JP2017195271A - Cleaning device - Google Patents

Cleaning device Download PDF

Info

Publication number
JP2017195271A
JP2017195271A JP2016084419A JP2016084419A JP2017195271A JP 2017195271 A JP2017195271 A JP 2017195271A JP 2016084419 A JP2016084419 A JP 2016084419A JP 2016084419 A JP2016084419 A JP 2016084419A JP 2017195271 A JP2017195271 A JP 2017195271A
Authority
JP
Japan
Prior art keywords
plate
cleaning
holder
cleaning member
holding means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016084419A
Other languages
Japanese (ja)
Other versions
JP6661453B2 (en
Inventor
倫太郎 茶野
Rintaro Chano
倫太郎 茶野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2016084419A priority Critical patent/JP6661453B2/en
Priority to TW106107999A priority patent/TWI711494B/en
Priority to KR1020170045180A priority patent/KR102264628B1/en
Publication of JP2017195271A publication Critical patent/JP2017195271A/en
Application granted granted Critical
Publication of JP6661453B2 publication Critical patent/JP6661453B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To excellently clean a whole surface of a plate-like object by a simple structure even when the plate-like object large in warp.SOLUTION: A cleaning device (1) comprises: holding means (10) of holding a plate-like object (W) at an external periphery and rotating the object to a peripheral direction; cleaning means (20) of cleaning the plate-like object in rotation; and cleaning liquid injection means of injecting a cleaning liquid onto an upper surface (Wa) and a lower surface (Wb) of the plate-like object in rotation. The cleaning means includes a cleaning member (23) that cleans the plate-like object so as to be contacted onto the upper surface of the plate-like object; a fluctuation part (21) that fluctuates the cleaning member to a radial direction of the plate-like object; and a follow-up mechanism (22) in which the cleaning member follow-ups to the upper surface of the plate-like object by contacting the cleaning member to the upper surface of the plate-like object to be curved. The cleaning means is constructed so as to be contacted onto the upper surface of the plate-like object held by the holding means, and cleaned the upper surface of the plate-like object along the upper surface of the plate-like object by the cleaning member.SELECTED DRAWING: Figure 4

Description

本発明は、ウェーハを洗浄する洗浄装置に関する。   The present invention relates to a cleaning apparatus for cleaning a wafer.

加工装置で加工されたウェーハ等の板状物にはコンタミ等の加工屑が付着するため、スピンナ装置等の洗浄装置によって板状物が洗浄される。この種の洗浄装置として、板状物の外周縁を保持して板状物の上面及び下面を非接触で洗浄するものが知られている(例えば、特許文献1参照)。特許文献1に記載の洗浄装置では、把持クランプで板状物の外周縁の3点が保持された状態で、上方のノズルから板状物の上面に洗浄液が噴射されると共に、下方のノズルから板状物の下面に洗浄液が噴射されて、板状物の上面及び下面が同時に洗浄される。   Since processing waste such as contamination adheres to a plate-like object such as a wafer processed by the processing apparatus, the plate-like object is cleaned by a cleaning device such as a spinner device. As this type of cleaning apparatus, an apparatus that holds the outer peripheral edge of a plate-like object and cleans the upper and lower surfaces of the plate-like object in a non-contact manner is known (for example, see Patent Document 1). In the cleaning device described in Patent Document 1, the cleaning liquid is sprayed from the upper nozzle to the upper surface of the plate-like object while the three points on the outer peripheral edge of the plate-like object are held by the grip clamp, and from the lower nozzle. The cleaning liquid is sprayed onto the lower surface of the plate-like object, and the upper and lower surfaces of the plate-like object are simultaneously cleaned.

また、洗浄装置として、ノズルから洗浄液の噴射による洗浄力不足を補うために、スポンジ等で板状物の上面を擦ってスクラブ洗浄する洗浄装置が知られている(例えば、特許文献2参照)。特許文献2に記載の洗浄装置では、洗浄テーブル上の板状物に対して上方のノズルから洗浄液が噴射されて、筒状のスポンジロールが板状物の上面に回転当接することで板状物の上面が洗浄される。このとき、板状物の直径以上のスポンジロールが使用されて、スポンジロールに対して板状物が相対移動することで板状物の上面全体にスポンジロールを当接させることが可能になっている。   In addition, as a cleaning device, a cleaning device that scrubs and cleans the upper surface of a plate-like object with a sponge or the like is known in order to compensate for a lack of cleaning power due to the ejection of cleaning liquid from a nozzle (see, for example, Patent Document 2). In the cleaning apparatus described in Patent Document 2, the cleaning liquid is sprayed from the upper nozzle to the plate-like object on the cleaning table, and the cylindrical sponge roll is brought into rotational contact with the upper surface of the plate-like object. The top surface of is cleaned. At this time, a sponge roll having a diameter larger than that of the plate-like object is used, and the sponge roll can be brought into contact with the entire upper surface of the plate-like object by moving the plate-like object relative to the sponge roll. Yes.

特開平11−031643号公報Japanese Patent Laid-Open No. 11-031643 特開2014−110270号公報JP 2014-110270 A

しかしながら、板状物の外周縁を保持する洗浄装置でスポンジロールを用いたスクラブ洗浄を実施する場合には、反りの激しい板状物に対してはスポンジロールで良好に洗浄することができない。すなわち、板状物の反りが激しいと、スポンジロールと板状物とが部分的にしか当接せず、板状物の全面をスポンジロールでスクラブ洗浄することが困難であった。板状物の反りに応じてスポンジロールを鉛直方向に上下動させる機構を備えることも考えられるが、洗浄装置の装置構成が複雑になってコストが増大してしまうという問題があった。   However, when scrub cleaning using a sponge roll is performed with a cleaning device that holds the outer peripheral edge of the plate-like object, it is not possible to clean the plate-like object that is severely warped with the sponge roll. That is, if the warpage of the plate-like material is severe, the sponge roll and the plate-like material are only partially in contact with each other, and it is difficult to scrub clean the entire surface of the plate-like material with the sponge roll. Although it is conceivable to provide a mechanism for moving the sponge roll up and down in the vertical direction in accordance with the warpage of the plate-like object, there is a problem in that the configuration of the cleaning device becomes complicated and the cost increases.

本発明はかかる点に鑑みてなされたものであり、反りの激しい板状物であっても、簡易な構成で板状物の全面を良好に洗浄することができる洗浄装置を提供することを目的とする。   The present invention has been made in view of the above points, and an object of the present invention is to provide a cleaning device that can satisfactorily clean the entire surface of a plate-like object with a simple configuration even if it is a plate-like object that is severely warped. And

本発明の洗浄装置は、板状物を外周縁で保持して板状物を周方向に回転させる保持手段と、該保持手段によって保持され回転している板状物を洗浄する洗浄手段と、該保持手段に保持された板状物の上面及び下面のそれぞれに洗浄液を噴射する洗浄液噴射手段とを備えた洗浄装置であって、該洗浄手段は、板状物の上面に当接して板状物を洗浄する洗浄部材と、該洗浄部材を板状物の径方向に揺動させると共に湾曲した板状物の上面に追従する揺動部とを備え、該保持手段に保持された板状物の上面に当接し該洗浄部材が板状物の上面に沿って板状物の上面を洗浄することを特徴とする。   The cleaning device of the present invention comprises a holding means for holding the plate-like object at the outer peripheral edge and rotating the plate-like object in the circumferential direction, a cleaning means for washing the plate-like object held and rotating by the holding means, A cleaning device including cleaning liquid spraying means for spraying cleaning liquid onto each of the upper and lower surfaces of the plate-like object held by the holding means, the cleaning means being in contact with the upper surface of the plate-like object to form a plate shape A cleaning member for cleaning the object, and a swinging part that swings the cleaning member in the radial direction of the plate-like object and follows the upper surface of the curved plate-like object, and is held by the holding means And the cleaning member cleans the upper surface of the plate-like object along the upper surface of the plate-like object.

