JP2018039688A - Glass substrate for micro channel device - Google Patents
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- JP2018039688A JP2018039688A JP2016173588A JP2016173588A JP2018039688A JP 2018039688 A JP2018039688 A JP 2018039688A JP 2016173588 A JP2016173588 A JP 2016173588A JP 2016173588 A JP2016173588 A JP 2016173588A JP 2018039688 A JP2018039688 A JP 2018039688A
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- 239000011521 glass Substances 0.000 title claims abstract description 124
- 239000000758 substrate Substances 0.000 title claims abstract description 112
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 230000003746 surface roughness Effects 0.000 claims description 8
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 5
- 239000007791 liquid phase Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 18
- 230000007423 decrease Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000006059 cover glass Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 229910006404 SnO 2 Inorganic materials 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000007500 overflow downdraw method Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229910018068 Li 2 O Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000004031 devitrification Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000006060 molten glass Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000004017 vitrification Methods 0.000 description 3
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000006025 fining agent Substances 0.000 description 2
- 239000000156 glass melt Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000010583 slow cooling Methods 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000009774 resonance method Methods 0.000 description 1
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- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明は、マイクロ流路デバイス用ガラス基板に関する。 The present invention relates to a glass substrate for a microchannel device.
マイクロ流路デバイスは、反応、分離、精製、検出など様々な化学操作を極微量試料の取扱いで行うことができるデバイスである。バイオや化学分析がマイクロスケール化されるため、環境負荷、時間、コストの低減や高い反応効率、省スペース化が可能になるなど、医療、バイオ分野において様々な応用が期待されている。マイクロ流路デバイスは、流路が形成された基板とそれをカバーする基板とを接合することにより作製される。マイクロ流路デバイス用基板として、石英ガラスの使用が検討されている。（例えば特許文献１参照） The microchannel device is a device that can perform various chemical operations such as reaction, separation, purification, and detection by handling a very small amount of sample. Since bio and chemical analyzes are microscaled, various applications are expected in the medical and bio fields such as reduction of environmental load, time and cost, high reaction efficiency, and space saving. The microchannel device is manufactured by bonding a substrate on which a channel is formed and a substrate that covers the substrate. The use of quartz glass has been studied as a substrate for microchannel devices. (For example, see Patent Document 1)
しかしながら、石英ガラスは軟化点が高いため、石英ガラス同士を高温で接合する必要があり、作製時間が長く、コストが高いという問題があった。 However, since quartz glass has a high softening point, it is necessary to join the quartz glasses at a high temperature, and there is a problem that the production time is long and the cost is high.
本発明はこのような状況に鑑みてなされたものであり、マイクロ流路デバイスの作製時間を短縮し、低コスト化が可能なマイクロ流路デバイス用ガラス基板を提供することを目的とする。 This invention is made | formed in view of such a condition, and it aims at providing the glass substrate for microchannel devices which can shorten the preparation time of a microchannel device and can reduce cost.
本発明のマイクロ流路デバイス用ガラス基板は、ガラス組成として、質量％で、ＳｉＯ２ ５０〜８５％、Ａｌ２Ｏ３ ０〜２０％、Ｂ２Ｏ３ ０〜１７％、ＭｇＯ ０〜１０％、ＣａＯ ０〜１５％、ＳｒＯ ０〜１５％、ＢａＯ ０〜１０％、Ｒ２Ｏ（ＲはＬｉ、Ｎａ及びＫから選択される少なくとも１種） ０．１〜１０％を含有することを特徴とする。 A glass substrate for the microchannel device of the present invention has a glass composition, in mass%, SiO 2 50~85%, Al 2 O 3 0~20%, B 2 O 3 0~17%, MgO 0~10% , CaO 0-15%, SrO 0-15%, BaO 0-10%, R 2 O (R is at least one selected from Li, Na and K) 0.1-10% And
本発明のマイクロ流路デバイス用ガラス基板は、多成分系であり、また、Ｒ２Ｏを必須成分として含有させているため、軟化点を低下することが可能である。軟化点が低いため、ガラス基板同士を低温で接合することができる。それゆえ、短時間かつ容易に、しかも低コストでマイクロ流路デバイスを製造することができる。 Since the glass substrate for a microchannel device of the present invention is a multi-component system and contains R 2 O as an essential component, the softening point can be lowered. Since the softening point is low, the glass substrates can be bonded at a low temperature. Therefore, a microchannel device can be manufactured in a short time, easily and at low cost.
本発明のマイクロ流路デバイス用ガラス基板は、軟化点が９００℃以下であることが好ましい。このようにすれば、ガラス基板同士を低温で接合することができるため、コストダウンにつながりやすい。 The glass substrate for a microchannel device of the present invention preferably has a softening point of 900 ° C. or lower. In this way, the glass substrates can be bonded to each other at a low temperature, which easily leads to cost reduction.
本発明のマイクロ流路デバイス用ガラス基板は、熱膨脹係数（３０〜３８０℃）が８０×１０−７／℃以下であることが好ましい。このようにすれば、ガラス基板同士を接合するための熱処理を行った後にガラスを急冷する際に、ガラスの破損が起こりにくい。 The glass substrate for a microchannel device of the present invention preferably has a thermal expansion coefficient (30 to 380 ° C.) of 80 × 10 −7 / ° C. or less. If it does in this way, when glass is rapidly cooled after performing the heat processing for joining glass substrates, breakage of glass does not occur easily.
本発明のマイクロ流路デバイス用ガラス基板は、歪点が５００℃以上であることが好ましい。 The glass substrate for a microchannel device of the present invention preferably has a strain point of 500 ° C. or higher.
本発明のマイクロ流路デバイス用ガラス基板は、液相粘度が１０４．０ｄＰａ・ｓ以上であることが好ましい。 The glass substrate for a microchannel device of the present invention preferably has a liquidus viscosity of 10 4.0 dPa · s or more.
本発明のマイクロ流路デバイス用ガラス基板は、表面粗さＲａが１００Å以下であることが好ましい。このようにすれば、基板同士を接合しやすくなる。 The glass substrate for a microchannel device of the present invention preferably has a surface roughness Ra of 100 mm or less. If it does in this way, it will become easy to join substrates.
本発明のガラス基板を用いれば、マイクロ流路デバイスの作製時間を短縮できることから、マイクロ流路デバイスを低コストで提供することができる。 If the glass substrate of this invention is used, since the production time of a microchannel device can be shortened, a microchannel device can be provided at low cost.
