JP2015505170A - 大きな角度で光を発する半導体発光素子ランプ - Google Patents
大きな角度で光を発する半導体発光素子ランプ Download PDFInfo
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
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- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (17)
- マウントに装着された複数の半導体発光ダイオードと、
前記複数の半導体発光ダイオード上に配置された複数のレンズと、
を有し、前記マウントの端部の近くに配置された半導体発光ダイオード上に配置されたレンズは回転非対称であり、前記レンズの一部について、最大強度の半分である強度で発せられる光が、前記半導体発光ダイオードの上面に対する垂線に対して少なくとも70°の角度で発せられるような形状とされた、構造体。 - 前記マウントの中央部の近くに配置された半導体発光ダイオード上に配置されたレンズは回転対称であり、最大強度の半分である強度で発せられる光が、前記半導体発光ダイオードの上面に対する垂線に対して70°よりも小さい角度で発せられるような形状とされた、請求項1に記載の構造体。
- 前記マウントの端部の近くに配置された半導体発光ダイオード上に配置されたレンズが、前記レンズの一部について、最大強度の半分である強度で発せられる光が、前記半導体発光ダイオードの上面に対する垂線に対して少なくとも80°の角度で発せられるような形状とされた、請求項1に記載の構造体。
- 前記複数の半導体発光ダイオード上に配置された殻部を更に有し、
前記構造体は、前記マウントの上面に対する垂線に対して135°の角度で光が脱出するように構成され、
前記マウントの上面に対する垂線に対して135°の角度で発せられる光の量は、発せられる光の強度が最大となる角度で発せられる光の量の少なくとも5%である、
請求項1に記載の構造体。 - 前記複数のレンズは、前記複数の半導体発光ダイオード上に成型されたシリコーンのレンズを有する、請求項1に記載の構造体。
- 前記複数の半導体発光ダイオード上に配置された殻部を更に有する、請求項1に記載の構造体。
- 前記殻部は、光の散乱を引き起こす材料を有する、請求項6に記載の構造体。
- 前記殻部は、前記マウントの底部の下に延在する、請求項6に記載の構造体。
- 前記マウントの端部の近くに配置された半導体発光ダイオード上に配置された前記殻部及びレンズは、前記マウントの上面に対する垂線に対して135°の角度で、光が前記殻部から脱出するように構成された、請求項6に記載の構造体。
- マウントに装着された複数の半導体発光ダイオード上に複数のレンズを形成するステップを有し、
第1の半導体発光ダイオード上に形成された第1のレンズは、第2の半導体発光ダイオード上に形成された第2のレンズとは異なる形状を持ち、
前記第1の半導体発光ダイオードは、前記第2の半導体発光ダイオードよりも、前記マウントの端部に近く配置され、
前記第1のレンズは回転非対称であり、前記第1のレンズの一部について、最大強度の半分である強度で発せられる光が、前記第1の半導体発光ダイオードの上面に対する垂線に対して少なくとも70°の角度で発せられるような形状とされた、方法。 - 前記第2のレンズは、最大強度の半分である強度で発せられる光が、前記第2の半導体発光ダイオードの上面に対する垂線に対して70°よりも小さい角度で発せられるような形状とされた、請求項10に記載の方法。
- 前記複数のレンズを形成するステップは、
前記複数の半導体発光ダイオードに対応する窪みを持つ金型を、前記マウントの上に配置するステップと、
前記金型と前記マウントとの間の空間をシリコーンで満たすステップと、
前記シリコーンを硬化させるステップと、
を有する、請求項10に記載の方法。 - 前記複数のレンズを形成するステップは、前記半導体発光ダイオードを前記マウントに装着する前に、個々の半導体発光ダイオード上に個々のレンズを形成するステップを有する、請求項10に記載の方法。
- 前記複数の半導体発光ダイオード上に殻部を配置するステップを更に有する、請求項10に記載の方法。
- 前記殻部は、光の散乱を引き起こす材料を有する、請求項14に記載の方法。
- 前記殻部は、前記マウントの底部の下に延在する、請求項14に記載の方法。
- 前記マウントの端部の近くに配置された半導体発光ダイオード上に配置された前記殻部及びレンズは、前記マウントの上面に対する垂線に対して135°の角度で、光が前記殻部から脱出するように構成され、
前記マウントの上面に対する垂線に対して135°の角度で発せられる光の量は、発せられる光の強度が最大となる角度で発せられる光の量の少なくとも5%である、
請求項14に記載の方法。
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US201261587156P | 2012-01-17 | 2012-01-17 | |
US61/587,156 | 2012-01-17 | ||
PCT/IB2013/050054 WO2013108143A1 (en) | 2012-01-17 | 2013-01-03 | Semiconductor light emitting device lamp that emits light at large angles |
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JP6574090B2 JP6574090B2 (ja) | 2019-09-11 |
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US (2) | US9136448B2 (ja) |
EP (1) | EP2805349B1 (ja) |
JP (1) | JP6574090B2 (ja) |
KR (1) | KR102071088B1 (ja) |
CN (1) | CN104040716B (ja) |
ES (1) | ES2698271T3 (ja) |
WO (1) | WO2013108143A1 (ja) |
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DE102009015313B4 (de) * | 2009-03-27 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Anzeigeeinrichtung |
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- 2013-01-03 JP JP2014551698A patent/JP6574090B2/ja active Active
- 2013-01-03 KR KR1020147022786A patent/KR102071088B1/ko active IP Right Grant
- 2013-01-03 US US14/366,294 patent/US9136448B2/en active Active
- 2013-01-03 WO PCT/IB2013/050054 patent/WO2013108143A1/en active Application Filing
- 2013-01-03 EP EP13706062.0A patent/EP2805349B1/en active Active
- 2013-01-03 CN CN201380005798.2A patent/CN104040716B/zh active Active
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2015
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2018137335A (ja) * | 2017-02-22 | 2018-08-30 | 株式会社本田電子技研 | 自動ドア開閉制御用センサ |
JP7049769B2 (ja) | 2017-02-22 | 2022-04-07 | 株式会社本田電子技研 | 自動ドア開閉制御用センサ |
JP2019212894A (ja) * | 2018-05-30 | 2019-12-12 | ソウル セミコンダクター カンパニー リミテッドSeoul Semicondutor Co., Ltd. | 発光モジュール及び発光モジュール用ウインドーユニット |
JP7316808B2 (ja) | 2018-05-30 | 2023-07-28 | ソウル セミコンダクター カンパニー リミテッド | 発光モジュール、発光モジュール用ウインドーユニット及び街灯 |
Also Published As
Publication number | Publication date |
---|---|
CN104040716B (zh) | 2018-06-22 |
US20140367709A1 (en) | 2014-12-18 |
WO2013108143A1 (en) | 2013-07-25 |
EP2805349A1 (en) | 2014-11-26 |
JP6574090B2 (ja) | 2019-09-11 |
US20150380617A1 (en) | 2015-12-31 |
ES2698271T3 (es) | 2019-02-01 |
KR102071088B1 (ko) | 2020-01-29 |
CN104040716A (zh) | 2014-09-10 |
US9136448B2 (en) | 2015-09-15 |
EP2805349B1 (en) | 2018-10-10 |
KR20140114037A (ko) | 2014-09-25 |
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