JP2015101083A - Method and device for feeding resin material of compression molding apparatus - Google Patents

Method and device for feeding resin material of compression molding apparatus Download PDF

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JP2015101083A
JP2015101083A JP2013246069A JP2013246069A JP2015101083A JP 2015101083 A JP2015101083 A JP 2015101083A JP 2013246069 A JP2013246069 A JP 2013246069A JP 2013246069 A JP2013246069 A JP 2013246069A JP 2015101083 A JP2015101083 A JP 2015101083A
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frame
release film
film
resin material
compression molding
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JP2015101083A5 (en
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弘樹 尾張
Hiroki Owari
弘樹 尾張
直毅 高田
Naoki Takada
直毅 高田
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Towa Corp
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Towa Corp
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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
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Abstract

PROBLEM TO BE SOLVED: To provide a method for extending a mold release film adequately in the lower part of a framework so that a wrinkle is not generated, even when the framework and the mold release film are large, to form a concave housing part and feeding a resin material in uniform thickness in a cavity.SOLUTION: The method for feeding the resin material in uniform thickness in the concave housing part, which is formed by: a framework 36 having vertically openings each having a shape corresponding to that of a lower die cavity of dies for compression molding; a the mold release film 37 for covering a lower opening of the framework, comprises: a film extension step of grasping the mold release film larger than the framework by film grasping members 41, 43 on both sides in two or more directions to extend the mold release film; and a framework disposition step of disposing the framework while bringing the entire periphery of a lower part of the framework into contact with the extended mold release film. As a result, a wavy wrinkle is never generated, the wrinkle having been generated in a conventional case of the mold release film pulled to only one direction.

Description

本発明は、半導体チップなどの電子部品を樹脂封止する方法に関し、特に圧縮成形のために顆粒状、粉末状、ペースト状、液状などの樹脂材料（以下、これらを総称して単に「樹脂材料」と呼ぶ。）を成形型のキャビティに供給する方法、及び装置に関する。   The present invention relates to a method for resin-sealing electronic components such as semiconductor chips, and in particular, resin materials such as granules, powders, pastes, and liquids for compression molding (hereinafter collectively referred to simply as “resin materials”). ) Is supplied to the mold cavity and apparatus.

電子部品の薄型化に伴い、圧縮成形が用いられるようになってきている。圧縮成形では、離型フィルムで被覆した下型のキャビティに樹脂材料を供給し、該樹脂材料を加熱溶融して、上型に取り付けた、電子部品を装着した基板を該溶融樹脂に浸漬させた後、下型と上型を型締めすることで該樹脂を圧縮して成形が行われる。このような圧縮成形では、大型の基板の全体に亘って欠陥のない成形を行うためには、キャビティに所定量の樹脂材料を均一に過不足無く供給することが重要となる。   As electronic parts become thinner, compression molding has been used. In compression molding, a resin material is supplied to a cavity of a lower mold covered with a release film, the resin material is heated and melted, and a board mounted with an electronic component and mounted on an upper mold is immersed in the molten resin. Thereafter, the lower mold and the upper mold are clamped to compress the resin to perform molding. In such compression molding, in order to perform defect-free molding over the entire large substrate, it is important to uniformly supply a predetermined amount of resin material to the cavity without excess or deficiency.

特許文献１には、キャビティに顆粒状樹脂Ｒを均一の厚さで過不足無く供給する方法が次のように記載されている（図１参照）。まず、下型１８のキャビティ１８ａの開口に対応した形状の開口を上下に有する矩形フレーム枠１１の下部の開口を離型フィルム１２で被覆し、矩形フレーム枠１１の下面で吸着して凹状収容部１３を作製する(a)。この凹状収容部１３を載置台１４に載せ、フィーダ１５から顆粒状樹脂Ｒを離型フィルム１２上で均一の厚さとなるように供給する(b)。その後、顆粒状樹脂Ｒを収容した凹状収容部１３を、矩形フレーム枠１１で囲まれた離型フィルム１２の部分がキャビティ１８ａの真上にくるようにして下型１８の型面に載置し(c)、矩形フレーム枠１１の下面での離型フィルム１２の吸着を解除した後、離型フィルム１２を、その上にある顆粒状樹脂Ｒと共にキャビティ１８ａ内に吸引して引き込む(d)。これによって、均一の厚さの顆粒状樹脂Ｒがキャビティ１８ａ内に供給される。その後、顆粒状樹脂Ｒを加熱溶融し(e)、この溶融樹脂Ｒｍをキャビティ１８ａ内に含む下型１８と、電子部品２０を装着した基板２１を、その装着面を下方に向けた状態で取り付けた上型１９とを型締めすることにより、電子部品２０を溶融樹脂Ｒｍに浸漬すると共に溶融樹脂Ｒｍを、樹脂加圧用のキャビティ底面部材１８ｂにより押圧する(f)。溶融樹脂Ｒｍが固化した後に上型１９と下型１８を型開きすることにより、電子部品２０の樹脂封止成形品が得られる(g)。   Patent Document 1 describes a method for supplying granular resin R to a cavity with a uniform thickness without excess or deficiency (see FIG. 1). First, the lower opening of the rectangular frame 11 having upper and lower openings corresponding to the opening of the cavity 18a of the lower mold 18 is covered with the release film 12, and is adsorbed on the lower surface of the rectangular frame 11 to be recessed. 13 is produced (a). The concave accommodating portion 13 is placed on the mounting table 14, and the granular resin R is supplied from the feeder 15 so as to have a uniform thickness on the release film 12 (b). Thereafter, the concave accommodating portion 13 accommodating the granular resin R is placed on the mold surface of the lower die 18 so that the part of the release film 12 surrounded by the rectangular frame 11 is directly above the cavity 18a. (c) After releasing the adsorption of the release film 12 on the lower surface of the rectangular frame 11, the release film 12 is sucked into the cavity 18a together with the granular resin R thereon (d). Thereby, the granular resin R having a uniform thickness is supplied into the cavity 18a. Thereafter, the granular resin R is heated and melted (e), and the lower mold 18 containing the molten resin Rm in the cavity 18a and the substrate 21 on which the electronic component 20 is mounted are mounted with the mounting surface facing downward. When the upper mold 19 is clamped, the electronic component 20 is immersed in the molten resin Rm and the molten resin Rm is pressed by the cavity bottom member 18b for resin pressurization (f). After the molten resin Rm is solidified, the upper mold 19 and the lower mold 18 are opened to obtain a resin-sealed molded product of the electronic component 20 (g).

この方法では、図２に示すように、矩形フレーム枠１１の開口より大きいサイズの矩形の離型フィルム１２の対向する二辺１２ａ、１２ｂをそれぞれグリップ（把持部材）２５で把持し、これらのグリップ２５を離型フィルム１２の面内にて互いに反対方向に引っ張った（すなわち、同一平面内で一方向（図２中ではＸ方向）に引っ張った）後、矩形フレーム枠１１の下面に吸着し、矩形フレーム枠１１に装着することにより、凹部収容部１３を作製している。   In this method, as shown in FIG. 2, two opposing sides 12a and 12b of a rectangular release film 12 having a size larger than the opening of the rectangular frame 11 are gripped by grips (gripping members) 25, and these grips are gripped. 25 is pulled in opposite directions within the surface of the release film 12 (that is, pulled in one direction (X direction in FIG. 2) in the same plane), and then adsorbed to the lower surface of the rectangular frame frame 11, By mounting on the rectangular frame 11, the recess housing portion 13 is produced.

特開2010-036542号公報JP 2010-036542

半導体基板はますます大型化しつつあり、それに伴ってキャビティ及びフレーム枠（凹状収容部）も大型化しつつある。一方、離型フィルムは、キャビティの内面形状になじむように変形する必要があるため、厚くすることはできない。このように薄い離型フィルムを大型のフレーム枠に用いた場合、特許文献１におけるように離型フィルムをその面内で一方向に引っ張るのみであると、離型フィルムにかかる面内のテンション（張力）も一方向のみであり、それに直交する方向には何らのテンションが加わらず、離型フィルムには、引張方向に直交する方向に波打つようなシワが発生するという問題が生じる。このようにシワがある離型フィルムを用いた場合、キャビティに供給される樹脂材料の厚さの均一性が保証されず、また、このシワが樹脂に転写されて成形品樹脂の表面凹凸欠陥となる。   As semiconductor substrates are becoming larger and larger, cavities and frame frames (concave housings) are also becoming larger. On the other hand, the release film needs to be deformed so as to be adapted to the inner shape of the cavity, and thus cannot be made thick. When such a thin release film is used for a large frame, as in Patent Document 1, if the release film is only pulled in one direction within the plane, the in-plane tension ( (Tension) is also only in one direction, and no tension is applied in the direction perpendicular to the direction, and the release film has a problem that wrinkles that undulate in the direction perpendicular to the tensile direction occur. When using a release film with wrinkles in this way, the uniformity of the thickness of the resin material supplied to the cavity is not guaranteed, and the wrinkles are transferred to the resin, resulting in surface irregularities on the molded product resin. Become.

本発明が解決しようとする課題は、大きなフレーム枠、大きな離型フィルムであっても、離型フィルムを、シワができないように適切にフレーム枠の下部に張設して凹状収容部を作製することができ、それにより樹脂材料をキャビティ内に均一の厚さで供給することができる圧縮成形装置の樹脂材料供給方法及び供給装置を提供することである。   The problem to be solved by the present invention is that even for a large frame frame and a large release film, the release film is appropriately stretched on the lower part of the frame frame so as not to be wrinkled, thereby producing a concave housing portion. It is possible to provide a resin material supply method and a supply device for a compression molding apparatus that can supply the resin material at a uniform thickness into the cavity.

上記課題を解決するために成された本発明に係る圧縮成形装置の樹脂材料供給方法は、
上型と下型とから成る圧縮成形用型の下型キャビティに樹脂材料を均一厚さに供給するために、該下型キャビティの開口に対応した形状の開口を上下に有するフレーム枠と該フレーム枠の下部の開口を被覆した離型フィルムとにより作製した凹状収容部に樹脂材料を供給する方法であって、
a) 前記フレーム枠よりも大きい離型フィルムを、フィルム把持部材によって二以上の方向において両側で保持することにより該離型フィルムを張設するフィルム張設工程と、
b) 前記張設された離型フィルムの上に前記フレーム枠を、該フレーム枠の下部全周が接触するように配置するフレーム枠配置工程と
を含むことを特徴とする。 The resin material supply method of the compression molding apparatus according to the present invention made to solve the above problems,
A frame having upper and lower openings corresponding to the openings of the lower mold cavity in order to supply the resin material with a uniform thickness to the lower mold cavity of the compression mold comprising the upper mold and the lower mold It is a method of supplying a resin material to a concave accommodating portion produced by a release film covering an opening at the bottom of a frame,
a) a film stretching step of stretching the release film by holding a release film larger than the frame frame on both sides in two or more directions by a film gripping member;
and b) a frame frame arranging step of arranging the frame frame on the stretched release film so that the entire lower periphery of the frame frame is in contact with the frame film.

本発明に係る圧縮成形装置の樹脂材料供給方法では、まず、離型フィルムがフィルム把持部材によって二以上の方向において両側で保持され、それによりフィルム把持部材間で張設される。このように張設された離型フィルム上にフレーム枠を、その下部全周が接触するように配置すると、離型フィルムはそのフレーム枠の内部において、該二以上の方向に張力がかかって張設された状態となる。そのため、本発明に係る圧縮成形装置の樹脂材料供給方法によると、離型フィルムには、従来のように一方向にのみ引っ張っていた場合に生じていた波状のシワが発生しない。なお、ここで離型フィルムの上にフレーム枠の下部全周を接触させる場合、単に接触させるだけでもよいし、接触させた後、フレーム枠を離型フィルムに沈めるようにして押し付けてもよい。   In the resin material supply method of the compression molding apparatus according to the present invention, first, the release film is held on both sides in two or more directions by the film gripping member, and is thereby stretched between the film gripping members. When the frame frame is arranged on the release film thus stretched so that the entire circumference of the lower part thereof is in contact with the release film, the release film is tensioned in the two or more directions inside the frame frame. It will be in the installed state. Therefore, according to the resin material supply method of the compression molding apparatus according to the present invention, the release film does not generate wavy wrinkles that are generated when the release film is pulled only in one direction. In addition, when making the lower perimeter of a frame frame contact on a mold release film here, you may just make contact, and after making it contact, you may press so that a frame frame may be sunk in a mold release film.

その後、そのフレーム枠内の離型フィルム上に顆粒状、粉末状、ペースト状、液状などの樹脂材料を均一な厚さで供給し、該樹脂材料と共に離型フィルムを下型キャビティ内に引き込むことにより、下型キャビティ内に樹脂材料を均一の厚さで供給することができる。   After that, a resin material such as granules, powders, pastes, and liquids is supplied on the release film in the frame with a uniform thickness, and the release film is drawn into the lower mold cavity together with the resin material. Thus, the resin material can be supplied into the lower mold cavity with a uniform thickness.

前記方法は、さらに、
c) 前記フレーム枠を前記フィルム把持部材に対して前記離型フィルムの面に垂直な方向に移動させることにより該フレーム枠内での前記離型フィルムの張力を増加又は減少させる張力調整工程
を含むことが望ましい。 The method further comprises:
c) a tension adjusting step of increasing or decreasing the tension of the release film in the frame frame by moving the frame frame in a direction perpendicular to the surface of the release film with respect to the film gripping member. It is desirable.

フレーム枠が大きい場合、そのフレーム枠内での離型フィルムの張力が不十分であると、離型フィルムの自重により離型フィルムはフレーム枠内の中央部分で下方にたるんで（垂下して）しまう。上記張力調整工程でフレーム枠内での離型フィルムの張力を調整することにより、フレーム枠の大きさと離型フィルムの厚さに応じて、離型フィルムに無理な力を掛けることなく、しかも、フレーム枠内での緩みのない、適切な張力での離型フィルムの張設が可能となる。   When the frame frame is large, if the release film has insufficient tension in the frame frame, the release film sags downward (hangs down) at the center of the frame frame due to its own weight. End up. By adjusting the tension of the release film in the frame frame in the tension adjustment process, according to the size of the frame frame and the thickness of the release film, without applying excessive force to the release film, The release film can be stretched with an appropriate tension without loosening in the frame.

本発明に係る圧縮成形装置の樹脂材料供給方法は、フレーム枠が矩形である場合、前記二以上の方向は垂直な二方向とし、前記フィルム把持部材は垂直な二方向において両側に設けられたフィルム把持具とすることができる。この場合、矩形のフレーム枠は、その辺が該二方向に平行となるように、該フィルム把持具の間に（フレーム枠の下部全周が離型フィルムに接触するようにして）配置する。   In the resin material supply method of the compression molding apparatus according to the present invention, when the frame is rectangular, the two or more directions are two perpendicular directions, and the film gripping members are provided on both sides in the two perpendicular directions. It can be a gripping tool. In this case, the rectangular frame frame is disposed between the film grippers (with the entire lower periphery of the frame frame in contact with the release film) so that the sides thereof are parallel to the two directions.

