 The thickness of the heat dissipation layer 3 is preferably 0.05 to 1 mm, 0.07 to 0.8 mm, and particularly 0.1 to 0.5 mm. If the thickness of the heat dissipation layer 3 is too small, the mechanical strength tends to decrease. On the other hand, when the thickness of the heat dissipation layer 3 is too large, the wavelength conversion element tends to be large.
放熱層３としては透光性セラミックスからなるものを使用することができる。このようにすれば、励起光または蛍光を透過させることができるため、透過型の波長変換素子として使用することができる。透光性セラミックスからなる放熱層の波長４００〜８００ｎｍにおける全光線透過率は１０％以上、２０％以上、３０％以上、４０％、特に５０％以上であることが好ましい。 The heat dissipating layer 3 may be made of translucent ceramic. In this way, excitation light or fluorescence can be transmitted, so that it can be used as a transmission type wavelength conversion element. The total light transmittance at a wavelength of 400 to 800 nm of the heat dissipation layer made of translucent ceramic is preferably 10% or more, 20% or more, 30% or more, 40%, particularly 50% or more.
透光性セラミックスとしては、酸化アルミニウム系セラミックス、窒化アルミニウム系セラミックス、炭化ケイ素系セラミックス、窒化ホウ素系セラミックス、酸化マグネシウム系セラミックス、酸化チタン系セラミックス、酸化ニオビウム系セラミックス、酸化亜鉛系セラミックス及び酸化イットリウム系セラミックスから選択される少なくとも１種を使用することができる。 As translucent ceramics, aluminum oxide ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron nitride ceramics, magnesium oxide ceramics, titanium oxide ceramics, niobium oxide ceramics, zinc oxide ceramics, yttrium oxide ceramics At least one selected from ceramics can be used.
本実施形態の波長変換素子２０は、波長変換部材１０の一方の主面のみに放熱層３が形成されているが、波長変換部材１０の両主面に放熱層３を形成してもよい。このようにすれば、波長変換部材１０で発生した熱をより一層効率よく外部に放出することができる。さらに、波長変換部材１０と放熱層３とを交互に積層させた４層以上の積層体であってもよい。 Although the heat dissipation layer 3 is formed only on one main surface of the wavelength conversion member 10 in the wavelength conversion element 20 of the present embodiment, the heat dissipation layer 3 may be formed on both main surfaces of the wavelength conversion member 10. In this way, the heat generated by the wavelength conversion member 10 can be released to the outside more efficiently. Furthermore, the laminated body of 4 or more layers which laminated | stacked the wavelength conversion member 10 and the thermal radiation layer 3 alternately may be sufficient.
なお、放熱層３としては透光性セラミックスからなるもの以外にも、Ｃｕ、Ａｌ、Ａｇ等の金属からなる層であってもよい。このようにすれば、反射型の波長変換素子として使用することができる。 Note that the heat dissipation layer 3 may be a layer made of a metal such as Cu, Al, Ag or the like other than the one made of translucent ceramic. In this way, it can be used as a reflection type wavelength conversion element.
（発光装置）
図３は、本発明の発光装置の一実施形態を示す模式的側面図である。本実施形態に係る発光装置は、透過型の波長変換部材を用いた発光装置である。図３に示すように、発光装置３０は、波長変換部材１０と光源４を備えている。光源４から出射された励起光Ｌ０は、波長変換部材１０により、励起光Ｌ０よりも波長の長い蛍光Ｌ１に波長変換される。また、励起光Ｌ０の一部は波長変換部材１０を透過する。このため、波長変換部材１０からは、励起光Ｌ０と蛍光Ｌ１との合成光Ｌ２が出射する。例えば、励起光Ｌ０が青色光であり、蛍光Ｌ１が黄色光である場合、白色の合成光Ｌ２を得ることができる。なお、波長変換部材１０の代わりに、上記で説明した波長変換素子２０を使用してもよい。
(Light-emitting device)
FIG. 3 is a schematic side view showing an embodiment of the light emitting device of the present invention. The light emitting device according to the present embodiment is a light emitting device using a transmission type wavelength conversion member. As shown in FIG. 3, the light emitting device 30 includes the wavelength conversion member 10 and the light source 4. The excitation light L0 emitted from the light source 4 is wavelength converted by the wavelength conversion member 10 into fluorescence L1 having a longer wavelength than the excitation light L0. Further, part of the excitation light L0 passes through the wavelength conversion member 10. For this reason, from the wavelength conversion member 10, the combined light L2 of the excitation light L0 and the fluorescence L1 is emitted. For example, when the excitation light L0 is blue light and the fluorescence L1 is yellow light, white synthetic light L2 can be obtained. The wavelength conversion element 20 described above may be used instead of the wavelength conversion member 10.
