JP2018056360A - 発光装置及びその製造方法 - Google Patents
発光装置及びその製造方法 Download PDFInfo
- Publication number
- JP2018056360A JP2018056360A JP2016191474A JP2016191474A JP2018056360A JP 2018056360 A JP2018056360 A JP 2018056360A JP 2016191474 A JP2016191474 A JP 2016191474A JP 2016191474 A JP2016191474 A JP 2016191474A JP 2018056360 A JP2018056360 A JP 2018056360A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- phosphor
- transparent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 88
- 239000011347 resin Substances 0.000 claims abstract description 88
- 239000000758 substrate Substances 0.000 claims abstract description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 49
- 239000003086 colorant Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
Description
前記複数の発光素子及び前記透明樹脂上に蛍光体含有樹脂層を形成する工程と、を含む、発光装置の製造方法。
(発光素子の構成)
図1(a)は、実施の形態に係る発光装置1の垂直断面図である。図1(b)は、図1(a)を部分的に拡大した図である。
図3(a)〜(d)は、実施の形態に係る発光装置1の製造工程を示す垂直断面図である。
上記実施の形態によれば、発光素子間の隙間に蛍光体を含まない透明樹脂を埋め込むことにより、複数の発光素子が高密度に配置される場合であっても色むらが少ない発光装置を得ることができる。
10 基板
11 発光素子
15 透明樹脂
16 蛍光体含有樹脂層
16a 第1の領域
16b 第2の領域
Claims (10)
- 基板と、
前記基板上に設置された複数の発光素子と、
前記複数の発光素子の隙間に埋め込まれた透明樹脂と、
前記複数の発光素子及び前記透明樹脂上に形成された蛍光体含有樹脂層と、
を有する、発光装置。 - 前記蛍光体含有樹脂層が、蛍光色の異なる複数種の領域を有する、
請求項1に記載の発光装置。 - 前記蛍光体含有樹脂層が、蛍光色の異なる第1の領域と第2の領域を有し、
前記第1の領域と前記第2の領域が市松模様を構成するように分布している、
請求項2に記載の発光装置。 - 前記蛍光体含有樹脂層の前記蛍光色の異なる複数種の領域の境界が前記透明樹脂上に位置する、
請求項2又は3に記載の発光装置。 - 前記透明樹脂の最上部の位置が前記複数の発光素子の上面よりも高い、
請求項4に記載の発光装置。 - 基板上に設置された複数の発光素子の隙間に透明樹脂を埋め込む工程と、
前記複数の発光素子及び前記透明樹脂上に蛍光体含有樹脂層を形成する工程と、
を含む、発光装置の製造方法。 - 前記蛍光体含有樹脂層が、蛍光色の異なる複数種の領域を有する、
請求項6に記載の発光装置の製造方法。 - 前記蛍光色の異なる複数種の領域の境界が前記透明樹脂上に位置するように前記蛍光体含有樹脂層を形成する、
請求項7に記載の発光装置の製造方法。 - 最上部の位置が前記複数の発光素子の上面よりも高くなるように前記透明樹脂を形成する、
請求項8に記載の発光装置の製造方法。 - 前記透明樹脂及び前記蛍光体含有樹脂層をスクリーン印刷により形成する、
請求項6〜9のいずれか1項に記載された発光装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016191474A JP6652025B2 (ja) | 2016-09-29 | 2016-09-29 | 発光装置及びその製造方法 |
US15/648,815 US10468390B2 (en) | 2016-09-29 | 2017-07-13 | Light emitting device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016191474A JP6652025B2 (ja) | 2016-09-29 | 2016-09-29 | 発光装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018056360A true JP2018056360A (ja) | 2018-04-05 |
JP6652025B2 JP6652025B2 (ja) | 2020-02-19 |
Family
ID=61686734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016191474A Active JP6652025B2 (ja) | 2016-09-29 | 2016-09-29 | 発光装置及びその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10468390B2 (ja) |
JP (1) | JP6652025B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020027814A (ja) * | 2018-08-09 | 2020-02-20 | シチズン時計株式会社 | Led発光装置 |
KR20200108209A (ko) * | 2019-03-08 | 2020-09-17 | 주식회사 유제이엘 | 복수 색상 형광체 플레이트, 이를 포함하는 칩 스케일 발광 다이오드 패키지 및 이의 제조방법 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6652025B2 (ja) * | 2016-09-29 | 2020-02-19 | 豊田合成株式会社 | 発光装置及びその製造方法 |
