JP2015196265A - 三次元積層装置及び三次元積層方法 - Google Patents
三次元積層装置及び三次元積層方法 Download PDFInfo
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- JP2015196265A JP2015196265A JP2014074059A JP2014074059A JP2015196265A JP 2015196265 A JP2015196265 A JP 2015196265A JP 2014074059 A JP2014074059 A JP 2014074059A JP 2014074059 A JP2014074059 A JP 2014074059A JP 2015196265 A JP2015196265 A JP 2015196265A
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- Powder Metallurgy (AREA)
Abstract
【解決手段】基台部に成形層を積層させて三次元形状を形成する三次元積層装置であって、基台部に向かって粉末材料を噴射し、粉末材料を供給する粉末供給部と、粉末供給部から基台部に向けて移動する粉末材料に光ビームを照射し、粉末材料を溶融させて、溶融した粉末材料を基台部上で固化させて成形層を形成する光照射部と、粉末供給部及び光照射部の動作を制御する制御装置と、を有する。
【選択図】図1
Description
前記制御装置は、前記識別部の前記粉末材料の識別結果に応じて、前記粉末導入部から前記粉末供給部への前記粉末材料の導入を制御することが好ましい。
2 三次元積層室
3 予備室
4 積層ヘッド収納室
4a、5a Z軸スライド部
5 機械加工部収納室
6、7 扉
10 ベッド
11 テーブル部
12 積層ヘッド
13 機械加工部
15 Y軸スライド部
16 X軸スライド部
17 回転テーブル部
18、19 ベローズ
20 制御装置
22 工具
23 ノズル
24 先端部
25 空気排出部
30 形状計測部
31 加熱ヘッド
32 機械加工部計測部
33 工具交換部
34 ノズル交換部
35、35A 粉末導入部
36 基台移動部
37 空気排出部
38 ガス導入部
39 粉末回収部
41 外管
42 内管
43 粉末流路
44 レーザ経路
46 本体
47 光源
48 光ファイバ
49 集光部
51 入力部
52 制御部
53 記憶部
54 出力部
55 通信部
56 先端
57 光源部
58 撮像部
81、81A 粉末収納部
82、82A 粉末識別部
83 カートリッジ
84 材料表示部
85 導入部
86 サイクロン部
87 気体排出部
88 粉末排出部
91 台座
92、93 成形層
95 円板部
96 ねじ穴部
97 軸部
98 円錐台部
99 部材
100 基台部
102、104、106、108 矢印
110、112、114 回転軸
120、120a 温度検出部
130 質量検出部
140 焦点位置調整部
150 粉末供給管
152 分配部
154 分岐管
155a、155b 範囲
156 混合部
156a、156b 撹拌板
158 整流装置
A 溶融体
B 固化体
L レーザ光
P 粉末
Claims (29)
- 基台部に成形層を積層させて三次元形状を形成する三次元積層装置であって、
前記基台部に向かって粉末材料を噴射し、粉末材料を供給する粉末供給部と、
前記粉末供給部から前記基台部に向けて移動する前記粉末材料に光ビームを照射し、前記粉末材料を溶融させて、溶融した前記粉末材料を前記基台部上で固化させて前記成形層を形成する光照射部と、
前記粉末供給部及び前記光照射部の動作を制御する制御装置と、を有する三次元積層装置。 - 前記粉末供給部に供給する前記粉末材料を貯留する複数の貯留部を備え、前記貯留部を切り換えることで、前記粉末供給部に導入させる前記粉末材料を切り換える粉末導入部を有する請求項1に記載の三次元積層装置。
- 前記粉末導入部は、3つ以上の貯留部を有し、3種類以上の粉末材料を前記粉末供給部に導入でき、
前記制御装置は、前記粉末供給部に導入させる前記粉末材料を第1粉末材料から第2粉末材料に切り換える場合、前記第1粉末材料で前記成形層を形成した後、前記第1粉末材料と前記第2粉末材料の両方に親和性の高い中間粉末材料で前記成形層を形成した後、前記第2粉末材料で前記成形層を形成する請求項2に記載の三次元積層装置。 - 前記粉末導入部は、2つ以上の貯留部を有し、2種類以上の粉末材料を前記粉末供給部に導入でき、
前記制御装置は、前記粉末供給部に導入させる前記粉末材料を第1粉末材料から第2粉末材料に切り換える場合、前記第1粉末材料で前記成形層を形成した後、前記第1粉末材料を前記粉末供給部に供給した状態で、前記第2粉末材料の前記粉末供給部への供給を開始し、前記第1粉末材料の供給量を減少させつつ前記第2粉末材料の供給量を増加させて供給比率を変化させる請求項2に記載の三次元積層装置。 - 工具を備え、前記工具で前記成形層を機械加工する機械加工部を備える請求項2から4のいずれか一項に記載の三次元積層装置。
- 前記粉末供給部は、前記光照射部の外周に同心円状に配置され、前記光照射部の前記光ビームが通過する経路を囲う内管と前記内管を覆う外管との間が前記粉末材料の流れる粉末流路となる請求項1から5のいずれか一項に記載の三次元積層装置。
- 前記粉末供給部の外周側に前記光照射部の外周に同心円状に配置され、前記粉末流路よりも外側から前記粉末材料が噴射される領域の外周を囲い、かつ、前記基台部に向けて噴射されるシールドガスを供給するシールドガス供給部をさらに有する請求項6に記載の三次元積層装置。
- 前記光照射部で照射される前記光ビームの焦点位置を調整する焦点位置調整部をさらに有する請求項1から7のいずれか一項に記載の三次元積層装置。
- 前記焦点位置調整部は、前記光照射部の位置を移動させる機構である請求項8に記載の三次元積層装置。
- 前記焦点位置調整部は、前記光照射部の集光光学系を調整し、焦点距離または焦点位置を移動させる機構である請求項8に記載の三次元積層装置。
