JP2018145524A - 電気メッキのための幅広リップシール - Google Patents
電気メッキのための幅広リップシール Download PDFInfo
- Publication number
- JP2018145524A JP2018145524A JP2018034439A JP2018034439A JP2018145524A JP 2018145524 A JP2018145524 A JP 2018145524A JP 2018034439 A JP2018034439 A JP 2018034439A JP 2018034439 A JP2018034439 A JP 2018034439A JP 2018145524 A JP2018145524 A JP 2018145524A
- Authority
- JP
- Japan
- Prior art keywords
- lip seal
- electroplating
- wafer
- semiconductor substrate
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000002253 acid Substances 0.000 claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 238000009792 diffusion process Methods 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 65
- 238000007747 plating Methods 0.000 description 38
- 239000003792 electrolyte Substances 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- UPMXNNIRAGDFEH-UHFFFAOYSA-N 3,5-dibromo-4-hydroxybenzonitrile Chemical compound OC1=C(Br)C=C(C#N)C=C1Br UPMXNNIRAGDFEH-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/446,631 US20180251907A1 (en) | 2017-03-01 | 2017-03-01 | Wide lipseal for electroplating |
US15/446,631 | 2017-03-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018145524A true JP2018145524A (ja) | 2018-09-20 |
Family
ID=63357279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018034439A Pending JP2018145524A (ja) | 2017-03-01 | 2018-02-28 | 電気メッキのための幅広リップシール |
Country Status (6)
Country | Link |
---|---|
US (1) | US20180251907A1 (zh) |
JP (1) | JP2018145524A (zh) |
KR (2) | KR20180100488A (zh) |
CN (1) | CN108531953B (zh) |
SG (1) | SG10201801584QA (zh) |
TW (1) | TW201841301A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7081063B1 (ja) * | 2021-10-18 | 2022-06-06 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
TWI803026B (zh) * | 2021-10-25 | 2023-05-21 | 日商荏原製作所股份有限公司 | 鍍覆方法及鍍覆裝置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7132136B2 (ja) * | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | ワーク保持治具及び電気めっき装置 |
JP7132134B2 (ja) * | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | ワーク保持治具及び電気めっき装置 |
KR20210157413A (ko) * | 2019-05-17 | 2021-12-28 | 램 리써치 코포레이션 | 기판 부착 및 파손 완화 |
US11352711B2 (en) | 2019-07-16 | 2022-06-07 | Applied Materials, Inc. | Fluid recovery in semiconductor processing |
US20230012414A1 (en) * | 2019-11-27 | 2023-01-12 | Lam Research Corporation | Edge removal for through-resist plating |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6755946B1 (en) * | 2001-11-30 | 2004-06-29 | Novellus Systems, Inc. | Clamshell apparatus with dynamic uniformity control |
JP2013040404A (ja) * | 2011-08-15 | 2013-02-28 | Novellus Systems Inc | 半導体電気メッキ装置用のリップシールおよびコンタクト部 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7033465B1 (en) * | 2001-11-30 | 2006-04-25 | Novellus Systems, Inc. | Clamshell apparatus with crystal shielding and in-situ rinse-dry |
US7985325B2 (en) * | 2007-10-30 | 2011-07-26 | Novellus Systems, Inc. | Closed contact electroplating cup assembly |
JP5237924B2 (ja) * | 2008-12-10 | 2013-07-17 | ノベルス・システムズ・インコーポレーテッド | ベースプレート、及び電気メッキ装置 |
JP6745103B2 (ja) * | 2014-11-26 | 2020-08-26 | ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated | 半導体電気メッキ装置用のリップシールおよび接触要素 |
-
2017
- 2017-03-01 US US15/446,631 patent/US20180251907A1/en not_active Abandoned
-
2018
- 2018-02-27 SG SG10201801584QA patent/SG10201801584QA/en unknown
- 2018-02-27 TW TW107106485A patent/TW201841301A/zh unknown
- 2018-02-27 KR KR1020180023598A patent/KR20180100488A/ko not_active IP Right Cessation
- 2018-02-28 JP JP2018034439A patent/JP2018145524A/ja active Pending
- 2018-02-28 CN CN201810166071.7A patent/CN108531953B/zh active Active
-
2023
- 2023-10-27 KR KR1020230145988A patent/KR20230153982A/ko not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6755946B1 (en) * | 2001-11-30 | 2004-06-29 | Novellus Systems, Inc. | Clamshell apparatus with dynamic uniformity control |
JP2013040404A (ja) * | 2011-08-15 | 2013-02-28 | Novellus Systems Inc | 半導体電気メッキ装置用のリップシールおよびコンタクト部 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7081063B1 (ja) * | 2021-10-18 | 2022-06-06 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
CN115135618A (zh) * | 2021-10-18 | 2022-09-30 | 株式会社荏原制作所 | 镀覆方法及镀覆装置 |
WO2023067650A1 (ja) * | 2021-10-18 | 2023-04-27 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
TWI803026B (zh) * | 2021-10-25 | 2023-05-21 | 日商荏原製作所股份有限公司 | 鍍覆方法及鍍覆裝置 |
Also Published As
Publication number | Publication date |
---|---|
US20180251907A1 (en) | 2018-09-06 |
CN108531953A (zh) | 2018-09-14 |
CN108531953B (zh) | 2022-07-12 |
KR20230153982A (ko) | 2023-11-07 |
TW201841301A (zh) | 2018-11-16 |
SG10201801584QA (en) | 2018-10-30 |
KR20180100488A (ko) | 2018-09-11 |
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