JP2016140937A - Polishing pad - Google Patents
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- JP2016140937A JP2016140937A JP2015017693A JP2015017693A JP2016140937A JP 2016140937 A JP2016140937 A JP 2016140937A JP 2015017693 A JP2015017693 A JP 2015017693A JP 2015017693 A JP2015017693 A JP 2015017693A JP 2016140937 A JP2016140937 A JP 2016140937A
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- polishing
- polishing pad
- abrasive grains
- curable resin
- base material
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- 239000011347 resin Substances 0.000 claims abstract description 94
- 239000000463 material Substances 0.000 claims abstract description 90
- 239000006061 abrasive grain Substances 0.000 claims abstract description 87
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
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- 239000004925 Acrylic resin Substances 0.000 description 1
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- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
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- 229940035429 isobutyl alcohol Drugs 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
本発明は、例えば、研磨対象物の表面に設けられた金属膜を除去するための研磨パッドに関する。 The present invention relates to a polishing pad for removing a metal film provided on the surface of an object to be polished, for example.
半導体材料や金属材料、難削材のラッピング（粗研磨）や研磨に利用される研磨パッドには、不織布等の基材に研磨砥粒を定着させた構造を有するものが知られている。研磨砥粒は、典型的には、基材に含浸された硬化性樹脂等によって基材に固着される。 As a polishing pad used for lapping (rough polishing) or polishing of a semiconductor material, a metal material, or a difficult-to-cut material, one having a structure in which abrasive grains are fixed on a substrate such as a nonwoven fabric is known. The abrasive grains are typically fixed to the base material by a curable resin or the like impregnated in the base material.
例えば特許文献１には、不織布に研磨砥粒を分散させたバインダーを含浸させた研磨シートが開示されている。また、特許文献２には、砥粒を静電スプレー法によってフィルム基材上に接着させた、表面に凹凸を有する研磨テープが開示されている。 For example, Patent Document 1 discloses an abrasive sheet in which a nonwoven fabric is impregnated with a binder in which abrasive grains are dispersed. Further, Patent Document 2 discloses a polishing tape having surface irregularities in which abrasive grains are adhered on a film substrate by an electrostatic spray method.
近年、研磨効率に優れ、ライフサイクルの長い研磨パッドが要求されている。例えば、研磨パッドが研磨対象物の表面に設けられた金属膜の除去等に用いられる場合、金属膜の研磨屑等によって研磨面が目詰まりを起こし易く、このためライフサイクルが短いという問題がある。
例えば特許文献１に記載の構成では、研磨砥粒の多くが不織布内部に沈み込んでしまうため、研磨効率が小さいという問題がある。また、特許文献２に記載の構成では、基材の表面に形成された凹凸によって、ある程度の目詰まりの防止を図るようにしているが、基材表面を凹凸加工する必要があるため、生産性に問題がある。
In recent years, polishing pads having excellent polishing efficiency and a long life cycle have been demanded. For example, when the polishing pad is used for removing a metal film provided on the surface of an object to be polished, the polishing surface is likely to be clogged by polishing scraps of the metal film, and there is a problem that the life cycle is short. .
For example, the configuration described in Patent Document 1 has a problem that the polishing efficiency is small because most of the abrasive grains sink into the nonwoven fabric. In addition, in the configuration described in Patent Document 2, the unevenness formed on the surface of the base material is intended to prevent clogging to a certain extent. There is a problem.
以上のような事情に鑑み、本発明の目的は、ライフサイクルが長く、研磨効率に優れた研磨パッドを提供することにある。 In view of the circumstances as described above, an object of the present invention is to provide a polishing pad having a long life cycle and excellent polishing efficiency.
上記目的を達成するため、本発明の一形態に係る研磨パッドは、研磨対象物の表面に設けられた金属膜を除去するための研磨パッドであって、基材と、研磨層とを具備する。
上記基材は、上記研磨対象物に対向する第１の面を有し、空隙を有する材料で構成される。
上記研磨層は、上記第１の面に選択的に設けられた硬化性樹脂膜と、上記硬化性樹脂膜に固定され上記金属膜に接触する研磨砥粒とを有する。
In order to achieve the above object, a polishing pad according to one embodiment of the present invention is a polishing pad for removing a metal film provided on the surface of an object to be polished, and includes a substrate and a polishing layer. .
The substrate has a first surface facing the object to be polished, and is made of a material having a gap.
The polishing layer includes a curable resin film selectively provided on the first surface, and polishing abrasive grains fixed to the curable resin film and in contact with the metal film.
上記研磨パッドにおいては、研磨砥粒を含む研磨層が基材の表面に選択的に設けられているため、基材表面に多数の研磨砥粒が分布し、高い研磨特性を有する研磨パッドを構成することができる。また、基材が空隙を有する材料で構成されているため、基材内部の空隙が研磨屑を受容する機能を果たす。これにより、粘りがあって目詰まりが生じやすい金属であっても良好な研磨効率を確保しつつ、ライフサイクルの向上を実現することが可能となる。 In the above polishing pad, a polishing layer containing polishing abrasive grains is selectively provided on the surface of the base material, so that a large number of polishing abrasive grains are distributed on the surface of the base material and constitute a polishing pad having high polishing characteristics. can do. Moreover, since the base material is made of a material having voids, the voids inside the base material serve to receive polishing scraps. As a result, even if the metal is sticky and easily clogged, the life cycle can be improved while ensuring good polishing efficiency.
上記研磨層は、例えば、硬化性樹脂と研磨砥粒とを含む砥粒含有溶液が上記第１の面に塗布され、上記硬化性樹脂が硬化して形成される。この構成によれば、硬化性樹脂は、空隙を有する材料からなる基材に染み込み、研磨砥粒は基材表面に残留するため、基材表面に多数の砥粒が分布し、高い研磨特性を有する研磨パッドとすることができる。 The polishing layer is formed, for example, by applying an abrasive-containing solution containing a curable resin and abrasive grains to the first surface and curing the curable resin. According to this configuration, since the curable resin soaks into the base material made of a material having voids and the abrasive grains remain on the base material surface, a large number of abrasive grains are distributed on the base material surface, and high polishing characteristics are obtained. It can be set as the polishing pad which has.
上記基材の空隙は、硬化前の上記硬化性樹脂が通過可能であり、上記研磨砥粒が通過不能な大きさに設けられてもよい。これにより、基材表面に多数の研磨砥粒を効率よく分布させることができる。 The space of the base material may be provided in such a size that the curable resin before curing can pass therethrough and the abrasive grains cannot pass therethrough. Thereby, many abrasive grains can be efficiently distributed on the substrate surface.
上記研磨パッドは、硬化性樹脂材料で構成されたシート材をさらに具備してもよい。この場合、上記基材は、上記シート材に接合された、上記第１の面とは反対側の第２の面をさらに有する。これにより、研磨パッドに適度な弾性が付与されるため、研磨対象物の種類等に応じて研磨条件の最適化を図ることができる。 The polishing pad may further include a sheet material made of a curable resin material. In this case, the base material further includes a second surface opposite to the first surface, which is bonded to the sheet material. As a result, moderate elasticity is imparted to the polishing pad, so that the polishing conditions can be optimized according to the type of the object to be polished.
上記基材や研磨砥粒の構成材料は特に限定されず、研磨対象物等に応じて適宜選択可能である。研磨対象物表面の金属膜を除去する場合、典型的には、上記基材には不織布が用いられ、研磨砥粒にはダイヤモンド砥粒が用いられる。 The constituent materials of the base material and the abrasive grains are not particularly limited, and can be appropriately selected depending on the object to be polished. When removing the metal film on the surface of the object to be polished, typically, a nonwoven fabric is used for the substrate, and diamond abrasive grains are used for the abrasive grains.
研磨対象物表面の金属膜は特に限定されず、例えば、金属モリブデン等の高融点金属膜であってもよい。このような金属膜であっても効率よく研磨を行うことができる。また、モリブデン膜を表面に有する構造体等であってもよく、例えば太陽電池パネルの製造工程に上記研磨パッドを好適に用いることができる。 The metal film on the surface of the object to be polished is not particularly limited, and may be, for example, a refractory metal film such as metal molybdenum. Even such a metal film can be polished efficiently. Moreover, the structure etc. which have a molybdenum film | membrane on the surface may be sufficient, for example, the said polishing pad can be used suitably for the manufacturing process of a solar cell panel.
研磨砥粒の平均粒径や、硬化性樹脂膜に対する研磨砥粒の含有割合等も特に限定されず、研磨対象物等に応じて適宜選択可能である。研磨砥粒の平均粒径を１０μｍ以上４０μｍ以下、上記含有割合を１０ｗｔ％以上４０ｗｔ％以下とすることで、例えば研磨対象物表面のモリブデン膜を効率よく除去することができる。 The average particle diameter of the abrasive grains, the content ratio of the abrasive grains with respect to the curable resin film, and the like are not particularly limited, and can be appropriately selected according to the object to be polished. By setting the average grain size of the abrasive grains to 10 μm or more and 40 μm or less and the content ratio being 10 wt% or more and 40 wt% or less, for example, the molybdenum film on the surface of the polishing object can be efficiently removed.
本発明によれば、良好な研磨効率およびライフサイクルを有する研磨パッドを提供することができる。 According to the present invention, a polishing pad having good polishing efficiency and life cycle can be provided.
以下、図面を参照しながら、本発明の実施形態を説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
＜第１の実施形態＞
［研磨パッドの構成］
図１は、本発明の一実施形態に係る研磨パッド１０を示す概略斜視図である。図２は研磨パッド１０の断面図である。図３は、基材１１の断面図である。
<First Embodiment>
[Configuration of polishing pad]
FIG. 1 is a schematic perspective view showing a polishing pad 10 according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the polishing pad 10. FIG. 3 is a cross-sectional view of the substrate 11.
研磨パッド１０は、基材１１と、研磨層１２とを備える。 The polishing pad 10 includes a base material 11 and a polishing layer 12.
基材１１は、シート状の空隙を有する材料で構成される。図３に示すように基材１１は、表面１１ａ（第１の面）と裏面１１ｂ（第２の面）とを有し、合成樹脂１１１が含浸された不織布１１２で構成される。 The base material 11 is comprised with the material which has a sheet-like space | gap. As shown in FIG. 3, the base material 11 has a front surface 11 a (first surface) and a back surface 11 b (second surface), and is composed of a nonwoven fabric 112 impregnated with a synthetic resin 111.
不織布１１２の製造方法としては、例えば、スパンボンド法、サーマルボンド法、ケミカルボンド法、ニードルパンチ法、スパンレース法などが挙げられる。本実施形態では、不織布１１２がクッション層としても機能するため、厚みのある不織布が好ましく、ニードルパンチ法を用いた。不織布１１２の目付けとしては１００〜５０００ｇ／ｍ２、密度としては０．０５〜０．６０ｇ／ｃｍ３が好ましく、０．１０〜０．５０ｇ／ｃｍ３がより好ましい。また、不織布に用いる繊維の繊度としては０．０１〜１０ｄｔｅｘを用いることができる。密度が同じ場合、繊維の繊度を変えることで単位体積当たりの繊維本数が変わることで、空隙単位を調整できる。不織布１１２の空隙は目付、密度および繊維の繊度により調節することができ、空隙率は４５〜９５％程度が好ましい。 Examples of the method for producing the nonwoven fabric 112 include a spun bond method, a thermal bond method, a chemical bond method, a needle punch method, and a spun lace method. In this embodiment, since the nonwoven fabric 112 functions also as a cushion layer, a thick nonwoven fabric is preferable and the needle punch method was used. 100~5000g / m 2 as the basis weight of the nonwoven fabric 112, preferably 0.05~0.60g / cm 3 as the density, and more preferably 0.10~0.50g / cm 3. Moreover, 0.01-10 dtex can be used as the fineness of the fiber used for a nonwoven fabric. When the density is the same, the void unit can be adjusted by changing the number of fibers per unit volume by changing the fineness of the fibers. The voids of the nonwoven fabric 112 can be adjusted by the basis weight, density, and fiber fineness, and the porosity is preferably about 45 to 95%.
なお、本発明において空隙とは、基材内部の連続した空間のことであり、基材表面に塗布された硬化性樹脂を基材内部に浸透可能とし、基材表面に塗布された砥粒の大部分を基材表面にとどめることを可能とする。このような空隙であればその大きさは問わないが、例えば、空隙の一断面における内接円の大きさで表わされ、１〜１００μｍであることが好ましい。空隙が１μｍより小さいと硬化性樹脂が不織布１１２に浸透することが難しく、空隙が１００μｍより大きいと空隙の内部を砥粒が通過してしまう恐れがある。 In the present invention, the void is a continuous space inside the base material, which allows the curable resin applied to the surface of the base material to penetrate into the base material, and the abrasive grains applied to the base material surface. It makes it possible to keep the majority on the substrate surface. If it is such a space | gap, the magnitude | size will not be ask | required, For example, it represents with the magnitude | size of the inscribed circle in one cross section of a space | gap, and it is preferable that it is 1-100 micrometers. If the gap is smaller than 1 μm, it is difficult for the curable resin to penetrate into the nonwoven fabric 112, and if the gap is larger than 100 μm, the abrasive grains may pass through the gap.
合成樹脂１１１は、不織布１１２を構成する繊維同士を結合するためのものであり、当該繊維間に部分的に含浸される。 The synthetic resin 111 is for bonding fibers constituting the nonwoven fabric 112 and is partially impregnated between the fibers.
不織布１１２に合成樹脂１１１を含浸させることにより、合成樹脂１１１が不織布１１２を保持し、研磨パッド１０に研磨に適した弾性を付与すると同時に基材１１の空隙率・空隙サイズをコントロールすることが可能となる。合成樹脂１１１は例えばポリウレタン樹脂であり、不織布１１２は、例えばポリエステル繊維からなる不織布であるものとすることができる。 By impregnating the non-woven fabric 112 with the synthetic resin 111, the synthetic resin 111 holds the non-woven fabric 112 and gives the polishing pad 10 elasticity suitable for polishing, and at the same time, the porosity and the void size of the base material 11 can be controlled. It becomes. The synthetic resin 111 may be a polyurethane resin, for example, and the nonwoven fabric 112 may be a nonwoven fabric made of polyester fibers, for example.
また、基材１１は、上記のものに限られず、適度な空隙を有する材料であればよい。例えば、連続発泡を有する発泡ポリウレタンフォーム等の発泡性材料等からなるものや合成樹脂が含浸されていない不織布、織布又は編地であってもよい。基材１１の厚みは特に限定されず、数ｍｍ〜数十ｍｍ程度とすることができる。 Moreover, the base material 11 is not restricted to said thing, What is necessary is just a material which has a moderate space | gap. For example, it may be a non-woven fabric, a woven fabric or a knitted fabric which is made of a foamable material such as a foamed polyurethane foam having continuous foaming, or is not impregnated with a synthetic resin. The thickness of the substrate 11 is not particularly limited, and can be about several mm to several tens mm.
基材１１の表面１１ａは、研磨層１２が形成される面であり、基材１１の裏面１１ｂは、必要に応じて図示しない粘着テープあるいは接着剤層等を設けてもよい。 The surface 11a of the base material 11 is a surface on which the polishing layer 12 is formed, and the back surface 11b of the base material 11 may be provided with an adhesive tape or an adhesive layer (not shown) as necessary.
研磨層１２は、基材１１の表面１１ａに選択的に設けられた硬化性樹脂膜１２１と、硬化性樹脂膜１２１に固定された研磨砥粒１２２とを有する。研磨層１２は後述するように、硬化性樹脂膜１２１を構成する硬化性樹脂材料と、研磨砥粒１２２とを含む砥粒含有溶液（研磨砥粒含有樹脂溶液）が基材１１の表面１１ａに塗布され、上記硬化性樹脂材料が硬化して形成されたものである。 The polishing layer 12 includes a curable resin film 121 that is selectively provided on the surface 11 a of the substrate 11, and polishing abrasive grains 122 that are fixed to the curable resin film 121. As will be described later, the polishing layer 12 has an abrasive-containing solution (abrasive abrasive-containing resin solution) containing a curable resin material constituting the curable resin film 121 and abrasive grains 122 on the surface 11a of the substrate 11. It is applied and formed by curing the curable resin material.
硬化性樹脂膜１２１は、研磨砥粒１２２を基材１１に対して固定する。硬化性樹脂膜１２１を構成する硬化性樹脂材料は、硬化させることが可能なものであれば特に限定されず、熱硬化性樹脂、光硬化性樹脂、２液混合型の硬化性樹脂等とすることができる。例えば、上記硬化性樹脂材料は合成樹脂及び天然樹脂のいずれであってもよく、合成樹脂としては、フェノール系樹脂、エポキシ系樹脂、ウレタン系樹脂、アクリル系樹脂、ＰＶＡ（ポリビニルアルコール）などが挙げられ、天然樹脂としてはニカワなどが挙げられる。上記硬化性樹脂材料は、これら列挙した樹脂単体を用いてもよいし、これらを混合したものを用いてもよい。 The curable resin film 121 fixes the abrasive grains 122 to the base material 11. The curable resin material constituting the curable resin film 121 is not particularly limited as long as it can be cured, and may be a thermosetting resin, a photocurable resin, a two-component mixed curable resin, or the like. be able to. For example, the curable resin material may be either a synthetic resin or a natural resin, and examples of the synthetic resin include phenol resins, epoxy resins, urethane resins, acrylic resins, and PVA (polyvinyl alcohol). In addition, examples of natural resins include glue. As the curable resin material, these listed resin simple substances may be used, or a mixture thereof may be used.
上記硬化性樹脂材料は、上記砥粒含有溶液として表面１１ａに塗布された際に、基材１１に染み込み、一部が基材１１中に含有されている。上記硬化性樹脂材料が染み込む深さは特に限定されず、裏面１１ｂまで染み込んでもよい。 When the curable resin material is applied to the surface 11 a as the abrasive grain-containing solution, the curable resin material soaks into the base material 11, and a part thereof is contained in the base material 11. The depth at which the curable resin material penetrates is not particularly limited, and may penetrate to the back surface 11b.
研磨砥粒１２２は、硬化性樹脂膜１２１によって基材１１上に固定されている。研磨砥粒１２２は、硬度が高い粒子であり、例えばダイヤモンドからなる砥粒（ダイヤモンド砥粒）とすることができる。また、研磨砥粒１２２は、この他にも、炭化ケイ素（ＳｉＣ）、アルミナ（Ａｌ２Ｏ３）、ジルコニア（ＺｒＯ２）、珪酸ジルコニウム（ＺｒＳｉＯ４）又は酸化セリウム（ＣｅＯ２）等からなる砥粒であってもよい。砥粒の粒径は特に限定されないが、例えば、不織布１１２の空隙を通過しない大きさが好ましい。 The abrasive grains 122 are fixed on the substrate 11 by a curable resin film 121. The abrasive grains 122 are particles with high hardness, and can be, for example, abrasive grains (diamond abrasive grains) made of diamond. In addition, the abrasive grains 122 are abrasives made of silicon carbide (SiC), alumina (Al 2 O 3 ), zirconia (ZrO 2 ), zirconium silicate (ZrSiO 4 ), cerium oxide (CeO 2 ), or the like. It may be a grain. Although the particle size of an abrasive grain is not specifically limited, For example, the magnitude | size which does not pass the space | gap of the nonwoven fabric 112 is preferable.
研磨砥粒の平均粒径や、硬化性樹脂膜に対する研磨砥粒の含有割合等も特に限定されず、研磨対象物等に応じて適宜選択可能である。研磨砥粒の平均粒径を１０μｍ以上４０μｍ以下、上記含有割合を１０ｗｔ％以上４０ｗｔ％以下とすることで、例えば研磨対象物表面の金属膜（例えばモリブデン膜）を効率よく除去することができる。 The average particle diameter of the abrasive grains, the content ratio of the abrasive grains with respect to the curable resin film, and the like are not particularly limited, and can be appropriately selected according to the object to be polished. By setting the average grain size of the abrasive grains to 10 μm or more and 40 μm or less and the content ratio being 10 wt% or more and 40 wt% or less, for example, a metal film (for example, a molybdenum film) on the surface of the polishing object can be efficiently removed.
研磨パッド１０は以上のような構成を有する。図１に示すように、研磨パッド１０は円板状であり、その大きさ（径）は研磨装置のサイズ等に応じて決定され、例えば直径数ｃｍ〜１ｍ程度とすることができる。また、研磨パッド１０の形状は円板状に限られず、矩形状や多角形状、ローラに装着可能な帯状等とすることも可能である。 The polishing pad 10 has the above configuration. As shown in FIG. 1, the polishing pad 10 has a disk shape, and its size (diameter) is determined according to the size of the polishing apparatus, and can be, for example, about several cm to 1 m in diameter. Further, the shape of the polishing pad 10 is not limited to a disk shape, but may be a rectangular shape, a polygonal shape, a belt-like shape that can be attached to a roller, or the like.
［研磨パッドの製造方法］
次に、研磨パッド１０の製造方法について説明する。
[Production method of polishing pad]
Next, a method for manufacturing the polishing pad 10 will be described.
図４に示すように、研磨砥粒を含有する砥粒含有溶液Ｓを準備する。砥粒含有溶液Ｓは、樹脂混合溶液Ｒ及び研磨砥粒１２２を含む。樹脂混合溶液Ｒは、硬化性樹脂膜１２１を構成する各種硬化性樹脂及び溶媒を含む。 As shown in FIG. 4, an abrasive-containing solution S containing abrasive grains is prepared. The abrasive grain-containing solution S includes a resin mixed solution R and abrasive grains 122. The resin mixed solution R contains various curable resins and solvents that constitute the curable resin film 121.
溶媒は砥粒含有溶液Ｓの粘度を調整するために用いられ、例えば水、イソプロピルアルコール、イソブチルアルコール、１-ブタノール、２-ブタノール、イソペンチルアルコール、酢酸メチル、酢酸エチル、酢酸ブチル、酢酸イソブチル、酢酸ｔｅｒｔ-ブチル、酢酸ｓｅｃ-ブチル、酢酸イソペンチル、酢酸２-メトキシエチル、酢酸２-エトキシエチル、メチルエチルケトン、メチルイソブチルケトン、１,３-ジオキソラン、１,４-ジオキサン、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールジメチルエーテル、エチレングリコールモノブチルエーテル、プロピレングリコールモノメチルエーテル、ジエチレングリコールモノメチルエーテルなどが用いられる。 The solvent is used to adjust the viscosity of the abrasive-containing solution S. For example, water, isopropyl alcohol, isobutyl alcohol, 1-butanol, 2-butanol, isopentyl alcohol, methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, Tert-butyl acetate, sec-butyl acetate, isopentyl acetate, 2-methoxyethyl acetate, 2-ethoxyethyl acetate, methyl ethyl ketone, methyl isobutyl ketone, 1,3-dioxolane, 1,4-dioxane, ethylene glycol monomethyl ether, ethylene glycol Monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether and the like are used.
樹脂混合溶液Ｒが不織布１１２に染み込む時間が、溶媒が揮発し硬化が始まるまでの時間に比べて短くなるように、砥粒含有溶液の粘度を調整する。具体的には、粘度０．１Ｐａ・s 〜１００Ｐａ・s程度とするのが好ましい。また、必要に応じて、砥粒含有溶液中の砥粒の分散性を高めるために、界面活性剤等の分散剤を加えても良い。 The viscosity of the abrasive-containing solution is adjusted so that the time for the resin mixed solution R to soak into the nonwoven fabric 112 is shorter than the time until the solvent evaporates and the curing starts. Specifically, the viscosity is preferably about 0.1 Pa · s to 100 Pa · s. Moreover, you may add dispersing agents, such as surfactant, in order to improve the dispersibility of the abrasive grain in an abrasive grain containing solution as needed.
続いて、図５に示すように、砥粒含有溶液Ｓを基材１１の表面１１ａに塗布する。塗布方法は特に限定されず、ドクターブレード法、ロールコート法、スピンコート法、グラビアコート法、スクリーン印刷法、ロータリー印刷法等の種々の塗布方法が適用可能である。塗布後、図６に示すように、樹脂混合溶液Ｒの一部は基材１１に染み込み、研磨砥粒１２２は表面１１ａ上に残留する。 Subsequently, as shown in FIG. 5, the abrasive-containing solution S is applied to the surface 11 a of the substrate 11. The coating method is not particularly limited, and various coating methods such as a doctor blade method, a roll coating method, a spin coating method, a gravure coating method, a screen printing method, and a rotary printing method are applicable. After application, as shown in FIG. 6, a part of the resin mixed solution R soaks into the base material 11, and the abrasive grains 122 remain on the surface 11a.
続いて、加熱や減圧等により、砥粒含有溶液Ｓ中に含まれる溶媒等の揮発成分を除去し、砥粒含有溶液Ｓを乾燥させる。乾燥後、砥粒含有溶液Ｓに含まれる硬化性樹脂を硬化させることで硬化性樹脂膜１２１を形成する。例えば、硬化性樹脂膜１２１が熱硬化性樹脂の場合、砥粒含有溶液Ｓを加熱することにより硬化させることができる。また、硬化性樹脂膜１２１が光硬化性樹脂の場合、砥粒含有溶液Ｓに光（例えば紫外線）を照射することにより硬化させることができる。硬化性樹脂膜１２１の硬化により、基材１１上に研磨層１２が形成される（図２参照）。 Subsequently, volatile components such as a solvent contained in the abrasive grain-containing solution S are removed by heating or decompression, and the abrasive grain-containing solution S is dried. After drying, the curable resin film 121 is formed by curing the curable resin contained in the abrasive grain-containing solution S. For example, when the curable resin film 121 is a thermosetting resin, the abrasive grain-containing solution S can be cured by heating. Further, when the curable resin film 121 is a photocurable resin, it can be cured by irradiating the abrasive-containing solution S with light (for example, ultraviolet rays). By the curing of the curable resin film 121, the polishing layer 12 is formed on the substrate 11 (see FIG. 2).
以上のようにして作製される研磨パッド１０においては、研磨砥粒１２２が基材１１の表面１１ａ（研磨面）に偏在し、表面１１ａに多くの研磨砥粒１２２が露出する。したがって、多くの研磨砥粒１２２を研磨対象物に接触させることが可能となるため、研磨対象物の研磨効率を高めることが可能となる。 In the polishing pad 10 produced as described above, the polishing abrasive grains 122 are unevenly distributed on the surface 11a (polishing surface) of the substrate 11, and a large number of polishing abrasive grains 122 are exposed on the surface 11a. Therefore, many polishing abrasive grains 122 can be brought into contact with the object to be polished, so that the polishing efficiency of the object to be polished can be increased.
一般に、研磨砥粒の多くが基材の内部に存在すると、ごく僅かな研磨砥粒しか研磨面に露出せず、したがって研磨効率の向上は望めない。また、この種の研磨パッドは、研磨により磨耗しても新たな表面を研磨に利用できるタイプのものではなく、当初の研磨面が磨耗すると交換される。このため、基材の内部に存在する研磨砥粒は無駄となり、しかも、ダイヤモンド砥粒は高価であることから、研磨効率の高い研磨パッドを低廉に作製することは困難であった。 In general, when most of the abrasive grains are present in the substrate, only a few abrasive grains are exposed on the polishing surface, and therefore improvement in polishing efficiency cannot be expected. Further, this type of polishing pad is not of a type in which a new surface can be used for polishing even if it is worn by polishing, and is replaced when the initial polishing surface is worn. For this reason, the abrasive grains present inside the substrate are wasted, and the diamond abrasive grains are expensive, and it has been difficult to produce a polishing pad with high polishing efficiency at a low cost.
