JP2015160895A - Conductive double-sided tape and electronic apparatus using the conductive double-sided tape - Google Patents

Conductive double-sided tape and electronic apparatus using the conductive double-sided tape Download PDF

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JP2015160895A
JP2015160895A JP2014036826A JP2014036826A JP2015160895A JP 2015160895 A JP2015160895 A JP 2015160895A JP 2014036826 A JP2014036826 A JP 2014036826A JP 2014036826 A JP2014036826 A JP 2014036826A JP 2015160895 A JP2015160895 A JP 2015160895A
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conductive
sided tape
double
adhesive
conductive double
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幹雄 山根
Mikio Yamane
幹雄 山根
佐藤　直紀
Naoki Sato
直紀 佐藤
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Sharp Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a conductive double-sided tape capable of realizing stable conduction performance by stably reducing resistance value by contacting between respective members in an adhesive surface.SOLUTION: Provided is a conductive double-sided tape 101 comprising: a sheet member with conductivity in which adhesive faces 30A, 30B are formed at the surface and back; and a metal film 200 as a conductive material pasted on the sheet member, in which at least one side of the surface and back of the sheet-shaped member includes: a conduction part pasted with the metal film; and an adhesive part to which an adhesive layer is exposed, and conduction members are joined each other.

Description

本開示は、導電両面テープ、および導電両面テープが使用された電子機器に関し、特に、導電両面テープに安定した性能を発揮させるための技術に関する。   The present disclosure relates to a conductive double-sided tape and an electronic device using the conductive double-sided tape, and particularly to a technique for causing a conductive double-sided tape to exhibit stable performance.

導電両面テープは、粘着性と導電性とを有しており、例えば金属製の筐体と導電部材とを接着させて導通させる場合や、プリント基板のグランドと導電性を有するケースとを密着させる場合など様々な用途に使用される。   The conductive double-sided tape has adhesiveness and conductivity. For example, when a metal casing and a conductive member are bonded to conduct, or a printed circuit board ground and a conductive case are brought into close contact with each other. Used for various purposes.

導電両面テープに関する技術は様々なものが知られている。例えば、特開２００２−３２７１５４号公報（特許文献１）は、十分な粘着性能と導電性能とを兼ね備え、作業性の良い導電両面テープであって、軽くて薄い導電両面テープを提供するための技術を記載している。具体的には、特許文献１には、導電性能を有する布材に対し粘着剤を塗布してシート状に形成された基材層と、導電フィラーとを備える導電両面テープについて記載している。特許文献１は、導電フィラーを、基材層の上から吹き付けること等によって、粘着剤の作用によって基材層に導電フィラーを固定することを記載している。   Various techniques relating to the conductive double-sided tape are known. For example, Japanese Patent Application Laid-Open No. 2002-327154 (Patent Document 1) is a technique for providing a light and thin conductive double-sided tape that is a conductive double-sided tape having both sufficient adhesive performance and conductive performance and good workability. Is described. Specifically, Patent Document 1 describes a conductive double-sided tape including a base material layer formed in a sheet shape by applying an adhesive to a cloth material having conductive performance, and a conductive filler. Patent document 1 has described fixing a conductive filler to a base material layer by the effect | action of an adhesive, such as spraying a conductive filler from on a base material layer.

特開２００２−３２７１５４号公報JP 2002-327154 A

しかし、通常、導電両面テープで接合した部材間の導通性能を安定して確保するには、導通させる部材同士を密着させるように、ある程度、強い圧力を、部材と部材との接着面に対して加えることが必要となる。部材と部材との接着面に加えられる圧力が不十分であると、部材同士の接着がまばらとなる、あるいは導電テープ内部の導通が不安定となり、導通性能にばらつきが生じ、部材間の導通性能が不安定となる。   However, in general, in order to stably secure the conduction performance between the members joined by the conductive double-sided tape, a certain amount of strong pressure is applied to the adhesion surface between the member and the member so that the members to be conducted are brought into close contact with each other. It is necessary to add. If the pressure applied to the bonding surface between the members is insufficient, the bonding between the members will be sparse, or the conduction inside the conductive tape will become unstable, resulting in variations in the conduction performance, and the conduction performance between the members. Becomes unstable.

したがって、導電両面テープによって部材同士を導通させる場合に、接着面において部材同士が接触することによる抵抗値を安定して低くすることで、十分な導通性能を実現するための技術が必要とされている。   Therefore, when conducting members with a conductive double-sided tape, there is a need for a technique for realizing sufficient conduction performance by stably reducing the resistance value due to contact between members on the adhesive surface. Yes.

一実施形態に従う導電両面テープは、表裏に粘着面が形成されている導電性を有するシート状部材と、シート状部材に貼りあわされた導電性材料とを備える。シート状部材の表裏の少なくとも一面は、導電性材料が貼りあわされた導通部と、粘着面が露呈した粘着部とを含む。   The conductive double-sided tape according to an embodiment includes a conductive sheet-like member having adhesive surfaces formed on the front and back sides, and a conductive material attached to the sheet-like member. At least one surface of the front and back surfaces of the sheet-like member includes a conductive portion on which a conductive material is pasted and an adhesive portion where the adhesive surface is exposed.

別の実施形態に従うと、導電両面テープが使用された電子機器が提供される。電子機器は、第１の導電部材と、第２の導電部材とを備える。第１の導電部材と第２の導電部材とは、導電両面テープにより貼り合わせられている。導電両面テープは、表裏に粘着面が形成されている導電性を有するシート状部材と、シート状部材に貼りあわされた導電性材料とを備える。シート状部材の表裏の少なくとも一面は、導電性材料が貼りあわされた導通部と、粘着面が露呈した粘着部とを含む。   According to another embodiment, an electronic device using a conductive double-sided tape is provided. The electronic device includes a first conductive member and a second conductive member. The first conductive member and the second conductive member are bonded together with a conductive double-sided tape. The conductive double-sided tape includes a conductive sheet-like member having an adhesive surface formed on the front and back sides, and a conductive material attached to the sheet-like member. At least one surface of the front and back surfaces of the sheet-like member includes a conductive portion on which a conductive material is pasted and an adhesive portion where the adhesive surface is exposed.

上記一実施形態によると、導電両面テープによって接合させる導電部材同士が接触する部分の抵抗値を安定して低下させることができ、十分な粘着性能と導電性能とを兼ね備えることが可能となる。   According to the one embodiment, it is possible to stably reduce the resistance value of the portion where the conductive members joined by the conductive double-sided tape are in contact with each other, and it is possible to have both sufficient adhesive performance and conductive performance.

この発明の上記および他の目的、特徴、局面および利点は、添付の図面と関連して理解されるこの発明に関する次の詳細な説明から明らかとなるであろう。   The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention taken in conjunction with the accompanying drawings.

関連技術における導電両面テープの外観および断面を示す図である。It is a figure which shows the external appearance and cross section of the electroconductive double-sided tape in related technology. 実施の形態１の導電両面テープ１０１の外観および断面を示す図である。It is a figure which shows the external appearance and cross section of the conductive double-sided tape 101 of Embodiment 1. FIG. 実施の形態２の導電両面テープ１０２の外観および断面を示す図である。It is a figure which shows the external appearance and cross section of the electroconductive double-sided tape 102 of Embodiment 2. FIG. 電子機器１の分解斜視図およびパネル４とプリント基板５との接合面の断面を示す図である。FIG. 2 is an exploded perspective view of the electronic device 1 and a cross section of a joint surface between the panel 4 and the printed circuit board 5.

以下、図面を参照しつつ、本発明の実施の形態について説明する。以下の説明では、同一の部品には同一の符号を付してある。それらの名称および機能も同じである。したがって、それらについての詳細な説明は繰り返さない。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

＜関連技術の導電両面テープ＞
まず、実施の形態にかかる導電両面テープと比較するため、関連技術における導電両面テープについて説明する。なお、ここで説明する両面テープは一例であり、他にもテープ状の粘着剤の中に導電性物質を含有させたタイプ等もあるが、表裏両面に粘着面を有する両面テープであれば、本発明が適用される。 <Related technology conductive double-sided tape>
First, in order to compare with the conductive double-sided tape concerning embodiment, the conductive double-sided tape in related technology is demonstrated. In addition, the double-sided tape described here is an example, and there are other types including a conductive substance in a tape-like adhesive, but if it is a double-sided tape having adhesive surfaces on both front and back sides, The present invention is applied.

図１は、関連技術における導電両面テープの外観および断面を示す図である。図１（Ａ）は、関連技術における導電両面テープ１００の外観を示す図である。図１（Ｂ）は、関連技術における導電両面テープ１００のＩ−Ｉ’線の断面を示す図である。   FIG. 1 is a diagram showing an appearance and a cross section of a conductive double-sided tape in the related art. FIG. 1A is a diagram illustrating an appearance of a conductive double-sided tape 100 in the related art. FIG. 1B is a diagram showing a cross section taken along line I-I ′ of the conductive double-sided tape 100 in the related art.

図１（Ａ）に示すように、導電両面テープ１００は、シート状の部材が巻き取られた状態から、順次、導電両面テープ１００を引き出すことで使用される。図１（Ｂ）に示すように、導電両面テープ１００は、基材層２０と、基材層２０の表裏に塗布される粘着層３０（図１では粘着層３０Ａと粘着層３０Ｂとして示す）と、粘着層３０が塗布された基材層２０を保護するためのセパレータ４０（図１ではセパレータ４０Ａとセパレータ４０Ｂとして示す）とを含む。   As shown in FIG. 1A, the conductive double-sided tape 100 is used by sequentially pulling out the conductive double-sided tape 100 from a state in which a sheet-like member is wound. As shown in FIG. 1B, the conductive double-sided tape 100 includes a base layer 20 and an adhesive layer 30 (shown as an adhesive layer 30A and an adhesive layer 30B in FIG. 1) applied to the front and back of the base layer 20. The separator 40 for protecting the base material layer 20 to which the adhesive layer 30 is applied (shown as a separator 40A and a separator 40B in FIG. 1) is included.

基材層２０は、例えば、導電性を有する布材、不織布などであり、シート状に形成されている。基材層２０の厚みは、例えば厚さ０．１ｍｍ程度のものを使用することができる。不織布としては、例えばカーボン繊維製のものを使用することができる。このような不織布に対し、金属皮膜をスパッタリングによって形成することで、導電性を有する基材層２０を形成する。また、導電性を有していない不織布に金属メッキを施す等により、導電性を有する基材層２０を形成することとしてもよい。   The base material layer 20 is, for example, a conductive cloth material or a non-woven fabric, and is formed in a sheet shape. For example, a thickness of the base layer 20 of about 0.1 mm can be used. As a nonwoven fabric, the thing made from carbon fiber can be used, for example. By forming a metal film on such a nonwoven fabric by sputtering, the base material layer 20 having conductivity is formed. Moreover, it is good also as forming the base material layer 20 which has electroconductivity by performing metal plating etc. to the nonwoven fabric which does not have electroconductivity.

シート状の基材層２０の表裏に、粘着層３０が塗布されている。粘着層３０は、例えばスプレー等により基材層２０の表裏にそれぞれ塗布される。これにより、粘着層３０Ａと粘着層３０Ｂとが基材層２０に形成される。粘着層３０としては、例えば、アクリル系の粘着剤、シリコン系の粘着剤、および合成ゴム系の粘着剤その他の粘着剤を使用することができる。また、基材層２０に塗布された粘着層３０に、導電性のフィラー等を吹き付けること等により、粘着層３０の導電性能を向上させることとしてもよい。   An adhesive layer 30 is applied to the front and back of the sheet-like base material layer 20. The adhesive layer 30 is applied to the front and back of the base material layer 20 by spraying, for example. Thereby, the adhesive layer 30 </ b> A and the adhesive layer 30 </ b> B are formed on the base material layer 20. As the adhesive layer 30, for example, an acrylic adhesive, a silicon adhesive, a synthetic rubber adhesive, and other adhesives can be used. Moreover, it is good also as improving the electroconductive performance of the adhesion layer 30 by spraying a conductive filler etc. on the adhesion layer 30 apply | coated to the base material layer 20. FIG.

