JP2016029687A - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
- Publication number
- JP2016029687A JP2016029687A JP2014151663A JP2014151663A JP2016029687A JP 2016029687 A JP2016029687 A JP 2016029687A JP 2014151663 A JP2014151663 A JP 2014151663A JP 2014151663 A JP2014151663 A JP 2014151663A JP 2016029687 A JP2016029687 A JP 2016029687A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor light
- light emitting
- emitting device
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 91
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 238000000465 moulding Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 23
- 238000005476 soldering Methods 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000020169 heat generation Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000005452 bending Methods 0.000 description 11
- 238000009826 distribution Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
Description
2… 本体
3… レンズ
5… 樹脂成形体
6… パッケージ
7… 半導体発光素子
8… ボンディングワイヤ
10… 前面部
11… 収容凹部
12… 係合凹部
13… 下面
20… 上壁部
21… 側壁部
21a… 内側面
21b… 下端面
22… 側壁部
22a… 内側面
22b… 下端面
25… 空間部
30… 第1のリードフレーム
30a… インナーリード
30b… アウターリード
30c… 折曲延長部
30d… 下面
30e… 延長脚部
30f… 切欠部
30g… 素子実装部
30h… 折曲部
31… 第2のリードフレーム
31a… インナーリード
31b… アウターリード
31c… 折曲延長部
31d… 下面
31f… 切欠部
40… 基台部
41… シリンドリカルレンズ部
42… 突起部
50… 実装基板
51a… 電極パッド
51b… 電極パッド
51c… 切欠部
60a… 第1のはんだフィレット
60b… 第2のはんだフィレット
60c… 第3のはんだフィレット
Claims (3)
- 開口を有する凹部が設けられた樹脂成形体と、
一端部側が前記樹脂成形体の内部に埋設され他端部側が前記樹脂成形体の外部に延出された、互いに同一面上に並設された一対のリードフレームを備え、
前記凹部の底面に前記一対のリードフレームの夫々の一端部側の一部が露出して該露出部のいずれか一方に半導体発光素子が実装されると共に、前記樹脂成形体から延出された、一対のリードフレームの夫々の他端部側が折り曲げられて前記半導体発光素子の光軸方向で且つ光照射方向と反対方向に向けて延設された折曲延長部を有するサイドビュー型の半導体発光装置であって、
前記一対のリードフレームは、一方のリードフレームが他方のリードフレームを略コの字状に覆うと共に該他方のリードフレームを挟んで左右対称の形状を有し、
前記他方のリードフレームの折曲延長部と、該折曲延長部を挟んだ両側に位置する、前記一方のリードフレームの両折曲延長部が互いに平行に並設され、
前記一方のリードフレームの両折曲延長部の夫々、及び/又は、前記他方のリードフレームの折曲延長部に、幅方向の一端部から幅方向に向かう切欠部が設けられていることを特徴とする半導体発光装置。 - 前記一方のリードフレームの両折曲延長部の夫々の下面及び前記他方のリードフレームの折曲延長部の下面はいずれも同一平面上に位置すると共に前記樹脂成形体の最下面に対して同一平面上、あるいはそれよりも上方に位置することを特徴とする請求項1に記載の半導体発光装置。
- 前記樹脂成形体には、レンズに設けられた突起部を嵌合する係合凹部が設けられ、レンズの突起部を前記樹脂成形体の係合凹部に嵌合することにより、前記レンズが前記半導体発光素子が実装された凹部を覆うように前記樹脂成形体に装着されていることを特徴とする請求項1又は請求項2に記載の半導体発光装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014151663A JP6374723B2 (ja) | 2014-07-25 | 2014-07-25 | 半導体発光装置 |
US14/753,659 US9620685B2 (en) | 2014-07-25 | 2015-06-29 | Surface mount light-emitting device |
EP15177317.3A EP2978031B1 (en) | 2014-07-25 | 2015-07-17 | Light-emitting device for surface mounting |
CN201510427078.6A CN105304791A (zh) | 2014-07-25 | 2015-07-20 | 表面安装发光器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014151663A JP6374723B2 (ja) | 2014-07-25 | 2014-07-25 | 半導体発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016029687A true JP2016029687A (ja) | 2016-03-03 |
JP6374723B2 JP6374723B2 (ja) | 2018-08-15 |
Family