本発明に係る圧縮成形装置の樹脂材料供給方法は、フレーム枠が円形である場合、前記フィルム把持部材は円形のフィルム把持具とすることができる。この場合、フィルム把持具は、その中心を挟む少なくとも二方向の両側において離型フィルムを把持し、フィルム把持具内に離型フィルムを張設する。そして、円形のフレーム枠は、そうしてフィルム把持具内に張設された離型フィルム上に（フレーム枠の下部全周が離型フィルムに接触するようにして）配置する。   In the resin material supply method of the compression molding apparatus according to the present invention, when the frame is circular, the film gripping member can be a circular film gripper. In this case, the film gripping tool grips the release film on both sides in at least two directions across the center, and stretches the release film in the film gripping tool. Then, the circular frame is placed on the release film stretched in the film gripping tool (with the entire lower periphery of the frame frame in contact with the release film).

上記課題を解決するために成された本発明に係る圧縮成形装置用の樹脂材料供給装置は、
上型と下型とから成る圧縮成形用型の下型キャビティに樹脂材料を均一厚さに供給するために、該下型キャビティの開口に対応した形状の開口を上下に有するフレーム枠と該フレーム枠の下部の開口を被覆した離型フィルムとにより作製した凹状収容部に樹脂材料を供給する装置であって、
a) 前記フレーム枠よりも大きい離型フィルムを二以上の方向において両側で保持することにより該離型フィルムを張設するフィルム把持部材と、
b) 前記フィルム把持部材により張設された離型フィルムの上で前記フレーム枠の下部全周が接触するように、前記フィルム把持部材に対して前記フレーム枠を配置するフレーム枠配置部材と
を備えることを特徴とする。 A resin material supply device for a compression molding apparatus according to the present invention, which has been made to solve the above problems,
A frame having upper and lower openings corresponding to the openings of the lower mold cavity in order to supply the resin material with a uniform thickness to the lower mold cavity of the compression mold comprising the upper mold and the lower mold An apparatus for supplying a resin material to a concave accommodating portion produced by a release film covering an opening at the bottom of a frame,
a) a film gripping member for stretching the release film by holding the release film larger than the frame frame on both sides in two or more directions;
b) a frame frame disposing member that disposes the frame frame with respect to the film gripping member so that the entire lower periphery of the frame frame contacts the release film stretched by the film gripping member. It is characterized by that.

本発明に係る圧縮成形装置用の樹脂材料供給装置では、まず、離型フィルムがフィルム把持部材によって二以上の方向において両側で保持され、それによりフィルム把持部材間で張設される。このように張設された離型フィルムに、フレーム枠配置部材により、フレーム枠を、その下部全周が離型フィルムに接触するように配置すると、離型フィルムはフレーム枠の内部において、該二以上の方向に張力がかかって張設された状態となる。そのため、本発明に係る圧縮成形装置用の樹脂材料供給装置によると、離型フィルムには、従来のように一方向にのみ引っ張っていた場合に生じていた波状のシワが発生しない。なお、ここでも、離型フィルムの上にフレーム枠の下部全周を接触させる場合、単に接触させるだけでもよいし、接触させた後、フレーム枠を離型フィルムに沈めるようにして押し付けてもよい。   In the resin material supply apparatus for a compression molding apparatus according to the present invention, first, the release film is held on both sides in two or more directions by the film gripping member, and is thereby stretched between the film gripping members. When the frame frame is arranged on the release film stretched in this way by the frame frame arrangement member so that the entire periphery of the lower part of the release film is in contact with the release film, the release film is placed inside the frame frame. The tension is applied in the above direction. Therefore, according to the resin material supply apparatus for a compression molding apparatus according to the present invention, the release film does not generate wavy wrinkles that are generated when the film is pulled only in one direction as in the prior art. In this case as well, when the entire lower periphery of the frame frame is brought into contact with the release film, it may be simply brought into contact, or after making contact, the frame frame may be pressed so as to be submerged in the release film. .

その後、そのフレーム枠内の離型フィルム上に均一な厚さの樹脂材料を供給し、該樹脂材料と共に離型フィルムを下型キャビティ内に引き込むことにより、下型キャビティ内に樹脂材料を均一の厚さで供給することができる。   Thereafter, a resin material having a uniform thickness is supplied onto the release film in the frame frame, and the release film is drawn into the lower mold cavity together with the resin material, so that the resin material is uniformly distributed in the lower mold cavity. Can be supplied in thickness.

前記装置は、さらに、
c) 前記フレーム枠を前記フィルム把持部材に対して前記離型フィルムの面に垂直な方向に移動させることにより該フレーム枠内での前記離型フィルムの張力を増加又は減少させる張力調整部材
を備えることが望ましい。 The apparatus further comprises:
c) A tension adjusting member that increases or decreases the tension of the release film in the frame frame by moving the frame frame in a direction perpendicular to the surface of the release film with respect to the film gripping member. It is desirable.

この張力調整部材によってフレーム枠内での離型フィルムの張力を調整することにより、フレーム枠の大きさと離型フィルムの厚さに応じて、離型フィルムに無理な力を掛けることなく、しかも、フレーム枠内での緩みのない、適切な張力での離型フィルムの張設が可能となる。   By adjusting the tension of the release film in the frame frame by this tension adjusting member, according to the size of the frame frame and the thickness of the release film, without applying excessive force to the release film, The release film can be stretched with an appropriate tension without loosening in the frame.

フレーム枠が矩形である場合、前記二以上の方向は垂直な二方向とし、前記フィルム把持部材は垂直な二方向において両側に設けられたフィルム把持具とすることができる。この場合、フレーム枠配置部材は、矩形のフレーム枠を、その辺が該二方向に平行となるように、該フィルム把持具の間に（フレーム枠の下部全周が離型フィルムに接触するようにして）配置する。   When the frame frame is rectangular, the two or more directions may be two perpendicular directions, and the film gripping member may be a film gripping tool provided on both sides in the two perpendicular directions. In this case, the frame frame arrangement member is arranged between the film gripping tools so that the sides of the rectangular frame frame are parallel to the two directions (the entire lower periphery of the frame frame is in contact with the release film). Place).

フレーム枠が円形である場合、前記フィルム把持部材は円形のフィルム把持具とすることができる。この場合、フィルム把持具は、その中心を挟む少なくとも二方向の両側において離型フィルムを把持することによりフィルム把持具内に離型フィルムを張設する。そして、フレーム枠配置部材は、円形のフレーム枠を、そうしてフィルム把持具内に張設された離型フィルム上に（フレーム枠の下部全周が離型フィルムに接触するようにして）配置する。   When the frame is circular, the film gripping member can be a circular film gripper. In this case, the film gripping tool stretches the release film in the film gripping tool by gripping the release film on both sides in at least two directions across the center. And the frame frame arrangement member arranges the circular frame frame on the release film stretched in the film gripping tool (with the entire lower periphery of the frame frame in contact with the release film). To do.

本発明に係る圧縮成形装置の樹脂材料供給方法及び供給装置によると、大きなフレーム枠、大きな離型フィルムであっても、離型フィルムを、シワができないように適切にフレーム枠の下部に張設して凹状収容部を作製することができ、それにより樹脂材料をキャビティ内に均一の厚さで供給することができる。   According to the resin material supply method and supply device of the compression molding apparatus according to the present invention, even in the case of a large frame frame and a large release film, the release film is properly stretched on the lower part of the frame frame so as not to be wrinkled. Thus, the concave accommodating portion can be manufactured, and thereby the resin material can be supplied into the cavity with a uniform thickness.

