TW201801857A - Abrasive material - Google Patents

Abrasive material Download PDF

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Publication number
TW201801857A
TW201801857A TW106122456A TW106122456A TW201801857A TW 201801857 A TW201801857 A TW 201801857A TW 106122456 A TW106122456 A TW 106122456A TW 106122456 A TW106122456 A TW 106122456A TW 201801857 A TW201801857 A TW 201801857A
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polishing
abrasive
section
abrasion
grinding
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TW106122456A
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Chinese (zh)
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TWI737760B (en
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井上裕昭
竹村幸二
岩永友樹
高木大輔
笹島啓佑
田浦歳和
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創技股份有限公司
阪東化學股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention is an abrasive material that comprises a base material, and an abrasive layer stacked on a surface side of the base material, and that is characterized in that: the abrasive layer contains abrasive grains and a binder for the abrasive grains, and includes multiple kinds of abrasive parts which show different abrasion amounts in the Taber abrasion test; a first abrasive part which shows the smallest abrasion amount among the multiple kinds of abrasive parts is surrounded by other abrasive parts; the ratio of the abrasion amounts of the other abrasive parts to the abrasion amount of the first abrasive part is at least 3; and the ratio of the area occupied by all the abrasive parts in the abrasive layer is 15-100% inclusive.

Description

研磨材Abrasive material

本發明是有關於一種研磨材。The present invention relates to an abrasive material.

近年來，硬碟（hard disk）等電子設備的精密化推進。對於此種電子設備的基板材料，考慮到可對應小型化或薄型化的剛性、耐衝擊性及耐熱性，可使用玻璃、藍寶石等。此種基板的加工中通常使用固定研磨粒的研磨材。In recent years, electronic devices such as hard disks have been refined. For the substrate material of such an electronic device, glass, sapphire, etc. can be used in consideration of rigidity, impact resistance, and heat resistance that can be reduced or reduced. In the processing of such a substrate, an abrasive material having fixed abrasive particles is generally used.

然而，於所述基板加工中，要求加工效率的提升。作為可提高基板加工的加工效率的研磨材，例如提出有一種於基材片的表面形成有作為研磨層而彼此獨立的多個研磨結構體的研磨材（參照日本專利特開2009-72832號公報）。於該研磨材中，降低研磨結構體的研磨面相對於研磨層的面積比率，且減小受到研磨時所施加的研磨負荷的研磨面的面積，藉此提高研磨壓力，且使磨削力提升。However, in the substrate processing, an improvement in processing efficiency is required. As an abrasive material that can improve the processing efficiency of substrate processing, for example, an abrasive material having a plurality of abrasive structures independently formed as a polishing layer on the surface of a substrate sheet has been proposed (see Japanese Patent Laid-Open No. 2009-72832 ). In this polishing material, the area ratio of the polishing surface of the polishing structure to the polishing layer is reduced, and the area of the polishing surface subjected to the polishing load applied during polishing is reduced, thereby increasing the polishing pressure and increasing the grinding force.

於所述現有的研磨材中，藉由於多個研磨結構體之間設置槽而控制面積比率。因此，為了降低面積比率且使磨削力提升，需要擴展研磨結構體間的槽寬。若槽寬如此般擴展，則當研磨時基板（被削體）的端部橫穿槽時，基板的端部容易向基材片側傾斜。因此，基板鉤掛於槽的側面上部、或者落入槽中，因此基板產生損傷的頻率提高。 [現有技術文獻] [專利文獻]In the conventional abrasive material, an area ratio is controlled by providing grooves between a plurality of abrasive structures. Therefore, in order to reduce the area ratio and increase the grinding force, it is necessary to expand the groove width between the polishing structures. If the groove width is expanded as described above, when the end portion of the substrate (the object to be cut) crosses the groove during polishing, the end portion of the substrate is likely to be inclined toward the substrate sheet side. Therefore, the substrate is caught on the upper side of the groove or dropped into the groove, so the frequency of damage to the substrate is increased. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2009-72832號公報[Patent Document 1] Japanese Patent Laid-Open No. 2009-72832

[發明所欲解決的課題] 本發明是鑒於此種不良狀況而成，其目的在於提供一種可抑制因被削體落入槽等中而引起的損傷，並且可達成比較高的加工效率的研磨材。 [解決課題之手段][Problems to be Solved by the Invention] The present invention is made in view of such a disadvantage, and an object of the present invention is to provide a polishing that can suppress damage caused by a workpiece being dropped into a groove, etc., and can achieve a relatively high processing efficiency. material. [Means for solving problems]

為了解決所述課題而成的發明為一種研磨材，其具備基材、及積層於該基材的表面側的研磨層，所述研磨材的特徵在於：所述研磨層包含研磨粒及其黏合劑，且具有塔柏（Taber）磨耗試驗中的磨耗量不同的多種研磨部，所述多種研磨部中所述磨耗量最小的第一研磨部由其他研磨部包圍，所述其他研磨部的所述磨耗量相對於所述第一研磨部的所述磨耗量的比為3以上，所述研磨層中的所述研磨部整體的佔有面積率為15%以上且100%以下。An invention made in order to solve the above-mentioned problem is a polishing material comprising a base material and a polishing layer laminated on a surface side of the base material, wherein the polishing material is characterized in that the polishing layer includes abrasive particles and a bond therebetween. Agent, and has a plurality of grinding sections with different abrasion amounts in the Taber abrasion test. Among the plurality of kinds of grinding sections, the first grinding section having the smallest abrasion amount is surrounded by other grinding sections. A ratio of the abrasion amount to the abrasion amount of the first polishing portion is 3 or more, and an area ratio of the entire polishing portion in the polishing layer is 15% or more and 100% or less.

該研磨材具備第一研磨部、以及包圍所述第一研磨部的其他研磨部，塔柏磨耗試驗中的所述其他磨耗部的磨耗量相對於所述第一磨耗部的磨耗量的比為所述下限以上。因此，若使用該研磨材進行研磨，則包圍第一研磨部的其他研磨部先磨耗。藉此，自研磨開始起較短時間內，於第一研磨部與其他研磨部之間產生階差，以使其他研磨部的高度低。另外，該研磨部的磨耗主要藉由研磨粒的脫落而於第一研磨部及其他研磨部一起進行，因此，一面維持該階差一面對被削體進行研磨。因而，第一研磨部主要受到研磨時所施加的研磨負荷，因此，第一研磨部的研磨壓力提高，藉此該研磨材的磨削力提高。另外，關於該研磨材，所述其他研磨部包圍所述第一研磨部，且將所述研磨層中的所述研磨部整體的佔有面積率設為所述範圍內。因此，關於該研磨材，當研磨時被削體的端部於第一研磨部之間移動時，藉由所述其他研磨部可抑制被削體向基材側傾斜。因而，該研磨材可抑制因被削體落入槽等中而引起的損傷。This abrasive material includes a first abrasive portion and other abrasive portions surrounding the first abrasive portion. A ratio of the amount of abrasion of the other abrasive portion to the amount of abrasion of the first abrasive portion in a Taber abrasion test is The lower limit is above. Therefore, when polishing is performed using this polishing material, other polishing portions surrounding the first polishing portion are worn first. Thereby, a step is generated between the first polishing portion and the other polishing portions in a short time from the start of the polishing, so that the height of the other polishing portions is low. In addition, the abrasion of the polishing portion is mainly performed together with the first polishing portion and other polishing portions by dropping of the abrasive particles. Therefore, the surface is polished while maintaining the step. Therefore, since the first polishing portion is mainly subjected to the polishing load applied during polishing, the polishing pressure of the first polishing portion is increased, whereby the grinding force of the polishing material is increased. In the polishing material, the other polishing portion surrounds the first polishing portion, and an area ratio of the entire polishing portion in the polishing layer is within the range. Therefore, regarding this abrasive, when the end portion of the object to be cut moves between the first polishing portions during polishing, the other polishing portion can suppress the object to be tilted toward the base material side. Therefore, the abrasive can suppress damage caused by the object being dropped into a groove or the like.

所述研磨層中的所述第一研磨部的佔有面積率較佳為3%以上且16%以下。藉由將所述第一研磨部的佔有面積率設為所述範圍內，可提高第一研磨部受到的研磨壓力，且可使該研磨材的磨削力進一步提升。The occupied area ratio of the first polishing portion in the polishing layer is preferably 3% or more and 16% or less. By setting the occupied area ratio of the first polishing portion within the range, the polishing pressure received by the first polishing portion can be increased, and the grinding force of the polishing material can be further improved.

所述第一研磨部的研磨粒可由多種研磨粒構成。藉由如此般由多種研磨粒構成所述第一研磨部的研磨粒，可抑制該研磨材的製造成本的增加，並且可使磨削力提升。The abrasive grains of the first abrasive portion may be composed of a plurality of kinds of abrasive grains. By configuring the abrasive grains of the first grinding section with a plurality of kinds of abrasive grains as described above, it is possible to suppress an increase in the manufacturing cost of the abrasive material and increase the grinding force.

所述第一研磨部可包含金剛石研磨粒，所述第一研磨部中的所述金剛石研磨粒的含量較佳為1體積%以上且20體積%以下。藉由如此般將第一研磨部的金剛石研磨粒的含量設為所述範圍內，可抑制該研磨材的製造成本的增加，並且進而可使磨削力提升。The first abrasive portion may include diamond abrasive particles, and the content of the diamond abrasive particles in the first abrasive portion is preferably 1% by volume or more and 20% by volume or less. By setting the content of the diamond abrasive grains in the first polishing section to be in the above-mentioned range, it is possible to suppress an increase in the manufacturing cost of the abrasive and further increase the grinding force.

所述其他研磨部中的所述金剛石研磨粒的含量較佳為0.3體積%以下。金剛石研磨粒為硬質且磨削力高，因此即使與被削體接觸亦難以引起鈍化或脫落，且與其他研磨粒相比容易受到大的研磨負荷。因此，藉由將所述其他研磨部中的金剛石研磨粒的含量設為所述上限以下，可抑制研磨時研磨負荷施加至其他研磨部，且容易集中於第一研磨部，因此可使該研磨材的磨削力提升。再者，所述金剛石研磨粒的含量可為0體積%，即所述其他研磨部可不包含金剛石研磨粒。The content of the diamond abrasive grains in the other polishing section is preferably 0.3% by volume or less. Diamond abrasive grains are hard and have a high grinding force. Therefore, they are less likely to cause passivation or peeling even when they come into contact with the workpiece, and they are more susceptible to large abrasive loads than other abrasive grains. Therefore, by setting the content of the diamond abrasive grains in the other polishing section to the upper limit or less, it is possible to suppress the polishing load from being applied to the other polishing section during polishing, and it is easy to concentrate on the first polishing section. Grinding power of wood is increased. Furthermore, the content of the diamond abrasive particles may be 0% by volume, that is, the other abrasive portions may not include diamond abrasive particles.

此處「塔柏磨耗試驗中的磨耗量」是準備試片（平均直徑104 mm，平均厚度300 μm），使用塔柏磨耗試驗機於磨耗輪H-18、負荷4.9 N（500 gf）的條件下使所述試片旋轉320轉而對320轉前後的試片的質量差進行測定所得的值。另外，所謂「第一研磨部由其他研磨部包圍」是指於俯視時第一研磨部位於由其他研磨部形成的封閉空間。再者，所述其他研磨部亦可連續存在於封閉空間的外周，但亦可於整周長度的10%以下的範圍內存在斷續部分。於其他研磨部存在斷續部分的情況下，設為該斷續部分藉由外插來確定封閉空間的區域。於存在此種斷續部分的情況下，可出現第一研磨部局部位於所述封閉空間的情況，但設為於俯視時位於封閉空間的第一研磨部的面積佔第一研磨部整體面積的50%以上的情況下，判斷為該第一研磨部位於封閉空間。另外，於研磨層具有槽的情況下，「研磨層的面積」為亦包含槽的面積在內的概念。 [發明的效果]Here, the "abrasion amount in the Taber abrasion test" is a condition in which a test piece (average diameter of 104 mm and average thickness of 300 μm) is prepared, and a Taber abrasion tester is used on the abrasion wheel H-18 under a load of 4.9 N (500 gf) The test piece is rotated by 320 rotations, and the value obtained by measuring the mass difference of the test piece before and after 320 rotations is measured. The term “the first polishing portion is surrounded by other polishing portions” means that the first polishing portion is located in a closed space formed by the other polishing portions in a plan view. In addition, the other polishing portions may continuously exist on the outer periphery of the closed space, but there may also be discontinuous portions within a range of less than 10% of the entire circumference length. In the case where there is a discontinuous portion in the other polishing portion, it is assumed that the region of the closed space is determined by extrapolation in the discontinuous portion. In the case where such a discontinuous portion exists, the first polishing portion may be partially located in the closed space, but it is set that the area of the first polishing portion located in the closed space in plan view occupies the entire area of the first polishing portion. In the case of 50% or more, it is determined that the first polishing portion is located in a closed space. When the polishing layer has grooves, the "area of the polishing layer" is a concept including the area of the grooves. [Effect of the invention]

如以上所說明般，本發明的研磨材可抑制因被削體落入槽等中而引起的損傷，並且可達成比較高的加工效率。As described above, the abrasive of the present invention can suppress damage caused by the object being dropped into a groove or the like, and can achieve a relatively high processing efficiency.

以下，適當參照圖式來對本發明的實施形態進行詳細說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

圖1及圖2所示的研磨材1具備：基材10；研磨層20，積層於該基材10的表面側；以及接著層30，積層於所述基材10的背面側。該研磨材1例如作為用以進行基板加工的固定研磨粒研磨材來使用。The abrasive material 1 shown in FIGS. 1 and 2 includes a base material 10, a polishing layer 20 laminated on the front surface side of the base material 10, and an adhesive layer 30 laminated on the back surface side of the base material 10. This polishing material 1 is used as a fixed abrasive polishing material for substrate processing, for example.

[基材] 基材10為用以支持研磨層20的板狀的構件。[Substrate] The substrate 10 is a plate-shaped member for supporting the polishing layer 20.

基材10的主成分並無特別限定，可列舉：聚對苯二甲酸乙二酯（polyethylene terephthalate，PET）、聚丙烯（polypropylene，PP）、聚乙烯（polyethylene，PE）、聚醯亞胺（polyimide，PI）、聚萘二甲酸乙二酯（polyethylene naphthalate，PEN）、芳族聚醯胺、鋁、銅等。其中較佳為與研磨層20的接著性良好的PET、及鋁。另外，亦可對基材10的表面進行化學處理、電暈處理、底塗處理等提高接著性的處理。此處，所謂「主成分」是指含量最多的成分，例如是指含量為50質量%以上、較佳為90%以上的成分。The main component of the substrate 10 is not particularly limited, and examples thereof include polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), and polyimide ( polyimide (PI), polyethylene naphthalate (PEN), aromatic polyamide, aluminum, copper, etc. Among them, PET and aluminum having good adhesion to the polishing layer 20 are preferred. In addition, the surface of the substrate 10 may be subjected to a treatment for improving adhesion, such as a chemical treatment, a corona treatment, or a primer treatment. Here, the "main component" means a component having the largest content, and for example, a component having a content of 50% by mass or more, preferably 90% or more.

另外，基材10可具有可撓性或延性。藉由如此般基材10具有可撓性或延性，該研磨材1追隨被削體的表面形狀，且研磨面與被削體的接觸面積變大，因此研磨速率進一步提高。此種具有可撓性的基材10的主成分例如可列舉PET或PI等。另外，具有延性的基材10的主成分可列舉鋁或銅等。In addition, the substrate 10 may have flexibility or ductility. Since the base material 10 has flexibility or ductility in this way, the polishing material 1 follows the shape of the surface of the object to be cut, and the contact area between the polishing surface and the object to be cut is increased, so that the polishing rate is further increased. Examples of the main component of such a flexible substrate 10 include PET and PI. Examples of the main component of the ductile base material 10 include aluminum and copper.

所述基材10的形狀及大小並無特別限制，例如可設為一邊為140 mm以上且160 mm以下的正方形狀或者外徑為200 mm以上且2100 mm以下以及內徑為100 mm以上且660 mm以下的圓環狀。另外，並置於平面上的多個基材10亦可為由單一的支持體所支持的構成。The shape and size of the substrate 10 are not particularly limited, and may be, for example, a square shape with a side of 140 mm or more and 160 mm or less, or an outer diameter of 200 mm or more and 2100 mm or less, and an inner diameter of 100 mm or more and 660. Ring shape below mm. In addition, the plurality of base materials 10 juxtaposed on a plane may have a structure supported by a single support.

所述基材10的平均厚度並無特別限制，例如可設為50 μm以上且1 mm以下。於所述基材10的平均厚度未滿所述下限的情況下，有該研磨材1的強度或平坦性不足之虞。相反，於所述基材10的平均厚度超過所述上限的情況下，有該研磨材1變得過厚而難以操作之虞。The average thickness of the substrate 10 is not particularly limited, and may be, for example, 50 μm or more and 1 mm or less. When the average thickness of the base material 10 is less than the lower limit, the strength or flatness of the abrasive material 1 may be insufficient. On the other hand, when the average thickness of the base material 10 exceeds the upper limit, the polishing material 1 may become too thick and may be difficult to handle.

[研磨層] 研磨層20具有塔柏磨耗試驗中的磨耗量不同的兩種研磨部。所述兩種研磨部中所述磨耗量小的第一研磨部21由所述磨耗量大的第二研磨部22包圍。另外，所述第二研磨部22彼此獨立，且由槽23劃分。另外，所述第二研磨部22分別包圍一個第一研磨部21，且所述第一研磨部21與第二研磨部22之間沒有間隙。即，藉由所述第一研磨部21與第二研磨部22而構成凸狀部24。[Polishing Layer] The polishing layer 20 includes two types of polishing portions having different abrasion amounts in the Taber abrasion test. Among the two types of polishing portions, the first polishing portion 21 having a small abrasion amount is surrounded by the second polishing portion 22 having a large abrasion amount. In addition, the second polishing portions 22 are independent of each other and are divided by the grooves 23. In addition, each of the second polishing portions 22 surrounds one first polishing portion 21, and there is no gap between the first polishing portion 21 and the second polishing portion 22. That is, the first polishing portion 21 and the second polishing portion 22 constitute a convex portion 24.

所述研磨層20的平均厚度（僅凸狀部24部分的平均厚度）的下限較佳為25 μm，更佳為30 μm，進而佳為50 μm。另一方面，所述研磨層20的平均厚度的上限較佳為4000 μm，更佳為3500 μm，進而佳為3000 μm。若所述研磨層20的平均厚度未滿所述下限，則有研磨層20的耐久性不足之虞。相反，若所述研磨層20的平均厚度超過所述上限，則所述研磨層20的均質性降低，因此有難以發揮穩定的磨削力之虞。另外，有該研磨材1變得過厚而難以操作之虞或製造成本增大之虞。The lower limit of the average thickness of the polishing layer 20 (the average thickness of only the convex portions 24) is preferably 25 μm, more preferably 30 μm, and even more preferably 50 μm. On the other hand, the upper limit of the average thickness of the polishing layer 20 is preferably 4000 μm, more preferably 3500 μm, and even more preferably 3000 μm. If the average thickness of the polishing layer 20 is less than the lower limit, the durability of the polishing layer 20 may be insufficient. On the contrary, if the average thickness of the polishing layer 20 exceeds the upper limit, the homogeneity of the polishing layer 20 is reduced, and therefore it may be difficult to exhibit a stable grinding force. In addition, the polishing material 1 may become too thick to be difficult to handle, or may increase the manufacturing cost.

＜第一研磨部＞ 第一研磨部21包含研磨粒21a及其黏合劑21b。所述第一研磨部21的俯視形狀並無特別限定，可設為方形狀或圓形狀。另外，所述多個第一研磨部21排列為規則的方塊圖案（block pattern）狀。<First polishing section> The first polishing section 21 includes abrasive particles 21a and an adhesive 21b thereof. The planar shape of the first polishing portion 21 is not particularly limited, and may be a square shape or a circular shape. In addition, the plurality of first polishing portions 21 are arranged in a regular block pattern.

（研磨粒） 所述第一研磨部21的研磨粒21a可列舉：金剛石研磨粒、氧化鋁研磨粒、二氧化矽研磨粒、氧化鈰研磨粒、碳化矽研磨粒、碳化硼研磨粒等。(Abrasive particles) Examples of the abrasive particles 21 a of the first polishing section 21 include diamond abrasive particles, alumina abrasive particles, silicon dioxide abrasive particles, cerium oxide abrasive particles, silicon carbide abrasive particles, and boron carbide abrasive particles.

第一研磨部21中的所述研磨粒21a的含量的下限較佳為50體積%，更佳為60體積%。另一方面，所述研磨粒21a的含量的上限較佳為85體積%，更佳為80體積%。若所述研磨粒21a的含量未滿所述下限，則相對地黏合劑21b的含量變大，因此研磨粒21a被牢固地固定而難以脫落。因此有第一研磨部21的表面所露出的研磨粒21a容易發生鈍化而研磨速率降低之虞。相反，若所述研磨粒21a的含量超過所述上限，則相對地黏合劑21b的含量變小，因此研磨粒21a容易脫落。因此，有因該脫落而研磨速率降低之虞。The lower limit of the content of the abrasive particles 21a in the first polishing section 21 is preferably 50% by volume, and more preferably 60% by volume. On the other hand, the upper limit of the content of the abrasive particles 21a is preferably 85% by volume, and more preferably 80% by volume. When the content of the abrasive particles 21a is less than the lower limit, the content of the adhesive 21b is relatively large, and therefore the abrasive particles 21a are firmly fixed and difficult to fall off. Therefore, the abrasive grains 21a exposed on the surface of the first polishing portion 21 are likely to be passivated and the polishing rate may be reduced. Conversely, if the content of the abrasive particles 21a exceeds the upper limit, the content of the adhesive 21b is relatively small, and therefore the abrasive particles 21a are liable to fall off. Therefore, there is a concern that the polishing rate may be reduced due to the peeling.

所述第一研磨部21的研磨粒21a的平均粒徑可根據研磨速率與研磨後的被削體的表面粗糙度的觀點來適當選擇。所述研磨粒21a的平均粒徑的下限較佳為1 μm，更佳為2 μm。另一方面，所述研磨粒21a的平均粒徑的上限較佳為45 μm，更佳為40 μm。若所述研磨粒21a的平均粒徑未滿所述下限，則有該研磨材1的磨削力不足而加工效率降低之虞。相反，若所述研磨粒21a的平均粒徑超過所述上限，則有研磨精度降低之虞。此處，所謂「平均粒徑」是指利用雷射繞射法等來測定的體積基準的累積粒度分佈曲線的50%值（50%粒徑，D50）。The average particle diameter of the abrasive grains 21a of the first polishing section 21 can be appropriately selected from the viewpoints of the polishing rate and the surface roughness of the workpiece after polishing. The lower limit of the average particle diameter of the abrasive particles 21a is preferably 1 μm, and more preferably 2 μm. On the other hand, the upper limit of the average particle diameter of the abrasive particles 21a is preferably 45 μm, and more preferably 40 μm. If the average particle diameter of the abrasive grains 21a is less than the lower limit, the grinding force of the abrasive material 1 may be insufficient and the processing efficiency may be reduced. On the other hand, if the average particle diameter of the abrasive grains 21a exceeds the upper limit, the polishing accuracy may be reduced. Here, the "average particle diameter" refers to a 50% value (50% particle diameter, D50) of a volume-based cumulative particle size distribution curve measured by a laser diffraction method or the like.

所述第一研磨部21的研磨粒21a可由一種研磨粒構成，但較佳為由多種研磨粒構成。藉由如此般由多種研磨粒構成所述第一研磨部21的研磨粒21a，可抑制該研磨材1的製造成本的增加，並且可使磨削力提升。The abrasive grains 21 a of the first polishing unit 21 may be composed of one kind of abrasive grains, but preferably composed of a plurality of kinds of abrasive grains. By constituting the abrasive grains 21a of the first grinding section 21 with a plurality of kinds of abrasive grains as described above, it is possible to suppress an increase in the manufacturing cost of the abrasive material 1 and to increase the grinding force.