ID=53717918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014151663A Active JP6374723B2 (ja) | 2014-07-25 | 2014-07-25 | 半導体発光装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9620685B2 (ja) |
EP (1) | EP2978031B1 (ja) |
JP (1) | JP6374723B2 (ja) |
CN (1) | CN105304791A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017111381A (ja) | 2015-12-18 | 2017-06-22 | スタンレー電気株式会社 | ハーフミラー、ハーフミラーを備えた灯具、およびハーフミラーを製造する方法 |
KR102335216B1 (ko) * | 2017-04-26 | 2021-12-03 | 삼성전자 주식회사 | 발광소자 패키지 |
US11677059B2 (en) | 2017-04-26 | 2023-06-13 | Samsung Electronics Co., Ltd. | Light-emitting device package including a lead frame |
DE102020121656A1 (de) * | 2020-08-18 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0311771A (ja) * | 1989-05-31 | 1991-01-21 | Siemens Ag | 表面実装可能なオプトデバイス |
JP2006080251A (ja) * | 2004-09-09 | 2006-03-23 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2007201405A (ja) * | 2005-07-22 | 2007-08-09 | Toshiba Lighting & Technology Corp | 発光ダイオード装置 |
DE102006035635A1 (de) * | 2006-07-31 | 2008-02-07 | Osram Opto Semiconductors Gmbh | Beleuchtungsanordnung |
US20080230790A1 (en) * | 2007-03-23 | 2008-09-25 | Sharp Kabushiki Kaisha | Semiconductor light emitting device |
JP2010504626A (ja) * | 2006-09-20 | 2010-02-12 | 株式会社ニコン | 光学素子及び樹脂封止発光素子の製造方法、並びに、それにより得られた物 |
US7737546B2 (en) * | 2007-09-05 | 2010-06-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Surface mountable semiconductor package with solder bonding features |
JP2010135706A (ja) * | 2008-12-08 | 2010-06-17 | Toyoda Gosei Co Ltd | 発光装置 |
JP2011233801A (ja) * | 2010-04-30 | 2011-11-17 | Rohm Co Ltd | 発光素子モジュール |
JP2012099737A (ja) * | 2010-11-04 | 2012-05-24 | Stanley Electric Co Ltd | サイドビュー型半導体発光装置およびその製造方法 |
JP2013219357A (ja) * | 2012-04-09 | 2013-10-24 | Lg Innotek Co Ltd | 発光素子パッケージ |
JP2013219325A (ja) * | 2012-04-09 | 2013-10-24 | Lg Innotek Co Ltd | 発光ランプ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58225673A (ja) | 1982-06-23 | 1983-12-27 | Nec Corp | 半導体装置 |
US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
JP5426091B2 (ja) * | 2007-12-27 | 2014-02-26 | 豊田合成株式会社 | 発光装置 |
US8120055B2 (en) * | 2009-04-20 | 2012-02-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light source |
JP5956167B2 (ja) | 2012-01-23 | 2016-07-27 | スタンレー電気株式会社 | 発光装置、車両用灯具及び発光装置の製造方法 |
JP5891133B2 (ja) | 2012-07-12 | 2016-03-22 | スタンレー電気株式会社 | 半導体発光装置 |
-
2014
- 2014-07-25 JP JP2014151663A patent/JP6374723B2/ja active Active
-
2015
- 2015-06-29 US US14/753,659 patent/US9620685B2/en active Active
- 2015-07-17 EP EP15177317.3A patent/EP2978031B1/en active Active
- 2015-07-20 CN CN201510427078.6A patent/CN105304791A/zh active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0311771A (ja) * | 1989-05-31 | 1991-01-21 | Siemens Ag | 表面実装可能なオプトデバイス |
