JP2017013199A - 切削装置 - Google Patents
切削装置 Download PDFInfo
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- JP2017013199A JP2017013199A JP2015134192A JP2015134192A JP2017013199A JP 2017013199 A JP2017013199 A JP 2017013199A JP 2015134192 A JP2015134192 A JP 2015134192A JP 2015134192 A JP2015134192 A JP 2015134192A JP 2017013199 A JP2017013199 A JP 2017013199A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 217
- 238000003860 storage Methods 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 description 8
- 238000003754 machining Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000007726 management method Methods 0.000 description 4
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- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02054—Cleaning before device manufacture, i.e. Begin-Of-Line process combining dry and wet cleaning steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Numerical Control (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
14 モニタ(入力手段、表示手段)
21 保持手段
36 切削ブレード
37 切削手段
71 ブレードケース
72 ケースホルダ
81 制御手段
82 特性記憶部
84 表示制御部
87 所定エリア
W 被加工物
Claims (1)
- 被加工物を保持する保持手段と、該保持手段が保持する被加工物を切削する切削ブレードを回転可能に装着する切削手段と、情報を入力する入力手段と、該入力手段から入力された情報を表示する表示手段と、制御手段と、を備える切削装置であって、
該切削ブレードの特性が色によって設定されており、
該制御手段は、該切削ブレードの特性が設定された色とIDとを記憶する特性記憶部と、該入力手段で入力された入力IDと該特性記憶部に記憶された該IDとを照合して該入力された該入力IDに対する該特性記憶部が記憶する該色で該表示手段の所定エリアを表示する表示制御部と、を備える切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015134192A JP2017013199A (ja) | 2015-07-03 | 2015-07-03 | 切削装置 |
TW105117409A TWI714593B (zh) | 2015-07-03 | 2016-06-02 | 切割裝置 |
CN201610509534.6A CN106313347B (zh) | 2015-07-03 | 2016-06-30 | 切削装置 |
KR1020160082344A KR20170004880A (ko) | 2015-07-03 | 2016-06-30 | 절삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015134192A JP2017013199A (ja) | 2015-07-03 | 2015-07-03 | 切削装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017013199A true JP2017013199A (ja) | 2017-01-19 |
Family
ID=57725470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015134192A Pending JP2017013199A (ja) | 2015-07-03 | 2015-07-03 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2017013199A (ja) |
KR (1) | KR20170004880A (ja) |
CN (1) | CN106313347B (ja) |
TW (1) | TWI714593B (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018129329A (ja) * | 2017-02-06 | 2018-08-16 | 株式会社ディスコ | 切削装置 |
KR20190024700A (ko) * | 2017-08-31 | 2019-03-08 | 가부시기가이샤 디스코 | 가공 장치 |
KR20190085866A (ko) * | 2018-01-11 | 2019-07-19 | 가부시기가이샤 디스코 | 가공 장치 및 가공 수단의 부착 방법 |
CN110450287A (zh) * | 2019-06-26 | 2019-11-15 | 云浮市科特机械有限公司 | 一种石材自动化生产方法 |
JP2020144420A (ja) * | 2019-03-04 | 2020-09-10 | 株式会社ディスコ | 加工装置および加工管理部材 |
KR20200120513A (ko) | 2019-04-12 | 2020-10-21 | 가부시기가이샤 디스코 | 절삭 장치 |
JP6851525B1 (ja) * | 2020-03-25 | 2021-03-31 | Dmg森精機株式会社 | 工具マガジン装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6998158B2 (ja) * | 2017-09-07 | 2022-01-18 | 株式会社ディスコ | 切削ブレード供給装置 |
JP7017949B2 (ja) * | 2018-03-02 | 2022-02-09 | 株式会社ディスコ | 加工装置 |
