JP2018075663A - Grinding device - Google Patents

Grinding device Download PDF

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JP2018075663A
JP2018075663A JP2016218803A JP2016218803A JP2018075663A JP 2018075663 A JP2018075663 A JP 2018075663A JP 2016218803 A JP2016218803 A JP 2016218803A JP 2016218803 A JP2016218803 A JP 2016218803A JP 2018075663 A JP2018075663 A JP 2018075663A
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plate
workpiece
grinding
measuring
measuring element
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JP6785132B2 (en
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レーニア アルカナ
Kana Lenya Al
レーニア アルカナ
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

PROBLEM TO BE SOLVED: To inhibit influence of static electricity of a contact type height gauge in electrode polishing of a thin film magnetic head.SOLUTION: A grinding device includes: a holding table 20 which suctions and holds a plate-like workpiece W; grinding means 40 which grinds an upper surface of the plate-like workpiece; first measurement means 51 which measures a holding surface height of the holding table; second measurement means 52 which measures an upper surface height of the plate-like workpiece; and calculation means 57 which calculates a thickness of the plate-like workpiece on the basis of measuring results of the first and second measurement means. The second measurement means has: a second probe 56 which is formed by a conductive member and contacts with the upper surface of the plate-like workpiece; and connection means 58 which connects the second probe with ground.SELECTED DRAWING: Figure 2

Description

本発明は、研削装置に関する。   The present invention relates to a grinding apparatus.

磁気ディスク装置等の磁気記録媒体に用いられる薄膜磁気ヘッドは、例えばアルチック基板（アルミナチタンカーバイド（ＡｌＴｉＣ）基板）で構成される（特許文献１及び特許文献２参照）。アルチック基板の表面には、例えばＣｕ電極が形成され、当該Ｃｕ電極を覆うようにアルミナセラミック等の絶縁層が形成される。薄膜磁気ヘッドの生産工程においては、上記アルチック基板の絶縁層を研削してＣｕ電極が表出される。   A thin film magnetic head used for a magnetic recording medium such as a magnetic disk device is composed of, for example, an AlTiC substrate (alumina titanium carbide (AlTiC) substrate) (see Patent Document 1 and Patent Document 2). On the surface of the AlTiC substrate, for example, a Cu electrode is formed, and an insulating layer such as alumina ceramic is formed so as to cover the Cu electrode. In the production process of the thin film magnetic head, the Cu electrode is exposed by grinding the insulating layer of the AlTiC substrate.

特開平９−２４５３１７号公報Japanese Patent Laid-Open No. 9-245317 特開２００１−８４５１６号公報JP 2001-84516 A

アルチック基板を研削する工程では、基板を保持テーブルに保持させ、基板の上面及び保持テーブルの上面にそれぞれ接触式のハイトゲージを接触させて基板の厚みを測定している。研削中は、保持テーブルが回転することでハイトゲージの測定子先端が基板又は保持面上で擦れるため、測定子先端が摩耗するおそれがある。そこで、測定子の材質は、摩耗し難いダイアモンドやサファイア等の絶縁体が採用される。   In the step of grinding the Altic substrate, the substrate is held on a holding table, and a contact-type height gauge is brought into contact with the upper surface of the substrate and the upper surface of the holding table, respectively, and the thickness of the substrate is measured. During grinding, the tip of the height gauge probe rubs on the substrate or the holding surface due to the rotation of the holding table, which may cause wear of the probe tip. Therefore, an insulator such as diamond or sapphire that is not easily worn is used as the material of the probe.

ところで、アルミナセラミック層に測定子を接触させた状態で保持テーブルが回転されると、接触部分が共に絶縁体であるため帯電することがある。アルミナセラミック層が研削されＣｕ電極が表出すると、測定子で帯電していた電気（静電気）がＣｕ電極に放電されることで、Ｃｕ電極が破損してしまうおそれがある。   By the way, if the holding table is rotated in a state in which the measuring element is in contact with the alumina ceramic layer, the contact portions may be charged because both of the contact portions are insulators. When the alumina ceramic layer is ground and the Cu electrode is exposed, electricity (static electricity) charged by the probe is discharged to the Cu electrode, which may damage the Cu electrode.

本発明はかかる点に鑑みてなされたものであり、静電気の影響を抑制することができる研削装置を提供することを目的の１つとする。   This invention is made | formed in view of this point, and makes it one of the objectives to provide the grinding device which can suppress the influence of static electricity.

