JP2015046390A - 保護素子 - Google Patents
保護素子 Download PDFInfo
- Publication number
- JP2015046390A JP2015046390A JP2014153858A JP2014153858A JP2015046390A JP 2015046390 A JP2015046390 A JP 2015046390A JP 2014153858 A JP2014153858 A JP 2014153858A JP 2014153858 A JP2014153858 A JP 2014153858A JP 2015046390 A JP2015046390 A JP 2015046390A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- melting point
- layered
- point metal
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 102
- 239000002184 metal Substances 0.000 claims abstract description 102
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims description 81
- 230000008018 melting Effects 0.000 claims description 79
- 229910045601 alloy Inorganic materials 0.000 claims description 42
- 239000000956 alloy Substances 0.000 claims description 42
- 230000001681 protective effect Effects 0.000 claims description 37
- -1 ferrous metals Chemical class 0.000 claims description 10
- 229910016334 Bi—In Inorganic materials 0.000 claims description 8
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 229910000925 Cd alloy Inorganic materials 0.000 claims description 6
- 229910020159 Pb—Cd Inorganic materials 0.000 claims description 6
- 229910000846 In alloy Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 3
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 2
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 2
- 229910016331 Bi—Ag Inorganic materials 0.000 claims description 2
- 229910020630 Co Ni Inorganic materials 0.000 claims description 2
- 229910002440 Co–Ni Inorganic materials 0.000 claims description 2
- 229910017932 Cu—Sb Inorganic materials 0.000 claims description 2
- 229910000927 Ge alloy Inorganic materials 0.000 claims description 2
- 229910017709 Ni Co Inorganic materials 0.000 claims description 2
- 229910003267 Ni-Co Inorganic materials 0.000 claims description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 claims description 2
- 239000002033 PVDF binder Substances 0.000 claims description 2
- 229910020174 Pb-In Inorganic materials 0.000 claims description 2
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 2
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 claims description 2
- 229910020935 Sn-Sb Inorganic materials 0.000 claims description 2
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 2
- 229910018956 Sn—In Inorganic materials 0.000 claims description 2
- 229910008757 Sn—Sb Inorganic materials 0.000 claims description 2
- 239000010953 base metal Substances 0.000 claims description 2
- 229910052790 beryllium Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910000510 noble metal Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims 1
- 229910020816 Sn Pb Inorganic materials 0.000 claims 1
- 229910020922 Sn-Pb Inorganic materials 0.000 claims 1
- 229910020994 Sn-Zn Inorganic materials 0.000 claims 1
- 229910008783 Sn—Pb Inorganic materials 0.000 claims 1
- 229910009069 Sn—Zn Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 230000002159 abnormal effect Effects 0.000 abstract description 15
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000020169 heat generation Effects 0.000 description 11
- 230000005856 abnormality Effects 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Fuses (AREA)
- Emergency Protection Circuit Devices (AREA)
- Protection Of Static Devices (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
Description
(i)絶縁性樹脂を含んで成る層状要素、
(ii)層状要素を貫通する少なくとも1つの低融点金属部材、および
(iii)層状要素の両主表面に位置し、低融点金属部材により電気的に接続されている一対の層状の金属電極
を有して成る、保護素子を提供する。
2…層状要素
4…低融点金属部材
6…金属電極
8…層状樹脂要素
10…層状PTC要素
Claims (14)
- (i)絶縁性樹脂を含んで成る層状要素、
(ii)層状要素を貫通する少なくとも1つの低融点金属部材、および
(iii)層状要素の両主表面に位置し、低融点金属部材により電気的に接続されている一対の層状の金属電極
を有して成る、保護素子。 - 層状要素の一部または全部が、PTC組成物により形成されていることを特徴とする、請求項1に記載の保護素子。
- 2つ以上の低融点金属部材を有することを特徴とする、請求項1または2に記載の保護素子。