US11631715B2 (en) | 2021-03-11 | 2023-04-18 | Lumileds Llc | Monolithic multi-color matrix emitter with patterned phosphor layer |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005109434A (ja) * | 2003-09-11 | 2005-04-21 | Nichia Chem Ind Ltd | 半導体装置およびその製造方法 |
JP2010267851A (ja) * | 2009-05-15 | 2010-11-25 | Koito Mfg Co Ltd | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
JP2013065726A (ja) * | 2011-09-16 | 2013-04-11 | Toshiba Corp | 半導体発光装置及びその製造方法 |
JP2013098458A (ja) * | 2011-11-04 | 2013-05-20 | Mitsubishi Chemicals Corp | 半導体発光装置及びこれを用いた照明器具 |
JP2015512559A (ja) * | 2012-03-19 | 2015-04-27 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス半導体チップおよび当該半導体チップを備えたヘッドライト |
JP2015138838A (ja) * | 2014-01-21 | 2015-07-30 | 豊田合成株式会社 | 発光装置及びその製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4289027B2 (ja) * | 2002-07-25 | 2009-07-01 | 豊田合成株式会社 | 発光装置 |
JP2008186777A (ja) * | 2007-01-31 | 2008-08-14 | Seiko Instruments Inc | 照明装置及びこれを備える表示装置 |
JP5158472B2 (ja) * | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
JP2010055947A (ja) * | 2008-08-28 | 2010-03-11 | Canon Inc | カラー画像表示装置用のフェイスパネル、該フェイスパネルを用いたカラー画像表示装置用のパネル、および、該パネルが搭載されたカラー画像表示装置 |
JP5178623B2 (ja) | 2009-05-08 | 2013-04-10 | サンユレック株式会社 | 照明装置の製造方法 |
JP2012199218A (ja) | 2010-09-09 | 2012-10-18 | Mitsubishi Chemicals Corp | 発光装置、照明システム及び照明方法 |
JP5553722B2 (ja) * | 2010-10-15 | 2014-07-16 | スタンレー電気株式会社 | 発光装置 |
JP5554680B2 (ja) * | 2010-10-15 | 2014-07-23 | スタンレー電気株式会社 | 発光素子搭載用基板、発光装置およびこれらの製造方法 |
US8967818B2 (en) * | 2011-06-20 | 2015-03-03 | Nec Corporation | Fluorescent screen and image display device provided with same |
US20130187540A1 (en) * | 2012-01-24 | 2013-07-25 | Michael A. Tischler | Discrete phosphor chips for light-emitting devices and related methods |
JP5895597B2 (ja) | 2012-02-29 | 2016-03-30 | 日亜化学工業株式会社 | 発光装置 |
JP5776599B2 (ja) * | 2012-03-26 | 2015-09-09 | 東芝ライテック株式会社 | 発光モジュール及び照明装置 |
JP2013201355A (ja) * | 2012-03-26 | 2013-10-03 | Toshiba Lighting & Technology Corp | 発光モジュール及び照明装置 |
JP6139976B2 (ja) | 2013-05-21 | 2017-05-31 | シチズン電子株式会社 | Led発光装置 |
JP2015207754A (ja) * | 2013-12-13 | 2015-11-19 | 日亜化学工業株式会社 | 発光装置 |
JP6152801B2 (ja) * | 2014-01-21 | 2017-06-28 | 豊田合成株式会社 | 発光装置及びその製造方法 |
KR102223421B1 (ko) * | 2014-08-05 | 2021-03-08 | 삼성디스플레이 주식회사 | 표시장치 |
JP2016062980A (ja) * | 2014-09-16 | 2016-04-25 | 株式会社東芝 | 半導体発光装置 |
TWI657597B (zh) * | 2015-03-18 | 2019-04-21 | 新世紀光電股份有限公司 | 側照式發光二極體結構及其製造方法 |
JP2017112295A (ja) * | 2015-12-18 | 2017-06-22 | 豊田合成株式会社 | 発光装置およびその製造方法 |
JP2017130633A (ja) * | 2016-01-22 | 2017-07-27 | 豊田合成株式会社 | 発光装置 |
JP6652025B2 (ja) * | 2016-09-29 | 2020-02-19 | 豊田合成株式会社 | 発光装置及びその製造方法 |
JP6783985B2 (ja) * | 2016-09-29 | 2020-11-11 | 豊田合成株式会社 | 発光装置 |
-
2016
- 2016-09-29 JP JP2016191474A patent/JP6652025B2/ja active Active
-
2017
