CN100457370C - Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering - Google Patents
Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering Download PDFInfo
- Publication number
- CN100457370C CN100457370C CNB2006100486231A CN200610048623A CN100457370C CN 100457370 C CN100457370 C CN 100457370C CN B2006100486231 A CNB2006100486231 A CN B2006100486231A CN 200610048623 A CN200610048623 A CN 200610048623A CN 100457370 C CN100457370 C CN 100457370C
- Authority
- CN
- China
- Prior art keywords
- solder
- silver
- soldering
- circuit breaker
- based alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Contacts (AREA)
Abstract
His invention relates to an Ag alloy solder used to improve the sealing property of vacuum device, which can reduce the solder cost, wherein based on the AgCu alloy solder, it adds some Ni component, to improve the property of solder, and improve the humidify property and welding strength of mother base of solder, and replace the Pd group solder in multi-stage welding, and reduce the cost.
Description
Technical field
The present invention relates to silver-based alloy solder, particularly relate to yellow gold solder and the application in vacuum circuit breaker step soldering thereof.
Background technology
Vacuum electron device is to be connected to form by welding method by multiple material, complex structure, and the dimension precision requirement height, soldering is the method for widespread usage.Because the mother metal performance of soldering is different, in being tightly connected, need from high temperature to low temperature, to carry out multistage soldering usually.A large amount of at present both at home and abroad Ag base solders that contain Pd that adopt weld as one-level, and 850 ℃~900 ℃ of brazing temperatures are carried out secondary welding, about 820 ℃ of brazing temperatures with AgCu28 again.And the AgCu28 solder is bad to stainless wetability, also need plate Ni and handle, and has increased processing step and cost, and it is higher to contain the Ag base solder price of Pd, and vacuum device need carry out secondary welding when making, and has improved the manufacturing cost of device greatly.
Summary of the invention
After the AgCu alloy adds the Ni constituent element, can be used for the soldering of copper-copper, copper-stainless-steel, kovar alloy and metallized ceramic and metal, be widely used in the multistage soldering of vacuum circuit breaker parts and other air locking soldering.
The purpose of this invention is to provide: Cu:28%~32%, Ni; 1%~5%, Ag surplus, serial solder.This series solder is applicable to the soldering of copper-copper in the vacuum circuit breaker spare, copper-stainless-steel, kovar alloy and metallized ceramic and metal, and its calking, wetability, free-running property, joint brazing intensity, soldering vacuum-tightness all reach the specification requirement of vacuum circuit breaker spare.
The present invention be directed to and improve the Ag base solder alloy performance that the vacuum device sealed welding uses and reduce the solder cost and carry out, on AgCu solder alloy basis commonly used, add an amount of Ni constituent element, the performance of solder is effectively improved, thereby improve wettability and the weld strength of solder to the soldering mother metal, and substitute the use of Pd brazing filler metal in the multistage soldering, reduce cost.
By in Ag base solder, adding an amount of Ni, the fusion temperature of solder suitably improves, solder is improved to the wettability of soldering mother metal, especially stainless steel material, in brazing process, adopt the process conditions of a soldering, thereby reduce or the alternative application that contains the Pd solder, enhance productivity, reduce the generation cost of vacuum device.
The specific embodiment
The trial-production condition: vacuum intermediate frequency (IF) smelting stove, vacuum is not less than 1 * 10
-2Pa, material purity 〉=99.99%.
Embodiment 1 is with 10 kilograms in every stove, and AgCu28%Ni1~3% is an example, carries out weighing on precision 0.1 gram balance, takes by weighing pure Ag:7100~6900 grams, pure Cu:2800 gram, pure Ni:100~300 grams.Whole furnace charges are once packed in the stove, vacuumize and reach 1 * 10
-2Pa is warming up to 1000 ℃ of melting batch, treats that whole furnace charge fusings finish the cooling cooled and solidified.Afterwards, vacuumize once more and reach 1 * 10
-2More than the Pa, towards the Ar gas shiled, heating up makes the furnace charge fusing evenly, is cast into required billet.For strip product, ingot casting through hot rolling cogging, in roll, technologies such as annealing, finish rolling, make required product.For the silk section product, ingot casting makes required product through technologies such as extruding, drawing, annealing, drawings.
