JP7291292B2 - アディティブ製造技術(amt)反転パッドインタフェース - Google Patents
アディティブ製造技術(amt)反転パッドインタフェース Download PDFInfo
- Publication number
- JP7291292B2 JP7291292B2 JP2022515686A JP2022515686A JP7291292B2 JP 7291292 B2 JP7291292 B2 JP 7291292B2 JP 2022515686 A JP2022515686 A JP 2022515686A JP 2022515686 A JP2022515686 A JP 2022515686A JP 7291292 B2 JP7291292 B2 JP 7291292B2
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- JP
- Japan
- Prior art keywords
- dielectric layer
- solder
- circuit board
- printed circuit
- interface structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
Claims (12)
- 第1の誘電体層及び第2の誘電体層を含む多層プリント回路基板であって、前記第1の誘電体層は頂面及び底面を有し、前記第2の誘電体層は頂面及び底面を有し、前記第1の誘電体層は、前記第1の誘電体層の前記底面を前記第2の誘電体層の前記頂面に面させて、前記第2の誘電体層の上に配置され、前記第2の誘電体層の前記頂面は導電トレースを有し、前記第2の誘電体層は、前記導電トレースを貫通するスルーホールを有し、当該多層プリント回路基板は、
反転パッドインタフェース構造であり、
前記第1の誘電体層の前記底面上に設けられた反転パッドと、
前記反転パッドの表面上に設けられた第1のはんだ層と、
前記導電トレース上に設けられた第2のはんだ層と、
前記スルーホール内に位置して、前記導電トレースとの上下方向の電気接続を提供する銅ワイヤと、
を含む反転パッドインタフェース構造、
を有する、多層プリント回路基板。 - 前記第1及び第2のはんだ層のリフロー温度まで前記反転パッドインタフェース構造が加熱されたことで、前記銅ワイヤを前記反転パッドに取り付けている、請求項1に記載の多層プリント回路基板。
- 当該多層プリント回路基板は更に、前記第2の誘電体層の前記底面上に実装された部品を有し、該部品への電気通信を提供すべく該部品は前記銅ワイヤに接続されている、請求項1に記載の多層プリント回路基板。
- 前記第1のはんだ層及び前記第2のはんだ層は各々、歪み誘起降伏を防止するために、はんだ合金を含んでいる、請求項1に記載の多層プリント回路基板。
- 前記銅ワイヤは断面において円形である、請求項1に記載の多層プリント回路基板。
- 前記第1の誘電体層の前記頂面に部品を実装するように構成された垂直銅立ち上げインタフェース構造、を更に有する請求項1に記載の多層プリント回路基板。
- 前記垂直銅立ち上げインタフェース構造は、前記第1の誘電体層を貫通するスルーホールと、前記第2の誘電体層の頂面に設けられた導電トレースにはんだ付けされた第2の銅ワイヤとを含む、請求項6に記載の多層プリント回路基板。
- 反転パッドインタフェース構造を製造する方法であって、
第1の誘電体層の底面上に反転パッドを形成し、
前記反転パッド上に、はんだバンプの形態ではんだを付与し、
第2の誘電体層の頂面上に導電トレースを設け、該導電トレース上にはんだ又ははんだペーストを付与し、
前記第2の誘電体層内にスルーホールを形成し、
前記第2の誘電体層内に設けられたスルーホールに銅ワイヤを挿入し、
ラミネートしたパッケージに熱及び/又は加圧を加えて前記反転パッドインタフェース構造を組み立てて作製する、
ことを有する方法。 - 前記スルーホールは前記導電トレースとアライメントされる、請求項8に記載の方法。
- 当該方法は更に、前記第2の誘電体層の底面上に部品を取り付けることを有し、該部品は、該部品への電気通信を提供すべく前記銅ワイヤに接続される、請求項8に記載の方法。
- 前記熱を加えることは、前記反転パッドインタフェース構造をリフロー温度に加熱して、前記銅ワイヤを前記反転パッドに取り付けることを含む、請求項8に記載の方法。
- 前記はんだは、歪み誘起降伏を防止するために、はんだ合金を含む、請求項8に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/576,895 US10631405B1 (en) | 2019-09-20 | 2019-09-20 | Additive manufacturing technology (AMT) inverted pad interface |
US16/576,895 | 2019-09-20 | ||
PCT/US2020/026186 WO2021055015A1 (en) | 2019-09-20 | 2020-04-01 | Additive manufacturing technology (amt) inverted pad interface |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022547951A JP2022547951A (ja) | 2022-11-16 |
JP7291292B2 true JP7291292B2 (ja) | 2023-06-14 |
Family
ID=70285240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022515686A Active JP7291292B2 (ja) | 2019-09-20 | 2020-04-01 | アディティブ製造技術(amt)反転パッドインタフェース |
Country Status (5)
Country | Link |
---|---|
US (1) | US10631405B1 (ja) |
EP (1) | EP4032375A1 (ja) |
JP (1) | JP7291292B2 (ja) |
KR (1) | KR20220037485A (ja) |
