JP2016147990A - Photocurable resin composition suppressing short circuit between adjacent electrodes - Google Patents
Photocurable resin composition suppressing short circuit between adjacent electrodes Download PDFInfo
- Publication number
- JP2016147990A JP2016147990A JP2015026475A JP2015026475A JP2016147990A JP 2016147990 A JP2016147990 A JP 2016147990A JP 2015026475 A JP2015026475 A JP 2015026475A JP 2015026475 A JP2015026475 A JP 2015026475A JP 2016147990 A JP2016147990 A JP 2016147990A
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- Prior art keywords
- component
- resin composition
- photocurable resin
- acrylate
- meth
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 42
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims abstract description 10
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 7
- 239000003999 initiator Substances 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 239000003505 polymerization initiator Substances 0.000 claims description 13
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 10
- 238000002834 transmittance Methods 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000004382 potting Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 75
- -1 oxime sulfonate Chemical class 0.000 description 61
- 239000000047 product Substances 0.000 description 28
- 239000002253 acid Substances 0.000 description 24
- 229910052757 nitrogen Inorganic materials 0.000 description 16
- 239000000126 substance Substances 0.000 description 15
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- XAAILNNJDMIMON-UHFFFAOYSA-N 2'-anilino-6'-(dibutylamino)-3'-methylspiro[2-benzofuran-3,9'-xanthene]-1-one Chemical compound C=1C(N(CCCC)CCCC)=CC=C(C2(C3=CC=CC=C3C(=O)O2)C2=C3)C=1OC2=CC(C)=C3NC1=CC=CC=C1 XAAILNNJDMIMON-UHFFFAOYSA-N 0.000 description 3
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 235000006708 antioxidants Nutrition 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910021485 fumed silica Inorganic materials 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical class OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 2
- WDFFWUVELIFAOP-UHFFFAOYSA-N 2,6-difluoro-4-nitroaniline Chemical compound NC1=C(F)C=C([N+]([O-])=O)C=C1F WDFFWUVELIFAOP-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 101000720524 Gordonia sp. (strain TY-5) Acetone monooxygenase (methyl acetate-forming) Proteins 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 2
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- ARPJZLLWCWXWJQ-UHFFFAOYSA-N dihydrogen phosphate;ethylazanium Chemical compound CCN.OP(O)(O)=O ARPJZLLWCWXWJQ-UHFFFAOYSA-N 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 229950000688 phenothiazine Drugs 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- 125000005409 triarylsulfonium group Chemical group 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- YSWBUABBMRVQAC-UHFFFAOYSA-N (2-nitrophenyl)methanesulfonic acid Chemical compound OS(=O)(=O)CC1=CC=CC=C1[N+]([O-])=O YSWBUABBMRVQAC-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- CUHCLROITCDERO-UHFFFAOYSA-N (4-nitrophenyl)methyl 9,10-dimethoxyanthracene-2-sulfonate Chemical compound C=1C=C2C(OC)=C3C=CC=CC3=C(OC)C2=CC=1S(=O)(=O)OCC1=CC=C([N+]([O-])=O)C=C1 CUHCLROITCDERO-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- MJYFYGVCLHNRKB-UHFFFAOYSA-N 1,1,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(F)(F)CF MJYFYGVCLHNRKB-UHFFFAOYSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- TWYROYMBOWCJTO-UHFFFAOYSA-N 1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidin-3-ol Chemical compound CC1(C)CCC(O)C(C)(C)N1CCO TWYROYMBOWCJTO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- ILMDJKLKHFJJMZ-UHFFFAOYSA-N 1-phenyl-2-(2,4,6-trimethylphenyl)sulfonylethanone Chemical compound CC1=CC(C)=CC(C)=C1S(=O)(=O)CC(=O)C1=CC=CC=C1 ILMDJKLKHFJJMZ-UHFFFAOYSA-N 0.000 description 1
- SHHQYIMTQGDRHS-UHFFFAOYSA-N 2'-anilino-6'-(dipentylamino)-3'-methylspiro[2-benzofuran-3,9'-xanthene]-1-one Chemical compound C=1C(N(CCCCC)CCCCC)=CC=C(C2(C3=CC=CC=C3C(=O)O2)C2=C3)C=1OC2=CC(C)=C3NC1=CC=CC=C1 SHHQYIMTQGDRHS-UHFFFAOYSA-N 0.000 description 1
- IXHBSOXJLNEOPY-UHFFFAOYSA-N 2'-anilino-6'-(n-ethyl-4-methylanilino)-3'-methylspiro[2-benzofuran-3,9'-xanthene]-1-one Chemical compound C=1C=C(C2(C3=CC=CC=C3C(=O)O2)C2=CC(NC=3C=CC=CC=3)=C(C)C=C2O2)C2=CC=1N(CC)C1=CC=C(C)C=C1 IXHBSOXJLNEOPY-UHFFFAOYSA-N 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- VDVUCLWJZJHFAV-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1 VDVUCLWJZJHFAV-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 125000006203 morpholinoethyl group Chemical group [H]C([H])(*)C([H])([H])N1C([H])([H])C([H])([H])OC([H])([H])C1([H])[H] 0.000 description 1
- ZIOFXYGGAJKWHX-UHFFFAOYSA-N n,2,4-trimethylaniline Chemical compound CNC1=CC=C(C)C=C1C ZIOFXYGGAJKWHX-UHFFFAOYSA-N 0.000 description 1
- GUAWMXYQZKVRCW-UHFFFAOYSA-N n,2-dimethylaniline Chemical compound CNC1=CC=CC=C1C GUAWMXYQZKVRCW-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FDAKZQLBIFPGSV-UHFFFAOYSA-N n-butyl-2,2,6,6-tetramethylpiperidin-4-amine Chemical compound CCCCNC1CC(C)(C)NC(C)(C)C1 FDAKZQLBIFPGSV-UHFFFAOYSA-N 0.000 description 1
- ATIOZSZEDIGMIS-UHFFFAOYSA-N n-sulfonylbenzenesulfonamide Chemical compound O=S(=O)=NS(=O)(=O)C1=CC=CC=C1 ATIOZSZEDIGMIS-UHFFFAOYSA-N 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical class [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229950002083 octabenzone Drugs 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- UFUASNAHBMBJIX-UHFFFAOYSA-N propan-1-one Chemical compound CC[C]=O UFUASNAHBMBJIX-UHFFFAOYSA-N 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 229940080818 propionamide Drugs 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006249 styrenic copolymer Polymers 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 150000003712 vitamin E derivatives Chemical class 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
本発明は、紫外線等の活性エネルギー線の照射により速やかに隠蔽性の高い硬化物が得られ、且つ電極上に塗布した場合、通電時に隣接電極間の短絡を生じさせない光硬化性樹脂組成物に関する。 The present invention relates to a photocurable resin composition that can quickly obtain a highly concealed cured product by irradiation with active energy rays such as ultraviolet rays and that does not cause a short circuit between adjacent electrodes when energized. .
従来より、隠蔽性の高い光硬化性樹脂組成物は、フレキシブル配線板向け被覆材料（特許文献１参照）、試作モデルの複製品用注型材料（特許文献２参照）、電子機器や画像表示装置等への部品の接着剤（特許文献３）、液晶ディスプレイ用シール剤（特許文献４参照）等に多用されている。光硬化性樹脂組成物に隠蔽性を付与する代表的な手法としては顔料のカーボンブラックを配合することが挙げられる。しかし、隠蔽性が得られる反面、紫外線等の活性エネルギー線の大部分がカーボンブラックに吸収されるため、顔料の濃度が高過ぎると硬化不良が生じていた。また、カーボンは導電性を有することから、硬化膜の絶縁性が低下し、フレキシブル配線板に用いられる被覆材料として適応が困難であった。つまり、隠蔽性と諸物性を同時に満たすことは困難であった。 Conventionally, a photo-curable resin composition with high concealment has been used as a coating material for flexible wiring boards (see Patent Document 1), a cast material for replicating a prototype model (see Patent Document 2), an electronic device, and an image display device. It is often used as an adhesive for parts to a liquid crystal (Patent Document 3), a sealant for liquid crystal display (see Patent Document 4), and the like. As a typical method for imparting concealability to the photocurable resin composition, blending carbon black as a pigment can be mentioned. However, while concealment is obtained, most of the active energy rays such as ultraviolet rays are absorbed by the carbon black, so that a curing failure occurs when the pigment concentration is too high. Moreover, since carbon has electrical conductivity, the insulating property of the cured film is lowered, and it is difficult to adapt as a coating material used for a flexible wiring board. In other words, it was difficult to satisfy both concealment and physical properties at the same time.
そのような背景から、特許文献２には、光ラジカル重合開始剤、酸により発色するという特徴を有するロイコ染料、光酸発生剤、エチレン性不飽和化合物を含有する、硬化物が黒色でありながら優れた深部硬化性を有する感光性樹脂組成物が開示されている。これは、「光照射により発生するラジカル種」が「光照射により発生する酸」の発生速度より早いことを利用したものである。すなわち、酸により黒色化する前に、深部まで光を透過させ硬化させるものである。 From such a background, Patent Document 2 includes a radical photopolymerization initiator, a leuco dye having a feature of coloring with an acid, a photoacid generator, and an ethylenically unsaturated compound, while the cured product is black. A photosensitive resin composition having excellent deep curability is disclosed. This utilizes the fact that “radical species generated by light irradiation” is faster than the generation rate of “acid generated by light irradiation”. That is, before blackening with an acid, light is transmitted to a deep part and cured.
しかしながら、電気電子デバイスの電極上に樹脂を塗布する場合、特許文献２に開示された感光性樹脂組成物では電極に通電したとき隣接電極間の短絡が生じるという課題があった。 However, when a resin is applied on the electrode of an electric / electronic device, the photosensitive resin composition disclosed in Patent Document 2 has a problem that a short circuit occurs between adjacent electrodes when the electrode is energized.
本発明は、上記の状況に鑑みてされたものであり、紫外線等の活性エネルギー線の照射により速やかに隠蔽性の高い硬化物が得られ、且つ電極上に塗布した場合、通電時に隣接電極間の短絡を生じさせない光硬化性樹脂組成物を提供することを目的とする。 The present invention has been made in view of the above situation, and when a cured product with high concealability is obtained quickly by irradiation with active energy rays such as ultraviolet rays, and when applied on electrodes, it is between adjacent electrodes when energized. It aims at providing the photocurable resin composition which does not produce short circuit of this.
本発明は、上述した従来の課題を克服するものである。すなわち、本発明は以下の要旨である。
下記の（Ａ）〜（Ｄ）成分を含有する光硬化性樹脂組成物。
（Ａ）成分：ロイコ染料
（Ｂ）成分：非イオン性光酸発生剤
（Ｃ）成分：ラジカル重合性化合物
（Ｄ）成分：光ラジカル開始剤
The present invention overcomes the above-described conventional problems. That is, the present invention has the following gist.
The photocurable resin composition containing the following (A)-(D) component.
(A) component: leuco dye (B) component: nonionic photoacid generator (C) component: radical polymerizable compound (D) component: photoradical initiator
本発明は、紫外線等の活性エネルギー線の照射により速やかに隠蔽性の高い硬化物が得られ、且つ電極上に塗布した場合、通電時に隣接電極間の短絡を生じさせない光硬化性樹脂組成物を提供するものである。 The present invention provides a photocurable resin composition that, when irradiated with active energy rays such as ultraviolet rays, can quickly obtain a highly concealed cured product and does not cause a short circuit between adjacent electrodes when energized. It is to provide.