- 2017-07-13 US US15/648,815 patent/US10468390B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005109434A (ja) * | 2003-09-11 | 2005-04-21 | Nichia Chem Ind Ltd | 半導体装置およびその製造方法 |
JP2010267851A (ja) * | 2009-05-15 | 2010-11-25 | Koito Mfg Co Ltd | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
JP2013065726A (ja) * | 2011-09-16 | 2013-04-11 | Toshiba Corp | 半導体発光装置及びその製造方法 |
JP2013098458A (ja) * | 2011-11-04 | 2013-05-20 | Mitsubishi Chemicals Corp | 半導体発光装置及びこれを用いた照明器具 |
JP2015512559A (ja) * | 2012-03-19 | 2015-04-27 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス半導体チップおよび当該半導体チップを備えたヘッドライト |
JP2015138838A (ja) * | 2014-01-21 | 2015-07-30 | 豊田合成株式会社 | 発光装置及びその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020027814A (ja) * | 2018-08-09 | 2020-02-20 | シチズン時計株式会社 | Led発光装置 |
JP7178820B2 (ja) | 2018-08-09 | 2022-11-28 | シチズン時計株式会社 | Led発光装置 |
KR20200108209A (ko) * | 2019-03-08 | 2020-09-17 | 주식회사 유제이엘 | 복수 색상 형광체 플레이트, 이를 포함하는 칩 스케일 발광 다이오드 패키지 및 이의 제조방법 |
KR102168701B1 (ko) * | 2019-03-08 | 2020-10-22 | 주식회사 유제이엘 | 복수 색상 형광체 플레이트, 이를 포함하는 칩 스케일 발광 다이오드 패키지 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP6652025B2 (ja) | 2020-02-19 |
US10468390B2 (en) | 2019-11-05 |
US20180090470A1 (en) | 2018-03-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10141491B2 (en) | Method of manufacturing light emitting device | |
JP6187277B2 (ja) | 発光装置及びその製造方法 | |
JP6331389B2 (ja) | 発光装置 | |
US9305903B2 (en) | Light-emitting device and method of manufacturing the same | |
JPWO2005106978A1 (ja) | 発光装置およびその製造方法 | |
US8287148B2 (en) | Light emitting module | |
JP6769248B2 (ja) | 発光装置 | |
JP6673410B2 (ja) | Ledモジュール | |
JP6652025B2 (ja) | 発光装置及びその製造方法 | |
JP2014138185A (ja) | 発光装置及びその製造方法 | |
JP6959548B2 (ja) | 発光装置およびその製造方法 | |
JP2017174909A (ja) | 発光素子の製造方法、及び発光装置の製造方法 | |
JP2005327786A (ja) | 発光ダイオード素子の製造方法 | |
JP6797314B2 (ja) | Led照明用実装基板を有する照明装置 | |
JP2014067774A (ja) | 波長変換部材及び波長変換部材を用いた半導体発光装置 | |
JP2016119381A (ja) | Led発光モジュール | |
JP2008270314A (ja) | 発光装置及び発光装置の製造方法 | |
CN106887507B (zh) | 发光装置及其制造方法 | |
JP2020053642A (ja) | 発光装置の製造方法 | |
JP2017076673A (ja) | 発光装置の製造方法 | |
JP7285439B2 (ja) | 面状光源 | |
JP2014086696A (ja) | 発光装置 | |
JP2020107837A (ja) | 発光装置とその製造方法 | |
JP2018022859A (ja) | 発光装置及びその製造方法 | |
JP2006059851A (ja) | 半導体発光装置、それを用いた照明装置およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181029 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190830 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190910 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191029 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20191029 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191224 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200106 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6652025 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |