JP2015225704A - Terminal - Google Patents

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JP2015225704A
JP2015225704A JP2014107976A JP2014107976A JP2015225704A JP 2015225704 A JP2015225704 A JP 2015225704A JP 2014107976 A JP2014107976 A JP 2014107976A JP 2014107976 A JP2014107976 A JP 2014107976A JP 2015225704 A JP2015225704 A JP 2015225704A
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metal
plating
terminal
portions
layers
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裕矢 岸端
Yuya Kishihata
裕矢 岸端
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Yazaki Corp
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Yazaki Corp
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Priority to PCT/JP2015/062489 priority patent/WO2015163439A1/en
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Abstract

PROBLEM TO BE SOLVED: To provide a terminal capable of being reduced in contact resistance without an increase in size thereof and complexity thereof as much as possible.SOLUTION: Terminals 1,10 are provided with conductive metal plating layers 5, 12 on the surfaces of base material layers 3a, 11a of contacts 2, 11. The plating layers 5, 12 comprise: oxidized metal plating portions 5A, 12A formed of a metal material to be oxidized; and spot metal plating portions 5B, 12B disposed in a scattered state with respect to the oxidized metal plating portions 5A, 12A, and formed of a metal material different from that of the oxidized metal plating portions 5A, 12A.

Description

本発明は、接点部を有する端子に関する。   The present invention relates to a terminal having a contact portion.

図４及び図５には、従来のメス端子とオス端子が示されている（類似技術として特許文献１参照）。図４及び図５に示すように、メス端子５１は、四角形状の箱部５２と、この箱部５２に一体に設けられ、箱部５２内に配置された弾性撓み部５３とを有する。弾性撓み部５３には、底面側に向かって突出するインデント部５４が設けられている。インデント部５４は、その外周面がほぼ球面形状であり、中心の頂点が最下方に位置している。   4 and 5 show a conventional female terminal and a male terminal (see Patent Document 1 as a similar technique). As shown in FIGS. 4 and 5, the female terminal 51 includes a rectangular box portion 52 and an elastic bending portion 53 provided integrally with the box portion 52 and disposed in the box portion 52. The elastic bending portion 53 is provided with an indent portion 54 that protrudes toward the bottom surface side. The indented portion 54 has a substantially spherical outer peripheral surface, and the center vertex is located at the lowest position.

又、メス端子５１には、高温環境下での接続信頼性の向上、腐食環境下での耐食性の向上等の観点から錫メッキが施されている。   The female terminal 51 is tin-plated from the viewpoints of improving connection reliability in a high-temperature environment and improving corrosion resistance in a corrosive environment.

オス端子６０は、平板状のタブ部６１を有する。オス端子６０には、高温環境下での接続信頼性の向上、腐食環境下での耐食性の向上等の観点から錫メッキが施されている。   The male terminal 60 has a flat tab portion 61. The male terminal 60 is tin-plated from the viewpoints of improving connection reliability in a high temperature environment and improving corrosion resistance in a corrosive environment.

上記構成において、図４の位置にあって、オス端子６０のタブ部６１をメス端子５１の箱部５２に挿入すると、弾性撓み部５３が撓み変形してタブ部６１の挿入が許容される。タブ部６１の挿入過程では、タブ部６１が弾性撓み部５３のインデント部５４上を摺動し、端子挿入完了位置では、図５、図６に示すように、弾性撓み部５３のインデント部５４とタブ部６１の面が接触する。   In the above configuration, when the tab portion 61 of the male terminal 60 is inserted into the box portion 52 of the female terminal 51 in the position of FIG. 4, the elastic bending portion 53 is deformed and insertion of the tab portion 61 is allowed. In the insertion process of the tab portion 61, the tab portion 61 slides on the indent portion 54 of the elastic deflection portion 53, and at the terminal insertion completion position, as shown in FIGS. 5 and 6, the indent portion 54 of the elastic deflection portion 53 is obtained. And the surface of the tab part 61 contact.

この従来例では、弾性撓み部５３の撓み復帰力を接触荷重として、メス端子５１のインデント部５４とオス端子６０のタブ部６１の接触面とが電気的に接触する。そして、この接触面を電流が流れることによってメス端子５１とオス端子６０間が通電する。   In this conventional example, the indented portion 54 of the female terminal 51 and the contact surface of the tab portion 61 of the male terminal 60 are in electrical contact with each other using the bending return force of the elastic bending portion 53 as a contact load. A current flows through the contact surface to energize the female terminal 51 and the male terminal 60.

ところで、弾性撓み部５２とタブ部６１等の外面には、全域に亘って錫メッキ処理されている。錫メッキし、その後にリフロー処理を行うと、次のような構造となる。図７に示すように、銅合金材の母材層５２ａ，６１ａの外面側に銅／錫合金層５２ｂ，６１ｂ、錫メッキ層５２ｃ，６１ｃが形成されると共に錫メッキ層５２ｃ，６１ｃの外面に酸化膜５２ｄ，６１ｄが形成される。酸化膜５２ｄ，６１ｄは、錫や銅に較べて電気比抵抗が非常に高い。そのため、接触抵抗の低減を図るために、酸化膜５２ｄ，６１ｄを破壊して錫メッキ層５２ｃ，６２ｃ同士の接触面（オーミック点）を多く作る必要がある。   By the way, the outer surfaces of the elastic deflection portion 52 and the tab portion 61 are tin-plated over the entire area. When tin plating is performed and then reflow treatment is performed, the following structure is obtained. As shown in FIG. 7, copper / tin alloy layers 52b and 61b and tin plating layers 52c and 61c are formed on the outer surfaces of the copper alloy base material layers 52a and 61a, and on the outer surfaces of the tin plating layers 52c and 61c. Oxide films 52d and 61d are formed. The oxide films 52d and 61d have a very high electrical resistivity as compared with tin and copper. Therefore, in order to reduce the contact resistance, it is necessary to destroy the oxide films 52d and 61d and to make many contact surfaces (ohmic points) between the tin plating layers 52c and 62c.

特開２００７−２８０８２５号公報JP 2007-280825 A

前記従来例の構造にあって、酸化膜５２ｄ，６１ｄの破壊を促進させるには、接点部間の接点圧力を大きくすることが考えられるが、端子５１，６０が大型化したり、複雑化したりする。   In the structure of the conventional example, in order to promote the destruction of the oxide films 52d and 61d, it is conceivable to increase the contact pressure between the contact portions. However, the terminals 51 and 60 are enlarged or complicated. .

そこで、本発明は、前記した課題を解決すべくなされたものであり、端子を大型化したり、極力複雑化したりすることなく、接触抵抗を低減できる端子を提供することを目的とする。   Therefore, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a terminal capable of reducing contact resistance without increasing the size of the terminal or making it as complex as possible.

本発明は、接点部の母材層の表面に導電性金属のメッキ層が設けられた端子であって、前記メッキ層は、酸化する金属材より形成された酸化金属メッキ部と、前記酸化金属メッキ部に対し点在状態で配置され、前記酸化金属メッキ部とは異なる金属材より形成されたスポット金属メッキ部とから構成されたことを特徴とする端子である。   The present invention is a terminal in which a conductive metal plating layer is provided on a surface of a base material layer of a contact portion, and the plating layer includes a metal oxide plating portion formed of a metal material to be oxidized, and the metal oxide It is a terminal characterized in that it is composed of spot metal plating portions that are arranged in a scattered state with respect to the plating portion and are formed of a metal material different from the metal oxide plating portion.

前記スポット金属メッキ部は、酸化する金属材より形成されるものであっても良い。前記スポット金属メッキ部は、酸化しない金属材より形成されるものであっても良い。   The spot metal plating part may be formed of a metal material to be oxidized. The spot metal plating portion may be formed of a metal material that does not oxidize.