以下に発明の詳細を説明する。
＜（Ａ）成分＞
本発明の（Ａ）成分であるロイコ染料とは、酸との接触により発色する化合物である。また、光硬化性樹脂組成物の硬化物に隠蔽性を与える成分である。（Ａ）成分としては、特に限定されないが、例えば、３−ブチルアミノ−６−メチルー７−アニリノフルオラン、３−ジプロピルアミノ−６−メチル−７−アニリノフルオラン、３−ジエチルアミノ−６−メチル−７−アニリノフルオラン、３−ジメチルアミノ−６−メチル−７−アニリノフルオラン、３−ジエチルアミノ−６−メチル−７−キシリジノフルオラン、３−（４−ジエチルアミノ−２−エトキシフェニル）−３−（１−エチル−２−メチルインドール−３−イル）−４−アザフタリドなどを例として挙げることができる。中でも、硬化物の隠蔽性および深部硬化性の観点から３−ブチル−６−メチル−７−アニリノフルオラン、３−ジエチルアミノ−６−メチル−７−アニリノフルオランが好ましい。
Details of the invention will be described below.
<(A) component>
The leuco dye which is the component (A) of the present invention is a compound that develops color upon contact with an acid. Moreover, it is a component which provides concealability to the hardened | cured material of a photocurable resin composition. The component (A) is not particularly limited. For example, 3-butylamino-6-methyl-7-anilinofluorane, 3-dipropylamino-6-methyl-7-anilinofluorane, 3-diethylamino- 6-methyl-7-anilinofluorane, 3-dimethylamino-6-methyl-7-anilinofluorane, 3-diethylamino-6-methyl-7-xylidinofluorane, 3- (4-diethylamino-2 Examples include -ethoxyphenyl) -3- (1-ethyl-2-methylindol-3-yl) -4-azaphthalide and the like. Among these, 3-butyl-6-methyl-7-anilinofluorane and 3-diethylamino-6-methyl-7-anilinofluorane are preferable from the viewpoints of concealability of the cured product and deep curability.
（Ａ）成分の市販品としては、特に限定されないが、Ｓ−２０５、ＢＬＡＣＫ３０５、ＥＴＡＣ、ＢＬＡＣＫ１００、ＮＩＲ ＢＬＡＣＫ７８（山田化学工業株式会社製）、ＯＤＢ、ＯＤＢ−２、ＯＤＢ−４、ＯＤＢ−２５０、Ｂｌａｃｋ−ＸＶ（山本化成株式会社製）などが挙げられる。 Although it does not specifically limit as a commercial item of (A) component, S-205, BLACK305, ETAC, BLACK100, NIR BLACK78 (made by Yamada Chemical Co., Ltd.), ODB, ODB-2, ODB-4, ODB-250, Examples include Black-XV (manufactured by Yamamoto Kasei Co., Ltd.).
＜（Ｂ）成分＞
本発明の（Ｂ）成分である非イオン性光酸発生剤とは、活性エネルギー線の照射によりルイス酸やブレンステッド酸などの酸を発生する、分解前が塩ではない化合物であり、発生した酸によりロイコ染料を発色させることが可能となる。各種光開始剤の中でも本発明の（Ｂ）成分を選択し、本発明のその他成分と組み合わせた光硬化性樹脂組成物は、電極上に塗布した場合に通電時に隣接電極間の短絡を生じさせないという顕著な効果を有する。（Ｂ）成分の具体例としては、特に限定されないが、有機スルホン酸を発生する非イオン性光酸発生剤又は有機カルボン酸を発生する非イオン性光酸発生剤等が挙げられる。
<(B) component>
The nonionic photoacid generator that is the component (B) of the present invention is a compound that generates an acid such as a Lewis acid or a Bronsted acid by irradiation with active energy rays and is not a salt before decomposition. The leuco dye can be colored by the acid. Among various photoinitiators, the component (B) of the present invention is selected, and the photocurable resin composition combined with the other components of the present invention does not cause a short circuit between adjacent electrodes when energized when applied on the electrode. It has a remarkable effect. Specific examples of the component (B) include, but are not limited to, a nonionic photoacid generator that generates organic sulfonic acid or a nonionic photoacid generator that generates organic carboxylic acid.
前記の有機スルホン酸を発生する非イオン性光酸発生剤としては、例えば、特に限定されないが、スルホニルジアゾメタン、オキシムスルホネート、イミドスルホネート、２ーニトロベンジルスルホネート、ピロガロールスルホネート、ｐ−ニトロベンジル−９，１０−ジメトキシアントラセン−２−スルホネート、Ｎ−スルホニル−フェニルスルホンアミド、トリフルオロメタンスルホン酸−１、８−ナフタルイミド、ノナフルオロブタンスルホン酸−１、８−ナフタルイミド、パーフルオロオクタンスルホン酸−１、８−ナフタルイミド、ペンタフルオロベンゼンスルホン酸−１、８−ナフタルイミド、ノナフルオロブタンスルホン酸１、３、６−トリオキソ−３、６−ジヒドロ−１Ｈ−１１−チア−アザシクロペンタアントラセン−２イルエステル、ノナフルオロブタンスルホン酸８−イソプロピル−１、３、６−トリオキソ−３、６−ジヒドロ−１Ｈ−１１−チア−２−アザシクロペンタアントラセン−２−イルエステル、１，２−ナフトキノン−２−ジアジド−５−スルホン酸クロリド、１，２−ナフトキノン−２−ジアジド−４−スルホン酸クロリド、１，２−ベンゾキノン−２−ジアジド−４−スルホン酸クロリド、１，２−ナフトキノン−２−ジアジド−５−スルホン酸ナトリウム、１，２−ナフトキノン−２−ジアジド−４−スルホン酸ナトリウム、１，２−ベンゾキノン−２−ジアジド−４−スルホン酸ナトリウム、１，２−ナフトキノン−２−ジアジド−５−スルホン酸カリウム、１，２−ナフトキノン−２−ジアジド−４−スルホン酸カリウム、１，２−ベンゾキノン−２−ジアジド−４−スルホン酸カリウム、１，２−ナフトキノン−２−ジアジド−５−スルホン酸メチル、１，２−ベンゾキノン−２−ジアジド−４−スルホン酸メチル、４−シクロヘキシルフェニル−ジフェニルスルホニウム−２，４−ジフルオロベンゼンスルホネート、１−（４−ｎ−ブトキシナフチル）テトラヒドロチオフェニウム−１−フルオロベンゼンスルホネート、１−（４−ｎ−ブトキシナフチル）テトラヒドロチオフェニウム−３，５−ビス（トリフルオロメチル）ベンゼンスルホネート、４−トリスフェナシルスルホン、メシチルフェナシルスルホン、
化学式（１）、（２）で表される化合物などが挙げられる。また、前記の有機カルボン酸を発生する非イオン性光酸発生剤としては、化学式（３）で表される化合物等のナフトキノンジアジド化合物等が挙げられる。これらは１種または２種以上を混合して用いることができる。
Examples of the nonionic photoacid generator that generates the organic sulfonic acid include, but are not limited to, sulfonyldiazomethane, oxime sulfonate, imide sulfonate, 2-nitrobenzyl sulfonate, pyrogallol sulfonate, p-nitrobenzyl-9, 10-dimethoxyanthracene-2-sulfonate, N-sulfonyl-phenylsulfonamide, trifluoromethanesulfonic acid-1,8-naphthalimide, nonafluorobutanesulfonic acid-1,8-naphthalimide, perfluorooctanesulfonic acid-1, 8-Naphthalimide, pentafluorobenzenesulfonic acid-1,8-naphthalimide, nonafluorobutanesulfonic acid 1,3,6-trioxo-3,6-dihydro-1H-11-thia-azacyclopentanthracene-2 Ester, nonafluorobutanesulfonic acid 8-isopropyl-1,3,6-trioxo-3,6-dihydro-1H-11-thia-2-azacyclopentanthracen-2-yl ester, 1,2-naphthoquinone-2 -Diazide-5-sulfonic acid chloride, 1,2-naphthoquinone-2-diazide-4-sulfonic acid chloride, 1,2-benzoquinone-2-diazido-4-sulfonic acid chloride, 1,2-naphthoquinone-2-diazide Sodium 5-sulfonate, sodium 1,2-naphthoquinone-2-diazide-4-sulfonate, sodium 1,2-benzoquinone-2-diazide-4-sulfonate, 1,2-naphthoquinone-2-diazide-5 -Potassium sulfonate, potassium 1,2-naphthoquinone-2-diazide-4-sulfonate, 1,2- Nzoquinone-2-diazide-4-sulfonate potassium, 1,2-naphthoquinone-2-diazide-5-sulfonate methyl, 1,2-benzoquinone-2-diazide-4-sulfonate methyl, 4-cyclohexylphenyl-diphenyl Sulfonium-2,4-difluorobenzenesulfonate, 1- (4-n-butoxynaphthyl) tetrahydrothiophenium-1-fluorobenzenesulfonate, 1- (4-n-butoxynaphthyl) tetrahydrothiophenium-3,5- Bis (trifluoromethyl) benzenesulfonate, 4-trisphenacylsulfone, mesitylphenacylsulfone,
Examples include compounds represented by chemical formulas (1) and (2). Examples of the nonionic photoacid generator that generates the organic carboxylic acid include naphthoquinonediazide compounds such as the compound represented by the chemical formula (3). These can be used alone or in combination of two or more.
前記の有機スルホン酸を発生する非イオン性光酸発生剤の市販品としては、ＳＰ−０８２、ＳＰ−１０３、ＳＰ−０８２、ＳＰ−６０１、ＳＰ−６０６（株式会社ＡＤＥＫＡ製）、ＮＴ−１ＴＦ（サンアプロ株式会社製）、ＷＰＡＧ−１４５、ＷＰＡＧ−１４９、ＷＰＡＧ−１７０、ＷＰＡＧ−１９９（和光純薬工業株式会社製）等が挙げられる。また、前記の有機カルボン酸を発生する非イオン性光酸発生剤の市販品としては、ＴＳ−５８３、ＴＳ−５６７、ＳＩＮ−１１（株式会社三宝化学研究所製）等が挙げられる。 Examples of commercially available nonionic photoacid generators that generate organic sulfonic acids include SP-082, SP-103, SP-082, SP-601, SP-606 (manufactured by ADEKA Corporation), NT-1TF. (Manufactured by San Apro Co., Ltd.), WPAG-145, WPAG-149, WPAG-170, WPAG-199 (manufactured by Wako Pure Chemical Industries, Ltd.) and the like. Moreover, as a commercial item of the nonionic photo-acid generator which generate | occur | produces the said organic carboxylic acid, TS-583, TS-567, SIN-11 (made by Sanpo Chemical Laboratory Co., Ltd.), etc. are mentioned.
前記（Ｂ）成分の好ましい配合量は、後述する（Ｃ）成分１００質量部に対して、０．１〜３０質量部の範囲であり、より好ましくは、０．３〜２０質量部である。（Ｂ）成分が０．１質量部未満であると、ロイコ染料を発色させる効果が小さくなり隠蔽性がおとるおそれがある。また、３０質量部を上回ると、硬化物の耐熱性が劣るおそれがある。また、（Ａ）成分１質量部に対して、（Ｂ）成分が０．１〜２０質量部であることが好ましい。 The preferable compounding quantity of the said (B) component is the range of 0.1-30 mass parts with respect to 100 mass parts of (C) component mentioned later, More preferably, it is 0.3-20 mass parts. When the component (B) is less than 0.1 part by mass, the effect of coloring the leuco dye may be reduced and concealment may be obtained. Moreover, when it exceeds 30 mass parts, there exists a possibility that the heat resistance of hardened | cured material may be inferior. Moreover, it is preferable that (B) component is 0.1-20 mass parts with respect to 1 mass part of (A) component.
＜（Ｃ）成分＞
本発明の（Ｃ）成分であるラジカル重合性化合物とは、接着剤及び塗料等に通常使用されているエチレン性不飽和基を有する化合物を使用することができ、好ましくは（メタ）アクリロイル基含有化合物等が挙げられる。（Ｃ）成分としては、例えば単官能性、二官能性、三官能性及び多官能性のモノマー、オリゴマー等を使用することができる。これらは単独で若しくは二種以上の混合物として用いることができる。中でも光硬化性及び硬化物の物性が優れるという観点から、オリゴマーとモノマーを併用することが好ましい。
<(C) component>
As the radically polymerizable compound which is the component (C) of the present invention, a compound having an ethylenically unsaturated group which is usually used in adhesives and paints can be used, and preferably contains a (meth) acryloyl group. Compounds and the like. As the component (C), for example, monofunctional, bifunctional, trifunctional and polyfunctional monomers, oligomers and the like can be used. These can be used alone or as a mixture of two or more. Among these, it is preferable to use an oligomer and a monomer in combination from the viewpoint of excellent photocurability and physical properties of the cured product.
前記単官能性モノマーとしては、特に限定されないが、例えば、エチル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、ｔｅｒ−ブチル（メタ）アクリレート、イソブチルメタクリレート、２−エチルヘキシル（メタ）アクリレート、イソデシル（メタ）アクリレート、ブトキシジエチレングリコール（メタ）アクリレート、メトキシポリエチレングリコール（メタ）アクリレート、グリシジル（メタ）アクリレート、ラウリル（メタ）アクリレート、ステアリル（メタ）アクリレート、テトラヒドロフルフリル（メタ）アクリレート、カプロラクトン変性テトラヒドロフルフリル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ジシクロペンタニル（メタ）アクリレート、ジシクロペンテニル（メタ）アクリレート、ジシクロペンテニルオキシ（メタ）アクリレート、イソボルニル（メタ）アクリレート、アダマンチル（メタ）アクリレート、ベンジル（メタ）アクリレート、フェニル（メタ）アクリレート、フェノキシエチル（メタ）アクリレート、フェノキシジエチレングリコール（メタ）アクリレート、フェノキシテトラエチレングリコール（メタ）アクリレート、ノニルフェノキシエチル（メタ）アクリレート、ブトキシエチル（メタ）アクリレート、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、４−ヒドロキシブチル（メタ）アクリレート、グリセロール（メタ）アクリレート、トリフロロエチル（メタ）アクリレート、メタクリロキシオキシエチルアシッドフォスフェート、２−ヒドロキシエチルメタクリル酸フォスフェート、γ−メタクリロキシプロピルトリメトキシシラン、γ−アクリロキシプロピルトリメトキシシラン、アクリロイルモルホリン、モルホリノエチル（メタ）アクリレート、ジメチルアミノエチル（メタ）アクリレート、ジエチルアミノエチル（メタ）アクリレート、Ｎ，Ｎ−ジメチルアミノエチル（メタ）アクリレート、Ｎ，Ｎ−ジメチルアミノプロピル（メタ）アクリレート、3-メタクリロキシプロピルメチルジメトキシシラン、3-メタクリロキシプロピルトリメトキシシラン、3-メタクリロキシプロピルメチルジエトキシシラン、3-メタクリロキシプロピルトリエトキシシラン、3-アクリロキシプロピルトリメトキシシラン、メタクリロキシオクチルトリメトキシシラン、ビニルトリメトキシシラン、ビニルトリクロルシラン、ビニルトリエトキシシラン、ビニル−トリス（β−メトキシエトキシ）シラン等が挙げられ、本発明の（Ａ）成分及び（Ｂ）成分との相溶性及び硬化性が優れるという観点から、シクロヘキシル（メタ）アクリレート、ジシクロペンタニル（メタ）アクリレート、ジシクロペンテニル（メタ）アクリレート、ジシクロペンテニルオキシ（メタ）アクリレート、イソボルニル（メタ）アクリレート、アダマンチル（メタ）アクリレート、ベンジル（メタ）アクリレート、フェニル（メタ）アクリレート、フェノキシエチル（メタ）アクリレート、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、４−ヒドロキシブチル（メタ）アクリレート、アクリロイルモルホリン、モルホリノエチル（メタ）アクリレート、ジメチルアミノエチル（メタ）アクリレート、ジエチルアミノエチル（メタ）アクリレート、Ｎ，Ｎ−ジメチルアミノエチル（メタ）アクリレート、Ｎ，Ｎ−ジメチルアミノプロピル（メタ）アクリレートが好ましい。 Although it does not specifically limit as said monofunctional monomer, For example, ethyl (meth) acrylate, n-butyl (meth) acrylate, ter-butyl (meth) acrylate, isobutyl methacrylate, 2-ethylhexyl (meth) acrylate, isodecyl ( (Meth) acrylate, butoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, glycidyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, caprolactone-modified tetrahydrofurfuryl (Meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate , Dicyclopentenyloxy (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxytetra Ethylene glycol (meth) acrylate, nonylphenoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, glycerol (Meth) acrylate, trifluoroethyl (meth) acrylate, methacryloxyoxyethyl acid phosphate, 2-hydroxy Ethyl methacrylate phosphate, γ-methacryloxypropyltrimethoxysilane, γ-acryloxypropyltrimethoxysilane, acryloylmorpholine, morpholinoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, N , N-dimethylaminoethyl (meth) acrylate, N, N-dimethylaminopropyl (meth) acrylate, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane , 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, methacryloxyoctyltrimethoxysilane, vinyltrimethoxysilane, vinyl Examples include trichlorosilane, vinyltriethoxysilane, vinyl-tris (β-methoxyethoxy) silane, and the like, from the viewpoint of excellent compatibility and curability with the components (A) and (B) of the present invention. (Meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxy (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, benzyl (meth) acrylate, phenyl ( (Meth) acrylate, phenoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, acryloylmorpholine, morpholine Noethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, and N, N-dimethylaminopropyl (meth) acrylate are preferred.
前記二官能性モノマーとしては、例えば、ネオペンチルグリコールジ（メタ）アクリレート、ステアリン酸変性ペンタエリスリトールジ（メタ）アクリレート、ジシクロペンテニルジアクリレート、ジ（メタ）アクリロイルイソシアヌレート、アルキレンオキサイド変性ビスフェノールジ（メタ）アクリレート等が挙げられる。 Examples of the bifunctional monomer include neopentyl glycol di (meth) acrylate, stearic acid-modified pentaerythritol di (meth) acrylate, dicyclopentenyl diacrylate, di (meth) acryloyl isocyanurate, alkylene oxide-modified bisphenol di ( And (meth) acrylate.
前記三官能性モノマーとしては、例えば、トリメチロールプロパントリ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、トリス（アクリロイルオキシエチル）イソシアヌレート等が挙げられる。 Examples of the trifunctional monomer include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tris (acryloyloxyethyl) isocyanurate, and the like.
前記多官能性モノマーとしては、例えば、ジトリメチロールプロパンテトラ（メタ）アクリレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジペンタエリスリトールモノヒドロキシペンタ（メタ）アクリレート、アルキル変性ジペンタエリスリトールペンタアクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート等が挙げられる。これらの重合性モノマーは単独で若しくは二種以上の混合物として用いることができる。 Examples of the polyfunctional monomer include ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, alkyl-modified dipentaerythritol pentaacrylate, and dipentaerythritol hexa. (Meth) acrylate etc. are mentioned. These polymerizable monomers can be used alone or as a mixture of two or more.
前記オリゴマーとしては、特に限定されないが、例えば、ポリブタジエン骨格のウレタン（メタ）アクリレート、水添ポリブタジエン骨格のウレタン（メタ）アクリレート、ポリカーボネート骨格のウレタン（メタ）アクリレート、ポリエーテル骨格のウレタン（メタ）アクリレート、ポリエステル骨格のウレタン（メタ）アクリレート、ひまし油骨格のウレタン（メタ）アクリレート、イソプレン系（メタ）アクリレート、水添イソプレン系（メタ）アクリレート、エポキシ（メタ）アクリレート、（メタ）アクリル基含有アクリルポリマー、（メタ）アクリル基含有ポリイソブチレンなどがあげられる。 The oligomer is not particularly limited. For example, urethane (meth) acrylate having a polybutadiene skeleton, urethane (meth) acrylate having a hydrogenated polybutadiene skeleton, urethane (meth) acrylate having a polycarbonate skeleton, and urethane (meth) acrylate having a polyether skeleton. , Urethane (meth) acrylate of polyester skeleton, urethane (meth) acrylate of castor oil skeleton, isoprene (meth) acrylate, hydrogenated isoprene (meth) acrylate, epoxy (meth) acrylate, (meth) acrylic group-containing acrylic polymer, Examples include (meth) acryl group-containing polyisobutylene.
＜（Ｄ）成分＞
本発明に用いられる（Ｄ）成分である光ラジカル開始剤は、活性エネルギー線を照射することにより、ラジカルを発生する化合物であれば限定されるものではない。（Ｄ）成分としては、例えば、アセトフェノン系光ラジカル重合開始剤、ベンゾイン系光ラジカル重合開始剤、ベンゾフェノン系光ラジカル重合開始剤、チオキサントン系光ラジカル重合開始剤、アシルホスフィンオキサイド系光ラジカル重合開始剤、チタノセン系光ラジカル重合開始剤等が挙げられ、この中でも、活性エネルギー線を照射することにより速やかに隠蔽性の優れる硬化物が得られるという観点からアセトフェノン系光ラジカル重合開始剤、アシルホスフィンオキサイド系光ラジカル重合開始剤が好ましい。またこれらは単独で用いてもよく、２種以上が併用されてもよい。
<(D) component>
The photoradical initiator that is the component (D) used in the present invention is not limited as long as it is a compound that generates radicals when irradiated with active energy rays. Examples of the component (D) include an acetophenone photoradical polymerization initiator, a benzoin photoradical polymerization initiator, a benzophenone photoradical polymerization initiator, a thioxanthone photoradical polymerization initiator, and an acylphosphine oxide photoradical polymerization initiator. , Titanocene photoradical polymerization initiators, etc. Among them, acetophenone photoradical polymerization initiators, acylphosphine oxides from the viewpoint that a cured product having excellent concealability can be obtained quickly by irradiating active energy rays. Photo radical polymerization initiators are preferred. Moreover, these may be used independently and 2 or more types may be used together.