CN109514302A (zh) * | 2018-12-11 | 2019-03-26 | 浙江英洛华装备制造有限公司 | 易割片的切割辅助装置 |
JP6944103B2 (ja) * | 2019-10-22 | 2021-10-06 | エヌティーエンジニアリング株式会社 | 作業機械の加工状態監視方法及びシステム |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009083016A (ja) * | 2007-09-28 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削装置 |
JP2012004262A (ja) * | 2010-06-16 | 2012-01-05 | Disco Abrasive Syst Ltd | 切削ブレードの管理方法 |
JP2012000704A (ja) * | 2010-06-16 | 2012-01-05 | Disco Corp | 切削ブレードの管理方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9012044D0 (en) | 1990-05-30 | 1990-07-18 | British Telecomm | Cellular radio |
JP2004272837A (ja) * | 2003-03-12 | 2004-09-30 | Toyota Motor Corp | 中間体形状データ作成装置および工具軌跡作成装置および最終体製作用データ作成システム |
JP5055732B2 (ja) * | 2005-09-15 | 2012-10-24 | 村田機械株式会社 | 段取工具情報表示装置 |
KR101879924B1 (ko) * | 2013-04-11 | 2018-07-18 | 시티즌 도케이 가부시키가이샤 | 오프셋 번호 설정 장치 |
-
2015
- 2015-07-03 JP JP2015134192A patent/JP2017013199A/ja active Pending
-
2016
- 2016-06-02 TW TW105117409A patent/TWI714593B/zh active
- 2016-06-30 KR KR1020160082344A patent/KR20170004880A/ko not_active Application Discontinuation
- 2016-06-30 CN CN201610509534.6A patent/CN106313347B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009083016A (ja) * | 2007-09-28 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削装置 |
JP2012004262A (ja) * | 2010-06-16 | 2012-01-05 | Disco Abrasive Syst Ltd | 切削ブレードの管理方法 |
JP2012000704A (ja) * | 2010-06-16 | 2012-01-05 | Disco Corp | 切削ブレードの管理方法 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018129329A (ja) * | 2017-02-06 | 2018-08-16 | 株式会社ディスコ | 切削装置 |
KR20190024700A (ko) * | 2017-08-31 | 2019-03-08 | 가부시기가이샤 디스코 | 가공 장치 |
JP2019046891A (ja) * | 2017-08-31 | 2019-03-22 | 株式会社ディスコ | 加工装置 |
KR102542087B1 (ko) * | 2017-08-31 | 2023-06-09 | 가부시기가이샤 디스코 | 가공 장치 |
KR20190085866A (ko) * | 2018-01-11 | 2019-07-19 | 가부시기가이샤 디스코 | 가공 장치 및 가공 수단의 부착 방법 |
CN110026876A (zh) * | 2018-01-11 | 2019-07-19 | 株式会社迪思科 | 加工装置、以及加工单元的安装方法 |
JP2019123020A (ja) * | 2018-01-11 | 2019-07-25 | 株式会社ディスコ | 加工装置及び加工手段の取り付け方法 |
KR102665142B1 (ko) | 2018-01-11 | 2024-05-10 | 가부시기가이샤 디스코 | 가공 장치 및 가공 수단의 부착 방법 |
JP2020144420A (ja) * | 2019-03-04 | 2020-09-10 | 株式会社ディスコ | 加工装置および加工管理部材 |
JP7198119B2 (ja) | 2019-03-04 | 2022-12-28 | 株式会社ディスコ | 加工装置 |
KR20200120513A (ko) | 2019-04-12 | 2020-10-21 | 가부시기가이샤 디스코 | 절삭 장치 |
JP2020174150A (ja) * | 2019-04-12 | 2020-10-22 | 株式会社ディスコ | 切削装置 |
JP7229640B2 (ja) | 2019-04-12 | 2023-02-28 | 株式会社ディスコ | 切削装置 |
CN110450287B (zh) * | 2019-06-26 | 2020-03-10 | 云浮市科特机械有限公司 | 一种石材自动化生产方法 |
CN110450287A (zh) * | 2019-06-26 | 2019-11-15 | 云浮市科特机械有限公司 | 一种石材自动化生产方法 |
JP6851525B1 (ja) * | 2020-03-25 | 2021-03-31 | Dmg森精機株式会社 | 工具マガジン装置 |
JP2021154394A (ja) * | 2020-03-25 | 2021-10-07 | Dmg森精機株式会社 | 工具マガジン装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20170004880A (ko) | 2017-01-11 |
CN106313347B (zh) | 2020-10-09 |
TWI714593B (zh) | 2021-01-01 |
TW201707904A (zh) | 2017-03-01 |
CN106313347A (zh) | 2017-01-11 |
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