JP2017084634A - Airtight terminal - Google Patents
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- JP2017084634A JP2017084634A JP2015212502A JP2015212502A JP2017084634A JP 2017084634 A JP2017084634 A JP 2017084634A JP 2015212502 A JP2015212502 A JP 2015212502A JP 2015212502 A JP2015212502 A JP 2015212502A JP 2017084634 A JP2017084634 A JP 2017084634A
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- 239000000463 material Substances 0.000 claims abstract description 103
- 239000011521 glass Substances 0.000 claims abstract description 52
- 239000011162 core material Substances 0.000 claims abstract description 41
- 238000005219 brazing Methods 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- 238000007789 sealing Methods 0.000 claims abstract description 32
- 238000002844 melting Methods 0.000 claims abstract description 14
- 230000008018 melting Effects 0.000 claims abstract description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 51
- 239000000956 alloy Substances 0.000 claims description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 8
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910017060 Fe Cr Inorganic materials 0.000 claims description 4
- 229910002544 Fe-Cr Inorganic materials 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 4
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 4
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 229910015363 Au—Sn Inorganic materials 0.000 claims description 3
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 3
- 229910017770 Cu—Ag Inorganic materials 0.000 claims description 3
- 229910018104 Ni-P Inorganic materials 0.000 claims description 3
- 229910018536 Ni—P Inorganic materials 0.000 claims description 3
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 3
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 3
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 claims description 3
- 229910020994 Sn-Zn Inorganic materials 0.000 claims description 3
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 3
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 3
- 229910009069 Sn—Zn Inorganic materials 0.000 claims description 3
- 229910007570 Zn-Al Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910016331 Bi—Ag Inorganic materials 0.000 claims 2
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 239000000945 filler Substances 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 229910000851 Alloy steel Inorganic materials 0.000 description 6
- 239000007769 metal material Substances 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 229910000975 Carbon steel Inorganic materials 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000010962 carbon steel Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 229910007563 Zn—Bi Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
Description
本発明は、気密端子に関する。 The present invention relates to an airtight terminal.
気密端子は、金属外環の挿通孔に絶縁材を介してリードを気密に封着したもので、気密容器内に収容された電気機器や素子に電流を供給したり、電気機器や素子から信号を外部に導出したりする場合に用いられる。特に金属外環とリードを絶縁ガラスで封着するＧＴＭＳ（Ｇｌａｓｓ−ｔｏ−Ｍｅｔａｌ−Ｓｅａｌ）タイプの気密端子は、整合封止型と圧縮封止型の２種類に大別される。前述の気密端子において信頼性の高い気密封止を確保するには、外環およびリードの金属材と絶縁ガラスの熱膨張係数を適正に選択することが重要となる。封止用の絶縁ガラスは、金属外環とリードの素材、要求温度プロファイルおよびその熱膨張係数によって決定されている。整合封止の場合、金属材と絶縁ガラスの熱膨張係数が可能な限り一致するように封止素材を選定する。一方、圧縮封止は、金属外環が絶縁ガラスおよびリードを圧縮するように意図的に異なる熱膨張係数の金属材と絶縁ガラスの材料が選択されている。 The hermetic terminal is a lead-sealed lead with an insulating material inserted in the insertion hole of the metal outer ring, supplying current to the electrical equipment and elements housed in the hermetic container, and signals from the electrical equipment and elements. It is used when deriving from the outside. In particular, GTMS (Glass-to-Metal-Seal) type hermetic terminals, in which the metal outer ring and the lead are sealed with insulating glass, are roughly classified into two types, a matching sealing type and a compression sealing type. In order to ensure highly reliable hermetic sealing in the above-described hermetic terminal, it is important to appropriately select the thermal expansion coefficients of the outer ring and the lead metal material and the insulating glass. The insulating glass for sealing is determined by the material of the metal outer ring and the lead, the required temperature profile, and its thermal expansion coefficient. In the case of alignment sealing, the sealing material is selected so that the thermal expansion coefficients of the metal material and the insulating glass match as much as possible. On the other hand, in the compression sealing, a metal material and an insulating glass material having different thermal expansion coefficients are selected intentionally so that the outer metal ring compresses the insulating glass and the lead.
