JP2017538855A - 半導体用接着フィルム - Google Patents
半導体用接着フィルム Download PDFInfo
- Publication number
- JP2017538855A JP2017538855A JP2017549158A JP2017549158A JP2017538855A JP 2017538855 A JP2017538855 A JP 2017538855A JP 2017549158 A JP2017549158 A JP 2017549158A JP 2017549158 A JP2017549158 A JP 2017549158A JP 2017538855 A JP2017538855 A JP 2017538855A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive film
- semiconductor
- epoxy resin
- resin
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 359
- 239000004065 semiconductor Substances 0.000 title claims abstract description 324
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000005011 phenolic resin Substances 0.000 claims description 103
- 239000003822 epoxy resin Substances 0.000 claims description 94
- 229920000647 polyepoxide Polymers 0.000 claims description 94
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 90
- 229920005992 thermoplastic resin Polymers 0.000 claims description 84
- 239000007787 solid Substances 0.000 claims description 66
- 230000009477 glass transition Effects 0.000 claims description 52
- 239000003795 chemical substances by application Substances 0.000 claims description 45
- 239000000155 melt Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 abstract description 100
- 230000008569 process Effects 0.000 abstract description 52
- 238000005520 cutting process Methods 0.000 abstract description 47
- 230000000704 physical effect Effects 0.000 abstract description 19
- 239000010408 film Substances 0.000 description 106
- 230000001070 adhesive effect Effects 0.000 description 77
- 239000000853 adhesive Substances 0.000 description 74
- 238000001723 curing Methods 0.000 description 69
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 36
- 239000004593 Epoxy Substances 0.000 description 29
- 239000000463 material Substances 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 28
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 239000004925 Acrylic resin Substances 0.000 description 20
- -1 dicyclopentadiene modified phenol Chemical class 0.000 description 20
- 125000000524 functional group Chemical group 0.000 description 19
- 239000012790 adhesive layer Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 17
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 12
- 239000000178 monomer Substances 0.000 description 11
- 238000010008 shearing Methods 0.000 description 11
- 239000011342 resin composition Substances 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 8
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
- 238000000227 grinding Methods 0.000 description 8
- 239000004843 novolac epoxy resin Substances 0.000 description 8
- 229920001568 phenolic resin Polymers 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 238000012858 packaging process Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000012467 final product Substances 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 229920000098 polyolefin Polymers 0.000 description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 5
- 229930003836 cresol Natural products 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- 239000004695 Polyether sulfone Substances 0.000 description 4
- 239000004697 Polyetherimide Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 4
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 4
- 229920003055 poly(ester-imide) Polymers 0.000 description 4
- 229920001643 poly(ether ketone) Polymers 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920006393 polyether sulfone Polymers 0.000 description 4
- 229920001601 polyetherimide Polymers 0.000 description 4
- 239000002952 polymeric resin Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 229910000323 aluminium silicate Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000306 polymethylpentene Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004821 Contact adhesive Substances 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920012753 Ethylene Ionomers Polymers 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920011250 Polypropylene Block Copolymer Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- PUUHQINUYLQTNH-UHFFFAOYSA-N [O-2].[Zr+4].[Sb+3] Chemical compound [O-2].[Zr+4].[Sb+3] PUUHQINUYLQTNH-UHFFFAOYSA-N 0.000 description 1
- FPTDTIWAXPDSFY-UHFFFAOYSA-N [Sb+3].[O-2].[O-2].[O-2].[Al+3] Chemical compound [Sb+3].[O-2].[O-2].[O-2].[Al+3] FPTDTIWAXPDSFY-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- LEHUDBPYSAPFFO-UHFFFAOYSA-N alumane;bismuth Chemical compound [AlH3].[Bi] LEHUDBPYSAPFFO-UHFFFAOYSA-N 0.000 description 1
- GSWGDDYIUCWADU-UHFFFAOYSA-N aluminum magnesium oxygen(2-) Chemical compound [O--].[Mg++].[Al+3] GSWGDDYIUCWADU-UHFFFAOYSA-N 0.000 description 1
- HVXCTUSYKCFNMG-UHFFFAOYSA-N aluminum oxygen(2-) zirconium(4+) Chemical compound [O-2].[Zr+4].[Al+3] HVXCTUSYKCFNMG-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- UZBRCYQVVLCUTR-UHFFFAOYSA-N antimony;oxobismuth Chemical compound [Sb].[Bi]=O UZBRCYQVVLCUTR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- SKKNACBBJGLYJD-UHFFFAOYSA-N bismuth magnesium Chemical compound [Mg].[Bi] SKKNACBBJGLYJD-UHFFFAOYSA-N 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- UNIOSFZFHJCHOJ-UHFFFAOYSA-N magnesium antimony(3+) oxygen(2-) Chemical compound [Sb+3].[O-2].[Mg+2] UNIOSFZFHJCHOJ-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- ANOYEYQQFRGUAC-UHFFFAOYSA-N magnesium;oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[O-2].[Mg+2].[Zr+4] ANOYEYQQFRGUAC-UHFFFAOYSA-N 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- QKMIXHLCCAVAMY-UHFFFAOYSA-N oxobismuth;zirconium Chemical compound [Zr].[Bi]=O QKMIXHLCCAVAMY-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 229920005630 polypropylene random copolymer Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229910001428 transition metal ion Inorganic materials 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- Adhesive Tapes (AREA)
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Abstract
Description
本出願は、2015年4月29日付の韓国特許出願第10−2015−0060690号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示された全ての内容は本明細書の一部として含まれる。
前記液状エポキシ樹脂は、100〜1,000のエポキシ当量を有してもよい。
前記フェノール樹脂は、100g/eq〜178g/eqの水酸基当量を有してもよい。
前記固状エポキシ樹脂の軟化点は、50℃〜120℃であってもよい。
発明の一実施形態によれば、110℃の温度および5rad/sの剪断速度で1,000Pa・s〜4,000Pa・sの溶融粘度を有し、常温で5%〜10%伸張時に発生するモジュラスが50MPa以上である、半導体用接着フィルムが提供される。
前記フェノール樹脂に対する前記液状エポキシ樹脂の重量比が高すぎると、前記半導体用接着フィルムの破断強度が大きく増加し、常温での引張モジュラスが低くなり得、低温分断過程での分断性または効率が低下することがある。
前記エポキシ系官能基は、エポキシ基またはグリシジル基を含むことができる。
前記固状エポキシ樹脂は、100〜1,000のエポキシ当量を有してもよい。
前記エポキシ系官能基を含む(メタ)アクリレート系繰り返し単位を0.1重量%〜10重量%含む(メタ)アクリレート系樹脂は、−10℃〜20℃、または−5℃〜15℃のガラス転移温度を有してもよい。上述したガラス転移温度を有する(メタ)アクリレート系樹脂を用いることによって、前記半導体用接着フィルムが十分な流動性を有することができ、最終的に製造される接着フィルムが高い接着力を確保することができ、前記半導体用接着フィルムを薄膜フィルムなどの形態に製造することが容易である。
前記固状エポキシ樹脂は、100〜1,000のエポキシ当量を有してもよい。
前記エポキシ系官能基は、エポキシ基またはグリシジル基を含むことができる。
前記固状エポキシ樹脂は、100〜1,000のエポキシ当量を有してもよい。
前記硬化触媒は、前記硬化剤の作用や前記半導体用接着フィルムの硬化を促進させる役割を果たし、半導体接着フィルムなどの製造に使用されることが知られた硬化触媒を大きな制限なく使用することができる。例えば、前記硬化触媒としては、リン系化合物、ホウ素系化合物およびリン−ホウ素系化合物、およびイミダゾール系化合物からなる群より選択された1種以上を使用することができる。前記硬化触媒の使用量は、最終的に製造される接着フィルムの物性などを考慮して適切に選択してもよいし、例えば、前記液状および固状エポキシ樹脂、(メタ)アクリレート系樹脂、およびフェノール樹脂の総和100重量部を基準として0.5〜10重量部使用される。
さらに、前記半導体用接着フィルムは、常温で引張率が500%以下であってもよい。
紫外線硬化型粘着剤を用いる場合には、基材フィルム側から紫外線を照射して、粘着剤の凝集力およびガラス転移温度を上げて粘着力を低下させ、熱硬化型粘着剤の場合は、温度を加えて粘着力を低下させる。
実施例1
(1)半導体接着用樹脂組成物溶液の製造
エポキシ樹脂の硬化剤であるフェノール樹脂KH−6021(DIC社製品、ビスフェノールAノボラック樹脂、水酸基当量121g/eq、軟化点:125℃)40g、エポキシ樹脂EOCN−104S(日本化薬製品、クレゾールノボラック型エポキシ樹脂、エポキシ当量214g/eq、軟化点:83℃)38g、液状エポキシ樹脂RE−310S(日本化学製品、ビスフェノールAエポキシ樹脂、エポキシ当量180g/eq)50g、熱可塑性アクリレート樹脂KG−3015(Mw:90万、ガラス転移温度:10℃)40g、シランカップリング剤A−187(GE東芝シリコン、ガンマ−グリシドキシプロピルトリメトキシシラン)5g、硬化促進剤2PZ(四国化成、2−フェニルイミダゾール)0.1g、および充填剤SC−2050(アドマテックス、球状シリカ、平均粒径約400nm)100gをメチルエチルケトン溶媒に混合して、半導体接着用樹脂組成物溶液(固形分20重量%濃度)を得た。
前記製造された半導体接着用樹脂組成物溶液を離型処理されたポリエチレンテレフタレートフィルム(厚さ38μm)上に塗布した後、110℃で3分間乾燥して、約60μmの厚さの半導体用接着フィルム(ダイボンディングフィルム)を得た。
下記表1に記載された成分および使用量を適用した点を除いて、実施例1と同様の方法で半導体接着用樹脂組成物溶液(固形分20重量%濃度)および60μmの厚さの半導体用接着フィルム(ダイボンディングフィルム)を得た。
下記表1の成分および含有量を用いて半導体接着用樹脂組成物溶液(メチルエチルケトン20重量%濃度)を製造した点を除いて、実施例1と同様の方法で半導体用接着フィルム(ダイボンディングフィルム)を製造した。
実験例1:溶融粘度の測定
前記実施例および比較例でそれぞれ得られた接着フィルムを厚さ650μmになるまで重畳して積層した後、60℃のロールラミネータを用いてラミネートした。以降、各試験片を直径10mmの円形に成形した後、TA社のadvanced rheometric expansion system(ARES)を用いて、1Hzおよび5radsの剪断速度で20℃/分の昇温速度を適用して、40℃〜160℃の範囲で温度に応じた溶融粘度を測定した。
前記実施例および比較例でそれぞれ得られた接着フィルムの引張特性を測定するために、Texture Analyzer(Stable Micro System社)を用いた。具体的には、前記実施例および比較例でそれぞれ得られた接着フィルムを幅15mmおよび長さ100mmの大きさに裁断してサンプルを製作し、サンプルの中央部を50mm残した状態で両端をテーピングした。そして、前記テーピングされたサンプルの両端を前記装備に固定し、0.3mm/secの速度で引張しながら引張曲線を作成した。前記引張曲線から5%引張時の傾き値を測定してモジュラスを測定し、前記サンプルが完全に破断する時点を測定して引張率を決定した。
(1)ダイシングフィルムの製造
2−エチルヘキシルアクリレート75g、2−エチルヘキシルメタクリレート10g、および2−ヒドロキシエチルアクリレート15gをエチルアクリレート溶媒300g下で共重合して、重量平均分子量が850,000の共重合体(ガラス転移温度が10℃)を得た後、これに光硬化物質のアクリルイソシアネート化合物10gを添加して反応物を得た。その後、これに多官能イソシアネートオリゴマー10gと光開始剤としてダロカーTPOを1g混合して、紫外線硬化型粘着剤組成物を製造した。
前記紫外線硬化型粘着剤組成物を離型処理された厚さ38umのポリエステルフィルム上に乾燥後の厚さが10umとなるように塗布し、110℃で3分間乾燥した。乾燥した粘着層を厚さが100μmのポリオレフィンフィルムにラミネートしてダイシングフィルムを製造した。