本発明の一態様の研削装置は、板状ワークの下面を保持する保持面を有する保持テーブルと、環状に研削砥石を配設した研削ホイールを回転可能に装着して保持テーブルが保持した板状ワークの上面側から研削する研削手段と、保持面に第１測定子を接触させて第１測定子の高さを認識させ保持面高さを測定する第１の測定手段と、保持テーブルが保持した板状ワークの上面に第２測定子を接触させて第２測定子の高さを認識させ板状ワークの上面高さを測定する第２の測定手段と、第１の測定手段が測定した測定値と第２の測定手段が測定した測定値との差を板状ワークの厚みとして算出する算出手段と、を備え、算出手段が算出した板状ワークの厚みが予め設定した仕上げ厚みになるまで研削する研削装置であって、少なくとも第２の測定手段は、硬質な導通部材で形成される第２測定子と、第２測定子をアースに接続する接続手段とを備え、第２測定子の帯電を防止することを特徴とする。   A grinding apparatus according to one aspect of the present invention is a plate-like shape in which a holding table having a holding surface that holds the lower surface of a plate-like workpiece and a grinding wheel in which a grinding wheel is annularly mounted are rotatably mounted and held by the holding table. The holding table holds the grinding means for grinding from the upper surface side of the workpiece, the first measuring means for contacting the first measuring element with the holding surface to recognize the height of the first measuring element, and measuring the holding surface height. A second measuring unit that contacts the upper surface of the plate-shaped workpiece, recognizes the height of the second measuring unit, and measures the upper surface height of the plate-shaped workpiece, and the first measuring unit measures Calculating means for calculating the difference between the measured value and the measured value measured by the second measuring means as the thickness of the plate-like workpiece, and the thickness of the plate-like workpiece calculated by the calculating means is a preset finish thickness. A grinding device that grinds up to at least a second measurement. Means comprise a second measuring element which is formed by the rigid conductive member, and a connecting means for connecting the second measuring element to the ground, characterized in that to prevent the charging of the second measuring element.

この構成によれば、板状ワークの上面に接触する第２測定子が導通部材で形成され、当該第２測定子がアースに接続される。このため、研削加工中に第２測定子が板状ワーク上で擦れて静電気が発生しても、当該静電気を接続手段を介してアースに逃がすことが可能である。この結果、第２測定子が帯電することを防止することができる。したがって、静電気の影響を抑制することができる。   According to this structure, the 2nd measuring element which contacts the upper surface of a plate-shaped workpiece is formed with a conduction member, and the said 2nd measuring element is connected to earth | ground. For this reason, even if the second measuring element is rubbed on the plate-like workpiece during the grinding process, static electricity can be released to the ground via the connecting means. As a result, the second probe can be prevented from being charged. Therefore, the influence of static electricity can be suppressed.

また、本発明の一態様の上記研削装置において、板状ワークは、基板に形成される電極を含む配線層と、配線層を覆う絶縁層とで形成され、少なくとも第２の測定手段の第２測定子の帯電を防止させつつ研削砥石で絶縁層を研削して電極を板状ワークの上面に露出させる。   In the grinding device of one embodiment of the present invention, the plate-like workpiece is formed of a wiring layer including an electrode formed on the substrate and an insulating layer covering the wiring layer, and at least a second of the second measuring unit. The electrode is exposed on the upper surface of the plate-like workpiece by grinding the insulating layer with a grinding wheel while preventing charging of the probe.

本発明によれば、静電気の影響を抑制することができる。   According to the present invention, the influence of static electricity can be suppressed.

本実施の形態の係る研削装置の斜視図である。It is a perspective view of the grinding device concerning this embodiment. 本実施の形態に係る研削装置で板状ワークを研削する際（研削工程）の模式図である。It is a schematic diagram at the time of grinding a plate-shaped workpiece with the grinding apparatus according to the present embodiment (grinding step).

以下、添付図面を参照して、本実施の形態に係る研削装置の概略構成について説明する。図１は、本実施の形態の係る研削装置の斜視図である。また、研削装置は、図１に示すように研削加工専用の装置構成に限定されず、例えば、研削加工、研磨加工、洗浄加工等の一連の加工が全自動で実施されるフルオートタイプの加工装置に組み込まれてもよい。   Hereinafter, a schematic configuration of a grinding apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a grinding apparatus according to the present embodiment. Further, the grinding apparatus is not limited to the apparatus configuration dedicated to the grinding process as shown in FIG. 1, for example, a fully automatic type process in which a series of processes such as a grinding process, a polishing process, and a cleaning process are performed automatically. It may be incorporated into the device.

図１に示すように、研削装置１は、多数の研削砥石４７を円環状に配置した研削ホイール４６を用いて、保持テーブル２０に保持された板状ワークＷを研削するように構成されている。板状ワークＷは、保護テープ（不図示）が貼着された状態で研削装置１に搬入され、保持テーブル２０に保持される。板状ワークＷは、研削対象となる板状部材であればよく、シリコン、ガリウム砒素等の半導体ウエーハでもよいし、セラミック、ガラス、サファイア等の光デバイスウエーハでもよいし、デバイスパターン形成前のアズスライスウエーハでもよい。なお、本実施の形態では、後述するように、板状ワークＷとして、アルチック基板（アルミナチタンカーバイド（ＡｌＴｉＣ）基板）を例に挙げて説明する。   As shown in FIG. 1, the grinding apparatus 1 is configured to grind a plate-like workpiece W held on a holding table 20 using a grinding wheel 46 in which a large number of grinding wheels 47 are arranged in an annular shape. . The plate-like workpiece W is carried into the grinding apparatus 1 with a protective tape (not shown) attached thereto and held on the holding table 20. The plate-like workpiece W may be a plate-like member to be ground, and may be a semiconductor wafer such as silicon or gallium arsenide, an optical device wafer such as ceramic, glass, or sapphire, or an as-prepared device pattern. A slice wafer may be used. In the present embodiment, as will be described later, the plate-like workpiece W will be described by taking an Altic substrate (alumina titanium carbide (AlTiC) substrate) as an example.

研削装置１の基台１０の上面には、Ｘ軸方向に延在する矩形状の開口が形成され、この開口は保持テーブル２０と共に移動可能な移動板１１及び蛇腹状の防水カバー１２に覆われている。防水カバー１２の下方には、保持テーブル２０をＸ軸方向に移動させるボールねじ式の進退手段（不図示）が設けられている。保持テーブル２０は、テーブル回転手段に連結されており、テーブル回転手段の駆動によって板状ワークＷの中心を軸に回転可能に構成されている。   A rectangular opening extending in the X-axis direction is formed on the upper surface of the base 10 of the grinding apparatus 1, and this opening is covered with a movable plate 11 and a bellows-shaped waterproof cover 12 that can move together with the holding table 20. ing. Below the waterproof cover 12, ball screw type advance / retreat means (not shown) for moving the holding table 20 in the X-axis direction is provided. The holding table 20 is connected to table rotating means, and is configured to be rotatable about the center of the plate-like workpiece W by driving the table rotating means.

保持テーブル２０は、アルミナセラミックで形成される枠体２１にポーラス板（不図示）をはめ込んで構成される。保持テーブル２０の上面には、板状ワークＷを吸引保持する保持面２１ａが形成される。保持面２１ａには、図示しない吸引源が接続される。保持テーブル２０は、保持面２１ａに生じる負圧によって板状ワークＷを保持面２１ａ上に吸引保持することが可能である。   The holding table 20 is configured by fitting a porous plate (not shown) to a frame body 21 made of alumina ceramic. A holding surface 21 a that sucks and holds the plate-like workpiece W is formed on the upper surface of the holding table 20. A suction source (not shown) is connected to the holding surface 21a. The holding table 20 can suck and hold the plate-like workpiece W on the holding surface 21a by the negative pressure generated on the holding surface 21a.

基台１０上のコラム１５には、研削手段４０を保持テーブル２０に対して接近及び離反させる方向（Ｚ軸方向）に研削送りする研削送り手段３０が設けられている。研削送り手段３０は、コラム１５に配置されたＺ軸方向に平行な一対のガイドレール３１と、一対のガイドレール３１にスライド可能に設置されたモータ駆動のＺ軸テーブル３２とを有している。Ｚ軸テーブル３２の背面側には図示しないナット部が形成され、これらナット部にボールネジ３３が螺合されている。ボールネジ３３の一端部に連結された駆動モータ３４によりボールネジ３３が回転駆動されることで、研削手段４０がガイドレール３１に沿ってＺ軸方向に移動される。   The column 15 on the base 10 is provided with a grinding feed means 30 that feeds the grinding means 40 in a direction (Z-axis direction) to approach and separate the holding table 20. The grinding feed means 30 has a pair of guide rails 31 arranged in the column 15 and parallel to the Z-axis direction, and a motor-driven Z-axis table 32 slidably installed on the pair of guide rails 31. . Nut portions (not shown) are formed on the back side of the Z-axis table 32, and a ball screw 33 is screwed to these nut portions. The ball screw 33 is rotationally driven by a drive motor 34 connected to one end of the ball screw 33, so that the grinding means 40 is moved along the guide rail 31 in the Z-axis direction.

研削手段４０は、ハウジング４１を介してＺ軸テーブル３２の前面に取り付けられており、スピンドルユニット４２で研削ホイール４６を中心軸回りに回転させるように構成されている。スピンドルユニット４２は、いわゆるエアスピンドルであり、ケーシングの内側で高圧エアを介してスピンドル軸４４を回転可能に支持している。   The grinding means 40 is attached to the front surface of the Z-axis table 32 via a housing 41, and is configured to rotate the grinding wheel 46 about the central axis by the spindle unit 42. The spindle unit 42 is a so-called air spindle, and rotatably supports the spindle shaft 44 via high-pressure air inside the casing.

スピンドル軸４４の先端にはマウント４５が連結されており、マウント４５には研削砥石４７を環状に備えた研削ホイール４６が装着されている。研削砥石４７は、例えば、所定砥粒径のダイヤモンド砥粒をビトリファイドボンドで結合して構成される。なお、研削砥石４７は、これに限定されず、ダイヤモンド砥粒をメタルボンドやレジンボンド等の結合剤で固めて形成してもよい。   A mount 45 is connected to the tip of the spindle shaft 44, and a grinding wheel 46 having an annular grinding wheel 47 is attached to the mount 45. The grinding wheel 47 is constituted by, for example, combining diamond abrasive grains having a predetermined abrasive grain diameter with vitrified bonds. The grinding wheel 47 is not limited to this, and diamond abrasive grains may be formed by solidifying with a binder such as metal bond or resin bond.

また、研削装置１には、装置各部を統括制御する制御手段（不図示）が設けられている。制御手段は、各種処理を実行するプロセッサやメモリ等により構成される。メモリは、用途に応じてＲＯＭ（Read Only Memory）、ＲＡＭ（Random Access Memory）等の一つ又は複数の記憶媒体で構成される。制御手段は、例えば、研削手段４０の研削送り量、研削送り速度等（その他、例えば研削ホイールの回転速度）を制御する。   Further, the grinding apparatus 1 is provided with a control means (not shown) for comprehensively controlling each part of the apparatus. The control means includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. The control means controls, for example, the grinding feed amount, grinding feed speed, etc. of the grinding means 40 (others, for example, the rotational speed of the grinding wheel).

保持テーブル２０の側方には、基台１０の上面から立ち上がる立設部５０が設けられている。立設部５０には、保持テーブル２０の保持面高さを測定する第１の測定手段５１と、板状ワークＷの上面高さを測定する第２の測定手段５２とが設けられている。第１の測定手段５１及び第２の測定手段５２は、共に接触式のハイトゲージであり、それぞれ立設部５０から保持テーブル２０の上方（Ｙ軸方向）に延在するアーム５３、５４の先端に第１測定子５５、第２測定子５６を取り付けて構成される。   On the side of the holding table 20, a standing portion 50 that rises from the upper surface of the base 10 is provided. The standing portion 50 is provided with first measuring means 51 for measuring the holding surface height of the holding table 20 and second measuring means 52 for measuring the upper surface height of the plate-like workpiece W. The first measuring means 51 and the second measuring means 52 are both contact-type height gauges, and are respectively attached to the tips of arms 53 and 54 that extend from the standing portion 50 to above the holding table 20 (in the Y-axis direction). The first measuring element 55 and the second measuring element 56 are attached.

第１測定子５５及び第２測定子５６は、例えばタングステン（Ｗ）や炭化チタン（ＴｉＣ）等の比較的硬質な導通部材で形成され、アーム５３、５４の先端から下方に向かって延在している。なお、第１測定子５５及び第２測定子５６の材質は、これに限定されず、導電性を有する材質であれば、どのような材質であってもよい。詳細は後述するが、第１の測定手段５１は、保持面２１ａに第１測定子５５を接触させて第１測定子の高さを認識し、保持面高さを測定する。第２の測定手段５２は、保持テーブル２０が保持した板状ワークＷの上面に第２測定子５６を接触させて第２測定子５６の高さを認識し、板状ワークＷの上面高さを測定する。保持面高さ及び板状ワークＷの上面高さの測定値は、制御手段（後述する算出手段５７）に出力される。   The first measuring element 55 and the second measuring element 56 are formed of a relatively hard conductive member such as tungsten (W) or titanium carbide (TiC), and extend downward from the tips of the arms 53 and 54. ing. In addition, the material of the 1st measuring element 55 and the 2nd measuring element 56 is not limited to this, What kind of material may be sufficient if it is a material which has electroconductivity. Although the details will be described later, the first measuring means 51 recognizes the height of the first measuring element by bringing the first measuring element 55 into contact with the holding surface 21a and measures the holding surface height. The second measuring means 52 recognizes the height of the second measuring element 56 by bringing the second measuring element 56 into contact with the upper surface of the plate-like workpiece W held by the holding table 20, and the upper surface height of the plate-like workpiece W. Measure. The measured values of the holding surface height and the upper surface height of the plate-like workpiece W are output to the control means (calculation means 57 described later).

また、制御手段には、上記測定値に基づいて板状ワークＷの厚みを算出する算出手段５７が設けられている。算出手段５７は、第１の測定手段５１が測定した保持面高さと、第２の測定手段５２が測定した板状ワークＷの上面高さとの差を板状ワークＷの厚みとして算出する。研削装置１は、研削加工中、常時板状ワークＷの厚みを算出し、当該厚みが予め設定した仕上げ厚みになるまで研削手段４０の研削送り量を制御して研削を実施する。   Further, the control means is provided with a calculation means 57 for calculating the thickness of the plate-like workpiece W based on the measured value. The calculating unit 57 calculates the difference between the holding surface height measured by the first measuring unit 51 and the upper surface height of the plate-like workpiece W measured by the second measuring unit 52 as the thickness of the plate-like workpiece W. During the grinding process, the grinding apparatus 1 always calculates the thickness of the plate-like workpiece W, and performs grinding by controlling the grinding feed amount of the grinding means 40 until the thickness reaches a preset finish thickness.