前記アセトフェノン系光ラジカル重合開始剤としては、例えばジエトキシアセトフェノン、２−ヒドロキシ−２−メチル−１−フェニルプロパン−１−オン、ベンジルジメチルケタール、４−（２−ヒドロキシエトキシ）フェニル−（２−ヒドロキシ−２−プロピル）ケトン、１−ヒドロキシ−シクロヘキシル−フェニル−ケトン、２−メチル−２−モルホリノ（４−チオメチルフェニル）プロパン−１−オン、２−ベンジル−２−ジメチルアミノ−１−（４−モルホリノフェニル）ブタノン、２−ヒドロキシ−２−メチル−１−［４−（１−メチルビニル）フェニル］プロパノンオリゴマー等が挙げられるが、この限りではない。前記アセトフェノン系光ラジカル重合開始剤の市販品としては、ＩＲＧＡＣＵＲＥ１８４、ＤＡＲＯＣＵＲ１１７３、ＩＲＧＡＣＵＲＥ２９５９、ＩＲＧＡＣＵＲＥ１２７（ＢＡＳＦ社製）、ＥＳＡＣＵＲＥ ＫＩＰ−１５０（Ｌａｍｂｅｒｔｉ ｓ．ｐ．ａ．社製）が挙げられる。 Examples of the acetophenone photoradical polymerization initiator include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 4- (2-hydroxyethoxy) phenyl- (2- Hydroxy-2-propyl) ketone, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-2-morpholino (4-thiomethylphenyl) propan-1-one, 2-benzyl-2-dimethylamino-1- ( Examples include 4-morpholinophenyl) butanone and 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone oligomer, but are not limited thereto. Examples of commercially available acetophenone photoradical polymerization initiators include IRGACURE 184, DAROCUR 1173, IRGACURE 2959, IRGACURE 127 (manufactured by BASF), and ESACURE KIP-150 (manufactured by Lamberti spa).
前記アシルホスフィンオキサイド系光ラジカル重合開始剤としては、例えば、ビス（２，４，６−トリメチルベンゾイル）−フェニルフォスフィンオキサイド、２，４，６−トリメチルベンゾイル−ジフェニルフォスフィンオキサイド等が挙げられるが、この限りではない。前記アシルホスフィンオキサイド系光ラジカル重合開始剤の市販品としては、ＩＲＧＡＣＵＲＥ ＴＰＯ、ＩＲＧＡＣＵＲＥ８１９、ＩＲＧＡＣＵＲＥ８１９ＤＷ （ＢＡＳＦ社製）が挙げられる。 Examples of the acylphosphine oxide-based photoradical polymerization initiator include bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and the like. This is not the case. IRGACURE TPO, IRGACURE819, IRGACURE819DW (manufactured by BASF) can be mentioned as commercial products of the acylphosphine oxide-based photoradical polymerization initiator.
この（Ｄ）成分の配合量は、（Ｃ）成分１００質量部に対して０．１〜１５質量部が好ましい。この場合、０．１質量部よりも少ないと活性エネルギー線による深部硬化性が低下するおそれがあり、１５質量部よりも多いと、光硬化性樹脂組成物の保存安定性が低下するおそれがある。 As for the compounding quantity of this (D) component, 0.1-15 mass parts is preferable with respect to 100 mass parts of (C) component. In this case, if the amount is less than 0.1 parts by mass, the deep curability due to the active energy rays may be reduced, and if it is more than 15 parts by mass, the storage stability of the photocurable resin composition may be reduced. .
本発明の組成物に対し、本発明の目的を損なわない範囲で、３級アミン化合物、スチレン系共重合体等の各種エラストマー、充填材、保存安定剤、酸化防止剤、光安定剤、接着助剤、可塑剤、顔料、難燃剤、及び界面活性剤等の添加剤を使用することができる。 To the composition of the present invention, various elastomers such as tertiary amine compounds and styrenic copolymers, fillers, storage stabilizers, antioxidants, light stabilizers, adhesion assistants and the like within the scope of the present invention. Additives such as agents, plasticizers, pigments, flame retardants, and surfactants can be used.
本発明に対して貯蔵安定性を向上させる目的で、３級アミン化合物を配合してもよい。３級アミン化合物としては特に限定されないが、例えば、トリメチルアミン、トリエチルアミン、トリブチルアミン、Ｎ，Ｎ’−ジエタノールアミン、Ｎ，Ｎ’−ジメチル−Ｐ−トルイジン、Ｎ，Ｎ’−ジメチル−アニリン、Ｎ−メチル−ジエタノールアミン、Ｎ−メチル−ジメタノールアミン、Ｎ，Ｎ’−（ジメチルアミノ）エチル−メタクリレート、Ｎ，Ｎ’−ジメチルアミノ−アセトフェノン、Ｎ，Ｎ’−ジメチルアミノベンゾフェノン、Ｎ，Ｎ’−ジエチルアミノ−ベンゾフェノン、アクリロイルモルホリン、モルホリノ（メタ）アクリレート、トリイソプロパノールアミン等が挙げられる。これらの中でも、アクリロイルモルホリン、モルホリノ（メタ）アクリレート、トリイソプロパノールアミンが好ましい。 For the purpose of improving the storage stability with respect to the present invention, a tertiary amine compound may be blended. Although it does not specifically limit as a tertiary amine compound, For example, a trimethylamine, a triethylamine, a tributylamine, N, N'-diethanolamine, N, N'-dimethyl-P-toluidine, N, N'-dimethyl-aniline, N-methyl -Diethanolamine, N-methyl-dimethanolamine, N, N '-(dimethylamino) ethyl-methacrylate, N, N'-dimethylamino-acetophenone, N, N'-dimethylaminobenzophenone, N, N'-diethylamino- Examples include benzophenone, acryloylmorpholine, morpholino (meth) acrylate, triisopropanolamine and the like. Among these, acryloylmorpholine, morpholino (meth) acrylate, and triisopropanolamine are preferable.
本発明に対し、硬化物の弾性率、流動性などの改良を目的として、保存安定性を阻害しない程度の充填材を添加してもよい。具体的には有機質粉体、無機質粉体、金属質粉体等が挙げられる。無機質粉体の充填材としては、ガラス、フュームドシリカ、アルミナ、マイカ、セラミックス、シリコーンゴム粉体、炭酸カルシウム、窒化アルミ、カーボン粉、カオリンクレー、乾燥粘土鉱物、乾燥珪藻土等が挙げられる。無機質粉体の配合量は、（Ａ）成分１００質量部に対し、０．１〜１００質量部程度が好ましい。０．１質量部より少ないと効果が小さく、１００質量部より大きいと光硬化性樹脂組成物の流動性が乏しくなり、作業性が低下する。 For the purpose of improving the elastic modulus and fluidity of the cured product, a filler that does not impair storage stability may be added to the present invention. Specific examples include organic powders, inorganic powders, and metallic powders. Examples of the inorganic powder filler include glass, fumed silica, alumina, mica, ceramics, silicone rubber powder, calcium carbonate, aluminum nitride, carbon powder, kaolin clay, dry clay mineral, and dry diatomaceous earth. As for the compounding quantity of inorganic powder, about 0.1-100 mass parts is preferable with respect to 100 mass parts of (A) component. When the amount is less than 0.1 parts by mass, the effect is small, and when the amount is more than 100 parts by mass, the fluidity of the photocurable resin composition becomes poor and workability is deteriorated.
フュームドシリカは、光硬化性樹脂組成物の粘度調整又は硬化物の機械的強度を向上させる目的で配合できる。好ましくは、オルガノクロロシラン類、ポリオルガノシロキサン、ヘキサメチルジシラザンなどで疎水化処理したものなどが用いることができる。フュームドシリカの具体例としては、例えば、日本アエロジル製の商品名アエロジルＲ９７４、Ｒ９７２、Ｒ９７２Ｖ、Ｒ９７２ＣＦ、Ｒ８０５、Ｒ８１２、Ｒ８１２Ｓ、Ｒ８１６、Ｒ８２００、ＲＹ２００、ＲＸ２００、ＲＹ２００Ｓ、Ｒ２０２等の市販品が挙げられる。 Fumed silica can be blended for the purpose of adjusting the viscosity of the photocurable resin composition or improving the mechanical strength of the cured product. Preferably, those hydrophobized with organochlorosilanes, polyorganosiloxane, hexamethyldisilazane, etc. can be used. Specific examples of fumed silica include commercial products such as Aerosil R974, R972, R972V, R972CF, R805, R812, R812S, R816, R8200, RY200, RX200, RY200S, R202 manufactured by Nippon Aerosil. .
有機質粉体の充填材としては、例えば、ポリエチレン、ポリプロピレン、ナイロン、架橋アクリル、架橋ポリスチレン、ポリエステル、ポリビニルアルコール、ポリビニルブチラール、ポリカーボネートが挙げられる。有機質粉体の配合量は、（Ａ）成分１００質量部に対し、０．１〜１００質量部程度が好ましい。０．１質量部より少ないと効果が小さく、１００質量部より大きいと光硬化性樹脂組成物の流動性が乏しくなり、作業性が低下する。 Examples of the organic powder filler include polyethylene, polypropylene, nylon, crosslinked acrylic, crosslinked polystyrene, polyester, polyvinyl alcohol, polyvinyl butyral, and polycarbonate. As for the compounding quantity of organic powder, about 0.1-100 mass parts is preferable with respect to 100 mass parts of (A) component. When the amount is less than 0.1 parts by mass, the effect is small, and when the amount is more than 100 parts by mass, the fluidity of the photocurable resin composition becomes poor and workability is deteriorated.
本発明に対し保存安定剤を添加してもよい。保存安定剤としては、ベンゾキノン、ハイドロキノン、ハイドロキノンモノメチルエーテル等のラジカル吸収剤、エチレンジアミン４酢酸又はその２−ナトリウム塩、シユウ酸、アセチルアセトン、ｏ−アミノフエノール等の金属キレート化剤等を添加することもできる。 A storage stabilizer may be added to the present invention. As a storage stabilizer, a radical absorbent such as benzoquinone, hydroquinone, hydroquinone monomethyl ether, a metal chelating agent such as ethylenediaminetetraacetic acid or its 2-sodium salt, oxalic acid, acetylacetone, o-aminophenol, etc. may be added. it can.