本発明によれば、酸化金属メッキ部の表面には酸化膜が生成されるとともに、スポット金属メッキ部の表面には、スポット金属メッキ部が酸化する金属材のときには酸化金属メッキ部の酸化膜とは異種の酸化膜が形成さり、又、スポット金属メッキ部が酸化しない金属材のときには酸化膜自体が形成されない。このように、強度的に弱い酸化膜が形成されるため、接触荷重によって破壊されやすい。以上より、端子を大型化したり、極力複雑化したりすることなく、接触抵抗を低減できる。   According to the present invention, an oxide film is generated on the surface of the metal oxide plating portion, and the surface of the spot metal plating portion is formed with the oxide film of the metal oxide plating portion when the spot metal plating portion is a metal material to be oxidized. In this case, different types of oxide films are formed, and the oxide film itself is not formed when the spot metal plating portion is a metal material that is not oxidized. In this way, since an oxide film that is weak in strength is formed, it is easily broken by a contact load. As described above, the contact resistance can be reduced without increasing the size of the terminal or making it as complex as possible.

本発明の第１実施形態を示し、端子接続前のメス端子とオス端子の断面図である。It is sectional drawing of the female terminal and male terminal which show 1st Embodiment of this invention and does not connect a terminal. 本発明の第１実施形態を示し、（ａ）は端子接続状態のメス端子とオス端子の断面図、（ｂ）は弾性撓み部やタブ部の要部断面構成図、（ｃ）は弾性撓み部やタブ部の要部平面図である。1 shows a first embodiment of the present invention, (a) is a cross-sectional view of a female terminal and a male terminal in a terminal connection state, (b) is a cross-sectional configuration diagram of a principal part of an elastic bending portion and a tab portion, and (c) is an elastic bending. It is a principal part top view of a part and a tab part. 本発明の第２実施形態を示し、（ａ）は弾性撓み部やタブ部の要部断面構成図、（ｂ）は弾性撓み部やタブ部の要部平面図である。The 2nd Embodiment of this invention is shown, (a) is principal part sectional block diagram of an elastic bending part and a tab part, (b) is a principal part top view of an elastic bending part and a tab part. 従来例を示し、端子接続前のメス端子とオス端子の断面図である。It is a sectional view of a female terminal and a male terminal before showing a conventional example and connecting a terminal. 従来例を示し、端子接続状態のメス端子とオス端子の断面図である。It is a sectional view of a female terminal and a male terminal in a terminal connected state, showing a conventional example. 従来例を示し、接点部の要部側面図である。It is a principal part side view of a contact part which shows a prior art example. 従来例を示し、弾性撓み部やタブ部のメッキ層の腰部断面構成図である。It is a waist cross-section block diagram of the plating layer of an elastic bending part and a tab part, showing a conventional example.

以下、本発明の実施形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（第１実施形態）
図１及び図２は本発明の第１実施形態を示す。図１及び図２（ａ）に示すように、メス端子１は、メス側コネクタハウジング（図示せず）内の端子収容室に配置されている。メス端子１は、所定形状に打ち抜かれた導電性金属（例えば銅合金）を折り曲げ加工して形成されている。メス端子１は、第１接点部である箱部２を有する。箱部２は、前方が開口された方形状である。箱部２内には、箱部２の上面部より折り曲げられた弾性撓み部３が配置されている。弾性撓み部３には、底面側に向かって突出するインデント部４が設けられている。インデント部４は、その外周面がほぼ球面形状であり、中心の頂点が最下方に位置している。インデント部４は、撓み変形部３の撓み変形によって上方に変移できる。弾性撓み部３と固定面部である箱部２の底面部２ａは、間隔を置いて配置されている。弾性撓み部３と箱部２の底面部２ａの間に、オス端子１０が挿入される。 (First embodiment)
1 and 2 show a first embodiment of the present invention. As shown in FIGS. 1 and 2A, the female terminal 1 is arranged in a terminal accommodating chamber in a female connector housing (not shown). The female terminal 1 is formed by bending a conductive metal (for example, copper alloy) punched into a predetermined shape. The female terminal 1 has a box portion 2 that is a first contact portion. The box part 2 has a rectangular shape with an opening at the front. In the box part 2, an elastic bending part 3 bent from the upper surface part of the box part 2 is arranged. The elastic bending portion 3 is provided with an indent portion 4 protruding toward the bottom surface side. The indented portion 4 has a substantially spherical outer peripheral surface, and the center vertex is located at the lowest position. The indent portion 4 can be shifted upward by the bending deformation of the bending deformation portion 3. The elastic deflecting portion 3 and the bottom surface portion 2a of the box portion 2 which is a fixed surface portion are arranged with an interval therebetween. A male terminal 10 is inserted between the elastic bending portion 3 and the bottom surface portion 2 a of the box portion 2.

