JP2016207947A - 基板搬送ロボットおよび基板検出方法 - Google Patents
基板搬送ロボットおよび基板検出方法 Download PDFInfo
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- 238000000034 method Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 2
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- B25J15/00—Gripping heads and other end effectors
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- B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
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- B25J9/00—Programme-controlled manipulators
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- B25J9/1697—Vision controlled systems
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- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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Abstract
【解決手段】この基板搬送ロボットは、昇降可能なロボットアームと、ロボットアームに装着された基板保持装置7と、基板保持装置7によって保持される基板を検出するための基板検出手段23と、を備える。基板検出手段23は、基板を検出するための基板センサと、ロボットアームを昇降させることなく基板センサを昇降させて、基板の配置位置を含む領域を走査するためのセンサ昇降手段16、17と、を有する。
【選択図】図2
Description
を参照して説明する。
2 基台
3 旋回主軸
4 ロボットアーム
5 第1リンク部材
6 第2リンク部材
7 ハンド(基板保持装置)
8 Z軸昇降駆動源
9 旋回駆動源
10 第2リンク部材の回転動作の駆動源
11 基板保持装置の回転動作の駆動源
12 ロボットコントローラ
13 手首軸
14 手首軸駆動源
15 ハンド基部(手首部)
16 昇降エアシリンダ
16A 昇降エアシリンダのピストン
17 昇降部材
18 ブレード部材
19 固定挟持部
20 底面支持部
21 押圧エアシリンダ
21A 押圧エアシリンダのピストン
22 可動挟持部
23 基板検出手段
24 基板センサ
25 センサアンプ
26 固定部材
L1 第1回転軸線
L2 第2回転軸線
L3 第3回転軸線
S 基板(ウェハ)
Claims (9)
- 基板を保持して搬送するための基板搬送ロボットであって、
昇降可能なロボットアームと、
前記ロボットアームに装着された基板保持装置と、
前記基板保持装置によって保持される前記基板を検出するための基板検出手段と、を備え、
前記基板検出手段は、前記基板を検出するための基板センサと、前記ロボットアームを昇降させることなく前記基板センサを昇降させて、前記基板の配置位置を含む領域を走査するためのセンサ昇降手段と、を有する、基板搬送ロボット。 - 前記基板センサは、前記基板保持装置に設けられている、請求項1記載の基板搬送ロボット。
- 前記基板保持装置は、前記ロボットアームに装着された手首部と、前記手首部に設けられ、前記基板が載置されるブレード部材と、を有し、
前記基板センサは、前記ブレード部材に設けられており、
前記センサ昇降手段は、前記手首部に対して前記ブレード部材を昇降させるように構成されている、請求項2記載の基板搬送ロボット。 - 前記基板保持装置は、前記ロボットアームに装着された手首部と、前記手首部に設けられ、それぞれに前記基板が載置される上側ブレード部材および下側ブレード部材と、を有し、
前記基板センサは、前記上側ブレード部材および前記下側ブレード部材のうちの少なくとも一方のブレード部材に設けられており、
前記センサ昇降手段は、前記少なくとも一方のブレード部材を前記手首部に対して昇降させるように構成されている、請求項2記載の基板搬送ロボット。 - 前記基板保持装置は、互いに独立して駆動可能な上側基板保持装置および下側基板保持装置を有し、
前記基板検出手段は、前記上側基板保持装置および前記下側基板保持装置のうちの少なくとも一方に設けられている、請求項2記載の基板搬送ロボット。 - 基板搬送ロボットによって保持される基板を検出するための基板検出方法であって、
前記基板搬送ロボットのロボットアームを駆動して、前記ロボットアームに装着された基板保持装置を前記基板の配置位置に近づける準備工程と、
前記基板保持装置に設けられた基板センサを、前記ロボットアームを昇降させることなく昇降させて、前記基板の配置位置を含む領域を走査することにより前記基板を検出する検出工程と、を備えた基板検出方法。 - 前記基板保持装置は、前記ロボットアームに装着された手首部と、前記手首部に設けられ、前記基板が載置されるブレード部材と、を有し、
前記基板センサは、前記ブレード部材に設けられており、
前記検出工程において、前記ブレード部材を前記手首部に対して昇降させる、請求項6記載の基板検出方法。 - 前記基板保持装置は、前記ロボットアームに装着された手首部と、前記手首部に設けられ、それぞれに前記基板が載置される上側ブレード部材および下側ブレード部材と、を有し、