前記過程で得られた粘着層および前記実施例および比較例でそれぞれ得られた接着フィルム(幅18mm、長さ10cm)を貼り合わせて、ダイシングダイボンディング用多層構造の接着フィルムを製造した。
100μmのウエハおよびウエハリングマウンタを用いて、50℃で前記製造されたそれぞれのダイシングダイボンディングフィルムをラミネーションした後、ダイシング装備を用いて、40K rpmおよび20mm/secの速度、10mm*10mmのチップサイズの条件でダイシングした後、ダイ上にバリが発生した個数を確認して、バリ発生率を測定した。
約600μm〜700μmのウエハミラー面に、実施例および比較例でそれぞれ得られた接着フィルムを60℃の条件下でラミネーションし、ウエハを5mm*5mmの大きさに切片化してダイの大きさだけの接着フィルムを準備した。そして、10mm*10mmの大きさの70μmのウエハミラーを130℃のホットプレートに位置させた後、前記ダイボンディングフィルムをウエハダイ2Kgおよび2秒の条件で付着させ、125℃の温度で1時間硬化を進行させ、175℃の温度で2時間再度硬化を進行させた。
そして、ダイシェアテスタ(Die Shear Tester)DAGE4000を用いて、250℃でウエハダイを0.05mm/secの速度で押しながら力を測定し、高温剪断力を測定した。
実施例1〜4および比較例1〜2から得られた粘着剤をダイシングフィルムにラミネートして、ダイシングダイボンディングフィルムを製造した。
5mm*5mmの大きさに予め切削された50μmの8インチのウエハおよびウエハリングマウンタを用いて、60℃で前記製造されたそれぞれのダイシングダイボンディングフィルムをラミネーションした後、30分間室温で放置した。以降、低温チャンバに前記ダイシングダイボンディングフィルムがラミネーションされたウエハを装着し、−10℃の温度で100mm/sの速度で5mmの高さまで低温エキスパンディングを行った。そして、前記ウエハを熱収縮装置に移動させて、1mm/sの条件で4mmまでエキスパンディングした後、熱を照射してダイシングフィルムを熱収縮させた。以降、室温でウエハの分断比率を確認した。
Claims (18)
- 110℃の温度および5rad/sの剪断速度で1,000Pa・s〜4,000Pa・sの溶融粘度を有し、
常温で5%〜10%伸張時に発生するモジュラスが50MPa以上である、半導体用接着フィルム。 - 前記接着フィルムは、リードフレームまたは基板とダイとを接着するか、ダイとダイとを接着するダイアタッチフィルム(DAF)として使用される、請求項1に記載の半導体用接着フィルム。
- 前記半導体用接着フィルムは、−10℃〜20℃のガラス転移温度を有する熱可塑性樹脂、70℃以上の軟化点を有するフェノール樹脂を含む硬化剤、液状エポキシ樹脂、および固状エポキシ樹脂を含む、請求項1に記載の半導体用接着フィルム。
- 前記熱可塑性樹脂に対する前記固状エポキシ樹脂および液状エポキシ樹脂の総含有量の重量比が1.6〜2.6である、請求項3に記載の半導体用接着フィルム。
- 前記熱可塑性樹脂、フェノール樹脂、および液状エポキシ樹脂の全重量に対する前記フェノール樹脂の重量比が0.280以上である、請求項3に記載の半導体用接着フィルム。
- 110℃の温度および5rad/sの剪断速度で1,000Pa・s〜4,000Pa・sの溶融粘度を有し、
常温で引張率が500%以下である、半導体用接着フィルム。 - 前記接着フィルムは、リードフレームまたは基板とダイとを接着するか、ダイとダイとを接着するダイアタッチフィルム(DAF)として使用される、請求項6に記載の半導体用接着フィルム。
- 前記半導体用接着フィルムは、−10℃〜20℃のガラス転移温度を有する熱可塑性樹脂、70℃以上の軟化点を有するフェノール樹脂を含む硬化剤、液状エポキシ樹脂、および固状エポキシ樹脂を含む、請求項6に記載の半導体用接着フィルム。
- 前記熱可塑性樹脂に対する前記固状エポキシ樹脂および液状エポキシ樹脂の総含有量の重量比が1.6〜2.6である、請求項8に記載の半導体用接着フィルム。
- 前記熱可塑性樹脂、フェノール樹脂、および液状エポキシ樹脂の全重量に対する前記フェノール樹脂の重量比が0.280以上である、請求項8に記載の半導体用接着フィルム。
- 常温で5%〜10%伸張時に発生するモジュラスが50MPa以上であり、
常温で引張率が500%以下である、半導体用接着フィルム。 - 前記接着フィルムは、リードフレームまたは基板とダイとを接着するか、ダイとダイとを接着するダイアタッチフィルム(DAF)として使用される、請求項11に記載の半導体用接着フィルム。
- −10℃〜20℃のガラス転移温度を有する熱可塑性樹脂、70℃以上の軟化点を有するフェノール樹脂を含む硬化剤、液状エポキシ樹脂、および固状エポキシ樹脂を含む、請求項11に記載の半導体用接着フィルム。
- 前記熱可塑性樹脂に対する前記固状エポキシ樹脂および液状エポキシ樹脂の総含有量の重量比が1.6〜2.6である、請求項13に記載の半導体用接着フィルム。
- 前記熱可塑性樹脂、フェノール樹脂、および液状エポキシ樹脂の全重量に対する前記フェノール樹脂の重量比が0.280以上である、請求項13に記載の半導体用接着フィルム。
- 110℃の温度および5rad/sの剪断速度で1,000Pa・s〜4,000Pa・sの溶融粘度を有し、
常温で5%〜10%伸張時に発生するモジュラスが50MPa以上であり、
常温で引張率が500%以下である、半導体用接着フィルム。 - 前記接着フィルムは、リードフレームまたは基板とダイとを接着するか、ダイとダイとを接着するダイアタッチフィルム(DAF)として使用される、請求項16に記載の半導体用接着フィルム。
- 前記接着フィルムは、1μm〜300μmの厚さを有する、請求項16に記載の半導体用接着フィルム。
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US20170233610A1 (en) | 2017-08-17 |
JP6536919B2 (ja) | 2019-07-03 |
JP6470848B2 (ja) | 2019-02-13 |
KR101832450B1 (ko) | 2018-04-13 |
KR101843900B1 (ko) | 2018-03-30 |
US10865329B2 (en) | 2020-12-15 |
CN106459719A (zh) | 2017-02-22 |
US20170198182A1 (en) | 2017-07-13 |
TWI664257B (zh) | 2019-07-01 |
US10759971B2 (en) | 2020-09-01 |
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