JP2017063187A - 半導体デバイス、シリコンウェハ、及びシリコンウェハの製造方法 - Google Patents
半導体デバイス、シリコンウェハ、及びシリコンウェハの製造方法 Download PDFInfo
- Publication number
- JP2017063187A JP2017063187A JP2016164702A JP2016164702A JP2017063187A JP 2017063187 A JP2017063187 A JP 2017063187A JP 2016164702 A JP2016164702 A JP 2016164702A JP 2016164702 A JP2016164702 A JP 2016164702A JP 2017063187 A JP2017063187 A JP 2017063187A
- Authority
- JP
- Japan
- Prior art keywords
- boron
- silicon
- doping
- type dopant
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 216
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 216
- 239000010703 silicon Substances 0.000 title claims abstract description 216
- 239000004065 semiconductor Substances 0.000 title claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000002019 doping agent Substances 0.000 claims abstract description 135
- 238000000034 method Methods 0.000 claims abstract description 77
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 17
- 239000001257 hydrogen Substances 0.000 claims abstract description 17
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 118
- 229910052796 boron Inorganic materials 0.000 claims description 118
- 239000000463 material Substances 0.000 claims description 106
- 238000005204 segregation Methods 0.000 claims description 42
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 39
- 229910052698 phosphorus Inorganic materials 0.000 claims description 39
- 239000011574 phosphorus Substances 0.000 claims description 39
- 230000008569 process Effects 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000010453 quartz Substances 0.000 claims description 14
- 238000009792 diffusion process Methods 0.000 claims description 13
- 238000000137 annealing Methods 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052733 gallium Inorganic materials 0.000 claims description 10
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 9
- 230000036961 partial effect Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- 238000011065 in-situ storage Methods 0.000 claims description 6
- 238000005468 ion implantation Methods 0.000 claims description 6
- 238000002513 implantation Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 229910052580 B4C Inorganic materials 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000012159 carrier gas Substances 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 230000005669 field effect Effects 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 41
- 239000000155 melt Substances 0.000 description 30
- 230000000694 effects Effects 0.000 description 11
- 239000000370 acceptor Substances 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 230000004323 axial length Effects 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 210000000746 body region Anatomy 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000006187 pill Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