前記基板センサは、前記上側ブレード部材および前記下側ブレード部材のうちの少なくとも一方のブレード部材に設けられており、
前記検出工程において、前記少なくとも一方のブレード部材を前記手首部に対して昇降させる、請求項6記載の基板検出方法。 - 前記基板保持装置は、互いに独立して駆動可能な上側基板保持装置および下側基板保持装置を有し、
前記基板検出手段は、前記上側基板保持装置および前記下側基板保持装置のうちの少なくとも一方の基板保持装置に設けられており、
前記検出工程において、前記少なくとも一方の基板保持装置に設けられた前記基板センサを昇降させる、請求項6記載の基板検出方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2015090814A JP6545519B2 (ja) | 2015-04-27 | 2015-04-27 | 基板搬送ロボットおよび基板検出方法 |
US15/570,226 US10431482B2 (en) | 2015-04-27 | 2016-04-21 | Substrate conveyance robot and substrate detection method |
PCT/JP2016/062687 WO2016175133A1 (ja) | 2015-04-27 | 2016-04-21 | 基板搬送ロボットおよび基板検出方法 |
CN201680024813.1A CN107534009B (zh) | 2015-04-27 | 2016-04-21 | 衬底搬送机器人及衬底检测方法 |
TW105113153A TWI619586B (zh) | 2015-04-27 | 2016-04-27 | 基板搬送機器人及基板檢測方法 |
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JP2015090814A JP6545519B2 (ja) | 2015-04-27 | 2015-04-27 | 基板搬送ロボットおよび基板検出方法 |
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JP2016207947A true JP2016207947A (ja) | 2016-12-08 |
JP6545519B2 JP6545519B2 (ja) | 2019-07-17 |
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US (1) | US10431482B2 (ja) |
JP (1) | JP6545519B2 (ja) |
CN (1) | CN107534009B (ja) |
TW (1) | TWI619586B (ja) |
WO (1) | WO2016175133A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020095874A1 (ja) * | 2018-11-06 | 2020-05-14 | 川崎重工業株式会社 | ロボットハンド及びそれを備えるロボット |
WO2020095875A1 (ja) * | 2018-11-06 | 2020-05-14 | 川崎重工業株式会社 | ロボットハンド及びそれを備えるロボット |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7149119B2 (ja) * | 2018-07-03 | 2022-10-06 | 日本電産サンキョー株式会社 | 産業用ロボット |
JP7158238B2 (ja) * | 2018-10-10 | 2022-10-21 | 東京エレクトロン株式会社 | 基板処理システム |
KR20210101208A (ko) * | 2018-12-11 | 2021-08-18 | 로제 가부시키가이샤 | 정전 용량 센서 |
JP7465709B2 (ja) * | 2020-04-10 | 2024-04-11 | ニデックインスツルメンツ株式会社 | 産業用ロボット |
US20230311342A1 (en) * | 2020-09-03 | 2023-10-05 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate holding hand and substrate conveying robot |
TWI829201B (zh) * | 2022-06-17 | 2024-01-11 | 和淞科技股份有限公司 | 可調式負壓吸持模組 |
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US20180130693A1 (en) | 2018-05-10 |
TW201707887A (zh) | 2017-03-01 |
JP6545519B2 (ja) | 2019-07-17 |
WO2016175133A1 (ja) | 2016-11-03 |
US10431482B2 (en) | 2019-10-01 |
CN107534009A (zh) | 2018-01-02 |
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CN107534009B (zh) | 2021-04-27 |
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