従来の気密端子は高い気密信頼性ならびに電気絶縁性を確保するため、整合封止型気密端子においては、金属外環およびリード材に広い温度範囲でガラス材と熱膨張係数が一致しているコバール合金（Ｆｅ５４％、Ｎｉ２８％、Ｃｏ１８％）を使用して、両者をホウケイ酸ガラスからなる絶縁ガラスで封着し、圧縮封止型気密端子においては、使用温度範囲においてガラスに同心円状の圧縮応力が加わるように、炭素鋼またはステンレス鋼などの鋼製の金属外環と、鉄ニッケル合金（Ｆｅ５０％、Ｎｉ５０％）や鉄クロム合金（Ｆｅ７２％、Ｃｒ２８％）などの鉄合金のリード材を使用して、両者をソーダバリウムガラスからなる絶縁ガラスで封着していた。 In order to ensure high hermetic reliability and electrical insulation, the conventional hermetic terminal has a Kovar that has the same thermal expansion coefficient as that of the glass outer ring and lead material in a wide temperature range. An alloy (Fe 54%, Ni 28%, Co 18%) is used, and both are sealed with insulating glass made of borosilicate glass. For compression-sealing type airtight terminals, concentric compressive stress is applied to the glass in the operating temperature range. Steel outer ring made of carbon steel or stainless steel and iron alloy lead material such as iron nickel alloy (Fe50%, Ni50%) and iron chromium alloy (Fe72%, Cr28%) Both were sealed with insulating glass made of soda barium glass.
その他、電子管、電球、放電ランプおよびダイオード、サーミスタなどの半導体デバイスの軟質ガラス封入部に用いる封着金属線材にジュメット線がある。ジュメット線は鉄・ニッケル合金を心金とし、それに銅を被覆した複合線で、さらに表面をオキシダイズ仕上げまたはボレート仕上げしたもので、非特許文献１の日本工業規格に規定されている。しかしながら、ジュメット線は灯具などの球管用の比較的細線径のものしか無く大容量化に対応できない。また、大容量化に対応して芯材線径の大きなリード母材を用意し、これにＣｕめっき被膜を施したものは、めっき工程に由来するガス成分のリーク発生、被膜密着性の悪さによる膨れや剥離、析出金属の粗大な表面組織、尖端電流効果によるエッジ部分の厚膜化による所謂Ｄｏｇ−Ｂｏｎｅ現象等の不具合を払拭し難いと言う欠点があった。 In addition, there is a dumet wire as a sealing metal wire used for a soft glass encapsulating portion of a semiconductor device such as an electron tube, a light bulb, a discharge lamp, a diode, or a thermistor. A dumet wire is a composite wire in which an iron / nickel alloy is used as a mandrel and copper is coated thereon, and the surface is further oxidized or borated, and is defined in Japanese Industrial Standards of Non-Patent Document 1. However, the jumet wire has only a relatively thin wire diameter for a bulb tube such as a lamp and cannot cope with an increase in capacity. In addition, a lead base material with a large core wire diameter corresponding to an increase in capacity and a copper plating film applied thereto are caused by the occurrence of gas component leaks from the plating process and poor film adhesion. There is a drawback that it is difficult to wipe out problems such as swelling and peeling, a rough surface structure of deposited metal, and a so-called Dog-Bone phenomenon due to thickening of the edge portion due to the tip current effect.
近年、気密端子の大電力対応が求められるようになっている。例えば、コンビニエンス・ストアのようなスペースが限られた店舗内に設置する冷凍機用に小型かつ高性能なコンプレッサーが求められるようになっている。このように業務用途を中心に近年のコンプレッサーは、従来サイズに比し小型化される傾向にあるが、冷凍機の能力向上に伴ってコンプレッサーに取り付けられた気密端子を通る最大電流値は自ずと上昇する傾向にある。従来から冷凍機用気密端子には、リード・ピンの機械的強度などの制約からリード材に鉄合金などの高抵抗金属を用いている。このため、電気的な過負荷がかかるとリード材のジュール熱により絶縁ガラスが溶融し、気密性が確保できなくなり、最悪の場合はリード材が抜け落ちるなどの危険があった。特に大電力用途向けには、気密端子のリード材の通電発熱を抑制できれば、大電力への対応や省電力化など電気エネルギーの効率利用の観点からより好ましい。従来の鉄合金製のリード材から、銅やアルミニウム合金などの低抵抗金属製のリード材に変更できればよいが、これら低抵抗材は機械的強度が鉄合金より乏しく、組立や設置作業時にリード・ピンが曲がりやすくなるため不都合である。また、封止に利用する絶縁ガラスは概して低熱膨張係数材料のため、リード材に高熱膨張係数材料の銀、銅、アルミニウムや銀合金、銅合金、アルミニウム合金などを用いると整合封止が原理上利用できなくなる。圧縮封止においても、低抵抗金属は、金属外環に使用する鋼材に比べて熱膨張係数がより大きく、これをリード材に用いると、封着後にリード材が収縮するため、絶縁ガラスに負荷できる圧縮応力が小さくなりすぎ気密性の確保が難しくなる。敢えて金属外環とリード材ともに銀、銅、アルミニウムやその合金などの高熱膨張係数材料で構成することも考えられるが、その場合は絶縁ガラスに加わる圧縮応力が大きくなりすぎ、封止材のガラスに割れが生じたりするので採用できない。 In recent years, it has been demanded that airtight terminals be compatible with high power. For example, a compact and high-performance compressor is required for a refrigerator installed in a store with limited space such as a convenience store. In this way, recent compressors, mainly for business use, tend to be smaller than conventional sizes, but the maximum current value that passes through the airtight terminal attached to the compressor naturally increases as the capacity of the refrigerator increases. Tend to. Conventionally, high resistance metals such as iron alloys have been used as lead materials for airtight terminals for refrigerators due to restrictions such as mechanical strength of the leads and pins. For this reason, when an electrical overload is applied, the insulating glass melts due to the Joule heat of the lead material, and airtightness cannot be secured, and in the worst case, there is a risk that the lead material falls off. Particularly for high-power applications, it is more preferable from the viewpoint of efficient use of electric energy, such as response to high power and power saving, if current conduction heat generation of the lead material of the hermetic terminal can be suppressed. It is only necessary to change from conventional iron alloy lead materials to lead materials made of low resistance metals such as copper and aluminum alloys. However, these low resistance materials have lower mechanical strength than iron alloys, and lead / This is inconvenient because the pins are easily bent. Insulating glass used for sealing is generally a low thermal expansion coefficient material. Therefore, if the lead material is a high thermal expansion coefficient material such as silver, copper, aluminum, a silver alloy, a copper alloy, or an aluminum alloy, matched sealing is the principle. It becomes unavailable. Even in compression sealing, low resistance metals have a larger coefficient of thermal expansion than steel materials used for the metal outer ring, and if this is used for the lead material, the lead material shrinks after sealing, so there is a load on the insulating glass. The compressive stress that can be made becomes too small, making it difficult to ensure airtightness. It is conceivable that both the metal outer ring and the lead material are made of a material having a high thermal expansion coefficient such as silver, copper, aluminum or an alloy thereof, but in that case, the compressive stress applied to the insulating glass becomes too large, and the glass of the sealing material It is not possible to adopt because cracks occur.