セパレータ４０は、粘着層３０の粘着性能が劣化しないよう、導電両面テープ１００の使用時に、使用者によってはがされる保護用のフィルムである。   The separator 40 is a protective film that is peeled off by the user when the conductive double-sided tape 100 is used so that the adhesive performance of the adhesive layer 30 does not deteriorate.

例えば金属ケース、プリント基板のグランド等の導電性部材同士を導電両面テープ１００によって接合する場合、導電両面テープ１００の接合部分において導電性部材同士を密着させるように圧力をある程度加える必要がある。この圧力が十分でない場合、導電性部材同士の接合面において、粘着力の分布がまばらとなる、あるいは導電テープ内部の導通が不安定となり、導電性部材間の導通性能にばらつきが発生することがある。   For example, when conductive members such as a metal case and a printed circuit board are bonded to each other with the conductive double-sided tape 100, it is necessary to apply a certain amount of pressure so that the conductive members are brought into close contact with each other at the bonding portion of the conductive double-sided tape 100. If this pressure is not sufficient, the adhesive force distribution may be sparse at the joint surfaces between the conductive members, or the conduction inside the conductive tape may become unstable, and the conduction performance between the conductive members may vary. is there.

＜実施の形態１の導電両面テープ＞
図２を参照して、実施の形態１の導電両面テープ１０１について説明する。 <Conductive double-sided tape of Embodiment 1>
With reference to FIG. 2, the conductive double-sided tape 101 of Embodiment 1 will be described.

図２は、実施の形態１の導電両面テープ１０１の外観および断面を示す図である。図２（Ａ）は、導電両面テープ１０１の外観を示す図である。図２（Ｂ）は、導電両面テープ１０１の断面を示す図である。   FIG. 2 is a diagram showing an appearance and a cross section of the conductive double-sided tape 101 of the first embodiment. FIG. 2A is a view showing the appearance of the conductive double-sided tape 101. FIG. 2B is a diagram showing a cross section of the conductive double-sided tape 101.

図２（Ａ）に示すように、導電両面テープ１０１は、セパレータ４０がはがされた状態で、シート状の部材の両端部のうちいずれか一方の辺を、メタルフィルム２００が挟みこみ、導電両面テープ１０１の粘着層３０（粘着層３０Ａと粘着層３０Ｂ）に貼りあわされることで形成される。   As shown in FIG. 2A, in the conductive double-sided tape 101, the metal film 200 sandwiches either side of both ends of the sheet-like member in a state where the separator 40 is peeled off, and the conductive double-sided tape 101 is electrically conductive. It is formed by sticking to the adhesive layer 30 (adhesive layer 30A and adhesive layer 30B) of the double-sided tape 101.

図２（Ｂ）に示すように、導電両面テープ１０１の両端部のうち一方を、メタルフィルム２００が挟みこんでいる。メタルフィルム２００は、粘着層３０Ａおよび粘着層３０Ｂに貼りあわされる。ここで、導電両面テープ１０１の表裏において、メタルフィルム２００が粘着層３０Ａと粘着層３０Ｂとに貼りあわされた導通部と、粘着層３０Ａと粘着層３０Ｂとが露呈している粘着部とが形成される。メタルフィルム２００は、導電性の材料であり、例えば金などの導電性を有する金属の薄膜がメッキされたフィルムである。メタルフィルム２００の厚みは、導電両面テープ１０１の柔軟性を損なわない程度のものとしてもよいし、例えば、基材層２０の厚みよりも小さいものとしてもよい。   As shown in FIG. 2B, the metal film 200 sandwiches one of both ends of the conductive double-sided tape 101. The metal film 200 is attached to the adhesive layer 30A and the adhesive layer 30B. Here, on the front and back of the conductive double-sided tape 101, a conductive part in which the metal film 200 is bonded to the adhesive layer 30A and the adhesive layer 30B and an adhesive part in which the adhesive layer 30A and the adhesive layer 30B are exposed are formed. Is done. The metal film 200 is a conductive material, for example, a film on which a thin metal film having conductivity such as gold is plated. The metal film 200 may have a thickness that does not impair the flexibility of the conductive double-sided tape 101, or may be smaller than the thickness of the base material layer 20, for example.