この構成によれば、板状物の外周縁が保持された状態で板状物の上面及び下面に洗浄液が噴射されると共に、板状物の上面に洗浄部材が当接されて板状物がスクラブ洗浄される。このとき、板状物が周方向に回転された状態で、洗浄部材が板状物の上面の湾曲に追従しながら板状物の径方向に揺動されるため、板状物の上面全体に洗浄部材を当接させることができる。また、洗浄部材が板状物の上面に当接して板状物の上面に沿って洗浄部材の動きが追従されるため、洗浄部材を上下方向に移動させる機構が不要になって装置構成が複雑になることがない。このように、反りの激しい板状物であっても、簡易な構成で板状物の全面を良好に洗浄することができる。   According to this configuration, the cleaning liquid is sprayed on the upper surface and the lower surface of the plate-shaped object while the outer peripheral edge of the plate-shaped object is held, and the cleaning member is brought into contact with the upper surface of the plate-shaped object so that the plate-shaped object is Scrub cleaned. At this time, the cleaning member is swung in the radial direction of the plate-like object while following the curvature of the upper surface of the plate-like object in a state where the plate-like object is rotated in the circumferential direction. The cleaning member can be brought into contact. In addition, since the cleaning member abuts on the upper surface of the plate-like object and the movement of the cleaning member follows the upper surface of the plate-like object, a mechanism for moving the cleaning member in the vertical direction is unnecessary, and the apparatus configuration is complicated. Never become. Thus, even if it is a plate-shaped object with intense curvature, the whole surface of a plate-shaped object can be wash | cleaned favorably by simple structure.

本発明の洗浄装置において、該揺動部は、揺動する先端に配設され該洗浄部材を鉛直方向にガイドする鉛直ガイドと、該洗浄部材を保持し且つ該鉛直ガイドにガイドされるホルダと、該ホルダを該鉛直ガイドにガイドされた状態で該揺動部の該先端に固定するスプリングと、を備え、該スプリングが伸縮することで該鉛直ガイドに沿って該ホルダ及び該洗浄部材が上下に揺動して湾曲した板状物の上面に追従する。   In the cleaning device of the present invention, the swinging portion is provided at a swinging tip and guides the cleaning member in the vertical direction; a holder that holds the cleaning member and is guided by the vertical guide; And a spring that fixes the holder to the tip of the swinging portion while being guided by the vertical guide, and the holder and the cleaning member are moved up and down along the vertical guide as the spring expands and contracts. And follows the upper surface of the curved plate-like object.

本発明の洗浄装置において、該揺動部の該先端に配設され鉛直下向きに延伸しているピストン部材と、該ピストン部材に係合する凹部を備え鉛直方向に駆動可能なシリンダ部材と、該シリンダ部材の該凹部内に鉛直下向きに圧縮エアーを噴射するエアー噴射口と、該シリンダ部材の下面側に配設された該洗浄部材と、を備え、該ピストン部材の該エアー噴射口から該凹部内に圧縮エアーが噴射され該凹部内に空間を有する状態で該洗浄部材が板状物に当接し、該ピストン部材に沿って該シリンダ部材及び該洗浄部材が上下に揺動して湾曲した板状物の上面に追従する。   In the cleaning device of the present invention, a piston member disposed at the tip of the swinging portion and extending vertically downward, a cylinder member having a recess engaging the piston member, and capable of being driven in the vertical direction, An air injection port for injecting compressed air vertically downward into the recess of the cylinder member, and the cleaning member disposed on the lower surface side of the cylinder member, and the recess from the air injection port of the piston member A plate in which the compressed air is injected into the concave portion and the cleaning member comes into contact with the plate-like object, and the cylinder member and the cleaning member swing up and down along the piston member. Follow the top surface of the object.

本発明によれば、洗浄部材が湾曲した板状物の上面に押し込まれることで、板状物の上面に洗浄部材の動きを追従させて、反りの激しい板状物であっても、簡易な構成で板状物の全面を良好に洗浄することができる。   According to the present invention, the cleaning member is pushed into the upper surface of the curved plate-like object so that the movement of the cleaning member follows the upper surface of the plate-like object. With the configuration, the entire surface of the plate-like object can be washed well.

本実施の形態の洗浄装置の模式図である。It is a schematic diagram of the washing | cleaning apparatus of this Embodiment. 比較例の洗浄手段による洗浄動作の説明図である。It is explanatory drawing of the washing | cleaning operation | movement by the washing | cleaning means of a comparative example. 本実施の形態の洗浄手段の斜視図及び側面模式図である。It is the perspective view and side surface schematic diagram of the washing | cleaning means of this Embodiment. 本実施の形態の洗浄手段による洗浄動作の一例を示す図である。It is a figure which shows an example of the washing | cleaning operation | movement by the washing | cleaning means of this Embodiment. 第1の変形例の洗浄手段の斜視図である。It is a perspective view of the washing | cleaning means of a 1st modification. 第2の変形例の洗浄手段の斜視図である。It is a perspective view of the washing | cleaning means of a 2nd modification.

以下、添付図面を参照して、本実施の形態の洗浄装置について説明する。図1は、本実施の形態の洗浄装置の模式図である。なお、以下に示す洗浄装置は一例を示すものであり、この構成に限定されない。   Hereinafter, with reference to the attached drawings, the cleaning apparatus of the present embodiment will be described. FIG. 1 is a schematic diagram of the cleaning apparatus of the present embodiment. In addition, the cleaning apparatus shown below shows an example and is not limited to this configuration.

図1に示すように、洗浄装置1は、いわゆるエッジクランプ式の洗浄装置であって、加工済みの板状物Wの外周縁を保持することによって、保持手段10のテーブル面13から板状物Wを浮かせた状態で洗浄するように構成されている。洗浄装置1ではテーブル面13に対して板状物Wが非接触で洗浄されるため、板状物Wの下面Wbにコンタミ等の加工屑の付着し難くなっている。なお、板状物Wは、洗浄対象になるものであればよく、例えば、シリコン、ガリウム砒素等の半導体基板、サファイア、炭化ケイ素等の無機材料基板、電子部品に使用される各種セラミック基板でもよい。   As shown in FIG. 1, the cleaning device 1 is a so-called edge clamp type cleaning device, and holds the outer peripheral edge of a processed plate-like object W, thereby removing the plate-like object from the table surface 13 of the holding means 10. It is comprised so that it may wash | clean in the state which floated W. In the cleaning apparatus 1, the plate-like object W is washed in a non-contact manner with respect to the table surface 13, so that it is difficult for processing waste such as contamination to adhere to the lower surface Wb of the plate-like object W. In addition, the plate-like object W should just be a washing | cleaning object, for example, may be various ceramic substrates used for semiconductor substrates, such as silicon and gallium arsenide, inorganic material substrates, such as sapphire and silicon carbide, and an electronic component. .

洗浄装置1の保持手段10は、板状物Wの外周縁を複数(本実施の形態では4つ)のクランプアーム11で保持して、各クランプアーム11が取り付けられた回転テーブル12によって板状物Wを週方向に回転させている。各クランプアーム11は、回転テーブル12の外周部分に揺動可能に連結されており、バネやエアーシリンダ等から成る開閉機構によって動かされている。各クランプアーム11の先端側が回転テーブル12の内側に傾くことで板状物Wの外周縁が保持され、各クランプアーム11の先端側が回転テーブル12の外側に傾くことで板状物Wの外周縁が解放される。   The holding means 10 of the cleaning apparatus 1 holds the outer peripheral edge of the plate-like object W with a plurality of (four in this embodiment) clamp arms 11 and is plate-like by a rotary table 12 to which each clamp arm 11 is attached. The object W is rotated in the week direction. Each clamp arm 11 is connected to the outer peripheral portion of the rotary table 12 so as to be swingable, and is moved by an opening / closing mechanism including a spring, an air cylinder and the like. The outer peripheral edge of the plate-like object W is held by tilting the distal end side of each clamp arm 11 toward the inner side of the rotary table 12, and the outer peripheral edge of the plate-like object W is inclined by tilting the distal end side of each clamp arm 11 to the outer side of the rotary table 12. Is released.