本発明のマイクロ流路デバイス用ガラス基板において、ガラス組成を上記のように限定した理由を以下に示す。なお、以下の各成分の説明において、特に断りのない限り、「％」は「質量％」を意味する。 The reason for limiting the glass composition as described above in the glass substrate for a microchannel device of the present invention will be described below. In the following description of each component, “%” means “mass%” unless otherwise specified.
ＳｉＯ２は、ガラス化範囲を拡げてガラス化しやすくするとともに、化学的耐久性を向上させる成分である。ＳｉＯ２の含有量は、５０〜８５％であり、５５〜８２％、６０〜７９％、６５〜７６％、特に６８〜７３％が好ましい。ＳｉＯ２の含有量が少な過ぎると、ガラス網目構造を形成し難くなって、ガラス化が困難になりやすくなり、また、クラックの発生率が高くなったり、化学的耐久性が低下しやすくなる。一方、ＳｉＯ２の含有量が多過ぎると、溶融性、成形性が低下しやすくなる。 SiO 2 is a component that expands the vitrification range to facilitate vitrification and improves chemical durability. The content of SiO 2 is 50 to 85%, preferably 55 to 82%, 60 to 79%, 65 to 76%, particularly 68 to 73%. If the content of SiO 2 is too small, it becomes difficult to form a glass network structure, and vitrification tends to be difficult, and the occurrence rate of cracks tends to increase, and chemical durability tends to decrease. On the other hand, if the content of SiO 2 is too large, the melting property, the moldability tends to decrease.
Ａｌ２Ｏ３は、化学的耐久性を向上させ、ヤング率、歪点を高める成分である。Ａｌ２Ｏ３の含有量は、０〜２０％であり、１〜１５％、２〜１２％、３〜１０％、特に５〜８％が好ましい。Ａｌ２Ｏ３の含有量が多過ぎると、ガラス中に失透結晶が析出して、液相粘度が低下しやすくなる。 Al 2 O 3 is a component that improves chemical durability and increases Young's modulus and strain point. The content of Al 2 O 3 is 0 to 20%, preferably 1 to 15%, 2 to 12%, 3 to 10%, particularly preferably 5 to 8%. When the content of Al 2 O 3 is too large, devitrification crystals in the glass are precipitated, the liquid phase viscosity tends to decrease.
Ｂ２Ｏ３は、軟化点、液相温度、密度を低下させる成分である。Ｂ２Ｏ３の含有量は、０〜１７％であり、２〜１５％、３〜１３％、５〜１３％、８〜１３％、１０〜１３％、１０．５〜１３％、特に１２〜１３％が好ましい。Ｂ２Ｏ３の含有量が多過ぎると、歪点、ヤング率、耐酸性が低下しやすくなる。 B 2 O 3 is a component that lowers the softening point, the liquidus temperature, and the density. The content of B 2 O 3 is 0 to 17%, 2 to 15%, 3 to 13%, 5 to 13%, 8 to 13%, 10 to 13%, 10.5 to 13%, especially 12 ~ 13% is preferred. When the content of B 2 O 3 is too large, the strain point, the Young's modulus, acid resistance tends to decrease.
Ｒ２Ｏ（ＲはＬｉ、Ｎａ及びＫから選択される少なくとも１種）は、軟化点、液相温度を低下させる成分である。Ｒ２Ｏの含有量（Ｌｉ２Ｏ、Ｎａ２Ｏ及びＫ２Ｏの合量）は、０．１〜１０％であり、０．５〜１０％、１〜８％、２〜７％、３〜７％、特に４〜７％が好ましい。Ｒ２Ｏの含有量が少なすぎると、上記効果が得られにくくなる。一方、Ｒ２Ｏの含有量が多すぎると、高温粘性が高くなり、ガラス中に泡等が発生しやすくなる。 R 2 O (R is at least one selected from Li, Na, and K) is a component that lowers the softening point and the liquidus temperature. The content of R 2 O (the total amount of Li 2 O, Na 2 O and K 2 O) is 0.1 to 10%, 0.5 to 10%, 1 to 8%, 2 to 7%, 3 to 7%, particularly 4 to 7% is preferable. When the content of R 2 O is too small, the effect is difficult to obtain. On the other hand, when the content of R 2 O is too large, the high temperature viscosity becomes higher, bubbles or the like are likely to occur in the glass.
なお、Ｒ２Ｏの各成分の含有量は以下の通りとすることが好ましい。 The content of each component of R 2 O is preferably as follows.
Ｌｉ２Ｏの含有量は、０〜１０％、０〜５％、０〜３％、０〜１％、特に０〜０．２％が好ましい。Ｌｉ２Ｏの含有量が多すぎると、アルカリ溶出が多くなりすぎたり、密度や熱膨張係数が高くなったり、失透傾向が強くなる。 The content of Li 2 O is preferably 0 to 10%, 0 to 5%, 0 to 3%, 0 to 1%, particularly preferably 0 to 0.2%. The content of Li 2 O is too large, or too many alkaline elution, or increased the density and thermal expansion coefficient, devitrification tendency increases.
Ｎａ２Ｏは、軟化点、液相温度を低下させる成分である。Ｎａ２Ｏの含有量は０．１〜１０％、０．５〜８％、１〜７％、２〜７％、３〜７％、特に４〜７％が好ましい。Ｎａ２Ｏの含有量が少なすぎると、上記効果が得られにくくなる。一方、Ｎａ２Ｏの含有量が多すぎると、アルカリ溶出が多くなりすぎたり、密度や熱膨張係数が高くなる。 Na 2 O is a component that lowers the softening point and the liquidus temperature. The content of Na2O is preferably 0.1 to 10%, 0.5 to 8%, 1 to 7%, 2 to 7%, 3 to 7%, particularly 4 to 7%. When the Na 2 O content is too small, the effect is difficult to obtain. On the other hand, when the content of Na 2 O is too large, the alkali dissolution or too much, the higher the density and thermal expansion coefficient.