従来の圧縮成形の手順を説明する概略図。Schematic explaining the procedure of the conventional compression molding. 従来の圧縮成形装置における離型フィルムの張設方法を説明する平面概略図(a)、及び側面概略図(b)。FIG. 2 is a schematic plan view (a) and a schematic side view (b) for explaining a method of stretching a release film in a conventional compression molding apparatus. 本発明の一実施例に係る圧縮成形装置の概略構成図。The schematic block diagram of the compression molding apparatus which concerns on one Example of this invention. 同実施例に係る圧縮成形装置用の樹脂材料供給装置の凹状収容部作製部の平面概略図(a)、及びA-A断面図(b)。FIG. 2 is a schematic plan view (a) and a cross-sectional view (b) taken along the line AA of the concave housing part production part of the resin material supply device for a compression molding apparatus according to the same embodiment. 同実施例の樹脂材料供給装置における樹脂材料供給方法を説明するフローチャート。The flowchart explaining the resin material supply method in the resin material supply apparatus of the Example. 同実施例の樹脂材料供給装置において、離型フィルムをグリップにより張設し(a)、張力を調整し(b)、フレーム枠を離型フィルム上に配置し(c)、その後フレーム枠を接触させて配置した状態(d)、及びグリップに張設した離型フィルムにフレーム枠の全重量が負荷されるようにした状態(e)を示すA-A断面図。In the resin material supply apparatus of the embodiment, the release film is stretched by the grip (a), the tension is adjusted (b), the frame frame is placed on the release film (c), and then the frame frame is contacted FIG. 6 is a cross-sectional view taken along line AA showing a state (d) in which the frame frame is arranged and a state (e) in which the entire weight of the frame frame is loaded on the release film stretched on the grip. 同実施例の矩形の離型フィルムにかかる力を図示した平面概略図。The plane schematic diagram which illustrated the force concerning the rectangular mold release film of the Example. 本発明の別の実施例に係る圧縮成形装置用の樹脂材料供給装置の凹状収容部作製部の平面概略図(a)、及びA-A断面図(b)。FIG. 6 is a schematic plan view (a) and a cross-sectional view (b) taken along the line AA of a concave housing part production part of a resin material supply device for a compression molding apparatus according to another embodiment of the present invention. 同実施例の樹脂材料供給装置における凹状収容部の作製方法を説明するフローチャート。The flowchart explaining the preparation methods of the concave accommodating part in the resin material supply apparatus of the Example. 同実施例の樹脂材料供給装置において、離型フィルムをグリップにより張設し(a)、フレーム枠を離型フィルム上に配置し(b)、フレーム枠を接触させて配置し(c)、その後張力を調整した状態(d)を示すA-A断面図。In the resin material supply apparatus of the embodiment, the release film is stretched by a grip (a), the frame frame is placed on the release film (b), the frame frame is placed in contact (c), and then The AA sectional view showing the state (d) which adjusted tension. 同実施例において、円形の離型フィルムにかかる力を図示した平面概略図。In the same Example, the plane schematic which illustrated the force concerning a circular mold release film. 本発明の別の実施例に係る圧縮成形装置用の樹脂材料供給装置の凹状収容部作製部の平面概略図(a)、及びA-A断面図(b)。FIG. 6 is a schematic plan view (a) and a cross-sectional view (b) taken along the line AA of a concave housing part production part of a resin material supply device for a compression molding apparatus according to another embodiment of the present invention.

（第１実施例）
本発明に係る圧縮成形装置用の樹脂材料供給装置の一実施例について、図３及び図４を参照しながら説明する。この樹脂材料供給装置３０は、上型３８ａと下型３８ｂとを備える圧縮成形装置の下型キャビティ３９内に樹脂材料（本実施例では顆粒状樹脂）３４を均一の厚さで供給するための装置であり、凹状収容部作製部３１と、樹脂材料供給部３２と、セッティング部３３から構成される。本実施例の下型キャビティ３９の平面形状は矩形である。なお、図４(a)において、離型フィルム３７は点線で示している。 (First embodiment)
An embodiment of a resin material supply apparatus for a compression molding apparatus according to the present invention will be described with reference to FIGS. This resin material supply device 30 is used for supplying a resin material (granular resin in this embodiment) with a uniform thickness into a lower mold cavity 39 of a compression molding apparatus including an upper mold 38a and a lower mold 38b. It is a device, and is composed of a concave housing part preparation part 31, a resin material supply part 32, and a setting part 33. The planar shape of the lower mold cavity 39 of this embodiment is a rectangle. In FIG. 4A, the release film 37 is indicated by a dotted line.

本実施例では、下型キャビティ３９に樹脂材料３４を均一の厚さで供給するために用いられる凹状収容部３５は、該下型キャビティ３９とほぼ同形の矩形状開口を上下に有するフレーム枠３６と、このフレーム枠３６の下面を被覆する離型フィルム３７により形成される。凹状収容部作製部３１は、そのような凹状収容部３５を作製するための装置であり、前記フレーム枠３６を囲繞する大きさの矩形状の外枠部材６０と、該外枠部材６０の各辺の内側に配置される4組の棒状グリップ４１〜４４と、各棒状グリップ４１〜４４を外枠部材６０の各辺の内側に保持すると共に各棒状グリップ４１〜４４と各辺の間の距離を調整する幅調整ネジ６１とから成る。各棒状グリップ４１〜４４は、上下の把持片ペア４１ａ・４１ｂ〜４４ａ・４４ｂと、離型フィルム３７を挟んでそれらを固定する2本の固定ネジ４６から成る。   In the present embodiment, the concave accommodating portion 35 used for supplying the resin material 34 to the lower mold cavity 39 with a uniform thickness has a frame frame 36 having rectangular openings that are substantially the same shape as the lower mold cavity 39 at the top and bottom. And a release film 37 that covers the lower surface of the frame 36. The concave housing part production unit 31 is an apparatus for producing such a concave housing part 35, and includes a rectangular outer frame member 60 having a size surrounding the frame frame 36, and each of the outer frame members 60. Four sets of rod-shaped grips 41 to 44 arranged on the inner side of the side, and the rod-shaped grips 41 to 44 are held inside the sides of the outer frame member 60, and the distance between the bar-shaped grips 41 to 44 and the sides. And a width adjusting screw 61 for adjusting. Each of the bar-shaped grips 41 to 44 includes an upper and lower grip piece pair 41a / 41b / 44a / 44b and two fixing screws 46 for fixing them with the release film 37 interposed therebetween.

フレーム枠３６の各辺の上部のほぼ中心には、それぞれ1個のフレーム枠保持部材５０が固定されている。フレーム枠保持部材５０はフレーム枠３６の各辺から外側に突出しており、その突出部にはそれぞれ高さ調整ネジ５１が設けられている。   One frame frame holding member 50 is fixed to the approximate center of the upper part of each side of the frame frame 36. The frame frame holding member 50 protrudes outward from each side of the frame frame 36, and a height adjustment screw 51 is provided at each of the protruding portions.