回転テーブル12の下部には駆動モータ(不図示)が連結されており、駆動モータによって回転テーブル12が鉛直軸回りに回転される。回転テーブル12のテーブル面13の中心には、板状物Wの下面Wbに洗浄液を噴射する噴射口14が形成されている。回転テーブル12の上方には、板状物Wの上面Waに洗浄液を噴射する噴射ノズル15が位置付けられている。噴射口14及び噴射ノズル15には洗浄液の供給源16、17が接続されており、これら噴射口14、噴射ノズル15、供給源16、17によって洗浄液噴射手段が構成されている。また、洗浄装置1には、保持手段10に保持されている回転中の板状物Wを洗浄する洗浄手段20が設けられている。   A drive motor (not shown) is connected to the lower part of the turntable 12, and the turntable 12 is rotated around the vertical axis by the drive motor. In the center of the table surface 13 of the rotary table 12, an injection port 14 for injecting the cleaning liquid onto the lower surface Wb of the plate-like object W is formed. Above the turntable 12, an injection nozzle 15 that injects the cleaning liquid onto the upper surface Wa of the plate-like object W is positioned. Cleaning liquid supply sources 16 and 17 are connected to the injection port 14 and the injection nozzle 15, and a cleaning liquid injection unit is configured by the injection port 14, the injection nozzle 15, and the supply sources 16 and 17. Further, the cleaning device 1 is provided with a cleaning means 20 for cleaning the rotating plate-like object W held by the holding means 10.

ところで、図2の比較例に示すように、一般的な洗浄手段90は、水平方向にスクラブ洗浄するように構成されており、板状物Wが保持手段10(図1参照)に対して水平姿勢で保持されていることが前提になっている。このため、板状物Wに反りが生じていると、板状物Wの全面に均一に洗浄部材91を当接させることができない。すなわち、板状物Wの高い位置と低い位置とでは洗浄部材91の当たり具合やスポンジ部分の潰れ具合が変わり、板状物Wに対して均一な条件でスクラブ洗浄することができない。このため、板状物Wの表面にコンタミ等の加工物が残ってしまうおそれがあった。   By the way, as shown in the comparative example of FIG. 2, the general cleaning means 90 is configured to perform scrub cleaning in the horizontal direction, and the plate-like object W is horizontal to the holding means 10 (see FIG. 1). It is assumed that it is held in a posture. For this reason, if the plate-like object W is warped, the cleaning member 91 cannot be uniformly brought into contact with the entire surface of the plate-like object W. That is, the contact state of the cleaning member 91 and the crushing state of the sponge portion change between the high position and the low position of the plate-like object W, and scrub cleaning cannot be performed on the plate-like object W under uniform conditions. For this reason, there is a concern that a workpiece such as contamination may remain on the surface of the plate-like object W.

この場合、板状物Wの反りに応じて洗浄手段90を鉛直方向に上下動させる機構を設けることも考えられるが、電気的な制御が必要になって洗浄手段90の構造が複雑になるという問題があった。また通常、機械的な構造には強度を考慮して金属製の部品が用いられるが、重量が増加すると共に洗浄液に使用される薬品によって腐食する恐れがあった。そこで、本実施の形態では、板状物Wに洗浄部材23が当接したときに板状物Wの上面Waに洗浄部材23の動きを追従させるようにしている。また、軽量で耐薬品性の高い樹脂材料を用いて洗浄手段20を形成するようにしている。   In this case, it is conceivable to provide a mechanism for moving the cleaning means 90 up and down in the vertical direction in accordance with the warp of the plate-like object W. However, electrical control is required and the structure of the cleaning means 90 is complicated. There was a problem. In general, metal parts are used for the mechanical structure in consideration of strength, but the weight increases and there is a risk of corrosion by chemicals used in the cleaning liquid. Therefore, in the present embodiment, when the cleaning member 23 comes into contact with the plate-like object W, the movement of the cleaning member 23 is caused to follow the upper surface Wa of the plate-like object W. Further, the cleaning means 20 is formed using a resin material that is lightweight and has high chemical resistance.

以下、図3を参照して、本実施の形態の洗浄手段について詳細に説明する。図3は、本実施の形態の洗浄手段の斜視図及び側面模式図である。なお、図3Aは洗浄手段の斜視図、図3Bは洗浄手段の側面模式図をそれぞれ示している。   Hereinafter, with reference to FIG. 3, the cleaning means of the present embodiment will be described in detail. FIG. 3 is a perspective view and a schematic side view of the cleaning means of the present embodiment. 3A is a perspective view of the cleaning means, and FIG. 3B is a schematic side view of the cleaning means.

図3A及び図3Bに示すように、洗浄手段20は、保持手段10(図1参照)によって板状物Wが周方向に回転した状態で、揺動部21で洗浄部材23を板状物Wの径方向に揺動させ、洗浄部材23を板状物Wの上面Waに当接させて板状物Wの上面Waを洗浄するように構成されている。揺動部21の揺動アーム29は、樹脂材料によって長尺に形成されており、基端側の揺動軸(不図示)に回転可能に軸支されている。揺動部21は、洗浄部材23を板状物Wの上面Waの湾曲に追従させる追従機構22を備えている。また、揺動部21には、この追従機構22を介して部材ホルダ36に収容された洗浄部材23が取り付けられている。   As shown in FIGS. 3A and 3B, the cleaning means 20 is configured such that the cleaning member 23 is moved by the swinging portion 21 while the plate-like object W is rotated in the circumferential direction by the holding means 10 (see FIG. 1). The cleaning member 23 is brought into contact with the upper surface Wa of the plate-like object W to wash the upper surface Wa of the plate-like object W. The swing arm 29 of the swing portion 21 is formed in a long shape with a resin material, and is rotatably supported by a swing shaft (not shown) on the base end side. The oscillating portion 21 includes a follow-up mechanism 22 that causes the cleaning member 23 to follow the curvature of the upper surface Wa of the plate-like object W. Further, the cleaning member 23 accommodated in the member holder 36 is attached to the swinging portion 21 via the follow-up mechanism 22.

追従機構22は、揺動アーム29の先端側に固定されたガイドプレート25と洗浄部材23を保持するホルダプレート(ホルダ)31とがスプリング35で連結されて構成されている。ガイドプレート25は、樹脂材料の縦板部26と横板部27とによって側面視逆L字状に形成されている。ガイドプレート25の縦板部26の前面には、ホルダプレート31を介して洗浄部材23を鉛直方向にガイドする一対の鉛直ガイド28が水平方向に間を空けて設けられている。ガイドプレート25の横板部27の下面には、樹脂材料で形成されたスプリング35の上端が連結されている。   The follow-up mechanism 22 includes a guide plate 25 fixed to the distal end side of the swing arm 29 and a holder plate (holder) 31 that holds the cleaning member 23 connected by a spring 35. The guide plate 25 is formed in a reverse L shape in a side view by a vertical plate portion 26 and a horizontal plate portion 27 made of a resin material. A pair of vertical guides 28 that guide the cleaning member 23 in the vertical direction via the holder plate 31 are provided on the front surface of the vertical plate portion 26 of the guide plate 25 with a gap in the horizontal direction. An upper end of a spring 35 made of a resin material is connected to the lower surface of the horizontal plate portion 27 of the guide plate 25.

ホルダプレート31は、樹脂材料で揺動部21の延長方向に延びる長尺状に形成されている。ホルダプレート31の基端側には、一対の鉛直ガイド28によって鉛直方向にガイドされるスライダ32が立設しており、スライダ32の上面にはスプリング35の下端が連結されている。ホルダプレート31の先端側には、部材ホルダ(ホルダ)36を取り付け可能な開口33が形成されている。部材ホルダ36は、樹脂材料で円筒状に形成された上部ホルダ37と下部ホルダ38とからなっており、各ホルダの上端側のフランジ部分を介してホルダプレート31にネジ止めされている。   The holder plate 31 is formed in a long shape extending in the extending direction of the swinging portion 21 with a resin material. A slider 32 guided in the vertical direction by a pair of vertical guides 28 is erected on the base end side of the holder plate 31, and the lower end of the spring 35 is connected to the upper surface of the slider 32. An opening 33 to which a member holder (holder) 36 can be attached is formed at the distal end side of the holder plate 31. The member holder 36 includes an upper holder 37 and a lower holder 38 formed in a cylindrical shape with a resin material, and is screwed to the holder plate 31 via a flange portion on the upper end side of each holder.

上部ホルダ37と下部ホルダ38は、下部ホルダ38の筒状部分の内側に上部ホルダ37の筒状部分が入り込むようにして組み合わされ、上部ホルダ37の筒状部分の下端と下部ホルダ38の底壁部分との間に洗浄部材23が取り付けられている。下部ホルダ38の底壁部分には開口39が形成されており、この開口39を通じて洗浄部材23が下部ホルダ38から下方に突出している。洗浄部材23は、PVA(Polyvinyl Alcohol)でスポンジ状に形成されており、上部ホルダ37の筒状部分と下部ホルダ38の底壁部分とで挟み込むようにして部材ホルダ36に固定されている。   The upper holder 37 and the lower holder 38 are combined so that the cylindrical portion of the upper holder 37 enters inside the cylindrical portion of the lower holder 38, and the lower end of the cylindrical portion of the upper holder 37 and the bottom wall of the lower holder 38 are combined. A cleaning member 23 is attached between the portions. An opening 39 is formed in the bottom wall portion of the lower holder 38, and the cleaning member 23 projects downward from the lower holder 38 through the opening 39. The cleaning member 23 is formed in a sponge shape from PVA (Polyvinyl Alcohol), and is fixed to the member holder 36 so as to be sandwiched between the cylindrical portion of the upper holder 37 and the bottom wall portion of the lower holder 38.

洗浄手段20では、湾曲した板状物Wの上面Waによって洗浄部材23が押し込まれることで、洗浄部材23が板状物Wの上面Waの湾曲に追従される。すなわち、湾曲した板状物Wの上面Waに洗浄部材23が当接すると、板状物Wの湾曲に応じてスプリング35が伸縮することで、一対の鉛直ガイド28に沿ってホルダプレート31、部材ホルダ36、洗浄部材23が一体的に上下に揺動する。これにより、板状物Wが周方向に回転された状態で、洗浄部材23が板状物Wの上面Waの湾曲に追従しながら板状物Wの径方向に揺動されるため、板状物Wの上面全体に洗浄部材23が当接される。なお、スプリング35としては、板状物Wの種類に応じて適切なバネ定数のものが使用される。   In the cleaning means 20, the cleaning member 23 is pushed by the curved upper surface Wa of the plate-like object W, so that the cleaning member 23 follows the curvature of the upper surface Wa of the plate-like object W. That is, when the cleaning member 23 comes into contact with the upper surface Wa of the curved plate W, the spring 35 expands and contracts according to the curve of the plate W, so that the holder plate 31 and the member along the pair of vertical guides 28. The holder 36 and the cleaning member 23 swing up and down integrally. Accordingly, the cleaning member 23 is swung in the radial direction of the plate-like object W while following the curvature of the upper surface Wa of the plate-like object W in a state where the plate-like object W is rotated in the circumferential direction. The cleaning member 23 is brought into contact with the entire top surface of the object W. As the spring 35, a spring having an appropriate spring constant according to the type of the plate-like object W is used.

図4を参照して、洗浄手段による洗浄動作について説明する。図4は、本実施の形態の洗浄手段による洗浄動作の一例を示す図である。なお、図4Aは板状物の外周縁側の洗浄状態、図4Bは板状物の中央側の洗浄状態をそれぞれ示している。   With reference to FIG. 4, the cleaning operation by the cleaning means will be described. FIG. 4 is a diagram illustrating an example of a cleaning operation by the cleaning unit of the present embodiment. 4A shows a cleaning state on the outer peripheral edge side of the plate-like object, and FIG. 4B shows a cleaning state on the center side of the plate-like object.

図4Aに示すように、保持手段10の複数のクランプアーム11によって板状物Wの外周縁が保持され、回転テーブル12によって複数のクランプアーム11に保持された板状物Wが周方向に回転される。また、回転テーブル12の噴射口14から板状物Wの下面Wbに向けて洗浄液が噴射されると共に、回転テーブル12の上方の噴射ノズル15から板状物Wの上面Waに向けて洗浄液が噴射される。そして、揺動部21が回転中の板状物Wの中心と外周縁との間で洗浄部材23を揺動させて、追従機構22によって板状物Wの湾曲に追従させながら板状物Wの上面全体に洗浄部材23を当接させている。   As shown in FIG. 4A, the outer peripheral edge of the plate-like object W is held by the plurality of clamp arms 11 of the holding means 10, and the plate-like object W held by the plurality of clamp arms 11 is rotated in the circumferential direction by the rotary table 12. Is done. Further, the cleaning liquid is ejected from the ejection port 14 of the rotary table 12 toward the lower surface Wb of the plate-like object W, and the cleaning liquid is ejected from the ejection nozzle 15 above the rotary table 12 toward the upper surface Wa of the plate-like object W. Is done. Then, the cleaning member 23 is swung between the center and the outer peripheral edge of the plate-like object W whose rotating part 21 is rotating, and the plate-like object W is caused to follow the curvature of the plate-like object W by the follow-up mechanism 22. The cleaning member 23 is brought into contact with the entire upper surface of.

この場合、板状物Wが中央から外周縁側に向かって高くなるように反っているため、洗浄部材23が板状物Wの外周縁側に位置付けられると、洗浄部材23が板状物Wの上面Waによって上方に押し込まれる。これにより、ホルダプレート31のスライダ32がガイドプレート25の一対の鉛直ガイド28によってガイドされながら上動して、ガイドプレート25とホルダプレート31を連結するスプリング35が収縮される。このように、板状物Wの上面Waの高い位置ではスプリング35の反力に抗して洗浄部材23が上動することで、板状物Wの上面Waの湾曲に洗浄部材23を追従させている。   In this case, since the plate-like object W is warped so as to become higher from the center toward the outer peripheral edge side, when the cleaning member 23 is positioned on the outer peripheral edge side of the plate-like object W, the cleaning member 23 becomes the upper surface of the plate-like object W. It is pushed upward by Wa. As a result, the slider 32 of the holder plate 31 moves upward while being guided by the pair of vertical guides 28 of the guide plate 25, and the spring 35 connecting the guide plate 25 and the holder plate 31 is contracted. As described above, the cleaning member 23 moves up against the reaction force of the spring 35 at a high position on the upper surface Wa of the plate-like object W, thereby causing the cleaning member 23 to follow the curvature of the upper surface Wa of the plate-like object W. ing.