又、メス端子１の外面には、導電性金属のメッキ層５が形成されている。このメッキ層５については、下記に詳述する。   A conductive metal plating layer 5 is formed on the outer surface of the female terminal 1. The plated layer 5 will be described in detail below.

オス端子１０は、オス側コネクタハウジング（図示せず）内の端子収容室に配置されている。オス端子１０は、所定形状に打ち抜かれた導電性金属（例えば銅合金）を折り曲げ加工して形成されている。オス端子１０は、第２接点部であるタブ部１１を有する。タブ部１１は、フラットな板形状である。又、オス端子１０の外面には、導電性金属のメッキ層１２が形成されている。   The male terminal 10 is disposed in a terminal accommodating chamber in a male connector housing (not shown). The male terminal 10 is formed by bending a conductive metal (for example, copper alloy) punched into a predetermined shape. The male terminal 10 has a tab portion 11 that is a second contact portion. The tab portion 11 has a flat plate shape. A conductive metal plating layer 12 is formed on the outer surface of the male terminal 10.

次に、弾性撓み部３とタブ部１１箇所のメッキ層５，１２について説明する。メッキ層５，１２は、図２（ｂ）に示すように、銅合金材の母材層３ａ，１１ａの上に形成されている。メッキ層５，１２は、酸化する金属材より形成された酸化金属メッキ部５Ａ，１２Ａと、酸化金属メッキ部５Ａ，１２Ａとは材料が異なるが同じく酸化する金属材より形成されたスポット金属メッキ部５Ｂ，１２Ｂとから構成されている。この実施形態では、酸化金属メッキ部５Ａ，１２Ａの金属材は、錫（Ｓｎ）であり、スポット金属部５Ｂ，１２Ｂの金属材は、アルミニウム（ＡＬ）である。スポット金属メッキ部５Ｂ，１２Ｂは、酸化金属メッキ部５Ａ，１２Ａに対して領域が狭く、且つ、点在して配置されている（図２（ｃ）参照）。錫酸化膜７，１４とアルミ酸化膜６，１３は、厚みが異なる。これにより、メッキ層５，１２の表面は、凹凸面に形成されている。   Next, the plating layers 5 and 12 at the elastic bending portion 3 and the tab portion 11 will be described. As shown in FIG. 2B, the plating layers 5 and 12 are formed on the base material layers 3a and 11a of the copper alloy material. The plated layers 5 and 12 are made of oxidized metal plated portions 5A and 12A formed of a metal material to be oxidized, and spot metal plated portions formed of a metal material which is different from the oxidized metal plated portions 5A and 12A but is also oxidized. 5B and 12B. In this embodiment, the metal material of the metal oxide plating portions 5A and 12A is tin (Sn), and the metal material of the spot metal portions 5B and 12B is aluminum (AL). The spot metal plating portions 5B and 12B are narrower than the metal oxide plating portions 5A and 12A and are disposed in a scattered manner (see FIG. 2C). The tin oxide films 7 and 14 and the aluminum oxide films 6 and 13 have different thicknesses. Thereby, the surface of the plating layers 5 and 12 is formed in an uneven surface.