これに対して、本実施形態に係る研磨パッド１０においては、砥粒含有溶液Ｓに含まれる研磨砥粒１２２のほぼ全量を基材１１の表面（研磨面）から露出させることが可能であるため、研磨砥粒１２２の必要量を低減することが可能である。したがって、本実施形態の研磨パッド１０においては、研磨効率の向上を図りつつ、製造コストを低減することが可能である。 On the other hand, in the polishing pad 10 according to the present embodiment, almost the entire amount of the polishing abrasive grains 122 contained in the abrasive grain-containing solution S can be exposed from the surface (polishing surface) of the substrate 11. It is possible to reduce the required amount of polishing abrasive grains 122. Therefore, in the polishing pad 10 of this embodiment, it is possible to reduce the manufacturing cost while improving the polishing efficiency.
さらに本実施形態の研磨パッド１０によれば、基材１１が空隙を有する材料で構成され、内部に複数の空隙を有しているため、研磨対象物表面の研磨時に生じる研磨屑を、研磨層１２を介して基材１１内部の空隙に収容することができる。このため、研磨層１２表面の目詰まりが抑制され、研磨対象物の材質に依存しない、耐久性に優れた研磨パッド１０を提供することができる。 Furthermore, according to the polishing pad 10 of this embodiment, since the base material 11 is made of a material having voids and has a plurality of voids inside, the polishing debris generated during polishing of the surface of the object to be polished is removed from the polishing layer. 12 can be accommodated in the void inside the substrate 11. For this reason, clogging of the surface of the polishing layer 12 is suppressed, and it is possible to provide the polishing pad 10 with excellent durability that does not depend on the material of the object to be polished.
特に、研磨対象物が金属あるいはその表面を被覆する金属膜である場合、酸化物材料等と比較して研磨屑の粘りが強いのが一般的である。このような場合においても、本実施形態の研磨パッド１０によれば、そのライフサイクルを長くすることができるので、交換頻度が低く、したがって研磨工程の効率化が図れるようになる。
また、研磨対象物が金属膜と非金属膜との積層体のような異種材料の複合物である場合にも本実施形態の研磨パッド１０は適用可能である。本実施形態によれば、例えば、ガラス基板上に電極膜や光電変換層（半導体層）等が積層された太陽発電パネルに対して、所望とする領域の積層物を容易に除去することができる。
In particular, when the object to be polished is a metal or a metal film that covers the surface of the object, it is common that polishing dust is more viscous than an oxide material or the like. Even in such a case, according to the polishing pad 10 of the present embodiment, since the life cycle can be lengthened, the replacement frequency is low, and therefore the efficiency of the polishing process can be improved.
The polishing pad 10 of this embodiment can also be applied when the object to be polished is a composite of different materials such as a laminate of a metal film and a nonmetal film. According to this embodiment, for example, a laminate in a desired region can be easily removed from a solar power generation panel in which an electrode film, a photoelectric conversion layer (semiconductor layer), and the like are stacked on a glass substrate. .
さらに本実施形態によれば、例えばエアガンから噴射される圧縮エアを研磨面に噴き付けることで、基材１１内部の空隙に溜まった研磨屑を容易に除去することができる。これにより、使用済みの研磨パッド１０の再生が可能となり、研磨パッド１０のライフサイクルの更なる向上が図れることになる。 Furthermore, according to the present embodiment, for example, by blowing compressed air injected from an air gun onto the polishing surface, it is possible to easily remove the polishing debris accumulated in the gap inside the substrate 11. As a result, the used polishing pad 10 can be regenerated, and the life cycle of the polishing pad 10 can be further improved.
(第２実施形態）
続いて、本発明の第２実施形態に係る研磨パッドについて説明する。
(Second embodiment)
Subsequently, a polishing pad according to a second embodiment of the present invention will be described.
図７は本実施形態に係る研磨パッド２００の斜視図であり、図８は研磨パッド２０の断面図である。図８に示すように、研磨パッド２０は、基材１１と、研磨層１２と、樹脂シート１３とを備える。 FIG. 7 is a perspective view of the polishing pad 200 according to the present embodiment, and FIG. 8 is a cross-sectional view of the polishing pad 20. As shown in FIG. 8, the polishing pad 20 includes a base material 11, a polishing layer 12, and a resin sheet 13.
基材１１及び研磨層１２の構成は、上述の第１の実施形態と同様であるため、ここでは説明を省略する。 Since the structure of the base material 11 and the polishing layer 12 is the same as that of the above-mentioned first embodiment, the description thereof is omitted here.
樹脂シート１３は、合成樹脂からなるシートであり、基材１１の裏面１１ｂに接合される。樹脂シート１３は、ポリエチレンテレフタレート樹脂からなるものとすることができる。また、樹脂シート１３は他の合成樹脂からなるものであってもよい。樹脂シート１３の厚みは特に限定されず、数ｍｍ〜数十ｍｍ程度とすることができる。 The resin sheet 13 is a sheet made of synthetic resin, and is bonded to the back surface 11 b of the base material 11. The resin sheet 13 can be made of polyethylene terephthalate resin. Further, the resin sheet 13 may be made of other synthetic resin. The thickness of the resin sheet 13 is not particularly limited, and can be about several mm to several tens of mm.
基材１１には、スパンレース法により製造された厚さ０．０３〜０．３０ｍｍの薄い不織布を用いた。本実施形態においては、樹脂シート１３がクッション層として機能するため、基材１１は熱硬化性樹脂を通過させ、研磨砥粒を通過させない機能のみ発現すればよい。基材１１は、例えばポリエチレンテレフタレート繊維からなる不織布であるものとすることができる。 As the base material 11, a thin nonwoven fabric having a thickness of 0.03 to 0.30 mm manufactured by a spunlace method was used. In the present embodiment, since the resin sheet 13 functions as a cushion layer, the base material 11 only needs to exhibit a function of allowing the thermosetting resin to pass therethrough and not passing the abrasive grains. The base material 11 can be a nonwoven fabric made of, for example, polyethylene terephthalate fiber.
基材１１は、上記のものに限られず、適度な空隙を有する材料であればよい。例えば、発泡ポリウレタンフォーム等の発泡性材料等からなるものや合成樹脂が含浸された不織布、織布又は編地であってもよい。 The base material 11 is not limited to the above, and may be any material having an appropriate gap. For example, it may be a non-woven fabric, a woven fabric or a knitted fabric made of a foamable material such as a foamed polyurethane foam or a synthetic resin.
以上のように構成される本実施形態の研磨パッド２０においても、第１の実施形態と同様の作用効果を得ることができる。本実施形態によれば、基材１１の裏面１１ｂに樹脂シート１３を積層することにより、樹脂シート１３が基材１１を支持し、研磨パッド２０に研磨に適した弾性を付与することが可能である。 Also in the polishing pad 20 of the present embodiment configured as described above, the same operational effects as those of the first embodiment can be obtained. According to the present embodiment, by laminating the resin sheet 13 on the back surface 11 b of the base material 11, the resin sheet 13 can support the base material 11 and can impart elasticity suitable for polishing to the polishing pad 20. is there.