於由多種研磨粒構成所述研磨粒21a的情況下，所述研磨粒21a較佳為包含金剛石研磨粒，尤佳為所述研磨粒21a由金剛石磨石與氧化鋁研磨粒構成。與其他研磨粒相比，金剛石研磨粒的磨削力高但價格高。因此，藉由將多種研磨粒的一種設為金剛石研磨粒，可抑制製造成本的增加，並且可使磨削力進一步提升。另外，氧化鋁研磨粒比較廉價，因此，藉由以金剛石磨石與氧化鋁研磨粒構成所述研磨粒21a，可提高製造成本的削減效果。When the abrasive particles 21a are composed of a plurality of types of abrasive particles, the abrasive particles 21a preferably include diamond abrasive particles, and particularly preferably, the abrasive particles 21a are composed of diamond abrasive stones and alumina abrasive particles. Compared with other abrasive particles, diamond abrasive particles have higher grinding power but are more expensive. Therefore, by using one type of abrasive grains as diamond abrasive grains, it is possible to suppress an increase in manufacturing cost and further increase the grinding force. In addition, alumina abrasive particles are relatively inexpensive. Therefore, by forming the abrasive particles 21a with a diamond abrasive stone and an alumina abrasive particle, the effect of reducing manufacturing costs can be improved.

再者，金剛石研磨粒的金剛石可為單晶亦可為多晶，另外亦可為經Ni塗佈等處理的金剛石。其中較佳為單晶金剛石及多晶金剛石。單晶金剛石於金剛石中亦為硬質且磨削力高。另外，多晶金剛石容易以構成多晶的微晶單位劈開而難以發生鈍化，因此研磨速率的降低小。In addition, the diamond of the diamond abrasive grains may be a single crystal or a polycrystal, and may also be a diamond treated with Ni coating or the like. Among them, single crystal diamond and polycrystalline diamond are preferred. Single crystal diamond is also hard in diamond and has high grinding force. In addition, since polycrystalline diamond is easily cleaved in microcrystalline units constituting the polycrystal, and it is difficult to passivate, the reduction in polishing rate is small.

於所述研磨粒21a由包含金剛石研磨粒的多種研磨粒構成的情況下，第一研磨部21中的金剛石研磨粒的含量的下限較佳為1體積%，更佳為2體積%。另一方面，所述金剛石研磨粒的含量的上限較佳為20體積%，更佳為8體積%。若所述金剛石研磨粒的含量未滿所述下限，則有該研磨材1的磨削力不足之虞。相反，若所述金剛石研磨粒的含量超過所述上限，則有該研磨材1的製造成本增加的抑制效果不充分之虞。In a case where the abrasive grains 21 a are composed of a plurality of types of abrasive grains including diamond abrasive grains, the lower limit of the content of the diamond abrasive grains in the first abrasive portion 21 is preferably 1% by volume, and more preferably 2% by volume. On the other hand, the upper limit of the content of the diamond abrasive particles is preferably 20% by volume, and more preferably 8% by volume. If the content of the diamond abrasive grains is less than the lower limit, the grinding force of the abrasive material 1 may be insufficient. On the other hand, if the content of the diamond abrasive grains exceeds the upper limit, the effect of suppressing an increase in the manufacturing cost of the abrasive material 1 may be insufficient.

另外，於所述研磨粒21a由包含金剛石研磨粒的多種研磨粒構成的情況下，金剛石研磨粒的平均粒徑較佳為大於除金剛石研磨粒以外的其他研磨粒的平均粒徑。金剛石研磨粒的平均粒徑相對於除金剛石研磨粒以外的其他研磨粒的平均粒徑的比的下限較佳為1.3，更佳為1.5。另一方面，所述平均粒徑的比的上限較佳為20，更佳為10。若所述平均粒徑的比未滿所述下限，則施加至除金剛石研磨粒以外的研磨粒的研磨壓力變大，且施加至磨削力高的金剛石研磨粒的研磨壓力相對地變小，因此有研磨速率降低之虞。相反，若所述平均粒徑的比超過所述上限，則除金剛石研磨粒以外的研磨粒的脫落過度產生，因此，有因該脫落而第一研磨部21的磨耗快速推進，以致該研磨材1的壽命變短之虞。When the abrasive grains 21 a are composed of a plurality of types of abrasive grains including diamond abrasive grains, the average grain diameter of the diamond abrasive grains is preferably larger than the average grain diameter of other abrasive grains other than the diamond abrasive grains. The lower limit of the ratio of the average particle diameter of the diamond abrasive grains to the average particle diameter of other abrasive grains other than the diamond abrasive grains is preferably 1.3, more preferably 1.5. On the other hand, the upper limit of the ratio of the average particle diameter is preferably 20, and more preferably 10. If the ratio of the average particle diameter is less than the lower limit, the polishing pressure applied to the abrasive grains other than the diamond abrasive grains becomes larger, and the polishing pressure applied to the diamond abrasive grains with higher grinding force becomes relatively smaller, Therefore, there is a concern that the polishing rate may decrease. On the contrary, if the ratio of the average particle diameter exceeds the upper limit, the abrasive grains other than the diamond abrasive grains fall off excessively, and therefore, the abrasion of the first abrasive portion 21 is rapidly advanced due to the peeling, so that the abrasive The life of 1 may be shortened.

（黏合劑） 第一研磨部21的黏合劑21b的主成分並無特別限定，例如可設為樹脂或無機物。(Binder) The main component of the binder 21 b of the first polishing section 21 is not particularly limited, and may be, for example, a resin or an inorganic substance.

所述樹脂可列舉：聚胺基甲酸酯、多酚、環氧樹脂、聚酯、纖維素、乙烯共聚物、聚乙烯基縮醛、聚丙烯酸、丙烯酸酯、聚乙烯醇、聚氯乙烯、聚乙酸乙烯酯、聚醯胺等樹脂。再者，所述樹脂亦可至少一部分進行交聯。Examples of the resin include: polyurethane, polyphenol, epoxy resin, polyester, cellulose, ethylene copolymer, polyvinyl acetal, polyacrylic acid, acrylate, polyvinyl alcohol, polyvinyl chloride, Resins such as polyvinyl acetate and polyamide. Furthermore, the resin may be crosslinked at least in part.

另外，所述無機物可列舉：矽酸鹽、磷酸鹽、多價金屬烷醇鹽等。Examples of the inorganic substance include silicates, phosphates, and polyvalent metal alkoxides.

所述黏合劑21b的主成分可為無機物。其中較佳為研磨粒保持力高的矽酸鹽。此種矽酸鹽可列舉矽酸鈉或矽酸鉀等。The main component of the adhesive 21b may be an inorganic substance. Among them, silicates having high abrasive grain retention are preferred. Examples of such silicates include sodium silicate and potassium silicate.

所述黏合劑21b中，亦可根據目的而適當含有分散劑、偶合劑、界面活性劑、潤滑劑、消泡劑、著色劑等各種助劑及添加劑等。The binder 21b may appropriately contain various auxiliary agents and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoaming agent, and a colorant according to the purpose.

各個第一研磨部21的平均面積的下限較佳為1 mm2 ，更佳為2 mm2 。另一方面，所述第一研磨部21的平均面積的上限較佳為150 mm2 ，更佳為130 mm2 。若所述第一研磨部21的平均面積未滿所述下限，則有第一研磨部21自基材10剝離之虞。相反，若所述第一研磨部21的平均面積超過所述上限，則研磨時與被削體接觸的第一研磨部21的個數變少。例如於被削體的邊緣位於第一研磨部21上的情況與位於槽23上的情況下，有時被削體與第一研磨部21的接觸面積會產生差異，若與被削體接觸的第一研磨部21的個數變少，則該差異容易變大。因此，有研磨時施加至各個研磨粒21a的研磨壓力容易發生變動而研磨精度降低之虞。The lower limit of the average area of each of the first polishing portions 21 is preferably 1 mm 2 , and more preferably 2 mm 2 . On the other hand, the upper limit of the average area of the first polishing portion 21 is preferably 150 mm 2 , and more preferably 130 mm 2 . If the average area of the first polishing portion 21 is less than the lower limit, the first polishing portion 21 may be peeled from the base material 10. On the contrary, if the average area of the first polishing portion 21 exceeds the upper limit, the number of the first polishing portions 21 that are in contact with the workpiece during polishing becomes smaller. For example, when the edge of the workpiece is located on the first grinding part 21 and when it is located on the groove 23, the contact area between the workpiece and the first grinding part 21 may be different. When the number of the first polishing portions 21 is reduced, the difference is likely to increase. Therefore, there is a possibility that the polishing pressure applied to each of the abrasive grains 21a during polishing tends to vary and the polishing accuracy may be reduced.

研磨層20中的所述第一研磨部21的佔有面積率的下限較佳為3%，更佳為4%。另一方面，所述第一研磨部21的佔有面積率的上限較佳為16%，更佳為10%，進而佳為9.5%。若所述第一研磨部21的佔有面積率未滿所述下限，則研磨時施加至第一研磨部21的研磨壓力過度提高，而研磨粒21a容易脫落，因此有研磨速率降低之虞。相反，若所述第一研磨部21的佔有面積率超過所述上限，則有因第一研磨部21的研磨壓力提高而導致研磨速率改善效果不充分之虞。The lower limit of the occupied area ratio of the first polishing portion 21 in the polishing layer 20 is preferably 3%, more preferably 4%. On the other hand, the upper limit of the occupied area ratio of the first polishing portion 21 is preferably 16%, more preferably 10%, and even more preferably 9.5%. If the occupied area ratio of the first polishing portion 21 is less than the lower limit, the polishing pressure applied to the first polishing portion 21 during polishing is excessively increased, and the abrasive grains 21a are liable to fall off, so that the polishing rate may be reduced. Conversely, if the occupied area ratio of the first polishing portion 21 exceeds the upper limit, there is a possibility that the polishing rate improvement effect is insufficient due to the increase in the polishing pressure of the first polishing portion 21.

鄰接的第一研磨部21間的距離（第一研磨部21的中心間的距離）的下限較佳為3 mm，更佳為5 mm。另一方面，所述第一研磨部21間的距離的上限較佳為50 mm，更佳為40 mm。若所述第一研磨部21間的距離未滿所述下限，則難以一面抑制自基材10的剝離一面減小各個第一研磨部21的面積，因此有無法充分降低第一研磨部21的佔有面積率而導致研磨速率改善效果不充分之虞。相反，若所述第一研磨部21間的距離超過所述上限，則有第一研磨部21的佔有面積率過度下降，且第一研磨部21的磨耗快速推進，以致該研磨材1的壽命變短之虞。The lower limit of the distance between the adjacent first polishing portions 21 (the distance between the centers of the first polishing portions 21) is preferably 3 mm, more preferably 5 mm. On the other hand, the upper limit of the distance between the first polishing portions 21 is preferably 50 mm, and more preferably 40 mm. If the distance between the first polishing portions 21 is less than the lower limit, it is difficult to reduce the area of each first polishing portion 21 while suppressing peeling from the base material 10, so that the first polishing portion 21 cannot be sufficiently reduced. Occupying the area ratio may cause insufficient polishing rate improvement effects. On the contrary, if the distance between the first grinding portions 21 exceeds the upper limit, the occupied area ratio of the first grinding portions 21 is excessively reduced, and the abrasion of the first grinding portions 21 is rapidly advanced, so that the life of the grinding material 1 The risk of shortening.

塔柏磨耗試驗中的所述第一研磨部21的磨耗量的下限較佳為0.05 g，更佳為0.08 g。另一方面，塔柏磨耗試驗中的所述第一研磨部21的磨耗量的上限較佳為0.15 g，更佳為0.13 g。若所述第一研磨部21的磨耗量未滿所述下限，則研磨粒21a難以脫落。因此，有第一研磨部21的表面所露出的研磨粒21a容易發生鈍化而研磨速率降低之虞。相反，若所述第一研磨部21的磨耗量超過所述上限，則有該研磨材1的壽命變短之虞。再者，第一研磨部21的磨耗量可主要藉由第一研磨部21的研磨粒21a的含量及黏合劑21b的種類而進行控制。The lower limit of the abrasion amount of the first polishing section 21 in the Taber abrasion test is preferably 0.05 g, and more preferably 0.08 g. On the other hand, the upper limit of the amount of abrasion of the first polishing portion 21 in the Taber abrasion test is preferably 0.15 g, and more preferably 0.13 g. If the amount of abrasion of the first polishing portion 21 does not exceed the lower limit, it is difficult for the abrasive particles 21a to fall off. Therefore, the abrasive grains 21a exposed on the surface of the first polishing section 21 may be easily passivated and the polishing rate may be reduced. On the contrary, if the amount of abrasion of the first polishing portion 21 exceeds the upper limit, the life of the polishing material 1 may be shortened. In addition, the amount of abrasion of the first polishing section 21 can be controlled mainly by the content of the abrasive particles 21 a and the type of the binder 21 b in the first polishing section 21.