本実施例の樹脂材料供給装置３０の動作を、本発明の特徴的部分である凹状収容部作製部３１の部分を中心に、図５のフローチャート、図４及び図６を参照しながら以下に説明する。
まず、フレーム枠３６の開口を被覆することができる大きさの矩形の離型フィルム３７の各辺を各グリップ４１、４２、４３、４４の上下の把持片ペア４１ａ・４１ｂ〜４４ａ・４４ｂで挟み、各把持片ペア４１ａ・４１ｂ〜４４ａ・４４ｂを固定ネジ４６で締めることによって、離型フィルム３７を4本のグリップ４１〜４４で保持する。これにより、離型フィルム３７は、矩形の対向する二辺間において（すなわち、図４(a)中のＸ方向とＹ方向の二方向において）保持され、張設される（ステップＳ１１、図６(a)）。なお、ここで離型フィルム３７をＸ、Ｙの二方向の両側のグリップ４１〜４４で保持・張設する際、離型フィルム３７は必ずしも平面状に緊張した状態で張設しておく必要はなく、多少の緩みやたわみがあっても良い。 The operation of the resin material supply apparatus 30 of the present embodiment will be described below with reference to the flowchart of FIG. 5 and FIGS. 4 and 6 with a focus on the concave housing part preparation part 31 which is a characteristic part of the present invention. To do.
First, each side of a rectangular release film 37 having a size capable of covering the opening of the frame frame 36 is sandwiched between upper and lower gripping piece pairs 41a, 41b to 44a, 44b of the grips 41, 42, 43, 44. The release film 37 is held by the four grips 41 to 44 by fastening the gripping piece pairs 41a, 41b to 44a, 44b with the fixing screws 46. Thereby, the release film 37 is held and stretched between two opposing sides of the rectangle (that is, in two directions of the X direction and the Y direction in FIG. 4A) (step S11, FIG. 6). (a)). Here, when the release film 37 is held and stretched by the grips 41 to 44 on both sides in the X and Y directions, the release film 37 is not necessarily stretched in a flat state. There may be some looseness and deflection.

その後、各グリップ４１〜４４とそれに対応する外枠部材６０の各辺の間の2個の幅調整ネジ６１を締めることにより、グリップ４１、４３をＸ方向に、グリップ４２、４４をＹ方向に、それぞれ引っ張り、離型フィルム３７に緩みやシワ、たるみが無くなった時点で幅調整ネジ６１を固定する（ステップＳ１２、図６(b)）。   After that, by tightening the two width adjusting screws 61 between the grips 41 to 44 and the corresponding sides of the outer frame member 60, the grips 41 and 43 are moved in the X direction, and the grips 42 and 44 are moved in the Y direction. The width adjusting screw 61 is fixed when the release film 37 is not pulled, loosened, wrinkled or slackened (step S12, FIG. 6B).

その後、こうして張設した離型フィルム３７の上方にフレーム枠３６を置く（図６(c)）。このとき、フレーム枠３６の各辺のフレーム枠保持部材５０の突出部が、高さ調整ネジ５１を介して各グリップ４１〜４４の上面に載ることになる。この4本の高さ調整ネジ５１を締め又は緩めることにより、フレーム枠３６を、その下部全周が離型フィルム３７に丁度接触するようにする（ステップＳ１３、図６(d)）。このように、フレーム枠３６の下部全周を離型フィルム３７に丁度接触させるだけであっても、凹状収容部３５の下面を構成する離型フィルム３７はシワのない、きれいな平面状となっている。   Thereafter, the frame frame 36 is placed above the release film 37 thus stretched (FIG. 6C). At this time, the protruding portions of the frame frame holding member 50 on each side of the frame frame 36 are placed on the upper surfaces of the grips 41 to 44 via the height adjustment screws 51. By tightening or loosening the four height adjusting screws 51, the entire circumference of the lower portion of the frame frame 36 is brought into contact with the release film 37 (step S13, FIG. 6 (d)). Thus, even if the entire lower periphery of the frame frame 36 is just brought into contact with the release film 37, the release film 37 constituting the lower surface of the concave housing portion 35 has a clean flat shape without wrinkles. Yes.

上記の実施例では、グリップ４１〜４４で離型フィルム３７を保持した後、幅調整ネジ６１により、離型フィルム３７が緩みやたるみの無い平面状に張設されるようにし、その後、その状態の離型フィルム３７の上面にフレーム枠３６の下部全周を丁度接触させるようにしたが、別の方法として、グリップ４１〜４４で離型フィルム３７を保持し、幅調整ネジ６１で離型フィルム３７を張設する際、多少の緩みやたるみを持たせたままにしておくという方法をとることもできる。この場合、そのような離型フィルム３７上にフレーム枠３６を載置し、離型フィルム３７上にフレーム枠３６の全重量ｗが負荷されるようにする（図６(a)→図６(e)）ことにより、離型フィルム３７に張力（テンション）が掛かり、フレーム枠３６の下部開口の内部で離型フィルム３７がシワのない、きれいな平面状に張設されることになる。   In the above embodiment, after the release film 37 is held by the grips 41 to 44, the release film 37 is stretched by a width adjusting screw 61 so as to be flat without any looseness or sagging. The entire lower periphery of the frame frame 36 is brought into contact with the upper surface of the release film 37. Alternatively, the release film 37 is held by the grips 41 to 44, and the release film 37 is held by the width adjusting screw 61. It is also possible to take a method of leaving 37 with some looseness or sagging. In this case, the frame frame 36 is placed on such a release film 37 so that the entire weight w of the frame frame 36 is loaded on the release film 37 (FIG. 6A → FIG. 6). e)), tension is applied to the release film 37, and the release film 37 is stretched in a clean flat shape without wrinkles inside the lower opening of the frame frame 36.

更に、その後、高さ調整ネジ５１を締めることにより、離型フィルム３７に負荷されるフレーム枠３６の重量を軽減し、離型フィルム３７に掛かるテンションを小さくすることもできる。この方法によれば、フレーム枠３６の大きさと離型フィルム３７の厚さ（強さ）を勘案して高さ調整ネジ５１の締め具合を調整することにより、離型フィルム３７に最適なテンションを掛けることができるようになる。   Further, by tightening the height adjusting screw 51 thereafter, the weight of the frame frame 36 loaded on the release film 37 can be reduced, and the tension applied to the release film 37 can be reduced. According to this method, the optimum tension is applied to the release film 37 by adjusting the tightening of the height adjusting screw 51 in consideration of the size of the frame frame 36 and the thickness (strength) of the release film 37. You can hang it.

以上のようにして、離型フィルム３７がフレーム枠３６の内部において、Ｘ方向とＹ方向の二方向に張力がかかって張設された状態となり、凹状収容部３５が作製される。本実施例の樹脂材料供給装置３０ではこのような構成であるため、離型フィルム３７には、従来のように一方向にのみ引っ張っていた場合に生じていた波状のシワが発生しない。   As described above, the release film 37 is tensioned in two directions of the X direction and the Y direction inside the frame frame 36, and the concave accommodating portion 35 is manufactured. Since the resin material supply apparatus 30 according to the present embodiment has such a configuration, the release film 37 does not generate wavy wrinkles that are generated when the release film 37 is pulled only in one direction as in the prior art.

図７(a)は、図６(d)の離型フィルム３７にかかる力を示す平面図であり、図７(b)は、図６(e)の離型フィルム３７にかかる力を示す平面図である。図７では、離型フィルム３７がグリップ４１〜４４によって把持されている部分を二本鎖線で、フレーム枠３６の外周縁を点線で示している。図７(a)、(b)に示すように、本実施例の樹脂材料供給装置３０では、凹状収容部３５の下面を形成する離型フィルム３７に、その面内で、互いに対向する二点において、反対方向に等しい力がかかる。そのため、矩形の離型フィルム３７は対向する二辺それぞれにおいて均一の力で互いに反対方向に引っ張られ、シワが無くなる。   FIG. 7A is a plan view showing the force applied to the release film 37 in FIG. 6D, and FIG. 7B is a plane showing the force applied to the release film 37 in FIG. FIG. In FIG. 7, the part where the release film 37 is gripped by the grips 41 to 44 is indicated by a double chain line, and the outer peripheral edge of the frame frame 36 is indicated by a dotted line. As shown in FIGS. 7A and 7B, in the resin material supply device 30 of the present embodiment, two points facing each other within the surface of the release film 37 that forms the lower surface of the concave housing portion 35 are provided. , Equal force is applied in the opposite direction. Therefore, the rectangular release film 37 is pulled in opposite directions with a uniform force on each of the two opposing sides, and wrinkles are eliminated.