光源４としては、ＬＥＤやＬＤが挙げられる。発光装置３０の発光強度を高める観点からは、光源４は高強度の光を出射できるＬＤを用いることが好ましい。 Examples of the light source 4 include LEDs and LDs. From the viewpoint of increasing the light emission intensity of the light emitting device 30, it is preferable that the light source 4 be an LD capable of emitting high-intensity light.
１ 無機蛍光体粒子
２ 酸化マグネシウム粒子
３ 放熱層
４ 光源
１０ 波長変換部材
２０ 波長変換素子
３０ 発光装置
DESCRIPTION OF SYMBOLS 1 inorganic fluorescent substance particle 2 magnesium oxide particle 3 heat dissipation layer 4 light source 10 wavelength conversion member 20 wavelength conversion element 30 light emitting device
Claims (13)
無機蛍光体粒子間に酸化マグネシウム粒子が介在しており、かつ、無機蛍光体粒子が酸化マグネシウム粒子により結着されていることを特徴とする波長変換部材。 It is a wavelength conversion member containing inorganic phosphor particles and magnesium oxide particles,
A wavelength conversion member characterized in that magnesium oxide particles intervene between inorganic phosphor particles, and the inorganic phosphor particles are bound by magnesium oxide particles.
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| JP2017079488A JP6802983B2 (en) | 2017-04-13 | 2017-04-13 | Wavelength conversion member and wavelength conversion element, and light emitting device using them |
| PCT/JP2018/005780 WO2018189997A1 (en) | 2017-04-13 | 2018-02-19 | Wavelength conversion member and wavelength conversion element, and light-emitting device using same |
| TW107106282A TW201842154A (en) | 2017-04-13 | 2018-02-26 | Wavelength conversion member and wavelength conversion element, and light-emitting device using same |
| CN201820515641.4U CN208507721U (en) | 2017-04-13 | 2018-04-12 | Wavelength convert component and Wavelength changing element and the light emitting device for using them |
| CN201810325104.8A CN108735877A (en) | 2017-04-13 | 2018-04-12 | Wavelength convert component and Wavelength changing element and use their light-emitting device |
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| JPWO2020213456A1 (en) * | 2019-04-18 | 2020-10-22 | ||
| WO2021015261A1 (en) | 2019-07-22 | 2021-01-28 | 地方独立行政法人神奈川県立産業技術総合研究所 | Fluorescent member, method for producing same, and light-emitting device |
| WO2021132212A1 (en) * | 2019-12-23 | 2021-07-01 | 日本電気硝子株式会社 | Wavelength conversion member, light-emitting element, and light-emitting device |
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| CN113544236A (en) * | 2019-04-18 | 2021-10-22 | 日本电气硝子株式会社 | Wavelength conversion member, method for manufacturing same, and light-emitting device |
| CN112174646A (en) * | 2020-09-28 | 2021-01-05 | 东北大学 | High-thermal-conductivity fluorescent ceramic for laser illumination and preparation method thereof |
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| WO2021132212A1 (en) * | 2019-12-23 | 2021-07-01 | 日本電気硝子株式会社 | Wavelength conversion member, light-emitting element, and light-emitting device |
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| TW201842154A (en) | 2018-12-01 |
| WO2018189997A1 (en) | 2018-10-18 |
| CN108735877A (en) | 2018-11-02 |
| CN208507721U (en) | 2019-02-15 |
| JP6802983B2 (en) | 2020-12-23 |
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