銅合金材の母材層３ａ，１１ａの上にメッキ処理し、その後にリフロー処理を行うと、図２（ｂ）に示す構造となる。つまり、酸化金属メッキ部５Ａ，１２Ａは、銅／錫合金層５ａ，１２ａと錫層５ｂ，１２ｂとなる。そして、錫層５ｂ，１２ｂの表面側に錫酸化膜６，１３が生成される。スポット金属メッキ部５Ｂ，１２Ｂは、アルミニウム材の中に銅が拡散されないために合金層に変化しないが、その表面側にはアルミ酸化膜７，１４が生成される。つまり、双方の接点部の表面側は、均一な錫酸化膜６，１３ではなく、錫酸化膜６，１３の中にアルミ酸化膜７，１７が点在された酸化膜が形成される。   When the copper alloy base material layers 3a and 11a are plated and then reflowed, the structure shown in FIG. 2B is obtained. That is, the metal oxide plated portions 5A and 12A become copper / tin alloy layers 5a and 12a and tin layers 5b and 12b. And the tin oxide films 6 and 13 are produced | generated by the surface side of the tin layers 5b and 12b. The spot metal plating portions 5B and 12B do not change into an alloy layer because copper is not diffused into the aluminum material, but aluminum oxide films 7 and 14 are formed on the surface side thereof. In other words, not the uniform tin oxide films 6 and 13 but the oxide films in which the aluminum oxide films 7 and 17 are scattered in the tin oxide films 6 and 13 are formed on the surface side of both contact portions.

上記構成において、メス側コネクタハウジング（図示せず）とオス側コネクタハウジング（図示せず）間をかん合すると、そのかん合過程ではオス端子１０のタブ部１１がメス端子１の箱部２に挿入される。すると、先ずタブ部１１の先端が弾性撓み部３に当接し、この当接箇所より更に挿入が進むと、弾性撓み部３が撓み変形してタブ部１１の挿入が許容される。タブ部１１の挿入過程では、インデント部４がタブ部１１の接触面を摺動し、端子挿入完了位置に達する（図２（ａ）参照）。   In the above configuration, when the female connector housing (not shown) and the male connector housing (not shown) are mated, the tab portion 11 of the male terminal 10 is connected to the box portion 2 of the female terminal 1 in the mating process. Inserted. Then, first, the tip of the tab portion 11 comes into contact with the elastic bending portion 3, and when the insertion further proceeds from this contact portion, the elastic bending portion 3 is bent and deformed, and insertion of the tab portion 11 is allowed. In the insertion process of the tab part 11, the indent part 4 slides on the contact surface of the tab part 11, and reaches a terminal insertion completion position (refer Fig.2 (a)).

以上説明したように、接点接続構造では、メッキ層５，１２は、酸化する金属材より形成された酸化金属メッキ部５Ａ，１２Ａと、酸化金属メッキ部５Ａ，１２Ａに対し点在状態で配置され、酸化金属メッキ部５Ａ，１２Ａとは材料が異なるが同じく酸化する金属材より形成されたスポット金属メッキ部５Ｂ，１２Ｂとから構成されている。従って、酸化金属メッキ部５Ａ，１２Ａの表面側とスポット金属メッキ部５Ｂ，１２Ｂの表面側には共に酸化膜６，１３、７，１４が生成されるため、均一な錫酸化膜６，１３ではなく、錫酸化膜６，１３の中にアルミ酸化膜７，１７が点在された酸化膜が形成される。その上、酸化膜は凹凸形状となる。このような酸化膜は、同一酸化材で、且つ、表面が均一な酸化膜よりも割れ易い、つまり、強度的に弱いため、接触荷重によって破壊されやすい。そのため、錫層５ｂ，１２ｂ同士の接触面（オーミック点）が多くできる。以上より、メス端子１やオス端子１０を大型化したり、極力複雑化したりすることなく、接触抵抗を低減できる。   As described above, in the contact connection structure, the plating layers 5 and 12 are disposed in a dotted state with respect to the metal oxide plating portions 5A and 12A formed of the metal material to be oxidized and the metal oxide plating portions 5A and 12A. The metal oxide plating parts 5A and 12A are made of spot metal plating parts 5B and 12B which are formed of a metal material which is different in material but is also oxidized. Therefore, since the oxide films 6, 13, 7, and 14 are formed on the surface side of the metal oxide plated portions 5A and 12A and the surface side of the spot metal plated portions 5B and 12B, the uniform tin oxide films 6 and 13 are not formed. Instead, an oxide film in which the aluminum oxide films 7 and 17 are scattered in the tin oxide films 6 and 13 is formed. In addition, the oxide film has an uneven shape. Such an oxide film is easier to break than an oxide film made of the same oxide material and having a uniform surface, that is, it is weak in strength, and is easily broken by a contact load. Therefore, the contact surface (ohmic point) between the tin layers 5b and 12b can be increased. As described above, the contact resistance can be reduced without increasing the size of the female terminal 1 or the male terminal 10 or making it as complex as possible.