- C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B30/00—Production of single crystals or homogeneous polycrystalline material with defined structure characterised by the action of electric or magnetic fields, wave energy or other specific physical conditions
- C30B30/04—Production of single crystals or homogeneous polycrystalline material with defined structure characterised by the action of electric or magnetic fields, wave energy or other specific physical conditions using magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/167—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table further characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66136—PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/6634—Vertical insulated gate bipolar transistors with a recess formed by etching in the source/emitter contact region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
【解決手段】 半導体デバイスの一実施形態は、正味のn型ドーピングのドリフトまたはベース区域を含むシリコン半導体本体を含む。n型ドーピングはp型ドーパントにより10%〜80%部分的に補償される。ドリフトまたはベース区域内の正味のn型ドーピング濃度は1x1013cm−3〜1x1015cm−3の範囲内にある。n型ドーピングの5%〜75%の部分は水素関連ドナーで構成される。
【選択図】 図1
Description
101 第1の表面
102 第2の表面
110 シリコン融液
112 シリコンインゴット
204 シリコン半導体本体
205 ドリフト区域
210 第1の表面
211 第2の表面
220 第1の負荷端子構造
225 第2の負荷端子構造
605 るつぼ
610 シリコン融液
612 シリコンインゴット
625 ドーパント源材料
626 表面
2001 縦型半導体デバイス
2002 横型半導体デバイス
Claims (39)
- 半導体デバイスであって、
正味のn型ドーピングのドリフトまたはベース区域を含むシリコン半導体本体であって、n型ドーピングがp型ドーパントにより10%〜80%部分的に補償され、前記ドリフト区域内の正味のn型ドーピング濃度は1x1013cm−3〜1x1015cm−3の範囲内にあり、前記n型ドーピングの5%〜75%の部分は水素関連ドナーで構成される、シリコン半導体本体
を含む、半導体デバイス。 - 前記ドリフトまたはベース区域内のn型ドーパントと前記ドリフトまたはベース区域内のp型ドーパントとの偏析係数の比が0.25〜4の範囲内にある、請求項1に記載の半導体デバイス。
- 前記n型ドーピングが、ホウ素によって部分的に補償されたリンを含む、請求項1または2に記載の半導体デバイス。
- 前記ドリフト区域内の前記正味のn型ドーピングが、リンよりも小さい偏析係数を有するp型ドーパント種によってさらに補償される、請求項3に記載の半導体デバイス。
- 前記p型ドーパント種がアルミニウムおよびガリウムのうちの少なくとも1つに対応する、請求項3に記載の半導体デバイス。
- ホウ素と、アルミニウムおよびガリウムのうちの前記少なくとも1つとの濃度比が少なくとも2である、請求項5に記載の半導体デバイス。
- 前記ドリフト区域の前記正味のnドーピングが前記シリコン半導体本体の原材料のドーピングに対応し、前記ドリフト区域内の前記正味のドーピング濃度よりも大きい正味のドーピング濃度を有するpドープ領域およびnドープ領域をさらに含む、請求項1〜6のいずれか一項に記載の半導体デバイス。
- 前記半導体デバイスが、絶縁ゲートバイポーラトランジスタ、ダイオードおよび絶縁ゲート電界効果トランジスタのうちの1つである、請求項1〜6のいずれか一項に記載の半導体デバイス。
- 前記半導体デバイスが、前記半導体本体の第1の表面における第1の負荷端子と、前記第1の表面の反対側の第2の表面における第2の負荷端子とを備える縦型パワー半導体デバイスである、請求項1〜8のいずれか一項に記載の半導体デバイス。
- 前記半導体本体の反対側の主表面の間における縦方向に沿った前記水素関連ドナーの濃度プロファイルの変化が80%未満である、請求項1〜9のいずれか一項に記載の半導体デバイス。
- 正味のn型ドーピングを含むシリコンウェハであって、n型ドーピングがp型ドーパントにより10%〜80%部分的に補償され、前記正味のn型ドーピング濃度は1x1013cm−3〜1x1015cm−3の範囲内にあり、前記n型ドーピングの5%〜75%の部分は水素関連ドナーで構成される、シリコンウェハ。
- 前記n型ドーピングが、ホウ素によって部分的に補償されたリンを含む、請求項11に記載のシリコンウェハ。
- 前記正味のn型ドーピングが、リンよりも小さい偏析係数を有するp型ドーパント種によってさらに補償される、請求項11または12に記載のシリコンウェハ。
- 前記p型ドーパント種がアルミニウムおよびガリウムのうちの少なくとも1つに対応する、請求項13に記載のシリコンウェハ。
- ホウ素と、アルミニウムおよびガリウムのうちの前記少なくとも1つとの濃度比が少なくとも2である、請求項14に記載のシリコンウェハ。
- シリコンウェハを製造する方法であって、前記方法は、
n型ドーパントを含むシリコン融液から引き出し期間にわたってn型シリコンインゴットを引き出すことと、
前記引き出し期間の少なくとも一部にわたって前記シリコン融液にp型ドーパントを添加し、それにより、前記n型シリコンインゴット内のn型ドーピングを10%〜80%補償することと、
前記シリコンインゴットをスライスすることと、
前記シリコンウェハに陽子を照射し、その後、前記シリコンウェハをアニールすることによって前記シリコンウェハ内に水素関連ドナーを形成することと、
を含む、方法。 - 前記n型ドーピングの5%〜75%の部分が水素関連ドナーで構成される、請求項16に記載の方法。
- 前記n型ドーパントのn型ドーパント種の偏析係数と前記p型ドーパントのp型ドーパント種の偏析係数とが少なくとも3倍異なる、請求項16又は17に記載の方法。
- 前記n型ドーパント種がリンであり、前記p型ドーパント種がホウ素である、請求項16〜18のいずれか一項に記載の方法。
- ホウ素に加えて、前記引き出し期間の少なくとも一部にわたって前記シリコン融液に、リンよりも小さい偏析係数を有する第2のp型ドーパント種を添加することをさらに含む、請求項19に記載の方法。
- 前記第2のp型ドーパント種がアルミニウムおよびガリウムのうちの少なくとも1つに対応する、請求項20に記載の方法。
- 前記ホウ素が、ホウ素ドープ石英材料、または気相におけるホウ素のうちの少なくとも1つから前記シリコン融液に添加される、請求項19〜21のいずれか一項に記載の方法。
- 前記ホウ素が、炭化ホウ素または窒化ホウ素源材料から前記シリコン融液に添加される、請求項19〜21のいずれか一項に記載の方法。
- 前記ホウ素が、ホウ素をドープされたるつぼから前記シリコン融液に添加される、請求項19〜21のいずれか一項に記載の方法。
- 前記ホウ素をドープされたるつぼが、前記るつぼ内にホウ素を打ち込むこと、前記るつぼ内へのホウ素の拡散、およびin−situドーピングのうちの少なくとも1つによって形成される、請求項24に記載の方法。
- 前記ホウ素が様々なエネルギーおよびドーズで前記るつぼ内に打ち込まれる、請求項25に記載の方法。
- 加熱によって前記るつぼに、前記るつぼ内に前記ホウ素の逆行プロファイルを設定するように構成されたサーマルバジェットを印加することをさらに含む、請求項24〜26のいずれか一項に記載の方法。
- 前記るつぼの内壁における層を形成することをさらに含む、請求項27に記載の方法。
- 前記シリコン融液に前記ホウ素を添加する速度を変更することをさらに含む、請求項19〜28のいずれか一項に記載の方法。
- 前記シリコン融液に前記ホウ素を添加する前記速度を変更することが、粒子のサイズ、幾何学的形状および送出速度、ホウ素キャリアガスの流量または分圧のうちの少なくとも1つを変更することを含む、請求項29に記載の方法。
- 前記シリコン融液に前記ホウ素を添加する前記速度を変更することが、前記シリコン融液内に浸漬される源材料の深さを変更すること、および前記源材料の温度を変更することのうちの少なくとも1つを含み、前記源材料は前記ホウ素をドープされている、請求項29に記載の方法。
- 前記源材料のドーピングが、in−situドーピング、前記源材料の表面を通したプラズマ堆積プロセス、前記源材料の前記表面を通したイオン打ち込み、および前記源材料の前記表面を通した拡散プロセスのうちの1つによって実行される、請求項31に記載の方法。
- チョクラルスキー成長プロセスの間に前記シリコンインゴットの重量を測定することによって前記シリコン融液に前記ホウ素を添加する速度を制御することをさらに含む、請求項29に記載の方法。
- 前記ホウ素をドープされた石英源材料の寸法の変化を光学的に測定することによって前記シリコン融液に前記ホウ素を添加する速度を制御することをさらに含む、請求項29に記載の方法。
- 源材料と前記シリコン融液との間の接触面積、および前記源材料の加熱のうちの少なくとも1つを変更することによって前記シリコン融液に前記ホウ素を添加する速度を変更することをさらに含む、請求項29に記載の方法。
- 前記シリコン融液に前記p型ドーパントを添加することが、p型ドーパント源材料からのp型ドーパントを前記シリコン融液内に溶解することを含む、請求項16〜35のいずれか一項に記載の方法。
- 前記シリコンウェハに陽子を照射することが、1x1013cm−2〜8x1014cm−2の範囲内の打ち込みドーズ、1.0MeV〜5.0MeVの範囲内の打ち込みエネルギー、460℃〜520℃の範囲内のアニール温度、および30分〜20時間の範囲内のアニール継続時間を含む、請求項16〜36のいずれか一項に記載の方法。
- 前記シリコンウェハの材料を除去することによって前記シリコンウェハの厚さを低減し、それにより、陽子照射のエンドオブレンジ・ピークを除去することをさらに含む、請求項16〜37のいずれか一項に記載の方法。
- 前記半導体ウェハの電気特性または材料特性を測定することと、前記測定された電気特性または材料特性の関数として陽子照射およびアニールの少なくとも1つのパラメータを設定することと、をさらに含む、請求項16〜38のいずれか一項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015114177.9 | 2015-08-26 | ||
DE102015114177.9A DE102015114177A1 (de) | 2015-08-26 | 2015-08-26 | Halbleitervorrichtung, Siliziumwafer und Verfahren zum Herstellen eines Siliziumwafers |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017063187A true JP2017063187A (ja) | 2017-03-30 |
JP2017063187A5 JP2017063187A5 (ja) | 2019-08-15 |
Family
ID=58010576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016164702A Pending JP2017063187A (ja) | 2015-08-26 | 2016-08-25 | 半導体デバイス、シリコンウェハ、及びシリコンウェハの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (3) | US20170062568A1 (ja) |
JP (1) | JP2017063187A (ja) |
DE (1) | DE102015114177A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021186944A1 (ja) * | 2020-03-17 | 2021-09-23 | ||