＜第二研磨部＞ 第二研磨部22包含研磨粒22a及其黏合劑22b。所述第二研磨部22包圍第一研磨部21的整周，其內周與第一研磨部21的周圍一致。即，由第二研磨部22的內周構成的形狀為與第一研磨部21的俯視形狀相同的形狀。另外，由第二研磨部22的外周構成的形狀（凸狀部24的俯視形狀）並無特別限定，可設為如圖1般與第一研磨部21重心一致且相似的形狀。<Second polishing section> The second polishing section 22 includes abrasive particles 22a and an adhesive 22b. The second polishing portion 22 surrounds the entire periphery of the first polishing portion 21, and the inner periphery thereof coincides with the periphery of the first polishing portion 21. That is, the shape formed by the inner periphery of the second polishing section 22 is the same shape as the plan view shape of the first polishing section 21. In addition, the shape (planar shape of the convex portion 24) formed by the outer periphery of the second polishing portion 22 is not particularly limited, and may be a shape that is consistent with and similar to the center of gravity of the first polishing portion 21 as shown in FIG. 1.

（研磨粒） 第二研磨部22的研磨粒22a可列舉與第一研磨部21的研磨粒21a同樣的研磨粒。(Abrasive Particles) Examples of the abrasive particles 22 a of the second polishing portion 22 are the same as the abrasive particles 21 a of the first polishing portion 21.

第二研磨部22中的所述研磨粒22a的含量的下限較佳為60體積%，更佳為70體積%。另一方面，所述研磨粒22a的含量的上限較佳為95體積%，更佳為80體積%。若所述研磨粒22a的含量未滿所述下限，則相對地黏合劑22b的含量變大，因此研磨粒22a被牢固地固定而難以脫落。因此，第二研磨部22的磨耗量變少，研磨時難以與第一研磨部21之間產生磨耗量的差。藉此，有無法充分提高第一研磨部21的研磨壓力而研磨速率的改善效果不充分之虞。相反，若所述研磨粒22a的含量超過所述上限，則黏合劑22b的含量不足而無法充分將研磨粒22a固定，因此有研磨時第二研磨部22容易損壞之虞。The lower limit of the content of the abrasive particles 22a in the second polishing section 22 is preferably 60% by volume, and more preferably 70% by volume. On the other hand, the upper limit of the content of the abrasive particles 22a is preferably 95% by volume, and more preferably 80% by volume. When the content of the abrasive particles 22a is less than the lower limit, the content of the adhesive 22b is relatively large, and therefore the abrasive particles 22a are firmly fixed and difficult to fall off. Therefore, the amount of abrasion of the second polishing portion 22 is reduced, and it is difficult to cause a difference in the amount of abrasion between the second polishing portion 22 and the first polishing portion 21 during polishing. Thereby, there is a possibility that the polishing pressure of the first polishing section 21 cannot be sufficiently increased and the effect of improving the polishing rate may be insufficient. On the other hand, if the content of the abrasive particles 22a exceeds the upper limit, the content of the binder 22b is insufficient to sufficiently fix the abrasive particles 22a. Therefore, the second abrasive portion 22 may be easily damaged during polishing.

另外，第二研磨部22中的研磨粒22a的含量較佳為大於第一研磨部21中的研磨粒21a的含量。第一研磨部21及第二研磨部22的磨耗主要藉由研磨粒的脫落來進行，且研磨粒的含量多者容易磨耗。因此，藉由使第二研磨部22中的研磨粒22a的含量大於第一研磨部21中的研磨粒21a的含量，可容易控制為使第二研磨部22的磨耗量大於第一研磨部21的磨耗量。The content of the abrasive particles 22 a in the second polishing section 22 is preferably larger than the content of the abrasive particles 21 a in the first polishing section 21. The abrasion of the first polishing section 21 and the second polishing section 22 is mainly performed by dropping off the abrasive grains, and the abrasive grains are easily worn if the content of the abrasive grains is large. Therefore, by making the content of the abrasive grains 22a in the second polishing part 22 larger than the content of the abrasive grains 21a in the first polishing part 21, the amount of wear of the second polishing part 22 can be easily controlled to be larger than that of the first polishing part 21 The amount of wear.

第二研磨部22中的研磨粒22a與第一研磨部21中的研磨粒21a的含量的差的下限較佳為5體積%，更佳為7體積%。另一方面，所述含量的差的上限較佳為20體積%，更佳為15體積%。若所述含量的差未滿所述下限，則有難以控制第一研磨部21與第二研磨部22的磨耗量的比，且因第一研磨部21的研磨壓力提高而導致研磨速率改善效果不充分之虞。相反，若所述含量的差超過所述上限，則有第二研磨部22中的研磨粒22a的含量變得過大而第二研磨部22容易損壞之虞、或者第一研磨部21中的研磨粒21a的含量變得過小而研磨速率降低之虞。The lower limit of the difference between the content of the abrasive particles 22a in the second polishing section 22 and the abrasive particles 21a in the first polishing section 21 is preferably 5% by volume, and more preferably 7% by volume. On the other hand, the upper limit of the content difference is preferably 20% by volume, and more preferably 15% by volume. If the difference in content is less than the lower limit, it is difficult to control the ratio of the abrasion amount of the first polishing portion 21 and the second polishing portion 22, and the polishing rate improvement effect is caused by the increase in the polishing pressure of the first polishing portion 21. Inadequate risk. Conversely, if the difference in the content exceeds the upper limit, the content of the abrasive particles 22a in the second polishing portion 22 may become too large, and the second polishing portion 22 may be easily damaged, or the polishing in the first polishing portion 21 may occur. The content of the particles 21a may become too small and the polishing rate may decrease.

第二研磨部22的研磨粒22a的平均粒徑可根據第二研磨部22的磨耗量的控制性的觀點來適當選擇。所述研磨粒22a的平均粒徑的下限較佳為1 μm，更佳為2 μm。另一方面，所述研磨粒22a的平均粒徑的上限較佳為20 μm，更佳為15 μm。若所述研磨粒22a的平均粒徑未滿所述下限，則有研磨粒22a過於容易脫落而第二研磨部22的磨耗量的控制性變困難之虞。相反，若所述研磨粒22a的平均粒徑超過所述上限，則研磨時所形成的第一研磨部21及第二研磨部22的高度的差與研磨粒22a的平均粒徑的差變得過小，且第二研磨部22的研磨粒22a與被削體接觸，從而有助於磨削的比例提高。因此，有研磨負荷分散於第一研磨部21與第二研磨部22，且因第一研磨部21的研磨壓力提高而導致研磨速率改善效果不充分之虞。The average particle diameter of the abrasive particles 22 a of the second polishing section 22 can be appropriately selected from the viewpoint of the controllability of the amount of wear of the second polishing section 22. The lower limit of the average particle diameter of the abrasive particles 22a is preferably 1 μm, and more preferably 2 μm. On the other hand, the upper limit of the average particle diameter of the abrasive particles 22a is preferably 20 μm, and more preferably 15 μm. If the average particle diameter of the abrasive grains 22 a is less than the lower limit, the abrasive grains 22 a may fall off too easily, and the controllability of the amount of wear of the second abrasive portion 22 may become difficult. Conversely, if the average particle diameter of the abrasive particles 22a exceeds the upper limit, the difference between the height of the first polishing portion 21 and the second polishing portion 22 formed during polishing and the average particle diameter of the polishing particles 22a become different. It is too small, and the abrasive grains 22a of the second polishing section 22 are in contact with the workpiece, so that the ratio that contributes to grinding is increased. Therefore, the polishing load may be dispersed in the first polishing portion 21 and the second polishing portion 22, and the polishing rate improvement effect may be insufficient due to the increase in the polishing pressure of the first polishing portion 21.

所述第二研磨部22的研磨粒22a可由一種研磨粒構成，亦可由多種研磨粒構成。The abrasive grains 22 a of the second polishing unit 22 may be composed of one kind of abrasive grains, or may be composed of a plurality of kinds of abrasive grains.

另外，第二研磨部22中的金剛石研磨粒的含量的上限較佳為0.3體積%，更佳為0.2體積%。金剛石研磨粒為硬質且磨削力高，因此即使與被削體接觸也難以引起鈍化或脫落，且與其他研磨粒相比容易受到大的研磨負荷。因此，若所述第二研磨部22的金剛石研磨粒的含量超過所述上限，則研磨時施加至第二研磨部22的研磨負荷變大。藉此，有研磨負荷分散於第一研磨部21與第二研磨部22，且因第一研磨部21的研磨壓力提高而導致研磨速率改善效果不充分之虞。另外，該研磨材1主要藉由第一研磨部21進行研磨，因此有相對於該研磨材1的製造成本的上升而所獲得的磨削力提升效果不充分之虞。另一方面，所述金剛石研磨粒的含量的下限並無特別限定，可為0體積%，即第二研磨部22可不含有金剛石研磨粒。The upper limit of the content of the diamond abrasive grains in the second polishing section 22 is preferably 0.3% by volume, and more preferably 0.2% by volume. Since diamond abrasive grains are hard and have a high grinding force, they are less likely to cause passivation or peeling even when they come into contact with the workpiece, and are more susceptible to large abrasive loads than other abrasive grains. Therefore, if the content of the diamond abrasive grains in the second polishing section 22 exceeds the upper limit, the polishing load applied to the second polishing section 22 during polishing becomes large. As a result, the polishing load is dispersed in the first polishing section 21 and the second polishing section 22, and the polishing rate improvement effect may be insufficient due to the increase in the polishing pressure of the first polishing section 21. In addition, since the polishing material 1 is mainly polished by the first polishing portion 21, there is a possibility that the effect of improving the grinding force with respect to an increase in the manufacturing cost of the polishing material 1 may be insufficient. On the other hand, the lower limit of the content of the diamond abrasive grains is not particularly limited, and may be 0% by volume, that is, the second abrasive portion 22 may not contain diamond abrasive grains.

（黏合劑） 第二研磨部22的黏合劑22b的主成分可列舉與第一研磨部21的黏合劑21b的主成分同樣者。其中，第二研磨部22的黏合劑22b的主成分較佳為聚丙烯酸、環氧樹脂、聚酯及聚胺基甲酸酯。該些樹脂容易確保對基材10的良好的密接性。另外，該些樹脂與無機物相比研磨粒保持力低，因此研磨粒22a的脫落適度地進行，且容易控制第二研磨部22的磨耗量。(Binder) The main component of the binder 22 b of the second polishing portion 22 may be the same as the main component of the binder 21 b of the first polishing portion 21. Among these, the main component of the adhesive 22b of the second polishing portion 22 is preferably polyacrylic acid, epoxy resin, polyester, and polyurethane. These resins easily ensure good adhesion to the substrate 10. In addition, since these resins have lower abrasive grain holding power than inorganic substances, the abrasive grains 22 a fall off moderately, and it is easy to control the amount of abrasion of the second abrasive portion 22.

所述黏合劑22b中，亦可根據目的而適當含有分散劑、偶合劑、界面活性劑、潤滑劑、消泡劑、著色劑等各種助劑及添加劑等。The binder 22b may appropriately contain various auxiliary agents and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoaming agent, and a colorant according to the purpose.

研磨層20中的所述第二研磨部22的佔有面積率的下限較佳為5%，更佳為15%。另一方面，所述第二研磨部22的佔有面積率的上限較佳為97%，更佳為95%。若所述第二研磨部22的佔有面積率未滿所述下限，則有因被削體落入槽23中而引起的損傷的抑制效果不足之虞。相反，若所述第二研磨部22的佔有面積率超過所述上限，則相對地第一研磨部21的佔有面積率變少，因此第一研磨部21的磨耗得以促進，且難以產生第一研磨部21與第二研磨部22的高度的差。藉此，存在無法充分提高第一研磨部21的研磨壓力而研磨速率的改善效果不充分之虞。The lower limit of the occupied area ratio of the second polishing portion 22 in the polishing layer 20 is preferably 5%, more preferably 15%. On the other hand, the upper limit of the occupied area ratio of the second polishing portion 22 is preferably 97%, and more preferably 95%. If the occupied area ratio of the second polishing portion 22 is less than the lower limit, there is a possibility that the effect of suppressing damage caused by the object to be cut falling into the groove 23 may be insufficient. On the contrary, if the occupied area ratio of the second polishing portion 22 exceeds the upper limit, the occupied area ratio of the first polishing portion 21 is relatively reduced, so that the abrasion of the first polishing portion 21 is promoted and it is difficult to generate the first The difference in height between the polishing section 21 and the second polishing section 22. Thereby, there is a possibility that the polishing pressure of the first polishing section 21 cannot be sufficiently increased and the effect of improving the polishing rate may be insufficient.

研磨層20中的研磨部整體的佔有面積率（所述第一研磨部21與所述第二研磨部22的佔有面積率的和）的下限為15%，更佳為16%，進而佳為25%。若所述研磨部整體的佔有面積率未滿所述下限，則有產生因被削體落入槽等中而引起的損傷之虞。另一方面，所述研磨部整體的佔有面積率的上限為100%。再者，於所述研磨部整體的佔有面積率為100%的情況下，研磨層20不具有槽23，而僅由第一研磨部21及第二研磨部22構成。The lower limit of the occupied area ratio of the entire polishing portion in the polishing layer 20 (the sum of the occupied area ratios of the first polishing portion 21 and the second polishing portion 22) is 15%, more preferably 16%, and even more preferably 25%. If the occupied area ratio of the entire polishing section is less than the lower limit, there is a possibility that damage may be caused due to the workpiece being dropped into a groove or the like. On the other hand, the upper limit of the occupied area ratio of the entire polishing portion is 100%. When the occupied area ratio of the entire polishing section is 100%, the polishing layer 20 does not have the grooves 23 and is composed of only the first polishing section 21 and the second polishing section 22.

塔柏磨耗試驗中的所述第二研磨部22的磨耗量的下限較佳為0.3 g，更佳為0.4 g。若所述第二研磨部22的磨耗量未滿所述下限，則研磨時難以與第一研磨部21之間產生因磨耗量的差異而引起的高度的差。藉此有無法充分提高第一研磨部21的研磨壓力，且研磨速率的改善效果不充分之虞。另一方面，所述第二研磨部的磨耗量的上限並無特別限定，通常為0.8 g左右。The lower limit of the abrasion amount of the second polishing section 22 in the Taber abrasion test is preferably 0.3 g, more preferably 0.4 g. If the amount of abrasion of the second polishing portion 22 is less than the lower limit, it is difficult to cause a difference in height between the first polishing portion 21 and the first polishing portion 21 due to a difference in the amount of abrasion. As a result, the polishing pressure of the first polishing section 21 cannot be sufficiently increased, and the effect of improving the polishing rate may be insufficient. On the other hand, the upper limit of the amount of wear of the second polishing section is not particularly limited, but is usually about 0.8 g.

塔柏磨耗試驗中的所述第二研磨部22的磨耗量相對於所述第一研磨部21的磨耗量的比的下限為3，更佳為3.5，進而佳為4。若所述磨耗量的比未滿所述下限，則研磨時難以與第一研磨部21之間產生因磨耗量的差異而引起的階差。藉此有無法充分提高第一研磨部21的研磨壓力，且研磨速率的改善效果不充分之虞。另一方面，所述磨耗量的比的上限並無特別限定，為15左右。The lower limit of the ratio of the amount of abrasion of the second polishing portion 22 to the amount of abrasion of the first polishing portion 21 in the Taber abrasion test is 3, more preferably 3.5, and even more preferably 4. If the ratio of the abrasion amount is less than the lower limit, it is difficult to generate a step due to a difference in abrasion amount between the abrasion amount and the first polishing portion 21 during polishing. As a result, the polishing pressure of the first polishing section 21 cannot be sufficiently increased, and the effect of improving the polishing rate may be insufficient. On the other hand, the upper limit of the ratio of the abrasion amount is not particularly limited, but is about 15.

再者，於將該研磨材1用於研磨之前，第一研磨部21與第二研磨部22可如圖2所示，表面為同一平面而無階差，亦可預先設置於研磨時產生的程度的階差、即平均高度為30 μm以上且60 μm以下的階差。Furthermore, before the polishing material 1 is used for polishing, the first polishing portion 21 and the second polishing portion 22 may be shown in FIG. 2, and the surfaces are on the same plane without step, and may be set in advance during the polishing. A step with a degree, that is, a step with an average height of 30 μm or more and 60 μm or less.

＜槽＞ 槽23於研磨層20的表面配設為等間隔的格子狀。另外，所述槽23的底面是由基材10的表面所構成。<Grooves> The grooves 23 are arranged on the surface of the polishing layer 20 in a regular grid pattern. The bottom surface of the groove 23 is composed of the surface of the base material 10.

所述槽23的平均寬度的上限較佳為10 mm，更佳為8 mm。若所述槽23的平均寬度超過所述上限，則凸狀部24的佔有面積率無法充分確保，且研磨時被削體容易落入槽23中，因此有被削體產生損傷之虞。另一方面，所述槽23的平均寬度的下限並無特別限定，可為0 mm，即該研磨材1可為不具有槽23的構成。The upper limit of the average width of the grooves 23 is preferably 10 mm, more preferably 8 mm. If the average width of the grooves 23 exceeds the upper limit, the occupied area ratio of the convex portions 24 cannot be sufficiently ensured, and the workpiece to be dropped into the grooves 23 during polishing may be damaged. On the other hand, the lower limit of the average width of the grooves 23 is not particularly limited, and may be 0 mm, that is, the abrasive material 1 may have a structure without the grooves 23.

[接著層] 接著層30為將該研磨材1固定於用以支持該研磨材1並安裝於研磨裝置的支持體的層。[Adhesive Layer] The adhesive layer 30 is a layer that fixes the abrasive material 1 to a support for supporting the abrasive material 1 and is mounted on a polishing device.

該接著層30中使用的接著劑並無特別限定，例如可列舉：反應型接著劑、瞬間接著劑、熱熔接著劑、作為可重新貼的接著劑的黏著劑等。The adhesive used in the adhesive layer 30 is not particularly limited, and examples thereof include a reactive adhesive, an instant adhesive, a hot-melt adhesive, and an adhesive that is a reattachable adhesive.

該接著層30中使用的接著劑較佳為黏著劑。藉由使用黏著劑來作為接著層30中使用的接著劑，可自支持體剝離該研磨材1而重新貼，因此容易實現該研磨材1及支持體的再利用。此種黏著劑並無特別限定，例如可列舉：丙烯酸系黏著劑、丙烯酸-橡膠系黏著劑、天然橡膠系黏著劑、丁基橡膠系等合成橡膠系黏著劑、矽酮系黏著劑、聚胺基甲酸酯系黏著劑等。The adhesive used in this adhesive layer 30 is preferably an adhesive. By using an adhesive as the adhesive used in the adhesive layer 30, the abrasive material 1 can be peeled off from the support and reattached. Therefore, it is easy to reuse the abrasive material 1 and the support. Such an adhesive is not particularly limited, and examples thereof include acrylic adhesives, acrylic-rubber adhesives, natural rubber adhesives, synthetic rubber adhesives such as butyl rubber adhesives, silicone adhesives, and polyamines. Carbamate-based adhesives and the like.

接著層30的平均厚度的下限較佳為0.05 mm，更佳為0.1 mm。另外，接著層30的平均厚度的上限較佳為0.3 mm，更佳為0.2 mm。於接著層30的平均厚度未滿所述下限的情況下，接著力不足，有該研磨材1自支持體剝離之虞。另一方面，於接著層30的平均厚度超過所述上限的情況下，有例如因接著層30的厚度而當將該研磨材1切割為所需形狀時造成障礙等作業性降低之虞。The lower limit of the average thickness of the subsequent layer 30 is preferably 0.05 mm, and more preferably 0.1 mm. The upper limit of the average thickness of the adhesive layer 30 is preferably 0.3 mm, and more preferably 0.2 mm. When the average thickness of the adhesive layer 30 is less than the lower limit, the adhesive force is insufficient, and the abrasive material 1 may peel from the support. On the other hand, when the average thickness of the adhesive layer 30 exceeds the said upper limit, there exists a possibility that workability | operativity, such as an obstacle, will fall when the abrasive 1 is cut into a desired shape due to the thickness of the adhesive layer 30.

[研磨材的製造方法] 該研磨材1可藉由以下步驟來製造：準備第一研磨部用組成物的步驟、準備第二研磨部用組成物的步驟、藉由第一研磨部用組成物的印刷而形成所述第一研磨部21的步驟、藉由第二研磨部用組成物的印刷而形成所述第二研磨部22的步驟、以及於基材10的背面側積層接著層30的步驟。[Manufacturing Method of Abrasive Material] The abrasive material 1 can be produced by a step of preparing a composition for a first polishing section, a step of preparing a composition for a second polishing section, and a composition for a first polishing section. A step of forming the first polishing portion 21 by printing, a step of forming the second polishing portion 22 by printing of a composition for a second polishing portion, and a step of laminating the adhesive layer 30 on the back surface side of the substrate 10 step.

首先，於第一研磨部用組成物準備步驟中，準備使第一研磨部用組成物（第一研磨部21的研磨粒21a及黏合劑21b的形成材料）分散於溶劑中而成的溶液作為塗敷液。作為所述溶劑，只要黏合劑21b的形成材料可溶，則並無特別限定。具體而言可使用：甲基乙基酮（methyl ethyl ketone，MEK）、異佛爾酮、萜品醇、N-甲基吡咯啶酮、環己酮、碳酸伸丙酯等。為了控制塗敷液的黏度或流動性，亦可添加水、醇、酮、乙酸酯、芳香族化合物等稀釋劑等。First, in the first step for preparing a composition for a polishing section, a solution prepared by dispersing a composition for a first polishing section (a material for forming the abrasive particles 21a of the first polishing section 21 and a binder 21b) in a solvent is prepared as a solution. Coating fluid. The solvent is not particularly limited as long as the material forming the binder 21b is soluble. Specifically, methyl ethyl ketone (MEK), isophorone, terpineol, N-methylpyrrolidone, cyclohexanone, propylene carbonate and the like can be used. In order to control the viscosity or fluidity of the coating liquid, water, alcohol, ketone, acetate, aromatic compounds, and other diluents may be added.

繼而，於第二研磨部用組成物準備步驟中，與第一研磨部用組成物準備步驟的塗敷液同樣地，準備使第二研磨部用組成物（第二研磨部22的研磨粒22a及黏合劑22b的形成材料）分散於溶劑中而成的溶液作為塗敷液。再者，該第二研磨部用組成物準備步驟可於第一研磨部用組成物準備步驟之前、或者第一研磨部形成步驟之後進行。Next, in the composition preparation step for the second polishing section, the composition for the second polishing section (the abrasive particles 22a of the second polishing section 22) is prepared in the same manner as the coating liquid in the composition preparation step for the first polishing section. A solution obtained by dispersing the binder and the forming material of the adhesive 22b in a solvent serves as a coating liquid. In addition, the composition preparation step for the second polishing section may be performed before the composition preparation step for the first polishing section or after the first polishing section forming step.

繼而，於第一研磨部形成步驟中，使用於第一研磨部用組成物準備步驟中準備的塗敷液，藉由印刷法而於基材10表面形成多個第一研磨部21。具體而言，準備具有與該第一研磨部21的反轉形狀相對應的形狀的遮罩，介隔該遮罩而印刷所述塗敷液。該印刷方式例如可使用網版印刷、金屬遮罩印刷等。Next, in the first polishing portion forming step, a plurality of first polishing portions 21 are formed on the surface of the substrate 10 by a printing method using the coating liquid prepared in the first polishing portion composition preparing step. Specifically, a mask having a shape corresponding to the inverse shape of the first polishing section 21 is prepared, and the coating liquid is printed through the mask. This printing method can be, for example, screen printing, metal mask printing, or the like.

藉由使該經印刷的塗敷液加熱脫水以及加熱硬化而形成第一研磨部21。具體而言，使所述塗敷液於室溫（25℃）下乾燥及加熱脫水後，使其加熱硬化，從而形成第一研磨部21。The first polishing portion 21 is formed by heating, dehydrating, and thermally curing the printed coating liquid. Specifically, the coating solution is dried at room temperature (25 ° C.) and heated and dehydrated, and then heated and hardened to form the first polishing portion 21.

繼而，於第二研磨部形成步驟中，使用於所述第二研磨部用組成物準備步驟中準備的塗敷液，藉由印刷法而形成包圍第一研磨部21的第二研磨部22。具體而言，準備具有與該第二研磨部22的反轉形狀相對應的形狀的遮罩，介隔該遮罩而印刷所述塗敷液。該印刷方式例如可使用刮板印刷、棒塗機印刷、敷料器印刷等。再者，所述第二研磨部形成步驟亦可於所述第一研磨部形成步驟之前、或者與第一研磨部形成步驟同時進行。Next, in the second polishing portion forming step, the second polishing portion 22 surrounding the first polishing portion 21 is formed by a printing method using the coating liquid prepared in the composition preparation step for the second polishing portion. Specifically, a mask having a shape corresponding to the inverse shape of the second polishing section 22 is prepared, and the coating liquid is printed through the mask. This printing method can use, for example, blade printing, bar coater printing, and applicator printing. In addition, the second polishing portion forming step may be performed before the first polishing portion forming step or concurrently with the first polishing portion forming step.

藉由使該經印刷的塗敷液加熱硬化而形成第二研磨部22。具體而言，使所述塗敷液加熱硬化，從而形成第二研磨部22。The second polishing portion 22 is formed by heating and hardening the printed coating liquid. Specifically, the coating liquid is heated and hardened to form the second polishing portion 22.

最後，於接著層積層步驟中，於基材10的背面側積層接著層30。具體而言，例如將預先形成的膠帶狀的接著層30貼附於基材10的背面。再者，該接著層積層步驟亦能夠於第二研磨部形成步驟之前進行。Finally, in the subsequent laminating step, an adhesive layer 30 is laminated on the back side of the substrate 10. Specifically, for example, a tape-shaped adhesive layer 30 formed in advance is attached to the back surface of the base material 10. Moreover, this step of subsequent lamination can also be performed before the step of forming the second polishing portion.

[優點] 該研磨材1具備第一研磨部21、及包圍所述第一研磨部21的第二研磨部22，塔柏磨耗試驗中的所述第二研磨部22的磨耗量相對於所述第一研磨部21的磨耗量的比為3以上。因此，若使用該研磨材1進行研磨，則包圍第一研磨部21的第二研磨部22先磨耗。藉此，自研磨開始起較短時間內，於第一研磨部21與第二研磨部22之間產生階差，以使第二研磨部22的高度低。另外，該研磨部的磨耗主要藉由研磨粒的脫落而於第一研磨部21及第二研磨部22一起進行，因此，一面維持該階差一面對被削體進行研磨。因而，第一研磨部21主要受到研磨時所施加的研磨負荷，因此，第一研磨部21的研磨壓力提高，藉此該研磨材1的磨削力提高。另外，關於該研磨材1，所述第二研磨部22包圍所述第一研磨部21，且將所述研磨層20中的所述研磨部整體的佔有面積率設為15%以上且100%以下。因此，關於該研磨材1，當研磨時被削體的端部於第一研磨部21之間移動時，藉由所述第二研磨部22可抑制被削體向基材側傾斜。因而，該研磨材1可抑制因被削體落入槽23等中而引起的損傷。[Advantage] The abrasive material 1 includes a first abrasive portion 21 and a second abrasive portion 22 surrounding the first abrasive portion 21. The amount of abrasion of the second abrasive portion 22 in the Taber abrasion test is relative to the abrasion amount. The ratio of the abrasion amount of the first polishing section 21 is 3 or more. Therefore, if the polishing material 1 is used for polishing, the second polishing portion 22 surrounding the first polishing portion 21 is worn first. Thereby, a step is generated between the first polishing portion 21 and the second polishing portion 22 in a short time from the start of polishing, so that the height of the second polishing portion 22 is low. In addition, the abrasion of the polishing section is mainly performed together with the first polishing section 21 and the second polishing section 22 by dropping of the abrasive particles. Therefore, the surface is polished while maintaining the step. Therefore, the first polishing portion 21 is mainly subjected to the polishing load applied during polishing. Therefore, the polishing pressure of the first polishing portion 21 is increased, and thereby the grinding force of the polishing material 1 is increased. In the polishing material 1, the second polishing portion 22 surrounds the first polishing portion 21, and an area ratio of the entire polishing portion in the polishing layer 20 is 15% or more and 100%. the following. Therefore, in the polishing material 1, when the end portion of the object to be cut moves between the first polishing portions 21 during polishing, the second polishing portion 22 can suppress the object to be tilted toward the base material side. Therefore, the abrasive material 1 can suppress damage caused by the object being dropped in the groove 23 and the like.

[其他實施形態] 本發明並不限定於所述實施形態，除了所述態樣以外，可以實施了各種變更、改良的態樣而實施。[Other Embodiments] The present invention is not limited to the embodiments described above, and various modifications and improvements can be implemented in addition to the aspects described above.

所述實施形態中，對多個第一研磨部規則地排列為方塊圖案狀的情況進行了說明，但多個第一研磨部的排列並不限定於此。例如多個第一研磨部亦可於正交的X方向與Y方向上以不同的間隔而排列。In the said embodiment, although the case where the several 1st grinding | polishing part was regularly arranged in a square pattern was demonstrated, the arrangement of a some 1st grinding | polishing part is not limited to this. For example, the plurality of first polishing portions may be arranged at different intervals in the orthogonal X direction and the Y direction.

所述實施形態中，將槽構成為等間隔的格子狀，但格子的間隔及平面形狀並不限定於所述實施形態。另外，所述實施形態中，設為槽的底面為基材的表面的構成，但亦可為槽的深度小於研磨層的平均厚度，槽不到達基材的表面。In the said embodiment, although the groove | channel was comprised in the grid | lattice form of equal interval, the space | interval and planar shape of a grid are not limited to the said embodiment. Moreover, in the said embodiment, although the bottom surface of a groove | channel was set as the surface of a base material, the depth of a groove | channel is smaller than the average thickness of a polishing layer, and a groove | channel does not reach the surface of a base material.

另外，所述實施形態中，對槽劃分第二研磨部的構成進行了說明，但槽的構成並不限定於此。例如如圖3所示，槽23亦可配設於第一研磨部21與第二研磨部22之間。該情況下，槽23可以包圍第一研磨部21的周圍的方式進行配設，但亦可以與第一研磨部21的一部分相接的方式進行配設。Moreover, in the said embodiment, although the structure which divide | segmented the 2nd grinding | polishing part was demonstrated, the structure of a groove is not limited to this. For example, as shown in FIG. 3, the groove 23 may be disposed between the first polishing portion 21 and the second polishing portion 22. In this case, the grooves 23 may be arranged so as to surround the periphery of the first polishing section 21, but may be arranged so as to be in contact with a part of the first polishing section 21.

另外，該研磨材亦可為不具有槽的結構。The polishing material may have a structure without grooves.

所述實施形態中，對由第二研磨部的外周構成的形狀為與第一研磨部相似的形狀這一情況進行了說明，但所述第二研磨部的形狀並不限定於與第一研磨部相似的形狀。例如如圖4所示，亦可將第一研磨部21設為圓形狀，且將由第二研磨部22的外周構成的形狀設為方形狀。In the said embodiment, the case where the shape which consists of the outer periphery of a 2nd grinding | polishing part is similar to the shape of a 1st grinding | polishing part was demonstrated, However, the shape of the said 2nd grinding | polishing part is not limited to 1st grinding | polishing Similar shapes. For example, as shown in FIG. 4, the first polishing portion 21 may be formed in a circular shape, and the shape formed by the outer periphery of the second polishing portion 22 may be formed in a square shape.

所述實施形態中，對一個第二研磨部包圍一個第一研磨部的情況進行了說明，但亦可如圖5所示，一個第二研磨部22包圍多個第一研磨部21。In the embodiment described above, a case where one second polishing portion surrounds one first polishing portion has been described, but as shown in FIG. 5, one second polishing portion 22 may surround a plurality of first polishing portions 21.

另外，第二研磨部可不包圍第一研磨部的整周，亦可如圖6所示於一部分上存在缺口。再者，自抑制因被削體落入至缺口等中而引起的損傷的觀點考慮，於第一研磨部21的整周，與所述第二研磨部22相向的部分的長度為90%以上、較佳為95%以上。In addition, the second polishing portion may not surround the entire circumference of the first polishing portion, or a gap may be formed in a part as shown in FIG. 6. In addition, from the viewpoint of suppressing damage caused by the object being dropped into the notch or the like, the length of the portion facing the second polishing portion 22 over the entire circumference of the first polishing portion 21 is 90% or more. It is preferably 95% or more.

所述實施形態中，對研磨層具有塔柏磨耗試驗中的磨耗量不同的兩種研磨部的情況進行了說明，但研磨層亦可具有三種以上研磨部。該情況下，所述磨耗量最小的研磨部為第一研磨部，剩餘的兩種以上研磨部為其他研磨部（相當於所述實施形態的第二研磨部）。作為所述其他研磨部的構成，只要由其他研磨部將第一研磨部包圍，則並無特別限定。作為該其他研磨部的構成，例如可列舉：如圖7所示第一研磨部21由第一其他研磨部25包圍，進而該第一其他研磨部25由第二其他研磨部26包圍的構成、或者如圖8所示第一其他研磨部25及第二其他研磨部26沿第一研磨部21的周圍交替配設，且由該交替配設的其他研磨部整體以環狀將第一研磨部21包圍的構成等。In the embodiment described above, the case where the polishing layer has two types of polishing portions having different abrasion amounts in the Taber abrasion test has been described, but the polishing layer may have three or more types of polishing portions. In this case, the polishing section having the smallest amount of wear is the first polishing section, and the remaining two or more types of polishing sections are other polishing sections (corresponding to the second polishing section of the embodiment). The configuration of the other polishing section is not particularly limited as long as the first polishing section is surrounded by the other polishing section. Examples of the configuration of the other polishing section include a configuration in which the first polishing section 21 is surrounded by the first other polishing section 25 and the first other polishing section 25 is surrounded by the second other polishing section 26 as shown in FIG. 7. Alternatively, as shown in FIG. 8, the first other polishing section 25 and the second other polishing section 26 are alternately arranged along the periphery of the first polishing section 21, and the first polishing section is annularly formed as a whole by the alternately disposed other polishing sections. 21 surrounded by the composition and so on.

進而，如圖9所示，該研磨材2亦可具備：隔著背面側的接著層30而積層的支持體40、以及積層於該支持體40的背面側的第二接著層31。藉由該研磨材2具備支持體40，而容易進行該研磨材2的操作。Further, as shown in FIG. 9, the polishing material 2 may further include a support 40 laminated on the back surface of the adhesive layer 30 and a second adhesive layer 31 laminated on the back surface of the support 40. Since the polishing material 2 is provided with a support 40, the operation of the polishing material 2 is easy.

所述支持體40的主成分可列舉：聚丙烯、聚乙烯、聚四氟乙烯、聚氯乙烯等具有熱塑性的樹脂，或聚碳酸酯、聚醯胺、聚對苯二甲酸乙二酯等工程塑膠。藉由對所述支持體40的主成分使用此種材料，所述支持體40具有可撓性，該研磨材2追隨被削體的表面形狀，研磨面與被削體容易接觸，因此研磨速率進一步提升。Examples of the main component of the support 40 include thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene, and polyvinyl chloride, or processes such as polycarbonate, polyamide, and polyethylene terephthalate. plastic. By using such a material as the main component of the support body 40, the support body 40 is flexible. The abrasive material 2 follows the shape of the surface of the object to be cut, and the polishing surface and the object to be contacted easily, so the polishing rate Further improvement.

所述支持體40的平均厚度例如可設為0.5 mm以上且3 mm以下。於所述支持體40的平均厚度未滿所述下限的情況下，有該研磨材2的強度不足之虞。另一方面，於所述支持體40的平均厚度超過所述上限的情況下，有難以將所述支持體40安裝於研磨裝置上之虞或者所述支持體40的可撓性不足之虞。The average thickness of the support 40 may be, for example, 0.5 mm or more and 3 mm or less. When the average thickness of the support 40 is less than the lower limit, the strength of the abrasive 2 may be insufficient. On the other hand, when the average thickness of the support body 40 exceeds the upper limit, there is a possibility that it may be difficult to mount the support body 40 on a polishing apparatus or the flexibility of the support body 40 may be insufficient.

所述第二接著層31可使用與接著層30同樣的接著劑。另外，第二接著層31可設為與接著層30同樣的平均厚度。 [實施例]The second adhesive layer 31 can use the same adhesive as the adhesive layer 30. The second adhesive layer 31 may have the same average thickness as that of the adhesive layer 30. [Example]

以下，列舉實施例及比較例來對本發明進一步詳細說明，但該發明並不限定於以下的實施例。Hereinafter, the present invention will be described in more detail with examples and comparative examples, but the present invention is not limited to the following examples.