Ｋ２Ｏの含有量は、０〜１０％、０〜５％、０〜３％、０〜１％、特に０〜０．２％が好ましい。Ｋ２Ｏの含有量が多すぎると、アルカリ溶出が多くなりすぎたり、密度や熱膨張係数が高くなる。 The content of K 2 O is preferably 0 to 10%, 0 to 5%, 0 to 3%, 0 to 1%, particularly preferably 0 to 0.2%. When the content of K 2 O is too large, the alkali dissolution or too much, the higher the density and thermal expansion coefficient.
ＭｇＯは、ヤング率、歪点を高めると共に、高温粘度、クラック発生率を低下させる成分である。ＭｇＯの含有量は、０〜１０％であり、０〜５％、０〜３％、０〜２％、０〜１．５％、０〜１％、特に０〜０．５％が好ましい。ＭｇＯの含有量が多すぎると、液相温度が上昇して、耐失透性が低下しやすくなる。 MgO is a component that increases the Young's modulus and strain point and decreases the high-temperature viscosity and crack generation rate. The content of MgO is 0 to 10%, preferably 0 to 5%, 0 to 3%, 0 to 2%, 0 to 1.5%, 0 to 1%, particularly preferably 0 to 0.5%. When there is too much content of MgO, liquidus temperature will rise and devitrification resistance will fall easily.
ＣａＯは、ヤング率、歪点を高めると共に、高温粘度、クラック発生率を低下させる成分である。ＣａＯの含有量は、０〜１５％であり、０．５〜１２％、１〜１０％、１〜９％、特に１〜８．５％が好ましい。ＣａＯの含有量が多すぎると、密度、熱膨張係数が高くなりやすい。 CaO is a component that increases the Young's modulus and strain point and decreases the high-temperature viscosity and crack generation rate. The content of CaO is 0 to 15%, preferably 0.5 to 12%, 1 to 10%, 1 to 9%, particularly preferably 1 to 8.5%. When there is too much content of CaO, a density and a thermal expansion coefficient will become high easily.
ＳｒＯは、ヤング率、歪点を高めると共に、高温粘度、クラック発生率を低下させる成分である。ＳｒＯの含有量は０〜１５％であり、０〜１２％、０〜８％、０〜５％、０〜３％、特に０〜１％が好ましい。ＳｒＯの含有量が多すぎると、密度、熱膨張係数が高くなりやすい。 SrO is a component that increases the Young's modulus and strain point, and decreases the high-temperature viscosity and crack generation rate. The SrO content is 0 to 15%, preferably 0 to 12%, 0 to 8%, 0 to 5%, 0 to 3%, particularly preferably 0 to 1%. When there is too much content of SrO, a density and a thermal expansion coefficient will become high easily.
ＢａＯは、化学的耐久性を向上させる成分である。ＢａＯの含有量は、０〜１０％、０．１〜７％、０．５〜５％、０．５〜３％、特に０．５〜２％が好ましい。ＢａＯの含有量が多過ぎると、密度、熱膨張係数が高くなりやすい。 BaO is a component that improves chemical durability. The content of BaO is preferably 0 to 10%, 0.1 to 7%, 0.5 to 5%, 0.5 to 3%, particularly preferably 0.5 to 2%. When there is too much content of BaO, a density and a thermal expansion coefficient will become high easily.
ＭｇＯ、ＣａＯ、ＳｒＯ、ＢａＯの各成分を複数導入すると、液相温度が低下して、ガラス中に結晶異物が発生し難くなる。これらの成分の合量は、０．１〜３０％、０．５〜１５％、１〜８％、特に１〜５％が好ましい。これらの成分の合量が少な過ぎると、上記効果が得られにくくなる。一方、これらの成分の合量が多すぎると、密度が上昇し、ガラスの軽量化が図り難くなることに加えて、クラック発生率が高くなりやすい。 When a plurality of MgO, CaO, SrO, and BaO components are introduced, the liquidus temperature is lowered, and it is difficult for crystal foreign matter to be generated in the glass. The total amount of these components is preferably 0.1 to 30%, 0.5 to 15%, 1 to 8%, and particularly preferably 1 to 5%. If the total amount of these components is too small, it is difficult to obtain the above effect. On the other hand, if the total amount of these components is too large, the density increases and it becomes difficult to reduce the weight of the glass, and the crack generation rate tends to increase.
本発明を構成するガラスには、上記成分以外にも以下の成分を含有させることができる。 In addition to the above components, the glass constituting the present invention may contain the following components.
Ｆｅ２Ｏ３の含有量は、３００ｐｐｍ以下、２００ｐｐｍ以下、１５０ｐｐｍ以下、１００ｐｐｍ以下、８０ｐｐｍ以下、５０ｐｐｍ以下、特に３０ｐｐｍ以下が好ましい。Ｆｅ２Ｏ３の含有量が少ない程、透過率が高くなるため、マイクロ流路内の液体の観察を行いやすくなる。なお、Ｆｅ２Ｏ３の含有量を低減するためには、高純度の原料を使用することが好ましい。Ｆｅ２Ｏ３の含有量の下限は特に限定されないが、現実的には、５ｐｐｍ以上、さらには１０ｐｐｍ以上である。 The content of Fe 2 O 3 is preferably 300 ppm or less, 200 ppm or less, 150 ppm or less, 100 ppm or less, 80 ppm or less, 50 ppm or less, and particularly preferably 30 ppm or less. The smaller the content of Fe 2 O 3 is, the higher the transmittance is, and it becomes easier to observe the liquid in the microchannel. In order to reduce the content of Fe 2 O 3 , it is preferable to use a high-purity raw material. Although Fe 2 the lower limit of the content of O 3 is not particularly limited, in reality, 5 ppm or more, more is 10ppm or more.
Ｙ２Ｏ３、Ｎｂ２Ｏ３、Ｌａ２Ｏ３は、歪点、ヤング率等を高める成分である。しかし、これらの成分の含有量が多すぎると、密度が高くなり易い。よって、Ｙ２Ｏ３、Ｎｂ２Ｏ３、Ｌａ２Ｏ３の含有量は、それぞれ３％以下が好ましい。 Y 2 O 3 , Nb 2 O 3 , and La 2 O 3 are components that increase the strain point, Young's modulus, and the like. However, when there is too much content of these components, a density will become high easily. Therefore, the content of Y 2 O 3 , Nb 2 O 3 and La 2 O 3 is preferably 3% or less.