次に、図２を参照して、本実施の形態に係る研削装置の詳細構成及び動作について説明する。図２は、本実施の形態に係る研削装置で板状ワークを研削する際（研削工程）の模式図である。図２Ａは研削前の状態を示し、図２Ｂは研削中の状態を示している。   Next, a detailed configuration and operation of the grinding apparatus according to the present embodiment will be described with reference to FIG. FIG. 2 is a schematic view when a plate-like workpiece is ground (grinding step) by the grinding apparatus according to the present embodiment. FIG. 2A shows a state before grinding, and FIG. 2B shows a state during grinding.

ハードディスクドライブ（ＨＤＤ）等の記憶媒体の読み書きを実現する薄膜磁気ヘッドは、例えばアルチック基板の表面に磁気回路を形成した板状ワークを個々のチップに分割して形成される。具体的に板状ワークＷは、図２に示すように、基板Ｗ１の表面に電極Ｌ１を含む配線層を形成し、当該電極Ｌ１（配線層）を絶縁層Ｌ２で覆って構成される。   A thin film magnetic head that realizes reading and writing of a storage medium such as a hard disk drive (HDD) is formed, for example, by dividing a plate-like work in which a magnetic circuit is formed on the surface of an AlTiC substrate into individual chips. Specifically, as shown in FIG. 2, the plate-like workpiece W is formed by forming a wiring layer including the electrode L1 on the surface of the substrate W1, and covering the electrode L1 (wiring layer) with an insulating layer L2.

基板Ｗ１は、上記したようにアルチック基板（アルミナチタンカーバイド（ＡｌＴｉＣ）基板）で構成される。電極Ｌ１は例えばＣｕ電極で構成され、当該電極Ｌ１によって基板Ｗ１上に所定の回路が形成される。なお、電極Ｌ１は、Ｃｕ（銅）に限らず、Ｃｒ（クロム）やＴａ（タンタル）等、導電性を有する材質であれば、どのような材質で形成されてもよい。絶縁層Ｌ２は、アルミナセラミック（Ａｌ２Ｏ３）等の絶縁体で形成される。なお、絶縁層Ｌ２は、アルミナセラミックに限らず、単結晶窒化アルミニウム（ＡｌＮ）や二酸化ケイ素（ＳｉＯ２）等で形成されてもよい。 As described above, the substrate W1 is composed of an Altic substrate (alumina titanium carbide (AlTiC) substrate). The electrode L1 is composed of, for example, a Cu electrode, and a predetermined circuit is formed on the substrate W1 by the electrode L1. The electrode L1 is not limited to Cu (copper), and may be formed of any material as long as it has conductivity, such as Cr (chromium) or Ta (tantalum). The insulating layer L2 is formed of an insulator such as alumina ceramic (Al 2 O 3 ). The insulating layer L2 is not limited to alumina ceramic, and may be formed of single crystal aluminum nitride (AlN), silicon dioxide (SiO 2 ), or the like.

ところで、薄膜磁気ヘッドの生産工程においては、板状ワークが仕上げ厚みに至るまで絶縁層が研削される。板状ワークを研削する工程では、板状ワークを保持テーブルに保持させ、板状ワークの上面及び保持テーブルの上面にそれぞれ接触式のハイトゲージを接触させて板状ワークの厚みを測定している。研削中は、保持テーブルが回転することでハイトゲージの測定子先端が板状ワーク又は保持面上で擦れるため、測定子先端が摩耗するおそれがある。このため、従来より、測定子の材質には、摩耗し難いダイアモンドやサファイア等の絶縁体が採用されていた。   By the way, in the production process of the thin film magnetic head, the insulating layer is ground until the plate-like workpiece reaches the finished thickness. In the step of grinding the plate-shaped workpiece, the thickness of the plate-shaped workpiece is measured by holding the plate-shaped workpiece on the holding table and bringing a contact-type height gauge into contact with the upper surface of the plate-shaped workpiece and the upper surface of the holding table. During grinding, as the holding table rotates, the tip of the height gauge probe rubs on the plate-like workpiece or the holding surface, and thus the probe tip may be worn. For this reason, conventionally, insulators such as diamond and sapphire, which are not easily worn, have been employed as the material of the probe.

しかしながら、絶縁層に測定子を接触させた状態で保持テーブルが回転されると、接触部分が共に絶縁体であるため帯電することがある。また、板状ワークが仕上げ厚みまで研削されると電極が表出する。このため、測定子が電極に接触すると、測定子で帯電していた電気（静電気）が電極で放電し、その結果、電極が破損してしまうおそれがあった。   However, when the holding table is rotated in a state where the measuring element is in contact with the insulating layer, the contact portions may be electrically charged because both are insulative. Further, when the plate-like workpiece is ground to the finished thickness, the electrode is exposed. For this reason, when the probe contacts the electrode, electricity (static electricity) charged by the probe is discharged by the electrode, and as a result, the electrode may be damaged.