本発明に対し酸化防止剤を添加してもよい。酸化防止剤としては、例えば、β−ナフトキノン、２−メトキシ−１，４−ナフトキノン、メチルハイドロキノン、ハイドロキノン、ハイドロキノンモノメチルエーテル、モノ−ｔｅｒｔ−ブチルハイドロキノン、２，５−ジ−ｔｅｒｔ−ブチルハイドロキノン、ｐ−ベンゾキノン、２，５−ジフェニル−ｐ−ベンゾキノン、２，５−ジ−ｔｅｒｔ−ブチル−ｐ−ベンゾキノン等のキノン系化合物；フェノチアジン、２，２−メチレン−ビス（４−メチル−６−ｔｅｒｔ−ブチルフェノール）、カテコール、ｔｅｒｔ−ブチルカテコール、２−ブチル−４−ヒドロキシアニソール、２，６−ジ−ｔｅｒｔ−ブチル−ｐ−クレゾール、２−ｔｅｒｔ−ブチル−６−（３−ｔｅｒｔ−ブチル−２−ヒドロキシ−５−メチルベンジル）−４−メチルフェニルアクリレート、２−〔１−（２−ヒドロキシ−３，５−ジ−ｔｅｒｔ−ペンチルフェニル）エチル〕−４，６−ジ−ｔｅｒｔ−ペンチルフェニルアクリレート、４，４′−ブチリデンビス（６−ｔｅｒｔ−ブチル−３−メチルフェノール）、４，４′−チオビス（６−ｔｅｒｔ−ブチル−３−メチルフェノール）、３，９−ビス〔２−〔３−（３−ｔｅｒｔ−ブチル−４−ヒドロキシ−５−メチルフェニル）プロピオニロキシ〕−１，１−ジメチルエチル〕−２，４，８，１０−テトラオキサスピロ〔５，５〕ウンデカン、ペンタエリスリトールテトラキス〔３−（３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシフェニル）プロピオネート〕、チオジエチレンビス〔３−（３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシフェニル）プロピオネート〕、オクタデシル−３−（３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシフェニル）プロピオネート、Ｎ，Ｎ′−ヘキサン−１，６−ジイルビス〔３−（３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシフェニル）プロピオンアミド〕、ベンゼンプロパン酸，３，５−ビス（１，１−ジメチルエチル）−４−ヒドロキシ，Ｃ７−Ｃ９側鎖アルキルエステル、２，４−ジメチル−６−（１−メチルペンタデシル）フェノール、ジエチル〔〔３，５−ビス（１，１−ジメチルエチル）−４−ヒドロキシフェニル〕メチル〕フォスフォネート、３，３′，３″，５，５′，５″−ヘキサ−ｔｅｒｔ−ブチル−ａ，ａ′，ａ″−（メシチレン−２，４，６−トリル）トリ−ｐ−クレゾール、カルシウムジエチルビス〔〔３，５−ビス（１，１−ジメチルエチル）−４−ヒドロキシフェニル〕メチル〕フォスフォネート、４，６−ビス（オクチルチオメチル）−ｏ−クレゾール、エチレンビス（オキシエチレン）ビス〔３−（５−ｔｅｒｔ−ブチル−４−ヒドロキシ−ｍ−トリル）プロピオネート〕、ヘキサメチレンビス〔３−（３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシフェニル）プロピオネート、１，３，５−トリス（３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシベンジル）−１，３，５−トリアジン−２，４，６（１Ｈ，３Ｈ，５Ｈ）−トリオン、１，３，５−トリス〔（４−ｔｅｒｔ−ブチル−３−ヒドロキシ−２，６−キシリル）メチル〕−１，３，５−トリアジン−２，４，６（１Ｈ，３Ｈ，５Ｈ）−トリオン、Ｎ−フェニルベンゼンアミンと２，４，６−トリメチルペンテンとの反応生成物、２，６−ジ−ｔｅｒｔ−ブチル−４−（４，６−ビス（オクチルチオ）−１，３，５−トリアジン−２−イルアミノ）フェノール、ピクリン酸、クエン酸等のフェノール類；トリス（２，４−ジ−ｔｅｒｔ−ブチルフェニル）フォスファイト、トリス〔２−〔〔２，４，８，１０−テトラ−ｔｅｒｔ−ブチルジベンゾ〔ｄ，ｆ〕〔１，３，２〕ジオキサフォスフェフィン−６−イル〕オキシ〕エチル〕アミン、ビス（２，４−ジ−ｔｅｒｔ−ブチルフェニル）ペンタエリスリートールジフォスファイト、ビス〔２，４−ビス（１，１−ジメチルエチル）−６−メチルフェニル〕エチルエステル亜リン酸、テトラキス（２，４−ジ−ｔｅｒｔ−ブチルフェニル）〔１，１−ビスフェニル〕−４，４‘−ジイルビスホスフォナイト、６−〔３−（３−ｔｅｒｔ−ブチル−４−ヒドロキシ−５−メチルフェニル）プロポキシ〕−２，４，８，１０−テトラ−ｔｅｒｔ−ブチルジベンズ〔ｄ、ｆ〕〔１，３，２〕ジオキサフォスフェフィン等のリン系化合物；ジラウリル３，３′−チオジプロピオネート、ジミリスチル３，３′−チオジプロピオネート、ジステアリル３，３’−チオジプロピオネート、ペンタエリスリチルテトラキス（３−ラウリルチオプロピオネート）、２−メルカプトベンズイミダゾール等のイオウ系化合物；フェノチアジン等のアミン系化合物；ラクトン系化合物；ビタミンＥ系化合物等が挙げられる。中でもフェノール系化合物が好適である。 An antioxidant may be added to the present invention. Examples of the antioxidant include β-naphthoquinone, 2-methoxy-1,4-naphthoquinone, methyl hydroquinone, hydroquinone, hydroquinone monomethyl ether, mono-tert-butyl hydroquinone, 2,5-di-tert-butyl hydroquinone, p. -Quinone compounds such as benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-di-tert-butyl-p-benzoquinone; phenothiazine, 2,2-methylene-bis (4-methyl-6-tert- Butylphenol), catechol, tert-butylcatechol, 2-butyl-4-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, 2-tert-butyl-6- (3-tert-butyl-2- Hydroxy-5-methylbenzyl) -4-methyl Phenyl acrylate, 2- [1- (2-hydroxy-3,5-di-tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, 4,4′-butylidenebis (6-tert- Butyl-3-methylphenol), 4,4'-thiobis (6-tert-butyl-3-methylphenol), 3,9-bis [2- [3- (3-tert-butyl-4-hydroxy-5) -Methylphenyl) propionyloxy] -1,1-dimethylethyl] -2,4,8,10-tetraoxaspiro [5,5] undecane, pentaerythritol tetrakis [3- (3,5-di-tert- Butyl-4-hydroxyphenyl) propionate], thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl)] Propionate], octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, N, N′-hexane-1,6-diylbis [3- (3,5-di-tert-butyl) -4-hydroxyphenyl) propionamide], benzenepropanoic acid, 3,5-bis (1,1-dimethylethyl) -4-hydroxy, C7-C9 side chain alkyl ester, 2,4-dimethyl-6- (1 -Methylpentadecyl) phenol, diethyl [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] phosphonate, 3,3 ', 3 ", 5,5', 5" -Hexa-tert-butyl-a, a ', a "-(mesitylene-2,4,6-tolyl) tri-p-cresol, calcium diethylbis [[3,5-bis 1,1-dimethylethyl) -4-hydroxyphenyl] methyl] phosphonate, 4,6-bis (octylthiomethyl) -o-cresol, ethylenebis (oxyethylene) bis [3- (5-tert-butyl) -4-hydroxy-m-tolyl) propionate], hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, 1,3,5-tris (3,5-di-) tert-butyl-4-hydroxybenzyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 1,3,5-tris [(4-tert-butyl-3- Hydroxy-2,6-xylyl) methyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, N-phenylbenzenamine and 2,4 Reaction products with 6-trimethylpentene, 2,6-di-tert-butyl-4- (4,6-bis (octylthio) -1,3,5-triazin-2-ylamino) phenol, picric acid, citric acid Phenols such as acids; tris (2,4-di-tert-butylphenyl) phosphite, tris [2-[[2,4,8,10-tetra-tert-butyldibenzo [d, f] [1, 3,2] dioxaphosphine-6-yl] oxy] ethyl] amine, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis [2,4-bis (1 , 1-dimethylethyl) -6-methylphenyl] ethyl ester phosphorous acid, tetrakis (2,4-di-tert-butylphenyl) [1,1-bisphenyl] -4,4′- Diylbisphosphonite, 6- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propoxy] -2,4,8,10-tetra-tert-butyldibenz [d, f] [1 , 3, 2] phosphorus compounds such as dioxaphosphine; dilauryl 3,3′-thiodipropionate, dimyristyl 3,3′-thiodipropionate, distearyl 3,3′-thiodipropionate, Sulfur compounds such as pentaerythrityl tetrakis (3-lauryl thiopropionate) and 2-mercaptobenzimidazole; amine compounds such as phenothiazine; lactone compounds; vitamin E compounds. Of these, phenol compounds are preferred.