本発明の実施例及び比較例に係る研磨パッドを作製し、その研磨面および断面を走査型電子顕微鏡（ＳＥＭ）によって観察した。 The polishing pad which concerns on the Example and comparative example of this invention was produced, and the polishing surface and the cross section were observed with the scanning electron microscope (SEM).
フェノール系樹脂（ＰＳ−Ｆ（Ｊ−ケミカル社製））とエポキシ系樹脂（Ｋ−１４３０（Ｊ−ケミカル社製））を重量比１：１で混合して砥粒含有溶液とし、当該砥粒含有溶液と溶媒（ＩＰＡ）を重量比９：１で混合して樹脂混合溶液を作製した。樹脂混合溶液にダイヤモンド砥粒（ＴＭＤ−Ｓ ２０−２５（粒径約１８μｍ、トラストウェル社製））を添加して砥粒含有溶液を作製した。砥粒の添加量は、樹脂重量に対して４０ｗｔ％とした。 A phenolic resin (PS-F (manufactured by J-Chemical)) and an epoxy resin (K-1430 (manufactured by J-Chemical)) are mixed at a weight ratio of 1: 1 to obtain an abrasive-containing solution. The containing solution and the solvent (IPA) were mixed at a weight ratio of 9: 1 to prepare a resin mixed solution. Diamond abrasive grains (TMD-S 20-25 (particle size: about 18 μm, manufactured by Trustwell)) were added to the resin mixed solution to prepare an abrasive-containing solution. The amount of abrasive grains added was 40 wt% with respect to the resin weight.
上記砥粒含有溶液を下記の各種基材に塗布し、７０℃で３０分間加熱して溶媒を除去した。続いて、１３０℃で２０分間加熱して架橋反応を生じさせ、樹脂を硬化させた。 The above abrasive-containing solution was applied to the following various substrates and heated at 70 ° C. for 30 minutes to remove the solvent. Subsequently, the resin was cured by heating at 130 ° C. for 20 minutes to cause a crosslinking reaction.
（実施例１）
ポリウレタン樹脂を含浸させたポリエステル不織布を基材とし、基材表面に砥粒含有溶液を塗布して研磨パッドを作製した。図９は実施例１に係る研磨パッドの断面のＳＥＭ像であり、図１０は同研磨パッドの表面（研磨面）のＳＥＭ像である。
Example 1
A polyester nonwoven fabric impregnated with a polyurethane resin was used as a base material, and an abrasive-containing solution was applied to the surface of the base material to prepare a polishing pad. FIG. 9 is an SEM image of a cross section of the polishing pad according to Example 1, and FIG. 10 is an SEM image of the surface (polishing surface) of the polishing pad.
図９に示すように、研磨パッドの断面においては、基材Ｂと研磨層Ｐが観察された。砥粒含有溶液に含まれていた樹脂混合溶液は一部が基材Ｂに含浸され、同図に示すように、基材Ｂ中に砥粒含有溶液に由来する硬化性樹脂が観察された。図９及び図１０に示すように砥粒は研磨層Ｐに含まれ、研磨パッドの表面に存在している。一方で、砥粒は基材Ｂの内部には存在していない。 As shown in FIG. 9, the base material B and the polishing layer P were observed in the cross section of the polishing pad. A part of the resin mixed solution contained in the abrasive-containing solution was impregnated into the base material B, and as shown in the figure, a curable resin derived from the abrasive-containing solution was observed in the base material B. As shown in FIGS. 9 and 10, the abrasive grains are included in the polishing layer P and are present on the surface of the polishing pad. On the other hand, the abrasive grains are not present inside the base material B.
（実施例２）
ポリエチレンテレフタレート不織布からなる基材に、ポリエチレンテレフタレート樹脂からなる樹脂シートを積層した。不織布の表面に砥粒含有溶液を塗布して研磨パッドを作製した。図１１は実施例２に係る研磨パッドの断面のＳＥＭ像であり、図１２は同研磨パッドの表面のＳＥＭ像である。
(Example 2)
A resin sheet made of polyethylene terephthalate resin was laminated on a base material made of polyethylene terephthalate nonwoven fabric. An abrasive-containing solution was applied to the surface of the nonwoven fabric to prepare a polishing pad. FIG. 11 is an SEM image of a cross section of the polishing pad according to Example 2, and FIG. 12 is an SEM image of the surface of the polishing pad.
図１１に示すように、研磨パッドの断面においては、樹脂シートＢ１、不織布Ｂ２及び研磨層Ｐが観察された。砥粒含有溶液に含まれていた樹脂混合溶液は一部が不織布Ｂ２に含浸され、同図に示すように、不織布Ｂ２中に砥粒含有溶液に由来する硬化性樹脂が観察された。図１１及び図１２に示すように砥粒は研磨層Ｐに含まれ、研磨パッドの表面に存在している。一方で、砥粒は基材Ｂの内部には存在していない。 As shown in FIG. 11, resin sheet B1, nonwoven fabric B2, and polishing layer P were observed in the cross section of the polishing pad. A part of the resin mixed solution contained in the abrasive-containing solution was impregnated into the nonwoven fabric B2, and as shown in the figure, a curable resin derived from the abrasive-containing solution was observed in the nonwoven fabric B2. As shown in FIGS. 11 and 12, the abrasive grains are included in the polishing layer P and exist on the surface of the polishing pad. On the other hand, the abrasive grains are not present inside the base material B.
（比較例１）
ポリエチレンテレフタレート樹脂からなる樹脂シートを基材とし、基材表面に砥粒含有溶液を塗布して研磨パッドを作製した。図１３は比較例１に係る研磨パッドの断面のＳＥＭ像であり、図１４は同研磨パッドの表面のＳＥＭ像である。
(Comparative Example 1)
Using a resin sheet made of polyethylene terephthalate resin as a base material, an abrasive-containing solution was applied to the surface of the base material to prepare a polishing pad. 13 is an SEM image of a cross section of the polishing pad according to Comparative Example 1, and FIG. 14 is an SEM image of the surface of the polishing pad.
図１３に示すように、研磨パッドの断面においては、基材Ｂと、樹脂層Ｔが観察された。砥粒含有溶液に含まれていた樹脂混合溶液は基材Ｂに含浸されず、樹脂層Ｔを形成している。砥粒は樹脂層Ｔに埋没しており、図１３及び図１４に示すように樹脂層Ｔの表面にほとんど存在していない。 As shown in FIG. 13, the base material B and the resin layer T were observed in the cross section of the polishing pad. The resin mixed solution contained in the abrasive grain-containing solution is not impregnated into the base material B, and forms a resin layer T. The abrasive grains are buried in the resin layer T and hardly exist on the surface of the resin layer T as shown in FIGS.
（比較例２）
ポリエステル不織布の表面をプライマー処理したものを基材とし、基材表面に砥粒含有溶液を塗布して研磨パッドを作製した。図１５は比較例２に係る研磨パッドの断面のＳＥＭ像であり、図１６は同研磨パッドの表面のＳＥＭ像である。
(Comparative Example 2)
A surface of a polyester nonwoven fabric was treated with a primer, and a polishing pad was prepared by applying an abrasive-containing solution to the surface of the substrate. FIG. 15 is an SEM image of a cross section of the polishing pad according to Comparative Example 2, and FIG. 16 is an SEM image of the surface of the polishing pad.
