JP2016092040A - プリント基板、プリント基板の製造方法及び導電性部材の接合方法 - Google Patents
プリント基板、プリント基板の製造方法及び導電性部材の接合方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 46
- 239000004020 conductor Substances 0.000 claims description 19
- 229920001721 polyimide Polymers 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000009719 polyimide resin Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
プリント基板100は、図1に示すように、基板1と、基板1に形成された複数の導電性接合部2とを有している。導電性接合部2の上面(接合面)2aには半田3により同軸ケーブル4の芯線41が接続されている。
導電性接合部2は所定のピッチで並んでいる。導電性接合部2の上面2aは同軸ケーブル4の芯線41が接合される接合面である。導電性接合部2は基板1をエッチング処理等することにより形成される。また導電性接合部2は、基板1に銀、銅等の導電性材料を印刷後、焼成等して形成されることもある。導電性接合部2の幅は例えば50μm〜200μmであり、導電性接合部2のピッチは例えば100μm〜400μmである。導電性接合部2を上記幅とすることにより導電性接合部2に芯線41を良好に接続できる。また、導電性接合部2を上記ピッチで並べることによりフィレットを良好な形状にすることができる。これにより導電性接合部2と芯線41との接続強度を所定の強度に保つことができる。
同軸ケーブル4は、円柱状の芯線41と、芯線41を覆う内部絶縁体42と、内部絶縁体42を覆う外部導体43と、最外層の外部絶縁体44とを有している。図1の拡大図に示すように、芯線41の側周面、特に下半分の面が半田3により導電性接合部2の上面2aに接合されている。芯線41の上半分の面は露出している。芯線41には例えば直径が15μm〜100μmの導線部材を用いることができる。芯線41のピッチは例えば100μm〜400μmである。
次に、プリント基板100の製造方法を、図2A〜図2D及び図3を参照しつつ説明する。
本実施形態では、導電性接合部2への芯線41の載置状態を光透過性シート30で保持しながら光を照射して予備半田を加熱溶融することによって、導電性接合部2及び芯線41を接合している。極細の芯線41を用いると、芯線41が軽量であるため移動や変形し易いが、芯線41を光透過性シート30で覆うことにより芯線41の移動や変形を防止して、芯線41を導電性接合部2と接触させることができる。このため、芯線41の導電性接合部2への接合を高い歩留まりで行える。また、導電性接合部2の予備半田を溶融して、芯線41と導電性接合部2との接触面側から半田による接合を行うため、従来のように手作業で芯線41の上方から半田ゴテを用いて半田付け作業を行う場合よりも、導電性接合部2間における半田ブリッジを生じにくくすることができる。これにより、半田ブリッジが原因で生じる短絡を起こり難くすることができる。特に、導電性接合部2間のピッチが狭くなった場合において、ブリッジの発生頻度を顕著に低減することが可能となる。
2,202 導電性接合部
2a,202a 上面(接合面)
3,203 半田
4 同軸ケーブル
30 光透過性シート
31 樹脂層
32,232 粘着層
41 芯線(導電性部材、導線部材)
100,200 プリント基板
241 端子(導電性部材)
Claims (6)
- 予備半田された複数の導電性接合部に載置された導電性部材を光透過性シートで覆うことにより前記導電性部材の載置状態を保持する載置状態保持工程と、
前記光透過性シートを介して前記導電性接合部及び前記導電性部材に向けて光を照射することにより前記予備半田を加熱溶融し、前記導電性接合部及び前記導電性部材を接合する接合工程と、
を有することを特徴とする導電性部材の接合方法。 - 予備半田された複数の導電性接合部上に、導線部材をそれぞれ載置する導線部材セット工程と、
前記導電性接合部及び前記導線部材を光透過性シートで覆うことにより前記導線部材の載置状態を保持する載置状態保持工程と、
前記光透過性シートを介して前記導電性接合部及び前記導線部材に向けて光を照射することにより前記予備半田を加熱溶融し、前記導電性接合部及び前記導線部材を接合する接合工程と、
を有することを特徴とするプリント基板の製造方法。 - 前記光透過性シートは、ポリイミド樹脂により形成されていることを特徴とする請求項2に記載のプリント基板の製造方法。
- 請求項2又は3のプリント基板の製造方法により製造されたことを特徴とするプリント基板。
- 前記導線部材の一部が露出されていることを特徴とする請求項4に記載のプリント基板。
- 前記導線部材の一部に粘着剤が積層されていることを特徴とする請求項4に記載のプリント基板。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014220867A JP6641079B2 (ja) | 2014-10-29 | 2014-10-29 | プリント基板の製造方法及び導電性部材の接合方法 |
KR1020197010038A KR20190040095A (ko) | 2014-10-29 | 2015-10-29 | 프린트 기판, 프린트 기판의 제조 방법 및 도전성 부재의 접합 방법 |
US15/522,207 US10206289B2 (en) | 2014-10-29 | 2015-10-29 | Printed circuit board, method for manufacturing printed circuit board, and method for joining conductive member |
CN201580059421.4A CN107079588B (zh) | 2014-10-29 | 2015-10-29 | 印刷基板、印刷基板的制造方法以及导电性部件的接合方法 |
KR1020177007463A KR20170076653A (ko) | 2014-10-29 | 2015-10-29 | 프린트 기판, 프린트 기판의 제조 방법 및 도전성 부재의 접합 방법 |
TW104135652A TWI630767B (zh) | 2014-10-29 | 2015-10-29 | 印刷基板之製造方法及導電性構件之接合方法 |
PCT/JP2015/080615 WO2016068260A1 (ja) | 2014-10-29 | 2015-10-29 | プリント基板、プリント基板の製造方法及び導電性部材の接合方法 |
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JP2014220867A JP6641079B2 (ja) | 2014-10-29 | 2014-10-29 | プリント基板の製造方法及び導電性部材の接合方法 |
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JP2016092040A true JP2016092040A (ja) | 2016-05-23 |
JP2016092040A5 JP2016092040A5 (ja) | 2017-01-05 |
JP6641079B2 JP6641079B2 (ja) | 2020-02-05 |
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JP2014220867A Active JP6641079B2 (ja) | 2014-10-29 | 2014-10-29 | プリント基板の製造方法及び導電性部材の接合方法 |
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Country | Link |
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US (1) | US10206289B2 (ja) |
JP (1) | JP6641079B2 (ja) |
KR (2) | KR20170076653A (ja) |
CN (1) | CN107079588B (ja) |
TW (1) | TWI630767B (ja) |
WO (1) | WO2016068260A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023233459A1 (ja) * | 2022-05-30 | 2023-12-07 | 住友電気工業株式会社 | 接続構造 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102369036B1 (ko) * | 2018-07-06 | 2022-03-02 | 텐류세이키 가부시키가이샤 | 전송선로, 전송선로의 제조 방법 및 전송선로의 제조 장치 |
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- 2014-10-29 JP JP2014220867A patent/JP6641079B2/ja active Active
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2015
- 2015-10-29 US US15/522,207 patent/US10206289B2/en active Active
- 2015-10-29 KR KR1020177007463A patent/KR20170076653A/ko active Application Filing
- 2015-10-29 KR KR1020197010038A patent/KR20190040095A/ko not_active Application Discontinuation
- 2015-10-29 CN CN201580059421.4A patent/CN107079588B/zh active Active
- 2015-10-29 TW TW104135652A patent/TWI630767B/zh active
- 2015-10-29 WO PCT/JP2015/080615 patent/WO2016068260A1/ja active Application Filing
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JPH05347373A (ja) * | 1992-06-12 | 1993-12-27 | Seiko Epson Corp | 半導体素子実装構造とその半田付け方法 |
JPH0766238A (ja) * | 1993-08-31 | 1995-03-10 | Mitsubishi Electric Corp | 半導体装置および半導体装置の実装方法および半導体装置の実装装置 |
JPH07183445A (ja) * | 1993-12-24 | 1995-07-21 | Sharp Corp | 樹脂封止型半導体装置 |
Cited By (1)
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WO2023233459A1 (ja) * | 2022-05-30 | 2023-12-07 | 住友電気工業株式会社 | 接続構造 |
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KR20170076653A (ko) | 2017-07-04 |
TW201622252A (zh) | 2016-06-16 |
US20170325338A1 (en) | 2017-11-09 |
US10206289B2 (en) | 2019-02-12 |
WO2016068260A1 (ja) | 2016-05-06 |
KR20190040095A (ko) | 2019-04-16 |
CN107079588A (zh) | 2017-08-18 |
TWI630767B (zh) | 2018-07-21 |
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JP6641079B2 (ja) | 2020-02-05 |
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