WO2021199687A1 (ja) * | 2020-04-02 | 2021-10-07 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014107590B3 (de) * | 2014-05-28 | 2015-10-01 | Infineon Technologies Ag | Halbleitervorrichtung, Siliziumwafer und Verfahren zum Herstellen eines Siliziumwafers |
DE102016015475B3 (de) * | 2016-12-28 | 2018-01-11 | 3-5 Power Electronics GmbH | IGBT Halbleiterstruktur |
US12027579B2 (en) * | 2017-01-25 | 2024-07-02 | Rohm Co., Ltd. | Semiconductor device having a carrier trapping region including crystal defects |
US10431462B2 (en) * | 2017-02-15 | 2019-10-01 | Lam Research Corporation | Plasma assisted doping on germanium |
US11585010B2 (en) * | 2019-06-28 | 2023-02-21 | Globalwafers Co., Ltd. | Methods for producing a single crystal silicon ingot using boric acid as a dopant and ingot puller apparatus that use a solid-phase dopant |
JP6976493B1 (ja) | 2020-03-13 | 2021-12-08 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
DE102020120933A1 (de) | 2020-08-07 | 2022-02-10 | Infineon Technologies Ag | Verfahren zum herstellen von cz-siliziumwafern |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59190292A (ja) * | 1983-04-08 | 1984-10-29 | Shin Etsu Handotai Co Ltd | 半導体シリコン単結晶の抵抗率制御方法 |
JPS61163188A (ja) * | 1985-01-14 | 1986-07-23 | Komatsu Denshi Kinzoku Kk | シリコン単結晶引上法における不純物のド−プ方法 |
JPH03199193A (ja) * | 1989-12-27 | 1991-08-30 | Nippon Steel Corp | シリコン単結晶の製造方法 |
JPH03247585A (ja) * | 1990-02-23 | 1991-11-05 | Sumitomo Metal Ind Ltd | 結晶成長方法 |
JPH1029894A (ja) * | 1996-07-15 | 1998-02-03 | Hitachi Ltd | 単結晶シリコンの比抵抗調整方法および単結晶シリコン製造装置 |
JP2003048798A (ja) * | 2001-08-06 | 2003-02-21 | Sharp Corp | 結晶シートの製造装置、結晶シートの製造方法、それを用いて得られる結晶シートおよび太陽電池 |
JP2004307305A (ja) * | 2003-04-10 | 2004-11-04 | Sumitomo Mitsubishi Silicon Corp | シリコン単結晶及び単結晶育成方法 |
JP2006344977A (ja) * | 2005-06-08 | 2006-12-21 | Infineon Technologies Ag | 阻止ゾーンを半導体基板に製造する方法、および、阻止ゾーンを有する半導体部品 |
JP2010531805A (ja) * | 2007-06-27 | 2010-09-30 | カリソーラー インク | 補償シリコン原料から製造されたインゴットの抵抗率を制御する方法およびシステム |
JP2011093778A (ja) * | 2009-09-29 | 2011-05-12 | Shin Etsu Handotai Co Ltd | シリコン単結晶ウェーハおよびシリコン単結晶の製造方法 |
JP2012136398A (ja) * | 2010-12-27 | 2012-07-19 | Covalent Materials Corp | シリコン単結晶引上げ用シリカガラスルツボ |
JP2013087008A (ja) * | 2011-10-17 | 2013-05-13 | Siltronic Ag | n型シリコン単結晶およびその製造方法 |
JP2015037194A (ja) * | 2013-08-14 | 2015-02-23 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 半導体ディスクの後ドーピング方法 |
DE202015102716U1 (de) * | 2014-05-28 | 2015-06-15 | Infineon Technologies Ag | Halbleitervorrichtung, Siliziumwafer und Siliziumstab |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000077350A (ja) | 1998-08-27 | 2000-03-14 | Mitsubishi Electric Corp | 電力用半導体装置及びその製造方法 |
CN102687277B (zh) | 2009-11-02 | 2016-01-20 | 富士电机株式会社 | 半导体器件以及用于制造半导体器件的方法 |
JP6067585B2 (ja) | 2011-12-28 | 2017-01-25 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
DE102012020785B4 (de) * | 2012-10-23 | 2014-11-06 | Infineon Technologies Ag | Erhöhung der Dotierungseffizienz bei Protonenbestrahlung |