本発明に対し光安定剤を添加してもよい。光安定剤としては、例えば、ビス（２，２，６，６−テトラメチル−４−ピペリジル）セバケート、ビス（１，２，２，６，６−ペンタメチル−４−ピペリジル）セバケート、４−ベンゾイルオキシ−２，２，６，６−テトラメチルピペリジン、１−〔２−〔３−（３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシフェニル）プロピオニルオキシ〕エチル〕−４−〔３−（３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシフェニル）プロピオニルオキシ〕−２，２，６，６−テトラメチルピペリジン、１，２，２，６，６−ペンタメチル−４−ピペリジニル−メタアクリレート、ビス（１，２，２，６，６−ペンタメチル−４−ピペリジニル）〔〔３，５−ビス（１，１−ジメチルエチル）−４−ヒドロキシフェニル〕メチル〕ブチルマロネート、デカン二酸ビス（２，２，６，６−テトラメチル−１（オクチルオキシ）−４−ピペリジニル）エステル，１，１−ジメチルエチルヒドロペルオキシドとオクタンの反応生成物、Ｎ，Ｎ′，Ｎ″，Ｎ″′−テトラキス−（４，６−ビス−（ブチル−（Ｎ−メチル−２，２，６，６−テトラメチルピペリジン−４−イル）アミノ）−トリアジン−２−イル）−４，７−ジアザデカン−１，１０−ジアミン、ジブチルアミン・１，３，５−トリアジン・Ｎ，Ｎ′−ビス（２，２，６，６−テトラメチル−４−ピペリジル−１，６−ヘキサメチレンジアミンとＮ−（２，２，６，６−テトラメチル−４−ピペリジル）ブチルアミンの重縮合物、ポリ〔〔６−（１，１，３，３−テトラメチルブチル）アミノ−１，３，５−トリアジン−２，４−ジイル〕〔（２，２，６，６−テトラメチル−４−ピペリジル）イミノ〕ヘキサメチレン〔（２，２，６，６−テトラメチル−４−ピペリジル）イミノ〕〕、コハク酸ジメチルと４−ヒドロキシ−２，２，６，６−テトラメチル−１−ピペリジンエタノールの重合物、２，２，４，４−テトラメチル−２０−（β−ラウリルオキシカルボニル）エチル−７−オキサ−３，２０−ジアザジスピロ〔５・１・１１・２〕ヘネイコサン−２１−オン、β−アラニン，Ｎ，−（２，２，６，６−テトラメチル−４−ピペリジニル）−ドデシルエステル／テトラデシルエステル、Ｎ−アセチル−３−ドデシル−１−（２，２，６，６−テトラメチル−４−ピペリジニル）ピロリジン−２，５−ジオン、２，２，４，４−テトラメチル−７−オキサ−３，２０−ジアザジスピロ〔５，１，１１，２〕ヘネイコサン−２１−オン、２，２，４，４−テトラメチル−２１−オキサ−３，２０−ジアザジシクロ−〔５，１，１１，２〕−ヘネイコサン−２０−プロパン酸ドデシルエステル／テトラデシルエステル、プロパンジオイックアシッド，〔（４−メトキシフェニル）−メチレン〕−ビス（１，２，２，６，６−ペンタメチル−４−ピペリジニル）エステル、２，２，６，６−テトラメチル−４−ピペリジノールの高級脂肪酸エステル、１，３−ベンゼンジカルボキシアミド，Ｎ，Ｎ′−ビス（２，２，６，６−テトラメチル−４−ピペリジニル）等のヒンダートアミン系；オクタベンゾン等のベンゾフェノン系化合物；２−（２Ｈ−ベンゾトリアゾール−２−イル）−４−（１，１，３，３−テトラメチルブチル）フェノール、２−（２−ヒドロキシ−５−メチルフェニル）ベンゾトリアゾール、２−〔２−ヒドロキシ−３−（３，４，５，６−テトラヒドロフタルイミド−メチル）−５−メチルフェニル〕ベンゾトリアゾール、２−（３−ｔｅｒｔ−ブチル−２−ヒドロキシ−５−メチルフェニル）−５−クロロベンゾトリアゾール、２−（２−ヒドロキシ−３，５−ジ−ｔｅｒｔ−ペンチルフェニル）ベンゾトリアゾール、メチル３−（３−（２Ｈ−ベンゾトリアゾール−２−イル）−５−ｔｅｒｔ−ブチル−４−ヒドロキシフェニル）プロピオネートとポリエチレングリコールの反応生成物、２−（２Ｈ−ベンゾトリアゾール−２−イル）−６−ドデシル−４−メチルフェノール等のベンゾトリアゾール系化合物；２，４−ジ−ｔｅｒｔ−ブチルフェニル−３，５−ジ−ｔｅｒｔ−ブチル−４−ヒドロキシベンゾエート等のベンゾエート系化合物；２−（４，６−ジフェニル−１，３，５−トリアジン−２−イル）−５−〔（ヘキシル）オキシ〕フェノール等のトリアジン系化合物等が挙げられる。特に好ましくは、ヒンダートアミン系化合物である。 A light stabilizer may be added to the present invention. Examples of the light stabilizer include bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, and 4-benzoyl. Oxy-2,2,6,6-tetramethylpiperidine, 1- [2- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] ethyl] -4- [3- ( 3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] -2,2,6,6-tetramethylpiperidine, 1,2,2,6,6-pentamethyl-4-piperidinyl-methacrylate, Bis (1,2,2,6,6-pentamethyl-4-piperidinyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] butylmalone , Decanedioic acid bis (2,2,6,6-tetramethyl-1 (octyloxy) -4-piperidinyl) ester, reaction product of 1,1-dimethylethyl hydroperoxide and octane, N, N ′, N ", N" '-tetrakis- (4,6-bis- (butyl- (N-methyl-2,2,6,6-tetramethylpiperidin-4-yl) amino) -triazin-2-yl)- 4,7-diazadecane-1,10-diamine, dibutylamine, 1,3,5-triazine, N, N′-bis (2,2,6,6-tetramethyl-4-piperidyl-1,6-hexa Polycondensate of methylenediamine and N- (2,2,6,6-tetramethyl-4-piperidyl) butylamine, poly [[6- (1,1,3,3-tetramethylbutyl) amino-1,3 , 5-Triazine-2,4 Diyl] [(2,2,6,6-tetramethyl-4-piperidyl) imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imino]], dimethyl succinate and 4- Polymer of hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol, 2,2,4,4-tetramethyl-20- (β-lauryloxycarbonyl) ethyl-7-oxa-3,20 -Diazadispiro [5,11,2] heneicosan-21-one, β-alanine, N,-(2,2,6,6-tetramethyl-4-piperidinyl) -dodecyl ester / tetradecyl ester, N- Acetyl-3-dodecyl-1- (2,2,6,6-tetramethyl-4-piperidinyl) pyrrolidine-2,5-dione, 2,2,4,4-tetramethyl-7-oxa-3, 0-diazadispiro [5,1,11,2] heneicosane-21-one, 2,2,4,4-tetramethyl-21-oxa-3,20-diazadicyclo- [5,1,11,2] -heneicosane -20-propanoic acid dodecyl ester / tetradecyl ester, propanedioic acid, [(4-methoxyphenyl) -methylene] -bis (1,2,2,6,6-pentamethyl-4-piperidinyl) ester, 2, Higher fatty acid esters of 2,6,6-tetramethyl-4-piperidinol, 1,3-benzenedicarboxamide, N, N′-bis (2,2,6,6-tetramethyl-4-piperidinyl), etc. Hindered amines; benzophenone compounds such as octabenzone; 2- (2H-benzotriazol-2-yl) -4- (1,1,3,3-te Tramethylbutyl) phenol, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- [2-hydroxy-3- (3,4,5,6-tetrahydrophthalimido-methyl) -5-methylphenyl] Benzotriazole, 2- (3-tert-butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3,5-di-tert-pentylphenyl) benzotriazole, methyl Reaction product of 3- (3- (2H-benzotriazol-2-yl) -5-tert-butyl-4-hydroxyphenyl) propionate and polyethylene glycol, 2- (2H-benzotriazol-2-yl) -6 -Benzotriazole compounds such as dodecyl-4-methylphenol; 2,4-di- benzoate compounds such as ert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate; 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5- [ (Hexyl) oxy] triazine compounds such as phenol and the like. Particularly preferred are hindered amine compounds.
本発明に対し密着付与剤を添加してもよい。密着付与剤としてはγ−クロロプロピルトリメトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、Ｎ−β−（アミノエチル）−γ−アミノプロピルトリメトキシシラン、Ｎ−β−（アミノエチル）−γ−アミノプロピルメチルジメトキシシラン、γ−ユレイドプロピルトリエトキシシラン、ヒドロキシエチルメタクリレートリン酸エステル、メタクリロキシオキシエチルアシッドフォスフェート、メタクリロキシオキシエチルアシッドフォスフェートモノエチルアミンハーフソルト、２−ヒドロキシエチルメタクリル酸フォスフェート等があげられる。これらの中では、ヒドロキシエチルメタクリレートリン酸エステル、メタクリロキシオキシエチルアシッドフォスフェート、メタクリロキシオキシエチルアシッドフォスフェートモノエチルアミンハーフソルト、２−ヒドロキシエチルメタクリル酸フォスフェート等が好ましい。密着性付与剤の含有量は、（Ｃ）成分１００質量部に対し、０．０５〜３０質量部が好ましく、更に好ましくは０．２〜１０質量部である。 An adhesion-imparting agent may be added to the present invention. As adhesion promoters, γ-chloropropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyl Triethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-ureidopropyltriethoxysilane, hydroxyethyl methacrylate Examples thereof include phosphoric acid ester, methacryloxyoxyethyl acid phosphate, methacryloxyoxyethyl acid phosphate monoethylamine half salt, 2-hydroxyethyl methacrylic acid phosphate and the like. Among these, hydroxyethyl methacrylate phosphate, methacryloxyoxyethyl acid phosphate, methacryloxyoxyethyl acid phosphate monoethylamine half salt, 2-hydroxyethyl methacrylate phosphate and the like are preferable. 0.05-30 mass parts is preferable with respect to 100 mass parts of (C) component, and, as for content of an adhesive provision agent, 0.2-10 mass parts is still more preferable.
本発明の光硬化性樹脂組成物は、従来公知の方法により製造することができる。例えば、（Ａ）成分〜（D）成分の所定量を配合して、ミキサー等の混合手段を使用して、好ましくは１０〜７０℃の温度で好ましくは０．１〜５時間混合することにより製造することができる。 The photocurable resin composition of the present invention can be produced by a conventionally known method. For example, by blending a predetermined amount of component (A) to component (D) and using a mixing means such as a mixer, preferably at a temperature of 10 to 70 ° C., preferably for 0.1 to 5 hours. Can be manufactured.
本発明の光硬化性樹脂組成物を紫外線、可視光等の光を照射することにより硬化させるに際しての光源は特に限定されず、例えば、低圧水銀灯、中圧水銀灯、高圧水銀灯、超高圧水銀灯、ブラックライトランプ、マイクロウェーブ励起水銀灯、メタルハライドランプ、ナトリウムランプ、ハロゲンランプ、キセノンランプ、ＬＥＤ、蛍光灯、太陽光、電子線照射装置等が挙げられる。光照射の照射量は硬化物の特性の観点で１０ｋＪ／ｍ２以上であることが好ましく、より好ましくは１５ｋＪ／ｍ２以上である。 The light source for curing the photocurable resin composition of the present invention by irradiation with light such as ultraviolet rays and visible light is not particularly limited. For example, the low pressure mercury lamp, the medium pressure mercury lamp, the high pressure mercury lamp, the ultrahigh pressure mercury lamp, black Examples thereof include a light lamp, a microwave excitation mercury lamp, a metal halide lamp, a sodium lamp, a halogen lamp, a xenon lamp, an LED, a fluorescent lamp, sunlight, and an electron beam irradiation device. The irradiation amount of light irradiation is preferably 10 kJ / m 2 or more, more preferably 15 kJ / m 2 or more from the viewpoint of the properties of the cured product.
本発明の光硬化性樹脂組成物の硬化物の透過率（波長５５０ｎｍの波長）が３％以下であることが隠蔽性の観点から好ましい。なお、硬化物の透過率測定は次の通りである。
硬化物の透過率測定：光硬化性樹脂組成物を厚みが１５０μｍになるように表面が平滑な試験片を作成し、６０ｋＪ／ｍ２の条件で紫外線照射し、硬化物を得る。この硬化物の透過率を分光光度計にて測定する。
From the viewpoint of concealability, it is preferable that the transmittance (wavelength of wavelength 550 nm) of the cured product of the photocurable resin composition of the present invention is 3% or less. In addition, the transmittance | permeability measurement of hardened | cured material is as follows.
Measurement of transmittance of cured product: A test piece having a smooth surface was prepared so that the thickness of the photocurable resin composition was 150 μm, and ultraviolet irradiation was performed under the condition of 60 kJ / m 2 to obtain a cured product. The transmittance of the cured product is measured with a spectrophotometer.
本発明の光硬化性樹脂組成物が好適に用いられる用途としては、被覆剤、注型剤、シール剤、シーリング剤、ポッティング剤、接着剤、ライニング剤等があげられる。中でも、被覆剤、注型剤、シール剤、ポッティング剤、接着剤用途が好ましい。なお、このような用途で使用するにあたり、本発明の光硬化性樹脂組成物は２５℃で液状であることが好ましい。 Applications in which the photocurable resin composition of the present invention is suitably used include coating agents, casting agents, sealing agents, sealing agents, potting agents, adhesives, lining agents and the like. Among these, coating agents, casting agents, sealing agents, potting agents, and adhesives are preferable. In addition, when using for such a use, it is preferable that the photocurable resin composition of this invention is a liquid at 25 degreeC.
本発明の光硬化性樹脂組成物の特に好ましい用途としては、フレキシブル配線板向け被覆材料、注型用樹脂、画像表示装置、光学部材、ＣＭＯＳセンサー、筐体とレンズ等の組立用接着剤、バックライトの光漏れ防止、外光の進入防止などを目的とした液晶ディスプレイのシール剤等が挙げられる。 Particularly preferred uses of the photocurable resin composition of the present invention include coating materials for flexible wiring boards, casting resins, image display devices, optical members, CMOS sensors, adhesives for assembly of housings and lenses, backs, etc. Examples thereof include a sealing agent for liquid crystal displays for the purpose of preventing light leakage and preventing entry of external light.
