JP6348981B2 - 半導体接着用樹脂組成物、接着フィルム、ダイシングダイボンディングフィルムおよび半導体装置 - Google Patents
半導体接着用樹脂組成物、接着フィルム、ダイシングダイボンディングフィルムおよび半導体装置 Download PDFInfo
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- JP6348981B2 JP6348981B2 JP2016549579A JP2016549579A JP6348981B2 JP 6348981 B2 JP6348981 B2 JP 6348981B2 JP 2016549579 A JP2016549579 A JP 2016549579A JP 2016549579 A JP2016549579 A JP 2016549579A JP 6348981 B2 JP6348981 B2 JP 6348981B2
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- epoxy resin
- film
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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Description
本出願は、2014年12月24日付の韓国特許出願第10−2014−0188717号および2015年12月22日付の韓国特許出願第10−2015−0184155号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示された全ての内容は本明細書の一部として含まれる。
本発明は、半導体接着用樹脂組成物、接着フィルム、ダイシングダイボンディングフィルムおよび半導体装置に関する。
実施例1
(1)半導体接着用樹脂組成物溶液の製造
エポキシ樹脂として、ビフェニルノボラックエポキシ樹脂(NC−3000−H、日本化薬社、エポキシ当量:288g/eq、軟化点:65℃)50g、ビスフェノールAノボラックエポキシ樹脂(MF8080EK80、日本JSI社、エポキシ当量:218g/eq、軟化点:65℃)50g、フェノール樹脂KPH−3075(コーロン油化、水酸基当量:180g/eq、軟化点65℃)、熱可塑性アクリレート樹脂KG−3015(85℃および85%RHの条件で165時間露出時の吸湿率:1.2wt%)482g、硬化促進剤2−フェニル−4−メチル−5−ジヒドロキシメチルイミダゾール(2P4MHZ、四国化成)0.5g、カップリング剤ガンマ−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学)2g、および充填剤R−972(デンカ、球状シリカ、平均粒径17mm)68gをメチルエチルケトンに溶解して、半導体接着用樹脂組成物溶液(固形分20重量%濃度)を得た。
前記製造された半導体接着用樹脂組成物溶液をポリエチレンテレフタレートフィルム(厚さ38μm)上に塗布した後、130℃で3分間乾燥して、20μmの厚さの接着フィルムを得た。
下記表1の成分および含有量を用いて半導体接着用樹脂組成物溶液(メチルエチルケトン20重量%濃度)を製造した点を除いて、実施例1と同様の方法で半導体用接着フィルムを製造した。
下記表1の成分および含有量を用いて半導体接着用樹脂組成物溶液(メチルエチルケトン20重量%濃度)を製造した点を除いて、実施例1と同様の方法で半導体用接着フィルムを製造した。
SHB−1101:ビスフェノールAノボラックフェノール樹脂(シンアT&C、水酸基当量:118g/eq、軟化点:110℃)
NC−3000−H:ビフェニルノボラックエポキシ樹脂(エポキシ当量180g/eq、軟化点65℃)
MF8080EK20:ビスフェノールAエポキシ樹脂(エポキシ当量218g/eq、軟化点60℃)
KG−3015:アクリレート系樹脂(グリシジルメタクリレート系繰り返し単位3重量%、ガラス転移温度:10℃、85℃および85%RHの条件で165時間露出時の吸湿率:1.2wt%)
KG−3047:アクリレート系樹脂(グリシジルメタクリレート系繰り返し単位3重量%、ガラス転移温度:30℃、85℃および85%RHの条件で165時間露出時の吸湿率:1.7wt%)
KG−3060:アクリレート系樹脂(グリシジルメタクリレート系繰り返し単位2重量%、ガラス転移温度:5℃、85℃および85%RHの条件で165時間露出時の吸湿率:0.8wt%)。
実験例1:半導体用接着フィルムの熱硬化後、260℃での引張貯蔵弾性率の測定
前記実施例および比較例でそれぞれ得られた接着フィルムを60℃の条件下で厚さ320μmになるまで重ねて積層した後、125℃の温度で1時間および175℃の温度で2時間熱硬化させた。そして、前記熱硬化結果物を切断して、長さ20mmおよび幅4mmの六面体の試験片を製造した。
(1)ダイシングフィルムの製造
2−エチルヘキシルアクリレート75g、2−エチルヘキシルメタクリレート10g、および2−ヒドロキシエチルアクリレート15gをエチルアクリレート溶媒300g下で共重合して、重量平均分子量が850,000の共重合体(ガラス転移温度が10℃)を得た後、これに光硬化物質のアクリルイソシアネート化合物10gを添加して反応物を得た。その後、これに多官能イソシアネートオリゴマー10gと、光開始剤としてダロキュアTPOを1g混合して、紫外線硬化型粘着剤組成物を製造した。
前記過程で得られた粘着層および前記実施例および比較例でそれぞれ得られた接着フィルムを合紙して、ダイシングダイボンディング用多層構造の接着フィルムを製造した。
二酸化膜でコーティングされた厚さ500umのウエハを用いて5mmx5mmの大きさに切断した後、前記製造されたダイシングダイボンディングフィルムと共に、60℃の条件でラミネーションし、UVを照射してダイシングフィルムを除去した後、チップの大きさの接着フィルムだけを残して切断した。10mmx10mmの大きさの下部チップに5mmx5mmの大きさの上部チップを載せた後、130℃のホットプレート上で2kgfの力で2秒間押し付けて試験片を作製し、125℃で1時間の硬化と175℃で2時間の硬化を順次に進行させて、250℃でDAGE4000 DST Testerを用いて上部チップのダイシェア強度を測定した。