Embodiment 2 is with 10 kilograms in every stove, and AgCu28%Ni4~5% is an example, carries out weighing on precision 0.1 gram balance, takes by weighing pure Ag:7000~6700 grams, pure Cu:2200~2300 grams, CuNi50 intermediate alloy: 800~1000 grams.Whole furnace charges are once packed in the stove, vacuumize and reach 1 * 10
-2Pa is warming up to 1200 ℃ of melting batch, treats that whole furnace charge fusings finish the cooling cooled and solidified.Vacuumize once more afterwards and reach 1 * 10
-2More than the Pa, towards the Ar gas shiled, heating up makes the furnace charge fusing evenly, is cast into required billet.For strip product, ingot casting through hot rolling cogging, in roll, technologies such as annealing, finish rolling, make required product.For the silk section product, ingot casting makes required product through technologies such as extruding, drawing, annealing, drawings.
Embodiment 3 is with 10 kilograms in every stove, and AgCu28%Ni2 is an example, carries out weighing on precision 0.1 gram balance, takes by weighing pure Ag:6900~6800 grams, pure Cu:2250~2300 grams, CuNi50 intermediate alloy: 900~1000 grams.Whole furnace charges are once packed in the stove, vacuumize and reach 1 * 10
-2Pa is warming up to 1200 ℃ of melting batch, treats that whole furnace charge fusings finish the cooling cooled and solidified.Vacuumize once more afterwards and reach 1 * 10
-2More than the Pa, towards the Ar gas shiled, heating up makes the furnace charge fusing evenly, is cast into required billet.For strip product, ingot casting through hot rolling cogging, in roll, technologies such as annealing, finish rolling, make required product.For the silk section product, ingot casting makes required product through technologies such as extruding, drawing, annealing, drawings.
Claims (4)
1, a kind of silver-based alloy solder, the percentage by weight that it is characterized in that containing in this solder following composition: Cu is 28%~32%, the percentage by weight of Ni is 1%~5%, the Ag surplus.
2, silver-based alloy solder according to claim 1, the percentage by weight that it is characterized in that Ni is 2%.
3, silver-based alloy solder according to claim 1 is characterized in that this solder is applied to the soldering of copper-copper in the vacuum circuit breaker spare, copper-stainless-steel, kovar alloy and metal and metallized ceramic and metal.
4, silver-based alloy solder according to claim 2 is characterized in that this solder is applied to the soldering of copper-copper in the vacuum circuit breaker spare, copper-stainless-steel, kovar alloy and metal and metallized ceramic and metal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100486231A CN100457370C (en) | 2006-08-17 | 2006-08-17 | Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100486231A CN100457370C (en) | 2006-08-17 | 2006-08-17 | Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1907638A CN1907638A (en) | 2007-02-07 |
CN100457370C true CN100457370C (en) | 2009-02-04 |
Family
ID=37698951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100486231A Expired - Fee Related CN100457370C (en) | 2006-08-17 | 2006-08-17 | Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100457370C (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103658901B (en) * | 2012-09-11 | 2016-08-03 | 杭州之江开关股份有限公司 | The intermediate frequency welding procedure of low-voltage high-capacity contact of breaker flexible connection |
CN103406684B (en) * | 2013-08-01 | 2016-01-06 | 中国航空工业集团公司北京航空材料研究院 | A kind of silver-copper-indium-nickel middle temperature brazing material |
CN105921908A (en) * | 2016-06-23 | 2016-09-07 | 国网江苏省电力公司宿迁供电公司 | Silver solder and preparation method thereof |
CN109382559B (en) * | 2017-08-09 | 2021-02-23 | 宁波江丰电子材料股份有限公司 | Backboard manufacturing method and backboard |
CN108161274B (en) * | 2017-11-24 | 2020-12-25 | 北京有色金属与稀土应用研究所 | Sealing solder for electric vacuum device and preparation method thereof |