従来、リード材の電気抵抗を低減する目的で銅芯リードを使った気密端子が提案されている。特許文献１に示されるように銅芯の表面を合金鋼で被覆した複合リード材を用いた気密端子がある。しかしながら、特許文献１の気密端子のリード材は、銅のインナコア表面に合金鋼のアウタジャケットを固着被覆してあるので、限られた金属外環内にリードを装着する制約の下で、銅のインナコア径を大きくして合金鋼のアウタジャケットを薄くすると、リードの機械的強度が保てないばかりか銅の大きな熱膨張に合金鋼の被覆が抗しきれず追従してしまい充分な圧縮封止を得られない。逆にインナコアの銅径を小さくし合金鋼の被覆を厚くすると、所望するリードの抵抗値を得ることが難しくなるという構造上の限界があった。また、リードに実用範囲の機械的強度を具備させた場合は、電流経路として鋼材のアウタジャケットにも必ず通電されるようになり、合金鋼のアウタジャケットは銅の数十倍の比抵抗を有するので、銅材部で発熱を抑えても鋼材部で大きな発熱が生じてしまう。鋼材への通電を抑制するため銅芯をより太くすれば鋼材の発熱は抑えられリードとガラスとの間の熱応力を小さくできるが、代わりに通電側の銅材と鋼材との間に大きな熱応力が生じ材料界面が剥離しやすくなる。従って、鋼材アウタジャケットと銅材インナコアの構成では、銅芯材の電気抵抗を下げる効果と、銅芯材の過大な熱膨張とが拮抗しているため、銅芯材と被覆鋼材の熱応力による界面剥離の問題を解決できず、金属材の複合界面が熱履歴の影響を受けて気密性を損ない易いという欠点があった。 Conventionally, airtight terminals using copper core leads have been proposed for the purpose of reducing the electrical resistance of the lead material. As shown in Patent Document 1, there is an airtight terminal using a composite lead material in which the surface of a copper core is coated with an alloy steel. However, since the lead material of the hermetic terminal of Patent Document 1 has a copper inner core surface fixedly coated with an outer jacket made of alloy steel, the lead material of copper is subject to the restriction of mounting the lead in a limited metal outer ring. If the inner core diameter is increased and the outer jacket of the alloy steel is made thinner, the mechanical strength of the lead cannot be maintained and the coating of the alloy steel cannot sufficiently resist the large thermal expansion of the copper, resulting in sufficient compression sealing. I can't get it. Conversely, if the copper diameter of the inner core is reduced and the coating of the alloy steel is increased, there is a structural limit that it becomes difficult to obtain a desired lead resistance value. In addition, when the lead has mechanical strength within a practical range, the outer jacket of the steel material is always energized as a current path, and the outer jacket of the alloy steel has a specific resistance several tens of times that of copper. Therefore, even if heat generation is suppressed in the copper material portion, large heat generation occurs in the steel material portion. If the copper core is made thicker in order to suppress energization to the steel material, the heat generation of the steel material can be suppressed and the thermal stress between the lead and the glass can be reduced, but instead a large amount of heat is generated between the copper material on the energization side and the steel material. Stress is generated and the material interface is easily peeled off. Therefore, in the structure of the steel outer jacket and the copper inner core, the effect of lowering the electrical resistance of the copper core material and the excessive thermal expansion of the copper core material antagonize, so the thermal stress of the copper core material and the coated steel material The problem of interfacial delamination could not be solved, and the composite interface of the metal material was affected by the thermal history, and there was a drawback that the airtightness was easily lost.
本発明の目的は、例えば、冷凍機用の気密端子や二次電池、燃料電池等の電池セルおよび車載用高容量リレーなどの大電力用に適合した気密端子であって、リード材およびガラス封着部の機械的強度を確保しながら気密信頼性を向上した気密端子を提供することにある。 An object of the present invention is, for example, a hermetic terminal suitable for high power use such as a hermetic terminal for a refrigerator, a battery cell such as a secondary battery or a fuel cell, and a high-capacity relay for vehicle use, and includes a lead material and a glass seal. An object of the present invention is to provide a hermetic terminal with improved hermetic reliability while ensuring the mechanical strength of the wearing portion.
本発明によれば、少なくとも１個の貫通孔を有した金属外環と、この金属外環の貫通孔に挿通した低電気抵抗材からなるパイプリードと、金属外環とパイプリードとを封着する絶縁ガラスと、パイプリードの内径に挿通した低熱膨張材の芯材リードと、この芯材リードの外径とパイプリードの内径との間を隙間なく接合したロウ材からなり、ロウ材は、絶縁ガラスの軟化点より低温の溶融温度を有することを特徴とする気密端子が提供される。絶縁ガラスの軟化点とロウ材の溶融温度との間に温度差を設けた構成により、絶縁ガラスが固化して封着が完了した後、ロウ材が固化して接合を完了させることができ、パイプリードと芯材リードとの間に大きな熱膨張差が有っても最後までロウ材が液相を維持するので、両者の熱応力を緩衝する効果があり、冷却時に問題となる急激なリード軸方向の収縮を緩和して芯材リードとパイプリードとの間の界面剥離を抑える。パイプリードと絶縁ガラスとの界面は、金属外環の焼ばめ効果によってガラス封着が圧縮保持されるため、ガラス封着させる最外層のパイプリードに熱膨張が大きい低電気抵抗金属材を用いながら、熱膨張が小さい芯材リードとの界面剥離を防止し気密信頼性を向上させる。しかも、各構成部品を同時に通炉して一度に組み立てることができる。 According to the present invention, a metal outer ring having at least one through hole, a pipe lead made of a low electrical resistance material inserted into the through hole of the metal outer ring, and the metal outer ring and the pipe lead are sealed. Insulating glass, a core material lead of a low thermal expansion material inserted into the inner diameter of the pipe lead, and a brazing material in which the outer diameter of the core material lead and the inner diameter of the pipe lead are joined without gaps. An airtight terminal having a melting temperature lower than the softening point of insulating glass is provided. With the configuration in which a temperature difference is provided between the softening point of the insulating glass and the melting temperature of the brazing material, after the insulating glass is solidified and sealing is completed, the brazing material is solidified and the joining can be completed. Even if there is a large difference in thermal expansion between the pipe lead and the core material lead, the brazing material maintains the liquid phase until the end, so there is an effect of buffering the thermal stress of both, and a rapid lead that becomes a problem during cooling Axial shrinkage is alleviated to prevent interfacial delamination between the core material lead and the pipe lead. At the interface between the pipe lead and the insulating glass, the glass seal is compressed and held by the shrink-fit effect of the metal outer ring, so a low electrical resistance metal material with high thermal expansion is used for the outermost pipe lead to be sealed. However, it prevents the interface peeling with the core lead having a small thermal expansion and improves the airtight reliability. Moreover, it is possible to assemble the components at once by passing them through the furnace at the same time.
本発明の別の観点によれば、低電気抵抗材のパイプリードと、絶縁ガラスのタブレットとを、金属外環の貫通孔に挿通し、さらに、低熱膨張材の母材に絶縁ガラスの軟化点未満の溶融温度を有するロウ材を装着した芯材リードを、パイプリードの内径に挿通して封着治具にセットする部品振込工程、封着治具にセットした各部材をガラス軟化点以上の温度に調温した加熱炉に通して金属外環とパイプリードをガラス封着すると共にパイプリードと芯材リードもロウ接する封着ロウ付け工程によって組み立てたことを特徴とする気密端子の製造方法が提供される。芯材リードへのロウ材の装着方法は、封着ロウ付け工程でパイプリードと芯材リードとの間を溶融したロウ材で充填できればどの様な方法でもよく、例えば、予め芯材リードの周壁にロウ材を取り付け、これをパイプリードに挿通して通炉するか、パイプリードまたは芯材リードの端部にロウ材を搭載して通炉する等の方法が好適に利用できる。 According to another aspect of the present invention, the pipe lead of the low electrical resistance material and the insulating glass tablet are inserted into the through-hole of the metal outer ring, and further the softening point of the insulating glass in the base material of the low thermal expansion material A component lead-in process in which a core material lead with a brazing material having a melting temperature of less than is inserted into the inner diameter of the pipe lead and set in a sealing jig, and each member set in the sealing jig has a glass softening point or higher An airtight terminal manufacturing method characterized by being assembled by a sealing brazing process in which a metal outer ring and a pipe lead are sealed with glass through a heating furnace adjusted to a temperature and a pipe lead and a core material lead are brazed. Provided. The brazing material can be attached to the core material lead by any method as long as it can be filled with a molten brazing material between the pipe lead and the core material lead in the sealing brazing process. For example, the peripheral wall of the core material lead in advance A method of attaching a brazing material to the pipe lead and passing it through the pipe lead and passing through the furnace, or mounting a brazing material on the end of the pipe lead or the core material lead and passing through the furnace can be suitably used.
本発明の構成により、一度の通炉で絶縁ガラスの軟化点未満の溶融温度を有するロウ材を用いて、パイプリードと芯材リードとの間を隙間なく接合でき、しかも両者の中間層を構成するロウ材の緩衝機能により、冷却時に問題となる急激なリード軸方向の収縮を緩和してパイプリードと芯材リードの界面剥離を抑え、端子の気密信頼性を高める。また低電気抵抗材からなるパイプリードを最外層に用いたことで端子の電気抵抗を低減できる。 According to the configuration of the present invention, the brazing material having a melting temperature lower than the softening point of the insulating glass can be joined without gaps in a single furnace, and the intermediate layer between the two can be configured. The brazing material cushioning function reduces the sudden shrinkage in the lead axis direction, which is a problem during cooling, and suppresses interface separation between the pipe lead and the core material lead, thereby improving the airtight reliability of the terminal. Moreover, the electrical resistance of a terminal can be reduced by using a pipe lead made of a low electrical resistance material as the outermost layer.
本発明に係る気密端子１０は、図１ないし図３に示すように、少なくとも１個の貫通孔を有した鉄または鉄合金からなる金属外環１１と、この金属外環１１の貫通孔に挿通した銀、銅、アルミニウムまたは銀合金、銅合金、アルミニウム合金などの低電気抵抗材からなるパイプリード１２と、パイプリード１２と金属外環１１とを封着する絶縁ガラス１３と、パイプリード１２の内径に挿通した鉄またはＦｅ−Ｎｉ合金、コバール合金、Ｆｅ−Ｃｒ合金、フェライト系ステンレス鋼材などの鉄合金からなる低熱膨張材の芯材リード１４と、芯材リード１４の外径とパイプリード１２の内径との間を隙間なく接合した溶融温度が９００℃以下のＳｎなどの金属単体またはＮｉ−Ｐ合金などの無電解Ｎｉめっき材またはＳｎ−Ｂｉ合金、Ｓｎ−Ｂｉ−Ａｇ合金、Ｓｎ−Ｃｕ合金、Ｓｎ−Ａｇ合金、Ｓｎ−Ａｇ−Ｉｎ−Ｂｉ合金、Ｓｎ−Ａｇ−Ｃｕ合金、Ｓｎ−Ｃｕ−Ａｇ合金、Ｓｎ−Ｃｕ−Ｎｉ合金、Ｓｎ−Ｚｎ合金、Ｓｎ−Ｚｎ−Ｂｉ合金、Ｓｎ−Ｚｎ−Ａｌ合金などのハンダ材またはＡｕ−Ｓｎ合金、Ａｇ−Ｃｕ合金などのロウ材１５からなり、ロウ材１５は絶縁ガラス１３の軟化点より低温の溶融温度を有することを特徴とする。
As shown in FIGS. 1 to 3, the
本発明の気密端子１０は、図４の工程フロー図２０に示すように、低電気抵抗材のパイプリードと、絶縁ガラスのタブレットとを、金属外環の貫通孔に挿通し、さらに低熱膨張材の母材に絶縁ガラスの軟化点未満の溶融温度を有するロウ材を装着した芯材リードを、パイプリードの内径に挿通して封着治具にセットする部品振込工程２１、封着治具にセットした各部材をガラス軟化点以上の温度に調温した加熱炉に通して金属外環とパイプリードをガラス封着すると共にパイプリードと芯材リードもロウ接する封着ロウ付け工程２２によって製造される。芯材リードへのロウ材の装着方法は、封着ロウ付け工程でパイプリードと芯材リードとの間を溶融したロウ材で充填できればどの様な方法でもよく、例えば、予め芯材リードの周壁にロウ材を取り付け、これをパイプリードに挿通して通炉するか、パイプリードまたは芯材リードの端部にロウ材を搭載して通炉するか何れかの方法で適用するのが好ましい。これにより、一度の通炉で絶縁ガラスの軟化点未満の溶融温度を有するロウ材を用いて、パイプリードと芯材リードとの間を隙間なく接合でき、しかも両者の中間層を構成するロウ材の緩衝機能により、冷却時に問題となる急激なリード軸方向の収縮を緩和してパイプリードと芯材リードの界面剥離を抑え、端子の気密信頼性を高める。また低電気抵抗材からなるパイプリードを最外層に用いたことで端子の電気抵抗を低減できる。
As shown in the process flow diagram 20 of FIG. 4, the
本発明に係る実施例１の気密端子１０は、図１ないし図３に示すように、３個の貫通孔を有した炭素鋼の金属外環１１と、この金属外環１１の貫通孔に挿通した銅製のパイプリード１２と、パイプリード１２と金属外環１１とを封着するソーダバリウムガラスの絶縁ガラス１３と、パイプリード１２の内径に挿通したＦｅ−Ｃｒ合金からなる低熱膨張材の芯材リード１４と、芯材リード１４の外径とパイプリード１２の内径との間を隙間なく接合したＳｎ−Ａｇ合金のロウ材１５からなり、ロウ材１５は絶縁ガラス１３の軟化点より低温の溶融温度を有する。
As shown in FIGS. 1 to 3, the
本発明に係る実施例１の気密端子１０は、図４の工程フロー図２０に示すように、低電気抵抗材のパイプリードと、絶縁ガラスのタブレットとを、金属外環の貫通孔に挿通し、さらに低熱膨張材の母材に絶縁ガラスの軟化点未満の溶融温度を有するロウ材を装着した芯材リードを、パイプリードの内径に挿通して封着治具にセットする部品振込工程２１、封着治具にセットした各部材をガラス軟化点以上の１０００℃に調温した加熱炉に通して金属外環とパイプリードをガラス封着すると共にパイプリードと芯材リードもロウ接する封着ロウ付け工程２２によって製造される。
As shown in the process flow diagram 20 of FIG. 4, the
本発明は、特に高圧力下で高電圧・高電流に耐久し、高い気密性が要求される気密端子に利用できる。 The present invention can be used for an airtight terminal that is durable to a high voltage and a high current, particularly under a high pressure, and requires high airtightness.
１０・・・気密端子、
１１・・・金属外環、
１２・・・パイプリード、
１３・・・絶縁ガラス、
１４・・・芯材リード、
１５・・・ロウ材、
２０・・・工程フロー図、
２１・・・部品振込工程、
２２・・・封着ロウ付け工程。
10 ... Airtight terminal,
11 ... Metal outer ring,
12 ... Pipe reed,
13: Insulating glass,
14 ... Core lead,
15 ... brazing material,
20 ... Process flow diagram,
21 ... Parts transfer process,
22: Sealing brazing process.
Claims (10)
The brazing material is Sn, Ni-P alloy, Sn-Bi alloy, Sn-Bi-Ag alloy, Sn-Cu alloy, Sn-Ag alloy, Sn-Ag-In-Bi alloy, Sn-Ag-Cu alloy, It is selected from Sn—Cu—Ag alloy, Sn—Cu—Ni alloy, Sn—Zn alloy, Sn—Zn—Bi alloy, Sn—Zn—Al alloy, Au—Sn alloy, and Ag—Cu alloy. The method for manufacturing an airtight terminal according to any one of claims 6 to 9.
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