WO (1) | WO2021055015A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11089673B2 (en) | 2019-07-19 | 2021-08-10 | Raytheon Company | Wall for isolation enhancement |
US11122692B1 (en) * | 2020-06-11 | 2021-09-14 | Raytheon Company | Preparation of solder bump for compatibility with printed electronics and enhanced via reliability |
US12035465B2 (en) | 2021-09-10 | 2024-07-09 | Continental Automotive Systems, Inc. | 3D-printed, PCB composite structures, and formation methods |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003318545A (ja) | 2002-04-22 | 2003-11-07 | Sony Corp | 多層型プリント配線基板及び多層型プリント配線基板の製造方法 |
JP2015128100A (ja) | 2013-12-27 | 2015-07-09 | 富士通株式会社 | 配線基板及びその製造方法 |
JP2016152397A (ja) | 2015-02-19 | 2016-08-22 | 富士通株式会社 | 多層回路基板、半導体装置、多層回路基板の製造方法 |
US20190150296A1 (en) | 2017-11-10 | 2019-05-16 | Raytheon Company | Additive manufacturing technology microwave vertical launch |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB945575A (en) * | 1961-11-15 | 1964-01-02 | Btr Industries Ltd | Improvements in and relating to printed circuits |
US5147084A (en) * | 1990-07-18 | 1992-09-15 | International Business Machines Corporation | Interconnection structure and test method |
US6747217B1 (en) | 2001-11-20 | 2004-06-08 | Unisys Corporation | Alternative to through-hole-plating in a printed circuit board |
JP2006203114A (ja) * | 2005-01-24 | 2006-08-03 | Mitsubishi Plastics Ind Ltd | 多層プリント配線基板 |
US9875988B2 (en) * | 2015-10-29 | 2018-01-23 | Semtech Corporation | Semiconductor device and method of forming DCALGA package using semiconductor die with micro pillars |
CA3045487A1 (en) * | 2016-12-07 | 2018-06-14 | D-Wave Systems Inc. | Superconducting printed circuit board related systems, methods, and apparatus |
CN212463677U (zh) * | 2017-05-26 | 2021-02-02 | 株式会社村田制作所 | 多层布线基板以及电子设备 |
-
2019
- 2019-09-20 US US16/576,895 patent/US10631405B1/en active Active
-
2020
- 2020-04-01 KR KR1020227006089A patent/KR20220037485A/ko not_active Application Discontinuation
- 2020-04-01 WO PCT/US2020/026186 patent/WO2021055015A1/en unknown
- 2020-04-01 EP EP20720717.6A patent/EP4032375A1/en active Pending
- 2020-04-01 JP JP2022515686A patent/JP7291292B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003318545A (ja) | 2002-04-22 | 2003-11-07 | Sony Corp | 多層型プリント配線基板及び多層型プリント配線基板の製造方法 |
JP2015128100A (ja) | 2013-12-27 | 2015-07-09 | 富士通株式会社 | 配線基板及びその製造方法 |
JP2016152397A (ja) | 2015-02-19 | 2016-08-22 | 富士通株式会社 | 多層回路基板、半導体装置、多層回路基板の製造方法 |
US20190150296A1 (en) | 2017-11-10 | 2019-05-16 | Raytheon Company | Additive manufacturing technology microwave vertical launch |
Also Published As
Publication number | Publication date |
---|---|
JP2022547951A (ja) | 2022-11-16 |
EP4032375A1 (en) | 2022-07-27 |
US10631405B1 (en) | 2020-04-21 |
KR20220037485A (ko) | 2022-03-24 |
TW202114488A (zh) | 2021-04-01 |
WO2021055015A1 (en) | 2021-03-25 |
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