以下に実施例をあげて本発明を更に詳細の説明をするが、本発明はこれら実施例に限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.
実施例及び比較例において使用した試験法は下記の通りである。
＜光硬化性樹脂組成物の調製＞
各成分を表１に示す質量部で採取し、常温にて攪拌機で６０分混合し、光硬化性樹脂組成物を調製し、各種物性に関して次のようにして測定した。尚詳細な調製量は表１に従い、数値は全て質量部で表記する。
Test methods used in Examples and Comparative Examples are as follows.
<Preparation of photocurable resin composition>
Each component was sampled in parts by mass shown in Table 1 and mixed with a stirrer at room temperature for 60 minutes to prepare a photocurable resin composition, and various physical properties were measured as follows. The detailed preparation amounts are in accordance with Table 1, and all numerical values are expressed in parts by mass.
＜（Ａ）成分＞
ａ１：３−ブチル−６−メチル−７−アニリノフルオラン（ＯＤＢ−２、山本化成株式会社製）
＜（Ａ）成分の比較成分＞
ａ’１：カーボンブラック
＜（Ｂ）成分＞
ｂ１：化学式（１）で表される光酸発生剤（有機スルホン酸を発生する非イオン性光酸発生剤、ＳＰ−１０３、株式会社ＡＤＥＫＡ製）
ｂ３：有機スルホン酸を発生する非イオン性光酸発生剤（ＮＴ−１ＴＦ、サンアプロ株式会社製）
ｂ４：ナフトキノンジアジド化合物（有機カルボン酸を発生する非イオン性光酸発生剤、Ｔ５８３、株式会社三宝化学研究所製）
＜（Ｂ）成分の比較成分＞
ｂ‘１：トリアリ−ルスルホニウム−ヘキサフルオロホスフェート（イオン性酸発生剤、ＣＰＩ−１００Ｐ、サンアプロ株式会社製）
ｂ‘２：トリアリールスルホニウム−フッ素化アルキルフルオロリン酸（イオン性酸発生剤、ＣＰＩ−２００Ｋ、サンアプロ株式会社製）
ｂ‘３：４−メチルフェニル−４−（１−メチルエチル）フェニルヨードニウム−テトラキス（ペンタフルオロフェニル）ボレート（イオン性酸発生剤、Ｐｈｏｔｏ ｉｎｉｔｉａｔｏｒ２０７４ローディア社製）
ｂ‘４：ジアリールスルホニウムヘキサフルオロアンチモネート（イオン性酸発生剤、ＰＣ−２５０６、ポリセット社製）
ｂ‘５：トリアリールスルホニウムヘキサフルオロアンチモネート（イオン性酸発生剤、ＨＳ−１Ａ、サンアプロ株式会社製）
＜（Ｃ）成分＞
ｃ１：ウレタン（メタ）アクリレート（ＵＶ−３０００Ｂ、日本合成化学工業株式会社製）
ｃ２：アクリロイルモルホリン（ＡＣＭＯ、ＫＪケミカルズ株式会社製）
ｃ３：イソボルニルアクリレート（ライトアクリレートＩＢＸ−Ａ、共栄社化学株式会社製）
ｃ４：テトラヒドロフルフリルアクリレート（ライトアクリレートＴＨＦ−Ａ、共栄社化学株式会社製）
＜（Ｄ）成分＞
ｄ１：２−ヒドロキシ−２−メチル−１−フェニル−プロパン−１−オン（ＩＲＧＡＣＵＲＥ１１７３、ＢＡＳＦ社製）
ｄ２：２−ヒドロキシ−１−｛４−［４−（２−ヒドロキシ−２−メチル−プロピオニル）−ベンジル］−フェニル｝−２−メチル−プロパン−１−オン（ＩＲＧＡＣＵＲＥ１２７、ＢＡＳＦ社製）
<(A) component>
a1: 3-butyl-6-methyl-7-anilinofluorane (ODB-2, manufactured by Yamamoto Kasei Co., Ltd.)
<Comparison component of component (A)>
a'1: Carbon black <(B) component>
b1: Photoacid generator represented by the chemical formula (1) (nonionic photoacid generator that generates organic sulfonic acid, SP-103, manufactured by ADEKA Corporation)
b3: Nonionic photoacid generator that generates organic sulfonic acid (NT-1TF, manufactured by San Apro Co., Ltd.)
b4: Naphthoquinonediazide compound (nonionic photoacid generator for generating organic carboxylic acid, T583, manufactured by Sanpo Chemical Laboratory Co., Ltd.)
<Comparison component of component (B)>
b′1: Triarylsulfonium-hexafluorophosphate (ionic acid generator, CPI-100P, manufactured by San Apro Co., Ltd.)
b′2: Triarylsulfonium-fluorinated alkyl fluorophosphoric acid (ionic acid generator, CPI-200K, manufactured by San Apro Co., Ltd.)
b'3: 4-methylphenyl-4- (1-methylethyl) phenyliodonium-tetrakis (pentafluorophenyl) borate (ionic acid generator, Photo initiator 2074, Rhodia)
b′4: Diarylsulfonium hexafluoroantimonate (ionic acid generator, PC-2506, manufactured by Polyset)
b′5: Triarylsulfonium hexafluoroantimonate (ionic acid generator, HS-1A, manufactured by San Apro Co., Ltd.)
<(C) component>
c1: Urethane (meth) acrylate (UV-3000B, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.)
c2: Acryloylmorpholine (ACMO, manufactured by KJ Chemicals)
c3: Isobornyl acrylate (Light acrylate IBX-A, manufactured by Kyoeisha Chemical Co., Ltd.)
c4: Tetrahydrofurfuryl acrylate (light acrylate THF-A, manufactured by Kyoeisha Chemical Co., Ltd.)
<(D) component>
d1: 2-hydroxy-2-methyl-1-phenyl-propan-1-one (IRGACURE 1173, manufactured by BASF)
d2: 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methyl-propan-1-one (IRGACURE127, manufactured by BASF)
表１の実施例、比較例において使用した試験方法は下記の通りである。 The test methods used in the examples and comparative examples in Table 1 are as follows.
＜硬化物の外観確認＞
各光硬化性樹脂組成物を厚みが１５０μｍになるように表面が平滑な試験片を作成し、紫外線照射器を用いて６０ｋＪ／ｍ２の条件で紫外線照射し、硬化物を得た。その硬化物の外観を目視で確認し、下記基準に基づき評価した。その結果を表１にまとめた。
［評価基準］
○：硬化物の外観が黒色であり、隠蔽性が認めれたもの
×：硬化物が透明であり、隠蔽性が認められなかったもの
<Appearance confirmation of cured product>
A test piece having a smooth surface was prepared so that each photocurable resin composition had a thickness of 150 μm, and was irradiated with ultraviolet rays using an ultraviolet irradiator at 60 kJ / m 2 to obtain a cured product. The appearance of the cured product was visually confirmed and evaluated based on the following criteria. The results are summarized in Table 1.
[Evaluation criteria]
○: The appearance of the cured product is black and concealment was recognized. ×: The cured product was transparent and no concealment was observed.
＜短絡確認試験＞
電極間の距離が０．１６５ｍｍである銅製の櫛歯電極に光硬化性樹脂組成物を厚み０．２ｍｍになるように塗布し、硬化させずに、２０Ｖの電圧を２４時間印加し続けたときの絶縁抵抗を測定し、「隣接電極間の短絡の有無」を下記の基準に基づき評価した。
［評価基準］
○：２４時間短絡が生じなかったもの
×：２４時間以内に短絡が生じたもの
<Short-circuit confirmation test>
When a photocurable resin composition is applied to a copper comb electrode having a distance between the electrodes of 0.165 mm to a thickness of 0.2 mm, and a voltage of 20 V is continuously applied for 24 hours without curing. The insulation resistance was measured, and “presence / absence of short circuit between adjacent electrodes” was evaluated based on the following criteria.
[Evaluation criteria]
○: No short circuit occurred for 24 hours ×: Short circuit occurred within 24 hours
表１によれば、本発明に該当する実施例１〜４は、（Ｂ）成分の非イオン性光酸発生剤を含有する光硬化性樹脂組成物であるが、紫外線等の活性エネルギーの照射により速やかに硬化し、隠蔽性の高い硬化物であり、かつ電極の隣接電極間の短絡を抑制する効果を有することがわかる。 According to Table 1, Examples 1-4 corresponding to the present invention are photocurable resin compositions containing a nonionic photoacid generator as component (B), but irradiation with active energy such as ultraviolet rays. It is found that the cured product is quickly cured, has a high concealability, and has an effect of suppressing a short circuit between adjacent electrodes.
また、比較例１〜５は、本発明の（Ｂ）成分を含有せず、代わりにイオン性光酸発生剤を含有する光硬化性樹脂組成物であるが、本発明の実施例では生じていない隣接電極間の短絡が生じていることが分かる。また、比較例６は、本発明の（A）成分を含有せず、代わりにカーボンブラックを含有する光硬化性樹脂組成物であるが、本発明の実施例では生じていない隣接電極間の短絡が生じていることが分かる。 Moreover, although Comparative Examples 1-5 are the photocurable resin compositions which do not contain (B) component of this invention and contain an ionic photoacid generator instead, it has arisen in the Example of this invention. It can be seen that there is a short between adjacent electrodes. Moreover, although the comparative example 6 is a photocurable resin composition which does not contain (A) component of this invention but contains carbon black instead, the short circuit between the adjacent electrodes which has not arisen in the Example of this invention It can be seen that
＜硬化物の透過率測定＞
実施例１〜５の各光硬化性樹脂組成物を厚みが１５０μｍになるように表面が平滑な試験片を作成し、
６０ｋＪ／ｍ２の条件で紫外線照射し、硬化物を得た。この硬化物の透過率を分光光度計ＵＶ−２４５０（島津製作所製）にて測定した。実施例１〜５の各光硬化性樹脂組成物の硬化物の評価結果は、すべて、５５０ｎｍの波長の透過率が３％以下であり、優れた隠蔽性が確認された。
<Measurement of transmittance of cured product>
Create a test piece with a smooth surface so that the thickness of each photocurable resin composition of Examples 1 to 5 is 150 μm,
The cured product was obtained by irradiation with ultraviolet rays under the condition of 60 kJ / m 2 . The transmittance of this cured product was measured with a spectrophotometer UV-2450 (manufactured by Shimadzu Corporation). All the evaluation results of the cured products of the respective photocurable resin compositions of Examples 1 to 5 had a transmittance of 550 nm at a wavelength of 3% or less, and excellent concealability was confirmed.
本発明の光硬化性樹脂組成物は、紫外線等の活性エネルギー線の照射により速やかに隠蔽性の高い硬化物が得られ、かつ電極上に塗布しても通電時の隣接電極間の短絡が生じないことから、各種接着用途特に、電気配線上若しくは近傍に用いられる。具体的には、被覆剤、注型用樹脂、シール剤、シーリング剤、ポッティング剤、接着剤、ライニング剤、接着剤、インキ等として極めて有効であり、広い分野に適用可能であることから産業上有用である。 With the photocurable resin composition of the present invention, a cured product with high concealability can be obtained quickly by irradiation with active energy rays such as ultraviolet rays, and even when applied on an electrode, a short circuit occurs between adjacent electrodes during energization. Therefore, it is used in various adhesive applications, particularly on or near electrical wiring. Specifically, it is extremely effective as a coating agent, casting resin, sealing agent, sealing agent, potting agent, adhesive agent, lining agent, adhesive agent, ink, etc., and can be applied to a wide range of industries. Useful.