導電両面テープ１０１の使用時に、使用者は、粘着部（粘着層３０Ａ、３０Ｂが露呈した部分）の粘着力を利用して、例えばプリント基板のグランドと金属製のケースなどの導電部材同士を導電両面テープ１０１によって接合する。導電両面テープ１０１は、表裏においてメタルフィルム２００が貼りあわされた導通部を有しているため、導電両面テープ１０１によって導電部材同士を接合させる場合に、導電部材と導電両面テープ１０１とが接触する部分の抵抗値を安定して低下させることができる。したがって、導電両面テープ１０１は、導電部材同士を接合するための十分な粘着性能と、導通性能とを兼ね備えることができる。また、関連技術を比較すると、導電部材同士の接合面において、接合のために加える圧力を小さくしたとしても、十分な導通性能を確保することができる。   When the conductive double-sided tape 101 is used, the user conducts electrical conduction between conductive members such as a printed circuit board ground and a metal case, for example, using the adhesive force of the adhesive portion (the portion where the adhesive layers 30A and 30B are exposed). Joining with double-sided tape 101. Since the conductive double-sided tape 101 has conductive portions where the metal film 200 is pasted on the front and back, when the conductive members are joined together by the conductive double-sided tape 101, the conductive member and the conductive double-sided tape 101 come into contact with each other. The resistance value of the portion can be stably reduced. Therefore, the conductive double-sided tape 101 can have both sufficient adhesion performance for joining the conductive members and conduction performance. In addition, when the related technologies are compared, sufficient conduction performance can be ensured even if the pressure applied for bonding is reduced on the bonding surfaces of the conductive members.

＜実施の形態２の導電両面テープ＞
図３を参照して、実施の形態２の導電両面テープ１０２について説明する。 <Conductive double-sided tape of Embodiment 2>
With reference to FIG. 3, the conductive double-sided tape 102 of Embodiment 2 will be described.

図３は、実施の形態２の導電両面テープ１０２の外観および断面を示す図である。図３（Ａ）は、導電両面テープ１０２の外観を示す図である。図３（Ｂ）は、導電両面テープ１０２の断面を示す図である。   FIG. 3 is a diagram illustrating an appearance and a cross section of the conductive double-sided tape 102 according to the second embodiment. FIG. 3A is a view showing the appearance of the conductive double-sided tape 102. FIG. 3B is a diagram showing a cross section of the conductive double-sided tape 102.

図３（Ａ）に示すように、導電両面テープ１０２は、シート状の部材の両端部の両方の辺を、それぞれメタルフィルム３００Ａとメタルフィルム３００Ｂとが挟みこみ、導電両面テープ１０２の粘着層３０（粘着層３０Ａと粘着層３０Ｂ）に貼りあわされることで形成される。図３（Ｂ）に示すように、導電両面テープ１０２の表裏において、メタルフィルム３００Ａが粘着層３０Ａと粘着層３０Ｂとに貼りあわされた第１の導通部と、メタルフィルム３００Ｂが粘着層３０Ａと粘着層３０Ｂとに貼りあわされた第２の導通部とが形成される。導電両面テープ１０２の表裏において、第１の導通部と第２の導通部との間に、粘着層３０Ａと粘着層３０Ｂとが露呈した粘着部が形成される。   As shown in FIG. 3A, the conductive double-sided tape 102 has both sides of the both ends of the sheet-like member sandwiched between the metal film 300A and the metal film 300B, respectively, and the adhesive layer 30 of the conductive double-sided tape 102. It is formed by sticking to (adhesive layer 30A and adhesive layer 30B). As shown in FIG. 3B, on the front and back of the conductive double-sided tape 102, the first conductive portion in which the metal film 300A is bonded to the adhesive layer 30A and the adhesive layer 30B, and the metal film 300B is the adhesive layer 30A. A second conductive portion pasted on the adhesive layer 30B is formed. On the front and back surfaces of the conductive double-sided tape 102, an adhesive portion where the adhesive layer 30A and the adhesive layer 30B are exposed is formed between the first conductive portion and the second conductive portion.