- 前記成形層の表面の温度を検出する温度検出部を有し、
前記制御装置は、前記温度検出部による前記成形層の表面温度の計測結果に応じて、前記光照射部から出力する光ビームの強度を制御する請求項1から10のいずれか一項に記載の三次元積層装置。 - 前記制御装置は、前記温度検出部による前記成形層の表面温度の計測結果と、前記基台部及び前記成形層の特性とに基づいて、温度を検出する位置を特定し、特定した位置の検出結果に基づいて、前記光照射部から出力する光ビームの強度を制御する請求項11に記載の三次元積層装置。
- 前記成形層の表面のプラズマ発光を検出するプラズマ発光検出部を有し、
前記制御装置は、前記プラズマ発光検出部による計測結果に応じて、前記光照射部から出力する光ビームの強度を制御する請求項1から12のいずれか一項に記載の三次元積層装置。 - 前記成形層の表面からの反射光を検出する反射光検出部を有し、
前記制御装置は、前記反射光検出部による計測結果に応じて、前記光照射部から出力する光ビームの強度を制御する請求項1から13のいずれか一項に記載の三次元積層装置。 - 前記光照射部及び前記粉末供給部と、前記基台部と、を相対移動させる移動機構を有し、
前記制御装置は、前記移動機構によって前記基台部に対して前記光照射部及び前記粉末供給部が通過する経路を決定する請求項1から14のいずれか一項に記載の三次元積層装置。 - 前記成形層の表面形状を計測する形状計測部を有し、
前記制御装置は、前記形状計測部による前記成形層の表面形状の計測結果に応じて、前記粉末供給部、前記光照射部及び前記移動機構の動作を制御する請求項15に記載の三次元積層装置。 - 前記光照射部は、前記光ビームのプロファイルを調整可能である請求項1から16のいずれか一項に記載の三次元積層装置。
- 前記光照射部は、前記光ビームをパルス波で照射するモードと連続波で照射するモードを切り換え可能である請求項1から17のいずれか一項に記載の三次元積層装置。
- 前記粉末供給部から供給され、前記光ビームで溶解されなかった粉末材料を回収する粉末回収部を有する請求項1から18のいずれか一項に記載の三次元積層装置。
- 前記粉末回収部で回収した回収物を粉末材料の特性ごとに分離する分別部をさらに有する請求項19に記載の三次元積層装置。
- 前記粉末供給部に供給する前記粉末材料を貯留する貯留部と、前記貯留部に貯留されている前記粉末材料を識別する識別部と、を備え、前記識別部で識別した前記貯留部の前記粉末材料を前記粉末供給部に前記粉末材料を導入させる粉末導入部を有し、
前記制御装置は、前記識別部の前記粉末材料の識別結果に応じて、前記粉末導入部から前記粉末供給部への前記粉末材料の導入を制御する請求項1から20のいずれか一項に記載の三次元積層装置。 - 前記制御装置は、前記粉末導入部による前記粉末材料の識別結果に応じて、さらに前記粉末供給部及び前記光照射部の少なくとも一方の動作を制御する請求項21に記載の三次元積層装置。
- 前記制御装置は、前記識別部の前記粉末材料の識別結果及び異なる粉末材料を混合して前記粉末供給部から供給する指示に基づいて、前記粉末導入部から前記粉末供給部への異なる前記粉末材料を混合して供給させる請求項21または22に記載の三次元積層装置。
- 基台部に成形層を積層して三次元形状物を形成する三次元積層方法であって、
粉末材料を基台部に向かって噴射しつつ、前記粉末材料に光ビームを照射することにより前記粉末材料を溶融させ、前記溶融した粉末材料を前記基台部上で固化させることにより前記基台部上に成形層を形成し、当該成形層を積層する三次元積層方法。 - 前記成形層の位置を検出し、前記成形層の位置に応じて前記光ビームの焦点位置を調整する請求項24に記載の三次元積層方法。
- 前記成形層の表面の温度を検出し、前記成形層の表面温度の計測結果に応じて、出力する光ビームの強度を制御する請求項25または26に記載の三次元積層方法。
- 前記成形層の表面のプラズマ発光を検出し、前記成形層のプラズマ発光の計測結果に応じて、出力する光ビームの強度を制御する請求項24から26のいずれか一項に記載の三次元積層方法。
- 前記成形層の表面の反射光を検出し、前記成形層の反射光の計測結果に応じて、出力する光ビームの強度を制御する請求項24から27のいずれか一項に記載の三次元積層方法。
- 形成する前記成形層に応じて、前記光ビームをパルス波で照射するモードと連続波で照射するモードを切り換える請求項24から28のいずれか一項に記載の三次元積層方法。
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TWI623412B (zh) | 2018-05-11 |
RU2016142283A3 (ja) | 2018-05-08 |
TW201600323A (zh) | 2016-01-01 |
CN106163774A (zh) | 2016-11-23 |
US10639740B2 (en) | 2020-05-05 |
EP3112134A4 (en) | 2017-08-09 |
JP6359316B2 (ja) | 2018-07-18 |
BR112016021764B1 (pt) | 2021-11-03 |
KR20160128383A (ko) | 2016-11-07 |
CN106163774B (zh) | 2018-09-28 |
BR112016021764A2 (pt) | 2017-08-15 |
EP3112134B1 (en) | 2020-03-04 |
US20170144248A1 (en) | 2017-05-25 |
KR20180049215A (ko) | 2018-05-10 |
RU2016142283A (ru) | 2018-05-08 |
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EP3112134A1 (en) | 2017-01-04 |
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