清澄剤として、Ａｓ２Ｏ３、Ｓｂ２Ｏ３、ＣｅＯ２、ＳｎＯ２、Ｆ、Ｃｌ、ＳＯ３の群から選択された一種又は二種以上を０〜３％添加してもよい。但し、Ａｓ２Ｏ３、Ｓｂ２Ｏ３及びＦ、特にＡｓ２Ｏ３及びＳｂ２Ｏ３は、環境的観点から、その使用を極力控えることが好ましく、各々の含有量を０．１％未満に制限することが好ましい。好ましい清澄剤は、ＳｎＯ２、ＳＯ３及びＣｌである。ＳｎＯ２の含有量は、好ましくは０〜１％、０．０１〜０．５％、特に０．０５〜０．４％である。また、ＳｎＯ２＋ＳＯ３＋Ｃｌ（ＳｎＯ２、ＳＯ３及びＣｌの合量）の含有量は、好ましくは０．００１〜１％、０．０１〜０．５％、特に０．０１〜０．３％である。 As a fining agent, As 2 O 3, Sb 2 O 3, CeO 2, SnO 2, F, Cl, selected from the group of SO 3 was one or two or more may be added 0-3%. However, As 2 O 3 , Sb 2 O 3 and F, especially As 2 O 3 and Sb 2 O 3 are preferably refrained from use as much as possible from an environmental point of view, and each content is less than 0.1%. It is preferable to limit to. Preferred fining agents are SnO 2, SO 3 and Cl. The content of SnO 2 is preferably 0 to 1%, 0.01 to 0.5%, particularly 0.05 to 0.4%. Further, the content of SnO 2 + SO 3 + Cl (total amount of SnO 2 , SO 3 and Cl) is preferably 0.001 to 1%, 0.01 to 0.5%, particularly 0.01 to 0.3. %.
本発明のマイクロ流路デバイス用ガラス基板は、軟化点が９００℃以下、８８０℃以下、８６０℃以下、８４０℃以下、特に８２０℃以下であることが好ましい。軟化点が高すぎると、ガラス基板同士を接合する温度が上昇するため、マイクロ流路デバイスを安価で作製しにくくなる。 The glass substrate for a microchannel device of the present invention preferably has a softening point of 900 ° C. or lower, 880 ° C. or lower, 860 ° C. or lower, 840 ° C. or lower, particularly 820 ° C. or lower. If the softening point is too high, the temperature at which the glass substrates are bonded to each other increases, and it becomes difficult to produce a microchannel device at low cost.
本発明のマイクロ流路デバイス用ガラス基板は、熱膨張係数（３０〜３８０℃）が８０×１０−７／℃以下、７５×１０−７／℃以下、７０×１０−７／℃以下、特に６８×１０−７／℃以下であることが好ましい。熱膨張係数が高すぎると、ガラス基板同士を接合するための熱処理を行った後に急冷する際に、ガラス基板の破損が起こりやすい。 The glass substrate for a microchannel device of the present invention has a thermal expansion coefficient (30 to 380 ° C.) of 80 × 10 −7 / ° C. or less, 75 × 10 −7 / ° C. or less, 70 × 10 −7 / ° C. or less, particularly It is preferable that it is 68 * 10 < -7 > / degrees C or less. When the thermal expansion coefficient is too high, the glass substrate is likely to be damaged when the glass substrate is rapidly cooled after the heat treatment for bonding the glass substrates.
また、複数のガラス基板を張り合わせる際、張り合わせる各ガラス基板の熱膨張係数の差は５×１０−７／℃以下、３×１０−７／℃以下、２×１０−７／℃以下、１×１０−７／℃以下、特に０．５×１０−７／℃以下であることが好ましい。熱膨張係数の差が大きすぎると接合し冷却する際にガラス基板の破損が起りやすく、また、ガラス基板の反りが大きくなりやすい。 Further, when laminating a plurality of glass substrates, the difference in thermal expansion coefficient between the glass substrates to be laminated is 5 × 10 −7 / ° C. or less, 3 × 10 −7 / ° C. or less, 2 × 10 −7 / ° C. or less, It is preferably 1 × 10 −7 / ° C. or less, particularly preferably 0.5 × 10 −7 / ° C. or less. If the difference in thermal expansion coefficient is too large, the glass substrate is likely to be damaged when bonded and cooled, and the warp of the glass substrate is likely to increase.
本発明のマイクロ流路デバイス用ガラス基板は、歪点が、５００℃以上、特に５２０℃以上であることが好ましい。歪点が低すぎると、耐熱性が低下しやすく、各種溶剤を用いた実験を行った後、再利用するための熱処理を高温で行ったとしてもガラス基板の変形や変質が起こりにくいため、再利用が行いやすくなる。高温で処理することにより、流路内に残存する有機物をほぼ０にすることが可能となる。 The glass substrate for a microchannel device of the present invention preferably has a strain point of 500 ° C. or higher, particularly 520 ° C. or higher. If the strain point is too low, the heat resistance tends to decrease, and after conducting experiments using various solvents, even if heat treatment for reuse is performed at high temperatures, the glass substrate is unlikely to be deformed or altered. Easy to use. By processing at a high temperature, it is possible to reduce the organic matter remaining in the flow path to almost zero.
本発明のマイクロ流路デバイス用ガラス基板は、液相粘度が、１０４．０ｄＰａ・ｓ以上、１０５．０ｄＰａ・ｓ以上、１０５．６ｄＰａ・ｓ以上、１０５．８ｄＰａ・ｓ以上、特に１０６．０ｄＰａ・ｓ以上であることが好ましい。また、液相温度が、１２００℃以下、１１５０℃以下、１１３０℃以下、１１１０℃以下、１０９０℃以下、特に１０７０℃以下であることが好ましい。液相粘度が低すぎ、液相温度が高すぎると、成形時にガラスが失透しやすくなる。 The glass substrate for a microchannel device of the present invention has a liquidus viscosity of 10 4.0 dPa · s or more, 10 5.0 dPa · s or more, 10 5.6 dPa · s or more, 10 5.8 dPa · s or more. It is preferably s or more, particularly 10 6.0 dPa · s or more. Moreover, it is preferable that liquidus temperature is 1200 degrees C or less, 1150 degrees C or less, 1130 degrees C or less, 1110 degrees C or less, 1090 degrees C or less, especially 1070 degrees C or less. If the liquidus viscosity is too low and the liquidus temperature is too high, the glass tends to devitrify during molding.
本発明のマイクロ流路デバイス用ガラス基板は、クラック発生率が７０％以下、５０％以下、４０％以下、３０％以下、特に２０％以下であることが好ましい。クラック発生率が高すぎると、ガラス基板が破損しやすくなる。ここで、「クラック発生率」は、湿度３０％、温度２５℃に保持された恒温恒湿槽内において、荷重１０００ｇに設定したビッカース圧子をガラス表面（光学研磨相当面）に１５秒間打ち込み、その１５秒後に圧痕の４隅から発生するクラックの数をカウント（１つの圧痕につき最大４とする）し、この操作を２０回繰り返し（即ち、圧子を２０回打ち込み）、総クラック数を計数した後、（総クラック発生数／８０）×１００（％）にて得られた値を指す。 The glass substrate for a microchannel device of the present invention preferably has a crack generation rate of 70% or less, 50% or less, 40% or less, 30% or less, particularly 20% or less. If the crack occurrence rate is too high, the glass substrate tends to be damaged. Here, the “crack occurrence rate” is a constant temperature and humidity chamber maintained at a humidity of 30% and a temperature of 25 ° C., and a Vickers indenter set at a load of 1000 g is driven into the glass surface (optical polishing equivalent surface) for 15 seconds. After counting the number of cracks generated from the four corners of the indentation after 15 seconds (maximum 4 per indentation), this operation was repeated 20 times (that is, the indenter was driven 20 times), and the total number of cracks was counted , (Total number of cracks generated / 80) × 100 (%).
本発明のマイクロ流路デバイス用ガラス基板は、ヤング率が６５ＧＰａ以上、６７ＧＰａ以上、６８ＧＰａ以上、６９ＧＰａ以上、７０ＧＰａ以上、７１ＧＰａ以上、７２ＧＰａ以上、特に７５ＧＰａ以上であることが好ましい。ヤング率が低すぎると、ガラス基板が反りやすくなり、破損等の問題が生じやすくなる。 The glass substrate for a microchannel device of the present invention preferably has a Young's modulus of 65 GPa or more, 67 GPa or more, 68 GPa or more, 69 GPa or more, 70 GPa or more, 71 GPa or more, 72 GPa or more, particularly 75 GPa or more. If the Young's modulus is too low, the glass substrate tends to warp and problems such as breakage are likely to occur.
本発明のマイクロ流路デバイス用ガラス基板は、密度が２．７ｇ／ｃｍ３以下、２．６ｇ／ｃｍ３以下、２．５ｇ／ｃｍ３以下、特に２．４ｇ／ｃｍ３以下であることが好ましい。密度が高すぎると、マイクロ流路デバイスの軽量化を図りにくくなる。 The glass substrate for a microchannel device of the present invention has a density of 2.7 g / cm 3 or less, 2.6 g / cm 3 or less, 2.5 g / cm 3 or less, particularly 2.4 g / cm 3 or less. preferable. If the density is too high, it is difficult to reduce the weight of the microchannel device.
本発明のマイクロ流路デバイス用ガラス基板は、厚み５００μｍにおいて、波長３００ｎｍの透過率が３０％以上、５０％以上、７０％以上、８０％以上、８５％以上、特に８９％以上であることが好ましい。また、波長３５０ｎｍの透過率が５０％以上、７０％以上、８０％以上、８５％以上、８９％以上、９０％以上、特に９１％以上であることが好ましい。さらに、波長５５０ｎｍの透過率が８５％以上、８９％以上、９０％以上、特に９１％以上であることが好ましい。透過率が低すぎると、流路中を流れる液体の観察時に鮮明な像が得られにくい。 The glass substrate for a microchannel device of the present invention has a transmittance of 30% or more, 50% or more, 70% or more, 80% or more, 85% or more, particularly 89% or more at a thickness of 500 μm at a wavelength of 300 nm. preferable. The transmittance at a wavelength of 350 nm is preferably 50% or more, 70% or more, 80% or more, 85% or more, 89% or more, 90% or more, particularly 91% or more. Further, the transmittance at a wavelength of 550 nm is preferably 85% or more, 89% or more, 90% or more, particularly 91% or more. If the transmittance is too low, it is difficult to obtain a clear image when observing the liquid flowing in the flow path.
次に、本発明のマイクロ流路デバイス用ガラス基板を製造する方法を説明する。 Next, a method for producing the glass substrate for a microchannel device of the present invention will be described.
まず、所望の組成を有するガラスとなるように調合したガラス原料を加熱溶融して、ガラス融液を得る。次に、得られたガラス融液を板引き成形し、マイクロデバイス用ガラス基板を得る。板引き成形の方法に制限はないが、オーバーフローダウンドロー法で成形されてなることが好ましい。この方法で作製されたガラス基板は、表面品位に優れており、研磨を必要としない。オーバーフローダウンドロー法で成形されたガラス基板が表面品位に優れる理由は、ガラス基板の表面となるべき面が樋状耐火物に接触せず、自由表面の状態で成形されるからである。ここで、オーバーフローダウンドロー法は、溶融ガラスを耐熱性の樋状構造物の両側から溢れさせて、溢れた溶融ガラスを樋状構造物の下端で合流させながら、下方に延伸成形してガラス基板を製造する方法である。樋状構造物の構造や材質は、ガラス基板の寸法や表面精度を所望の状態とし、ガラス基板に使用できる品位を実現できるものであれば、特に限定されない。また、下方への延伸成形を行うために、ガラスに対してどのような方法で力を印加するものであってもよい。例えば、充分に大きい幅を有する耐熱性ロールをガラスに接触させた状態で回転させて延伸する方法を採用してもよいし、複数の対になった耐熱性ロールをガラスの端面近傍のみに接触させて延伸する方法を採用してもよい。なお、オーバーフローダウンドロー法以外にも、例えば、スロットダウン法、リドロー法等の成形方法を採用することもできる。 First, the glass raw material prepared so that it may become the glass which has a desired composition is heat-melted, and a glass melt is obtained. Next, the obtained glass melt is subjected to sheet drawing to obtain a glass substrate for microdevices. Although there is no restriction | limiting in the method of plate drawing, It is preferable to shape | mold by the overflow downdraw method. The glass substrate produced by this method has excellent surface quality and does not require polishing. The reason why the glass substrate formed by the overflow down draw method is excellent in surface quality is that the surface to be the surface of the glass substrate is not in contact with the bowl-like refractory and is formed in a free surface state. Here, the overflow down draw method is a method in which molten glass is overflowed from both sides of a heat-resistant bowl-shaped structure, and the overflowed molten glass is stretched and formed downward while joining at the lower end of the bowl-shaped structure. It is a method of manufacturing. The structure and material of the bowl-shaped structure are not particularly limited as long as the dimensions and surface accuracy of the glass substrate can be set to a desired state and the quality usable for the glass substrate can be realized. Moreover, in order to perform the downward stretch molding, any force may be applied to the glass. For example, a method may be adopted in which a heat-resistant roll having a sufficiently large width is rotated and stretched in contact with glass, or a plurality of pairs of heat-resistant rolls are contacted only near the end face of the glass. It is also possible to adopt a method of stretching by stretching. In addition to the overflow downdraw method, for example, a molding method such as a slot down method or a redraw method may be employed.