メッキ層５，１２は、酸化金属メッキ部５Ａ，１２Ａとスポット金属メッキ部５Ｂ，１２Ｂから構成するので、端子挿入力の増大を招来することなく、接触抵抗の低減を図ることができる。   Since the plating layers 5 and 12 are composed of the metal oxide plating portions 5A and 12A and the spot metal plating portions 5B and 12B, the contact resistance can be reduced without increasing the terminal insertion force.

酸化金属メッキ部５Ａ，１２Ａの金属材は錫であり、スポット金属メッキ部５Ｂ，１２Ｂの金属材はアルミニウム（ＡＬ）であるため、錫層５ｂ、１２ｂとアルミニウム層との接触面（オーミック点）も形成されるため、接触抵抗の更なる向上が図れる。この実施形態では、酸化する金属材は、アルミニウムであるが、それ以外の導電性金属でも良い。   Since the metal material of the metal oxide plating portions 5A and 12A is tin and the metal material of the spot metal plating portions 5B and 12B is aluminum (AL), the contact surface (ohmic point) between the tin layers 5b and 12b and the aluminum layer. Therefore, contact resistance can be further improved. In this embodiment, the metal material to be oxidized is aluminum, but other conductive metals may be used.

（第２実施形態）
図３は、本発明の第２実施形態を示す。第２実施形態は、前記第１実施形態と比較して、弾性撓み部３とタブ部１１箇所のメッキ層５，１２の構成のみが相違する。メッキ層５，１２は、図３（ａ）に示すように、銅合金材の母材層３ａ，１１ａの上に形成されている。メッキ層５，１２は、酸化する金属材より形成された酸化金属メッキ部５Ａ，１２Ａと酸化しない金属材より形成されたスポット金属メッキ部５Ｃ，１２Ｃとから構成されている。この実施形態では、酸化金属メッキ部５Ａ，１２Ａの金属材は、錫（Ｓｎ）であり、スポット金属部５Ｂ，１２Ｂの金属材は、金（Ａｕ）である。スポット金属メッキ部５Ｃ，１２Ｃは、酸化金属メッキ部５Ａ，１２Ａに対して領域が狭く、且つ、点在して配置されている（図３（ｂ）参照）。 (Second Embodiment)
FIG. 3 shows a second embodiment of the present invention. The second embodiment is different from the first embodiment only in the configurations of the elastic bending portion 3 and the plating layers 5 and 12 at the 11 tab portions. As shown in FIG. 3A, the plated layers 5 and 12 are formed on the base material layers 3a and 11a of the copper alloy material. The plated layers 5 and 12 are composed of metal oxide plated portions 5A and 12A formed from a metal material that oxidizes and spot metal plated portions 5C and 12C formed from a metal material that does not oxidize. In this embodiment, the metal material of the metal oxide plating portions 5A and 12A is tin (Sn), and the metal material of the spot metal portions 5B and 12B is gold (Au). The spot metal plating parts 5C and 12C are narrower than the metal oxide plating parts 5A and 12A, and are arranged in a scattered manner (see FIG. 3B).

銅合金材の母材層３ａ，１１ａの上にメッキ処理し、その後にリフロー処理を行うと、図３（ａ）に示す構造となる。つまり、酸化金属メッキ部５Ａ，１２Ａは、銅／錫合金層５ａ，１２ａと錫層５ｂ，１２ｂとなる。そして、錫層５ｂ，１２ｂの表面側に錫酸化膜６，１３が生成される。スポット金属メッキ部５Ｃ，１２Ｃは、金材の中に銅が拡散されないために合金層に変化せず、その表面側に酸化膜も生成されない。   When the copper alloy base material layers 3a and 11a are plated and then reflowed, the structure shown in FIG. 3A is obtained. That is, the metal oxide plated portions 5A and 12A become copper / tin alloy layers 5a and 12a and tin layers 5b and 12b. And the tin oxide films 6 and 13 are produced | generated by the surface side of the tin layers 5b and 12b. The spot metal plating portions 5C and 12C do not change into an alloy layer because copper is not diffused into the gold material, and no oxide film is generated on the surface side thereof.