CN104347408B (zh) * | 2013-07-31 | 2017-12-26 | 中芯国际集成电路制造(上海)有限公司 | 半导体装置及其制造方法 |
-
2015
- 2015-08-26 DE DE102015114177.9A patent/DE102015114177A1/de not_active Withdrawn
-
2016
- 2016-08-25 JP JP2016164702A patent/JP2017063187A/ja active Pending
- 2016-08-25 US US15/247,200 patent/US20170062568A1/en not_active Abandoned
-
2017
- 2017-11-22 US US15/820,770 patent/US10566424B2/en active Active
-
2020
- 2020-01-27 US US16/773,225 patent/US10957767B2/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59190292A (ja) * | 1983-04-08 | 1984-10-29 | Shin Etsu Handotai Co Ltd | 半導体シリコン単結晶の抵抗率制御方法 |
JPS61163188A (ja) * | 1985-01-14 | 1986-07-23 | Komatsu Denshi Kinzoku Kk | シリコン単結晶引上法における不純物のド−プ方法 |
JPH03199193A (ja) * | 1989-12-27 | 1991-08-30 | Nippon Steel Corp | シリコン単結晶の製造方法 |
JPH03247585A (ja) * | 1990-02-23 | 1991-11-05 | Sumitomo Metal Ind Ltd | 結晶成長方法 |
JPH1029894A (ja) * | 1996-07-15 | 1998-02-03 | Hitachi Ltd | 単結晶シリコンの比抵抗調整方法および単結晶シリコン製造装置 |
JP2003048798A (ja) * | 2001-08-06 | 2003-02-21 | Sharp Corp | 結晶シートの製造装置、結晶シートの製造方法、それを用いて得られる結晶シートおよび太陽電池 |
JP2004307305A (ja) * | 2003-04-10 | 2004-11-04 | Sumitomo Mitsubishi Silicon Corp | シリコン単結晶及び単結晶育成方法 |
JP2006344977A (ja) * | 2005-06-08 | 2006-12-21 | Infineon Technologies Ag | 阻止ゾーンを半導体基板に製造する方法、および、阻止ゾーンを有する半導体部品 |
JP2010531805A (ja) * | 2007-06-27 | 2010-09-30 | カリソーラー インク | 補償シリコン原料から製造されたインゴットの抵抗率を制御する方法およびシステム |
JP2011093778A (ja) * | 2009-09-29 | 2011-05-12 | Shin Etsu Handotai Co Ltd | シリコン単結晶ウェーハおよびシリコン単結晶の製造方法 |
JP2012136398A (ja) * | 2010-12-27 | 2012-07-19 | Covalent Materials Corp | シリコン単結晶引上げ用シリカガラスルツボ |
JP2013087008A (ja) * | 2011-10-17 | 2013-05-13 | Siltronic Ag | n型シリコン単結晶およびその製造方法 |
JP2015037194A (ja) * | 2013-08-14 | 2015-02-23 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 半導体ディスクの後ドーピング方法 |
DE202015102716U1 (de) * | 2014-05-28 | 2015-06-15 | Infineon Technologies Ag | Halbleitervorrichtung, Siliziumwafer und Siliziumstab |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021186944A1 (ja) * | 2020-03-17 | 2021-09-23 | ||
WO2021186944A1 (ja) * | 2020-03-17 | 2021-09-23 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
JP7334849B2 (ja) | 2020-03-17 | 2023-08-29 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
WO2021199687A1 (ja) * | 2020-04-02 | 2021-10-07 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
JP2021163929A (ja) * | 2020-04-02 | 2021-10-11 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
JP7264100B2 (ja) | 2020-04-02 | 2023-04-25 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
Also Published As
Publication number | Publication date |
---|---|
US10957767B2 (en) | 2021-03-23 |
US20180097064A1 (en) | 2018-04-05 |
DE102015114177A1 (de) | 2017-03-02 |
US20170062568A1 (en) | 2017-03-02 |
US20200161424A1 (en) | 2020-05-21 |
US10566424B2 (en) | 2020-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6849766B2 (ja) | 半導体素子、シリコンウエハ、及びシリコンインゴット | |