図１５に示すように、研磨パッドの断面においては、基材Ｂと、樹脂層Ｔが観察された。砥粒含有溶液に含まれていた樹脂混合溶液は基材Ｂに含浸されず、樹脂層Ｔを形成している。砥粒は樹脂層Ｔに埋没しており、図１５及び図１６に示すように樹脂層Ｔの表面にほとんど存在していない。 As shown in FIG. 15, the base material B and the resin layer T were observed in the cross section of the polishing pad. The resin mixed solution contained in the abrasive grain-containing solution is not impregnated into the base material B, and forms a resin layer T. The abrasive grains are buried in the resin layer T and hardly exist on the surface of the resin layer T as shown in FIGS. 15 and 16.
上記のように、実施例１及び２においては、樹脂混合溶液が基材に含浸されることによって、砥粒が表面に存在する研磨パッドが得られた。このため、高い研磨特性が得られる。一方、砥粒は基材中には存在せず、樹脂混合溶液に含まれていた砥粒が無駄になることが防止されている。 As described above, in Examples 1 and 2, the base material was impregnated with the resin mixed solution to obtain a polishing pad having abrasive grains on the surface. For this reason, high polishing characteristics can be obtained. On the other hand, the abrasive grains are not present in the base material, and the abrasive grains contained in the resin mixed solution are prevented from being wasted.
一方、比較例１及び２においては、砥粒は基材中には存在していないものの、樹脂混合溶液が形成した樹脂層に埋没している。このため、これらの研磨パッドは砥粒による研磨特性が得られず、研磨パッドとして機能しないものである。 On the other hand, in Comparative Examples 1 and 2, the abrasive grains are not present in the substrate, but are buried in the resin layer formed by the resin mixed solution. For this reason, these polishing pads do not have polishing characteristics due to abrasive grains and do not function as polishing pads.
（実施例３）
以下のように、研磨砥粒の番手（粒径）および付与量（硬化性樹脂膜に対する重量比）を異ならせて、実施例１と同様の構造の複数の研磨パッドのサンプルを作製した。各サンプルは、直径２０ｍｍの円形状とした。
サンプル１：番手＃８００（粒径１８μｍ）、付与量２０ｗｔ％
サンプル２：番手＃８００（粒径１８μｍ）、付与量３０ｗｔ％
サンプル３：番手＃８００（粒径１８μｍ）、付与量４０ｗｔ％
サンプル４：番手＃４００（粒径３６μｍ）、付与量２０ｗｔ％
サンプル５：番手＃４００（粒径３６μｍ）、付与量３０ｗｔ％
サンプル６：番手＃４００（粒径３６μｍ）、付与量４０ｗｔ％
(Example 3)
As described below, samples of a plurality of polishing pads having the same structure as in Example 1 were prepared by changing the count (particle size) and the applied amount (weight ratio with respect to the curable resin film) of the abrasive grains. Each sample had a circular shape with a diameter of 20 mm.
Sample 1: Count # 800 (particle size 18 μm), applied amount 20 wt%
Sample 2: Count # 800 (particle size 18 μm), applied amount 30 wt%
Sample 3: Count # 800 (particle size 18 μm), applied amount 40 wt%
Sample 4: Count # 400 (particle size 36 μm), applied amount 20 wt%
Sample 5: Count # 400 (particle size 36 μm), applied amount 30 wt%
Sample 6: Count # 400 (particle size 36 μm), applied amount 40 wt%
研磨対象物として、ガラス基板の表面にＤＣスパッタ法で成膜された厚み１００〜１０００ｎｍ程度のＭｏ（モリブデン）膜を準備し、上記各サンプルを用いて当該Ｍｏ膜の表面を研磨した。研磨方法としては、サンプルの研磨面をＭｏ膜に接触させ、サンプルの背面を指で押しつけながら一軸方向に往復移動させた。研磨条件としては、研磨圧力が約１００ｋＰａ、研磨回数（往復回数）を１５回とした。 As an object to be polished, a Mo (molybdenum) film having a thickness of about 100 to 1000 nm formed on the surface of a glass substrate by a DC sputtering method was prepared, and the surface of the Mo film was polished using each sample. As a polishing method, the polished surface of the sample was brought into contact with the Mo film, and the sample was reciprocated in the uniaxial direction while pressing the back surface of the sample with a finger. As polishing conditions, the polishing pressure was about 100 kPa, and the number of polishing times (the number of reciprocations) was 15.
図１７上は、各サンプルの砥粒の種類を、図１７下の左側は、研磨前におけるＭｏ膜および各サンプルの研磨面の様子を、そして、図１７下の右側は研磨後におけるＭｏ膜および各サンプルの研磨面の様子をそれぞれ示している。図１７下の各図において、円形で示される６つのサンプルの研磨面は左から右へサンプル１〜６の順に並べられ、図１７下の右側の図には、Ｍｏ膜の研磨後の様子が各サンプルの下方領域に示されている。 17 shows the type of abrasive grains of each sample, the lower left side of FIG. 17 shows the state of the Mo film before polishing and the polished surface of each sample, and the lower right side of FIG. The state of the polished surface of each sample is shown. In each figure at the bottom of FIG. 17, the polished surfaces of the six samples indicated by circles are arranged in order of samples 1 to 6 from left to right, and the figure on the right side at the bottom of FIG. Shown in the lower region of each sample.
図１７に示すように、サンプル１〜６のすべてについて、Ｍｏ膜に対して一定の研磨あるいは研削効果を認めることができた。サンプル１〜３に着目すると、同じ番手の砥粒でも、砥粒の付与量が大きいほどＭｏ膜に対する研削能力が高いことが確認された（白い領域は下地の基板を示しており、灰色の領域はＭｏ膜が残留していることを示している）。また、サンプル４〜６に示すように、＃４００の砥粒を用いることで、いずれも同等の研削能力（Ｍｏ膜の除去能力）が得られることが確認された。 As shown in FIG. 17, a constant polishing or grinding effect could be recognized for the Mo film for all of Samples 1 to 6. Focusing on Samples 1 to 3, it was confirmed that, even with the same number of abrasive grains, the grinding ability with respect to the Mo film increases as the applied amount of abrasive grains increases (the white area indicates the underlying substrate and the gray area) Indicates that the Mo film remains). Further, as shown in Samples 4 to 6, it was confirmed that the same grinding ability (Mo film removal ability) can be obtained by using # 400 abrasive grains.
また図１７の結果より、サンプル３〜６に係る研磨パッドによって、基板上のＭｏ膜を研削除去できることが確認された。このことから、研磨砥粒の平均粒径を１０μｍ以上４０μｍ以下、硬化性樹脂膜に対する研磨砥粒の含有割合を１０ｗｔ％以上４０ｗｔ％以下とすることで、モリブデン膜を効率よく除去することができることが確認された。 Moreover, from the result of FIG. 17, it was confirmed that the Mo film on the substrate can be ground and removed by the polishing pads according to Samples 3 to 6. Therefore, the molybdenum film can be efficiently removed by setting the average grain size of the abrasive grains to 10 μm to 40 μm and the content ratio of the abrasive grains to the curable resin film to 10 wt% to 40 wt%. Was confirmed.