他の構成は、前記第１実施形態と同様であるため、説明を省略する。   Since other configurations are the same as those of the first embodiment, description thereof will be omitted.

この第２実施形態の接点接続構造では、メッキ層５，１２は、酸化する金属材より形成された酸化金属メッキ部５Ａ，１２Ａと、酸化金属メッキ部５Ａ，１２Ａに対し点在状態で配置され、酸化しない金属材より形成されたスポット金属メッキ部５Ｃ，１２Ｃとから構成されている。従って、酸化金属メッキ部５Ａ，１２Ａの表面には錫酸化膜６，１３が生成されるが、スポット金属メッキ部５Ｃ，１２Ｃの表面側には酸化膜が生成されないため、接点部の表面には、欠落箇所のある錫酸化膜６，１３が生成される。欠落箇所のある錫酸化膜６，１３は、強度的に弱いため、接触荷重によって破壊されやすい。そのため、錫層５ｂ，１２ｂ同士の接触面（オーミック点）が多くできる。以上より、メス端子１やオス端子１０を大型化したり、極力複雑化したりすることなく、接触抵抗を低減できる。   In the contact connection structure of the second embodiment, the plating layers 5 and 12 are arranged in a dotted state with respect to the metal oxide plating portions 5A and 12A formed of a metal material to be oxidized and the metal oxide plating portions 5A and 12A. The spot metal plating portions 5C and 12C are formed of a metal material that does not oxidize. Accordingly, tin oxide films 6 and 13 are formed on the surfaces of the metal oxide plated portions 5A and 12A, but no oxide film is generated on the surface side of the spot metal plated portions 5C and 12C. Then, tin oxide films 6 and 13 with missing portions are generated. Since the tin oxide films 6 and 13 having the missing portions are weak in strength, they are easily broken by a contact load. Therefore, the contact surface (ohmic point) between the tin layers 5b and 12b can be increased. As described above, the contact resistance can be reduced without increasing the size of the female terminal 1 or the male terminal 10 or making it as complex as possible.

メッキ層５，１２が酸化金属メッキ部５Ａ，１２Ａとスポット金属メッキ部５Ｃ，１２Ｃから構成するので、端子挿入力の増大を招来することなく、接触抵抗の低減を図ることができる。   Since the plating layers 5 and 12 are composed of the metal oxide plating portions 5A and 12A and the spot metal plating portions 5C and 12C, the contact resistance can be reduced without increasing the terminal insertion force.

酸化金属メッキ部５Ａ，１２Ａの金属材は錫であり、スポット金属メッキ部５Ｃ，１２Ｃの金属材は金（Ａｕ）であるため、金（Ａｕ）からなるスポット金属メッキ部５Ｃ，１２Ｃと錫層５ｂ，１２ｂの接触面（オーミック点）も形成されるため、接触抵抗の更なる向上が図れる。この実施形態では、酸化しない金属材は、金であるが、銀（Ａｇ）であってもよく、その以外の導電性金属でも良い。   Since the metal material of the metal oxide plating parts 5A and 12A is tin and the metal material of the spot metal plating parts 5C and 12C is gold (Au), the spot metal plating parts 5C and 12C made of gold (Au) and the tin layer are used. Since contact surfaces (ohmic points) 5b and 12b are also formed, contact resistance can be further improved. In this embodiment, the metal material that does not oxidize is gold, but may be silver (Ag) or other conductive metal.

