JP2017047510A - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP2017047510A JP2017047510A JP2015173628A JP2015173628A JP2017047510A JP 2017047510 A JP2017047510 A JP 2017047510A JP 2015173628 A JP2015173628 A JP 2015173628A JP 2015173628 A JP2015173628 A JP 2015173628A JP 2017047510 A JP2017047510 A JP 2017047510A
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- Prior art keywords
- grinding
- wafer
- height
- holding surface
- ground
- Prior art date
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000000203 mixture Substances 0.000 claims abstract description 31
- 238000002347 injection Methods 0.000 claims abstract description 15
- 239000007924 injection Substances 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims description 57
- 238000005259 measurement Methods 0.000 claims description 30
- 239000000523 sample Substances 0.000 abstract description 30
- 239000000428 dust Substances 0.000 abstract description 8
- 239000000243 solution Substances 0.000 abstract 1
- 239000004575 stone Substances 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 11
- 239000007921 spray Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 238000003892 spreading Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
21 チャックテーブル
22 回転手段
23 保持面
48 砥石
61 算出部
62 被研削面高さ測定部
64 第1の測定子
65 保持面高さ測定部
67 第2の測定子
71、76 混合液噴射ノズル
81 被研削面
W ウエーハ
Claims (1)
- ウエーハを保持面で保持するチャックテーブルと、該保持面中心を軸に該チャックテーブルを回転させる回転手段と、該チャックテーブルに保持されたウエーハを砥石で研削する研削手段と、該チャックテーブルに保持されたウエーハの被研削面に第1の測定子を接触させ被研削面の高さを測定する被研削面高さ測定部と、該保持面に第2の測定子を接触させ該保持面の高さを測定する保持面高さ測定部と、該被研削面高さ測定部の値と該保持面高さ測定部の値との差からウエーハの厚みを算出する算出部と、を備える研削装置であって、
該第1の測定子および該第2の測定子のうち少なくとも第2の測定子の先端に向かって水とエアとを混合させた混合液を噴射させる混合液噴射ノズルを備え、該被研削面および該保持面に接触する該第1の測定子および該第2の測定子のうち少なくとも第2の測定子が接触する該保持面の高さの値の変化を防止することを特徴とする研削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2015173628A JP6576747B2 (ja) | 2015-09-03 | 2015-09-03 | 研削装置 |
Applications Claiming Priority (1)
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JP2015173628A JP6576747B2 (ja) | 2015-09-03 | 2015-09-03 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017047510A true JP2017047510A (ja) | 2017-03-09 |
JP6576747B2 JP6576747B2 (ja) | 2019-09-18 |
Family
ID=58278506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015173628A Active JP6576747B2 (ja) | 2015-09-03 | 2015-09-03 | 研削装置 |
Country Status (1)
Country | Link |
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JP (1) | JP6576747B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017164823A (ja) * | 2016-03-14 | 2017-09-21 | 株式会社ディスコ | 研削装置 |
JP2019038044A (ja) * | 2017-08-22 | 2019-03-14 | 株式会社ディスコ | 研削方法 |
JPWO2021166687A1 (ja) * | 2020-02-17 | 2021-08-26 | ||
TWI783983B (zh) * | 2017-03-29 | 2022-11-21 | 日商日東電工股份有限公司 | 經非直線加工之附黏著劑層之光學積層體之製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11333719A (ja) * | 1998-05-26 | 1999-12-07 | Samsung Electronics Co Ltd | 半導体ウェ―ハのグラインディング装置 |
JP2013184277A (ja) * | 2012-03-09 | 2013-09-19 | Disco Corp | バイト切削装置 |
JP2014079838A (ja) * | 2012-10-16 | 2014-05-08 | Disco Abrasive Syst Ltd | 研削装置 |
-
2015
- 2015-09-03 JP JP2015173628A patent/JP6576747B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11333719A (ja) * | 1998-05-26 | 1999-12-07 | Samsung Electronics Co Ltd | 半導体ウェ―ハのグラインディング装置 |
JP2013184277A (ja) * | 2012-03-09 | 2013-09-19 | Disco Corp | バイト切削装置 |
JP2014079838A (ja) * | 2012-10-16 | 2014-05-08 | Disco Abrasive Syst Ltd | 研削装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017164823A (ja) * | 2016-03-14 | 2017-09-21 | 株式会社ディスコ | 研削装置 |
TWI783983B (zh) * | 2017-03-29 | 2022-11-21 | 日商日東電工股份有限公司 | 經非直線加工之附黏著劑層之光學積層體之製造方法 |
JP2019038044A (ja) * | 2017-08-22 | 2019-03-14 | 株式会社ディスコ | 研削方法 |
JPWO2021166687A1 (ja) * | 2020-02-17 | 2021-08-26 | ||
JP7450700B2 (ja) | 2020-02-17 | 2024-03-15 | 東京エレクトロン株式会社 | 加工装置 |
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JP6576747B2 (ja) | 2019-09-18 |
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