JP2006080251A (ja) * | 2004-09-09 | 2006-03-23 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2007201405A (ja) * | 2005-07-22 | 2007-08-09 | Toshiba Lighting & Technology Corp | 発光ダイオード装置 |
JP2009545864A (ja) * | 2006-07-31 | 2009-12-24 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 照明装置 |
DE102006035635A1 (de) * | 2006-07-31 | 2008-02-07 | Osram Opto Semiconductors Gmbh | Beleuchtungsanordnung |
JP2010504626A (ja) * | 2006-09-20 | 2010-02-12 | 株式会社ニコン | 光学素子及び樹脂封止発光素子の製造方法、並びに、それにより得られた物 |
US20080230790A1 (en) * | 2007-03-23 | 2008-09-25 | Sharp Kabushiki Kaisha | Semiconductor light emitting device |
US7737546B2 (en) * | 2007-09-05 | 2010-06-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Surface mountable semiconductor package with solder bonding features |
JP2010135706A (ja) * | 2008-12-08 | 2010-06-17 | Toyoda Gosei Co Ltd | 発光装置 |
JP2011233801A (ja) * | 2010-04-30 | 2011-11-17 | Rohm Co Ltd | 発光素子モジュール |
JP2012099737A (ja) * | 2010-11-04 | 2012-05-24 | Stanley Electric Co Ltd | サイドビュー型半導体発光装置およびその製造方法 |
JP2013219357A (ja) * | 2012-04-09 | 2013-10-24 | Lg Innotek Co Ltd | 発光素子パッケージ |
JP2013219325A (ja) * | 2012-04-09 | 2013-10-24 | Lg Innotek Co Ltd | 発光ランプ |
Also Published As
Publication number | Publication date |
---|---|
US9620685B2 (en) | 2017-04-11 |
EP2978031B1 (en) | 2019-02-13 |
CN105304791A (zh) | 2016-02-03 |
JP6374723B2 (ja) | 2018-08-15 |
US20160027968A1 (en) | 2016-01-28 |
EP2978031A1 (en) | 2016-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4739851B2 (ja) | 表面実装型半導体装置 | |
JP4922663B2 (ja) | 半導体光学装置 | |
JP5933959B2 (ja) | 半導体光学装置 | |
JP6374723B2 (ja) | 半導体発光装置 | |
KR102146342B1 (ko) | 레이저 부품 및 그 제조 방법 | |
EP3171681A1 (en) | Lamp and manufacturing method thereof | |
JP2015216214A (ja) | Ledユニットおよびその製造方法 | |
JP2012064940A (ja) | 発光ダイオードパッケージ及び発光ダイオード | |
JP2006287131A (ja) | 半導体パッケージ及びその製造方法 | |
JP2015056649A (ja) | 発光装置 | |
JP2015528215A (ja) | 光源の製造方法 | |
JP6005362B2 (ja) | 光モジュール及び光伝送モジュール | |
JP2017098212A (ja) | 灯具及びその製造方法 | |
JP3974154B2 (ja) | 光半導体モジュール及び光半導体装置 | |
JP2015119022A (ja) | 発光装置、及びその製造方法 | |
JP7115548B2 (ja) | 光モジュール | |
JP5451243B2 (ja) | 車両用灯具 | |
JP2005251824A (ja) | 発光ダイオード | |
JP2006278385A (ja) | 電子部品及びその製造方法 | |
KR101744547B1 (ko) | 반도체 패키지 테스트용 소켓 어셈블리 | |
JPWO2015190431A1 (ja) | Ledユニット | |
JP5121421B2 (ja) | 光半導体素子用パッケージおよび光半導体装置 | |
KR101217949B1 (ko) | 반사형 발광 다이오드 | |
KR101733924B1 (ko) | 칩 온 보드형 백라이트 유닛 | |
JP2015103558A (ja) | 半導体発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170620 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180314 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180327 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180528 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180703 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180720 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6374723 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |