JP2016503950A - 半導体モジュール向け圧入電気ピン - Google Patents
半導体モジュール向け圧入電気ピン Download PDFInfo
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- JP2016503950A JP2016503950A JP2015552891A JP2015552891A JP2016503950A JP 2016503950 A JP2016503950 A JP 2016503950A JP 2015552891 A JP2015552891 A JP 2015552891A JP 2015552891 A JP2015552891 A JP 2015552891A JP 2016503950 A JP2016503950 A JP 2016503950A
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- Prior art keywords
- press
- fit
- hole
- pin
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title description 2
- 238000000034 method Methods 0.000 claims description 26
- 230000000295 complement effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 11
- 230000007704 transition Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
- H01R13/415—Securing in non-demountable manner, e.g. moulding, riveting by permanent deformation of contact member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Abstract
Description
Claims (22)
- 少なくとも1つの圧入電気接点を有する電気モジュールであって、
ハウジングと、
前記ハウジング内に装着された少なくとも1つの電気部品と、
前記ハウジング内の一部に位置し、その遠位端にある圧入部及び止まり部と、その近位端にある装着部と、を有する圧入電気接点であって、前記装着部が前記少なくとも1つの電気部品に電気的に接続され、圧入力が前記圧入接点に加えられて、前記圧入接点が前記ハウジングに押し込まれるとき、前記止まり部が前記ハウジング内への前記圧入部の動きを阻止できるように前記圧入部が前記ハウジングの外部に位置する、圧入電気接点と、を含む、電気モジュール。 - 前記圧入接点が圧入ピンであり、前記圧入部が、キャリアの第1貫通孔に挿入可能であるように構成されて、前記キャリアの前記貫通孔を画定する側壁と電気接点が確立される、請求項1に記載の電気モジュール。
- 前記圧入接点が圧入ピンであり、前記ハウジングが中に形成された貫通孔を含む表面を有し、前記貫通孔が非円形形状を有し、前記圧入ピンが鍵と鍵穴方式で前記貫通孔を通り抜けるように、前記圧入ピンが前記貫通孔の前記非円形形状に相補的な断面形状を有する、請求項1に記載の電気モジュール。
- 前記圧入ピンが、前記装着部が前記少なくとも1つの電気部品に電気的に接続される一方で、前記止まり部が前記圧入部の前記貫通孔を通過する動きを阻止できるロック位置に捩って入れることができるように構成される、請求項3に記載の電気モジュール。
- 前記圧入接点が圧入ピンであり、前記ハウジングが中に形成された貫通孔を有する表面を有し、前記圧入ピンが、長手方向軸の周りで捩られたときに、前記貫通孔が単一方向である前記圧入ピンの前記圧入部及び前記止まり部のみを収容するように前記長手方向軸及び前記長手方向軸を横断する断面形状を有し、前記単一方向ではなく、前記貫通孔によって完全には収容され得ないように前記圧入ピンが前記長手方向軸の周りで捩られる、請求項1に記載の電気モジュール。
- 前記圧入ピンの少なくとも前記圧入部及び前記止まり部が前記長手方向軸に対して対称である、請求項5に記載の電気モジュール。
- 前記圧入ピンが前記止まり部の近位に位置する可捩部を含み、前記圧入ピンが前記単一方向ではなく、前記貫通孔によって完全には収容され得ないように前記可捩部を捩ることができる、請求項5に記載の電気モジュール。
- 前記可捩部以外の前記圧入ピンの残りの部分が捩られない、請求項7に記載の電気モジュール。
- 前記圧入ピンが、前記圧入ピンに加えられる外力を補償する弾性をもたらす応力逃げ部を更に含む、請求項1に記載の電気モジュール。
- 前記圧入ピンの前記応力逃げ部が前記ハウジング内に位置する、請求項9に記載の電気モジュール。
- 前記圧入部が、その中を前記長手方向に延在するスリットを有する、請求項1に記載の電気モジュール。
- 少なくとも1つの圧入接点を有する電気モジュールを組み立てる方法であって、
ハウジングのキャリア部の装着面に圧入電気接点を機械的かつ電気的に固定することであって、前記キャリアがその中に固定された少なくとも1つの電気部品を有し、前記圧入接点が、その遠位端にある圧入部及び止まり部と、その近位端にある装着部と、を有し、前記装着部が前記少なくとも1つの電気部品に電気的に接続されている、ことと、
前記キャリア部と嵌合して、前記圧入部が前記ハウジングの外部に位置し、少なくとも前記装着部が前記ハウジングの内部に位置するように、その中に内部空間を形成する、前記ハウジングの第2部分の表面に位置する貫通孔に前記圧入接点の前記遠位端を挿入することと、
少なくとも前記圧入接点の前記圧入部に回転力を加えて、圧入力が前記圧入接点の前記遠位端に加えられるときに、前記止まり部が、前記ハウジングの前記表面にある前記貫通孔を通って前記圧入部が戻る動きを阻止できることと、を含む、方法。 - 前記回転力を加えると、前記圧入電気接点の可捩部のみがその前記止まり部の近位の位置において捩れる、請求項12に記載の方法。
- 前記圧入接点が圧入ピンであり、前記圧入部が、キャリアの第1貫通孔に挿入可能であるように構成されて、前記キャリアの前記貫通孔を画定する側壁と電気接点が確立される、請求項12に記載の方法。
- 前記圧入接点が圧入ピンであり、前記ハウジングが中に形成された貫通孔を含む表面を有し、前記貫通孔が非円形形状を有し、前記圧入ピンが鍵と鍵穴方式で前記貫通孔を通り抜けるように、前記圧入ピンが前記貫通孔の前記非円形形状に相補的な断面形状を有する、請求項12に記載の方法。
- 前記圧入ピンが、前記装着部が前記少なくとも1つの電気部品と電気的に接続する一方で、前記止まり部が前記圧入部の前記貫通孔を通過する動きを阻止できるロック位置に捩って入れることができるように構成される、請求項14に記載の方法。
- 前記圧入接点が圧入ピンであり、前記ハウジングが中に形成された貫通孔を有する表面を有し、前記圧入ピンが、長手方向軸の周りで捩られたときに、前記貫通孔が単一方向である前記圧入ピンの前記圧入部及び前記止まり部のみを収容するように前記長手方向軸及び前記長手方向軸を横断する断面形状を有し、前記単一方向ではなく、前記貫通孔によって完全には収容され得ないように前記圧入ピンが前記長手方向軸の周りで捩られる、請求項12に記載の方法。
- 前記圧入ピンの少なくとも前記圧入部及び前記止まり部が前記長手方向軸に対して対称である、請求項17に記載の方法。
- 前記圧入ピンが前記止まり部の近位に位置する可捩部を含み、前記圧入ピンが前記単一方向ではなく、前記貫通孔によって完全には収容され得ないように前記可捩部を捩ることができる、請求項17に記載の方法。
- 前記可捩部以外の前記圧入ピンの残りの部分が捩られない、請求項19に記載の方法。
- 前記圧入ピンが、前記圧入ピンに加えられる外力を補償する弾性をもたらす応力逃げ部を更に含む、請求項12に記載の方法。
- 前記圧入部が、その中を前記長手方向に延在するスリットを有する、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201361752278P | 2013-01-14 | 2013-01-14 | |
US61/752,278 | 2013-01-14 | ||
PCT/US2014/011454 WO2014110563A1 (en) | 2013-01-14 | 2014-01-14 | Electrical press-fit pin for a semiconductor module |
Publications (2)
Publication Number | Publication Date |
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JP2016503950A true JP2016503950A (ja) | 2016-02-08 |
JP6808321B2 JP6808321B2 (ja) | 2021-01-06 |
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Family Applications (1)
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JP2015552891A Active JP6808321B2 (ja) | 2013-01-14 | 2014-01-14 | 電気モジュール及びその組み立てる方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9263820B2 (ja) |
EP (1) | EP2943999B1 (ja) |
JP (1) | JP6808321B2 (ja) |
KR (1) | KR101763630B1 (ja) |
CN (1) | CN104919657B (ja) |
DK (1) | DK2943999T3 (ja) |
ES (1) | ES2661406T3 (ja) |
PL (1) | PL2943999T3 (ja) |
WO (1) | WO2014110563A1 (ja) |
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US9570832B2 (en) | 2015-03-19 | 2017-02-14 | Semiconductor Components Industries, Llc | Press-fit pin for semiconductor packages and related methods |
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- 2014-01-14 KR KR1020157018824A patent/KR101763630B1/ko active IP Right Grant
- 2014-01-14 US US14/154,804 patent/US9263820B2/en active Active
- 2014-01-14 ES ES14738326.9T patent/ES2661406T3/es active Active
- 2014-01-14 CN CN201480004665.8A patent/CN104919657B/zh active Active
- 2014-01-14 JP JP2015552891A patent/JP6808321B2/ja active Active
- 2014-01-14 DK DK14738326.9T patent/DK2943999T3/en active
- 2014-01-14 PL PL14738326T patent/PL2943999T3/pl unknown
- 2014-01-14 EP EP14738326.9A patent/EP2943999B1/en active Active
- 2014-01-14 WO PCT/US2014/011454 patent/WO2014110563A1/en active Application Filing
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Also Published As
Publication number | Publication date |
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US20140199861A1 (en) | 2014-07-17 |
WO2014110563A1 (en) | 2014-07-17 |
CN104919657A (zh) | 2015-09-16 |
US9263820B2 (en) | 2016-02-16 |
EP2943999B1 (en) | 2017-11-29 |
EP2943999A4 (en) | 2016-01-06 |
EP2943999A1 (en) | 2015-11-18 |
KR20150095860A (ko) | 2015-08-21 |
KR101763630B1 (ko) | 2017-08-01 |
JP6808321B2 (ja) | 2021-01-06 |
PL2943999T3 (pl) | 2018-07-31 |
CN104919657B (zh) | 2019-05-10 |
ES2661406T3 (es) | 2018-03-28 |
DK2943999T3 (en) | 2018-02-12 |
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