一方、洗浄部材23が板状物Wの中央側に位置付けられると、洗浄部材23がスプリング35の反発力によって洗浄部材23が下方に僅かに押し戻される。これにより、ホルダプレート31のスライダ32がガイドプレート25の一対の鉛直ガイド28によってガイドされながら下動して、ガイドプレート25とホルダプレート31を連結するスプリング35が伸長される。このように、板状物Wの上面Waの低い位置ではスプリング35の反力によって、板状物Wの上面Waの高低差分だけ洗浄部材23が下動することで、板状物Wの上面Waの湾曲に洗浄部材23を追従させている。   On the other hand, when the cleaning member 23 is positioned on the center side of the plate-like object W, the cleaning member 23 is slightly pushed back by the repulsive force of the spring 35. As a result, the slider 32 of the holder plate 31 moves downward while being guided by the pair of vertical guides 28 of the guide plate 25, and the spring 35 connecting the guide plate 25 and the holder plate 31 is extended. As described above, the cleaning member 23 moves down by the height difference of the upper surface Wa of the plate-like object W by the reaction force of the spring 35 at a position where the upper surface Wa of the plate-like object W is low, so that the upper surface Wa of the plate-like object W is lowered. The cleaning member 23 is caused to follow the curve.

このように、板状物Wの上面Waの湾曲に洗浄部材23を追従させることで、板状物Wの上面全体に洗浄部材23を当接させている。よって、板状物Wの高い位置と低い位置とで洗浄部材23の当たり具合やスポンジ部分の潰れ具合を略同じにして、板状物Wに対して略均一な条件でスクラブ洗浄することが可能になっている。また、洗浄手段20の全体が耐薬品性の高い樹脂材料を用いて形成されているため、洗浄液に薬品が含まれる場合であっても、金属のように薬品によって洗浄手段20が腐食することがなく、さらに金属と比較して軽量化を図ることができる。   In this way, the cleaning member 23 is brought into contact with the entire upper surface of the plate-like object W by causing the cleaning member 23 to follow the curvature of the upper surface Wa of the plate-like object W. Therefore, scrub cleaning can be performed on the plate-like object W under substantially uniform conditions by making the contact state of the cleaning member 23 and the crushing state of the sponge portion substantially the same at the high position and the low position of the plate-like object W. It has become. In addition, since the entire cleaning unit 20 is formed using a resin material having high chemical resistance, the cleaning unit 20 may be corroded by the chemical like metal even when the cleaning liquid contains the chemical. In addition, the weight can be reduced as compared with metal.

以上のように、本実施の形態の洗浄装置1では、板状物Wの外周縁が保持された状態で板状物Wの上面Wa及び下面Wbに洗浄液が噴射されると共に、板状物Wの上面Waに洗浄部材23が当接されて板状物Wがスクラブ洗浄される。このとき、板状物Wが周方向に回転された状態で、洗浄部材23が板状物Wの上面Waの湾曲に追従しながら板状物Wの径方向に揺動されるため、板状物Wの上面全体に洗浄部材23を当接させることができる。また、洗浄部材23が板状物Wの上面Waに当接して、板状物Wの上面Waに沿って洗浄部材23の動きが追従されるため、洗浄部材23を上下方向に移動させる機構が不要になって装置構成が複雑になることがない。このように、反りの激しい板状物Wであっても、簡易な構成で板状物Wの全面を良好に洗浄することができる。   As described above, in the cleaning device 1 according to the present embodiment, the cleaning liquid is sprayed onto the upper surface Wa and the lower surface Wb of the plate-like object W while the outer peripheral edge of the plate-like object W is held, and the plate-like object W is used. The cleaning member 23 is brought into contact with the upper surface Wa of the plate to clean the plate-like object W. At this time, in the state where the plate-like object W is rotated in the circumferential direction, the cleaning member 23 is swung in the radial direction of the plate-like object W while following the curvature of the upper surface Wa of the plate-like object W. The cleaning member 23 can be brought into contact with the entire upper surface of the object W. Further, since the cleaning member 23 comes into contact with the upper surface Wa of the plate-like object W and the movement of the cleaning member 23 is followed along the upper surface Wa of the plate-like object W, a mechanism for moving the cleaning member 23 in the vertical direction is provided. There is no need to complicate the apparatus configuration. Thus, even if it is the plate-shaped object W with intense curvature, the whole surface of the plate-shaped object W can be wash | cleaned favorably by simple structure.

なお、本発明は上記実施の形態に限定されず、種々変更して実施することが可能である。上記実施の形態において、添付図面に図示されている大きさや形状などについては、これに限定されず、本発明の効果を発揮する範囲内で適宜変更することが可能である。その他、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施することが可能である。   In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

例えば、本実施の形態では、洗浄手段20がスプリング35の伸縮によってホルダプレート31が上下方向に揺動させて、ホルダプレート31の先端に固定された洗浄部材23を板状物Wの湾曲に追従させる構成にしたが、この構成に限定されない。洗浄手段20は、湾曲した板状物Wの上面に当接することで洗浄部材23が板状物Wの上面に追従する追従機構22を備えていればよい。以下、図5及び図6を参照して、洗浄手段の変形例について説明する。なお、変形例の洗浄手段では、本実施の形態と同一の構成については説明を省略する。   For example, in this embodiment, the cleaning means 20 causes the holder plate 31 to swing in the vertical direction by the expansion and contraction of the spring 35, and the cleaning member 23 fixed to the tip of the holder plate 31 follows the curvature of the plate-like object W. However, the present invention is not limited to this configuration. The cleaning means 20 only needs to include a follow-up mechanism 22 in which the cleaning member 23 follows the upper surface of the plate-like object W by contacting the upper surface of the curved plate-like object W. Hereinafter, with reference to FIG.5 and FIG.6, the modification of a washing | cleaning means is demonstrated. In the cleaning means of the modified example, the description of the same configuration as that of the present embodiment is omitted.

図5に示すように、第1の変形例の洗浄手段40において、揺動部41の追従機構42は、揺動アーム49の先端側にL字プレート45を介して延長プレート48が取り付けられ、延長プレート48と部材ホルダ56とを複数(本実施の形態では3つ)のスプリング55で連結して構成されている。L字プレート45は、樹脂材料の縦板部46と横板部47とによって側面視逆L字状に形成されている。L字プレート45の横板部47には樹脂材料で形成された延長プレート48が固定されており、延長プレート48の下面には樹脂材料で形成された複数のスプリング55の上端が連結されている。   As shown in FIG. 5, in the cleaning means 40 of the first modified example, the follower mechanism 42 of the swing part 41 has an extension plate 48 attached to the tip side of the swing arm 49 via an L-shaped plate 45, The extension plate 48 and the member holder 56 are connected by a plurality of (three in the present embodiment) springs 55. The L-shaped plate 45 is formed in a reverse L shape in a side view by a vertical plate portion 46 and a horizontal plate portion 47 made of a resin material. An extension plate 48 made of a resin material is fixed to the horizontal plate portion 47 of the L-shaped plate 45, and upper ends of a plurality of springs 55 made of a resin material are connected to the lower surface of the extension plate 48. .

L字プレート45の縦板部46には、L字状のホルダプレート51の縦板部52が固定されており、ホルダプレート51の横板部53には部材ホルダ56を鉛直方向にガイド可能な開口(不図示)が形成されている。ホルダプレート51の開口には部材ホルダ56の筒状部分が入り込んで、部材ホルダ56のフランジ部分によってホルダプレート51に抜け止め可能に支持されている。このように、第1の変形例のホルダプレート51は、上記本実施の形態のホルダプレート31(図3参照)のように部材ホルダ56と一体に揺動する揺動部材ではなく、部材ホルダ56の鉛直方向のガイドとして機能している。   A vertical plate portion 52 of an L-shaped holder plate 51 is fixed to the vertical plate portion 46 of the L-shaped plate 45, and a member holder 56 can be guided in the vertical direction on the horizontal plate portion 53 of the holder plate 51. An opening (not shown) is formed. The cylindrical portion of the member holder 56 enters the opening of the holder plate 51 and is supported by the holder plate 51 by the flange portion of the member holder 56 so as to be prevented from coming off. Thus, the holder plate 51 of the first modification is not a swinging member that swings integrally with the member holder 56 like the holder plate 31 (see FIG. 3) of the present embodiment, but the member holder 56. Functions as a vertical guide.