前記実施例および比較例でそれぞれ得られた接着フィルムを60℃の条件下で厚さ550μmになるまで重ねて積層した後、各辺の長さが5cmの六面体の試験片を製造し、175℃の温度で2時間熱硬化させた。熱硬化した試験片を85℃および85%RHの条件で165時間露出し、吸湿前後の重量を測定して吸湿度を測定した。
(吸湿後の試験片の重量−吸湿前の試験片の重量)*100/吸湿前の試験片の重量
実験例4:信頼性評価(Precon TEST)
二酸化膜でコーティングされた厚さ80μmのウエハを、前記実験例2に記載の方法で製造されたダイシングダイボンディングフィルムと共に60℃の条件でラミネーションし、10mm*10mm(横*縦)の大きさに切断して試験片を準備した。
二酸化膜でコーティングされた厚さ80μmのウエハを、前記実験例2に記載の方法で製造されたダイシングダイボンディングフィルムと共に60℃の条件でラミネーションし、10mm*10mm(横*縦)の大きさに切断して試験片を準備した。
Claims (19)
- 85℃および85%RHの条件で165時間露出時の吸湿率が1.5重量%以下の熱可塑性樹脂;
50℃〜100℃の軟化点を有するビフェニル系エポキシ樹脂を含むエポキシ樹脂;および
フェノール樹脂を含む硬化剤;を含み、
固形分中の前記ビフェニル系エポキシ樹脂の含有量が5重量%〜25重量%であり、
前記熱可塑性樹脂は、エポキシ系官能基を含む(メタ)アクリレート系繰り返し単位を0.1重量%〜10重量%含み、−10℃〜20℃のガラス転移温度を有する(メタ)アクリレート系樹脂を含む
半導体接着用樹脂組成物。 - 前記ビフェニル系エポキシ樹脂は、ビフェニルノボラックエポキシ樹脂を含む、請求項1に記載の半導体接着用樹脂組成物。
- 前記エポキシ樹脂は、ビスフェノールAエポキシ樹脂、ビスフェノールFエポキシ樹脂、クレゾールノボラックエポキシ樹脂、フェノールノボラックエポキシ樹脂、4官能性エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、アルキル変性トリフェノールメタン型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、およびジシクロペンタジエン変性フェノール型エポキシ樹脂からなる群より選択された1種以上の樹脂をさらに含む、請求項1または2に記載の半導体接着用樹脂組成物。
- 前記エポキシ樹脂は、100〜5,000の平均エポキシ当量を有する、請求項1〜3のいずれか一項に記載の半導体接着用樹脂組成物。
- 前記フェノール樹脂は、80g/eq〜300g/eqの水酸基当量および60℃〜150℃の軟化点を有する、請求項1〜4のいずれか一項に記載の半導体接着用樹脂組成物。
- 前記エポキシ樹脂100重量部対比、前記熱可塑性樹脂50〜1,000重量部および前記硬化剤30〜700重量部を含む、請求項1〜5のいずれか一項に記載の半導体接着用樹脂組成物。
- 前記硬化剤は、アミン系硬化剤、および酸無水物系硬化剤からなる群より選択された1種以上の化合物をさらに含む、請求項1〜6のいずれか一項に記載の半導体接着用樹脂組成物。
- リン系化合物、ホウ素系化合物およびリン−ホウ素系化合物、およびイミダゾール系化合物からなる群より選択された1種以上の硬化触媒をさらに含む、請求項1〜7のいずれか一項に記載の半導体接着用樹脂組成物。
- カップリング剤および無機充填剤からなる群より選択された1種以上の添加剤をさらに含む、請求項1〜8のいずれか一項に記載の半導体接着用樹脂組成物。
- 請求項1〜9のいずれか一項に記載の半導体接着用樹脂組成物の硬化物を含む接着フィルム。
- 85℃および85%RHの条件で165時間露出時の前記接着フィルムの吸湿率が1.5重量%以下である、請求項10に記載の接着フィルム。
- 前記接着フィルムは、1μm〜50μmの厚さを有する、請求項10または11に記載の接着フィルム。
- 基材フィルム;前記基材フィルム上に形成される粘着層;および前記粘着層上に形成され、請求項1〜9のいずれか一項に記載の半導体接着用樹脂組成物を含む接着層;を含むダイシングダイボンディングフィルム。
- 85℃および85%RHの条件で165時間露出時の前記接着層の吸湿率が1.5重量%以下である、請求項13に記載のダイシングダイボンディングフィルム。
- 前記粘着層は、紫外線硬化型粘着剤または熱硬化型粘着剤を含む、請求項13または14に記載のダイシングダイボンディングフィルム。
- 前記基材フィルムは、10μm〜200μmの厚さを有し、
前記粘着層は、10μm〜500μmの厚さを有し、
前記接着フィルムは、1μm〜50μmの厚さを有する、請求項13〜15のいずれか一項に記載のダイシングダイボンディングフィルム。 - 請求項10〜12のいずれか一項に記載の接着フィルムを介在させて第1半導体素子と被着体とが結合する構造を含む、半導体装置。
- 前記半導体装置を100℃〜200℃で硬化時、前記接着フィルムおよび第1半導体素子の接する面や前記接着フィルムの内部に発生するボイド(void)の面積が1%以下である、請求項17に記載の半導体装置。
- 前記被着体は、基板、絶縁層、または第2半導体素子である、請求項17または18に記載の半導体装置。
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KR20140188717 | 2014-12-24 | ||
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KR10-2015-0184155 | 2015-12-22 | ||
KR1020150184155A KR101799499B1 (ko) | 2014-12-24 | 2015-12-22 | 반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치 |
PCT/KR2015/014199 WO2016105134A1 (ko) | 2014-12-24 | 2015-12-23 | 반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치 |
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