以下に発明の詳細を説明する。
＜（Ａ）成分＞
本発明の（Ａ）成分であるロイコ染料とは、酸との接触により発色する化合物である。また、光硬化性樹脂組成物の硬化物に隠蔽性を与える成分である。（Ａ）成分としては、特に限定されないが、例えば、３−ジブチルアミノ−６−メチルー７−アニリノフルオラン、３−ジプロピルアミノ−６−メチル−７−アニリノフルオラン、３−ジエチルアミノ−６−メチル−７−アニリノフルオラン、３−ジメチルアミノ−６−メチル−７−アニリノフルオラン、３−ジエチルアミノ−６−メチル−７−キシリジノフルオラン、３−（４−ジエチルアミノ−２−エトキシフェニル）−３−（１−エチル−２−メチルインドール−３−イル）−４−アザフタリドなどを例として挙げることができる。中でも、硬化物の隠蔽性および深部硬化性の観点から３−ブチル−６−メチル−７−アニリノフルオラン、３−ジエチルアミノ−６−メチル−７−アニリノフルオランが好ましい。
Details of the invention will be described below.
<(A) component>
The leuco dye which is the component (A) of the present invention is a compound that develops color upon contact with an acid. Moreover, it is a component which provides concealability to the hardened | cured material of a photocurable resin composition. As the component (A) is not particularly limited, for example, 3-di-butylamino-6-methyl-7-anilinofluoran, 3-dipropylamino-6-methyl-7-anilinofluoran, 3-diethylamino -6-methyl-7-anilinofluorane, 3-dimethylamino-6-methyl-7-anilinofluorane, 3-diethylamino-6-methyl-7-xylidinofluorane, 3- (4-diethylamino- Examples include 2-ethoxyphenyl) -3- (1-ethyl-2-methylindol-3-yl) -4-azaphthalide and the like. Among these, 3-butyl-6-methyl-7-anilinofluorane and 3-diethylamino-6-methyl-7-anilinofluorane are preferable from the viewpoints of concealability of the cured product and deep curability.
＜（Ａ）成分＞
ａ１：３−ジブチル−６−メチル−７−アニリノフルオラン（ＯＤＢ−２、山本化成株式会社製）
＜（Ａ）成分の比較成分＞
ａ’１：カーボンブラック
＜（Ｂ）成分＞
ｂ１：化学式（１）で表される光酸発生剤（有機スルホン酸を発生する非イオン性光酸発生剤、ＳＰ−１０３、株式会社ＡＤＥＫＡ製）
ｂ４：ナフトキノンジアジド化合物（有機カルボン酸を発生する非イオン性光酸発生剤、Ｔ５８３、株式会社三宝化学研究所製）
＜（Ｂ）成分の比較成分＞
ｂ‘１：トリアリ−ルスルホニウム−ヘキサフルオロホスフェート（イオン性酸発生剤、ＣＰＩ−１００Ｐ、サンアプロ株式会社製）
ｂ‘２：トリアリールスルホニウム−フッ素化アルキルフルオロリン酸（イオン性酸発生剤、ＣＰＩ−２００Ｋ、サンアプロ株式会社製）
ｂ‘３：４−メチルフェニル−４−（１−メチルエチル）フェニルヨードニウム−テトラキス（ペンタフルオロフェニル）ボレート（イオン性酸発生剤、Ｐｈｏｔｏ ｉｎｉｔｉａｔｏｒ２０７４ローディア社製）
ｂ‘４：ジアリールスルホニウムヘキサフルオロアンチモネート（イオン性酸発生剤、ＰＣ−２５０６、ポリセット社製）
ｂ‘５：トリアリールスルホニウムヘキサフルオロアンチモネート（イオン性酸発生剤、ＨＳ−１Ａ、サンアプロ株式会社製）
＜（Ｃ）成分＞
ｃ１：ウレタン（メタ）アクリレート（ＵＶ−３０００Ｂ、日本合成化学工業株式会社製）
ｃ２：アクリロイルモルホリン（ＡＣＭＯ、ＫＪケミカルズ株式会社製）
ｃ３：イソボルニルアクリレート（ライトアクリレートＩＢＸ−Ａ、共栄社化学株式会社製）
ｃ４：テトラヒドロフルフリルアクリレート（ライトアクリレートＴＨＦ−Ａ、共栄社化学株式会社製）
＜（Ｄ）成分＞
ｄ１：２−ヒドロキシ−２−メチル−１−フェニル−プロパン−１−オン（ＩＲＧＡＣＵＲＥ１１７３、ＢＡＳＦ社製）
ｄ２：２−ヒドロキシ−１−｛４−［４−（２−ヒドロキシ−２−メチル−プロピオニル）−ベンジル］−フェニル｝−２−メチル−プロパン−１−オン（ＩＲＧＡＣＵＲＥ１２７、ＢＡＳＦ社製）
<(A) component>
a1: 3- dibutyl-6-methyl-7-anilinofluoran (ODB-2, Yamamoto Chemicals Inc.)
<Comparison component of component (A)>
a'1: Carbon black <(B) component>
b1: Photoacid generator represented by the chemical formula (1) (nonionic photoacid generator that generates organic sulfonic acid, SP-103, manufactured by ADEKA Corporation)
b4: Naphthoquinonediazide compound (nonionic photoacid generator for generating organic carboxylic acid, T583, manufactured by Sanpo Chemical Laboratory Co., Ltd.)
<Comparison component of component (B)>
b′1: Triarylsulfonium-hexafluorophosphate (ionic acid generator, CPI-100P, manufactured by San Apro Co., Ltd.)
b′2: Triarylsulfonium-fluorinated alkyl fluorophosphoric acid (ionic acid generator, CPI-200K, manufactured by San Apro Co., Ltd.)
b'3: 4-methylphenyl-4- (1-methylethyl) phenyliodonium-tetrakis (pentafluorophenyl) borate (ionic acid generator, Photo initiator 2074, Rhodia)
b′4: Diarylsulfonium hexafluoroantimonate (ionic acid generator, PC-2506, manufactured by Polyset)
b′5: Triarylsulfonium hexafluoroantimonate (ionic acid generator, HS-1A, manufactured by San Apro Co., Ltd.)
<(C) component>
c1: Urethane (meth) acrylate (UV-3000B, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.)
c2: Acryloylmorpholine (ACMO, manufactured by KJ Chemicals)
c3: Isobornyl acrylate (Light acrylate IBX-A, manufactured by Kyoeisha Chemical Co., Ltd.)
c4: Tetrahydrofurfuryl acrylate (light acrylate THF-A, manufactured by Kyoeisha Chemical Co., Ltd.)
<(D) component>
d1: 2-hydroxy-2-methyl-1-phenyl-propan-1-one (IRGACURE 1173, manufactured by BASF)
d2: 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methyl-propan-1-one (IRGACURE127, manufactured by BASF)
Claims (7)
（Ａ）成分：ロイコ染料
（Ｂ）成分：非イオン性光酸発生剤
（Ｃ）成分：ラジカル重合性化合物
（Ｄ）成分：光ラジカル開始剤 The photocurable resin composition containing the following (A)-(D) component.
(A) component: leuco dye (B) component: nonionic photoacid generator (C) component: radical polymerizable compound (D) component: photoradical initiator
硬化物の透過率測定：光硬化性樹脂組成物を厚みが１５０μｍになるように表面が平滑な試験片を作成し、６０ｋＪ／ｍ２の条件で紫外線照射し、硬化物を得る。この硬化物の透過率（波長５５０ｎｍ）を分光光度計にて測定する。 The photocurable resin composition according to claim 1, wherein the cured product has a transmittance (wavelength 550 nm) of 3% or less by the following measurement.
Measurement of transmittance of cured product: A test piece having a smooth surface was prepared so that the thickness of the photocurable resin composition was 150 μm, and ultraviolet irradiation was performed under the condition of 60 kJ / m 2 to obtain a cured product. The transmittance (wavelength 550 nm) of the cured product is measured with a spectrophotometer.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019035411A1 (en) * | 2017-08-18 | 2019-02-21 | 積水化学工業株式会社 | Moisture curable resin composition, adhesive for electronic components, and adhesive for display elements |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08240908A (en) * | 1994-12-29 | 1996-09-17 | Tokyo Ohka Kogyo Co Ltd | Photosensitive resin composition, photosensitive planographic printing plate using the same and production of printing plate material for planographic printing |
| JP2001075271A (en) * | 1999-09-06 | 2001-03-23 | Mitsubishi Paper Mills Ltd | Photo-color forming recording material |
| WO2011105011A1 (en) * | 2010-02-26 | 2011-09-01 | 太陽ホールディングス株式会社 | Image formation method and photosensitive composition used in said method |
| JP2013228710A (en) * | 2012-03-26 | 2013-11-07 | Sekisui Chem Co Ltd | Sealing agent for liquid crystal dropping method, vertical conduction material, and liquid crystal display element |
-
2015
- 2015-02-13 JP JP2015026475A patent/JP6504346B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08240908A (en) * | 1994-12-29 | 1996-09-17 | Tokyo Ohka Kogyo Co Ltd | Photosensitive resin composition, photosensitive planographic printing plate using the same and production of printing plate material for planographic printing |
| JP2001075271A (en) * | 1999-09-06 | 2001-03-23 | Mitsubishi Paper Mills Ltd | Photo-color forming recording material |
| WO2011105011A1 (en) * | 2010-02-26 | 2011-09-01 | 太陽ホールディングス株式会社 | Image formation method and photosensitive composition used in said method |
| JP2013228710A (en) * | 2012-03-26 | 2013-11-07 | Sekisui Chem Co Ltd | Sealing agent for liquid crystal dropping method, vertical conduction material, and liquid crystal display element |
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|---|---|---|---|---|
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| CN110832034A (en) * | 2017-08-18 | 2020-02-21 | 积水化学工业株式会社 | Moisture-curable resin composition, adhesive for electronic component, and adhesive for display element |
| KR20200042876A (en) * | 2017-08-18 | 2020-04-24 | 세키스이가가쿠 고교가부시키가이샤 | Moisture-curable resin composition, adhesive for electronic components, and adhesive for display elements |
| JPWO2019035411A1 (en) * | 2017-08-18 | 2020-07-27 | 積水化学工業株式会社 | Moisture-curable resin composition, adhesive for electronic parts, and adhesive for display element |
| KR102598369B1 (en) | 2017-08-18 | 2023-11-03 | 세키스이가가쿠 고교가부시키가이샤 | Moisture-curable resin composition, adhesive for electronic components, and adhesive for display elements |
| JP7088838B2 (en) | 2017-08-18 | 2022-06-21 | 積水化学工業株式会社 | Moisture-curable resin compositions, adhesives for electronic components, and adhesives for display elements |
| KR102386563B1 (en) | 2019-03-15 | 2022-04-14 | 닛토덴코 가부시키가이샤 | Adhesive sheet, manufacturing method of adhesive sheet, manufacturing method of intermediate laminated body, and intermediate laminated body |
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