実施の形態２の導電両面テープ１０２の使用時に、使用者は、粘着部の粘着力を利用して、導電部材同士を導電両面テープ１０２によって接合する。導電両面テープ１０２は、表裏において第１の導通部と第２の導通部とを有しているため、導電両面テープ１０２によって導電部材を接合させる場合に、導電部材と導電両面テープ１０２とが接触する部分の抵抗値を安定して低下させることができる。したがって、導電両面テープ１０２は、導電部材同士を接合するための十分な粘着性能と、導電性能とを兼ね備えることができる。また、関連技術を比較すると、導電部材同士の接合面において、接合のために加える圧力を小さくしたとしても、十分な導通性能を確保することができる。   When using the conductive double-sided tape 102 of Embodiment 2, the user joins the conductive members to each other with the conductive double-sided tape 102 using the adhesive force of the adhesive portion. Since the conductive double-sided tape 102 has a first conductive portion and a second conductive portion on the front and back, when the conductive member is joined by the conductive double-sided tape 102, the conductive member and the conductive double-sided tape 102 are in contact with each other. It is possible to stably reduce the resistance value of the portion that performs. Therefore, the conductive double-sided tape 102 can have both sufficient adhesive performance for joining the conductive members and conductive performance. In addition, when the related technologies are compared, sufficient conduction performance can be ensured even if the pressure applied for bonding is reduced on the bonding surfaces of the conductive members.

＜各実施形態の導電両面テープが使用された電子機器＞
図４を参照して、各実施の形態で説明した導電両面テープが使用された電子機器について説明する。 <Electronic device using the conductive double-sided tape of each embodiment>
With reference to FIG. 4, an electronic device using the conductive double-sided tape described in each embodiment will be described.

図４は、電子機器１の分解斜視図およびパネル４とプリント基板５との接合面の断面を示す図である。図４（Ａ）は、電子機器１の分解斜視図である。図４（Ｂ）は、パネル４とプリント基板５との接合面の断面を示す図である。   FIG. 4 is an exploded perspective view of the electronic device 1 and a cross-sectional view of the joint surface between the panel 4 and the printed circuit board 5. FIG. 4A is an exploded perspective view of the electronic device 1. FIG. 4B is a diagram showing a cross section of the joint surface between the panel 4 and the printed circuit board 5.

図４に示すように、電子機器１は、筐体３と、筐体３に組み付けられるパネル４と、筐体３およびパネル４を収容するための筐体２とを含む。   As shown in FIG. 4, the electronic device 1 includes a housing 3, a panel 4 assembled to the housing 3, and the housing 3 and the housing 2 for housing the panel 4.

