JP2018129381A - 印刷回路の電気接続方法及び印刷回路の電気接続構造 - Google Patents
印刷回路の電気接続方法及び印刷回路の電気接続構造 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
【解決手段】印刷回路30の電気接続方法は、第1〜第3工程を有する。第1工程では、基材20と、導体11を搭載するFFC10とを重ね合わせる。第2工程では、第1工程においてFFC10に重ね合わせられた基材20を貫通すると共に、FFC10の導体11まで到達する貫通孔Thを形成する。第3工程では、導電性ペーストを利用したスクリーン印刷によって基材20上に印刷回路30を形成する。さらに、第3工程では、基材20上に印刷回路30を形成する際に、第2工程において形成された貫通孔Thに対して導電性ペーストを充填する。
【選択図】図4
Description
10 :FFC(薄型部材)
11 :導体(薄型導体)
12 :被覆部
20 :基材
30 :印刷回路
31 :信号線(第1の印刷回路)
32 :グランド線(第2の印刷回路)
40 :フラットシールドケーブル(薄型部材)
41 :導体(薄型導体)
42 :被覆部
43 :シールド部材(薄型導体)
44 :一部の部位
CM :導電性部材
D :ドリル
Th :貫通孔
Th1 :第1の貫通孔
Th2 :第2の貫通孔
Claims (4)
- 基材と薄型導体を搭載する薄型部材とを重ね合わせる第1工程と、
前記第1工程において前記薄型部材に重ね合わせられた基材を貫通すると共に、前記薄型部材の前記薄型導体まで到達する貫通孔を形成する第2工程と、
導電性ペーストを利用したスクリーン印刷によって前記基材上に印刷回路を形成する第3工程と、を備え、
前記第3工程では、前記基材上に印刷回路を形成する際に、前記第2工程において形成された貫通孔に対して導電性ペーストを充填する
ことを特徴とする印刷回路の電気接続方法。 - 前記第1工程における前記薄型部材は、一部を除いて周囲がシールド部材によって覆われたフラットシールドケーブルであって、
前記第2工程では、前記第1工程において重ね合わせられた基材を貫通すると共に前記薄型部材の前記シールド部材に覆われていない部位を開口して前記薄型導体まで到達する第1の貫通孔を形成し、且つ、前記第1工程において重ね合わせられた基材を貫通して前記シールド部材まで到達する第2の貫通孔を形成し、
前記第3工程では、前記基材上に第1の印刷回路としての信号線を形成するときに、前記第2工程において形成された第1の貫通孔に対して導電性ペーストを充填し、前記信号線と同時に前記基材上に第2の印刷回路としてのグランド線を形成するときに、前記第2工程において形成された第2の貫通孔に対して導電性ペーストを充填する
ことを特徴とする請求項1に記載の印刷回路の電気接続方法。 - 前記第2工程では、前記貫通孔を複数形成し、
前記第3工程では、前記基材上に印刷回路を形成するときに、前記第2工程において形成された複数の貫通孔に対して一括して導電性ペーストを充填して、印刷回路のうちの一回路を前記複数の貫通孔を介して前記薄型導体に電気接続させる
ことを特徴とする請求項1又は請求項2のいずれかに記載の印刷回路の電気接続方法。 - 薄型導体を搭載する薄型部材と、
前記薄型部材上に載置された基材と、
前記基材上に形成された印刷回路と、を備え、
前記基材には、前記基材を貫通すると共に、前記薄型部材の前記薄型導体まで到達する貫通孔が形成されており、
前記印刷回路は、前記基材のうち前記貫通孔上に形成され、
前記貫通孔には、前記印刷回路と同一の導電性部材が充填状態となっている
ことを特徴とする印刷回路の電気接続構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017021021A JP6700207B2 (ja) | 2017-02-08 | 2017-02-08 | 印刷回路の電気接続方法 |
US15/878,063 US20180228033A1 (en) | 2017-02-08 | 2018-01-23 | Electrical Connection Method of Printed Circuit and Electrical Connection Structure of Printed Circuit |
DE102018201911.8A DE102018201911B4 (de) | 2017-02-08 | 2018-02-07 | Elektrisches Verbindungsverfahren einer gedruckten Schaltung |
US16/040,596 US10485110B2 (en) | 2017-02-08 | 2018-07-20 | Electrical connection method of printed circuit and electrical connection structure of printed circuit |
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JP2017021021A JP6700207B2 (ja) | 2017-02-08 | 2017-02-08 | 印刷回路の電気接続方法 |
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JP2018129381A true JP2018129381A (ja) | 2018-08-16 |
JP6700207B2 JP6700207B2 (ja) | 2020-05-27 |
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KR102640159B1 (ko) * | 2018-12-12 | 2024-02-22 | 타츠타 전선 주식회사 | 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법 |
WO2020133421A1 (zh) * | 2018-12-29 | 2020-07-02 | 深南电路股份有限公司 | 多样化装配印刷线路板及制造方法 |
CN112672531B (zh) * | 2020-11-30 | 2023-10-24 | 江门荣信电路板有限公司 | Pcb单面基板的双面加工方法 |
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- 2018-01-23 US US15/878,063 patent/US20180228033A1/en not_active Abandoned
- 2018-02-07 DE DE102018201911.8A patent/DE102018201911B4/de active Active
- 2018-07-20 US US16/040,596 patent/US10485110B2/en active Active
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JP2001313448A (ja) * | 2000-04-28 | 2001-11-09 | Nitto Denko Corp | 両面フレキシブル配線板、icカードおよび両面フレキシブル配線板の製造方法 |
JP2007123744A (ja) * | 2005-10-31 | 2007-05-17 | Sony Corp | 光送受信モジュール |
JP2007221077A (ja) * | 2006-02-20 | 2007-08-30 | Fujikura Ltd | プリント配線板の接続構造および接続方法 |
US20080093118A1 (en) * | 2006-10-23 | 2008-04-24 | Ibiden Co., Ltd | Flex-rigid wiring board and method of manufacturing the same |
WO2009113202A1 (ja) * | 2008-03-10 | 2009-09-17 | イビデン株式会社 | フレキシブル配線板及びその製造方法 |
WO2010067731A1 (ja) * | 2008-12-08 | 2010-06-17 | イビデン株式会社 | 配線板及びその製造方法 |
JP2010212617A (ja) * | 2009-03-12 | 2010-09-24 | Sumitomo Electric Ind Ltd | フレキシブル配線基板 |
JP2015217639A (ja) * | 2014-05-20 | 2015-12-07 | 株式会社日立ハイテクノロジーズ | パターン形成方法及びその形成装置 |
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JP6700207B2 (ja) | 2020-05-27 |
DE102018201911A1 (de) | 2018-08-09 |
DE102018201911B4 (de) | 2023-10-05 |
US20180228033A1 (en) | 2018-08-09 |
US10485110B2 (en) | 2019-11-19 |
US20180332718A1 (en) | 2018-11-15 |
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