- 2つ以上の低融点金属部材が、互いに接触して配置されていることを特徴とする、請求項3に記載の保護素子。
- 2つ以上の低融点金属部材が、互いに離隔して配置されていることを特徴とする、請求項3に記載の保護素子。
- 2つ以上の低融点金属部材が、均等に配置されていることを特徴とする、請求項5に記載の保護素子。
- 低融点金属部材が、Sn、Bi−Cd合金、Bi−Pb合金、Sn−Ag合金、Sn−Ag−Bi−In合金、Sn−Ag−Cu合金、Sn−Ag−Cu−Bi合金、Sn−Ag−Cu−Bi−In合金、Sn−Ag−Cu−Co−Ni合金、Sn−Ag−Cu−Sb合金、Sn−Ag−Ni−Co合金、Sn−Bi合金、Sn−Bi−Ag合金、Sn−Bi−Cd合金、Sn−Bi−In合金、Sn−Bi−Pb合金、Sn−Bi−Pb−Cd合金、Sn−Bi−Pb−Cd−In合金、Sn−Bi−Pb−In合金、Sn−Bi−Zn合金、Sn−Cu合金、Sn−Cu−Ni合金、Sn−Cu−Ni−P−Ge合金、Sn−Cd合金、Sn−In合金、Sn−Pb合金、Sn−Pb−Cd合金、Sn−Zn合金およびSn−Sb合金からなる群から選択される1種またはそれ以上の低融点金属から形成されていることを特徴とする、請求項1〜6のいずれかに記載の保護素子。
- 低融点金属が、80〜90℃の融点を有することを特徴とする、請求項7に記載の保護素子。
- 低融点金属が、Sn−Bi−Pb合金、Sn−Bi−Pb−Cd合金、Sn−Bi−Pb−Cd−In合金およびSn−Bi−In合金からなる群から選択される1種またはそれ以上であることを特徴とする、請求項8に記載の保護素子。
- 金属電極が、貴金属および卑金属を含む非鉄金属からなる群から選択される1種またはそれ以上の金属から形成されていることを特徴とする、請求項1〜9のいずれかに記載の保護素子。
- 非鉄金属が、Ni、Cu、Sn、Al、Ti、Cr、Mn、Zn、Ag、Au、W、Pt、Pb、MoおよびBeからなる群から選択されることを特徴とする、請求項10に記載の保護素子。
- 絶縁性樹脂が、熱可塑性樹脂および熱硬化性樹脂からなる群から選択される1種またはそれ以上の樹脂であることを特徴とする、請求項1〜11のいずれかに記載の保護素子。
- 絶縁性樹脂が、ポリエチレン、ポリフッ化ビニリデン、およびポリプロピレンからなる群から選択される1種またはそれ以上の樹脂であることを特徴とする、請求項1〜12のいずれかに記載の保護素子。
- 請求項1〜13のいずれかに記載の保護素子を有して成ることを特徴とする二次電池。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014153858A JP6352095B2 (ja) | 2013-07-29 | 2014-07-29 | 保護素子 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013156826 | 2013-07-29 | ||
JP2013156826 | 2013-07-29 | ||
JP2014153858A JP6352095B2 (ja) | 2013-07-29 | 2014-07-29 | 保護素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015046390A true JP2015046390A (ja) | 2015-03-12 |
JP6352095B2 JP6352095B2 (ja) | 2018-07-04 |
Family
ID=52502711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014153858A Active JP6352095B2 (ja) | 2013-07-29 | 2014-07-29 | 保護素子 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6352095B2 (ja) |
CN (1) | CN104347312A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109243667A (zh) * | 2018-08-17 | 2019-01-18 | 上海长园维安电子线路保护有限公司 | 高分子基导电复合材料及过流保护元件 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5562637A (en) * | 1979-09-29 | 1980-05-12 | Murata Manufacturing Co | Method of manufacturing through type pellet fuse |
JPH10275546A (ja) * | 1997-03-29 | 1998-10-13 | Uchihashi Estec Co Ltd | 温度ヒュ−ズ及び二次電池における温度ヒュ−ズの取付け構造 |
JP2007184138A (ja) * | 2006-01-05 | 2007-07-19 | Sony Corp | 電流制御機構および電池 |
JP2007280807A (ja) * | 2006-04-07 | 2007-10-25 | Sumitomo Electric Ind Ltd | ヒューズ及びその製造方法 |
JP2009032696A (ja) * | 2007-07-26 | 2009-02-12 | Littelfuse Inc | 一体化されたサーミスタ及び金属素子装置並びに方法 |
WO2012118153A1 (ja) * | 2011-03-03 | 2012-09-07 | タイコエレクトロニクスジャパン合同会社 | 保護素子 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1128100A (en) * | 1979-03-21 | 1982-07-20 | Vojislav Narancic | Electric fuses employing composite metal fuse elements |
JP2004265618A (ja) * | 2003-02-05 | 2004-09-24 | Sony Chem Corp | 保護素子 |
JP4112417B2 (ja) * | 2003-04-14 | 2008-07-02 | 釜屋電機株式会社 | チップヒューズ及びその製造方法 |
JP4780203B2 (ja) * | 2009-02-10 | 2011-09-28 | 日亜化学工業株式会社 | 半導体発光装置 |
-
2014
- 2014-07-25 CN CN201410359813.XA patent/CN104347312A/zh active Pending
- 2014-07-29 JP JP2014153858A patent/JP6352095B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5562637A (en) * | 1979-09-29 | 1980-05-12 | Murata Manufacturing Co | Method of manufacturing through type pellet fuse |
JPH10275546A (ja) * | 1997-03-29 | 1998-10-13 | Uchihashi Estec Co Ltd | 温度ヒュ−ズ及び二次電池における温度ヒュ−ズの取付け構造 |
JP2007184138A (ja) * | 2006-01-05 | 2007-07-19 | Sony Corp | 電流制御機構および電池 |
JP2007280807A (ja) * | 2006-04-07 | 2007-10-25 | Sumitomo Electric Ind Ltd | ヒューズ及びその製造方法 |
JP2009032696A (ja) * | 2007-07-26 | 2009-02-12 | Littelfuse Inc | 一体化されたサーミスタ及び金属素子装置並びに方法 |
WO2012118153A1 (ja) * | 2011-03-03 | 2012-09-07 | タイコエレクトロニクスジャパン合同会社 | 保護素子 |
Also Published As
Publication number | Publication date |
---|---|
JP6352095B2 (ja) | 2018-07-04 |
CN104347312A (zh) | 2015-02-11 |
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