このようにして形成された凹状収容部３５は、幅調整ネジ６１及び高さ調整ネジ５１により外枠部材６０に固定され、一体化した状態で、その後の、凹状収容部３５内への樹脂材料３４の供給及び離型フィルム３７と樹脂材料３４の下型キャビティ３９への引き込みを行うことができる。もちろん、特許文献１に記載のように、このように張設された離型フィルム３７をフレーム枠３６の下面に吸着などすることにより固定した後、幅調整ネジ６１を緩めて外枠部材６０を取り外し、凹状収容部３５のみでそこへの樹脂材料３４の供給及び離型フィルム３７と樹脂材料３４の下型キャビティ３９への引き込みを行ってもよい。   The concave accommodating portion 35 formed in this way is fixed to the outer frame member 60 by the width adjusting screw 61 and the height adjusting screw 51, and in the integrated state, the resin material into the concave accommodating portion 35 thereafter. 34 and the release film 37 and the resin material 34 can be pulled into the lower mold cavity 39. Of course, as described in Patent Document 1, after fixing the release film 37 stretched in this way to the lower surface of the frame frame 36, the width adjustment screw 61 is loosened to loosen the outer frame member 60. The resin material 34 may be supplied to and removed from the concave cavity 39 only by the removal of the concave housing portion 35 and the release film 37 and the resin material 34 may be drawn into the lower mold cavity 39.

次に、樹脂材料供給部３２において、凹状収容部３５の離型フィルム３７上に樹脂材料３４が均一な厚さで供給される（ステップＳ１４、図３）。   Next, in the resin material supply part 32, the resin material 34 is supplied with a uniform thickness onto the release film 37 of the concave housing part 35 (step S14, FIG. 3).

最後に、そうして均一な厚さで樹脂材料３４が供給された凹状収容部３５を、セッティング部３３において、上型３８ａと下型３８ｂから成る圧縮成形装置の下型キャビティ３９の直上に配置し、下型キャビティ３９側から吸引することにより、離型フィルム３７及び樹脂材料３４を下型キャビティ３９内に引き込む（ステップＳ１５、図３）。   Finally, the concave accommodating portion 35 to which the resin material 34 is supplied in a uniform thickness is arranged in the setting portion 33 directly above the lower die cavity 39 of the compression molding apparatus including the upper die 38a and the lower die 38b. Then, the release film 37 and the resin material 34 are drawn into the lower mold cavity 39 by sucking from the lower mold cavity 39 side (step S15, FIG. 3).

（第２実施例）
本発明に係る樹脂材料供給装置の第２実施例として、下型キャビティの形状が円形である圧縮成形装置に適用する場合について説明する。樹脂材料供給部３２及びセッティング部３３については、第１実施例と同じなので説明は省略する。 (Second embodiment)
As a second embodiment of the resin material supply apparatus according to the present invention, a case where the present invention is applied to a compression molding apparatus in which the shape of the lower mold cavity is circular will be described. Since the resin material supply unit 32 and the setting unit 33 are the same as those in the first embodiment, description thereof will be omitted.

本実施例の樹脂材料供給装置において凹状収容部は、前記下型キャビティの開口と同形の円形開口を上下に有する円形のフレーム枠７６と、このフレーム枠７６を被覆する離型フィルム７７とにより形成される。この凹状収容部を作製するための装置である凹状収容部作製部７１（図８）は、該円形のフレーム枠７６を囲繞する上下の把持片ペア８０ａ、８０ｂと、その円周に等間隔に配置された8本の固定ネジ８６で構成される円形のグリップ８０から成る。また、フレーム枠７６の上部には、円周上の等間隔の3箇所に、フレーム枠７６から外側に突出するフレーム枠保持部材８７が固定されており、その突出部にはそれぞれ高さ調整ネジ８８が設けられている。   In the resin material supply apparatus of the present embodiment, the concave accommodating portion is formed by a circular frame frame 76 having upper and lower circular openings having the same shape as the opening of the lower mold cavity, and a release film 77 covering the frame frame 76. Is done. The concave accommodating portion producing unit 71 (FIG. 8), which is an apparatus for producing this concave accommodating portion, has upper and lower gripping piece pairs 80a and 80b surrounding the circular frame frame 76 and the circumference thereof at equal intervals. It consists of a circular grip 80 composed of eight fixed screws 86 arranged. Also, on the upper part of the frame frame 76, frame frame holding members 87 that protrude outward from the frame frame 76 are fixed at three equally spaced locations on the circumference, and height adjustment screws are respectively attached to the protruding portions. 88 is provided.

本実施例の凹状収容部作製部７１の動作を、図９のフローチャート、図８及び図１０を参照しながら以下に説明する。
まず、円形の離型フィルム７７をグリップ８０の把持片ペア８０ａ、８０ｂの間に挟み、把持片ペア８０ａ、８０ｂを固定ネジ８６で締めることによって、離型フィルム７７を円形のグリップ８０で保持し、その内部に張設する（ステップＳ２１、図１０(a)）。なお、ここで離型フィルム７７をグリップ８０で保持・張設する際、離型フィルム７７は必ずしも平面状に緊張した状態でなくてもよく、多少の緩みやたわみがあっても良い。 The operation of the concave accommodating portion preparing unit 71 of this embodiment will be described below with reference to the flowchart of FIG. 9 and FIGS. 8 and 10.
First, the release film 77 is held by the circular grip 80 by sandwiching the circular release film 77 between the grip piece pairs 80 a and 80 b of the grip 80 and tightening the grip piece pairs 80 a and 80 b with the fixing screw 86. Then, it is stretched inside (step S21, FIG. 10A). Here, when the release film 77 is held and stretched by the grip 80, the release film 77 does not necessarily have to be flattened and may have some looseness or deflection.

こうしてグリップ８０内にフレーム枠７６を置く。このとき、高さ調整ネジ８８は最も締めた状態、すなわち高さ調整ネジ８８がフレーム枠保持部材８７の下方から最も長く突出した状態としておく。これにより、フレーム枠７６の下面はグリップ８０内に張設された離型フィルム７７には接触しない状態となっている（図１０(b)）。その後、高さ調整ネジ８８を緩めると、フレーム枠７６はその自重ｗにより徐々に降下してゆく。そして或る時点で、フレーム枠７６の下部全周が離型フィルム７７に接触した状態となる（ステップＳ２２、図１０(c)）。このとき、離型フィルム７７は、張力（テンション）がほぼゼロで、フレーム枠７６内部に張設された状態となる。   Thus, the frame frame 76 is placed in the grip 80. At this time, the height adjustment screw 88 is in a most tightened state, that is, a state in which the height adjustment screw 88 protrudes the longest from below the frame frame holding member 87. Thereby, the lower surface of the frame frame 76 is not in contact with the release film 77 stretched in the grip 80 (FIG. 10B). Thereafter, when the height adjusting screw 88 is loosened, the frame frame 76 gradually descends due to its own weight w. At a certain point, the entire lower periphery of the frame frame 76 is in contact with the release film 77 (step S22, FIG. 10 (c)). At this time, the release film 77 is in a state of being tensioned inside the frame frame 76 with substantially zero tension.

