JP2016109995A - 光電気混載基板 - Google Patents
光電気混載基板 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title abstract description 14
- 230000005622 photoelectricity Effects 0.000 title abstract 4
- 230000003287 optical effect Effects 0.000 claims abstract description 48
- 238000005452 bending Methods 0.000 claims description 2
- 238000009429 electrical wiring Methods 0.000 abstract description 15
- 230000001902 propagating effect Effects 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 106
- 238000005253 cladding Methods 0.000 description 36
- 229910052751 metal Inorganic materials 0.000 description 32
- 239000002184 metal Substances 0.000 description 32
- 239000000463 material Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- -1 and the like Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/032—Optical fibres with cladding with or without a coating with non solid core or cladding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12176—Etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
(A)コアの幅方向のみに曲げられ、その曲率半径が50μmを上回り1500μm未満の値に設定されている凹曲面。
(B)コアの厚み方向のみに曲げられ、その曲率半径が200μmを上回り1500μm未満の値に設定されている凹曲面。
(C)コアの幅方向および厚み方向に曲げられ、コアの幅方向の曲率半径が50μmを上回り1500μm未満の値に設定され、上記コアの厚み方向の曲率半径が200μmを上回り1500μm未満の値に設定されている凹曲面。
成分a:o−クレゾールノボラックグリシジルエーテル(新日鐵住金化学社製、YDCN−700−10)50重量部。
成分b:ビスフェノキシエタノールフルオレンジグリシジルエーテル(大阪ガスケミカル社製、オグゾールEG)50重量部。
成分c:光酸発生剤(アデカ社製、SP170)1重量部。
成分d:乳酸エチル(武蔵野化学研究所社製、溶剤)50重量部。
これら成分a〜dを混合することにより、コアの形成材料を調製した。
成分e:脂環骨格を含むエポキシ樹脂(ダイセル社製、EHPE3150)20重量部。
成分f:液状長鎖二官能半脂肪族エポキシ樹脂(DIK社製、EXA−4816)80重量部。
成分g:光酸発生剤(アデカ社製、SP170)2重量部。
成分h:乳酸エチル(武蔵野化学研究所社製、溶剤)40重量部。
これら成分e〜hを混合することにより、第1および第2クラッド層の形成材料を調製した。
光ファイバ〔GI(グレーデッドインデックス)ファイバ:直径50μm、NA(開口数)0.22〕の一端部に、発光素子(OPTOTEST社製、レーザ安定化光源OP-250-LS-MM50)を接続した。そして、上記発光素子から発光され上記光ファイバの他端部から出射した光を直接、実装前の上記受光素子で受光した際の光量Aを測定した。ついで、上記光ファイバの他端部を、上記光電気混載基板の光透過面(上記コアの他端部)に接続し、上記発光素子から発光され上記光ファイバの他端部から出射した光を、上記光電気混載基板の光導波路のコアに通して上記受光素子で受光した際の光量Bを測定した。そして、その比(A/B)を算出し、その値を上記光電気混載基板における光の伝播損失とした。そして、その結果を下記の表1〜3に示した。ここで、第1クラッド層とコアとの界面から、受光素子の受光部までの距離は、30μmとした。
W 光導波路
1 絶縁層
2 電気配線
6 第1クラッド層
7 コア
7a,7b 光反射面
8 第2クラッド層
11 発光素子
12 受光素子
Claims (2)
- 光路用の線状のコアを2層のクラッド層で挟持した光導波路と、その1層のクラッド層の表面に直接または他の層を介して形成された電気配線と、この電気配線の一部分に実装された光素子とを備え、上記光導波路のコアの端部に、光を反射して上記コアと上記光素子との間の光伝播を可能とする光反射面が形成されている光電気混載基板であって、上記光反射面が、下記(A)〜(C)のいずれかの凹曲面に形成されていることを特徴とする光電気混載基板。
(A)コアの幅方向のみに曲げられ、その曲率半径が50μmを上回り1500μm未満の値に設定されている凹曲面。
(B)コアの厚み方向のみに曲げられ、その曲率半径が200μmを上回り1500μm未満の値に設定されている凹曲面。
(C)コアの幅方向および厚み方向に曲げられ、コアの幅方向の曲率半径が50μmを上回り1500μm未満の値に設定され、上記コアの厚み方向の曲率半径が200μmを上回り1500μm未満の値に設定されている凹曲面。 - 上記凹曲面が、レーザ加工により形成されたレーザ加工面になっている請求項1記載の光電気混載基板。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014249635A JP6674691B2 (ja) | 2014-12-10 | 2014-12-10 | 光電気混載基板 |
US15/527,390 US10288823B2 (en) | 2014-12-10 | 2015-11-20 | Opto-electric hybrid board |
CN201580063101.6A CN107003476B (zh) | 2014-12-10 | 2015-11-20 | 光电混合基板 |
PCT/JP2015/082647 WO2016093036A1 (ja) | 2014-12-10 | 2015-11-20 | 光電気混載基板 |
KR1020177013647A KR102576475B1 (ko) | 2014-12-10 | 2015-11-20 | 광 전기 혼재 기판 |
TW104138575A TWI655468B (zh) | 2014-12-10 | 2015-11-20 | Photoelectric hybrid substrate |
Applications Claiming Priority (1)
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JP2014249635A JP6674691B2 (ja) | 2014-12-10 | 2014-12-10 | 光電気混載基板 |
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JP2016109995A true JP2016109995A (ja) | 2016-06-20 |
JP6674691B2 JP6674691B2 (ja) | 2020-04-01 |
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JP2014249635A Active JP6674691B2 (ja) | 2014-12-10 | 2014-12-10 | 光電気混載基板 |
Country Status (6)
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---|---|
US (1) | US10288823B2 (ja) |
JP (1) | JP6674691B2 (ja) |
KR (1) | KR102576475B1 (ja) |
CN (1) | CN107003476B (ja) |
TW (1) | TWI655468B (ja) |
WO (1) | WO2016093036A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6959731B2 (ja) * | 2016-11-30 | 2021-11-05 | 日東電工株式会社 | 光電気混載基板 |
JP6941460B2 (ja) * | 2017-03-31 | 2021-09-29 | 日東電工株式会社 | 光電気混載基板および光電気混載基板アセンブリ |
US10585254B2 (en) * | 2017-11-17 | 2020-03-10 | Samsung Electronics Co., Ltd. | Vertical optical via and method of fabrication |
US11002927B2 (en) * | 2019-02-21 | 2021-05-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
CN114567962B (zh) | 2020-11-27 | 2023-11-10 | 鹏鼎控股(深圳)股份有限公司 | 电路板的制造方法及电路板 |
CN112596172B (zh) * | 2020-12-14 | 2023-04-18 | 中航光电科技股份有限公司 | 一种光无线光电集成链路及其实现装置 |
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- 2014-12-10 JP JP2014249635A patent/JP6674691B2/ja active Active
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- 2015-11-20 KR KR1020177013647A patent/KR102576475B1/ko active IP Right Grant
- 2015-11-20 TW TW104138575A patent/TWI655468B/zh active
- 2015-11-20 CN CN201580063101.6A patent/CN107003476B/zh active Active
- 2015-11-20 US US15/527,390 patent/US10288823B2/en active Active
- 2015-11-20 WO PCT/JP2015/082647 patent/WO2016093036A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
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KR20170093126A (ko) | 2017-08-14 |
JP6674691B2 (ja) | 2020-04-01 |
WO2016093036A1 (ja) | 2016-06-16 |
US10288823B2 (en) | 2019-05-14 |
US20170329079A1 (en) | 2017-11-16 |
TWI655468B (zh) | 2019-04-01 |
CN107003476A (zh) | 2017-08-01 |
KR102576475B1 (ko) | 2023-09-07 |
CN107003476B (zh) | 2020-01-21 |
TW201626011A (zh) | 2016-07-16 |
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