得られたガラス基板は、未研磨の表面を有することが好ましい。ガラスの理論強度は、本来、非常に高いが、理論強度よりも遥かに低い応力でも破壊に至ることが多い。これは、ガラス基板の表面にグリフィスフローと呼ばれる小さな欠陥がガラスの成形後の工程、例えば研磨工程等で生じるからである。よって、ガラス基板の表面を未研磨とすれば、本来の機械的強度を損ない難くなり、ガラス基板が破壊し難くなる。また、研磨工程を省略し得るため、ガラス基板の製造コストを低下することができる。なお、両表面の有効面全体を未研磨の表面とすれば、ガラス基板が更に破壊し難くなる。 The obtained glass substrate preferably has an unpolished surface. The theoretical strength of glass is inherently very high, but breakage is often caused even by a stress much lower than the theoretical strength. This is because a small defect called Griffith flow is generated on the surface of the glass substrate in a step after glass molding, for example, a polishing step. Therefore, if the surface of the glass substrate is unpolished, the original mechanical strength is hardly impaired, and the glass substrate is hardly broken. Moreover, since the polishing step can be omitted, the manufacturing cost of the glass substrate can be reduced. Note that if the entire effective surface of both surfaces is an unpolished surface, the glass substrate is more difficult to break.
得られたガラス基板の表面粗さＲａは、１００Å以下、５０Å以下、１０Å以下、８Å以下、４Å以下、３Å以下、特に２Å以下であることが好ましい。ガラス基板の表面の表面粗さＲａが大きすぎると、基板同士を接合しにくくなる。ガラス基板の端面の表面粗さＲａは、１００Å以下、５０Å以下、１０Å以下、８Å以下、４Å以下、３Å以下、特に２Å以下であることが好ましい。ガラス基板の端面の表面粗さＲａが大きすぎると、ガラス基板が破損しやすくなる。また、ガラス基板のうねりは、１μｍ以下、０．０８μｍ以下、０．０５μｍ以下、０．０３μｍ以下、０．０２μｍ以下、特に０．０１μｍ以下であることが好ましい。ガラス基板のうねりが大きすぎると、基板同士を接合しにくくなる。
さらに、ガラス基板の最大厚みと最小厚みの差が１０μｍ以下、５μｍ以下、２μｍ以下、特に１μｍ以下であることが好ましい。この差が大きすぎると、基板同士を接合しにくくなる。
The surface roughness Ra of the obtained glass substrate is preferably 100 mm or less, 50 mm or less, 10 mm or less, 8 mm or less, 4 mm or less, 3 mm or less, particularly 2 mm or less. When surface roughness Ra of the surface of a glass substrate is too large, it will become difficult to join substrates. The surface roughness Ra of the end surface of the glass substrate is preferably 100 mm or less, 50 mm or less, 10 mm or less, 8 mm or less, 4 mm or less, 3 mm or less, particularly 2 mm or less. If the surface roughness Ra of the end surface of the glass substrate is too large, the glass substrate is easily damaged. The waviness of the glass substrate is preferably 1 μm or less, 0.08 μm or less, 0.05 μm or less, 0.03 μm or less, 0.02 μm or less, and particularly preferably 0.01 μm or less. If the waviness of the glass substrates is too large, it becomes difficult to bond the substrates together.
Furthermore, the difference between the maximum thickness and the minimum thickness of the glass substrate is preferably 10 μm or less, 5 μm or less, 2 μm or less, and particularly preferably 1 μm or less. If this difference is too large, it becomes difficult to bond the substrates together.
マイクロ流路用ガラス基板の幅寸法は、５００ｍｍ以上、６００ｍｍ以上、８００ｍｍ以上、１０００ｍｍ以上、１２００ｍｍ以上、１５００ｍｍ以上、特に２０００ｍｍ以上であることが好ましい。このようにすれば、大型のガラス基板にフォトリソグラフィーあるいはレーザーにより流路を書き込み、カバーガラスを張り合わせたのちに切断することで一度に大量のマイクロ流路デバイスを作製することが可能になる。 The width dimension of the glass substrate for microchannels is preferably 500 mm or more, 600 mm or more, 800 mm or more, 1000 mm or more, 1200 mm or more, 1500 mm or more, particularly 2000 mm or more. In this way, it is possible to manufacture a large number of microchannel devices at once by writing a channel on a large glass substrate by photolithography or laser and cutting the substrate after pasting the cover glass.
次に、本発明のマイクロ流路デバイス用ガラス基板を用いてマイクロ流路デバイスを製造する方法を説明する。なお、マイクロ流路デバイスは、流路形成用基板と、その基板をカバーするガラス基板（以下、カバー用ガラス基板）からなり、本発明のガラス基板は、流路形成用基板及びカバー用ガラス基板のどちらにも用いることができる。 Next, a method for producing a microchannel device using the glass substrate for a microchannel device of the present invention will be described. The microchannel device includes a channel formation substrate and a glass substrate (hereinafter referred to as a cover glass substrate) that covers the substrate. The glass substrate of the present invention includes a channel formation substrate and a cover glass substrate. It can be used for both.
流路形成用ガラス基板とカバー用ガラス基板を上記の方法で作製する。流路形成用ガラス基板の厚みは３０〜３０００μｍ、５０〜２８００μｍ、１００〜２０００μｍ、２００〜１８００μｍ、２００〜１５００μｍ、２００〜１２００μｍ、２００〜１０００μｍ、２００〜８００μｍ、２００〜７００μｍ、２００〜５００μｍ、特に２００〜３００μｍであることが好ましい。厚みが小さすぎると、デバイス全体の剛性が不足し、取扱時に破損しやすくなる。一方、厚みが大きすぎると、流路デバイスが軽量化されにくくなる。また、カバー用ガラス基板の厚みは、１０００μｍ以下、７００μｍ以下、６００μｍ以下、４００μｍ以下、３００μｍ以下、２００μｍ以下、１００μｍ以下、特に５０μｍ以下であることが好ましい。なお、厚みの下限値は特に限定されないが、現実的には、５μｍ以上である。厚みが大きすぎると、流路形成用ガラス基板の上に、カバー用ガラス基板を湾曲させながら張り合わせることができにくくなり、張り合わせたガラスの間に空気を巻き込みやすくなる。 The glass substrate for flow path formation and the glass substrate for cover are produced by the above method. The thickness of the flow path forming glass substrate is 30 to 3000 μm, 50 to 2800 μm, 100 to 2000 μm, 200 to 1800 μm, 200 to 1500 μm, 200 to 1200 μm, 200 to 1000 μm, 200 to 800 μm, 200 to 700 μm, 200 to 500 μm, particularly It is preferable that it is 200-300 micrometers. If the thickness is too small, the rigidity of the entire device will be insufficient, and it will be easily damaged during handling. On the other hand, when the thickness is too large, the flow path device is hardly reduced in weight. Further, the thickness of the glass substrate for cover is preferably 1000 μm or less, 700 μm or less, 600 μm or less, 400 μm or less, 300 μm or less, 200 μm or less, 100 μm or less, particularly 50 μm or less. In addition, the lower limit value of the thickness is not particularly limited, but is actually 5 μm or more. When the thickness is too large, it becomes difficult to bond the glass substrate for covering while curving the glass substrate for covering on the flow path forming glass substrate, and it becomes easy to entrain air between the bonded glasses.
次に、流路形成用ガラス基板に流路を形成する。流路の形成には、フォトリソグラフィー、レーザー等を使用できる。流路を形成した流路形成用ガラス基板とカバー用ガラス基板を５００〜９００℃で熱融着させ、マイクロ流路デバイスを得る。ここで熱融着する温度が高すぎると、流路パターンが溶融しやすくなる。一方、低すぎると基板同士が融着しづらくなる。 Next, a flow path is formed in the flow path forming glass substrate. Photolithography, a laser, etc. can be used for formation of a channel. The flow path forming glass substrate and the cover glass substrate on which the flow path is formed are thermally fused at 500 to 900 ° C. to obtain a micro flow path device. Here, when the temperature for heat-sealing is too high, the flow path pattern is easily melted. On the other hand, if it is too low, it becomes difficult for the substrates to be fused together.
なお、流路形成用ガラス基板に貫通孔からなる流路を形成しても構わない。この場合は、カバー用ガラス基板を流路形成用ガラス基板の両面に接合する。この場合、流路形成用ガラス基板の厚みは５００μｍ以下、３００μｍ以下、１００μｍ以下、７０μｍ以下、５０μｍ以下、特に３０μｍ以下であることが好ましい。厚みが大きすぎると、フォトリソグラフィー、レーザー等により貫通孔を作製する際に、タクトタイムが上昇するため、製造コストが上がりやすい。また、カバー用ガラス基板の厚みは２０００μｍ以下、１８００μｍ以下、１５００μｍ以下、１２００μｍ以下、１０００μｍ以下、８００μｍ以下、７００μｍ以下、５００μｍ以下、特に３００μｍ以下であることが好ましい。なお、厚みの下限値は特に限定されないが、現実的には、５μｍ以上である。厚みが大きすぎると、流路デバイスが軽量化されにくくなる。 In addition, you may form the flow path which consists of a through-hole in the glass substrate for flow paths. In this case, the glass substrate for a cover is joined to both surfaces of the glass substrate for channel formation. In this case, the thickness of the glass substrate for forming a flow path is preferably 500 μm or less, 300 μm or less, 100 μm or less, 70 μm or less, 50 μm or less, particularly 30 μm or less. If the thickness is too large, the tact time increases when the through-hole is produced by photolithography, laser, or the like, and the manufacturing cost is likely to increase. The thickness of the cover glass substrate is preferably 2000 μm or less, 1800 μm or less, 1500 μm or less, 1200 μm or less, 1000 μm or less, 800 μm or less, 700 μm or less, 500 μm or less, and particularly preferably 300 μm or less. In addition, the lower limit value of the thickness is not particularly limited, but is actually 5 μm or more. If the thickness is too large, the flow path device is hardly reduced in weight.
以下に、本発明で使用するガラス基板の好適な例を説明する。但し、以下の例は単なる例示である。本発明で使用するガラス基板は、以下の例に何ら限定されない。 Below, the suitable example of the glass substrate used by this invention is demonstrated. However, the following examples are merely illustrative. The glass substrate used by this invention is not limited to the following examples at all.
表１は、ガラス基板（試料Ｎｏ．１〜３）のガラス組成と特性を示している。 Table 1 shows the glass composition and characteristics of the glass substrate (Sample Nos. 1 to 3).
まず表１に記載のガラス組成になるように、ガラス原料を調合し、得られたガラス原料をガラス溶融炉に供給して１５００〜１６００℃で溶融した。次いで、得られた溶融ガラスをオーバーフローダウンドロー法により、表中の厚み、幅寸法１５００ｍｍになるように成形した。続いて、成形直後のガラス基板を徐冷エリアに移動させ、冷却し、流路形成用ガラス基板及びカバー用ガラス基板を得た。その際に、１０１２〜１０１４ｄＰａ・ｓにおける温度での冷却速度が２０℃／分になるように、徐冷エリアの温度と基板引き出し速度を調整した。得られた流路形成用ガラス基板にレーザーにて流路を形成した。その後、流路形成用ガラス基板とカバー用ガラス基板を５００〜９００℃で熱融着し、マイクロ流路デバイスを作製した。 First, glass raw materials were prepared so as to have the glass composition shown in Table 1, and the obtained glass raw materials were supplied to a glass melting furnace and melted at 1500 to 1600 ° C. Next, the obtained molten glass was molded by an overflow down draw method so as to have a thickness and a width dimension of 1500 mm in the table. Then, the glass substrate immediately after shaping | molding was moved to the slow cooling area, it cooled, and the glass substrate for flow path formation and the glass substrate for covers were obtained. At that time, the temperature of the slow cooling area and the substrate drawing speed were adjusted so that the cooling rate at a temperature of 10 12 to 10 14 dPa · s was 20 ° C./min. A channel was formed with a laser on the obtained glass substrate for channel formation. Thereafter, the flow path forming glass substrate and the cover glass substrate were thermally fused at 500 to 900 ° C. to produce a micro flow path device.
表１から明らかなように、試料Ｎｏ．１〜３は、軟化点が７４０〜７９２℃と低かったため熱融着する温度が低かった。また、試料Ｎｏ．１〜３は、厚みが小さく、表面精度が良好であった。そのため、コストアップを招来させることなく、マイクロ流路デバイスを作製することができた。 As is clear from Table 1, sample No. 1 to 3 had a low softening point of 740 to 792 [deg.] C., and thus the heat fusion temperature was low. Sample No. 1-3 were small in thickness and had good surface accuracy. Therefore, it was possible to produce a microchannel device without causing an increase in cost.
密度は、周知のアルキメデス法により測定した値である。 The density is a value measured by a well-known Archimedes method.
歪点は、ＡＳＴＭ Ｃ３３６−７１の方法に基づいて測定した値である。 The strain point is a value measured based on the method of ASTM C336-71.
ガラス転移温度は、熱膨張曲線からＪＩＳ Ｒ３１０３−３の方法に基づいて測定した値である。 The glass transition temperature is a value measured from the thermal expansion curve based on the method of JIS R3103-3.
軟化点は ＡＳＴＭ Ｃ３３８−９３の方法に基づいて測定した値である。 The softening point is a value measured based on the method of ASTM C338-93.
１０４．０、１０３．０、１０２．５ｄＰａ・ｓにおける温度は、白金球引き上げ法で測定した値である。この温度が低い程、溶融性に優れていることになる。 The temperature at 10 4.0 , 10 3.0 , 10 2.5 dPa · s is a value measured by a platinum ball pulling method. The lower the temperature, the better the meltability.
ヤング率は、共振法により測定した値である。 The Young's modulus is a value measured by a resonance method.
熱膨張係数は、ディラトメーターを用いて、３０〜３８０℃における平均熱膨張係数を測定したものである。熱膨張係数の測定用試料として、端面にＲ加工を施したφ５ｍｍ×２０ｍｍの円柱状の試料を用いた。 The thermal expansion coefficient is obtained by measuring an average thermal expansion coefficient at 30 to 380 ° C. using a dilatometer. As a sample for measuring the coefficient of thermal expansion, a cylindrical sample of φ5 mm × 20 mm whose end face was subjected to R processing was used.
液相温度は、標準篩３０メッシュ（５００μｍ）を通過し、５０メッシュ（３００μｍ）に残るガラス粉末を白金ボートに入れ、温度勾配炉中に２４時間保持して、結晶の析出する温度を測定したものである。液相粘度は、液相温度におけるガラスの粘度を白金球引き上げ法で測定した値である。 The liquid phase temperature passed through a standard sieve 30 mesh (500 μm), the glass powder remaining in 50 mesh (300 μm) was placed in a platinum boat and held in a temperature gradient furnace for 24 hours, and the temperature at which crystals were precipitated was measured. Is. The liquid phase viscosity is a value obtained by measuring the viscosity of glass at the liquid phase temperature by a platinum ball pulling method.
化学的耐久性については下記の方法により確認した。耐水性についてはＩＳＯ７１９および、ＪＩＳＲ３５０２、耐アルカリ性についてはＩＳＯ６９５、耐酸性についてはＤＩＮ１２１１６に準拠して確認した。 The chemical durability was confirmed by the following method. The water resistance was confirmed according to ISO 719 and JIS R3502, the alkali resistance was determined according to ISO 695, and the acid resistance was determined according to DIN 12116.
表面の表面粗さＲａは、ＪＩＳ Ｂ０６０１：２００１に準拠した方法で測定した値である。 The surface roughness Ra of the surface is a value measured by a method based on JIS B0601: 2001.
端面の表面粗さＲａは、ＪＩＳ Ｂ０６０１：２００１に準拠した方法で測定した値である。 The surface roughness Ra of the end face is a value measured by a method based on JIS B0601: 2001.
うねりは、触針式の表面形状測定装置を用いて、ＪＩＳ Ｂ０６０１：２００１に記載のＷＣＡ（ろ波中心線うねり）を測定した値であり、この測定は、ＳＥＭＩ ＳＴＤ Ｄ１５−１２９６「ＦＰＤガラス板の表面うねりの測定方法」に準拠した方法で測定し、測定時のカットオフは０．８〜８ｍｍ、ガラス基板の引き出し方向に対して垂直な方向に３００ｍｍの長さで測定した値である。 The waviness is a value obtained by measuring the WCA (filtered center line waviness) described in JIS B0601: 2001 using a stylus type surface shape measuring device. This measurement is based on SEMI STD D15-1296 “FPD glass plate”. Measured by a method in accordance with “Measurement method of surface waviness”, the cut-off at the time of measurement is 0.8 to 8 mm, and is a value measured at a length of 300 mm in a direction perpendicular to the drawing direction of the glass substrate.
ガラス基板の最大厚みと最小厚みの差は、レーザー式厚み測定装置を用いて、ガラス基板の任意の一辺に厚み方向からレーザーを走査することにより、ガラス基板の最大厚みと最小厚みを測定した上で、最大厚みの値から最小厚みの値を減じた値である。 The difference between the maximum thickness and the minimum thickness of the glass substrate is determined by measuring the maximum thickness and the minimum thickness of the glass substrate by scanning a laser from one side of the glass substrate in the thickness direction using a laser thickness measuring device. The value obtained by subtracting the value of the minimum thickness from the value of the maximum thickness.
透過率は、ＵＶ−３１００ＰＣを使用し、スリット幅：２．０ｎｍ、スキャン速度：中速、サンプリングピッチ：０．５ｎｍの条件で測定した。 The transmittance was measured using UV-3100PC under the conditions of slit width: 2.0 nm, scan speed: medium speed, and sampling pitch: 0.5 nm.
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