KR20180100488A - 전기도금을 위한 와이드 립시일 - Google Patents

전기도금을 위한 와이드 립시일 Download PDF

Info

Publication number: KR20180100488A
Authority: KR; South Korea
Prior art keywords: lip seal; electroplating; semiconductor substrate; wafer; cup
Prior art date: 2017-03-01

Application number

KR1020180023598A

Other languages

English (en)

Korean (ko)

Inventor

카리 소켈슨

아론 베르케

산토쉬 쿠마

로버트 래쉬

리 펭 추아

브라이언 버칼루

Original Assignee

램 리써치 코포레이션

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-03-01

Filing date

2018-02-27

Publication date

2018-09-11

2018-02-27 Application filed by 램 리써치 코포레이션 filed Critical 램 리써치 코포레이션

2018-09-11 Publication of KR20180100488A publication Critical patent/KR20180100488A/ko

2023-10-27 Priority to KR1020230145988A priority Critical patent/KR20230153982A/ko

Links

238000009713 electroplating Methods 0.000 title claims abstract description 37
239000000758 substrate Substances 0.000 claims abstract description 39
239000004065 semiconductor Substances 0.000 claims abstract description 20
230000002093 peripheral effect Effects 0.000 claims abstract description 11
238000000034 method Methods 0.000 claims description 9
239000002253 acid Substances 0.000 abstract description 24
238000009792 diffusion process Methods 0.000 abstract description 15
229920001971 elastomer Polymers 0.000 abstract 1
239000000806 elastomer Substances 0.000 abstract 1
235000012431 wafers Nutrition 0.000 description 63
238000007747 plating Methods 0.000 description 37
239000003792 electrolyte Substances 0.000 description 21
239000000243 solution Substances 0.000 description 18
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
229910052802 copper Inorganic materials 0.000 description 12
239000010949 copper Substances 0.000 description 12
230000007797 corrosion Effects 0.000 description 8
238000005260 corrosion Methods 0.000 description 8
229910052751 metal Inorganic materials 0.000 description 7
239000002184 metal Substances 0.000 description 7
239000012528 membrane Substances 0.000 description 6
230000001965 increasing effect Effects 0.000 description 5
238000007789 sealing Methods 0.000 description 5
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
238000013461 design Methods 0.000 description 4
238000009736 wetting Methods 0.000 description 4
238000007654 immersion Methods 0.000 description 3
238000004519 manufacturing process Methods 0.000 description 3
238000012545 processing Methods 0.000 description 3
239000007921 spray Substances 0.000 description 3
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
239000005751 Copper oxide Substances 0.000 description 2
230000000712 assembly Effects 0.000 description 2
238000000429 assembly Methods 0.000 description 2
229910000431 copper oxide Inorganic materials 0.000 description 2
239000013536 elastomeric material Substances 0.000 description 2
238000005530 etching Methods 0.000 description 2
238000009434 installation Methods 0.000 description 2
239000007788 liquid Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
230000007246 mechanism Effects 0.000 description 2
229910021645 metal ion Inorganic materials 0.000 description 2
230000005012 migration Effects 0.000 description 2
238000013508 migration Methods 0.000 description 2
238000009428 plumbing Methods 0.000 description 2
239000000654 additive Substances 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
230000008901 benefit Effects 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
230000008859 change Effects 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
230000000295 complement effect Effects 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000002845 discoloration Methods 0.000 description 1
239000012636 effector Substances 0.000 description 1
239000008151 electrolyte solution Substances 0.000 description 1
230000003628 erosive effect Effects 0.000 description 1
230000007717 exclusion Effects 0.000 description 1
239000012530 fluid Substances 0.000 description 1
230000001939 inductive effect Effects 0.000 description 1
239000003112 inhibitor Substances 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
238000011835 investigation Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
125000002524 organometallic group Chemical group 0.000 description 1
238000007781 pre-processing Methods 0.000 description 1
230000008569 process Effects 0.000 description 1
238000011112 process operation Methods 0.000 description 1
238000000926 separation method Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
230000007480 spreading Effects 0.000 description 1
238000003892 spreading Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
229910052715 tantalum Inorganic materials 0.000 description 1
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Life Sciences & Earth Sciences (AREA)
Sustainable Development (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
General Physics & Mathematics (AREA)
Physics & Mathematics (AREA)
Electroplating Methods And Accessories (AREA)
Electrodes Of Semiconductors (AREA)

KR1020180023598A 2017-03-01 2018-02-27 전기도금을 위한 와이드 립시일 KR20180100488A (ko)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
KR1020230145988A KR20230153982A (ko)	2017-03-01	2023-10-27	전기도금을 위한 와이드 립시일

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US15/446,631 US20180251907A1 (en)	2017-03-01	2017-03-01	Wide lipseal for electroplating
US15/446,631		2017-03-01

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020230145988A Division KR20230153982A (ko)	2017-03-01	2023-10-27	전기도금을 위한 와이드 립시일

Publications (1)

Publication Number	Publication Date
KR20180100488A true KR20180100488A (ko)	2018-09-11

Family

ID=63357279

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
KR1020180023598A KR20180100488A (ko)	2017-03-01	2018-02-27	전기도금을 위한 와이드 립시일
KR1020230145988A KR20230153982A (ko)	2017-03-01	2023-10-27	전기도금을 위한 와이드 립시일

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
KR1020230145988A KR20230153982A (ko)	2017-03-01	2023-10-27	전기도금을 위한 와이드 립시일

Country Status (6)

Country	Link
US (1)	US20180251907A1 (zh)
JP (1)	JP2018145524A (zh)
KR (2)	KR20180100488A (zh)
CN (1)	CN108531953B (zh)
SG (1)	SG10201801584QA (zh)
TW (1)	TW201841301A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20230006776A (ko) *	2019-07-16	2023-01-11	어플라이드 머티어리얼스, 인코포레이티드	반도체 프로세싱에서의 유체 회수

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7132136B2 (ja) *	2019-01-23	2022-09-06	上村工業株式会社	ワーク保持治具及び電気めっき装置
JP7132134B2 (ja) *	2019-01-23	2022-09-06	上村工業株式会社	ワーク保持治具及び電気めっき装置
KR20210157413A (ko) *	2019-05-17	2021-12-28	램 리써치 코포레이션	기판 부착 및 파손 완화
US20230012414A1 (en) *	2019-11-27	2023-01-12	Lam Research Corporation	Edge removal for through-resist plating
KR102493634B1 (ko) *	2021-10-18	2023-02-06	가부시키가이샤 에바라 세이사꾸쇼	도금 방법 및 도금 장치
TWI803026B (zh) *	2021-10-25	2023-05-21	日商荏原製作所股份有限公司	鍍覆方法及鍍覆裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7033465B1 (en) *	2001-11-30	2006-04-25	Novellus Systems, Inc.	Clamshell apparatus with crystal shielding and in-situ rinse-dry
US6755946B1 (en) *	2001-11-30	2004-06-29	Novellus Systems, Inc.	Clamshell apparatus with dynamic uniformity control
US7985325B2 (en) *	2007-10-30	2011-07-26	Novellus Systems, Inc.	Closed contact electroplating cup assembly
JP5237924B2 (ja) *	2008-12-10	2013-07-17	ノベルス・システムズ・インコーポレーテッド	ベースプレート、及び電気メッキ装置
US9228270B2 (en) *	2011-08-15	2016-01-05	Novellus Systems, Inc.	Lipseals and contact elements for semiconductor electroplating apparatuses
JP6745103B2 (ja) *	2014-11-26	2020-08-26	ノベラス・システムズ・インコーポレーテッドＮｏｖｅｌｌｕｓＳｙｓｔｅｍｓＩｎｃｏｒｐｏｒａｔｅｄ	半導体電気メッキ装置用のリップシールおよび接触要素

2017
- 2017-03-01 US US15/446,631 patent/US20180251907A1/en not_active Abandoned
2018
- 2018-02-27 SG SG10201801584QA patent/SG10201801584QA/en unknown
- 2018-02-27 TW TW107106485A patent/TW201841301A/zh unknown
- 2018-02-27 KR KR1020180023598A patent/KR20180100488A/ko not_active IP Right Cessation
- 2018-02-28 JP JP2018034439A patent/JP2018145524A/ja active Pending
- 2018-02-28 CN CN201810166071.7A patent/CN108531953B/zh active Active
2023
- 2023-10-27 KR KR1020230145988A patent/KR20230153982A/ko not_active Application Discontinuation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20230006776A (ko) *	2019-07-16	2023-01-11	어플라이드 머티어리얼스, 인코포레이티드	반도체 프로세싱에서의 유체 회수
US11788200B2 (en)	2019-07-16	2023-10-17	Applied Materials, Inc.	Fluid recovery in semiconductor processing

Also Published As

Publication number	Publication date
US20180251907A1 (en)	2018-09-06
CN108531953A (zh)	2018-09-14
CN108531953B (zh)	2022-07-12
KR20230153982A (ko)	2023-11-07
TW201841301A (zh)	2018-11-16
SG10201801584QA (en)	2018-10-30
JP2018145524A (ja)	2018-09-20

Legal Events

Date	Code	Title	Description
2021-02-22	AMND	Amendment
2022-07-13	E902	Notification of reason for refusal
2022-09-13	AMND	Amendment
2023-01-30	E601	Decision to refuse application
2023-01-30	X091	Application refused [patent]
2023-05-30	AMND	Amendment
2023-07-27	X601	Decision of rejection after re-examination
2023-10-27	J201	Request for trial against refusal decision
2024-04-05	J301	Trial decision	Free format text: TRIAL NUMBER: 2023101002317; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20231027 Effective date: 20240405

Publication	Publication Date	Title
KR20180100488A (ko)	2018-09-11	전기도금을 위한 와이드 립시일
US10053792B2 (en)	2018-08-21	Plating cup with contoured cup bottom
US10435807B2 (en)	2019-10-08	Lipseals and contact elements for semiconductor electroplating apparatuses
US10689774B2 (en)	2020-06-23	Control of current density in an electroplating apparatus
KR20170007167A (ko)	2017-01-18	웨이퍼 부착을 감소시키기 위해 통합된 탄성중합체 립시일 및 컵 하단부
KR20130113370A (ko)	2013-10-15	역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝
US7033465B1 (en)	2006-04-25	Clamshell apparatus with crystal shielding and in-situ rinse-dry
KR20010014062A (ko)	2001-02-26	기판상에 전기도금하는 전기화학적인 증착 시스템 및 방법
US20180080140A1 (en)	2018-03-22	Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step
TW202424280A (zh)	2024-06-16	電鍍用寬唇形密封
JP2006328470A (ja)	2006-12-07	電気めっき装置
TWI826698B (zh)	2023-12-21	在一電鍍處理器中於電化學電鍍後減少或消除數個沈積物的方法
US11225727B2 (en)	2022-01-18	Control of current density in an electroplating apparatus
KR100660343B1 (ko)	2006-12-22	전기화학 도금 방법