この状態のフレーム枠７６及び離型フィルム７７で構成される凹状収容部を樹脂材料供給に用いてもよいが、内部に供給される樹脂材料３４の重量により、離型フィルム７７がたわむ可能性がある。そこで、上記のようにフレーム枠７６の下面全周が離型フィルム７７に丁度接触した状態からさらに高さ調整ネジ８８を緩めてフレーム枠７６を下げてゆき、離型フィルム７７に適度な張力（テンション）がかかったところで、高さ調整ネジ８８を固定する。このように、本実施例の樹脂材料供給装置では、大型の円形の凹状収容部であっても、シワのない離型フィルム７７がフレーム枠７６の下部の開口に適度な張力（テンション）で張設される（ステップＳ２３、図１０(d)）。   Although the concave housing portion composed of the frame frame 76 and the release film 77 in this state may be used for supplying the resin material, there is a possibility that the release film 77 is bent due to the weight of the resin material 34 supplied to the inside. is there. Therefore, from the state in which the entire lower surface of the frame frame 76 is just in contact with the release film 77 as described above, the height adjustment screw 88 is further loosened to lower the frame frame 76, so that an appropriate tension ( When the tension is applied, the height adjusting screw 88 is fixed. As described above, in the resin material supply apparatus of the present embodiment, the release film 77 without wrinkles is stretched with an appropriate tension (tension) at the lower opening of the frame frame 76 even in the case of a large circular concave housing portion. (Step S23, FIG. 10 (d)).

図１１は、図１０(d)の離型フィルム７７にかかる力を示す平面図である。凹状収容部の下面を形成する離型フィルム７７に、その面内において、フレーム枠７６の外周縁（点線）を起点として、円の中心から外側に向けて均等な力がかかる。そのため、円形の離型フィルム７７はその円の中心から放射状に等しい力で引っ張られ、シワが無くなる。   FIG. 11 is a plan view showing the force applied to the release film 77 of FIG. A uniform force is applied to the release film 77 forming the lower surface of the concave housing portion from the center of the circle to the outside, starting from the outer peripheral edge (dotted line) of the frame frame 76 in the plane. Therefore, the circular release film 77 is pulled from the center of the circle with the same radial force, and wrinkles are eliminated.

（第３実施例）
第２実施例の変形例として、矩形の下型キャビティに対応する凹状収容部を作製するための装置である凹状収容部作製部９１（図１２）の例を説明する。本実施例のグリップ９０は矩形の把持片ペア９０ａ、９０ｂと固定ネジ９３とから成る。下型キャビティと同形の開口を上下に有するフレーム枠９６の各辺の上部には、各辺から外側に突出するフレーム枠保持部材９４が固定され、その突出部にはそれぞれ高さ調整ネジ９２が設けられている。
本実施例でも、第２実施例の場合と同じようにステップＳ２１〜ステップＳ２３の動作を行い、高さ調整ネジ９２によってフレーム枠９６内の離型フィルム９７にかかる張力を調整することにより、離型フィルム９７にシワやたわみなどの無い凹状収容部を作製することができる。 (Third embodiment)
As a modified example of the second embodiment, an example of a concave housing part preparation portion 91 (FIG. 12), which is a device for manufacturing a concave housing part corresponding to a rectangular lower mold cavity, will be described. The grip 90 of this embodiment is composed of a pair of rectangular gripping pieces 90 a and 90 b and a fixing screw 93. A frame frame holding member 94 protruding outward from each side is fixed to the upper part of each side of the frame frame 96 having upper and lower openings having the same shape as the lower mold cavity, and height adjustment screws 92 are respectively provided in the protruding portions. Is provided.
In this embodiment as well, in the same manner as in the second embodiment, the operations in steps S21 to S23 are performed, and the tension applied to the release film 97 in the frame frame 96 is adjusted by the height adjusting screw 92, thereby releasing the mold. A concave housing portion free from wrinkles or deflection can be produced in the mold film 97.

上記実施例は本発明の一例であり、本考案の趣旨の範囲で適宜に変形や修正、追加が許容される。例えば、圧縮成形装置に樹脂材料を供給する樹脂材料供給装置において、以下のように、上記実施例の各工程を適宜な自動機構を用いて実施する（自動運転する）ことができる。
すなわち、矩形の或いは円形のフレーム枠を用いて樹脂材料を供給する樹脂材料供給装置において、（樹脂材料供給装置に設けた基台の上に載置した）矩形の或いは円形の離型フィルムを、適宜な駆動機構にて所要数のグリップで把持して該離型フィルムに張力（テンション）を加え張設し、適宜な駆動機構にてフレーム枠を離型フィルムの上に載置することができる。
また、適宜な駆動機構によってグリップを、フレーム枠の下面に垂直な方向に上方又は下方に移動させ張力を調整しても良い。このとき、グリップを上方に移動させると離型フィルムはフレーム枠の下端面の外周縁に掛かり、下方に移動させると装置基台の縁に掛かることになる。このように張設した離型フィルムをフレーム枠の下面に固定することにより凹状収容部を作製することができる。 The above embodiment is an example of the present invention, and appropriate modifications, corrections, and additions are permitted within the scope of the present invention. For example, in a resin material supply apparatus that supplies a resin material to a compression molding apparatus, each step of the above-described embodiment can be performed (automatic operation) using an appropriate automatic mechanism as follows.
That is, in a resin material supply apparatus that supplies a resin material using a rectangular or circular frame, a rectangular or circular release film (mounted on a base provided in the resin material supply apparatus) The frame can be placed on the release film by an appropriate drive mechanism and gripped with a required number of grips to apply tension to the release film. .
Further, the tension may be adjusted by moving the grip upward or downward in a direction perpendicular to the lower surface of the frame frame by an appropriate drive mechanism. At this time, when the grip is moved upward, the release film is applied to the outer peripheral edge of the lower end surface of the frame frame, and when it is moved downward, it is applied to the edge of the apparatus base. By fixing the release film stretched in this way to the lower surface of the frame frame, the concave accommodating portion can be produced.

このような駆動機構として、エアシリンダー機構、エアスプリング機構、カム機構、リンク機構、直線ソレノイド機構などを用いることができる。   As such a drive mechanism, an air cylinder mechanism, an air spring mechanism, a cam mechanism, a link mechanism, a linear solenoid mechanism, or the like can be used.

また、上記実施例において、適宜な自動機構を用いて、ロール巻状の離型フィルムを所要の長さに切断した矩形の離型フィルム、或いは、円形に切り抜いた円形の離型フィルムを用いることができる。   Further, in the above embodiment, using a suitable release mechanism, a rectangular release film obtained by cutting a roll-like release film into a required length, or a circular release film cut into a circle is used. Can do.

３０…圧縮成形装置用の樹脂材料供給装置
３１、７１、９１…凹状収容部作製部
３２…樹脂材料供給部
３３…セッティング部
３４…樹脂材料
３５…凹状収容部
３６、７６、９６…フレーム枠
３７、７７、９７…離型フィルム
３９…下型キャビティ
４１〜４４、８０、９０…グリップ
４１ａ・４１ｂ〜４４ａ・４４ｂ、８０ａ・８０ｂ、９０ａ・９０ｂ…上下の把持片ペア
４６、８６、９３…固定ネジ
５０、８７、９４…フレーム枠保持部材
５１、８８、９２…高さ調整ネジ
６０…外枠部材
６１…幅調整ネジ DESCRIPTION OF SYMBOLS 30 ... Resin material supply apparatus 31, 71, 91 for compression molding apparatuses ... Concave accommodation part preparation part 32 ... Resin material supply part 33 ... Setting part 34 ... Resin material 35 ... Concave accommodation parts 36, 76, 96 ... Frame frame 37 , 77, 97 ... release film 39 ... lower mold cavities 41 to 44, 80, 90 ... grips 41a, 41b to 44a, 44b, 80a, 80b, 90a, 90b ... upper and lower gripping piece pairs 46, 86, 93 ... fixed Screws 50, 87, 94 ... Frame frame holding member 51, 88, 92 ... Height adjustment screw 60 ... Outer frame member 61 ... Width adjustment screw

Claims (10)