部材ホルダ56は、上記したように上部ホルダ57と下部ホルダ58とからなり、上部ホルダ57の上面には複数のスプリング55の下端が連結されている。複数のスプリング55は、部材ホルダ56から均一な力を受けるように、部材ホルダ56の周方向で等間隔に配置されている。この場合、洗浄部材43と板状物Wの上面Waとの当接位置の真上に複数のスプリング55が位置しているため、当接位置から複数のスプリング55に対して当接時の反力がダイレクトに伝達される。このように、第1の変形例の洗浄手段40では、当接時の反力が真っ直ぐにスプリング55に作用するため、部材ホルダ56の揺動時のブレが抑えられた状態で、湾曲した板状物Wの上面Waに洗浄部材43の動きが追従させることが可能になっている。   The member holder 56 includes the upper holder 57 and the lower holder 58 as described above, and the lower ends of the plurality of springs 55 are connected to the upper surface of the upper holder 57. The plurality of springs 55 are arranged at equal intervals in the circumferential direction of the member holder 56 so as to receive a uniform force from the member holder 56. In this case, since the plurality of springs 55 are located immediately above the contact position between the cleaning member 43 and the upper surface Wa of the plate-like object W, the reaction at the time of contact with the plurality of springs 55 from the contact position. Force is transmitted directly. Thus, in the cleaning means 40 of the first modified example, since the reaction force at the time of contact acts on the spring 55 straightly, the curved plate is kept in a state in which the shake at the time of swinging of the member holder 56 is suppressed. The movement of the cleaning member 43 can follow the upper surface Wa of the object W.

図6A及び図6Bに示すように、第2の変形例の洗浄手段60において、揺動部61の追従機構62は、揺動アーム64の先端側にL字プレート65を介して延長プレート68が取り付けられ、延長プレート68のピストン部材71と部材ホルダ81の凹部82によって空気バネを構成している。L字プレート65は、樹脂材料の縦板部66と横板部67とによって側面視逆L字状に形成されている。L字プレート65の横板部67には樹脂材料で形成された延長プレート68が固定されており、延長プレート68には樹脂材料で形成されたピストン部材71が取り付けられる開口69が形成されている。   As shown in FIGS. 6A and 6B, in the cleaning means 60 of the second modified example, the follower mechanism 62 of the swing part 61 has an extension plate 68 on the tip side of the swing arm 64 via an L-shaped plate 65. An air spring is configured by the piston member 71 of the extension plate 68 and the recess 82 of the member holder 81. The L-shaped plate 65 is formed in a reverse L shape in a side view by a vertical plate portion 66 and a horizontal plate portion 67 made of a resin material. An extension plate 68 made of a resin material is fixed to the horizontal plate portion 67 of the L-shaped plate 65, and an opening 69 to which a piston member 71 made of a resin material is attached is formed in the extension plate 68. .

ピストン部材71は、延長プレート68の開口69から鉛直下向きに筒状部分が延伸し、筒状部分の基端のフランジ部分で延長プレート68に固定されている。ピストン部材71の筒状部分にはエアー流路が形成されており、筒状部分の上端側にはコネクタ72を介してコンプレッサー等が接続されている。ピストン部材71の筒状部分は部材ホルダ81の凹部82に入り込み、ピストン部材71の下端には凹部82内に鉛直下向きの圧縮エアーを噴射するエアー噴射口73が形成されている。このエアー噴射口73からの圧縮エアーの噴射によって部材ホルダ81の凹部82内の圧力が調整されている。   The piston member 71 has a cylindrical portion extending vertically downward from the opening 69 of the extension plate 68, and is fixed to the extension plate 68 at a flange portion at the base end of the cylindrical portion. An air flow path is formed in the cylindrical portion of the piston member 71, and a compressor or the like is connected to the upper end side of the cylindrical portion via a connector 72. The cylindrical portion of the piston member 71 enters the concave portion 82 of the member holder 81, and an air injection port 73 for injecting vertically downward compressed air into the concave portion 82 is formed at the lower end of the piston member 71. The pressure in the recess 82 of the member holder 81 is adjusted by the injection of compressed air from the air injection port 73.

L字プレート65の縦板部66には、L字状のホルダプレート75の縦板部76が固定されており、ホルダプレート75の横板部77には部材ホルダ81を鉛直方向にガイド可能な開口78が形成されている。ホルダプレート75の開口78には部材ホルダ81の筒状部分が入り込んで、部材ホルダ81のフランジ部分によってホルダプレート75に抜け止め可能に支持されている。このように、第2の変形例のホルダプレート75は、上記本実施の形態のホルダプレート31(図3参照)のように部材ホルダ81と一体に揺動する揺動部材ではなく、部材ホルダ81の鉛直方向のガイドとして機能している。   The vertical plate portion 66 of the L-shaped holder plate 75 is fixed to the vertical plate portion 66 of the L-shaped plate 65, and the member holder 81 can be guided in the vertical direction on the horizontal plate portion 77 of the holder plate 75. An opening 78 is formed. The cylindrical portion of the member holder 81 enters the opening 78 of the holder plate 75 and is supported by the holder plate 75 by the flange portion of the member holder 81 so as to be prevented from coming off. Thus, the holder plate 75 of the second modification is not a swinging member that swings integrally with the member holder 81 like the holder plate 31 (see FIG. 3) of the present embodiment, but the member holder 81. Functions as a vertical guide.

部材ホルダ81は、上記したように上部ホルダ83と下部ホルダ84とからなり、上部ホルダ83にピストン部材71の筒状部分が差し込まれる凹部82が形成されている。このように、第2の変形例では、部材ホルダ81の上部ホルダ83が、ピストン部材71が入り込む凹部82を有するシリンダ部材として機能している。この場合、ピストン部材71のエアー噴射口73から凹部82内に圧縮エアーが噴射され、凹部82の底面とピストン部材71の下面の間の空間の圧力が高められている。そして、凹部82内の空間を有する状態で洗浄部材63が板状物Wに当接することで、凹部82内の空間を潰しながらピストン部材71に沿って部材ホルダ81ごと洗浄部材63が上下に揺動される。   As described above, the member holder 81 is composed of the upper holder 83 and the lower holder 84, and the concave portion 82 into which the cylindrical portion of the piston member 71 is inserted is formed in the upper holder 83. Thus, in the second modified example, the upper holder 83 of the member holder 81 functions as a cylinder member having the recess 82 into which the piston member 71 enters. In this case, compressed air is injected into the recess 82 from the air injection port 73 of the piston member 71, and the pressure in the space between the bottom surface of the recess 82 and the lower surface of the piston member 71 is increased. Then, the cleaning member 63 abuts on the plate-like object W in a state having the space in the recess 82, so that the cleaning member 63 together with the member holder 81 swings up and down along the piston member 71 while collapsing the space in the recess 82. Moved.

このように、第2の変形例の洗浄手段60では、スプリングの代わりに空気バネを使用することでスプリング等を使用することなく、湾曲した板状物Wの上面Waに洗浄部材43の動きを追従させることが可能になっている。また、洗浄部材63と板状物Wの上面Waとの当接位置の真上で部材ホルダ81が上下方向に揺動しているため、部材ホルダ81の揺動時のブレが抑えられている。なお、凹部82内の圧力は、板状物Wの種類に応じて適切な値に調整される。   As described above, in the cleaning means 60 of the second modified example, the movement of the cleaning member 43 is performed on the upper surface Wa of the curved plate-like object W without using a spring or the like by using an air spring instead of the spring. It is possible to follow. In addition, since the member holder 81 swings in the vertical direction directly above the contact position between the cleaning member 63 and the upper surface Wa of the plate-like object W, blurring when the member holder 81 swings is suppressed. . The pressure in the recess 82 is adjusted to an appropriate value according to the type of the plate-like object W.

なお、洗浄手段20は、上記した第1、第2の変形例の洗浄手段40、60に他にも、他の変形例が考えられる。例えば、第1の変形例の洗浄部材40からホルダプレート51を外した構成にしてもよいし、延長プレート48に単一のスプリング55を介して部材ホルダ56を連結した構成にしてもよい。   In addition to the cleaning means 40 and 60 of the first and second modified examples described above, other modified examples of the cleaning unit 20 can be considered. For example, the holder plate 51 may be removed from the cleaning member 40 of the first modification, or the member holder 56 may be connected to the extension plate 48 via a single spring 55.

また、本実施の形態及び各変形例では、洗浄手段20、40、60が耐薬品性の高い樹脂材料で形成されることが好ましいが、この構成に限定されない。例えば、耐薬品性の高い金属材料で形成されてもよいし、薬品を含まない洗浄液であれば、耐薬品性の低い材料を使用してもよい。   Moreover, in this Embodiment and each modification, although it is preferable that the washing | cleaning means 20, 40, 60 is formed with a resin material with high chemical resistance, it is not limited to this structure. For example, it may be formed of a metal material with high chemical resistance, or a material with low chemical resistance may be used as long as the cleaning liquid does not contain chemicals.

また、本実施の形態及び各変形例では、保持手段10が複数のクランプアーム11によって板状物Wの外周縁を保持する構成にしたが、この構成に限定されない。保持手段10は、板状物Wの外周縁を保持可能な構成であればよく、例えば、複数の進退ピンを板状物Wの外周縁に当接させることで保持する構成にしてもよい。   Moreover, in this Embodiment and each modification, although the holding means 10 was set as the structure which hold | maintains the outer periphery of the plate-shaped object W with the some clamp arm 11, it is not limited to this structure. The holding means 10 may be configured to hold the outer peripheral edge of the plate-like object W. For example, the holding means 10 may be configured to hold a plurality of advance / retreat pins by contacting the outer peripheral edge of the plate-like object W.

また、本実施の形態及び各変形例では、洗浄液噴射手段が回転テーブル12の噴射口14と噴射ノズル15で構成されたが、この構成に限定されない。洗浄液噴射手段は、板状物Wの上面Wa及び下面Wbに洗浄液を噴射可能な構成であればよく、例えば、板状物Wの上方及び下方に設けた上下の噴射ノズルで構成されてもよい。   Moreover, in this Embodiment and each modification, although the washing | cleaning-liquid injection means was comprised by the injection port 14 and the injection nozzle 15 of the turntable 12, it is not limited to this structure. The cleaning liquid spraying unit may be configured to spray the cleaning liquid onto the upper surface Wa and the lower surface Wb of the plate-like object W. For example, the cleaning liquid spraying unit may be composed of upper and lower injection nozzles provided above and below the plate-like object W. .

また、本実施の形態及び各変形例では、洗浄部材23がスポンジ状に形成されたが、この構成に限定されない。洗浄部材23は、板状物Wをスクラブ洗浄可能なものであればよく、例えば、ブラシ状に形成されていてもよい。   Moreover, in this Embodiment and each modification, although the cleaning member 23 was formed in sponge shape, it is not limited to this structure. The cleaning member 23 only needs to be capable of scrub cleaning the plate-like object W, and may be formed in a brush shape, for example.

また、本実施の形態及び各変形例では、揺動部21が洗浄部材23を旋回させることで、洗浄部材23を板状物Wの径方向に揺動させる構成にしたが、この構成に限定されない。揺動部21は、洗浄部材23を板状物Wの径方向に揺動させる構成であればよく、例えば、洗浄部材23を直線的に移動させることで、洗浄部材23を板状物Wの径方向に揺動させてもよい。   Moreover, in this Embodiment and each modification, although the rocking | swiveling part 21 swirled the cleaning member 23, it was set as the structure rock | fluctuated the cleaning member 23 to the radial direction of the plate-shaped object W, However, It is limited to this structure. Not. The swinging portion 21 may be configured to swing the cleaning member 23 in the radial direction of the plate-like object W. For example, the cleaning member 23 is moved linearly so that the cleaning member 23 is moved to the plate-like object W. You may rock | fluctuate to radial direction.

以上説明したように、本発明は、反りの激しい板状物であっても、簡易な構成で板状物の全面を良好に洗浄することができるという効果を有し、特に、激しい反りを生じた板状物を洗浄する洗浄装置に有用である。   As described above, the present invention has an effect that the entire surface of the plate-like object can be satisfactorily cleaned with a simple configuration even if it is a plate-like object with a strong warp. This is useful for a cleaning apparatus for cleaning a plate-like object.

1 洗浄装置
10 保持手段
14 噴射口(洗浄液噴射手段)
15 噴射ノズル(洗浄液噴射手段)
16、17 供給源(洗浄液噴射手段)
20、40、60 洗浄手段
21、41、61 揺動部
22、42、62 追従機構
23、43,63 洗浄部材
28 鉛直ガイド
31 ホルダプレート(ホルダ)
35、55 スプリング
36、56、81 部材ホルダ(ホルダ)
71 ピストン部材
73 エアー噴射口
82 部材ホルダの凹部
83 上部ホルダ(シリンダ部材)
W 板状物
Wa 板状物の上面
Wb 板状物の下面
DESCRIPTION OF SYMBOLS 1 Cleaning apparatus 10 Holding means 14 Injection port (cleaning liquid injection means)
15 Injection nozzle (cleaning liquid injection means)
16, 17 Supply source (cleaning liquid injection means)
20, 40, 60 Cleaning means 21, 41, 61 Swing part 22, 42, 62 Follow-up mechanism 23, 43, 63 Cleaning member 28 Vertical guide 31 Holder plate (holder)
35, 55 Spring 36, 56, 81 Member holder (holder)
71 Piston member 73 Air injection port 82 Concave portion of member holder 83 Upper holder (cylinder member)
W Plate-shaped object Wa Upper surface of the plate-shaped object Wb Lower surface of the plate-shaped object

Claims (3)

板状物を外周縁で保持して板状物を周方向に回転させる保持手段と、該保持手段によって保持され回転している板状物を洗浄する洗浄手段と、該保持手段に保持された板状物の上面及び下面のそれぞれに洗浄液を噴射する洗浄液噴射手段とを備えた洗浄装置であって、
該洗浄手段は、板状物の上面に当接して板状物を洗浄する洗浄部材と、該洗浄部材を板状物の径方向に揺動させると共に湾曲した板状物の上面に追従する揺動部とを備え、
該保持手段に保持された板状物の上面に当接し該洗浄部材が板状物の上面に沿って板状物の上面を洗浄することを特徴とする洗浄装置。
Holding means for holding the plate-like object at the outer peripheral edge and rotating the plate-like object in the circumferential direction, cleaning means for cleaning the rotating plate-like object held by the holding means, and held by the holding means A cleaning apparatus comprising cleaning liquid spraying means for spraying a cleaning liquid on each of the upper surface and the lower surface of the plate-like object,
The cleaning means includes a cleaning member that contacts the upper surface of the plate-shaped object to clean the plate-shaped object, and a rocker that swings the cleaning member in the radial direction of the plate-shaped object and follows the upper surface of the curved plate-shaped object. With moving parts,
A cleaning apparatus, wherein the cleaning member is in contact with an upper surface of a plate-like object held by the holding means and the cleaning member cleans the upper surface of the plate-like object along the upper surface of the plate-like object.
該揺動部は、
揺動する先端に配設され該洗浄部材を鉛直方向にガイドする鉛直ガイドと、
該洗浄部材を保持し且つ該鉛直ガイドにガイドされるホルダと、
該ホルダを該鉛直ガイドにガイドされた状態で該揺動部の該先端に固定するスプリングと、を備え、
該スプリングが伸縮することで該鉛直ガイドに沿って該ホルダ及び該洗浄部材が上下に揺動して湾曲した板状物の上面に追従することを特徴とする、請求項1記載の洗浄装置。
The rocking part is
A vertical guide disposed at the tip of swinging and guiding the cleaning member in the vertical direction;
A holder for holding the cleaning member and guided by the vertical guide;
A spring that fixes the holder to the tip of the swinging portion in a state of being guided by the vertical guide,
2. The cleaning apparatus according to claim 1, wherein the spring and the elastic member swing up and down along the vertical guide to follow the upper surface of the curved plate-like object.
該揺動部の該先端に配設され鉛直下向きに延伸しているピストン部材と、該ピストン部材に係合する凹部を備え鉛直方向に駆動可能なシリンダ部材と、該シリンダ部材の該凹部内に鉛直下向きに圧縮エアーを噴射するエアー噴射口と、該シリンダ部材の下面側に配設された該洗浄部材と、を備え、
該ピストン部材の該エアー噴射口から該凹部内に圧縮エアーが噴射され該凹部内に空間を有する状態で該洗浄部材が板状物に当接し、該ピストン部材に沿って該シリンダ部材及び該洗浄部材が上下に揺動して湾曲した板状物の上面に追従することを特徴とする、請求項1記載の洗浄装置。
A piston member that is disposed at the tip of the swinging portion and extends vertically downward, a cylinder member that includes a concave portion that engages with the piston member and that can be driven in the vertical direction, and in the concave portion of the cylinder member An air injection port for injecting compressed air vertically downward, and the cleaning member disposed on the lower surface side of the cylinder member,
Compressed air is injected into the recess from the air injection port of the piston member, and the cleaning member comes into contact with the plate-like object with a space in the recess, and the cylinder member and the cleaning are moved along the piston member. The cleaning apparatus according to claim 1, wherein the member swings up and down and follows the upper surface of the curved plate-like object.
JP2016084419A 2016-04-20 2016-04-20 Cleaning equipment Active JP6661453B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016084419A JP6661453B2 (en) 2016-04-20 2016-04-20 Cleaning equipment
TW106107999A TWI711494B (en) 2016-04-20 2017-03-10 Washing device
KR1020170045180A KR102264628B1 (en) 2016-04-20 2017-04-07 Cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016084419A JP6661453B2 (en) 2016-04-20 2016-04-20 Cleaning equipment

Publications (2)

Publication Number Publication Date
JP2017195271A true JP2017195271A (en) 2017-10-26
JP6661453B2 JP6661453B2 (en) 2020-03-11

Family

ID=60156100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016084419A Active JP6661453B2 (en) 2016-04-20 2016-04-20 Cleaning equipment

Country Status (3)

Country Link
JP (1) JP6661453B2 (en)
KR (1) KR102264628B1 (en)
TW (1) TWI711494B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108538761A (en) * 2018-04-09 2018-09-14 绍兴文理学院 A kind of photovoltaic panel silicon chip processing cleaning device
JP7167705B2 (en) 2018-12-26 2022-11-09 株式会社島津製作所 Mass spectrometry method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108648989B (en) * 2018-05-16 2020-12-25 福建北电新材料科技有限公司 Method for cleaning single crystal silicon carbide substrate wafer
CN111992268B (en) * 2020-09-18 2022-06-24 苏州格力美特实验室科技发展有限公司 Laboratory test bench

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189512A (en) * 1996-12-26 1998-07-21 Sony Corp Substrate cleaning device
JP2001096238A (en) * 1999-07-26 2001-04-10 Tokyo Electron Ltd Instrument, device and method for washing substrate
JP2007250783A (en) * 2006-03-15 2007-09-27 Dainippon Screen Mfg Co Ltd Substrate holding and rotating apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1080797A3 (en) * 1994-06-28 2005-10-05 Ebara Corporation Method and apparatus for cleaning workpiece
JP4089837B2 (en) 1997-07-10 2008-05-28 株式会社ディスコ Spinner device
US6648979B2 (en) * 2001-01-24 2003-11-18 International Business Machines Corporation Apparatus and method for wafer cleaning
JP2014110270A (en) 2012-11-30 2014-06-12 Disco Abrasive Syst Ltd Cleaning device
JP6279276B2 (en) * 2013-10-03 2018-02-14 株式会社荏原製作所 Substrate cleaning apparatus and substrate processing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189512A (en) * 1996-12-26 1998-07-21 Sony Corp Substrate cleaning device
JP2001096238A (en) * 1999-07-26 2001-04-10 Tokyo Electron Ltd Instrument, device and method for washing substrate
JP2007250783A (en) * 2006-03-15 2007-09-27 Dainippon Screen Mfg Co Ltd Substrate holding and rotating apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108538761A (en) * 2018-04-09 2018-09-14 绍兴文理学院 A kind of photovoltaic panel silicon chip processing cleaning device
JP7167705B2 (en) 2018-12-26 2022-11-09 株式会社島津製作所 Mass spectrometry method

Also Published As

Publication number Publication date
JP6661453B2 (en) 2020-03-11
KR102264628B1 (en) 2021-06-11
KR20170120024A (en) 2017-10-30
TW201801808A (en) 2018-01-16
TWI711494B (en) 2020-12-01

Similar Documents

Publication Publication Date Title
KR102635712B1 (en) Substrate cleaning device, substrate cleaning method, substrate processing device, and substrate drying device
JP6661453B2 (en) Cleaning equipment
JP6674679B2 (en) Substrate holding / rotating apparatus, substrate processing apparatus having the same, and substrate processing method
KR102364243B1 (en) Substrate processing apparatus, substrate processing method, and program recording medium
CN107851573B (en) Substrate processing method and substrate processing apparatus
KR102465094B1 (en) Substrate processing apparatus, substrate processing method and recording medium
US9922849B2 (en) Substrate liquid processing apparatus having nozzle with multiple flow paths and substrate liquid processing method thereof
KR102653771B1 (en) Non-contact clean module
KR20150075366A (en) Substrate cleaning apparatus and substrate processing apparatus
KR20200123194A (en) Substrate cleaning apparatus and substrate cleaning method
US10128103B2 (en) Apparatus and process for wafer cleaning
JP2015019024A (en) Substrate processing apparatus
JP7290695B2 (en) Cleaning equipment for ultrasonic cleaning equipment and cleaning tools
KR20200004471A (en) Substrate treatment method and substrate treatment device
JP2014216393A (en) Substrate processing apparatus and method for manufacturing processed substrate
KR20100136835A (en) Megasonic cleaning system for semiconductor backside cleaning
US20220401997A1 (en) Substrate support mechanism, substrate cleaning device and substrate processing method
JP6122684B2 (en) Substrate processing apparatus and manufacturing method of processing substrate
JP6172957B2 (en) Cleaning device
KR102620817B1 (en) wafer cleaning device
KR101213967B1 (en) Wafer cleaning apparatus
JP6612176B2 (en) Substrate cleaning device
KR20060025836A (en) Apparatus and method for cleaning substrates
JP2023080405A (en) Substrate cleaning device
JP6276982B2 (en) Spinner cleaning device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191008

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191010

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191206

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200114

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200212

R150 Certificate of patent or registration of utility model

Ref document number: 6661453

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250