そこで、本発明者は、電極の静電破壊を防止することを着想した。具体的に本実施の形態では、板状ワークＷの上面（絶縁層Ｌ２）に接触する第２測定子５６を導通部材で形成し、当該第２測定子５６を接続手段５８を介してアース５９に接続する構成とした。これにより、研削加工中に第２測定子５６が板状ワークＷ上で擦れて静電気が発生しても、当該静電気を接続手段５８を介してアース５９に逃がすことが可能である。この結果、第２測定子５６が帯電することを防止することができる。したがって、静電気の影響を抑制して、電極の静電破壊を防止することが可能になった。   Therefore, the present inventor has conceived of preventing electrostatic breakdown of the electrode. Specifically, in the present embodiment, the second measuring element 56 that contacts the upper surface (insulating layer L2) of the plate-like workpiece W is formed of a conductive member, and the second measuring element 56 is grounded 59 through the connecting means 58. It was set as the structure connected to. Thus, even when the second measuring element 56 is rubbed on the plate-like workpiece W during grinding, static electricity can be released to the ground 59 via the connecting means 58. As a result, the second probe 56 can be prevented from being charged. Therefore, it is possible to suppress the influence of static electricity and prevent electrostatic breakdown of the electrode.

以下、具体的な研削工程について説明する。図２Ａに示すように、保持テーブル２０の保持面２１ａには、板状ワークＷが載置される。より具体的に板状ワークＷは、基板Ｗ１側が下側となるように保持面２１ａ上に載置される。板状ワークＷは、保持面２１ａ上に生じる負圧によって吸引保持される。なお、図示はしていないが、保持面２１ａは、保持テーブル２０の回転中心（保持面２１ａの中心）を頂点とし外周が僅かに低く傾斜した傾斜面を有しており、板状ワークＷは、保持面２１ａの形状に倣って緩傾斜の円錐形状となる。   Hereinafter, a specific grinding process will be described. As shown in FIG. 2A, the plate-like workpiece W is placed on the holding surface 21 a of the holding table 20. More specifically, the plate-like workpiece W is placed on the holding surface 21a so that the substrate W1 side is on the lower side. The plate-like workpiece W is sucked and held by the negative pressure generated on the holding surface 21a. Although not shown, the holding surface 21a has an inclined surface whose center is the rotation center of the holding table 20 (center of the holding surface 21a) and whose outer periphery is slightly inclined, and the plate-like workpiece W is Then, a conical shape with a gentle inclination follows the shape of the holding surface 21a.

保持テーブル２０は、研削手段４０の下方に位置付けられる。このとき、保持テーブル２０の回転軸は、研削砥石４７の回転軸から偏心した位置に位置付けられる。更に保持テーブル２０は、研削砥石４７の研削面４７ａと保持面２１ａとが平行となるように、図示しない傾き調整機構によって回転軸の傾きが調整される。   The holding table 20 is positioned below the grinding means 40. At this time, the rotating shaft of the holding table 20 is positioned at a position eccentric from the rotating shaft of the grinding wheel 47. Furthermore, the inclination of the rotation shaft of the holding table 20 is adjusted by an inclination adjusting mechanism (not shown) so that the grinding surface 47a of the grinding wheel 47 and the holding surface 21a are parallel to each other.

そして、保持テーブル２０が回転されると共に、研削手段４０は、スピンドルユニット４２で研削砥石４７を回転させながら、研削送り手段３０（図１参照）によって保持面２１ａに向かって下降（研削送り）される。研削砥石４７の研削面４７ａは、板状ワークＷの中心から外周に至る半径部分に円弧状に接触される。このように、研削手段４０は、研削砥石４７が板状ワークＷの中心を通過し、当該板状ワークＷの中心と外周との半径エリアで板状ワークＷの円弧の被研削部分を研削する。   Then, while the holding table 20 is rotated, the grinding means 40 is lowered (ground feed) toward the holding surface 21a by the grinding feed means 30 (see FIG. 1) while the grinding wheel 47 is rotated by the spindle unit 42. The The grinding surface 47a of the grinding wheel 47 is in arcuate contact with the radius portion from the center of the plate-like workpiece W to the outer periphery. Thus, in the grinding means 40, the grinding wheel 47 passes through the center of the plate-like workpiece W, and the portion to be ground of the arc of the plate-like workpiece W is ground in a radial area between the center and the outer periphery of the plate-like workpiece W. .

また、研削中は、第１測定子５５の先端が保持面２１ａに接触しており、保持面高さが測定されている。一方、第２測定子５６の先端は絶縁層Ｌ２の表面に接触しており、板状ワークＷの上面高さが測定されている。算出手段５７は、第１の測定手段５１及び第２の測定手段５２の測定値を常時取得し、その差に基づいて板状ワークＷの厚みをリアルタイムに算出している。   During grinding, the tip of the first measuring element 55 is in contact with the holding surface 21a, and the holding surface height is measured. On the other hand, the tip of the second probe 56 is in contact with the surface of the insulating layer L2, and the upper surface height of the plate-like workpiece W is measured. The calculation means 57 always acquires the measurement values of the first measurement means 51 and the second measurement means 52, and calculates the thickness of the plate-like workpiece W in real time based on the difference.