上型と下型とから成る圧縮成形用型の下型キャビティに樹脂材料を均一厚さに供給するために、該下型キャビティの開口に対応した形状の開口を上下に有するフレーム枠と該フレーム枠の下部の開口を被覆した離型フィルムとにより作製した凹状収容部に樹脂材料を供給する方法であって、
a) 前記フレーム枠よりも大きい離型フィルムを、フィルム把持部材によって二以上の方向において両側で保持することにより該離型フィルムを張設するフィルム張設工程と、
b) 前記張設された離型フィルムの上に前記フレーム枠を、該フレーム枠の下部全周が接触するように配置するフレーム枠配置工程と
を含むことを特徴とする圧縮成形装置の樹脂材料供給方法。 A frame having upper and lower openings corresponding to the openings of the lower mold cavity in order to supply the resin material with a uniform thickness to the lower mold cavity of the compression mold comprising the upper mold and the lower mold It is a method of supplying a resin material to a concave accommodating portion produced by a release film covering an opening at the bottom of a frame,
a) a film stretching step of stretching the release film by holding a release film larger than the frame frame on both sides in two or more directions by a film gripping member;
b) a frame frame placement step of placing the frame frame on the stretched release film so that the entire lower periphery of the frame frame is in contact with the resin material of the compression molding apparatus, Supply method. さらに、
c) 前記フレーム枠を前記フィルム把持部材に対して前記離型フィルムの面に垂直な方向に移動させることにより該フレーム枠内での前記離型フィルムの張力を増加又は減少させる張力調整工程
を含むことを特徴とする請求項１に記載の圧縮成形装置の樹脂材料供給方法。 further,
c) a tension adjusting step of increasing or decreasing the tension of the release film in the frame frame by moving the frame frame in a direction perpendicular to the surface of the release film with respect to the film gripping member. The resin material supply method of the compression molding apparatus according to claim 1. 前記フレーム枠が矩形であり、
前記二以上の方向が垂直な二方向であり、
前記フィルム把持部材が、前記垂直な二方向において両側に設けられたフィルム把持具から成り、そして
前記フレーム枠配置工程において、前記フレーム枠を、その辺が前記垂直な二方向に平行となるように、前記フィルム把持具の間に、フレーム枠の下部全周が前記離型フィルムに接触するようにして配置する
ことを特徴とする請求項１又は２に記載の圧縮成形装置の樹脂材料供給方法。 The frame is rectangular;
The two or more directions are two perpendicular directions;
The film gripping member comprises a film gripper provided on both sides in the two perpendicular directions, and in the frame frame arranging step, the frame frame is arranged such that its sides are parallel to the two perpendicular directions. The resin material supply method for a compression molding apparatus according to claim 1, wherein the entire periphery of the lower part of the frame is in contact with the release film between the film grippers. 前記フレーム枠が円形であり、
前記フィルム把持部材が、円形のフィルム把持具から成り、
前記フィルム張設工程において、前記フィルム把持具が、その中心を挟む少なくとも二方向の両側において前記離型フィルムを把持することにより前記フィルム把持具内に前記離型フィルムを張設し、そして
前記フレーム枠配置工程において、前記フレーム枠を、前記張設された離型フィルム上に、前記フレーム枠の下部全周が前記離型フィルムに接触するようにして配置する
ことを特徴とする請求項１又は２に記載の圧縮成形装置の樹脂材料供給方法。 The frame is circular,
The film gripping member comprises a circular film gripper;
In the film stretching step, the film gripping tool stretches the release film in the film gripping tool by gripping the release film on both sides in at least two directions sandwiching the center thereof, and the frame In the frame arranging step, the frame frame is arranged on the stretched release film so that the entire lower periphery of the frame frame is in contact with the release film. The resin material supply method of the compression molding apparatus of 2. 請求項１〜４のいずれかに記載の樹脂材料供給方法を用いることを特徴とする樹脂材料の圧縮成形方法。   A resin material compression molding method using the resin material supply method according to claim 1. 上型と下型とから成る圧縮成形用型の下型キャビティに樹脂材料を均一厚さに供給するために、該下型キャビティの開口に対応した形状の開口を上下に有するフレーム枠と該フレーム枠の下部の開口を被覆した離型フィルムとにより作製した凹状収容部に樹脂材料を供給する装置であって、
a) 前記フレーム枠よりも大きい離型フィルムを二以上の方向において両側で保持することにより該離型フィルムを張設するフィルム把持部材と、
b) 前記フィルム把持部材により張設された離型フィルムの上で前記フレーム枠の下部全周が接触するように、前記フィルム把持部材に対して前記フレーム枠を配置するフレーム枠配置部材と
を備えることを特徴とする圧縮成形装置用の樹脂材料供給装置。 A frame having upper and lower openings corresponding to the openings of the lower mold cavity in order to supply the resin material with a uniform thickness to the lower mold cavity of the compression mold comprising the upper mold and the lower mold An apparatus for supplying a resin material to a concave accommodating portion produced by a release film covering an opening at the bottom of a frame,
a) a film gripping member for stretching the release film by holding the release film larger than the frame frame on both sides in two or more directions;
b) a frame frame disposing member that disposes the frame frame with respect to the film gripping member so that the entire lower periphery of the frame frame contacts the release film stretched by the film gripping member. A resin material supply device for a compression molding device. さらに、
c) 前記フレーム枠を前記フィルム把持部材に対して前記離型フィルムの面に垂直な方向に移動させることにより該フレーム枠内での前記離型フィルムの張力を増加又は減少させる張力調整部材
を備えることを特徴とする請求項６に記載の圧縮成形装置用の樹脂材料供給装置。 further,
c) A tension adjusting member that increases or decreases the tension of the release film in the frame frame by moving the frame frame in a direction perpendicular to the surface of the release film with respect to the film gripping member. The resin material supply apparatus for a compression molding apparatus according to claim 6. 前記フレーム枠が矩形であり、
前記二以上の方向が垂直な二方向であり、
前記フィルム把持部材が、前記垂直な二方向において両側に設けられたフィルム把持具から成り、そして
前記フレーム枠配置部材が、前記フレーム枠を前記フィルム把持具の間に、その辺が前記垂直な二方向に平行となるように、且つ、フレーム枠の下部全周が前記離型フィルムに接触するように配置するものである
ことを特徴とする請求項６又は７に記載の圧縮成形装置用の樹脂材料供給装置。 The frame is rectangular;
The two or more directions are two perpendicular directions;
The film gripping member comprises a film gripping tool provided on both sides in the two perpendicular directions, and the frame frame disposing member has the frame frame between the film gripping tools and the sides of the film gripping member. The resin for a compression molding apparatus according to claim 6 or 7, wherein the resin is disposed so as to be parallel to the direction and so that the entire lower periphery of the frame frame is in contact with the release film. Material supply device. 前記フレーム枠が円形であり、
前記フィルム把持部材が円形のフィルム把持具から成り、
該フィルム把持具が、その中心を挟む少なくとも二方向の両側において前記離型フィルムを把持することにより前記フィルム把持具内に前記離型フィルムを張設するものであり、そして
前記フレーム枠配置部材が、前記フレーム枠を、前記フレーム枠の下部全周が前記離型フィルムに接触するように配置するものである
ことを特徴とする請求項６又は７に記載の圧縮成形装置用の樹脂材料供給装置。 The frame is circular,
The film gripping member comprises a circular film gripper;
The film gripping tool stretches the release film in the film gripping tool by gripping the release film on both sides in at least two directions across the center thereof, and the frame frame arranging member 8. The resin material supply device for a compression molding apparatus according to claim 6, wherein the frame frame is arranged so that the entire lower periphery of the frame frame is in contact with the release film. . 請求項６〜９のいずれかに記載の樹脂材料供給装置を備えることを特徴とする樹脂材料の圧縮成形装置。   A resin material compression molding apparatus comprising the resin material supply device according to claim 6.
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