パネル４には、グランド部が形成されている。パネル４は、例えば、ディスプレイパネルなどであり、フレキシブルなプリント基板５等と接続される。プリント基板５は、配線パターンなどが形成されたフレキシブルな基板である。プリント基板５は、グランド６を含む。図４（Ｂ）に示すように、パネル４のグランド部とプリント基板５のグランド６とが、実施の形態１の導電両面テープ１０１によって接合される。なお、導電両面テープ１０１の粘着部がそれぞれパネル４のグランド部とプリント基板５のグランド６とに接触することにより、パネル４のグランド部とプリント基板５のグランド６とが接合される。こうすることにより、プリント基板５のグランド６とパネル４のグランド部とを導通させることができ、グランドが強化される。また、パネル４のグランド部とプリント基板５のグランド６とが接触する部分において、導通部（メタルフィルム２００が粘着層３０Ａ、３０Ｂに貼りあわされた部分）が挟みこまれているため、導通性能を確保することができる。   The panel 4 is formed with a ground portion. The panel 4 is a display panel, for example, and is connected to a flexible printed board 5 or the like. The printed board 5 is a flexible board on which a wiring pattern or the like is formed. The printed circuit board 5 includes a ground 6. As shown in FIG. 4B, the ground portion of the panel 4 and the ground 6 of the printed circuit board 5 are joined by the conductive double-sided tape 101 of the first embodiment. The adhesive portion of the conductive double-sided tape 101 is brought into contact with the ground portion of the panel 4 and the ground 6 of the printed circuit board 5, so that the ground portion of the panel 4 and the ground 6 of the printed circuit board 5 are joined. By doing so, the ground 6 of the printed circuit board 5 and the ground portion of the panel 4 can be conducted, and the ground is strengthened. In addition, since the conductive portion (the portion where the metal film 200 is bonded to the adhesive layers 30A and 30B) is sandwiched in the portion where the ground portion of the panel 4 and the ground 6 of the printed circuit board 5 are in contact, the conductive performance Can be secured.

＜まとめ＞
各実施の形態で説明したように、関連技術の導電両面テープ１００は、導電部材同士を導電両面テープ１００によって接合させた場合に、導電部材同士が接触する部分の抵抗値が安定して低くならないため、導電性能が確保できないことがある。 <Summary>
As described in each embodiment, in the conductive double-sided tape 100 of the related art, when the conductive members are joined together by the conductive double-sided tape 100, the resistance value of the portion where the conductive members are in contact with each other does not stably decrease. Therefore, the conductive performance may not be ensured.

これに対し、各実施の形態で説明した導電両面テープ１０１や導電両面テープ１０２を導電部材同士の接合に使用すると、導電部材同士が接触する部分の抵抗値が関連技術と比較して安定して低下させることができ、十分な粘着性能と導電性能とを兼ね備えることが可能となる。すなわち、導電両面テープとしては、少なくとも一面に、メタルフィルム２００が粘着層３０Ａまたは粘着層３０Ｂの少なくともいずれかに貼りあわされる導通部を有し、粘着層３０Ａと粘着層３０Ｂにおいてメタルフィルム２００によって覆われていない粘着部とを有する。   On the other hand, when the conductive double-sided tape 101 or the conductive double-sided tape 102 described in each embodiment is used for bonding between conductive members, the resistance value of the portion where the conductive members are in contact with each other is more stable than in the related art. It can be reduced, and it is possible to have both sufficient adhesive performance and conductive performance. That is, as the conductive double-sided tape, at least one surface has a conductive portion where the metal film 200 is bonded to at least one of the adhesive layer 30A and the adhesive layer 30B, and the adhesive film 30A and the adhesive layer 30B are covered with the metal film 200. It has an adhesive part that is not broken.

今回開示された実施の形態はすべての点で例示であって制限的なものでないと考えられるべきである。この発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。   The embodiment disclosed this time must be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

１ 電子機器、２ 筐体、３ 筐体、４ パネル、５ プリント基板、６ グランド、１００，１０１，１０２ 導電両面テープ、２００，３００ メタルフィルム、２０ 基材層、３０Ａ，３０Ｂ 粘着層、４０Ａ，４０Ｂ セパレータ。   DESCRIPTION OF SYMBOLS 1 Electronic device, 2 housing | casing, 3 housing | casing, 4 panel, 5 printed circuit board, 6 ground, 100, 101,102 Conductive double-sided tape, 200,300 Metal film, 20 Base material layer, 30A, 30B Adhesive layer, 40A, 40B separator.