上記したように、第２測定子５６が導通部材で形成されると共に接続手段５８を介してアース５９に接続されているため、第２測定子５６と絶縁層Ｌ２との接触部分で静電気が発生しても、当該静電気をアース５９に逃がすことが可能である。これにより、第２測定子５６の帯電が防止されている。   As described above, since the second probe 56 is formed of a conductive member and is connected to the ground 59 through the connection means 58, static electricity is generated at the contact portion between the second probe 56 and the insulating layer L2. Even so, the static electricity can escape to the ground 59. Thereby, the charging of the second probe 56 is prevented.

また、第１測定子５５を第２測定子５６と同じ材質にし、保持テーブル２０（保持面２１ａ）と絶縁層Ｌ２の材質を同じアルミナセラミックにしたことにより、第１測定子５５と第２測定子５６の摩耗傾向（消耗度合い）を近づけることが可能である。よって、板状ワークＷの厚み測定誤差を少なくすることができ、その誤差の補正も最小限に抑えることが可能である。   Further, the first measuring element 55 and the second measuring element 56 are made of the same material, and the holding table 20 (holding surface 21a) and the insulating layer L2 are made of the same alumina ceramic, so that the first measuring element 55 and the second measuring element 55 are made of the same material. It is possible to bring the wear tendency (consumption level) of the child 56 closer. Therefore, the thickness measurement error of the plate-like workpiece W can be reduced, and correction of the error can be minimized.

板状ワークＷは、研削砥石４７と板状ワークＷとを回転接触させながら徐々にＺ軸方向へ研削送りすることで薄化され、リアルタイムに算出される板状ワークＷの厚みが予め設定した仕上げ厚みになったら研削が終了する。具体的には、図２Ｂに示すように、電極Ｌ１が板状ワークＷの上面に露出するまで、研削手段４０の研削送りが継続される。上記したように、第２測定子５６の帯電が防止された状態で板状ワークＷ（絶縁層Ｌ２）が研削されるため、第２測定子５６の先端が電極Ｌ１に接触しても、電極Ｌ１が放電することはない。よって、電極Ｌ１が静電破壊されることもない。   The plate-like workpiece W is thinned by gradually feeding it in the Z-axis direction while rotating the grinding wheel 47 and the plate-like workpiece W, and the thickness of the plate-like workpiece W calculated in real time is preset. Grinding ends when the finished thickness is reached. Specifically, as shown in FIG. 2B, the grinding feed of the grinding means 40 is continued until the electrode L1 is exposed on the upper surface of the plate-like workpiece W. As described above, since the plate-like workpiece W (insulating layer L2) is ground in a state in which the charging of the second probe 56 is prevented, the electrode is not affected even if the tip of the second probe 56 contacts the electrode L1. L1 is not discharged. Therefore, the electrode L1 is not electrostatically broken.

以上説明したように、本実施の形態によれば、基板Ｗ１の上面に電極Ｌ１が形成され、当該電極Ｌ１が絶縁層Ｌ２で覆われる板状ワークＷを研削する研削装置１において、絶縁層Ｌ２に接触する第２測定子５６を導通部材で形成し、当該第２測定子５６をアース５９に接続している。これにより、研削加工中に第２測定子５６の帯電を防止しつつも、板状ワークＷの厚みをリアルタイムに算出しながら適切に研削加工を実施することが可能である。特に、板状ワークＷが所望の厚みまで研削され、電極Ｌ１が表出して第２測定子５６が電極Ｌ１に接触しても、第２測定子５６の帯電が防止されていることで、電極Ｌ１が放電することなく、電極Ｌ１の静電破壊を防止することが可能である。   As described above, according to the present embodiment, in the grinding apparatus 1 for grinding the plate-like workpiece W in which the electrode L1 is formed on the upper surface of the substrate W1 and the electrode L1 is covered with the insulating layer L2, the insulating layer L2 A second measuring element 56 that contacts the first electrode 56 is formed of a conductive member, and the second measuring element 56 is connected to the ground 59. Accordingly, it is possible to appropriately perform the grinding process while calculating the thickness of the plate-like workpiece W in real time while preventing the second measuring element 56 from being charged during the grinding process. In particular, even if the plate-like workpiece W is ground to a desired thickness, the electrode L1 is exposed, and the second probe 56 contacts the electrode L1, the second probe 56 is prevented from being charged. It is possible to prevent electrostatic breakdown of the electrode L1 without discharging L1.

なお、本実施の形態では、第１測定子５５を第２測定子５６と同じ材質にし、保持テーブル２０（保持面２１ａ）と絶縁層Ｌ２の材質を同じアルミナセラミックにする構成としたが、この構成に限定されない。第１測定子５５は、第２測定子５６と異なる材質であってもよく、保持テーブル２０は、絶縁層Ｌ２と異なる材質であってもよい。   In the present embodiment, the first measuring element 55 is made of the same material as the second measuring element 56, and the holding table 20 (holding surface 21a) and the insulating layer L2 are made of the same alumina ceramic. It is not limited to the configuration. The first measuring element 55 may be made of a material different from that of the second measuring element 56, and the holding table 20 may be made of a material different from that of the insulating layer L2.

また、本実施の形態において、接続手段５８は、第２測定子５６をアース５９に接続する構成であれば、どのように構成されてもよく、例えば、単なる配線であってもよい。   In the present embodiment, the connection means 58 may be configured in any way as long as the second measuring element 56 is connected to the ground 59, and may be a simple wiring, for example.

また、本実施の形態及び変形例を説明したが、本発明の他の実施の形態として、上記実施の形態及び変形例を全体的又は部分的に組み合わせたものでもよい。   Moreover, although this Embodiment and the modified example were demonstrated, what combined the said embodiment and modified example entirely or partially as another embodiment of this invention may be sufficient.

また、本発明の実施の形態は上記の実施の形態に限定されるものではなく、本発明の技術的思想の趣旨を逸脱しない範囲において様々に変更、置換、変形されてもよい。さらには、技術の進歩又は派生する別技術によって、本発明の技術的思想を別の仕方で実現することができれば、その方法を用いて実施されてもよい。したがって、特許請求の範囲は、本発明の技術的思想の範囲内に含まれ得る全ての実施形態をカバーしている。   The embodiments of the present invention are not limited to the above-described embodiments, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

以上説明したように、本発明は、静電気の影響を抑制することができるという効果を有し、特に、板状ワークの絶縁層を研削する研削装置に有用である。   As described above, the present invention has an effect of suppressing the influence of static electricity, and is particularly useful for a grinding apparatus for grinding an insulating layer of a plate-like workpiece.

２０ 保持テーブル
２１ａ 保持面
４０ 研削手段
４６ 研削ホイール
４７ 研削砥石
５１ 第１の測定手段
５２ 第２の測定手段
５５ 第１測定子
５６ 第２測定子
５７ 算出手段
５８ 接続手段
５９ アース
Ｗ 板状ワーク
Ｗ１ 基板
Ｌ１ 電極
Ｌ２ 絶縁層 20 holding table 21a holding surface 40 grinding means 46 grinding wheel 47 grinding wheel 51 first measuring means 52 second measuring means 55 first measuring element 56 second measuring element 57 calculating means 58 connecting means 59 ground W plate-like work W1 Substrate L1 Electrode L2 Insulating layer

Claims (2)

板状ワークの下面を保持する保持面を有する保持テーブルと、環状に研削砥石を配設した研削ホイールを回転可能に装着して該保持テーブルが保持した板状ワークの上面側から研削する研削手段と、該保持面に第１測定子を接触させて該第１測定子の高さを認識させ該保持面高さを測定する第１の測定手段と、該保持テーブルが保持した板状ワークの上面に第２測定子を接触させて該第２測定子の高さを認識させ板状ワークの上面高さを測定する第２の測定手段と、該第１の測定手段が測定した測定値と該第２の測定手段が測定した測定値との差を板状ワークの厚みとして算出する算出手段と、を備え、該算出手段が算出した板状ワークの厚みが予め設定した仕上げ厚みになるまで研削する研削装置であって、
少なくとも該第２の測定手段は、硬質な導通部材で形成される該第２測定子と、該第２測定子をアースに接続する接続手段とを備え、該第２測定子の帯電を防止することを特徴とする研削装置。 Grinding means for grinding from the upper surface side of the plate-like workpiece held by the holding table having a holding surface for holding the lower surface of the plate-like workpiece and a grinding wheel in which a grinding wheel is arranged in an annular shape is rotatably mounted First measuring means for contacting the first measuring element to the holding surface to recognize the height of the first measuring element and measuring the holding surface height; and a plate-like workpiece held by the holding table. A second measuring means for contacting the upper surface with the second measuring element to recognize the height of the second measuring element and measuring the upper surface height of the plate-like workpiece; and a measurement value measured by the first measuring means; Calculating means for calculating a difference from the measured value measured by the second measuring means as the thickness of the plate-like workpiece, until the thickness of the plate-like workpiece calculated by the calculating means reaches a preset finish thickness A grinding device for grinding,
At least the second measuring means includes the second measuring element formed of a hard conductive member and connecting means for connecting the second measuring element to the ground, and prevents the second measuring element from being charged. A grinding apparatus characterized by that. 該板状ワークは、基板に形成される電極を含む配線層と、該配線層を覆う絶縁層とで形成され、該少なくとも第２の測定手段の該第２測定子の帯電を防止させつつ該研削砥石で該絶縁層を研削して該電極を板状ワークの上面に露出させる請求項１記載の研削装置。   The plate-like workpiece is formed of a wiring layer including an electrode formed on a substrate and an insulating layer covering the wiring layer, and prevents the at least second measuring element of the second measuring unit from being charged. The grinding apparatus according to claim 1, wherein the insulating layer is ground with a grinding wheel to expose the electrode on the upper surface of the plate-like workpiece.
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JP2021032800A (en) * 2019-08-28 2021-03-01 株式会社ディスコ Height gage
CN112440170A (en) * 2019-08-28 2021-03-05 株式会社迪思科 Altimeter

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