CN111843087A (en) * | 2020-07-07 | 2020-10-30 | 哈尔滨工业大学 | Vacuum brazing process method for inhibiting high-temperature nitrogen precipitation in high-nitrogen steel |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2129482C1 (en) * | 1996-08-19 | 1999-04-27 | Научно-производственное объединение энергетического машиностроения им.акад.В.П.Глушко | Solder for parts soldering |
JP2001121288A (en) * | 1999-10-27 | 2001-05-08 | Tanaka Kikinzoku Kogyo Kk | Silver brazing filler metal for joining cemented carbide |
CN1377753A (en) * | 2001-03-26 | 2002-11-06 | 株式会社东芝 | Ag solder for welding and soldering method using it |
CN1446664A (en) * | 2003-04-10 | 2003-10-08 | 贵研铂业股份有限公司 | Silver alloy solder with low palladium content |
EP1078711B1 (en) * | 1999-08-24 | 2005-06-29 | BrazeTec GmbH | Cadmium-free brazing alloys |
-
2006
- 2006-08-17 CN CNB2006100486231A patent/CN100457370C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2129482C1 (en) * | 1996-08-19 | 1999-04-27 | Научно-производственное объединение энергетического машиностроения им.акад.В.П.Глушко | Solder for parts soldering |
EP1078711B1 (en) * | 1999-08-24 | 2005-06-29 | BrazeTec GmbH | Cadmium-free brazing alloys |
JP2001121288A (en) * | 1999-10-27 | 2001-05-08 | Tanaka Kikinzoku Kogyo Kk | Silver brazing filler metal for joining cemented carbide |
CN1377753A (en) * | 2001-03-26 | 2002-11-06 | 株式会社东芝 | Ag solder for welding and soldering method using it |
CN1446664A (en) * | 2003-04-10 | 2003-10-08 | 贵研铂业股份有限公司 | Silver alloy solder with low palladium content |
Non-Patent Citations (2)
Title |
---|
钎焊手册. 美国焊接学会钎焊委员会,第36、342页,国防工业出版社. 1982 |
钎焊手册. 美国焊接学会钎焊委员会,第36、342页,国防工业出版社. 1982 * |
Also Published As
Publication number | Publication date |
---|---|
CN1907638A (en) | 2007-02-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100457370C (en) | Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering | |
US20200030921A1 (en) | Alloys | |
CN101780607B (en) | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof | |
CN101367159B (en) | Cu-P based amorphous brazing filler metal and method for manufacturing the same | |
CN102862003A (en) | Silver-free copper based solder and preparation method thereof | |
CN101007376A (en) | Silver based electric vacuum solder | |
CN102115834B (en) | Gold-copper-nickel alloy, preparation method and application thereof | |
CN102935559A (en) | Composite zinc-aluminum flux cored wire containing beryllium and magnesium and rubidium salt and preparation method of flux cored wire | |
CN105189030A (en) | Nickel brazing filler metal having exceptional corrosion resistance | |
WO2007079671A1 (en) | Lead-free solder and its preparation method | |
CN103240543A (en) | Nickel-based amorphous brazing filler metal | |
CN100409996C (en) | Oxidation resistance tin-based no-lead solder capable of proceeding welding without welding flux in air | |
CN109465564A (en) | The zinc-aluminium medicine core solder that a kind of soldering strength is high, corrosion resistance is strong | |
CN103100825A (en) | Manufacturing method for pre-alloying gold-tin pre-forming soldering lug | |
CN101380701A (en) | High-temperature leadless soft solder and preparation method thereof | |
CN100439029C (en) | Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering | |
CN109079363A (en) | A kind of sealing-in solder of low-vapor pressure low melting point | |
CN111421261B (en) | High-entropy alloy solder for electronic packaging assembly brazing and preparation method thereof | |
CN103170760A (en) | Electric vacuum brazing filler and preparation method thereof | |
CN102500946A (en) | Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same | |
CN103014404B (en) | Alloy material for sealing microwave magnetron and preparation method thereof | |
CN103014406B (en) | Multicomponent alloy material for sealing microwave oven magnetron | |
CN100364713C (en) | Ag-Al-Cu-Ni-Sn series lead-free soldering tin | |
CN107322178A (en) | A kind of new solder for power device package | |
CN107971652B (en) | Electric vacuum brazing filler metal and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090204 Termination date: 20150817 |
|
EXPY | Termination of patent right or utility model |