なお本発明者らは、研磨砥粒の上記含有割合が２０ｗｔ％未満でも、Ｍｏ膜に対する一定の研磨能力が得られることを確認した。図１８は、砥粒の量がそれぞれ５ｗｔ％（左側）および１０ｗｔ％（右側）のサンプルを用いてＭｏ膜表面を上記研磨条件で研磨したときの様子を示している。 In addition, the present inventors have confirmed that a certain polishing ability with respect to the Mo film can be obtained even when the content of the abrasive grains is less than 20 wt%. FIG. 18 shows a state in which the Mo film surface was polished under the above-described polishing conditions using samples of 5 wt% (left side) and 10 wt% (right side), respectively.
そして、図１９は、研磨後の各サンプルの研磨面に対してエアガン（噴射圧力約０．６ＭＰａ）による浄化処理を実施したときの、各サンプルの研磨面の様子を示している。図中左側は浄化前の様子を、右側は浄化後の様子をそれぞれ示している。なお、図１９左側の図は、図１７下の右側の図に相当する。 FIG. 19 shows the state of the polished surface of each sample when the polished surface of each sample after polishing is subjected to a purification treatment with an air gun (injection pressure of about 0.6 MPa). In the figure, the left side shows the state before purification, and the right side shows the state after purification. Note that the diagram on the left side of FIG. 19 corresponds to the diagram on the right side of FIG.
図１９に示すように、研磨面からの研磨屑の除去効果は、各サンプルについて同様に認められた。すなわち、研磨面の再生が可能であり、これによりライフサイクルの向上が図れることが確認された。 As shown in FIG. 19, the effect of removing polishing debris from the polished surface was similarly recognized for each sample. That is, it was confirmed that the polished surface can be regenerated, and that the life cycle can be improved.
以上、本発明の実施形態について説明したが、本発明は上述の実施形態にのみ限定されるものではなく種々変更を加え得ることは勿論である。 As mentioned above, although embodiment of this invention was described, this invention is not limited only to the above-mentioned embodiment, Of course, a various change can be added.
例えば以上の実施形態では、研磨対象物である金属膜としてＭｏ膜を例に挙げたが、これに限られず、これ以外の非鉄系金属膜あるいは鉄系金属膜の研削除去にも、本発明は適用可能である。また、金属膜以外にも金属酸化物等の金属化合物膜あるいはセラミック膜の研削にも本発明は適用可能である。 For example, in the above embodiment, the Mo film is taken as an example of the metal film that is an object to be polished. However, the present invention is not limited to this, and the present invention is applicable to grinding and removal of other non-ferrous metal films or iron metal films. Applicable. In addition to the metal film, the present invention can be applied to grinding a metal compound film such as a metal oxide or a ceramic film.
また、硬化性樹脂膜１２１に対する砥粒１２２の含有量は上述したような範囲に限られず、研磨対象物や研磨目的等に応じて適宜変更することが可能である。 Further, the content of the abrasive grains 122 with respect to the curable resin film 121 is not limited to the above-described range, and can be appropriately changed according to the object to be polished, the purpose of polishing, and the like.
さらに上述のように構成される研磨パッド１０，２０は、典型的には、自転又は公転可能なヘッド部に装着されて使用されるが、この場合、単独で使用されてもよいし、スラリー状の補助研磨材等と組み合わせて用いられてもよい。 Further, the polishing pads 10 and 20 configured as described above are typically mounted and used on a head portion that can rotate or revolve, but in this case, they may be used alone or in a slurry state. The auxiliary abrasive may be used in combination.
１０、２０…研磨パッド
１１…基材
１２…研磨層
１３…樹脂シート
１１１…合成樹脂
１２１…硬化性樹脂膜
１２２…研磨砥粒
DESCRIPTION OF SYMBOLS 10, 20 ... Polishing pad 11 ... Base material 12 ... Polishing layer 13 ... Resin sheet 111 ... Synthetic resin 121 ... Curable resin film 122 ... Polishing abrasive grain
Claims (8)
前記研磨対象物に対向する第１の面を有し、空隙を有する材料で構成された基材と、
前記第１の面に選択的に設けられた硬化性樹脂膜と、前記硬化性樹脂膜に固定され前記金属膜に接触する研磨砥粒とを有する研磨層と
を具備する研磨パッド。 A polishing pad for removing a metal film provided on the surface of a polishing object,
A substrate having a first surface facing the object to be polished and made of a material having voids;
A polishing pad comprising: a curable resin film selectively provided on the first surface; and a polishing layer having polishing abrasive grains fixed to the curable resin film and in contact with the metal film.
前記研磨層は、硬化性樹脂と研磨砥粒とを含む砥粒含有溶液が前記第１の面に塗布され、前記硬化性樹脂が硬化して形成される
研磨パッド。 The polishing pad according to claim 1,
The polishing layer is formed by applying an abrasive-containing solution containing a curable resin and abrasive grains to the first surface and curing the curable resin.
前記基材の空隙は、硬化前の前記硬化性樹脂が通過可能であり、前記研磨砥粒が通過不能な大きさに設けられている
研磨パッド。 The polishing pad according to claim 1 or 2,
The gap of the substrate is provided with a size that allows the curable resin before curing to pass therethrough and prevents the abrasive grains from passing therethrough.
合成樹脂材料で構成されたシート材をさらに具備し、
前記基材は、前記シート材に接合された、前記第１の面とは反対側の第２の面をさらに有する
研磨パッド。 The polishing pad according to any one of claims 1 to 3,
Further comprising a sheet material made of a synthetic resin material,
The said base material further has a 2nd surface on the opposite side to the said 1st surface joined to the said sheet | seat material. Polishing pad.
前記基材は不織布であり、
前記研磨砥粒はダイヤモンド砥粒である
研磨パッド。 The polishing pad according to any one of claims 1 to 4,
The substrate is a nonwoven;
The polishing pad is a diamond abrasive.
前記金属膜は、モリブデン膜を含む
研磨パッド。 A polishing pad according to any one of claims 1 to 5,
The metal film includes a molybdenum film.
前記研磨対象物は、前記金属膜が表面に形成された太陽発電パネルである
研磨パッド。 The polishing pad according to claim 6,
The polishing object is a solar power generation panel having the metal film formed on a surface thereof.
前記研磨砥粒の平均粒径は、１０μｍ以上４０μｍ以下であり、
前記硬化性樹脂膜に対する前記研磨砥粒の含有割合は、１０ｗｔ％以上４０ｗｔ％以下である
研磨パッド。 A polishing pad according to any one of claims 5 to 7,
The average particle size of the abrasive grains is 10 μm or more and 40 μm or less,
The polishing pad having a content ratio of the abrasive grains to the curable resin film of 10 wt% or more and 40 wt% or less.
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