[實施例1] 將金剛石研磨粒（55質量%鎳塗佈處理金剛石，平均粒徑35 μm）、氧化鋁研磨粒（Al2 O3 ，電熔氧化鋁，平均粒徑12 μm）、以及作為黏合劑的矽酸鹽（3號矽酸鈉）混合，以使金剛石研磨粒的第一研磨部中的含量成為5體積%以及氧化鋁研磨粒的第一研磨部中的含量成為71體積%的方式進行製備，而獲得第一研磨部用組成物的塗敷液。[Example 1] Diamond abrasive grains (55 mass% nickel-coated diamond, average particle diameter 35 μm), alumina abrasive grains (Al 2 O 3 , fused alumina, average particle diameter 12 μm), and as The silicate (sodium silicate No. 3) of the binder is mixed so that the content in the first grinding portion of the diamond abrasive grains becomes 5 vol% and the content in the first grinding portion of the alumina abrasive grains becomes 71 vol% The coating liquid was prepared by the method described above, and a composition for the first polishing portion was obtained.

另外，將氧化鋁研磨粒（白色氧化鋁WA#1000，平均粒徑12 μm）、作為黏合劑的環氧樹脂（三鍵控股（Threebond Holdings）股份有限公司的「TB2022」）、以及環氧樹脂硬化劑（三鍵控股（Threebond Holdings）股份有限公司的「TB2105C」），以使氧化鋁研磨粒的第二研磨部中的含量成為85體積%的方式進行製備，而獲得第二研磨部用組成物的塗敷液。In addition, alumina abrasive particles (white alumina WA # 1000, average particle size 12 μm), epoxy resin ("TB2022" of Threebond Holdings Co., Ltd.) as an adhesive, and epoxy resin A hardener ("TB2105C" from Threebond Holdings Co., Ltd.) is prepared so that the content in the second grinding section of the alumina abrasive grains is 85% by volume, and a composition for the second grinding section is obtained.物 的 应用 液 Liquid for coating.

準備平均厚度300 μm的鋁板作為基材，使用所述第一研磨部用組成物的塗敷液，藉由印刷於該基材的表面形成多個第一研磨部。所述多個第一研磨部為規則地排列的方塊圖案狀，鄰接的第一研磨部的中心間的距離為10 mm。再者，印刷使用具有與第一研磨部的反轉形狀相對應的圖案的遮罩。各個第一研磨部設為面積9 mm2 （俯視時一邊為3 mm的正方形狀），將第一研磨部的平均厚度設為500 μm。再者，第一研磨部於研磨層中的面積佔有率設為9%。An aluminum plate having an average thickness of 300 μm was prepared as a substrate, and a plurality of first polishing portions were formed by printing on the surface of the substrate using the coating liquid of the composition for a first polishing portion. The plurality of first polishing portions are regularly arranged in a square pattern, and the distance between the centers of adjacent first polishing portions is 10 mm. Furthermore, a mask having a pattern corresponding to the inverse shape of the first polishing portion was used for printing. Each first polishing portion was set to an area of 9 mm 2 (a square shape with a side of 3 mm in plan view), and the average thickness of the first polishing portion was 500 μm. The area occupancy of the first polishing portion in the polishing layer was 9%.

再者，塗敷液於室溫（25℃）下進行乾燥及加熱脫水後，進行加熱硬化。Furthermore, the coating liquid was dried and heated and dehydrated at room temperature (25 ° C), and then heat-hardened.

另外，使用平均厚度1 mm的硬質氯乙烯樹脂板作為支持基材並固定於研磨裝置的支持體，利用平均厚度130 μm的黏著劑將所述基材的背面與所述支持體的表面貼合。所述黏著劑使用雙面膠帶（積水化學股份有限公司的「#5605HGD」）。In addition, a rigid vinyl chloride resin plate having an average thickness of 1 mm was used as a support substrate and fixed to a support of a polishing apparatus, and the back surface of the substrate was bonded to the surface of the support with an adhesive having an average thickness of 130 μm. . As the adhesive, a double-sided tape ("# 5605HGD" of Sekisui Chemical Co., Ltd.) was used.

繼而，使用所述第二研磨部用組成物的塗敷液，藉由印刷以包圍第一研磨部的方式形成第二研磨部。各個第二研磨部設為面積81 mm2 （俯視時外周為一邊9.5 mm的正方形狀）。第二研磨部的平均厚度設為與第一研磨部的平均厚度為相同值。第二研磨部於研磨層中的面積佔有率為81%，且研磨層中的研磨部整體的面積佔有率設為90%。再者，研磨層的剩餘部分的10%為槽，所述槽設為平均寬度為0.5 mm的格子狀。Then, the second polishing portion is formed by printing so as to surround the first polishing portion by using the coating liquid of the composition for the second polishing portion. Each of the second polishing portions is set to an area of 81 mm 2 (the outer periphery has a square shape with a side of 9.5 mm in plan view). The average thickness of the second polishing section is set to the same value as the average thickness of the first polishing section. The area occupancy ratio of the second polishing portion in the polishing layer was 81%, and the area occupancy ratio of the entire polishing portion in the polishing layer was set to 90%. Furthermore, 10% of the remaining portion of the polishing layer is a groove, and the groove is formed in a grid shape having an average width of 0.5 mm.

再者，對塗敷液進行加熱乾燥。以此種方式獲得實施例1的研磨材。In addition, the coating liquid was heated and dried. In this way, the abrasive material of Example 1 was obtained.

[實施例2、實施例3、比較例3] 除了將第一研磨部的佔有面積率、第二研磨部的佔有面積率、及研磨部整體的佔有面積率設為表1所示的值以外，以與實施例1同樣的方式獲得實施例2及實施例3的研磨材。[Example 2, Example 3, Comparative Example 3] Except that the occupied area ratio of the first polishing portion, the occupied area ratio of the second polishing portion, and the occupied area ratio of the entire polishing portion were the values shown in Table 1. In the same manner as in Example 1, the abrasive materials of Examples 2 and 3 were obtained.

[實施例4] 將金剛石研磨粒（55質量%鎳塗佈處理金剛石，平均粒徑35 μm）、氧化鋁研磨粒（白色氧化鋁WA#1000，平均粒徑12 μm）、作為黏合劑的環氧樹脂（三鍵控股（Threebond Holdings）股份有限公司的「TB2022」）、以及環氧樹脂硬化劑（三鍵控股（Threebond Holdings）股份有限公司的「TB2105C」）混合，以使金剛石研磨粒的第二研磨部中的含量成為0.2體積%、以及氧化鋁研磨粒的第二研磨部中的含量成為84.8體積%的方式進行製備，而獲得第二研磨部用組成物的塗敷液。[Example 4] Diamond abrasive particles (55 mass% nickel-coated diamond, average particle size 35 μm), alumina abrasive particles (white alumina WA # 1000, average particle diameter 12 μm), and a ring as a binder Oxygen resin ("TB2022" of Threebond Holdings) and epoxy hardener ("TB2105C" of Threebond Holdings) are mixed to make the diamond abrasive particles the first The coating liquid of the composition for a 2nd grinding | polishing part was prepared so that content in the 2nd grinding | polishing part might become 0.2 volume%, and the content in the 2nd grinding | polishing part of alumina abrasive grains became 84.8 volume%.

除了使用所述第二研磨部用組成物以外，以與實施例1同樣的方式獲得實施例4的研磨材。A polishing material of Example 4 was obtained in the same manner as in Example 1 except that the composition for a second polishing portion was used.

[實施例5] 除了將第二研磨部於研磨層中的面積佔有率設為91%、以及研磨層中的研磨部整體的面積佔有率設為100%，且將研磨層設為不具有槽的構成以外，以與實施例1同樣的方式獲得實施例5的研磨材。[Example 5] Except that the area occupancy ratio of the second polishing portion in the polishing layer was set to 91%, and the area occupancy ratio of the entire polishing portion in the polishing layer was set to 100%, and the polishing layer was set to have no groove. A polishing material of Example 5 was obtained in the same manner as in Example 1 except for the structure.

[實施例6] 將氧化鋁研磨粒（白色氧化鋁WA#1000，平均粒徑12 μm）、及作為黏合劑的丙烯酸（三菱麗陽（Mitsubishi Rayon）股份有限公司的「蒂阿諾（Dianal）BR-80」）混合，以使氧化鋁研磨粒於第二研磨部中的含量成為85體積%的方式進行製備，而獲得第二研磨部用組成物的塗敷液。[Example 6] Alumina abrasive grains (white alumina WA # 1000, average particle diameter 12 μm) and acrylic ("Dianal" by Mitsubishi Rayon Co., Ltd.) as a binder BR-80 ") was mixed so that the content of the alumina abrasive particles in the second polishing section was 85% by volume, and a coating liquid of a composition for the second polishing section was obtained.

除了使用所述第二研磨部用組成物以外，以與實施例5同樣的方式獲得實施例6的研磨材。A polishing material of Example 6 was obtained in the same manner as in Example 5 except that the composition for a second polishing portion was used.

[比較例1] 將碳化矽研磨粒（綠色金剛砂（green carborundum），平均粒徑30 μm）、氧化鋁研磨粒（白色氧化鋁WA#1000，平均粒徑12 μm）、作為黏合劑的矽酸鹽（3號矽酸鈉）混合，以使碳化矽研磨粒於第二研磨部中的含量成為30體積%、以及氧化鋁研磨粒於第二研磨部中的含量成為46體積%的方式進行製備，而獲得第二研磨部用組成物的塗敷液。[Comparative Example 1] Silicon carbide abrasive grains (green carborundum, average particle size 30 μm), alumina abrasive grains (white alumina WA # 1000, average particle size 12 μm), and silicic acid as a binder The salt (sodium silicate No. 3) was mixed so that the content of the silicon carbide abrasive particles in the second polishing section would be 30% by volume and the content of the alumina abrasive particles in the second polishing section would be 46% by volume. Thus, a coating liquid of a composition for a second polishing portion was obtained.

除了使用所述第二研磨部用組成物以外，以與實施例5同樣的方式獲得比較例1的研磨材。A polishing material of Comparative Example 1 was obtained in the same manner as in Example 5 except that the composition for a second polishing portion was used.

[比較例2] 將金剛石研磨粒（55質量%鎳塗佈處理金剛石，平均粒徑35 μm）、氧化鋁研磨粒（白色氧化鋁WA#1000，平均粒徑12 μm）、作為黏合劑的矽酸鹽（3號矽酸鈉）混合，以使碳化矽研磨粒於第二研磨部中的含量成為2.5體積%、以及氧化鋁研磨粒於第二研磨部中的含量成為77.5體積%的方式進行製備，而獲得第二研磨部用組成物的塗敷液。[Comparative Example 2] Diamond abrasive particles (55 mass% nickel-coated diamond, average particle size 35 μm), alumina abrasive particles (white alumina WA # 1000, average particle diameter 12 μm), and silicon as a binder Acid salt (sodium silicate No. 3) was mixed so that the content of the silicon carbide abrasive particles in the second polishing section was 2.5% by volume and the content of the alumina abrasive particles in the second polishing section was 77.5% by volume. The coating liquid of the composition for a 2nd grinding | polishing part was prepared.

除了使用所述第二研磨部用組成物以外，以與實施例1同樣的方式獲得比較例2的研磨材。A polishing material of Comparative Example 2 was obtained in the same manner as in Example 1 except that the composition for a second polishing portion was used.

[研磨條件] 使用所述實施例1～實施例6及比較例1～比較例3中所獲得的研磨材進行藍寶石基板的研磨。對於所述藍寶石基板，使用直徑5.08 cm、比重3.97的c面的藍寶石基板。所述研磨中，使用公知的雙面研磨機。雙面研磨機的載體為厚度0.4 mm的環氧樹脂玻璃。將研磨壓力設為200 g/cm2 ，於上壓盤轉速25 rpm、下壓盤轉速50 rpm及太陽齒輪轉速8 rpm的條件下進行研磨。此時，作為冷卻劑（coolant），每分鐘供給30 cc的出光興產股份有限公司的「達夫尼卡特（Daphne Cut）GS50K」。[Polishing Conditions] The sapphire substrate was polished using the polishing materials obtained in Examples 1 to 6 and Comparative Examples 1 to 3 described above. As the sapphire substrate, a c-plane sapphire substrate having a diameter of 5.08 cm and a specific gravity of 3.97 was used. For the polishing, a known double-side polishing machine is used. The carrier of the double-side grinder is epoxy glass with a thickness of 0.4 mm. The grinding pressure was set to 200 g / cm 2 , and grinding was performed under the conditions of an upper platen rotation speed of 25 rpm, a lower platen rotation speed of 50 rpm, and a sun gear rotation speed of 8 rpm. At this time, as a coolant, 30 cc of "Daphne Cut GS50K" from Idemitsu Kosan Co., Ltd. was supplied every minute.