（その他）
各実施形態では、本発明に係るメッキ層５，１２は、メス端子１とオス端子１０の双方の端子に適用されているが、いずれか一方に適用しても良いことはもちろんである。酸化金属メッキ部５Ａ，１２Ａとスポット金属メッキ部５Ｂ，１２Ｂ（５Ｃ，１２Ｃ）からなるメッキ層５，１２は、第１接点部である箱部２（弾性撓み部３と底面部２ａ）と第２接点部であるタブ部１１にのみ少なくとも設ければ良い。より詳細には、相手端子側の接点が摺動し、端子挿入完了位置で相手側接点が位置する領域に設ければ良い。 (Other)
In each embodiment, the plated layers 5 and 12 according to the present invention are applied to both terminals of the female terminal 1 and the male terminal 10, but it goes without saying that it may be applied to either one. The plated layers 5 and 12 including the metal oxide plated portions 5A and 12A and the spot metal plated portions 5B and 12B (5C and 12C) are connected to the box portion 2 (the elastic deflecting portion 3 and the bottom surface portion 2a) as the first contact portion. It is only necessary to provide at least the tab portion 11 which is the two contact portion. More specifically, it may be provided in a region where the contact on the mating terminal side slides and the mating contact is located at the terminal insertion completion position.

１ メス端子（第１端子）
２ 箱部（第１接点部）
３ａ，１１ａ 母材層
５，１２ メッキ層
５Ａ，１２Ａ 酸化金属メッキ部
５Ｂ，５Ｃ，１２Ｂ，１２Ｃ スポット金属メッキ部
１０ オス端子（第２端子）
１１ タブ部（第２接点部） 1 Female terminal (1st terminal)
2 Box part (first contact part)
3a, 11a Base material layer 5,12 Plating layer 5A, 12A Metal oxide plating part 5B, 5C, 12B, 12C Spot metal plating part 10 Male terminal (second terminal)
11 Tab part (second contact part)

Claims (3)

接点部の母材層の表面に導電性金属のメッキ層が設けられた端子であって、
前記メッキ層は、酸化する金属材より形成された酸化金属メッキ部と、前記酸化金属メッキ部に対し点在状態で配置され、前記酸化金属メッキ部とは異なる金属材より形成されたスポット金属メッキ部とから構成されたことを特徴とする端子。 A terminal provided with a conductive metal plating layer on the surface of the base material layer of the contact portion;
The plated layer is a metal oxide plated portion formed of a metal material to be oxidized, and a spot metal plated formed of a metal material different from the metal oxide plated portion, arranged in a scattered state with respect to the metal oxide plated portion. A terminal characterized by comprising a part. 請求項１記載の端子であって、
前記スポット金属メッキ部は、酸化する金属材より形成されているであることを特徴とする端子。 The terminal according to claim 1,
The spot metal plating portion is formed of a metal material to be oxidized. 請求項１記載の端子であって、
前記スポット金属メッキ部は、酸化しない金属材より形成されているであることを特徴とする端子。 The terminal according to claim 1,
The spot metal plating part is formed of a metal material that does not oxidize.
JP2014107976A 2014-04-24 2014-05-26 Terminal Abandoned JP2015225704A (en)

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PCT/JP2015/062489 WO2015163439A1 (en) 2014-04-24 2015-04-24 Terminal contact

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018116877A (en) * 2017-01-20 2018-07-26 古河電気工業株式会社 Fitting type terminal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006077307A (en) * 2004-09-10 2006-03-23 Kobe Steel Ltd Electrically conductive material for connecting parts and production method therefor
JP2012214864A (en) * 2011-03-31 2012-11-08 Jx Nippon Mining & Metals Corp Sn PLATING MATERIAL
JP2013213249A (en) * 2012-03-30 2013-10-17 Jx Nippon Mining & Metals Corp Sn-PLATED MATERIAL
WO2014034460A1 (en) * 2012-08-31 2014-03-06 株式会社オートネットワーク技術研究所 Plated terminal for connector, and terminal pair

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006077307A (en) * 2004-09-10 2006-03-23 Kobe Steel Ltd Electrically conductive material for connecting parts and production method therefor
JP2012214864A (en) * 2011-03-31 2012-11-08 Jx Nippon Mining & Metals Corp Sn PLATING MATERIAL
JP2013213249A (en) * 2012-03-30 2013-10-17 Jx Nippon Mining & Metals Corp Sn-PLATED MATERIAL
WO2014034460A1 (en) * 2012-08-31 2014-03-06 株式会社オートネットワーク技術研究所 Plated terminal for connector, and terminal pair

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018116877A (en) * 2017-01-20 2018-07-26 古河電気工業株式会社 Fitting type terminal

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