JP2018006710A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2018006710A JP2018006710A JP2016136240A JP2016136240A JP2018006710A JP 2018006710 A JP2018006710 A JP 2018006710A JP 2016136240 A JP2016136240 A JP 2016136240A JP 2016136240 A JP2016136240 A JP 2016136240A JP 2018006710 A JP2018006710 A JP 2018006710A
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- JP
- Japan
- Prior art keywords
- refrigerant
- plate
- package
- semiconductor
- flow path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 87
- 239000003507 refrigerant Substances 0.000 claims description 112
- 238000001816 cooling Methods 0.000 abstract description 83
- 239000002826 coolant Substances 0.000 abstract description 22
- 239000011347 resin Substances 0.000 description 46
- 229920005989 resin Polymers 0.000 description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
3a、3b、3c:パワー端子
4:制御端子
5:前端カバー
6:後端カバー
7:冷媒供給口
8:冷媒排出口
10、10a、10b:樹脂筐体
12:外枠
12a:周壁
12b:上端面
12c、12d:貫通孔
13、13a、13b:パッケージ
14、15:フィン
16:絶縁板
17:放熱板
18、18a、18b:冷却プレート
19:ガスケット
21a、21b:トランジスタチップ
22:銅ブロック
30:中板
31:溝
32:ノズル
33、34:流れ止め部
39:冷媒流路
Claims (1)
- 半導体チップを収容している平板型の複数の半導体モジュールと複数の冷媒流路が一つずつ交互に積層されている半導体装置であり、
前記冷媒流路内に、前記半導体モジュールと平行に拡がる中板が配置されており、
前記中板は、前記冷媒流路に隣接する一対の前記半導体モジュールの一方に向けて冷媒を噴出させるノズルを有しており、
前記半導体モジュールは、内部の前記半導体チップから前記冷媒が噴出される側の表面までの熱抵抗が、前記半導体チップから反対側の表面までの熱抵抗よりも小さい、半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016136240A JP6724613B2 (ja) | 2016-07-08 | 2016-07-08 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016136240A JP6724613B2 (ja) | 2016-07-08 | 2016-07-08 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018006710A true JP2018006710A (ja) | 2018-01-11 |
JP6724613B2 JP6724613B2 (ja) | 2020-07-15 |
Family
ID=60949886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016136240A Expired - Fee Related JP6724613B2 (ja) | 2016-07-08 | 2016-07-08 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6724613B2 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005311046A (ja) * | 2004-04-21 | 2005-11-04 | Denso Corp | 冷却器 |
JP2007258458A (ja) * | 2006-03-23 | 2007-10-04 | Toyota Motor Corp | 冷却器 |
JP2011192730A (ja) * | 2010-03-12 | 2011-09-29 | Toyota Motor Corp | 冷却器、積層冷却器および中間プレート |
JP2014143273A (ja) * | 2013-01-23 | 2014-08-07 | Toyota Motor Corp | 積層冷却ユニット |
JP2014187170A (ja) * | 2013-03-22 | 2014-10-02 | Toyota Motor Corp | 冷却器 |
JP2015023124A (ja) * | 2013-07-18 | 2015-02-02 | トヨタ自動車株式会社 | 積層冷却ユニット |
JP2015115445A (ja) * | 2013-12-11 | 2015-06-22 | トヨタ自動車株式会社 | 冷却器 |
JP2015201471A (ja) * | 2014-04-04 | 2015-11-12 | トヨタ自動車株式会社 | 冷却器 |
-
2016
- 2016-07-08 JP JP2016136240A patent/JP6724613B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005311046A (ja) * | 2004-04-21 | 2005-11-04 | Denso Corp | 冷却器 |
JP2007258458A (ja) * | 2006-03-23 | 2007-10-04 | Toyota Motor Corp | 冷却器 |
JP2011192730A (ja) * | 2010-03-12 | 2011-09-29 | Toyota Motor Corp | 冷却器、積層冷却器および中間プレート |
JP2014143273A (ja) * | 2013-01-23 | 2014-08-07 | Toyota Motor Corp | 積層冷却ユニット |
JP2014187170A (ja) * | 2013-03-22 | 2014-10-02 | Toyota Motor Corp | 冷却器 |
JP2015023124A (ja) * | 2013-07-18 | 2015-02-02 | トヨタ自動車株式会社 | 積層冷却ユニット |
JP2015115445A (ja) * | 2013-12-11 | 2015-06-22 | トヨタ自動車株式会社 | 冷却器 |
JP2015201471A (ja) * | 2014-04-04 | 2015-11-12 | トヨタ自動車株式会社 | 冷却器 |
Also Published As
Publication number | Publication date |
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JP6724613B2 (ja) | 2020-07-15 |
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