[評價方法] 對實施例1～實施例6及比較例1～比較例3的研磨材進行藉由塔柏磨耗試驗的磨耗量的測定、以及使用該些研磨材研磨藍寶石基板時的第一研磨部與第二研磨部的階差的平均高度的測定、及研磨速率的測定。將結果示於表1。[Evaluation method] The abrasive materials of Examples 1 to 6 and Comparative Examples 1 to 3 were measured for the amount of abrasion by the Taber abrasion test, and the first polishing when the sapphire substrate was polished using these abrasives. Measurement of the average height of the step between the portion and the second polishing portion, and measurement of the polishing rate. The results are shown in Table 1.

＜磨耗量的測定＞ 藉由塔柏磨耗試驗的磨耗量的測定中，準備所述實施例1～實施例6及比較例1～比較例3的研磨材各兩塊。該兩塊研磨材中，自一塊研磨材去除第二研磨部而製成僅有第一研磨部的研磨材，且自另一塊研磨材去除第一研磨部而製成僅有第二研磨部的研磨材。由所述兩塊研磨材分別準備試片（平均直徑104 mm，平均厚度300 μm），使用塔柏磨耗試驗機（塔柏儀器（Taber Instrument）公司的「型號（MODEL）174」），以磨耗輪H-18、負荷4.9 N（500 gf）的條件使各試片旋轉320轉而經磨耗。測定該320轉前後的試片的質量差[g]而作為磨耗量[g]。<Measurement of abrasion amount> In the measurement of the abrasion amount by the Taber abrasion test, two pieces each of the abrasives of the above-mentioned Examples 1 to 6 and Comparative Examples 1 to 3 were prepared. Among the two abrasive materials, the second abrasive portion is removed from one abrasive material to produce an abrasive material having only the first abrasive portion, and the first abrasive portion is removed from the other abrasive material to produce a second abrasive portion only. Abrasive material. Test pieces were prepared from the two abrasive materials (average diameter: 104 mm, average thickness: 300 μm), and were abraded using a Taber abrasion tester ("MODEL 174" of Taber Instrument). The conditions of wheel H-18 and load 4.9 N (500 gf) caused each test piece to rotate for 320 revolutions and then wear. The mass difference [g] of the test piece before and after the 320 revolutions was measured as the abrasion amount [g].

＜階差的平均高度的測定＞ 第一研磨部與第二研磨部的階差的平均高度是使用雷射位移計（基恩士（KEYENCE）股份有限公司製造）測定任意的15處，以所獲得的測定值的平均值的形式而求出。<Measurement of the average height of the step difference> The average height of the step between the first polishing section and the second polishing section was measured at 15 arbitrary places using a laser displacement meter (manufactured by KEYENCE Corporation), The obtained measurement value is obtained as an average value.

＜研磨速率＞ 關於研磨速率，對藍寶石基板進行10分鐘研磨，將研磨前後的基板的重量變化（g）除以基板的表面積（cm2 ）、基板的比重（g/cm3 ）及研磨時間（分鐘），並將單位換算為μm/分鐘而算出。<Polishing rate> About the polishing rate, the sapphire substrate was polished for 10 minutes, and the weight change (g) of the substrate before and after polishing was divided by the substrate surface area (cm 2 ), the specific gravity of the substrate (g / cm 3 ), and the polishing time ( Minutes) and calculated in units of μm / minute.

[表1]

Figure TW201801857AD00001
[Table 1]
Figure TW201801857AD00001

表1中，硬化劑及第二研磨粒的「-」是指分別未使用硬化劑及第二研磨粒。另外，階差的平均高度及研磨速率的「-」是指因基板落入槽中而基板受到損傷，因此未能進行測定。In Table 1, "-" of the hardener and the second abrasive grain means that the hardener and the second abrasive grain are not used, respectively. In addition, the "-" of the average height of the step and the polishing rate means that the substrate was damaged due to the substrate falling into the groove, so the measurement could not be performed.

根據表1的結果，與比較例1～比較例3的研磨材相比，實施例1～實施例6的研磨材的研磨速率高。相對於此，比較例1、比較例2的研磨材中，第一研磨部相對於第二研磨部的塔柏磨耗試驗中的磨耗量的比未滿3，因此研磨時未於第一研磨部與第二研磨部之間產生充分的階差。因此，使用比較例1、比較例2的研磨材的研磨中，研磨負荷分散於第一研磨部與第二研磨部，因此認為第一研磨部的研磨壓力未提高，而研磨速率低。另外，關於比較例3的研磨材，因研磨部整體的面積佔有率未滿15%，因此認為因被削體落入槽中而產生了損傷。Based on the results in Table 1, the polishing rate of the polishing materials of Examples 1 to 6 was higher than that of the polishing materials of Comparative Examples 1 to 3. On the other hand, in the abrasives of Comparative Examples 1 and 2, the ratio of the abrasion amount in the Taber abrasion test of the second polishing portion to the second polishing portion was less than 3, so it was not in the first polishing portion during polishing A sufficient level difference is generated from the second polishing section. Therefore, in the polishing using the polishing materials of Comparative Example 1 and Comparative Example 2, since the polishing load is distributed between the first polishing section and the second polishing section, it is considered that the polishing pressure of the first polishing section is not increased and the polishing rate is low. In addition, regarding the polishing material of Comparative Example 3, since the area occupancy ratio of the entire polishing portion was less than 15%, it was considered that damage was caused by the workpiece being dropped into the groove.

根據以上可知，相對於第一研磨部的塔柏磨耗試驗中的第二研磨部的所述磨耗量的比設為3以上，且將研磨層中的研磨部整體的佔有面積率設為15%以上且100%以下，藉此可抑制因被削體落入槽等中而引起的損傷，並且可達成高加工效率。 [產業上的可利用性]From the above, it can be seen that the ratio of the abrasion amount to the second polishing portion in the Taber abrasion test of the first polishing portion is set to 3 or more, and the area ratio of the entire polishing portion in the polishing layer is set to 15%. Above and not more than 100%, this can suppress damage caused by the object being dropped into a groove, etc., and achieve high processing efficiency. [Industrial availability]

本發明的研磨材可抑制因被削體落入槽等中而引起的損傷，並且可達成比較高的加工效率。因而，該研磨材可適宜地用於玻璃或藍寶石等基板的平面研磨。The abrasive of the present invention can suppress damage caused by the workpiece being dropped into a groove or the like, and can achieve a relatively high processing efficiency. Therefore, this polishing material can be suitably used for planar polishing of a substrate such as glass or sapphire.

1、2‧‧‧研磨材
10‧‧‧基材
20‧‧‧研磨層
21‧‧‧第一研磨部
21a、22a‧‧‧研磨粒
21b、22b‧‧‧黏合劑
22‧‧‧第二研磨部
23‧‧‧槽
24‧‧‧凸狀部
25、26‧‧‧其他研磨部
30‧‧‧接著層
31‧‧‧第二接著層
40‧‧‧支持體1, 2‧‧‧ Abrasives
10‧‧‧ Substrate
20‧‧‧ abrasive layer
21‧‧‧The first grinding section
21a, 22a‧‧‧ Abrasive particles
21b, 22b‧‧‧Adhesive
22‧‧‧Second grinding section
23‧‧‧slot
24‧‧‧ convex
25, 26‧‧‧ Other grinding department
30‧‧‧ Adjacent layer
31‧‧‧Second Adhesive Layer
40‧‧‧ support

圖1為表示本發明的實施形態的研磨材的示意性局部平面圖。 圖2為圖1的A-A線處的示意性局部剖面圖。 圖3為表示與圖1不同的研磨材的示意性局部平面圖。 圖4為表示與圖1及圖3不同的研磨材的研磨部的結構的示意性局部平面圖。 圖5為表示與圖1、圖3及圖4不同的研磨材的研磨部的結構的示意性局部平面圖。 圖6為表示與圖1、圖3至圖5不同的研磨材的研磨部的結構的示意性局部平面圖。 圖7為表示與圖1、圖3至圖6不同的研磨材的研磨部的結構的示意性局部平面圖。 圖8為表示與圖1、圖3至圖7不同的研磨材的研磨部的結構的示意性局部平面圖。 圖9為表示與圖2不同的實施形態的研磨材的示意性局部平面圖。FIG. 1 is a schematic partial plan view showing an abrasive according to an embodiment of the present invention. Fig. 2 is a schematic partial cross-sectional view taken along the line A-A in Fig. 1. FIG. 3 is a schematic partial plan view showing an abrasive material different from FIG. 1. FIG. 4 is a schematic partial plan view showing the structure of a polishing section of the polishing material different from those of FIGS. 1 and 3. FIG. 5 is a schematic partial plan view showing a structure of a polishing section of an abrasive material different from those of FIGS. 1, 3, and 4. FIG. 6 is a schematic partial plan view showing a structure of a polishing section of an abrasive material different from those of FIGS. 1, 3 to 5. FIG. 7 is a schematic partial plan view showing a structure of a polishing section of an abrasive material different from those of FIGS. 1, 3 to 6. FIG. 8 is a schematic partial plan view showing the structure of a polishing section of an abrasive material different from those of FIGS. 1, 3 to 7. FIG. 9 is a schematic partial plan view showing a polishing material according to an embodiment different from FIG. 2.

1‧‧‧研磨材 1‧‧‧ Abrasive

10‧‧‧基材 10‧‧‧ Substrate

20‧‧‧研磨層 20‧‧‧ abrasive layer

21‧‧‧第一研磨部 21‧‧‧The first grinding section

21a、22a‧‧‧研磨粒 21a, 22a‧‧‧ Abrasive particles

21b、22b‧‧‧黏合劑 21b, 22b‧‧‧Adhesive

22‧‧‧第二研磨部 22‧‧‧Second grinding section

23‧‧‧槽 23‧‧‧slot

24‧‧‧凸狀部 24‧‧‧ convex

Claims (5)

一種研磨材，其具備基材、及積層於所述基材的表面側的研磨層，所述研磨材的特徵在於： 所述研磨層包含研磨粒及其黏合劑，且具有塔柏磨耗試驗中的磨耗量不同的多種研磨部， 所述多種研磨部中所述磨耗量最小的第一研磨部由其他研磨部包圍， 所述其他研磨部的所述磨耗量相對於所述第一研磨部的所述磨耗量的比為3以上， 所述研磨層中的所述研磨部整體的佔有面積率為15%以上且100%以下。A polishing material includes a base material and a polishing layer laminated on a surface side of the base material. The polishing material is characterized in that: the polishing layer includes abrasive particles and an adhesive, and has a taper abrasion test; A plurality of grinding sections having different abrasion amounts, among which the first grinding section having the smallest abrasion amount is surrounded by other grinding sections, and the abrasion amount of the other grinding sections is relative to that of the first grinding section The ratio of the abrasion amount is 3 or more, and the occupied area ratio of the entire polishing section in the polishing layer is 15% or more and 100% or less. 如申請專利範圍第1項所述的研磨材，其中，所述研磨層中的所述第一研磨部的佔有面積率為3%以上且16%以下。The polishing material according to item 1 of the scope of patent application, wherein the occupied area ratio of the first polishing portion in the polishing layer is 3% or more and 16% or less. 如申請專利範圍第1項所述的研磨材，其中，所述第一研磨部的研磨粒由多種研磨粒構成。The abrasive material according to item 1 of the scope of patent application, wherein the abrasive grains of the first abrasive portion are composed of a plurality of types of abrasive grains. 如申請專利範圍第3項所述的研磨材，其中，所述第一研磨部包含金剛石研磨粒，且 所述第一研磨部中的所述金剛石研磨粒的含量為1體積%以上且20體積%以下。The abrasive material according to item 3 of the scope of patent application, wherein the first abrasive portion includes diamond abrasive particles, and a content of the diamond abrasive particles in the first abrasive portion is 1 vol% or more and 20 vols. %the following. 如申請專利範圍第4項所述的研磨材，其中，所述其他研磨部中的所述金剛石研磨粒的含量為0.3體積%以下。The abrasive material according to item 4 of the scope of patent application, wherein a content of the diamond abrasive grains in the other abrasive portion is 0.3% by volume or less.
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