JP2015132601A - 位置決めフレーム構造 - Google Patents
位置決めフレーム構造 Download PDFInfo
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- JP2015132601A JP2015132601A JP2014263987A JP2014263987A JP2015132601A JP 2015132601 A JP2015132601 A JP 2015132601A JP 2014263987 A JP2014263987 A JP 2014263987A JP 2014263987 A JP2014263987 A JP 2014263987A JP 2015132601 A JP2015132601 A JP 2015132601A
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- 238000010276 construction Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000005355 Hall effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004481 total suppression of sideband Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/026—Housings for speed measuring devices, e.g. pulse generator
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
- G01P3/488—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by variable reluctance detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Abstract
【解決手段】位置決めフレーム構造100は、内部に規定された第1のチャンバ103を有するICキャリア101と、ICキャリアの第1のチャンバ内に配置されたIC位置決め磁石102とを含み、さらに、IC位置決め磁石の上方に配置されるICホルダ300を含む。IC200がICホルダに保持され、IC位置決め磁石に対するICのセンタリングおよびポジショニングが提供される。
【選択図】図1
Description
その内部に規定された第1のチャンバを有するICキャリアと、
ICキャリアの第1のチャンバ内に配置されたIC位置決め磁石とを含み、
位置決めフレーム構造は、IC位置決め磁石上に配置されたICホルダをさらに含み、ICが当該ICホルダに保持され、これにより、IC位置決め磁石に対してICのセンタリングおよびポジショニングが提供される。
Claims (10)
- ICのセンタリングおよびポジショニングのための位置決めフレーム構造であって、
内部に規定された第1のチャンバを有するICキャリアと、
前記ICキャリアの前記第1のチャンバ内に配置されるIC位置決め磁石と
を含み、
前記位置決めフレーム構造はさらに、前記IC位置決め磁石の上方に配置されたICホルダを含み、ICが当該ICホルダに保持され、これにより、前記IC位置決め磁石に対するICのセンタリングおよびポジショニングを提供する、位置決めフレーム構造。 - 前記ICホルダには受け部が形成され、前記ICは当該受け部内に保持される、請求項1に記載の位置決めフレーム構造。
- 前記受け部は、前記ICのサイズおよび形状に対応するサイズおよび形状とされ、その結果、前記ICは前記受け部内に固定して配置され得る、請求項2に記載の位置決めフレーム構造。
- 前記IC位置決め磁石は、前記ICキャリアの第1のチャンバのサイズに対応するサイズとされ、この結果、前記IC位置決め磁石は、前記第1のチャンバ内に固定して配置され得る、請求項1に記載の位置決めフレーム構造。
- 前記IC位置決め磁石のサイズは、前記ICのサイズよりも大きい、請求項1に記載の位置決めフレーム構造。
- 前記ICキャリアは、内部に規定される第2のチャンバも有し、当該第2のチャンバは、前記第1のチャンバの上方に配置される、請求項1に記載の位置決めフレーム構造。
- 前記ICホルダは、前記ICキャリアの前記第2のチャンバ内に配置される、請求項6に記載の位置決めフレーム構造。
- 前記ICキャリアの前記第2のチャンバは、前記ICホルダの前記第1のチャンバのサイズよりも大きいサイズである、請求項6に記載の位置決めフレーム構造。
- ショルダー(肩部)が、前記第1のチャンバと前記第2のチャンバの間に形成され、前記ICホルダが、当該ショルダーに抗して前記ICキャリアの前記第2のチャンバ内に配置される、請求項7に記載の位置決めフレーム構造。
- 前記ICホルダの外周が、前記ICキャリアの前記第2のチャンバのサイズに対応するサイズとされ、その結果、前記ICホルダが、前記第2のチャンバ内に固定して配置され得る、請求項7ないし9に記載の位置決めフレーム構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310752418.3A CN104749390B (zh) | 2013-12-31 | 2013-12-31 | 定位框架结构 |
CN201310752418.3 | 2013-12-31 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015132601A true JP2015132601A (ja) | 2015-07-23 |
JP2015132601A5 JP2015132601A5 (ja) | 2018-02-08 |
JP6291412B2 JP6291412B2 (ja) | 2018-03-14 |
Family
ID=52423542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014263987A Active JP6291412B2 (ja) | 2013-12-31 | 2014-12-26 | 位置決めフレーム構造 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9564351B2 (ja) |
EP (1) | EP2896966B1 (ja) |
JP (1) | JP6291412B2 (ja) |
KR (1) | KR20150079466A (ja) |
CN (1) | CN104749390B (ja) |
Citations (7)
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2013
- 2013-12-31 CN CN201310752418.3A patent/CN104749390B/zh active Active
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2014
- 2014-12-26 JP JP2014263987A patent/JP6291412B2/ja active Active
- 2014-12-29 US US14/584,207 patent/US9564351B2/en active Active
- 2014-12-30 EP EP14200644.4A patent/EP2896966B1/en active Active
- 2014-12-30 KR KR1020140193614A patent/KR20150079466A/ko not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0344588A (ja) * | 1989-07-12 | 1991-02-26 | Tdk Corp | 移動物体検出センサ |
JPH06137802A (ja) * | 1992-10-14 | 1994-05-20 | Kearney Natl Inc | 磁束制限器及び磁気分散手段を備えるホール効果位置センサ |
JPH08139429A (ja) * | 1994-11-07 | 1996-05-31 | Sumitomo Electric Ind Ltd | 電子回路装置 |
JPH09133743A (ja) * | 1995-11-08 | 1997-05-20 | Murata Mfg Co Ltd | 磁気センサ |
JPH11153452A (ja) * | 1997-11-20 | 1999-06-08 | Hitachi Ltd | 回転検出装置 |
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JP2008216043A (ja) * | 2007-03-05 | 2008-09-18 | Honda Lock Mfg Co Ltd | 回転センサ |
Also Published As
Publication number | Publication date |
---|---|
JP6291412B2 (ja) | 2018-03-14 |
EP2896966A1 (en) | 2015-07-22 |
EP2896966B1 (en) | 2021-06-23 |
KR20150079466A (ko) | 2015-07-08 |
US9564351B2 (en) | 2017-02-07 |
US20150187623A1 (en) | 2015-07-02 |
CN104749390A (zh) | 2015-07-01 |
CN104749390B (zh) | 2020-07-03 |
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