Claims (5)

導電両面テープであって、
表裏に粘着面が形成されている導電性を有するシート状部材と、
前記シート状部材に貼りあわされた導電性材料とを備え、
前記シート状部材の表裏の少なくとも一面は、前記導電性材料が貼りあわされた導通部と、前記粘着面が露呈した粘着部とを含む、導電両面テープ。 Conductive double-sided tape,
An electrically conductive sheet-like member having an adhesive surface formed on the front and back;
A conductive material pasted on the sheet-like member,
At least one surface of the front and back of the sheet-like member is a conductive double-sided tape including a conductive portion on which the conductive material is pasted and an adhesive portion on which the adhesive surface is exposed. 前記シート状部材の両端部のうちいずれか一方の辺を前記導電性材料が挟んで前記導通部が形成され、他方の辺は前記粘着部が露呈されている、請求項１に記載の導電両面テープ。   2. The conductive double-sided surface according to claim 1, wherein the conductive portion is formed by sandwiching the conductive material on either side of both end portions of the sheet-like member, and the adhesive portion is exposed on the other side. tape. 前記シート状部材の両端部のうち一方の辺を第１の前記導電性材料が挟みこむことで前記粘着面に貼りあわされた第１の導通部が形成され、他方の辺を第２の前記導電性材料が挟みこむことで前記粘着面に貼りあわされた第２の導通部が形成され、
前記粘着部は、前記シート状部材の第１の導通部と第２の導通部との間に形成されている、請求項１に記載の導電両面テープ。 A first conductive portion bonded to the adhesive surface is formed by sandwiching one side of the both ends of the sheet-like member with the first conductive material, and the other side is formed with the second side. A second conductive part pasted on the adhesive surface is formed by sandwiching a conductive material,
2. The conductive double-sided tape according to claim 1, wherein the adhesive portion is formed between a first conductive portion and a second conductive portion of the sheet-like member. 前記導電性材料は、導電性を有する金属薄膜がメッキされたフィルムである、請求項１から３のいずれか１項に記載の導電両面テープ。   The conductive double-sided tape according to any one of claims 1 to 3, wherein the conductive material is a film plated with a conductive metal thin film. 電子機器であって、
第１の導電部材と、
第２の導電部材とを備え、
前記第１の導電部材と前記第２の導電部材とは、導電両面テープにより貼り合わせられており、
前記導電両面テープは、
表裏に粘着面が形成されている導電性を有するシート状部材と、
前記シート状部材に貼りあわされた導電性材料とを備え、
前記シート状部材の表裏の少なくとも一面は、前記導電性材料が貼りあわされた導通部と、前記粘着面が露呈した粘着部とを含む、電子機器。 Electronic equipment,
A first conductive member;
A second conductive member,
The first conductive member and the second conductive member are bonded together with a conductive double-sided tape,
The conductive double-sided tape is
An electrically conductive sheet-like member having an adhesive surface formed on the front and back;
A conductive material pasted on the sheet-like member,
At least one surface of the front and back of the sheet-like member is an electronic device including a conductive portion on which the conductive material is pasted and an adhesive portion on which the adhesive surface is exposed.
JP2014036826A 2014-02-27 2014-02-27 Conductive double-sided tape and electronic apparatus using the conductive double-sided tape Pending JP2015160895A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586313U (en) * 1981-07-03 1983-01-17 ソニ−ケミカル株式会社 conductive adhesive tape
JPS605010U (en) * 1983-06-23 1985-01-14 ニチバン株式会社 conductive adhesive tape
WO1999063627A1 (en) * 1998-05-29 1999-12-09 Flexman Ab Double adherent electrically conductive tape
JP2005344068A (en) * 2004-06-07 2005-12-15 Toyo Bussan Kk Electroconductive adhesive tape and method for producing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586313U (en) * 1981-07-03 1983-01-17 ソニ−ケミカル株式会社 conductive adhesive tape
JPS605010U (en) * 1983-06-23 1985-01-14 ニチバン株式会社 conductive adhesive tape
WO1999063627A1 (en) * 1998-05-29 1999-12-09 Flexman Ab Double adherent electrically conductive tape
JP2005344068A (en) * 2004-06-07 2005-12-15 Toyo Bussan Kk Electroconductive adhesive tape and method for producing the same

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