US10957767B2 (en) | Semiconductor device, silicon wafer and method of manufacturing a silicon wafer | |
US8361893B2 (en) | Semiconductor device and substrate with chalcogen doped region | |
US10128328B2 (en) | Method of manufacturing semiconductor devices and semiconductor device containing hydrogen-related donors | |
US10192955B2 (en) | Semiconductor device containing oxygen-related thermal donors | |
US10724148B2 (en) | Silicon ingot and method of manufacturing a silicon ingot | |
US11242616B2 (en) | Silicon ingot | |
JP2008177296A (ja) | 半導体装置、pnダイオード、igbt、及びそれらの製造方法 | |
JP2017063187A5 (ja) | ||
US10566198B2 (en) | Doping method | |
US10727311B2 (en) | Method for manufacturing a power semiconductor device having a reduced oxygen concentration | |
JP6671320B2 (ja) | Czシリコンウエハを製造する方法及び半導体装置を製造する方法 | |
JP2001501162A (ja) | SiC層中にボロンをドープされた領域を生成する方法 | |
US10957788B2 (en) | Semiconductor devices with superjunction structures | |
JP6904931B2 (ja) | 半導体デバイスを形成する方法 | |
US9312338B2 (en) | Semiconductor device containing chalcogen atoms and method of manufacturing | |
CN114059149A (zh) | 制造直拉硅晶片的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160826 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170926 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170928 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20171214 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20180226 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180326 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180522 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20180806 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20181022 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190226 |
|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20190626 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20190626 |
|
C11 | Written invitation by the commissioner to file amendments |
Free format text: JAPANESE INTERMEDIATE CODE: C11 Effective date: 20190709 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20190731 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20190806 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20190906 |
|
C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20190910 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20200317 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20200414 |
|
C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20200526 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200824 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20201104 |
|
C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20201124 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20210330 |
|
C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20210413 |
|
C03 | Trial/appeal decision taken |
Free format text: JAPANESE INTERMEDIATE CODE: C03 Effective date: 20210518 |
|
C30A | Notification sent |
Free format text: JAPANESE INTERMEDIATE CODE: C3012 Effective date: 20210518 |